CN111384483A - Dielectric filter applied to 5G communication system, manufacturing method thereof and communication equipment - Google Patents

Abstract

The present application discloses a dielectric filter applied to a 5G communication system, a manufacturing method thereof, and a communication device. The dielectric filter includes: a circuit board, the circuit board includes a board core body and a Metal foils on two main surfaces opposite to each other, wherein the circuit board is processed into a preset filter shape; an electromagnetic shielding layer, the electromagnetic shielding layer is provided on the exposed metal foils on both sides. on the side surface of the core body. The application can improve the production efficiency, without the need for molds, shorten the production cycle, reduce the cost, and improve the processing accuracy.

Description

Dielectric filter applied to 5G communication system, its manufacturing method, and communication equipment

technical field

The present application relates to the technical field of communication devices, and relates to a dielectric filter applied to a 5G communication system, a method for manufacturing the same, and a communication device.

Background technique

With the rapid development of communication technology, especially in the coming 5G communication era, more stringent technical requirements are put forward to the system architecture. While realizing efficient and large-capacity communication, the system modules must be highly integrated, miniaturized, Lightweight and low cost. For example, while 5G Massive MIMO technology can further expand the system channels from the current 8 or 16 channels to 32, 64 or even 128 channels, the overall size of the system architecture must not be too large, and even a certain degree of miniaturization is required. As the core component of the system, the microwave filter's performance parameters, size, and cost have a great impact on the performance, architecture size, and cost of the system.

The inventors of the present application have found in the long-term research and development work that the existing dielectric filters are integrally formed, have low processing accuracy, and the dimensions of the dielectric filters are deviated, resulting in poor stop-band suppression capabilities of the dielectric filters.

SUMMARY OF THE INVENTION

In order to solve the above-mentioned problems of the dielectric filter in the prior art, the present application provides a dielectric filter applied to a 5G communication system, a manufacturing method thereof, and a communication device.

In order to solve the above problems, an embodiment of the present application provides a dielectric filter applied to a 5G communication system, which includes: a circuit board, the circuit board includes a board core body and two opposite to each other disposed on the board core body. a metal foil on the main surface, wherein the circuit board is processed into a preset filter shape; an electromagnetic shielding layer, the electromagnetic shielding layer is provided on the board core body exposed by the metal foils on both sides. on the side surface.

In order to solve the above technical problem, the present invention also provides a communication device applied to a 5G communication system, which includes an antenna and the above-mentioned dielectric filter, wherein the antenna is coupled to the dielectric filter.

In order to solve the above-mentioned technical problems, the present invention also provides a method for manufacturing a dielectric filter, which includes:

A circuit board is provided, the circuit board includes a board core body and metal foils disposed on two main surfaces of the board core body opposite to each other;

machining the circuit board into a preset filter shape;

An electromagnetic shielding layer is formed on the side surfaces of the board core body exposed by the metal foils on both sides.

Compared with the prior art, the dielectric filter of the present application includes a circuit board and an electromagnetic shielding layer, the circuit board includes a board core body and metal foils disposed on two main surfaces of the board core body opposite to each other, and the electromagnetic shielding layer is provided. On the side surface of the board core body exposed by the metal foils on both sides, the circuit board of the circuit board is processed into a preset filter shape; by mass-producing the circuit board, the circuit board is processed into a dielectric filter to improve the processing accuracy. , to avoid the deviation of the size of the dielectric filter, which can improve the stop-band suppression capability of the dielectric filter.

Description of drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the accompanying drawings required in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some of the present application. In the embodiments, for those of ordinary skill in the art, other drawings can also be obtained according to these drawings without any creative effort.

1 is a schematic structural diagram of a dielectric filter according to a first embodiment of the present application;

2 is a schematic structural diagram of a dielectric filter according to a second embodiment of the present application;

3 is a schematic structural diagram of a dielectric filter according to a third embodiment of the present application;

4 is a schematic structural diagram of a dielectric filter according to a fourth embodiment of the present application;

5 is a schematic structural diagram of a dielectric filter according to a fifth embodiment of the present application;

6 is a schematic structural diagram of another dielectric filter in FIG. 5;

7 is a schematic structural diagram of a dielectric filter according to a sixth embodiment of the present application;

8 is a schematic structural diagram of a dielectric filter according to a seventh embodiment of the present application;

9 is a schematic structural diagram of a dielectric filter according to an eighth embodiment of the present application;

10 is a schematic structural diagram of a dielectric filter according to a ninth embodiment of the present application;

FIG. 11 is a schematic flowchart of the manufacturing method of the dielectric filter according to the first embodiment of the present application;

FIG. 12 is a schematic structural diagram of a communication device according to the first embodiment of the present application.

Detailed ways

The present application will be further described in detail below with reference to the accompanying drawings and embodiments. It is particularly pointed out that the following examples are only used to illustrate the present application, but do not limit the scope of the present application. Likewise, the following embodiments are only some of the embodiments of the present application but not all of the embodiments, and all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of this application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances so that the embodiments of the application described herein, for example, can be implemented in sequences other than those illustrated or described herein. Furthermore, the terms "comprising" and "having" and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those expressly listed Rather, those steps or units may include other steps or units not expressly listed or inherent to these processes, methods, products or devices.

Please refer to FIG. 1 , which is a schematic structural diagram of a dielectric filter according to a first embodiment of the present application. The dielectric filter 10 is applied to a 5G communication system. The dielectric filter 10 includes a dielectric block 11 and a metal layer (not shown), and the metal layer covers the dielectric block 11 .

Wherein, the dielectric block 11 can be made of materials with light weight, low loss and high dielectric constant, for example, ceramics, glass or titanate, etc., so that the dielectric filter 10 has smaller volume, smaller size than traditional metal cavity resonators, Low loss, high frequency, high quality factor and high temperature stability.

The dielectric block 11 is provided with at least two dielectric resonators 111 arranged at intervals, and the at least two dielectric resonators 111 are connected between the signal input end and the signal output end. Wherein, two grooves 113 are provided between two adjacent dielectric resonators 111, and the grooves 113 may extend from at least one side surface of the dielectric block 11 to the interior of the dielectric block 11, for example, the grooves 113 extend from the dielectric block 11. The first side surface of 11 extends toward the inside of dielectric block 11 .

As shown in FIG. 1 , the spacing direction A between two adjacent dielectric resonators 111 may be the direction of the central axis of the two adjacent dielectric resonators 111 . The two grooves 113 are spaced apart from each other in the spacing direction A between the two adjacent dielectric resonators 111 , that is, the two grooves 113 are spaced in the spacing direction A, and the spacing distance is a preset distance value; A coupling window is defined between two adjacent dielectric resonators 111 , that is, the coupling window between two adjacent dielectric resonators 111 may be two grooves 113 .

The two grooves 113 are provided on the same side surface of the dielectric block 11, for example, the two grooves 113 are provided on the first side surface of the dielectric block 11; the side surfaces of the dielectric block 11 are opposite to the side surfaces where the two grooves 113 are located The other side surface of the dielectric block 11 is arranged in a flat manner, for example, the second side surface of the dielectric block 11 is arranged in a flat manner, and the first side surface and the second side surface are arranged on opposite sides of the dielectric block 11 .

The extending direction B of the two grooves 113 in this embodiment may be perpendicular to the spacing direction A between the two adjacent dielectric resonators 111 , that is, the two grooves 113 are both connected to the adjacent two dielectric resonators 111 . The spacing between the directions A is vertical. Therefore, in this embodiment, two grooves 113 are provided on the same side surface of the dielectric block 11, which can improve the out-of-band suppression effect at the far end and improve the performance of the dielectric filter.

The metal layer covers the surface of the dielectric block 11, and the tangential electric field of the metal layer is zero, so the metal layer is used to confine the electromagnetic field within the dielectric block 11 to form standing wave oscillation. The material of the metal layer can be metal materials such as silver, copper, aluminum, titanium or gold; for example, the material of the metal layer can be silver, and the silver paste is electrosprayed on the surface of the dielectric body 11 to make the surface of the dielectric body 11 . Alternatively, the material of the metal layer may be a metal thin film, such as a silver thin film, which is welded on the surface of the dielectric body 11 by electric welding to form a metal layer on the surface of the dielectric body 11 .

The present application further provides the dielectric filter of the second embodiment. As shown in FIG. 2 , the extending direction of the two grooves 213 and the spacing direction A between the two adjacent dielectric resonators 111 may be set obliquely, that is, the concave The angle between the extending direction of the grooves 213 and the spacing direction A is not equal to 90°.

Wherein, the two grooves 213 are located on the same side surface of the dielectric block 21, for example, the first side surface of the dielectric block 21 is provided with two grooves 213; and the extension direction of the two grooves 213 is from the side surface where they are located The directions toward the inside of the dielectric block 11 are away from each other, that is, the extension direction B1 of the groove 213 and the extension direction B2 of the groove 213 are away from each other, so that the intersection of the central axes of the two grooves 213 is C.

Further, the inclination directions of the two grooves 213 with respect to the spacing direction A between the adjacent two dielectric filters 111 are different from each other, that is, the inclination direction of the extending direction B1 of the grooves 213 with respect to the spacing direction A and the inclination direction of the grooves 213 The inclination direction of the extending direction B2 of the grooves 213 relative to the spacing direction A is not the same.

In this embodiment, the extending direction of the two grooves 213 and the spacing direction A between the two adjacent dielectric resonators 111 can be set obliquely, thereby improving the out-of-band suppression effect at the far end and improving the performance of the dielectric filter. .

The present application further provides a dielectric filter according to a third embodiment. As shown in FIG. 3 , two grooves 313 are respectively provided on two side surfaces of the dielectric block 11 disposed opposite to each other between two adjacent dielectric resonators 111 . That is, two grooves 313 may be provided on both the first side surface and the second side surface of the dielectric block 11 between two adjacent dielectric resonators 111 .

The extending direction of the two grooves 313 on the first side surface of the dielectric block 11 is perpendicular to the spacing direction A, and the extending direction and spacing direction A of the two grooves 313 on the second side surface of the dielectric block 11 are also Vertically arranged, at this time, the two grooves 313 on the first side surface of the dielectric block 11 and the two grooves 313 on the second side surface of the dielectric block 11 are symmetrically arranged.

The present application further provides a dielectric filter according to a fourth embodiment. As shown in FIG. 4 , two grooves 413 are respectively provided on two side surfaces of the dielectric block 11 disposed opposite to each other between two adjacent dielectric resonators 111 . That is, two grooves 413 may be provided on both the first side surface and the second side surface of the dielectric block 11 between two adjacent dielectric resonators 111 , and the first side surface and the second side surface are oppositely arranged.

Wherein, the extending direction of the two grooves 413 on the two side surfaces of the dielectric block 11 is inclined to the spacing direction A between the two adjacent dielectric resonators 111 , that is, the two grooves 413 on the first side surface of the dielectric block 11 are inclined The grooves 413 are inclined to the spacing direction A, and the two grooves 413 on the second side surface of the dielectric block 11 are inclined to the spacing direction A; and the extension directions of the two grooves 413 on the same side surface are on the side where they are located. The surfaces face away from each other in the direction toward the interior of the dielectric block 11 , that is, the extension directions of the two grooves 413 on the first side surface of the dielectric block 11 are away from each other, and the intersection of the central axes of the two grooves 413 is C; the dielectric block 11 The extending directions of the two grooves 413 on the second side surface of the two grooves are away from each other, and the intersection point of the central axes of the two grooves 413 is D.

The line connecting the intersection of the central axes of the two grooves 413 on one side surface of the dielectric block 11 and the intersection of the central axes of the two grooves 413 on the other side surface is perpendicular to the two adjacent dielectric resonators The spacing direction A between 111 , that is, the intersection of the central axes of the two grooves 413 on the first side surface of the dielectric block 11 is C, and the intersection of the central axes of the two grooves 413 on the second side surface of the dielectric block 11 . For D, the connection line CD is perpendicular to the spacing direction A between the two adjacent dielectric resonators 111 .

The present application further provides the dielectric filter of the fifth embodiment. As shown in FIG. 5 , the depths of the two grooves 513 along the respective extending directions are different from each other, that is, the two grooves 513 located on the same side surface of the dielectric block 11 are The depths of the two grooves 513 are not equal, that is, the depths of the two grooves 513 are not equal.

In this embodiment, the depths of the two grooves 513 along the respective extending directions are not equal. By adjusting the depths of the grooves 513 along the extending direction, the coupling parameters between the two adjacent dielectric resonators 111 , such as coupling, can be adjusted. bandwidth.

In other embodiments, as shown in FIG. 6 , at least three dielectric resonators 611 , 612 and 613 are arranged on the dielectric block 11 at intervals, and there are two grooves 614 between each adjacent two dielectric resonators. The two grooves 614 are alternately arranged on two opposite side surfaces of the dielectric block 11, that is, the two grooves 614 between the adjacent dielectric resonators 611 and 612 are arranged on the first side surface of the dielectric block 11. The two grooves 614 between the dielectric resonator 612 and the dielectric resonator 613 are provided on the second side surface of the dielectric block 11, and the first side surface and the second side surface are oppositely arranged.

The present application provides a dielectric filter according to a sixth embodiment. As shown in FIG. 7 , the dielectric filter 80 is applied to a 5G communication system. The dielectric filter 80 includes at least a circuit board 81 and an electromagnetic shielding layer 82 , and the circuit board 81 includes a board core. The body 811 and the metal foils 812 disposed on the two main surfaces of the core body 811 opposite to each other, for example, the first and second major surfaces of the core body 811 are provided with metal foils 812, and the first and second The two main surfaces are arranged opposite to each other.

The material of the metal foil 812 can be silver, copper, aluminum, titanium or gold and other metal materials, for example, the material of the metal foil 812 can be copper, and the copper paste is electrosprayed on the first main surface and the surface of the core body 811 by electrospraying. on the second main surface to form the metal foil 812 on the main surface of the board core body 811; or, coating copper paste on the first and second main surfaces of the board core body 811 to Metal foil 812 is formed on the main surface of 811 .

The circuit board 81 can be processed into a preset filter shape, that is, the board core body 811 is processed into a preset filter shape, and then metal foils 812 are provided on the two main surfaces of the board core body 811 opposite to each other.

The electromagnetic shielding layer 82 is disposed on the side surface of the board core body 811 exposed by the metal foils 812 on both sides, that is, the metal foils 812 are provided on the first main surface and the second main surface of the board core body 811 , and the board core body 811 An electromagnetic shielding layer 82 is disposed on the side surface of the EMI shielding layer 82 , and the material of the electromagnetic shielding layer 82 may be the same as that of the metal foil 812 . The material of the core body 811 can be made of materials with light weight, low loss and high dielectric constant, such as ceramics, glass or titanate.

In the manufacturing process of the dielectric filter 80, the circuit board 81 is firstly manufactured in batches. Compared with the existing ceramic filter, which needs to be integrally formed, the circuit board 81 does not need to involve the complicated process of ceramic dielectric molding, which improves the production efficiency; The board 81 is cut and punched to process the circuit board 81 into a preset filter shape. Compared with the existing mold molding, no mold is required, the production cycle is short, the cost is low, the processing accuracy is improved, and mass production can be realized; Finally, the metal foil 812 and the electromagnetic shielding layer 82 are arranged on the circuit board 81 after cutting and punching, which can avoid waste of the metal foil 812 and the electromagnetic shielding layer 82 and reduce the cost. Simultaneous processing and easy integration.

A groove 813 for defining a coupling window is further processed on the side surface of the board core body 811 , so that the circuit board 81 includes at least two resonance units cascaded by the coupling window. The groove 813 may be the groove disclosed in the above-mentioned embodiments, the resonance unit is the dielectric resonator of the above-mentioned embodiments, and the plate core body 811 is the dielectric block 11 of the above-mentioned embodiments, which will not be repeated here.

A tuning hole 815 and/or a coupling hole 816 are processed on one side main surface of the board core body 811 and its metal foil 812, and the dielectric filter 80 further includes a tuning screw inserted in the tuning hole 815 and/or the coupling hole 816 and / or coupling screw. For example, the first main surface of the core body 811 and its metal foil 812 are provided with tuning holes 815 or coupling holes 816 .

The dielectric filter 80 of this embodiment includes a circuit board 81 and an electromagnetic shielding layer 82. By mass-producing the circuit board 81 and processing the circuit board 81 into a dielectric filter, the processing accuracy is improved, the size deviation of the dielectric filter is avoided, and the The stopband rejection capability of the dielectric filter 80 .

The tuning hole 815 and the tuning screw are described in detail below. The structure of the coupling hole 816 and the tuning hole 815 are the same, and the structure of the coupling screw and the tuning screw are the same, which will not be repeated here.

The present application further provides the dielectric filter of the seventh embodiment. As shown in FIG. 8 , the tuning hole 815 of the dielectric filter 80 includes a first hole segment 8151 and a second hole segment 8152 arranged along the axis of the tuning hole 815 . The cross-sectional area of the hole segment 8151 perpendicular to the axis is greater than the cross-sectional area of the second hole segment 8152 perpendicular to the axis, that is, the cross-sectional shape of the tuning hole 815 along the axis may be a stepped shape. In other embodiments, the tuning hole 815 may be provided with other numbers of hole segments along the axis, such as 3 hole segments, 5 hole segments.

Since the cross-sectional area of the first hole section 8151 perpendicular to the axis is larger than the cross-sectional area of the second hole section 8152 perpendicular to the axis, the first bearing platform is formed at the connection between the first hole section 8151 and the second hole section 8152 .

The dielectric filter 80 further includes a first nut 83 and a first tuning screw 84 , and the first tuning screw 84 is a tuning screw inserted in the tuning hole 815 . The first nut 83 is arranged on the first bearing platform, that is, the first nut 83 can be fixed on the first bearing platform by means of electric welding or gluing; the first tuning screw 84 is arranged in the tuning hole 815 through the first nut 83, that is The first tuning screw 84 can be rotated relative to the first nut 83 to adjust the length of the first tuning screw 84 in the second hole section 8152 .

The cross-sectional area of the first nut 83 perpendicular to the axis may be equal to or smaller than the cross-sectional area of the first hole section 8151, and the shape of the cross-section of the first nut 83 may be the same as the shape of the cross-section of the first hole section 8151. The cross-sectional shape of a nut 83 is hexagonal or circular. In other embodiments, the shape of the cross-section of the first nut 83 and the shape of the cross-section of the first hole segment 8151 are different. For example, the shape of the cross-section of the first hole segment 8151 is circular, and the The shape of the cross section is hexagonal. In this embodiment, the parameters of the dielectric filter 80 can be adjusted through the first tuning screw 84 .

Specifically, the longer the length of the first tuning screw 84 in the second hole section 8152, the lower the resonance frequency of the dielectric resonator 80; the shorter the length of the first tuning screw 84 in the second hole section 8152, the lower the dielectric resonator The resonant frequency of 80 is higher.

In this embodiment, the first nut 83 and the first tuning screw 84 are arranged in the tuning hole 815 to prevent the first nut 83 and the first tuning screw 84 from protruding from the circuit board 81 , reducing the thickness of the dielectric resonator 80 , thereby reducing the thickness of the dielectric resonator 80 . The volume of the dielectric resonator 80 is small.

The present application provides the dielectric resonator of the eighth embodiment. As shown in FIG. 9 , the first rod section 841 and the second rod section 842 of the first tuning screw 84 are arranged along the axis, and the cross-sectional area of the first rod section 841 perpendicular to the axis less than the cross-sectional area of the second rod segment 842 perpendicular to the axis. Compared with the tuning screw of equal diameter, in this embodiment, the cross-sectional area of the second rod section 842 is set larger than that of the first rod section 841, thereby reducing the distance between the second rod section 842 and the second hole section 8152. The gap can reduce the leakage of the electromagnetic field of the dielectric resonator 80 .

The material on the surface of the first tuning screw 84 may be a metal material, and specifically may be a metal material such as silver, copper, aluminum, titanium, or gold. Further, the materials of other regions of the first tuning screw 84 may be non-metallic materials, such as plastics and the like. Compared with the existing tuning screws that are all made of metal materials, the surface of the first tuning screw 84 of the present application is made of metal materials, and other areas are made of non-metal materials to reduce costs.

Wherein, the cross-sectional area of the second rod section 842 perpendicular to the axis may be equal to the cross-sectional area of the second hole section 8152 perpendicular to the axis, which can further reduce the gap between the second rod section 842 and the second hole section 8152, and can Avoid leakage of the electromagnetic field of the dielectric resonator.

The first rod section 841 is provided with threads, and the second rod section 842 can be designed to be smooth, that is, the outer surface of the second rod section 842 is smooth, so that the second rod section 842 is closely matched with the second hole section 8152, which can avoid the first The thread of the tuning screw 84 wears the inner wall of the tuning hole 815, which improves the performance index of the dielectric filter.

In addition, the first rod section 841 may be partially provided with threads, that is, the end of the first rod section 841 close to the first nut 63 is provided with threads, and the end of the first rod section 841 close to the second rod section 842 is designed to be smooth, thereby ensuring the first The threads of the rod segment 841 do not extend into the second bore segment 8152.

The present application provides the dielectric resonator of the ninth embodiment. As shown in FIG. 10 , the tuning hole 815 further includes a third hole segment 816 , and the cross-sectional area of the second hole segment 8152 perpendicular to the axis is greater than that of the third hole segment 816 perpendicular to the axis. Because of the cross-sectional area of the axis, the connection between the second hole section 8152 and the third hole section 816 forms a second bearing platform.

Wherein, the dielectric resonator 80 further includes a second nut 85 and a second tuning screw 86, the second nut 85 is arranged on the second bearing platform, and the second tuning screw 86 is arranged in the tuning hole 815 through the second nut 85; wherein, The second nut 85 is the same as the above-mentioned first nut 83 , and the second tuning screw 86 is the same as the above-mentioned first tuning screw 84 , which will not be repeated here.

The present application further provides the manufacturing method of the dielectric filter of the first embodiment, which is described on the basis of the dielectric filter 80 disclosed in the sixth embodiment. As shown in FIG. 11 , the manufacturing method includes the following steps:

S201: Provide a circuit board, the circuit board includes a board core body and metal foils disposed on two main surfaces of the board core body that are opposite to each other.

As shown in FIG. 7 , a circuit board 81 is provided, wherein the circuit board 81 includes a core body 811 and metal foils 812 disposed on two main surfaces of the core body 811 opposite to each other, for example, the first The main surface and the second main surface are provided with metal foil 812, and the first main surface and the second main surface are arranged oppositely.

S202: Process the circuit board into a preset filter shape by machining.

The circuit board 81 is processed by machining, for example, cutting and punching the circuit board 81 by machining, so that the processed circuit board 81 has a preset filter shape.

S203 : forming an electromagnetic shielding layer on the side surface of the board core body exposed by the metal foils on both sides.

The electromagnetic shielding layer 82 is disposed on the side surface of the board core body 811 exposed by the metal foils 812 on both sides, that is, the metal foils 812 are provided on the first main surface and the second main surface of the board core body 811 , and the board core body 811 An electromagnetic shielding layer 82 is disposed on the side surface of the EMI shielding layer 82 , and the material of the electromagnetic shielding layer 82 may be the same as that of the metal foil 812 .

Compared with the existing ceramic filter that needs to be integrally formed, the present embodiment does not need to involve complex processes for forming ceramic dielectrics, improves production efficiency, does not require molds, shortens production cycle, reduces costs, and improves processing accuracy.

The present application further provides the communication device of the first embodiment. As shown in FIG. 12 , the communication device 100 is applied to a 5G communication system. The communication device 100 includes an antenna 101 and a dielectric filter 102 , and the antenna 101 is coupled to the dielectric filter 102 . The dielectric filter 102 is the dielectric filter disclosed in the above embodiments, and details are not described herein again. The communication device 100 may be a base station or a terminal for a 5G communication system, and the terminal may specifically be a mobile phone, a tablet computer, a wearable device with a 5G communication function, or the like.

It should be noted that the above embodiments all belong to the same inventive concept, and the description of each embodiment has its own emphasis. For details not described in individual embodiments, reference may be made to descriptions in other embodiments.

The protection circuits and control systems provided by the embodiments of the present application have been described in detail above. The principles and implementations of the present application are described in this article by using specific examples. The descriptions of the above embodiments are only used to help understand the methods of the present application. and its core idea; at the same time, for those of ordinary skill in the art, according to the idea of the application, there will be changes in the specific implementation and application scope. To sum up, the content of this specification should not be construed as a limits.

Claims (12)

1. A dielectric filter applied to a 5G communication system, wherein the dielectric filter comprises: a circuit board, the circuit board includes a board core body and metal foils disposed on two main surfaces of the board core body opposite to each other, wherein the circuit board is processed into a preset filter shape; An electromagnetic shielding layer, the electromagnetic shielding layer is disposed on the side surface of the board core body exposed by the metal foils on both sides. 2 . The dielectric filter according to claim 1 , wherein tuning holes and/or coupling holes are processed on at least one main surface of the core body and its metal foil, and the dielectric filter further comprises: 3 . A tuning screw and/or a coupling screw inserted in the tuning hole and/or the coupling hole. 3 . The dielectric filter according to claim 1 , wherein a groove for defining a coupling window is processed on the side surface of the board core body, so that the circuit board includes at least two coupling Window cascaded resonant units. 4 . The dielectric filter according to claim 3 , wherein the two grooves on the side surface of the board core body extend toward the inside of the board core body, and the two grooves are in the The two adjacent resonance units are spaced apart from each other in the spacing direction. 5 . The dielectric filter according to claim 4 , wherein the extending direction of the two grooves is perpendicular to the spacing direction. 6 . 6 . The dielectric filter according to claim 4 , wherein the extending direction of the two grooves is inclined to the spacing direction. 7 . 7 . The dielectric filter according to claim 6 , wherein the two grooves are located on the same side surface, and the extension direction of the two grooves is from the side surface where the two grooves are located toward the board core. 8 . The directions inside the body are away from each other. 8. The dielectric filter according to claim 6, wherein inclination directions of the two grooves with respect to the spacing direction are different from each other. 9 . The dielectric filter according to claim 4 , wherein the depths of the two grooves in respective extending directions are different from each other. 10 . 10 . The dielectric filter according to claim 4 , wherein the two grooves are arranged on the same side surface of the board core body; the part of the board core body and the two grooves are located. 11 . The other side surface opposite to the side surface is arranged flat. 11. A communication device applied to a 5G communication system, characterized in that the communication device comprises an antenna and the dielectric filter according to any one of claims 1-10, wherein the antenna is coupled to the dielectric filter catch. 12. A method for manufacturing a dielectric filter, wherein the method comprises: A circuit board is provided, the circuit board includes a board core body and metal foils disposed on two main surfaces of the board core body opposite to each other; machining the circuit board into a preset filter shape; An electromagnetic shielding layer is formed on the side surfaces of the board core body exposed by the metal foils on both sides.

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