CN111403912A - Electronic equipment's lid and electronic equipment - Google Patents

Abstract

Embodiments of the present invention disclose a cover for an electronic device and the electronic device, which relate to the technical field of communications and can solve the problem of performance degradation of a millimeter-wave antenna in an electronic device. Wherein, the cover body includes: a first dielectric layer, a second dielectric layer disposed on the first surface of the first dielectric layer, and a third dielectric layer disposed on the second dielectric layer, the second dielectric layer disposed on the first dielectric layer between a dielectric layer and a third dielectric layer. Wherein, a feeding network is provided on the second surface of the first dielectric layer, and the second surface is arranged opposite to the first surface; the feeding network is connected to the coupling feeding unit passing through the second dielectric layer and the first dielectric layer electrical connection; the third medium layer carries a target radiator, and the coupling feeding unit is coupled and connected to the target radiator. The embodiments of the present invention are applied to electronic devices.

Description

Cover of an electronic device and electronic device

technical field

Embodiments of the present invention relate to the field of communication technologies, and in particular, to a cover of an electronic device and an electronic device.

Background technique

With the development of 5G (fifth generation mobile communication) technology, millimeter-wave antennas are gradually being used in various electronic devices to meet users' requirements for the rate of data transmission from electronic devices.

At present, in a millimeter-wave antenna system, a power management integrated circuit (PMIC) and a radio frequency integrated circuit (RFIC) can be packaged into an independent module through an antenna inpackage (AIP) technology. Then, the independent module and the millimeter-wave antenna are respectively disposed in the housing of the electronic device, so as to realize high-speed data transmission through the independent module and the millimeter-wave antenna.

However, in the above-mentioned millimeter-wave antenna system, the independent module and the millimeter-wave antenna are arranged in the casing of the electronic device, and the back cover of the casing may affect the gain of the millimeter-wave antenna and the pattern of the millimeter-wave antenna, so that the The coverage of mmWave antennas is reduced, resulting in reduced performance of mmWave antennas in electronic devices.

SUMMARY OF THE INVENTION

Embodiments of the present invention provide a cover for an electronic device and an electronic device, which can solve the problem of performance degradation of a millimeter-wave antenna in an electronic device.

In order to solve the above technical problems, the embodiment of the present invention adopts the following technical solutions:

A first aspect of the embodiments of the present invention provides a cover body for an electronic device, the cover body includes: a first dielectric layer, a second dielectric layer disposed on a first surface of the first dielectric layer, and a second dielectric layer disposed on the second dielectric layer. a third dielectric layer on the layer, the second dielectric layer is disposed between the first dielectric layer and the third dielectric layer. Wherein, a feeding network is provided on the second surface of the first dielectric layer, and the second surface is arranged opposite to the first surface; the feeding network is connected to the coupling feeding unit passing through the second dielectric layer and the first dielectric layer electrical connection; the third medium layer carries a target radiator, and the coupling feeding unit is coupled and connected to the target radiator.

In a second aspect of the embodiments of the present invention, an electronic device is provided, and the electronic device includes the cover body according to the first aspect.

In the embodiment of the present invention, the cover body of the electronic device includes a first dielectric layer, a second dielectric layer and a third dielectric layer, and a feeding network is provided on the first dielectric layer, and the feeding network is connected to the second dielectric layer. The layer is electrically connected to the coupling feeding unit of the first dielectric layer, the third dielectric layer carries the target radiator, and the coupling feeding unit is coupled and connected to the target radiator. Since the cover of the electronic device includes a plurality of dielectric layers, each module (ie the feeding network, the coupling feeding unit and the target radiator) provided with the multiple dielectric layers can constitute an antenna unit (ie the antenna), that is, the cover can As an antenna unit, the influence of the cover of the electronic device on the coverage of the antenna unit can be avoided, so that the performance of the antenna unit in the electronic device can be improved.

Description of drawings

FIG. 1 is one of the schematic structural diagrams of a cover of an electronic device according to an embodiment of the present invention;

FIG. 2 is a second schematic structural diagram of a cover body of an electronic device according to an embodiment of the present invention;

3 is a reflection coefficient diagram of a cover body of an electronic device provided by an embodiment of the present invention;

4 is a third schematic structural diagram of a cover body of an electronic device according to an embodiment of the present invention;

FIG. 5 is a fourth schematic structural diagram of a cover body of an electronic device according to an embodiment of the present invention;

FIG. 6 is a fifth schematic structural diagram of a cover body of an electronic device according to an embodiment of the present invention;

FIG. 7 is a simulation pattern of a signal radiated by a cover of an electronic device according to an embodiment of the present invention;

8 is a sixth schematic structural diagram of a cover body of an electronic device according to an embodiment of the present invention;

9A is a seventh schematic structural diagram of a cover body of an electronic device according to an embodiment of the present invention;

9B is an eighth schematic structural diagram of a cover body of an electronic device according to an embodiment of the present invention;

9C is a ninth schematic structural diagram of a cover body of an electronic device according to an embodiment of the present invention;

10A is a tenth schematic structural diagram of a cover body of an electronic device according to an embodiment of the present invention;

10B is an eleventh schematic structural diagram of a cover body of an electronic device according to an embodiment of the present invention;

10C is a twelfth schematic structural diagram of a cover body of an electronic device according to an embodiment of the present invention;

10D is a thirteenth schematic structural diagram of a cover body of an electronic device according to an embodiment of the present invention;

FIG. 11 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

The terms "first" and "second" in the description and claims of the embodiments of the present invention are used to distinguish different objects, rather than to describe a specific order of the objects. For example, the first dielectric layer and the second dielectric layer are used to distinguish different dielectric layers, rather than to describe a specific order of the dielectric layers.

In the description of the embodiments of the present invention, unless otherwise specified, the meaning of "plurality" refers to two or more. For example, a plurality of elements refers to two or more elements.

The term "and/or" in this document is an association relationship describing associated objects, indicating that there can be three kinds of relationships, for example, display panel and/or backlight, which can mean: the display panel exists alone, the display panel and the backlight exist simultaneously, There are three cases of backlight alone. The symbol "/" in this document indicates that the associated object is an OR relationship, for example, input/output indicates input or output.

In the embodiments of the present invention, words such as "exemplary" or "for example" are used to mean serving as an example, illustration or illustration. Any embodiments or designs described as "exemplary" or "such as" in the embodiments of the present invention should not be construed as preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "such as" is intended to present the related concepts in a specific manner.

Embodiments of the present invention provide a cover body of an electronic device and an electronic device. Since the cover body of the electronic device includes a plurality of dielectric layers, each module (ie, the feeding network, the coupling feeding unit, and the target radiation) set in the plurality of dielectric layers body) to form an antenna unit (ie antenna), that is, the cover can be regarded as an antenna unit, so the influence of the cover of the electronic device on the coverage of the antenna unit can be avoided, thereby improving the performance of the antenna unit in the electronic device.

The cover of the electronic device and the electronic device provided by the embodiments of the present invention can be applied to an antenna system.

The cover body and the electronic device of an electronic device provided by the embodiments of the present invention will be described in detail below through specific embodiments and application scenarios with reference to the accompanying drawings.

FIG. 1 shows a schematic structural diagram of a cover of an electronic device provided by an embodiment of the present invention. As shown in FIG. 1 , the cover body 10 of the electronic device includes: a first dielectric layer 11 , a second dielectric layer 12 disposed on the first surface of the first dielectric layer 11 , and a third dielectric layer 12 disposed on the second dielectric layer 12 The dielectric layer 13 , the second dielectric layer 12 is disposed between the first dielectric layer 11 and the third dielectric layer 13 .

In the embodiment of the present invention, a feeding network 14 is disposed on the second surface of the first dielectric layer 11, and the second surface is disposed opposite to the first surface; The coupling feeding unit 15 of the first dielectric layer 11 is electrically connected; the third dielectric layer 13 carries the target radiator 16 , and the coupling feeding unit 15 is coupled and connected to the target radiator 16 .

It can be understood that the above-mentioned first surface and second surface are surfaces in two opposite directions in the first dielectric layer 11 , that is, the first surface is the surface of the first dielectric layer 11 in contact with the second dielectric layer 12 (that is, facing the second dielectric layer 12 ). The surface of the dielectric layer 12 ), the second surface is the surface of the first dielectric layer 11 facing away from the second dielectric layer 12 .

Optionally, in the embodiment of the present invention, the first dielectric layer 11 , the second dielectric layer 12 , and the third dielectric layer 13 may all be dielectric substrates.

Optionally, in this embodiment of the present invention, the first dielectric layer 11 , the second dielectric layer 12 or the third dielectric layer 13 may be made of non-metallic materials; the first dielectric layer 11 , the second dielectric layer 12 and the Specifically, the third dielectric layer 13 may be made of a ceramic material.

Optionally, in a possible implementation manner of the embodiment of the present invention, the above-mentioned coupling feeding unit 15 includes at least one feeding part and at least one feeding arm, and each feeding part is electrically connected to one feeding arm respectively. , the at least one feeding part is located in the second dielectric layer 12 , the at least one feeding arm is located on the third surface of the second dielectric layer 12 , and the third surface is the second dielectric layer 12 in contact with the third dielectric layer 13 s surface.

It should be noted that the above-mentioned "at least one feeding arm is located on the third surface of the second dielectric layer 12" can be understood as: all parts of each feeding arm in the at least one feeding arm are located on the third surface of the second dielectric layer 12 three surfaces; or, a part of each feeding arm of the at least one feeding arm is located on the third surface of the second dielectric layer 12; The third surface of the dielectric layer 12 .

Optionally, in this embodiment of the present invention, the at least one feeder arm is an arc-shaped feeder arm, and each feeder arm of the at least one feeder arm is respectively disposed toward the target radiator 16 .

It should be noted that the above "each feeder arm is respectively set towards the target radiator 16" can be understood as: the arc center of each feeder arm is located on the side of each feeder arm that is close to the target radiator 16 .

Exemplarily, as shown in FIG. 2 , the coupling feeding unit 15 includes at least one feeding part (eg, feeding part 151 , feeding part 152 , feeding part 153 and feeding part 154 ) and at least one feeding arm ( For example, the arc-shaped feeding arm 155, the arc-shaped feeding arm 156, the arc-shaped feeding arm 157 and the arc-shaped feeding arm 158), the feeding part 151 is electrically connected to the arc-shaped feeding arm 155, The feeding part 152 is electrically connected to the arc-shaped feeding arm 156; the feeding part 153 is electrically connected to the arc-shaped feeding arm 157; The power feeding part 151 , the power feeding part 152 , the power feeding part 153 and the power feeding part 154 are located in the second dielectric layer 12 , and the arc-shaped feeding arm 155 , the arc-shaped feeding arm 156 , and the arc-shaped feeding arm 157 are located in the second dielectric layer 12 . and the arc-shaped feeding arm 158 is located on the third surface of the second dielectric layer 12 .

Optionally, in another possible implementation manner of the embodiment of the present invention, the above-mentioned coupling feeding unit 15 includes at least one feeding part and at least one feeding arm, and each feeding part is respectively connected to one feeding arm. connection, the at least one feed portion and the at least one feed arm are located in the second dielectric layer 12 .

It should be noted that “at least one feeding arm is located in the second dielectric layer 12 ” can be understood as: all parts of each feeding arm in the at least one feeding arm are located in the second dielectric layer 12 .

Optionally, in this embodiment of the present invention, arc coupling feeding may be performed through an arc-shaped feeding arm, so that the arc-shaped feeding arm can couple and feed the target radiator 16 by means of arc coupling feeding, In order to improve the bandwidth of the target radiator 16, the compatibility requirements of the target radiator 16 for different network standard frequency bands are met.

Exemplarily, FIG. 3 shows a reflection coefficient diagram of the target radiator 16 in the embodiment of the present invention. As shown in FIG. 3 , the target radiator is fed by circular arc coupling and feeding, so that the target radiator is fed by circular arc coupling. The bandwidth of the target radiator 16 can reach -10dB, and the -10dB bandwidth can cover the frequency band of 23GHz-46GHz, so that it can meet the global mainstream 5G millimeter wave frequency band of n257-n261.

In the embodiment of the present invention, at least one arc-shaped feeding arm can be provided to couple and feed the target radiator by means of circular arc coupling and feeding, so that the bandwidth of the target radiator can be improved.

Optionally, in this embodiment of the present invention, the above-mentioned feeding network 14 includes at least one equal-power-division moving network, and two ends of each equal-power moving network are respectively electrically connected to different feeding arms, and each equal-power moving network is electrically connected to different feeding arms. The power division moves to the feeder arms connected to the network are all different.

Optionally, in this embodiment of the present invention, the number of feeding arms included in the coupling feeding unit 15 is the same as the total number of ends of the equal power division moving network included in the feeding network 14 .

Exemplarily, with reference to FIG. 2 and as shown in FIG. 4 , the feeder network 14 includes at least one equal-power-division moving network (eg, the equal-power-division moving network 17 and the equal-power-dividing network 18 ), and the equal-power division moving network 18 . One end (eg V-) moving to the network 17 is electrically connected to the feeding arm 155, the other end (eg V+) of the power division moving to the network 17 is electrically connecting to the feeding arm 157, and the power dividing is moving to the network 18 One end (H-) of the network 18 is electrically connected to the feeding arm 156, and the other end (H+) of the equal power division is electrically connected to the feeding arm 158.

Optionally, in this embodiment of the present invention, the target radiator 16 may radiate differential signals with equal signal amplitudes and a phase difference of 180° through at least one equal-power-division moving network.

Optionally, in this embodiment of the present invention, in the case where at least one equal-power-division moving network includes two equal-power-division moving networks, the level of radiation of the target radiator 16 can be stimulated through one equal-power moving network. The signal in the direction can be moved to the network by another equal power division to excite the signal in the vertical direction radiated by the target radiator 16, thereby realizing dual polarization (ie, orthogonal polarization) of the signal.

In the embodiment of the present invention, when at least two equal-power-division networks work simultaneously, a multiple-input multiple-output (MIMO) multi-channel signal transmission mode can be formed, thereby increasing the signal transmission rate.

In this embodiment of the present invention, the above-mentioned feeding network 14 is electrically connected to the coupling feeding unit 15 so as to feed the coupling feeding unit 15 by means of coupling feeding, so that the coupling feeding unit 15 can feed the target radiator by means of coupling feeding. 16 is coupled to feed so that the target radiator 16 resonates so that the target radiator 16 can radiate signals.

In the embodiment of the present invention, the target radiator can be differentially fed through at least one equal-power-division moving network, so that the common-mode rejection capability and anti-interference capability of the target radiator can be improved, and the differential end-to-end performance can be improved. Isolation and purity of signal polarization radiated by the target radiator.

It should be noted that the above-mentioned "the feeding network 14 is electrically connected to the coupling feeding unit 15 passing through the second dielectric layer 12 and the first dielectric layer 11" can be understood as: one end of the coupling feeding unit 15 (that is, each feeding unit 15) One end of the electric part) is electrically connected to the feeding network 14 provided on the second surface of the first dielectric layer 11, and the other end of the coupling feeding unit 15 (that is, the other end of each feeding part) is located in the second medium The third surface of layer 12 .

Optionally, in this embodiment of the present invention, the above-mentioned target radiator 16 (or target radiation unit) may be disposed in the third dielectric layer 13 or on the surface of the third dielectric layer 13 .

Optionally, in this embodiment of the present invention, the above-mentioned target radiator 16 may be a millimeter wave radiator.

Optionally, in this embodiment of the present invention, the above-mentioned target radiator 16 may include at least one of a high-frequency radiator and a low-frequency radiator.

It can be understood that the cover body 10 has a multi-layer structure, and the first dielectric layer 11 , the second dielectric layer 12 and the third dielectric layer 13 are the layer structure of the cover body 10 . The cover body 10 can be regarded as an antenna unit (eg, a millimeter-wave antenna).

Optionally, in the embodiment of the present invention, a metal layer is provided on the fourth surface of the second dielectric layer 12 , and the fourth surface is the surface of the second dielectric layer 12 that is in contact with the first dielectric layer 11 .

It can be understood that the above-mentioned third surface and fourth surface are surfaces in two opposite directions in the second dielectric layer 12 , that is, the third surface is the surface of the second dielectric layer 12 in contact with the third dielectric layer 13 (that is, facing the third dielectric layer 13 ). surface of the dielectric layer 13 ), and the fourth surface is the surface of the second dielectric layer 12 facing the first dielectric layer 11 .

In this embodiment of the present invention, a metal layer can be provided to reduce the influence of other devices in the electronic device (eg, devices connected to the feeding network 14 ) on the antenna unit, so that the boundary conditions of the antenna unit are relatively fixed.

An embodiment of the present invention provides a cover body of an electronic device, the cover body includes a first dielectric layer, a second dielectric layer and a third dielectric layer, and a feeding network is provided on the first dielectric layer, and the feeding network is connected with the wear-through network. The second dielectric layer is electrically connected to the coupling feeding unit of the first dielectric layer, the third dielectric layer carries the target radiator, and the coupling feeding unit is coupled and connected to the target radiator. Since the cover of the electronic device includes a plurality of dielectric layers, each module (ie the feeding network, the coupling feeding unit and the target radiator) provided with the multiple dielectric layers can constitute an antenna unit (ie the antenna), that is, the cover can As an antenna unit, the influence of the cover of the electronic device on the coverage of the antenna unit can be avoided, so that the performance of the antenna unit in the electronic device can be improved.

Optionally, in this embodiment of the present invention, the cover body 10 of the electronic device may include at least one antenna module, and each antenna module includes a first dielectric layer 11 , a second dielectric layer 12 and a third dielectric layer 13 .

It should be noted that, the number of antenna modules included in the cover body 10 and the positions of the antenna modules can be set according to actual use requirements, which are not limited in the embodiment of the present invention.

It can be understood that the embodiment of the present invention integrates a millimeter-wave antenna (ie, a millimeter-wave array antenna) on the cover body 10, which can greatly reduce the influence of the surrounding environment and the user's hand, and greatly improve the performance of the millimeter-wave antenna.

Optionally, in the embodiment of the present invention, the third dielectric layer 13 includes at least one first sub-dielectric layer arranged in parallel to each other, and the target radiator 16 includes sub-radiators carried by each of the first sub-dielectric layers.

Optionally, in this embodiment of the present invention, each first sub-dielectric layer is provided with a sub-radiator respectively, or, a sub-radiator is respectively provided on the fifth surface of each first sub-dielectric layer, and a first sub-radiator is provided on the fifth surface of each first sub-dielectric layer. The fifth surface is the surface of a first sub-dielectric layer facing away from the second dielectric layer 12 .

Optionally, in this embodiment of the present invention, the sub-radiator carried by each first sub-dielectric layer may be a millimeter wave radiator, and the sub-radiator may be a high-frequency radiator or a low-frequency radiator.

Optionally, in this embodiment of the present invention, the shape of the sub-radiator may be any one of the following: a circle, an ellipse, a triangle, a square, a rectangle, a rhombus, and a polygon. Specifically, it can be set according to actual usage requirements, which is not limited in the embodiment of the present invention.

Optionally, in this embodiment of the present invention, in the at least one first sub-dielectric layer, the sub-radiator carried by the first sub-dielectric layer in contact with the second dielectric layer 12 is coupled and connected to the coupling and feeding unit 15; and each Any two adjacent sub-radiators in the sub-radiators carried by the first sub-dielectric layer are coupled and connected.

It can be understood that the sub-radiators directly coupled and connected to the coupling feeding unit 15 (that is, the radiators carried by the first sub-dielectric layer in contact with the second dielectric layer 12 in the at least one first sub-dielectric layer) can be sent through the coupling feeding unit 15 sub-radiator), and then through the sub-radiator to couple and feed the sub-radiator coupled to the sub-radiator, and so on, until all the sub-radiators carried by the first sub-dielectric layer are fed. .

It should be noted that the coupling feeding of the sub-radiator to the sub-radiator coupled to the sub-radiator can be understood as: the sub-radiator passes the radiation signal, so that the sub-radiator coupled to the sub-radiator resonates, Thereby the signal is also radiated.

Optionally, in this embodiment of the present invention, any two adjacent sub-radiators are disposed opposite to each other.

It should be noted that the above-mentioned "any two adjacent sub-radiators are set opposite to each other" can be understood as: the line connecting the center point of one sub-radiator and the center point of the other sub-radiator is perpendicular to a first The plane where the sub-dielectric layer is located.

Exemplarily, with reference to FIG. 1 , as shown in FIG. 5 , the third dielectric layer 13 includes at least one first sub-dielectric layer (eg, the dielectric layer 17 and the dielectric layer 18 ) arranged in parallel with each other. The second dielectric layer 12 is in contact, the other surface of the dielectric layer 17 is provided with a sub-radiator 19, and the other surface of the dielectric layer 17 is in contact with one surface of the dielectric layer 18, and the other surface of the dielectric layer 18 is provided with Sub-radiator 20; the sub-radiator 19 is coupled and connected to the coupling feeding unit 15, the sub-radiator 19 is arranged opposite to the sub-radiator 20, and the sub-radiator 19 is coupled and connected to the sub-radiator 20.

Optionally, in this embodiment of the present invention, the cover body 10 may further include at least one parasitic unit, and each parasitic unit is disposed through at least one first sub-dielectric layer.

Optionally, in this embodiment of the present invention, each parasitic unit in the at least one parasitic unit is a metal via structure.

It can be understood that the above-mentioned metal via structure is a hollow cylindrical structure.

Optionally, in this embodiment of the present invention, in any one of the first sub-dielectric layers, the at least one parasitic unit described above is distributed around the sub-radiators carried by the any one of the first sub-dielectric layers.

Optionally, in this embodiment of the present invention, the above-mentioned at least one parasitic unit is uniformly distributed around the sub-radiators carried by the first sub-dielectric layer.

Exemplarily, with reference to FIG. 5 , as shown in FIG. 6 , the above-mentioned cover 10 further includes at least one parasitic unit (eg, parasitic unit a, parasitic unit b, parasitic unit c, parasitic unit d, parasitic unit e, parasitic unit f, parasitic unit Parasitic unit g and parasitic unit h), each parasitic unit in the at least one parasitic unit is disposed through at least one first sub-dielectric layer (for example, the dielectric layer 17 and the dielectric layer 18 ), and the at least one parasitic unit is uniformly distributed in the sub-radiation around the body 19 and the sub-radiator 20 .

In the embodiment of the present invention, when each sub-radiator radiates a signal, each parasitic unit can generate resonance, so that the beam width of the radiation pattern of each sub-radiator can be widened, thereby increasing the coverage angle of the array scanning.

Exemplarily, FIG. 7 shows a simulation pattern of a signal radiated by the target radiator 16 according to an embodiment of the present invention. As shown in FIG. 7 , the width of the beam corresponding to the signal radiated by the target radiator 16 is 3dB. Before setting at least one parasitic element, the coverage angle of the signal corresponding to the beam with a width of 3dB is D=78.2 degrees. After setting at least one parasitic element After the parasitic element, the coverage angle of the signal corresponding to the beam with a width of 3 dB is increased to D ₁ =100.6 degrees.

In this embodiment of the present invention, at least one parasitic unit may be disposed through at least one first sub-dielectric layer to widen the beam width of the radiation pattern of the sub-radiators carried by the at least one first sub-dielectric layer, thereby increasing the scanning efficiency of the array. coverage angle to increase the radiation coverage of these sub-radiators.

It can be understood that the coupling method is used to increase the bandwidth of the antenna unit, and at the same time at least one parasitic unit around the antenna unit widens the beam width of the antenna, thereby achieving better beam scanning characteristics.

Optionally, in this embodiment of the present invention, the third dielectric layer 13 further includes at least one second sub-dielectric layer arranged in parallel to each other, and any second sub-dielectric layer and the first sub-dielectric layer are arranged in parallel to each other; At least one parasitic unit is disposed on the two sub-dielectric layers, and the at least one parasitic unit penetrates through the at least one second sub-dielectric layer.

It can be understood that each of the at least one first sub-dielectric layer carries a sub-radiator respectively, and each of the at least one second sub-dielectric layer is respectively provided with at least one parasitic unit.

Optionally, in this embodiment of the present invention, one of the at least one first sub-dielectric layer is in contact with the third surface of the second dielectric layer 12 , and one of the at least one second sub-dielectric layer is the first sub-dielectric layer. The two sub-dielectric layers are in contact with another first sub-dielectric layer in the at least one first sub-dielectric layer (ie, the first sub-dielectric layer farthest from the one first sub-dielectric layer in the at least one first sub-dielectric layer).

Exemplarily, with reference to FIG. 1 , as shown in FIG. 8 , the third dielectric layer 13 includes at least one first sub-dielectric layer (for example, the dielectric layer 21 ) arranged parallel to each other and at least one second sub-dielectric layer ( For example, the dielectric layer 22), the dielectric layer 21 and the dielectric layer 22 are arranged parallel to each other; one surface of the dielectric layer 21 is in contact with the second dielectric layer 12, the other surface of the dielectric layer 21 is provided with a sub-radiator 23, and the medium The other surface of the layer 21 is in contact with one surface of the dielectric layer 22 on which at least one parasitic unit (eg, parasitic unit a, parasitic unit b, parasitic unit c, and parasitic unit d) is disposed.

Optionally, in this embodiment of the present invention, one second sub-dielectric layer in the at least one second sub-dielectric layer is in contact with the third surface of the second dielectric layer 12, and one second sub-dielectric layer in the at least one first sub-dielectric layer is in contact with the third surface of the second dielectric layer 12. A sub-dielectric layer is in contact with another second sub-dielectric layer in the at least one second sub-dielectric layer (ie, the second sub-dielectric layer farthest from the one second sub-dielectric layer in the at least one second sub-dielectric layer).

In this embodiment of the present invention, at least one parasitic unit may be disposed through at least one second sub-dielectric layer to widen the beam width of the radiation pattern of the sub-radiators carried by the at least one first sub-dielectric layer, thereby increasing the scanning efficiency of the array. coverage angle to increase the radiation coverage of these sub-radiators.

Optionally, in the embodiment of the present invention, the above-mentioned feeding network 14 is electrically connected to the signal processing module in the electronic device, or the above-mentioned feeding network 14 is electrically connected to the signal processing module in the electronic device through a signal transmission line.

Optionally, in this embodiment of the present invention, the above-mentioned signal processing module may be an IC chip, and the IC chip may include a PMIC and an RFIC.

Optionally, in the embodiment of the present invention, the above-mentioned feeding network 14 is electrically connected to the RFIC, and the PMIC is electrically connected to the processor in the electronic device through a connector.

Optionally, in this embodiment of the present invention, the feeder network 14 and the RFIC are electrically connected to the RFIC through a signal transmission line, and the PMIC is electrically connected to the processor in the electronic device through a connector.

Optionally, in this embodiment of the present invention, the above signal transmission line may be any one of the following: a substrate integrated waveguide (SIW) and a microstrip line.

Optionally, in this embodiment of the present invention, the cover body 10 and the signal processing module may be regarded as an antenna system.

Exemplarily, FIG. 9A shows a schematic layout diagram of the antenna module of the cover body 10 provided by the embodiment of the present invention. As shown in FIG. 9A , the cover body 10 includes at least one antenna module (for example, the antenna module X, the antenna module Y and the antenna module Z), and the antenna module X, the antenna module Y and the antenna module Z are located on the cover body 10 different positions.

Illustratively, the cover body 10 includes an antenna module as an example for illustration. FIG. 9B shows a cross-sectional view of a cover body 10 provided by an embodiment of the present invention. As shown in FIG. 9B , the cover body 10 includes a first dielectric layer 11 , a second dielectric layer 12 and at least one first sub-dielectric arranged parallel to each other layer (for example, the dielectric layer 17 and the dielectric layer 18 ), the first dielectric layer 11 is provided with a feeding network 14 , and the feeding network 14 is coupled to the feeding unit passing through the second dielectric layer 12 and the first dielectric layer 11 . 15 is electrically connected, the dielectric layer 17 is provided with a sub-radiator 19, the dielectric layer 18 is provided with a sub-radiator 20, at least one parasitic element 24 is provided through the dielectric layer 17 and the dielectric layer 18, the feed network 14 and the signal Processing modules 25 (eg, PMICs and RFICs) are snug and electrically connected.

For another example, FIG. 9C shows a cross-sectional view of a cover body 10 provided by an embodiment of the present invention. As shown in FIG. 9C , the cover body 10 includes a first dielectric layer 11 , a second dielectric layer 12 and at least one first sub-layer Dielectric layers (eg, dielectric layer 17 and dielectric layer 18 ), the first dielectric layer 11 is provided with a feeding network 14 , and the feeding network 14 is coupled to feed through the second dielectric layer 12 and the first dielectric layer 11 The unit 15 is electrically connected, the dielectric layer 17 is provided with a sub-radiator 19, the dielectric layer 18 is provided with a sub-radiator 20, at least one parasitic unit 24 is provided through the dielectric layer 17 and the dielectric layer 18, the feeding network 14 and the electron The signal processing modules 25 in the device are electrically connected through signal transmission lines 26 .

It can be understood that the feeding network 14 can be connected to the signal processing module through a signal transmission line, so that the cover body 10 (ie the antenna unit) and the signal processing module can be staggered in space to reduce the difficulty of stacking the whole machine, and can widen the antenna The freedom of unit layout allows you to choose the optimal layout position of the antenna unit without affecting other devices.

Optionally, in the embodiment of the present invention, the cover body 10 may be fabricated by a low temperature co-fired ceramic (LTCC) process, and the cover body 10 is attached to the signal processing module.

Exemplarily, as shown in FIG. 10A , the first dielectric layer 11 , the second dielectric layer 12 , the third dielectric layer 13 , the feeding network 14 , the coupling feeding unit 15 and the target radiation of the cover body 10 may be radiated by the LTCC process. The body 16 is formed and formed; as shown in FIG. 10B , the cover body 10 formed by the LTCC process and the signal processing module 25 can be welded by the flip-chip welding process; as shown in FIG. 10C , the cover body welded with the signal processing module 25 can be welded. The body 10 is milled to a desired shape by a computer numerical control (computer numerical control, CNC) process; as shown in FIG. 10D , a color material finish (CMF) surface treatment can be performed on the cover body 10 by the CNC process to form a color coating layer 27 to complete the fabrication of the cover body 10 .

It can be understood that in this embodiment of the present invention, the millimeter-wave antenna unit and the cover body 10 can be integrated by using the LTCC process to form a structural relationship of the antenna unit, that is, the cover body 10, and the antenna unit can be saved while the influence of the cover body 10 on the performance of the antenna unit is solved. The space required to enhance the competitiveness of the product.

Optionally, in this embodiment of the present invention, the cover 10 (ie, the antenna unit) may be applied to a wireless wide area network (WWAN), a wireless local area network (WLAN), a radio frequency identification (radio frequency) identification, RFID), near field communication (near field communication, NFC) or wireless charging, etc.

FIG. 11 shows a possible schematic structural diagram of the electronic device involved in the embodiment of the present invention. As shown in FIG. 11 , the electronic device 50 may include: the cover body 10 in the above embodiment.

Optionally, in this embodiment of the present invention, the foregoing electronic device may be a mobile electronic device or a non-mobile electronic device. Exemplarily, the mobile electronic device may be a mobile phone, a tablet computer, a notebook computer, a palmtop computer, an in-vehicle electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, a personal game console, a smart watch , electronic camera equipment or personal digital assistant (personal digital assistant, PDA), etc., the non-mobile electronic equipment can be a personal computer (personal computer, PC), television (television, TV), teller machine or self-service machine, etc. Specific restrictions.

Optionally, in this embodiment of the present invention, the electronic device may further include a signal processing module, and the power feeding network 14 in the cover body 10 is connected to the signal processing module (eg, electrical connection or connection through a signal transmission line).

An embodiment of the present invention provides an electronic device, which includes a cover. Since the cover includes a plurality of dielectric layers, each module (ie, a feeding network, a coupling feeding unit, and a target radiator) provided with the plurality of dielectric layers ) constitutes an antenna unit (ie, an antenna), that is, the cover can be regarded as an antenna unit, so the influence of the cover of the electronic device on the coverage of the antenna unit can be avoided, thereby improving the performance of the antenna unit in the electronic device.

It should be noted that, herein, the terms "comprising", "comprising" or any other variation thereof are intended to encompass non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements, It also includes other elements not expressly listed or inherent to such a process, method, article or apparatus. Without further limitation, an element qualified by the phrase "comprising a..." does not preclude the presence of additional identical elements in a process, method, article or apparatus that includes the element.

From the description of the above embodiments, those skilled in the art can clearly understand that the method of the above embodiment can be implemented by means of software plus a necessary general hardware platform, and of course can also be implemented by hardware, but in many cases the former is better implementation. Based on this understanding, the technical solutions of the present invention can be embodied in the form of software products in essence or the parts that make contributions to the prior art, and the computer software products are stored in a storage medium (such as ROM/RAM, magnetic disk, CD-ROM), including several instructions to make an electronic device (which may be a mobile phone, a computer, a server, an air conditioner, or a network device, etc.) to execute the methods described in the various embodiments of the present invention.

The embodiments of the present invention have been described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific embodiments, which are merely illustrative rather than restrictive. Under the inspiration of the present invention, without departing from the spirit of the present invention and the scope protected by the claims, many forms can be made, which all belong to the protection of the present invention.

Claims (12)

1. A cover for an electronic device, wherein the cover comprises: a first dielectric layer, a second dielectric layer disposed on a first surface of the first dielectric layer, a second dielectric layer disposed on the second dielectric layer a third dielectric layer on the dielectric layer, the second dielectric layer is disposed between the first dielectric layer and the third dielectric layer; Wherein, a feeding network is provided on the second surface of the first dielectric layer, and the second surface is arranged opposite to the first surface; The coupling feeding unit of the first dielectric layer is electrically connected; the third dielectric layer carries a target radiator, and the coupling feeding unit is coupled and connected to the target radiator. 2 . The cover according to claim 1 , wherein the third dielectric layer comprises at least one first sub-dielectric layer arranged in parallel with each other, and the target radiator comprises a radiator carried by each first sub-dielectric layer. a sub-radiator; in the at least one first sub-dielectric layer, a sub-radiator carried by the first sub-dielectric layer in contact with the second dielectric layer is coupled and connected to the coupling and feeding unit; and each Any two adjacent sub-radiators in the sub-radiators carried by a sub-dielectric layer are coupled and connected. 3 . The cover body according to claim 2 , wherein the cover body further comprises at least one parasitic unit, and each parasitic unit is disposed through the at least one first sub-dielectric layer. 4 . 4 . The cover according to claim 2 , wherein the third dielectric layer further comprises at least one second sub-dielectric layer arranged parallel to each other, and any second sub-dielectric layer and any first sub-dielectric layer are mutually are arranged in parallel; at least one parasitic unit is arranged on the at least one second sub-dielectric layer, and the at least one parasitic unit penetrates the at least one second sub-dielectric layer. 5. The cover according to claim 3 or 4, wherein each parasitic unit is a metal via structure. 6 . The cover according to claim 3 , wherein, in any one of the first sub-dielectric layers, the at least one parasitic unit is distributed on the sub-radiators carried by the any one of the first sub-dielectric layers. 7 . around. 7 . The cover according to claim 1 , wherein the coupling and feeding unit comprises at least one feeding part and at least one feeding arm, and each feeding part is electrically connected to one feeding arm respectively, so the The at least one feeding part is located in the second dielectric layer, and the at least one feeding arm is located on a third surface of the second dielectric layer, and the third surface is the same as the second dielectric layer. The surface that the third dielectric layer contacts. 8 . The cover according to claim 7 , wherein the at least one feeding arm is an arc-shaped feeding arm, and each feeding arm in the at least one feeding arm faces the target respectively. 9 . Radiator settings. 9 . The cover body according to claim 7 or 8 , wherein the feed network comprises at least one equal power division moving network, and two ends of each equal power moving network are respectively connected to different feeders. 10 . The arms are electrically connected, and the feeder arm is different for each equal power division move toward the network connection. 10 . The cover according to claim 1 , wherein a metal layer is provided on the fourth surface of the second dielectric layer, and the fourth surface is the second dielectric layer and the first surface. 11 . The surface that the dielectric layer contacts. 11 . The cover according to claim 1 , wherein the power feeding network is attached and electrically connected to a signal processing module in the electronic device, or the power feeding network is connected to the electronic device through a signal transmission line. 12 . The signal processing modules in the device are electrically connected. 12. An electronic device, characterized in that, the electronic device comprises the cover body according to any one of claims 1 to 11.

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