CN111394729B - Electrolysis device and printed board acid etching waste liquid regeneration and copper recovery equipment thereof - Google Patents
Electrolysis device and printed board acid etching waste liquid regeneration and copper recovery equipment thereof Download PDFInfo
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- CN111394729B CN111394729B CN202010339532.3A CN202010339532A CN111394729B CN 111394729 B CN111394729 B CN 111394729B CN 202010339532 A CN202010339532 A CN 202010339532A CN 111394729 B CN111394729 B CN 111394729B
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- anode
- cathode
- waste liquid
- printed board
- plate
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- 238000005868 electrolysis reaction Methods 0.000 title claims abstract description 55
- 239000007788 liquid Substances 0.000 title claims description 154
- 239000002699 waste material Substances 0.000 title claims description 103
- 238000005530 etching Methods 0.000 title claims description 101
- 239000010949 copper Substances 0.000 title claims description 86
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 82
- 229910052802 copper Inorganic materials 0.000 title claims description 82
- 239000002253 acid Substances 0.000 title claims description 67
- 238000011084 recovery Methods 0.000 title claims description 39
- 238000011069 regeneration method Methods 0.000 title claims description 10
- 230000008929 regeneration Effects 0.000 title claims description 9
- 238000005342 ion exchange Methods 0.000 claims abstract description 34
- 238000003825 pressing Methods 0.000 claims abstract description 11
- 238000002156 mixing Methods 0.000 claims description 39
- 239000007789 gas Substances 0.000 claims description 29
- 239000002912 waste gas Substances 0.000 claims description 23
- 230000002378 acidificating effect Effects 0.000 claims description 21
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 19
- 230000001172 regenerating effect Effects 0.000 claims description 17
- 238000003860 storage Methods 0.000 claims description 17
- 238000009489 vacuum treatment Methods 0.000 claims description 16
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 claims description 11
- 229910000041 hydrogen chloride Inorganic materials 0.000 claims description 11
- 239000000460 chlorine Substances 0.000 claims description 10
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 9
- 229910052801 chlorine Inorganic materials 0.000 claims description 9
- 230000005484 gravity Effects 0.000 claims description 9
- 238000004064 recycling Methods 0.000 claims description 9
- 239000012528 membrane Substances 0.000 claims description 8
- 238000004891 communication Methods 0.000 claims description 5
- 238000001802 infusion Methods 0.000 claims description 4
- 239000004744 fabric Substances 0.000 claims description 3
- 230000033116 oxidation-reduction process Effects 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 description 20
- 239000000243 solution Substances 0.000 description 18
- 238000004519 manufacturing process Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 239000003792 electrolyte Substances 0.000 description 8
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 238000009413 insulation Methods 0.000 description 6
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 3
- 238000005341 cation exchange Methods 0.000 description 3
- 150000001768 cations Chemical class 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229910001431 copper ion Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 235000011121 sodium hydroxide Nutrition 0.000 description 3
- 239000002351 wastewater Substances 0.000 description 3
- BZSXEZOLBIJVQK-UHFFFAOYSA-N 2-methylsulfonylbenzoic acid Chemical compound CS(=O)(=O)C1=CC=CC=C1C(O)=O BZSXEZOLBIJVQK-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 125000002091 cationic group Chemical group 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 150000002500 ions Chemical group 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000006386 neutralization reaction Methods 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- FAKFSJNVVCGEEI-UHFFFAOYSA-J tin(4+);disulfate Chemical compound [Sn+4].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O FAKFSJNVVCGEEI-UHFFFAOYSA-J 0.000 description 2
- 229910017917 NH4 Cl Inorganic materials 0.000 description 1
- 239000005708 Sodium hypochlorite Substances 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 239000003011 anion exchange membrane Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012824 chemical production Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000000895 extractive distillation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002440 industrial waste Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- SUKJFIGYRHOWBL-UHFFFAOYSA-N sodium hypochlorite Chemical compound [Na+].Cl[O-] SUKJFIGYRHOWBL-UHFFFAOYSA-N 0.000 description 1
- RCIVOBGSMSSVTR-UHFFFAOYSA-L stannous sulfate Chemical compound [SnH2+2].[O-]S([O-])(=O)=O RCIVOBGSMSSVTR-UHFFFAOYSA-L 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910000375 tin(II) sulfate Inorganic materials 0.000 description 1
- 239000005028 tinplate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
- C25C1/12—Electrolytic production, recovery or refining of metals by electrolysis of solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C7/00—Constructional parts, or assemblies thereof, of cells; Servicing or operating of cells
- C25C7/04—Diaphragms; Spacing elements
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C7/00—Constructional parts, or assemblies thereof, of cells; Servicing or operating of cells
- C25C7/06—Operating or servicing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Water Treatment By Electricity Or Magnetism (AREA)
Abstract
The electrolysis device claimed by the invention comprises a press machine and an electrolysis unit; the press is provided with a pressing space, and an electrolysis unit is arranged in the pressing space; the electrolysis unit comprises an anode plate, an anode frame, an ion exchange layer, a cathode frame and a cathode plate; the press machine can sequentially compress the anode plate, the anode frame, the ion exchange layer, the cathode frame and the cathode plate to form a closed anode chamber and a closed cathode chamber. According to the electrolysis device, the anode plate, the anode frame, the ion exchange layer, the cathode frame and the cathode plate of the electrolysis unit are sequentially pressed by the press machine to form the closed anode chamber and the closed cathode chamber, so that gas generated by the electrolysis reaction of the electrolysis device cannot be released, generated corrosive gas is prevented from corroding equipment, and the quality of an operation environment is improved.
Description
Technical Field
The invention relates to the technical field of electrolytic units for electrolytic treatment of electrolyte, in particular to an electrolytic device and a device for regenerating acid etching waste liquid and recycling copper of a printed board thereof.
Background
Most of the existing electrolytic treatment devices for treating waste liquid are in an open state, when the waste liquid is treated by electrolysis, generated gas is often released into the air, some gas is corrosive gas, on one hand, the quality of the air in the operation environment is reduced by volatilization of the corrosive gas, on the other hand, equipment is corroded by long-term volatilization of the corrosive gas, and other gas is harmful gas, and the environment is polluted by emission of the harmful gas. Therefore, it is necessary to develop a sealed electrolytic processing device.
Disclosure of Invention
Aiming at the problem that the conventional electrolytic treatment device has adverse effect on volatile gas in the electrolytic process, the invention designs an electrolytic unit structure, develops an electrolytic device with an electrolytic unit with a sealed anode chamber and a sealed cathode chamber, and can not release the gas generated by the electrolytic unit in the electrolytic process.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
an electrolysis device comprises a press machine and an electrolysis unit;
the press is provided with a pressing space, and an electrolysis unit is arranged in the pressing space;
The electrolysis unit comprises an anode plate, an anode frame, an ion exchange layer, a cathode frame and a cathode plate;
The press machine can sequentially compress the anode plate, the anode frame, the ion exchange layer, the cathode frame and the cathode plate to form a closed anode chamber and a closed cathode chamber.
Preferably, the press comprises a propping part, a moving part and a driving part;
A pressing space is arranged between the propping part and the driving part;
the moving part is arranged in the holding space;
The driving part drives the moving part to move along the pressing space, and presses and holds a plurality of electrolysis units between the abutting part and the moving part in a row.
Preferably, a plurality of the electrolysis units are arranged in a row in the holding space;
an anode frame is arranged between the supporting part and the anode plate, and an anode frame is arranged between the moving part and the anode plate.
Or alternatively
A cathode frame is arranged between the propping part and the cathode plate, and a cathode frame is arranged between the moving part and the cathode plate
Or also or alternatively
The propping part is propped against the anode plate or the cathode plate, and the moving part is propped against the anode plate or the cathode plate;
preferably, anode frames are arranged at two sides of the anode plate;
Cathode frames are arranged at two sides of the cathode plate;
two adjacent electrolytic units share the same anode plate or cathode plate.
Preferably, the anode frame and the cathode frame are in a shape of a circle;
The press machine can compress the anode plate, the anode frame, the ion exchange layer, the cathode frame and the cathode plate in sequence, so that the anode plate, the anode frame and the ion exchange layer form an anode chamber, and the ion exchange layer, the cathode frame and the cathode plate form a cathode chamber.
Preferably, one side of the anode frame is provided with an anode liquid inlet, and the other side of the anode frame is provided with an anode liquid outlet;
one side of the cathode frame is provided with a catholyte inlet, and the other side of the cathode frame is provided with a catholyte outlet;
The anolyte inlet and the anolyte outlet are both communicated with the anode chamber;
both the catholyte inlet and the catholyte outlet are in communication with the cathode chamber.
Preferably, the electrolysis device further comprises a transfusion pipeline;
The infusion pipeline comprises an anode liquid inlet main pipe, an anode liquid outlet main pipe, a cathode liquid inlet main pipe and a cathode liquid outlet main pipe;
the anolyte inlet main pipe is communicated with the anolyte inlet;
one end of the anolyte inlet main pipe is provided with an anolyte inlet valve, and the other end is provided with an anode evacuation valve;
The anolyte outlet main pipe is communicated with the anolyte outlet;
The catholyte inlet header pipe is communicated with the catholyte inlet;
One end of the catholyte inlet header pipe is provided with a catholyte inlet valve, and the other end is provided with a cathode evacuation valve;
the catholyte outlet header pipe is communicated with the catholyte outlet.
Preferably, the electrolysis device further comprises an anode conductive copper bar, the anode conductive copper bar is arranged at the top of the anode plate, one end of the anode conductive copper bar extends outwards to form a first connecting rod, the other end of the anode conductive copper bar extends outwards to form a second connecting rod, and the second connecting rod is provided with a cathode insulation head.
Preferably, the electrolysis device further comprises a cathode conductive copper bar, the cathode conductive copper bar is arranged at the top of the cathode plate, one end of the cathode conductive copper bar extends outwards to form a third connecting rod, the other end of the cathode conductive copper bar extends outwards to form a fourth connecting rod, and the fourth connecting rod is provided with an anode insulation head.
The first connecting rod and the fourth connecting rod are positioned at the same side, and the second connecting rod and the third connecting rod are positioned at the same side.
Preferably, the electrolysis device further comprises a power supply assembly;
The power supply assembly comprises a rectifier, an anode conductive part and a cathode conductive part;
the first connecting rod is connected with the anode conductive part;
the third connecting rod is connected with the cathode conductive part;
The anode conductive part is electrically connected with the rectifier, and the cathode conductive part is electrically connected with the rectifier.
Preferably, the anode conductive part is an anode connecting copper bar or an anode conductive wire;
the cathode conductive part is a cathode connecting copper bar or a cathode conductive wire.
Preferably, the anode conductive part is an anode connection copper bar, and the cathode conductive part is a cathode connection copper bar;
The first connecting rod and the anode insulating head are at the same height, and the third connecting rod and the cathode insulating head are at the same height;
The first connecting rod and the anode insulating head are connected with an anode connecting copper bar;
and the third connecting rod and the cathode insulating head are connected with the cathode connecting copper bar.
The equipment for regenerating the acid etching waste liquid of the printed board and recovering copper comprises the electrolytic device;
The ion exchange layer is an ion membrane or diaphragm cloth;
preferably, the ion exchange layer is a cationic membrane;
the electrolysis device is used for electrolytically treating the printed board acid etching waste liquid.
Preferably, the device for regenerating the acid etching waste liquid and recycling copper of the printed board further comprises a waste liquid collecting storage tank, a cathode circulating tank, an anode circulating tank, a mixing tank, a vacuum recycling device, a vacuum treatment device and an exhaust gas purifying tower;
the waste liquid collecting storage tank is used for storing acid etching waste liquid of printed board;
the waste liquid collecting storage tank is communicated with the cathode circulating tank;
The cathode circulation groove is in circulation communication with the cathode chamber, and is provided with a specific gravity measuring instrument;
the mixing tank is provided with a hydrometer, an acidity meter and an oxidation-reduction value meter;
The mixing tank is communicated with the anode chamber;
The anode chamber is communicated with the anode circulation tank;
the anode circulation tank discharges the regenerated acidic etching solution of the electrolytically treated printed board;
the waste liquid collecting storage tank, the cathode circulating tank, the anode circulating tank and the mixing tank are communicated with the vacuum recovery device to collect waste gas;
The vacuum recovery device is used for recovering chlorine and hydrogen chloride gas; the vacuum recovery device is communicated with the vacuum treatment device, and the vacuum treatment device is used for further treating chlorine and hydrogen chloride which are not completely recovered by the vacuum recovery device;
The waste gas purifying tower is communicated with the vacuum treatment device and is used for purifying waste gas discharged by the vacuum treatment device so as to ensure that the waste gas reaches the standard to be discharged.
Preferably, the vacuum recovery device is communicated with the cathode circulation tank and the mixing tank at the same time, the cathode circulation tank pumps the acid etching waste liquid of the printed board after the electrolytic treatment, namely, the cathode liquid into the vacuum recovery device, the vacuum recovery device uses the acid etching waste liquid of the printed board to recover chlorine and hydrogen chloride gas, and the cathode liquid after the reaction flows into the mixing tank;
The waste liquid collecting storage tank is communicated with the mixing tank, and the waste liquid collecting storage tank adds the printed board acid etching waste liquid into the mixing tank to stabilize the copper content of the solution in the regeneration recovery process.
The anode plate, the anode frame, the ion exchange layer, the cathode frame and the cathode plate of the electrolysis unit are sequentially pressed by the press machine to form the closed anode chamber and the closed cathode chamber, so that gas generated by the electrolysis reaction of the electrolysis device can not be released, corrosion of harmful gas to equipment and pollution to the environment are avoided, and the quality of the operation environment is improved.
Drawings
FIG. 1 is a front view of an embodiment of an electrolyzer;
FIG. 2 is a rear view of the electrolyzer;
FIG. 3 is a schematic view of the structure of the electrolytic device;
FIG. 4 is an enlarged view of the location indicated by A in FIG. 1;
FIG. 5 is an enlarged view of the location indicated by B in FIG. 1;
FIG. 6 is a schematic view of the structure of an electrolytic cell;
FIG. 7 is a cross-sectional view of the location indicated by C-C in FIG. 6;
FIG. 8 is an exploded view of an electrolysis cell;
FIG. 9 is an exploded view of an alternate angle of the electrolysis cell;
Fig. 10 is a schematic structural view of an anode frame;
FIG. 11 is a schematic view of the structure of a cathode frame;
fig. 12 is a schematic diagram of a device for regenerating acid etching waste liquid of a printed board and recovering copper.
Reference numerals illustrate:
100-electrolysis device; 1-press, 11-butt part, 12-driving part, 13-moving part, 14-holding space and 15-driving rod; 2-electrolysis unit, 21-anode plate, 21 a-anode conductive copper bar, 211-first connecting bar, 212-second connecting bar, 213-cathode insulating head, 22-anode frame, 221-anolyte inlet, 222-anolyte outlet, 23-cathode frame, 231-catholyte inlet, 232-catholyte outlet, 24-cathode plate, 24 a-cathode conductive copper bar, 241-third connecting bar, 242-fourth connecting bar, 243-anode insulating head, 25-ion exchange layer, 26-anode chamber, 27-cathode chamber; 3-infusion pipeline, 31-anode liquid outlet main pipe, 32-cathode liquid inlet main pipe, 321-anode liquid inlet valve, 322-anode evacuation valve, 33-cathode liquid outlet main pipe, 34-anode liquid inlet main pipe, 341-cathode liquid inlet valve and 342-cathode evacuation valve; 4-power supply assembly, 41-cathode conductive part, 42-anode conductive part, 43-rectifier; 5-a waste liquid collecting storage tank; 6-a cathode circulation tank; 7-a mixing tank; 8-an anode circulation tank; 9-an etching production line; 10-a vacuum recovery device; 20-a vacuum treatment device; 30-an exhaust gas purifying tower; 200-regeneration of acid etching waste liquid of printed boards and copper recovery equipment.
Detailed Description
Embodiments of the invention are described in detail below with reference to the attached drawings, but the invention can be implemented in a number of different ways, which are defined and covered by the claims.
Referring to fig. 1-3 and 6-7, an electrolysis apparatus 100 includes a press 1 and an electrolysis unit 2. The press 1 has a holding space 14, and an electrolysis unit 2 is disposed in the holding space 14, wherein the electrolysis unit 2 includes an anode plate 21, an anode frame 22, an ion exchange layer 25, a cathode frame 23, and a cathode plate 24. The press 1 may sequentially compress the anode plate 21, the anode frame 22, the ion exchange layer 25, the cathode frame 23, and the cathode plate 24 to form a closed anode chamber 26 and a closed cathode chamber 27. In this way, the electrolysis device 100 compresses the anode plate 21, the anode frame 22, the ion exchange layer 25, the cathode frame 23 and the cathode plate 24 of the electrolysis unit 2 in sequence through the press machine 1 to form the closed anode chamber 26 and the cathode chamber 27, so that the gas generated by the electrolysis reaction of the electrolysis device 100 is not released, the generated corrosive gas is prevented from corroding equipment, the harmful gas is prevented from affecting the environment, and the quality of the working environment is improved.
The number of the electrolysis cells 2 provided in the holding space 14 may be one or more. In the present embodiment, the plurality of electrolysis units 2 are arranged in rows and held in the holding space 14, so that the electrolysis treatment efficiency of the electrolysis apparatus 100 can be increased.
Referring to fig. 1 to 3, the press 1 may be an electric press or a manual press, and when the press 1 is an electric press, the press 1 includes a supporting portion 11, a moving portion 13, and a driving portion 12, and the driving portion 12 may be a conventional driving structure. A holding space 14 is provided between the abutting part 11 and the driving part 12, the moving part 13 is provided in the holding space 14, the driving part 12 drives the moving part 13 to move along the holding space 14 by acting the driving rod 15, and a plurality of electrolytic cells 2 in the holding space 14 are held between the abutting part 11 and the moving part 13 in a row.
The anode plates 21 or the cathode plates 24 are arranged at two ends of the plurality of electrolysis units 2 arranged in a row in the holding space 14, when the abutting part 11 abuts against the anode plates 21 or the cathode plates 24 and the moving part 13 abuts against the anode plates 21 or the cathode plates 24, only one side surface of the anode plates 21 or the cathode plates 24 can contact with the electrolytic liquid to carry out electrolytic reaction.
The two ends of the plurality of electrolysis units 2 arranged in a row in the holding space 14 may be anode frames 22 or cathode frames 23, at this time, the abutting portion 11 abuts against the anode frames 22 or the cathode frames 23 with the anode plates 21 or the cathode plates 24, and the moving portion 13 abuts against the anode frames 22 or the cathode frames 23 with the anode plates 21 or the cathode plates 24.
Preferably, referring to fig. 3-5, in the present embodiment, the number of the electrolysis units 2 disposed in the holding space 14 is odd (e.g. 7 or 9), and anode frames 22 are disposed between the anode plate 21 and the abutment portion 11, and between the anode plate 21 and the moving portion 13. The regeneration efficiency of the liquid medicine in this way is highest, and the recovery of copper is not affected.
The electrolytic device 100 adopts such a configuration, and the anode frame 22 is disposed at both ends, so that the anode plate 21 is prevented from directly contacting the abutting portion 11 or the moving portion 13, and the abutting portion 11 and the moving portion 13 act on the electrolytic unit 2 through the anode frame 22 due to good matching between the anode frame 22 and the anode plate 21 and between the anode frame 22 and the cathode plate 24, so that the tightness of the press-holding between the anode plate 21, the anode frame 22, the ion exchange layer 25, the cathode frame 23 and the cathode plate 24 of the electrolytic unit 2 can be improved, and the tightness of the electrolytic unit 2 can be improved. More importantly, the two side surfaces of the anode plate 21 or the cathode plate 24 at the two ends carry out electrolytic reaction, so that the electrolytic treatment efficiency is accelerated, and the potential safety hazard possibly generated by the heating surface of the anode plate 21 or the cathode plate 24 is eliminated.
Referring to fig. 1-2, when a plurality of electrolysis units 2 are disposed in the holding space 14, anode frames 22 are disposed on both sides of the anode plate 21, and cathode frames 23 are disposed on both sides of the cathode plate 24, and adjacent electrolysis units 2 share the same anode plate 21 or cathode plate 24. By adopting such an arrangement, the electrolytic device 100 can simplify the structure, improve the utilization ratio of the anode plate 21 or the cathode plate 24, and accelerate the electrolytic treatment efficiency.
Referring to fig. 6 to 11, for the electrolytic unit 2, the anode plate 21 and the cathode plate 24 are both plate-shaped structures, the anode plate 21 and the cathode plate 24 are made of conductive materials, and in this embodiment, the anode plate 21 and the cathode plate 24 are made of titanium materials, and the surface of the anode plate 21 is coated with a platinum group metal active coating. The cross sections of the anode frame 22 and the cathode frame 23 are in a shape of a circle, the anode frame 22 and the cathode frame 23 are in a shape of a circle as a whole, and the anode plate 21 and the anode frame 22, and the cathode plate 24 and the cathode frame 23 can be in an integral structure or a separate structure. The electrolytic unit 2 is in a frame-type laminated electrolytic cell structure as a whole, and an ion exchange layer 25 is arranged between the anode frame 22 and the cathode frame 23 and can be made of materials such as an anion exchange membrane, a cation exchange membrane or diaphragm cloth.
In the state where the electrolytic cell 2 is held by pressure, the anode plate 21, the anode frame 22 and the ion exchange layer 25 form an anode chamber 26, and the ion exchange layer 25, the cathode frame 23 and the cathode plate 24 can form a cathode chamber 27. Under the energized condition, when the ion exchange layer 25 is a cation exchange membrane, cations in the anode chamber 26 can enter the cathode chamber 27 through the ion exchange layer 25, undergo oxidation reaction on the anode plate 21, and undergo reduction reaction on the cathode plate 24.
Specifically, referring to fig. 3-4 and fig. 8-11, for convenience in energizing, an anode plate 21 and a cathode plate 24 are provided with an anode conductive copper bar 21a on top of the anode plate 21, and a cathode conductive copper bar 24a on top of the cathode plate 24, and the anode conductive copper bar 21a and the cathode conductive copper bar 24a may be fixed by screws or welding.
One end of the anode conductive copper bar 21a extends outwards to form a first connecting rod 211, the other end of the anode conductive copper bar 21a extends outwards to form a second connecting rod 212, the second connecting rod 212 is provided with a cathode insulating head 213, and the cathode insulating head 213 can be formed by wrapping insulating glue on the end side of the second connecting rod 212 or sleeving a plastic head on the second connecting rod 212. One end of the cathode conductive copper bar 24a extends outwards to form a third connecting rod 241, the other end of the cathode conductive copper bar 24a extends outwards to form a fourth connecting rod 242, the fourth connecting rod 242 is provided with an anode insulating head 243, and the anode insulating head 243 can be formed by wrapping insulating glue on the end side of the fourth connecting rod 242 or sleeving a plastic head on the fourth connecting rod 242. The first connecting rod 211 and the third connecting rod 241 are electrically connected with the power supply assembly 4, and after the power supply assembly 4 is electrified, the first connecting rod 211 and the third connecting rod 241 conduct electricity to the anode plate 21 and the cathode plate 24 respectively.
With continued reference to fig. 3-4 and fig. 8-11, the first connecting rod 211 and the second connecting rod 212 are disposed on opposite sides of the anode plate 21, the third connecting rod 241 and the fourth connecting rod 242 are disposed on opposite sides of the cathode plate 24, the first connecting rod 211 and the fourth connecting rod 242 are disposed on the same side, and the second connecting rod 212 and the third connecting rod 241 are disposed on the same side, so that the connection with the power supply assembly 4 is facilitated.
Referring to fig. 1-5, the power supply assembly 4 includes a rectifier 43, an anode conductive portion 42 and a cathode conductive portion 41, where the anode conductive portion 42 and the cathode conductive portion 41 may be copper strips or wires. The anode conductive portion 42 is electrically connected to the rectifier 43, and the cathode conductive portion 41 is electrically connected to the rectifier 43.
When the anode conductive portion 42 is an anode conductive wire and the cathode conductive portion 41 is a cathode conductive wire, the anode conductive portion 42 is electrically connected to the first connecting rod 211 and the cathode conductive portion 41 is electrically connected to the third connecting rod 241.
When the anode conductive portion 42 is an anode connection copper bar and the cathode conductive portion 41 is a cathode connection copper bar, the first connection rod 211 and the anode insulation head 243 are both connected to the anode conductive portion 42, the third connection rod 241 and the cathode insulation head 213 are both connected to the cathode conductive portion 41, and the connection of the first connection rod 211 to the anode conductive portion 42 and the connection of the third connection rod 241 to the cathode conductive portion 41 may be achieved by lap joint or screw fixation, and the connection of the anode insulation head 243 to the anode conductive portion 42 and the connection of the cathode insulation head 213 to the cathode conductive portion 41 may be achieved by simply using the anode conductive portion 42 and the cathode conductive portion 41 as supporting functions. And the first connecting rod 211 and the anode insulating head 243 are located at the same height, and the third connecting rod 241 and the cathode insulating head 213 are located at the same height. Thus, the anode conductive portion 42 and the cathode conductive portion 41 are made of copper strips and are arranged so as to facilitate the energization of the anode plate 21 and the cathode plate 24, and the electrolytic cell 2 can be secured to some extent.
As shown in fig. 8 to 11, for a specific structure for inputting an electrolytic liquid into the anode chamber 26 and the cathode chamber 27, an anolyte inlet 221 is provided on one side of the anode frame 22, and an anolyte outlet 222 is provided on the other side of the anode frame 22, and both the anolyte inlet 221 and the anolyte outlet 222 are communicated with the anode chamber 26. A catholyte inlet 231 is provided on one side of the cathode frame 23, a catholyte outlet 232 is provided on the other side of the cathode frame 23, and both the catholyte inlet 231 and the catholyte outlet 232 are in communication with the cathode chamber 27. Specifically, the anolyte inlet 221 is disposed at the bottom of the anode chamber 26, the anolyte outlet 222 is disposed at the top of the anode chamber 26, the catholyte inlet 231 is disposed at the bottom of the cathode chamber 27, and the catholyte outlet 232 is disposed at the top of the cathode chamber 27, so that the electrolyte can sufficiently flow in the anode chamber 26 and the cathode chamber 27, which is beneficial to the electrolytic reaction. The input electrolyte can be various, such as tin sulfate solution, sodium chloride solution, industrial waste liquid (including PCB etching waste liquid) and other electrolytes.
When the electrolytic liquid is a tin sulfate solution, the anode plate 21 is a tin plate or a titanium plate coated with an active coating, the ion exchange layer 25 is a cationic membrane, and the cathode plate 24 is a titanium plate, so that stannous sulfate is produced.
When the electrolyte is a sodium chloride solution, the anode plate 21 is a titanium plate coated with an active coating, the ion exchange layer 25 is an ion membrane, and the cathode plate 24 is a titanium plate, so that sodium chlorate, sodium hydroxide, and hydrochloric acid are produced.
As shown in fig. 1-3 and 8-11, infusion line 3 includes an anolyte outlet manifold 31, an anolyte inlet manifold 34, a catholyte outlet manifold 33, and a catholyte inlet manifold 32. Wherein, the anolyte inlet manifold 34 is communicated with the anolyte inlet 221, the anolyte outlet manifold 31 is communicated with the anolyte outlet 222, and electrolyte is input and output to the anode chamber 26 through the anolyte inlet manifold 34 and the anolyte outlet manifold 31; the catholyte inlet manifold 32 communicates with the catholyte inlet 231, the catholyte outlet manifold 33 communicates with the catholyte outlet 232, and electrolyte is fed into and discharged from the cathode chamber 27 through the catholyte inlet manifold 32 and the catholyte outlet manifold 33. In order to improve the reaction efficiency of the electrolyte in the anode chamber 26 and the cathode chamber 27, an anolyte inlet 221 communicates with the bottom of the anode chamber 26, and an anolyte outlet 222 communicates with the top of the anode chamber 26; catholyte inlet 231 communicates with the bottom of cathode chamber 27 and catholyte outlet 232 communicates with the top of cathode chamber 27.
In addition, an anode liquid inlet valve 341 is arranged at one end of the anode liquid inlet manifold 34, an anode evacuation valve 342 is arranged at the other end, and when liquid is fed, the anode liquid inlet valve 341 is opened, and the anode evacuation valve 342 is closed; one end of the catholyte inlet header 32 is provided with a catholyte inlet valve 321, the other end is provided with a cathode evacuation valve 322, and when liquid is fed, the catholyte inlet valve 321 is opened, and the cathode evacuation valve 322 is closed. When the treatment of the electrolytic liquid in the electrolytic unit 2 is completed or in other cases (such as removal and installation of the cathode plate 24) it is necessary to drain the electrolytic liquid in the electrolytic unit 2, the anode liquid inlet valve 341 is closed, the anode drain valve 342 is opened, and the electrolytic liquid in the anode chamber 22 is drained; the cathode liquid inlet valve 321 is closed, the cathode evacuation valve 322 is opened, and the electrolytic liquid in the cathode frame 23 is evacuated.
An example of a specific application of the electrolytic device 100 is listed below.
With the annual growth rate of electronic industry of China exceeding 20%, the development of Printed Circuit Boards (PCBs) and related industries is driven, and China becomes the largest PCB production center in the world. Etching processes are an important step in the current PCB manufacturing process, and in the printed circuit board manufacturing process, the circuit boards are generally manufactured by using acid and alkaline etching processes, and a large amount of copper-containing etching waste liquid is generated by enterprises each year.
The acid etching liquid has the processes of hydrochloric acid, sodium chlorate, hydrochloric acid, hydrogen peroxide, hydrochloric acid, ammonium chloride and the like, and the main component of the acid etching waste liquid is CuCl 2,HCl,NaClO3,NH4 Cl, naCl or the like. The existing treatment methods for the acidic etching solution mainly comprise three methods: substitution, dilution and neutralization extraction and sulfuric acid extractive distillation, but the substitution method discharges a large amount of wastewater containing salt and Cl 2, so that the wastewater can pollute the environment and cannot be regenerated; the dilution and neutralization extraction method can also produce a large amount of wastewater, and has the problems of large equipment investment, low liquid medicine utilization rate and the like; the sulfuric acid extraction distillation method needs to add a large amount of sulfuric acid to replace CuCl into copper sulfate, and because the copper sulfate belongs to chemical products, special chemical production qualification is needed, and circuit board production enterprises do not have production qualification.
In order to solve the above problems in the prior art for treating the acidic etching solution, the electrolytic device 100 may be used to prepare a printed board acidic etching waste solution and the copper recovery device 200 may be used to treat the printed board acidic etching waste solution, where the printed board acidic etching waste solution regeneration and copper recovery device 200 may recover copper and convert the printed board acidic etching waste solution into a printed board regeneration acidic etching solution, where the printed board regeneration acidic etching solution may be used in the production of a Printed Circuit Board (PCB), and may also recover and utilize generated chlorine gas, and the waste gas is discharged up to the standard.
Specifically, referring to fig. 1 and 12, in fig. 12, the single line flow direction indicates the liquid flow direction, the double line indicates the gas flow direction, and the printed board acid etching waste liquid regenerating and copper recovering apparatus 200 includes an electrolysis device 100, a waste liquid collecting tank 5, a cathode circulation tank 6, an anode circulation tank 8, a mixing tank 7, a vacuum recovering device 10, a vacuum treating device 20, and an exhaust gas purifying tower 30. Wherein, the waste liquid collecting tank 5 stores the waste liquid of the acid etching of the printed board produced by the etching production line 9, the waste liquid collecting tank 5 is communicated with the cathode circulation tank 6 and the mixing tank 7 of the electrolysis device 100 through pipelines, the cathode circulation tank 6 is circularly communicated with the cathode chamber 27, the cathode circulation tank 6 conveys the waste liquid of the acid etching of the printed board to the cathode chamber 27 through the cathode liquid inlet 231, the on-off is controlled by setting a control valve (not shown), and some waste liquid of the acid etching of the printed board is conveyed through a pump (triangle mark shown in fig. 12), and the cathode chamber 27 conveys the waste liquid of the acid etching of the printed board after reaction back to the cathode circulation tank 6 through the cathode liquid outlet 232.
The cathode circulation tank 6 is also communicated with the vacuum recovery device 10, the cathode circulation tank 6 inputs the reacted printed board acid etching waste liquid into the vacuum recovery device 10 to recover gas, the vacuum recovery device 10 is communicated with the mixing tank 7, the printed board acid etching waste liquid is input into the mixing tank 7 after recovery treatment, the mixing tank 7 is communicated with the anode chamber 26, the mixing tank 7 inputs the printed board acid etching waste liquid into the anode chamber 26 through the anode liquid inlet 221, the anode chamber 26 is communicated with the anode circulation tank 8 through the anode liquid outlet 222, normal printed board regenerated acid etching liquid is generated after the printed board acid etching waste liquid is subjected to electrolytic reaction in the anode chamber 26, the printed board regenerated acid etching liquid is input into the etching production line 9 by the anode circulation tank 8, the printed board regenerated acid etching liquid is used for etching reaction by the etching production line 9, and the printed board acid etching waste liquid is discharged into the waste liquid collecting tank 5.
In addition, the waste liquid collecting tank 5, the cathode circulating tank 6, the anode circulating tank 8 and the mixing tank 7 are respectively communicated with the vacuum recovery device 10, the vacuum recovery device 10 recovers waste gases such as chlorine and hydrogen chloride gas in the waste liquid collecting tank 5, the cathode circulating tank 6, the anode circulating tank 8 and the mixing tank 7, the vacuum recovery device 10 recovers and recycles the chlorine and the hydrogen chloride gas, the waste gases treated by the vacuum recovery device 10 flow into the vacuum treatment device 20 for treatment, and the treated waste gases enter the waste gas purifying tower 30 for treatment after being treated by the vacuum treatment device 20, and then reach the standard for discharge.
More specifically, in the process of treating the waste acidic etching solution, the ion exchange layer 25 of the electrolysis device 100 is a cation exchange membrane, and cations in the waste acidic etching solution of the printed board in the anode chamber 26 can enter the cathode chamber 27 through the ion exchange layer 25, while cations in the waste acidic etching solution of the printed board in the cathode chamber 27 cannot enter the anode chamber 26 through the ion exchange layer 25. In the cathode chamber 27, the reactions carried out on the cathode plate 24 are: cu 2++2e→Cu;Cu2++e→Cu+;Cu+ +e- & gt Cu; in the anode chamber 26, the reaction performed on the anode plate 21 is: cu +-e→Cu2+. Thus, copper ions in the printed board acid etching waste liquid are separated out from the cathode plate 24 after the electrolytic reaction, when a large amount of copper is separated out from the cathode plate 24, before the copper on the cathode plate 24 is removed, the printed board acid etching waste liquid in the anode chamber 26 and the cathode chamber 27 is discharged from the anode liquid emptying pipe and the cathode liquid emptying pipe respectively, then the driving part 12 of the press machine 1 drives the moving part 13 to reversely drive, the copper on the cathode plate 24 is removed, and the copper is reloaded or replaced by a new cathode plate 24 after the copper is removed.
The cathode circulation tank 6 conveys the printed board acid etching waste liquid to the cathode chamber 27 and circulates continuously, the specific gravity of the cathode liquid is in the range of 1.1-1.3g/ml at this time, after the electrolytic reaction in the cathode chamber 27, the specific gravity of the cathode liquid can be reduced due to the precipitation of copper, and at this time, the specific gravity of the cathode liquid is adjusted in the range of 1.1-1.3g/ml by inputting the printed board acid etching waste liquid in the waste liquid collecting storage tank 5 into the mixing tank 7, so as to ensure the stability of the copper concentration of the cathode liquid.
In the mixing tank 7, specific gravity, acidity and redox value of the printed board acid etching waste liquid in the mixing tank 7 are measured by a densitometer, an acidity meter and a redox value meter, the specific gravity of the printed board acid etching waste liquid in the mixing tank 7 is controlled in the range of 1.2-1.3g/ml, the acidity is controlled in the range of 1.5-2.5N, and the redox value is controlled in the range of 300-600mv, after which the mixing tank 7 conveys the printed board acid etching waste liquid to the anode chamber 26.
The copper ions in the printed board acid etching waste liquid are reduced after copper is separated out through the electrolytic reaction of the cathode chamber 27, the specific gravity of the printed board acid etching waste liquid flowing into the cathode circulation tank 6 is reduced, the printed board acid etching waste liquid in the cathode circulation tank 6 flows into the mixing tank 7 after waste gas is recovered by the vacuum recovery device 10, the final printed board acid etching waste liquid flows into the anode circulation tank 8, the printed board regenerated acid etching liquid in the anode circulation tank 8 flows into the etching production line 9 for etching reaction, in order to ensure the stability of the copper content in the printed board regenerated acid etching liquid, the adverse effect on the etching reaction caused by the excessively low copper content in the printed board regenerated acid etching liquid is avoided, the waste liquid collecting storage tank 5 is communicated with the mixing tank 7, the waste liquid collecting storage tank 5 flows into the printed board acid etching waste liquid into the mixing tank 7, the copper content in the waste liquid acid etching waste liquid flowing into the mixing tank 7 is very high, the waste liquid can be mixed with the printed board acid etching waste liquid flowing into the mixing tank 7 by the vacuum recovery device 10, and finally the copper content in the printed board regenerated acid etching waste liquid is stabilized, and the etching reaction of the printed board regenerated acid etching liquid in the production line 9 is ensured to be stably carried out.
The acidic etching waste liquid of the printed board is subjected to electrolytic reaction in the anode chamber 26, and part of Cu +、Cu2+ in the acidic etching waste liquid of the printed board in the anode chamber 26 can enter the cathode chamber 27 through the ion exchange layer 25.
The copper is separated out from the waste acid etching liquid of the printed board through the electrolytic reaction of the cathode chamber 27, and Cu +、Cu2+ in the anode chamber 26 enters the cathode chamber 27 again through the ion exchange layer 25 for electrolytic reaction, so that the concentration of copper ions in the waste acid etching liquid of the printed board can be remarkably reduced, the waste acid etching liquid of the printed board is converted into regenerated acid etching liquid of the printed board after flowing through the anode chamber 26, the anode chamber 26 conveys the acid etching liquid of the printed board to the anode circulation tank 8, and the anode circulation tank 8 conveys the acid etching liquid of the printed board to the etching production line 9.
Waste gas in the waste liquid collecting storage tank 5, the cathode circulation tank 6, the anode circulation tank 8 and the mixing tank 7 enters the vacuum recovery device 10, the vacuum recovery device 10 is also communicated with the cathode circulation tank 6 and the mixing tank 7, the cathode circulation tank 6 pumps in the waste acid etching liquid of the printed board into the vacuum recovery device 10, the waste acid etching liquid of the printed board reacts with chlorine gas and hydrogen chloride gas in the waste gas in the vacuum recovery device 10 to be recycled, the chlorine gas can oxidize the waste liquid, the hydrogen chloride gas can improve the acidity of the waste liquid after being dissolved in the waste liquid, the waste liquid can achieve the effect of preliminary regeneration, and the waste acid etching liquid of the printed board after the reaction flows into the mixing tank 7. The vacuum recovery apparatus 10 sends the waste gas into the vacuum treatment apparatus 20, the vacuum treatment apparatus 20 may be a multi-stage treatment apparatus, the liquid caustic soda is introduced into the vacuum treatment apparatus 20 to react with chlorine in the waste gas to generate sodium hypochlorite solution, and the treated waste gas is sent to the waste gas purifying tower 30, purified by 5% liquid caustic soda in the waste gas purifying tower 30, and the waste gas is discharged after being purified by the waste gas purifying tower 30.
The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes using the descriptions and the drawings of the present invention or directly or indirectly applied to other related technical fields are included in the scope of the invention.
Claims (12)
1. The device for regenerating the acid etching waste liquid of the printed board and recycling copper is characterized by comprising a press machine, an electrolysis unit, a waste liquid collecting storage tank, a cathode circulation tank, an anode circulation tank, a mixing tank, a vacuum recycling device, a vacuum treatment device and an exhaust gas purifying tower;
the press is provided with a pressing space, a plurality of electrolysis units are arranged in the pressing space, and the number of the electrolysis units is odd;
the electrolysis unit comprises an anode plate, an anode frame, an ion exchange layer, a cathode frame and a cathode plate;
The press machine can sequentially compress the anode plate, the anode frame, the ion exchange layer, the cathode frame and the cathode plate to form a closed anode chamber and a closed cathode chamber;
The ion exchange layer is an ion membrane or diaphragm cloth;
The electrolysis device is used for electrolyzing the printed board acid etching waste liquid;
the waste liquid collecting storage tank is used for storing the acid etching waste liquid of the printed board;
the waste liquid collecting storage tank is communicated with the cathode circulating tank;
The cathode circulation groove is in circulation communication with the cathode chamber, and is provided with a specific gravity measuring instrument;
The cathode circulation tank is also communicated with the mixing tank;
the mixing tank is provided with a specific gravity meter, an acidity meter and an oxidation-reduction value meter;
The mixing tank is communicated with the anode chamber;
The anode chamber is communicated with the anode circulation tank;
the anode circulation tank discharges the regenerated acidic etching solution of the electrolytically treated printed board;
The waste liquid collecting storage tank, the cathode circulating tank, the anode circulating tank and the mixing tank are communicated with the vacuum recovery device to collect waste gas;
The vacuum recovery device is simultaneously communicated with the cathode circulation tank and the mixing tank, the cathode circulation tank pumps the electrolyzed printed board acid etching waste liquid into the vacuum recovery device, the vacuum recovery device uses the printed board acid etching waste liquid to recover chlorine and hydrogen chloride gas, and the reacted solution flows into the mixing tank; the waste liquid collecting storage tank is communicated with the mixing tank, and the waste liquid collecting storage tank adds the printed board acid etching waste liquid into the mixing tank to stabilize the copper content of the solution in the regeneration recovery process;
The vacuum recovery device is used for recovering chlorine and hydrogen chloride gas; the vacuum recovery device is communicated with the vacuum treatment device, and the vacuum treatment device is used for further treating chlorine and hydrogen chloride which are not completely recovered by the vacuum recovery device;
the waste gas purifying tower is communicated with the vacuum treatment device and is used for purifying waste gas discharged by the vacuum treatment device so as to ensure that the waste gas reaches the standard and is discharged.
2. The apparatus for regenerating an acidic etching waste liquid of a printed board and recovering copper according to claim 1, wherein the press machine comprises a pressing part, a moving part and a driving part;
a pressing space is arranged between the abutting part and the driving part;
The moving part is arranged in the holding space;
The driving part drives the moving part to move along the pressing space, and presses and holds a plurality of electrolysis units between the abutting part and the moving part in a row.
3. The device for regenerating acid etching waste liquid and recycling copper of printed board according to claim 2, wherein a plurality of the electrolytic units are arranged in a row in the holding space;
An anode frame is arranged between the abutting part and the anode plate, and an anode frame is arranged between the moving part and the anode plate;
Or alternatively
A cathode frame is arranged between the propping part and the cathode plate, and a cathode frame is arranged between the moving part and the cathode plate;
Or alternatively
The propping part is propped against the anode plate or the cathode plate, and the moving part is propped against the anode plate or the cathode plate.
4. The apparatus for regenerating and recovering copper from an acidic etching waste liquid of a printed board according to claim 3, wherein both sides of said anode plate are anode plates
A frame;
Cathode frames are arranged on two sides of the cathode plate;
two adjacent electrolytic units share the same anode plate or cathode plate.
5. The apparatus for regenerating acid etching waste liquid and copper recovery of printed board according to any one of claims 1 to 4, wherein the anode frame and the cathode frame are both in a loop-shaped structure;
The press machine can sequentially compress the anode plate, the anode frame, the ion exchange layer, the cathode frame and the cathode plate, so that the anode plate, the anode frame and the ion exchange layer form an anode chamber, and the ion exchange layer, the cathode frame and the cathode plate form a cathode chamber.
6. The device for regenerating and recovering copper from an acidic etching waste liquid of a printed board according to claim 5, wherein an anolyte inlet is provided at one side of the anode frame, and an anolyte outlet is provided at the other side of the anode frame;
One side of the cathode frame is provided with a catholyte inlet, and the other side of the cathode frame is provided with a catholyte outlet;
the anolyte inlet and the anolyte outlet are both communicated with the anode chamber;
the catholyte inlet and the catholyte outlet are both in communication with the cathode chamber.
7. The device for regenerating acid etching waste liquid and recycling copper for printed board according to claim 6, further comprising a transfusion pipe;
the infusion pipeline comprises an anolyte inlet main pipe, an anolyte outlet main pipe, a catholyte inlet main pipe and a catholyte outlet main pipe;
the anolyte inlet main pipe is communicated with the anolyte inlet;
An anode liquid inlet valve is arranged at one end of the anode liquid inlet main pipe, and an anode evacuation valve is arranged at the other end of the anode liquid inlet main pipe;
The anolyte outlet main pipe is communicated with the anolyte outlet;
The catholyte inlet header pipe is communicated with the catholyte inlet;
one end of the catholyte inlet header pipe is provided with a catholyte inlet valve, and the other end of the catholyte inlet header pipe is provided with a cathode evacuation valve;
And the catholyte outlet header pipe is communicated with the catholyte outlet.
8. The device for regenerating and recovering copper from an acidic etching waste liquid of a printed board according to claim 5, further comprising an anode conductive copper bar, wherein the anode conductive copper bar is arranged at the top of the anode plate, one end of the anode conductive copper bar extends outwards to form a first connecting rod, the other end of the anode conductive copper bar extends outwards to form a second connecting rod, and the second connecting rod is provided with a cathode insulating head.
9. The device for regenerating acid etching waste liquid and recycling copper of a printed board according to claim 8, further comprising a cathode conductive copper bar, wherein the cathode conductive copper bar is arranged at the top of the cathode plate, one end of the cathode conductive copper bar extends outwards to form a third connecting rod, the other end of the cathode conductive copper bar extends outwards to form a fourth connecting rod, and the fourth connecting rod is provided with an anode insulating head;
The first connecting rod and the fourth connecting rod are positioned on the same side, and the second connecting rod and the third connecting rod are positioned on the same side.
10. The device for regenerating acid etching waste liquid and recycling copper for printed board according to claim 9, further comprising a power supply assembly;
The power supply assembly comprises a rectifier, an anode conductive part and a cathode conductive part;
The first connecting rod is connected with the anode conductive part;
the third connecting rod is connected with the cathode conducting part;
The anode conductive part is electrically connected with the rectifier, and the cathode conductive part is electrically connected with the rectifier.
11. The apparatus for regenerating and recovering copper from an acidic etching waste liquid of a printed board according to claim 10, wherein the anode conductive part is an anode connection copper bar or an anode conductive wire;
the cathode conductive part is a cathode connection copper bar or a cathode conductive wire.
12. The apparatus for regenerating and recovering copper from an acidic etching waste liquid of a printed board according to claim 11, wherein the anode conductive part is an anode connection copper bar, and the cathode conductive part is a cathode connection copper bar;
The first connecting rod and the anode insulating head are at the same height, and the third connecting rod and the cathode insulating head are at the same height;
The first connecting rod and the anode insulating head are connected with an anode connecting copper bar;
and the third connecting rod and the cathode insulating head are connected with the cathode connecting copper bar.
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