CN111376566B

CN111376566B - Laminated substrate manufacturing apparatus, laminated substrate production line, and laminated substrate manufacturing method

Info

Publication number: CN111376566B
Application number: CN201910800593.2A
Authority: CN
Inventors: 新垣绫介; 河东和彦
Original assignee: Beac Co Ltd
Current assignee: Beac Co Ltd
Priority date: 2018-12-27
Filing date: 2019-08-28
Publication date: 2022-03-15
Anticipated expiration: 2039-08-28
Also published as: KR20200081209A; JP7298864B2; CN111376566A; JP2020107761A; KR102280160B1

Abstract

The invention provides a laminated substrate manufacturing device, which can more efficiently feed and remove workpieces compared with the prior art, and can laminate the workpieces while inhibiting quality deviation. The laminated substrate manufacturing apparatus of the present invention includes a tray conveying unit 100 for intermittently conveying a tray P on which a workpiece W is placed, and the tray conveying unit 100 is disposed in a state in which a laminating area R1 in which a heating head 320 is disposed and an area R2 in which the tray conveying unit 100 is disposed overlap. The lower edge 312 of the laminating unit 300 is lowered toward the positioned tray P, the lower edge 312 comes into contact with the tray P to form a temporary cavity CH, and the heating surface 326 is pressed against the workpiece W in a state where the workpiece W is placed on the tray P and the inside of the cavity CH is exhausted to laminate the workpiece W.

Description

Laminated substrate manufacturing apparatus, laminated substrate production line, and laminated substrate manufacturing method

Technical Field

The present invention relates to a laminated substrate manufacturing apparatus, a laminated substrate production line, and a laminated substrate manufacturing method.

Background

Conventionally, a multilayer component formed by bonding a plurality of individual sheets (bonding members) to a substrate (bonded member) with an adhesive has been widely known.

The laminated member is capable of passing: a method in which a state in which a plurality of pieces are pre-bonded to a substrate (including a case in which the substrate is another piece as in patent document 1) is regarded as a "workpiece (Work)", and then pressure is applied (pressurized) in the lamination direction while heating the workpiece.

In the present specification, heating and pressing a workpiece as described above is referred to as "lamination (main press bonding)", a laminated member obtained by such a method is referred to as "laminated substrate", and an apparatus for obtaining a laminated substrate by such a method is referred to as "laminated substrate manufacturing apparatus".

However, it is also widely known in the industry that when the adhesive is heated, bubbles are generated from the inside of the adhesive or/and the vicinity of the adhesive (a portion where the adhesive is in contact with a member to be bonded or an adhesive member, or the like) depending on conditions. However, when air bubbles remain in the adhesive and in the vicinity of the adhesive after the completion of the lamination, the adhesive state may be uneven, or defects may occur after the adhesive, the member to be bonded, the adhesive member, and the like are oxidized (air bubbles may occur).

(1) In order to solve the above-mentioned problem of air bubbles, a technique is widely known in which an adherend member and an adhesive member (a plurality of members) are placed in a cavity (Chamber), and the adhesive member are laminated while exhausting air from the cavity, so that air bubbles do not remain in a portion where air bubbles are likely to occur.

As a member bonding apparatus to which this technique is applied, for example, a metal-clad laminate manufacturing apparatus for a multilayer printed wiring board described in patent document 1 (hereinafter, for convenience of description, simply referred to as "apparatus 700 described in patent document 1") is known.

Fig. 12 is a diagram for explaining the apparatuses described in

patent documents

1 and 3. Fig. 12(a) shows the apparatus 700 described in patent document 1, and fig. 12(b) shows the substrate bonding apparatus 900 described in patent document 3.

As shown in fig. 12(a), in the device 700 described in patent document 1, before the bonding process, the laminated multilayer members 713 (laminated body) for multilayer printed wiring are arranged inside a cavity (not shown) formed by the elastic gasket 715, the blade 711, and the heat plates 761a and 716b, and the heat plate 716a on the upper layer side of the laminated body is brought into contact with the elastic gasket 715 to form a closed space, so that the cavity is evacuated from the exhaust port 718 by a vacuum pump (not shown). In addition, the laminated body is heated and pressurized by upper hot plate 716a and lower hot plate 716b to be integrated (lamination process). In the figure, reference numeral 714 denotes a buffer material, and reference numeral 719 denotes a mirror plate.

According to the apparatus 700 described in patent document 1, a plurality of multilayer printed wiring laminated members 713 can be bonded together (multi-stage lamination) while removing air bubbles.

As described above, it is conceivable to configure a "laminated substrate manufacturing apparatus" by applying the apparatus 700 described in patent document 1. For example, it is possible to constitute: a plurality of "work pieces" each having a single piece pre-bonded to a base plate is prepared, and the plurality of work pieces are stacked in a cavity to laminate the plurality of work pieces together.

Prior art documents

[ patent document 1 ] JP-A5-88920 (Kokai)

[ patent document 2 ] Japanese patent application laid-open No. 2000-325773

[ patent document 3 ] Japanese patent application laid-open No. 2007-5335

However, in the apparatus 700 described in patent document 1, after a certain number of multilayer printed wiring laminated members 713 (workpieces) are accumulated, the workpieces are collectively placed in a cavity and Batch processed (Batch processing) is performed, and therefore, if the apparatus 700 described in patent document 1 is applied to a "laminated substrate manufacturing apparatus", the following problems arise.

That is, when the apparatus 700 described in patent document 1 is applied to the "laminated substrate manufacturing apparatus", it can be said that: (a) the time (standby time) from the preliminary press bonding to the actual lamination processing for the plurality of workpieces stacked in the cavity differs depending on the workpieces to be stacked. That is, since various workpieces are laminated from being left for a long time after completion of the pre-crimping to just being subjected to the pre-crimping, the pre-crimping state of each workpiece is not the same. Therefore, when a plurality of these workpieces are laminated together, there is a possibility that quality variation occurs in the pressure-bonded state. (b) When crimping is performed, workpieces that have already been subjected to pre-crimping need to be taken out one by one and then stacked (laminated) in the cavity, and in the process, the positions of the individual pieces subjected to pre-crimping are slightly shifted relative to the substrate due to the stacking operation. That is, a quality deviation may occur at the crimping position. (c) Since the plurality of workpieces are collectively heated and pressurized by the upper hot plate 716a and the lower hot plate 761b, the magnitudes of the heat and the pressurizing force that can be received by the workpiece in the layer closer to the hot plates 761a and 761b and the workpiece in the layer (intermediate layer) farther from the hot plates 761a and 761b are not said to be the same. Since sufficient heat and pressure are not applied to the workpiece in the intermediate layer, the adhesion may be insufficient. Therefore, once comparison is made between a plurality of workpieces, there is a possibility that quality deviation occurs in the crimped state.

As described above, when the apparatus 700 described in patent document 1 is applied to the "laminated substrate manufacturing apparatus", variations in quality (variations in quality) occur depending on the individual products as a whole manufacturing lot.

(2) In order to solve the problem of the quality deviation, the workpieces may be subjected to a lamination process one by one (see, for example, a hot press chamber described in patent document 2). In this case, if the workpieces from the upstream process can be laminated one by one under the same processing conditions, variations in quality due to the product monomers can be suppressed.

However, when the hot press chamber (not shown) described in patent document 2 is applied, it is necessary to perform the following operations for the workpieces one by one: taking prepared workpieces into the cavity (feeding), laminating the workpieces, and taking out the processed products in the cavity (removing), so that the efficiency of feeding and removing the workpieces is low, and the productivity cannot be improved (the problem of efficiency of feeding and removing the workpieces).

(3) In order to solve the problem of the work supply and removal efficiency, a robot or the like may be used to automate the supply and removal (for example, refer to a substrate bonding apparatus 900 described in patent document 3).

As shown in fig. 12(b), a substrate bonding apparatus 900 described in patent document 3 includes: a substrate placing mechanism 909 for placing the first substrate 991 on the second substrate 992; a bonding mechanism 903 for bonding the first substrate 991 and the second substrate 992 in a reduced-pressure atmosphere or an inert gas atmosphere; and a conveyance mechanism 904 for conveying the first substrate 991 and the second substrate 992 from the substrate placement mechanism 909 to the bonding mechanism 903. The conveyance mechanism 904 is constituted by, for example, a robot having a robot arm 941 (see patent document 3 for other specific reference numerals).

When such a robot (conveyance mechanism 904) having a robot arm 941 is introduced into the "laminated substrate manufacturing apparatus", it is possible to improve the efficiency of workpiece supply and removal.

However, the conveyance target assumed by the robot arm 941 of the robot or the like described in patent document 3 is: two semiconductor substrates (a first substrate and a second substrate) having substantially the same shape as each other, a work 9W having a large size, and a single work 9W having relative rigidity, the shape of the upper end face side thereof being substantially flat.

On the other hand, the work related to the "laminated substrate manufacturing apparatus" may be applied not only to a flexible substrate or a sheet-like thin film as a substrate, but also to a fine member smaller than the substrate (smaller in area than the substrate when viewed in plan view) as a single piece. Therefore, even when the robot arm 941 of the robot or the like described in patent document 3 is introduced into the "laminated substrate manufacturing apparatus", it is not possible to place and hold the workpiece on the robot arm 941 and it is not possible to convey the workpiece. Even if such a workpiece can be placed on the robot arm 941, there is a possibility that a fine piece may be dropped or a position of the piece may be shifted during conveyance, and there is a possibility that a scratch may occur on the workpiece during conveyance, resulting in a defective product (in the case of a substrate such as a thin film substrate or a flexible substrate).

Therefore, the robot arm 941 of the robot or the like described in patent document 3 cannot convey (feed) the workpiece relating to the "laminated substrate manufacturing apparatus" in the first place, and may cause a quality problem.

Further, the joining mechanism 903 described in patent document 3 is configured as a work (a first substrate and a second substrate) having a substantially flat shape on the joining upper end surface side, and when the upper end surface of the work is uneven (in a case where a plurality of pieces having different heights are placed on the substrates, or the like), the work cannot be laminated satisfactorily.

In view of the above problems, it is an object of the present invention to provide a laminated substrate manufacturing apparatus and a laminated substrate manufacturing method, which can more efficiently feed and remove workpieces and can perform a laminating process on the workpieces while suppressing variations in quality, as compared with the conventional apparatus.

Disclosure of Invention

【1】 A laminated substrate manufacturing apparatus according to the present invention is a laminated substrate manufacturing apparatus for laminating a plurality of work pieces, each of which is in a state in which a plurality of individual pieces are pre-pressed on a substrate, as an object to be laminated, the laminated substrate manufacturing apparatus including: a Pallet (Pallet) conveying unit for intermittently conveying a Pallet on which the workpiece is placed; a tray positioning unit for stopping the movement of the tray conveyed and separating the tray from the conveying force transmission part of the tray conveying unit to determine the position of the tray; and a laminating unit having a workpiece housing portion capable of housing the workpiece from a lower edge portion to an inner side, and a heating head configured to heat and press the workpiece housed in the workpiece housing portion, wherein, when the laminated substrate manufacturing apparatus is viewed from a plane, a laminating area in which the heating head is disposed and an area in which the tray conveying unit is disposed are disposed in a state in which they are overlapped, the heating head has a heating surface whose shape matches a shape of an upper end surface side of the workpiece, and the laminating unit is configured to: the lower edge portion descends toward the positioned tray, and a temporary cavity is formed by the work accommodating portion and the tray by the lower edge portion coming into contact with the tray, and the laminated substrate manufacturing apparatus is configured such that: pressing the heating surface toward the work in a state where the work is placed on the tray and the inside of the cavity has been exhausted to laminate the work.

The laminated substrate manufacturing apparatus of the present invention is configured to: the laminating area where the heating head is arranged and the area where the tray conveying unit is arranged are arranged in a state where they overlap each other, and the workpieces are laminated by pressing the heating surface against the workpieces in a state where the workpieces are placed on the tray and the cavities are exhausted. That is, the work can be taken into the laminating area (feeding) together with the pallet and subjected to the laminating processing in a state where the work is placed on the pallet, and the product after the laminating processing is placed on the pallet can be conveyed to the downstream process (flow) (discharging) together with the pallet.

Therefore, in the case where the conventional step of taking out the works subjected to the preliminary press bonding one by one and stacking the works in the cavity, or taking out (feeding) the works prepared one by one into the cavity and taking out (removing) the processed product from the cavity after the completion of the laminating process is not required, the feeding and removing of the work and the laminating process can be performed on the laminating area while the works are still placed on the pallet on the conveying path of the pallet (in the same state as in the conveying process).

As described above, according to the laminated substrate manufacturing apparatus of the present invention, the work can be fed and removed more efficiently than in the conventional apparatus.

Further, the laminated substrate manufacturing apparatus of the present invention includes a tray conveying unit for intermittently conveying a tray on which a workpiece is placed, and is configured such that: the heating surface is pressed against the work in a state where the work is placed on the tray and the inside of the cavity has been exhausted to laminate the work. That is, the present invention is configured to: the work preliminarily pressed and joined in the upstream process is directly taken into the laminated substrate manufacturing apparatus by the tray conveying means, and is laminated by forming a temporary cavity directly in units of trays.

Therefore, as long as the conveyance by the tray conveyance device outside the laminated substrate manufacturing apparatus is performed at approximately the same throughput (throughput), the standby time from the preliminary pressure bonding until the lamination process is performed is substantially constant. Therefore, the problem that the standby time until the lamination process is performed varies greatly as in the conventional case does not occur.

Further, according to the laminated substrate manufacturing apparatus of the present invention, since the heating surfaces are laminated after being brought into contact with the works one by one, the magnitudes of the heat and the pressing force applied to the works can be made to meet the same conditions. Therefore, the problem of variation in the magnitude of the heat and the pressure that the workpiece can receive due to the position of the stacked layers in the conventional art does not occur.

Further, since it is not necessary to stack the work pieces for lamination as in the conventional art, the problem of positional deviation of the individual pieces due to stacking does not occur.

Further, since the laminated substrate manufacturing apparatus of the present invention performs lamination using the heating head having the heating surface conforming to the shape of the upper end surface side of the workpiece, even when the upper end surface side of the workpiece is uneven due to the difference in height of the individual pieces placed on the substrate, desired lamination can be performed without causing positional deviation, or the like of the individual pieces.

As described above, according to the laminated substrate manufacturing apparatus of the present invention, variations due to various elements such as standby time, heat, the magnitude of the force to be pressurized, and positional deviation can be suppressed, and thus, since variations in the pressure bonding state can be suppressed, it is possible to perform the laminating process on the work while suppressing variations in quality as compared with the conventional apparatus.

【2】 In the laminated substrate manufacturing apparatus according to the present invention, it is preferable that a sealing member which abuts against an upper end surface of the tray is provided in the lower edge portion of the laminating unit.

By providing the sealing member at the lower edge portion in this manner, when the lower edge portion is brought into contact with the tray to form a temporary cavity, the airtightness of the cavity can be improved. Further, the exhaust efficiency in the air chamber can be improved, thereby shortening the cycle time.

Even if the surface state of the tray varies to some extent, the sealing member can be sandwiched between the tray and the lower edge portion to secure the sealing.

Further, the tray is less likely to be displaced from the heating head by the friction of the sealing member, and the variation in the quality of the laminated substrate due to the displacement can be further suppressed.

【3】 When the vertical direction in the laminated substrate manufacturing apparatus of the present invention is defined as a + z direction, the direction in which the tray is conveyed is defined as a + x direction, and the direction perpendicular to the + z direction and the + x direction is defined as a + y direction, the tray positioning means includes: a tray stopper (palette stopper) provided with a tray stopper portion, and determining a position of the tray in the + x direction by stopping a movement of the tray being conveyed by protruding the tray stopper portion from a direction perpendicular to the + x direction toward a tray passing area; and a tray conveying unit elevation driving unit that drives the tray conveying unit up and down, the laminated substrate manufacturing apparatus further including: a tray placing table disposed at a position directly below the tray stopped by the tray stopper, and the laminated substrate manufacturing apparatus is desirably configured such that: the tray conveying unit is lowered together with the tray by the tray conveying unit elevation driving part, so that the tray is placed on the tray placing table.

With this tray stopper, the position of the tray in the + x direction can be pre-fixed after stopping the movement of the tray during conveyance, and the tray position in the + x direction can be positioned.

Further, by the tray conveying unit elevation driving portion, the tray can be separated from (released from contact with) the conveying force transmitting portion of the tray conveying unit, and the tray can be placed on the tray placing table. Thus, the tray can be positioned in the + z direction.

Further, since the tray and the workpiece are placed on the tray placement table after being firmly fixed, one side of the tray and the workpiece can stably resist the pressing of the heating head. Therefore, variations in the quality of the laminated substrate can be further suppressed.

【4】 In the laminated substrate manufacturing apparatus of the present invention, it is desirable that: and a workbench exhaust port is arranged on the tray placing table.

With this configuration, the air existing between the upper end surface of the tray table and the lower end surface of the tray can be exhausted from the table exhaust port by the exhaust device. Thus, the lower end surface of the tray can be made to closely contact the tray placement table, and the positioning of the tray and the workpiece can be ensured.

【5】 In the laminated substrate manufacturing apparatus of the present invention, it is desirable that: the area of the individual piece of the workpiece is smaller than the area of the substrate when the workpiece placed on the tray is viewed in plan from a direction perpendicular to the main surface of the tray.

According to the laminated substrate manufacturing apparatus of the present invention, even a workpiece in which the area of a single piece is smaller than the area of the substrate, that is, a workpiece on which a fine member is placed can be laminated appropriately.

【6】 In the laminated substrate manufacturing apparatus of the present invention, it is desirable that: the substrate is a flexible substrate.

According to the laminated substrate manufacturing apparatus of the present invention, even a workpiece including a flexible substrate having a relatively flexible structure can be laminated appropriately.

【7】 The laminated substrate production line of the present invention includes: a pre-crimping device for pre-crimping the plurality of single sheets onto the substrate; a tray distributing device for distributing the tray removed from the pre-crimping device to any one of the plurality of tray conveying devices; a plurality of tray conveying devices, each of which has one end connected to the tray distributing device and conveys the trays distributed from the tray distributing device; and a plurality of laminated substrate manufacturing apparatuses each connected to the other end of each of the plurality of tray conveying apparatuses, wherein the laminated substrate manufacturing apparatus is the laminated substrate manufacturing apparatus described in any one of the above [ 1 ] to [ 6 ].

【8】 The method for manufacturing a laminated substrate of the present invention is a method for laminating a plurality of pieces of work, each of which is in a state in which the pieces are pre-bonded to the substrate, as an object to be laminated, the method including: a feeding step comprising: a pallet stopping step of stopping the movement of the pallet conveyed in a state where the workpiece is placed, while contacting the conveying force transmitting portion; and a tray positioning step of separating the stopped tray from the conveying force transmission part and determining the position of the tray; and a laminating step of: a cavity forming step of lowering the lower edge portion of a laminating unit having a work accommodating portion capable of accommodating the work from the lower edge portion to the inside and provided with a heating head for heating and pressurizing the work accommodated in the work accommodating portion toward the tray and forming a temporary cavity by the work accommodating portion and the tray by the lower edge portion coming into contact with the tray; a vacuumizing step, wherein air is exhausted from the cavity; and a heating/pressing step of pressing the heating surface of the laminating unit against the workpiece to heat/press the workpiece.

Since the method for manufacturing a laminated substrate of the present invention has the above-described configuration, the same effects as those obtained by the apparatus for manufacturing a laminated substrate described in the above-described [ 1 ] to [ 6 ] can be obtained.

Drawings

Fig. 1 is a diagram illustrating a workpiece W and a pallet P.

Fig. 2 is a perspective view of the laminated substrate manufacturing apparatus 1 according to the first embodiment.

Fig. 3 is a front view of a main part of the laminated substrate manufacturing apparatus 1 according to the first embodiment as viewed from the direction of arrow a in fig. 2.

Fig. 4 is a diagram showing the laminated substrate manufacturing apparatus 1 according to the first embodiment.

Fig. 5 is a diagram showing a main part of the laminating unit 300 according to the first embodiment.

Fig. 6 is a flowchart for explaining a method of manufacturing a laminated substrate according to an embodiment.

Fig. 7 is a schematic diagram illustrating the operation of the laminated substrate manufacturing apparatus 1 according to the first embodiment.

Fig. 8 is a schematic diagram illustrating the operation of the laminated substrate manufacturing apparatus 1 according to the first embodiment.

Fig. 9 is a schematic diagram showing the laminated substrate production line 10 according to the second embodiment.

Fig. 10 is a diagram showing the laminated substrate manufacturing apparatus 2 according to the second modification and the laminated substrate manufacturing apparatus 3 according to the third modification.

Fig. 11 is a diagram showing the laminated substrate manufacturing apparatus 4 according to the fourth modification.

Fig. 12 is a diagram for explaining the apparatuses described in

patent documents

1 and 3.

Detailed Description

Next, a laminated substrate manufacturing apparatus, a laminated substrate manufacturing line, and a laminated substrate manufacturing method of the present invention will be described based on embodiments shown in the drawings. The drawings are schematic drawings, and do not necessarily strictly reflect actual dimensions.

[ first embodiment ] to provide a toner

1. Workpiece W and pallet P

Before describing the laminated substrate manufacturing apparatus 1, a description will be given of a work W and a tray P to be processed by the laminated substrate manufacturing apparatus 1.

Fig. 1 is a diagram illustrating a workpiece W and a pallet P. Fig. 1(a) is a plan view of the workpiece W and the pallet P placed on a horizontal plane, and fig. 1(b) is a sectional view taken along line a-a in fig. 1 (a). The symbol SL of the two-dot chain line indicates a seal line described later, and the symbol WSF indicates the upper end surface of the workpiece W.

(1) Workpiece W

The "workpiece W" in the present specification means: the "substrate BD and the entirety of the plurality of individual PCs" are in a state where the plurality of individual PCs are pre-bonded to the substrate BD (see fig. 1).

A plurality of single PCs are placed on the substrate BD in a pre-crimped state. A plurality of the same type of pieces may be placed on the substrate BD, or a plurality of types of pieces having different sizes, heights, and the like may be placed thereon as shown in fig. 1. In this case, as shown in fig. 1(b), the upper end surface WSF side of the workpiece W has a concave-convex shape due to the difference in height between the individual PCs placed on the substrate BD.

The laminated substrate manufacturing apparatus 1 according to the first embodiment can be suitably applied to such a workpiece W that the area of the single PC is smaller than the area of the substrate BD. That is, even a workpiece on which a fine member is placed can be laminated appropriately.

The "pre-press bonding state" means: the single PC is pre-fixed on the substrate BD by a few pressing forces from the single PC to the substrate BD. In the first embodiment, since the adhesive is typically interposed between the single PC and the substrate BD, the adhesive force of the adhesive contributes to the pre-fixing of the single PC and the substrate BD. However, the present invention is not limited to this, and the "pre-press bonding state" is also included in the pre-set state in which, for example, no adhesive is used and no positional deviation or positional deviation occurs.

The laminated substrate manufacturing apparatus 1 performs lamination by applying pressure (pressurization) to the lamination direction of the individual sheets PC and the substrate BD while heating the workpiece W. The workpiece W is "a laminated object" at this time.

For reference, since the single PC is usually pressure-bonded to the substrate BD, the single PC is an "adhesive member" and the substrate BD is an "adhered member". In this specification, "lamination" may be referred to as "main crimping" or simply "crimping".

As the "substrate BD", various substrates made of a material such as a sheet-like film, a resin-impregnated substrate, a ceramic substrate, or a metal substrate can be applied. In addition, the "substrate BD" can be arbitrarily applied to a flexible substrate having a relatively soft structure to a rigid substrate having a relatively firm structure. In particular, the laminated substrate manufacturing apparatus 1 according to the first embodiment can be suitably applied to a flexible substrate as a substrate.

Here, the "substrate BD" may or may not have a circuit formed thereon.

As the "monolithic PC", various films for protection and the like, metal plates for reinforcement and the like, individual electronic components, and the like can be applied.

(2) Tray P

The "tray P" in the present specification means: as a member of a jig for placing and conveying the workpiece W. The pallet P not only contributes to conveying the work but also constitutes a part of the cavity for performing evacuation as described later.

The tray P may be, for example, plate-shaped. For example, an aluminum plate of a given thickness may also be used.

The pallet P is preferably provided with a suitable work fixing mechanism (not shown) so that the position and posture of the work W do not deviate from the pallet P. The tray P is only to be: when the outer dimensions, the structure of the lower end surface of the pallet with which a conveying force transmission portion (a conveyor belt or the like) described later comes into contact, the structure in the vicinity of a portion (a seal line SL) with which the lower edge portion of the laminating unit comes into contact when a cavity described later is formed, and the like satisfy certain conditions, the holding structure of the work W and the like can be changed in accordance with changes in the specifications, the number, and the like of the work W, and the changes in the specifications can be flexibly coped with.

The pallet P has a workpiece W (see fig. 1) placed thereon. As illustrated in fig. 1, two workpieces W may be placed on the pallet P. After a plurality of works W are placed on the pallet P, the plurality of works W are laminated at the same time by using a laminating unit described later, so that the production cycle time per work can be shortened.

The number of workpieces W placed on one pallet P is not limited, and may be one or three or more.

The work W is placed on the tray P, is conveyed from an upstream process after being integrated with the tray P, is taken into the laminated substrate manufacturing apparatus 1 and subjected to a lamination process, and is conveyed to a downstream process.

In this specification, the transport tray is sometimes referred to as a "flow" tray. Further, the work W after the lamination process has been completed by the laminated substrate manufacturing apparatus 1 will also be referred to as a "product".

2. Structure of laminated substrate manufacturing apparatus 1 according to embodiment one

Fig. 2 is a perspective view of the laminated substrate manufacturing apparatus 1 according to the first embodiment. Fig. 3 is a front view of a main part when the laminated substrate manufacturing apparatus 1 is viewed from the direction of arrow a in fig. 2. Fig. 4 is a diagram showing the laminated substrate manufacturing apparatus 1 according to the first embodiment. Fig. 4(a) is a plan view of the laminated substrate manufacturing apparatus 1 as viewed from above (the illustration of the laminating unit 300 described later is omitted). Fig. 4(e) is a view corresponding to fig. 4(a), which shows a region R2 provided with a laminating region R1 and a tray conveying unit.

The vertical direction is defined as the + z direction, the direction in which the tray P is conveyed by the tray conveying unit 100 (described later) is defined as the + x direction, and the direction perpendicular to the + z direction and the + x direction is defined as the + y direction. The direction opposite to the + x direction is defined as the-x direction, the direction opposite to the + y direction is defined as the-y direction, and the direction opposite to the + z direction is defined as the-z direction. And sometimes the + z direction will be referred to as "down" and the-z direction will be referred to as "up".

(1) Summary of the invention

The laminated substrate manufacturing apparatus 1 performs lamination with a workpiece in a state where a plurality of individual pieces are pre-pressed on a substrate as an object to be laminated.

As shown in fig. 2 and 3, the laminated substrate manufacturing apparatus 1 includes: a tray conveying unit 100, a tray positioning unit 200, and a laminating unit 300.

Reference numeral 500 denotes a susceptor. Although not shown in the drawings, the respective bodies (not shown) of the tray conveying unit 100, the tray positioning unit 200, and the laminating unit 300 are fixed to the base 500.

(2) Tray conveying unit 100

The tray conveying unit 100 is used to intermittently convey a tray P on which a workpiece W is placed.

As shown in fig. 3, the tray conveying unit frame 105 is fixed to the base 500. A conveyance power source 115 is fixed to the tray conveyance unit frame 105. A shaft of the conveying power source 115 (motor or the like) is connected to a driving wheel (pulley) via a belt (pulley) or the like, so that power can be transmitted to the conveying force transmitting portion 110 via the driving wheel.

The conveying force transmitting portion 110 transmits a conveying force to the tray P. Specifically, the conveyance force transmitting unit 110 is configured to: after contacting the lower end surface of the tray P, the tray P can be conveyed in the + x direction by the frictional force between the two. The conveying force transmitting unit 110 can be applied to, for example, a conveyor belt or a conveyor chain called a conveyor belt. In addition, when non-contact tray conveyance using a linear motor is realized in the tray conveying unit 100, a linear driving device disposed on a fixed side (for example, on the side of the tray conveying unit frame 105) is also included in the conveying force transmission unit 110.

The tray conveying unit 100 takes in a tray P on which the workpieces W subjected to the pre-compression in the upstream process are placed, from the left side of the paper surface in fig. 2 and 3. The loaded pallet P is conveyed in the + x direction after the lower end surface thereof comes into contact with the conveying force transmitting portion 110.

When the laminated substrate manufacturing apparatus 1 is viewed from the plane, the tray conveying unit 100 is disposed in a state where a laminating area R1 (hatched area in fig. 4 e) in which the heating heads 320 described later are disposed and an area R2 (hatched area in fig. 4 e) in which the tray conveying unit is disposed overlap each other (see fig. 4 e). Further, the conveying force transmitting portion 110 extends in the + x direction, and the flow path of the tray P overlaps the lamination region R1.

The tray P is temporarily conveyed to the lamination area R1 along the flow path. And once the required lamination process is completed, the tray conveying unit 100 conveys the tray P toward the downstream process. Further, reference numeral 120 denotes a side wall guide.

The definition of "intermittently conveying the tray P" means: the conveying device in the first embodiment is not a device that conveys a continuous conveying object such as a tape or a loop, but is assumed to be a device that conveys a predetermined unit of the conveying object "intermittently" in a predetermined unit. Specifically, it is assumed that: the free-flow type conveyor is configured to sequentially flow the trays P from upstream to downstream in units of the trays P.

(3) Tray positioning unit 200

The tray positioning unit 200 stops the movement of the tray P being conveyed, and separates the tray P from the conveying force transmitting portion 110 of the tray conveying unit 100, thereby determining the position of the tray P.

(3-1) tray stopper 210

Fig. 4(c) is a plan view of an enlarged main portion of the region surrounded by the broken line E in fig. 4 (a). Fig. 4(d) is a cross-sectional view of the right side of the main portion when the laminated substrate manufacturing apparatus 1 is cut along the one-dot chain line shown by B-B in fig. 4(a) and viewed from the direction of arrow F (arrow B in fig. 2). Further, each constituent element in fig. 4(d) is schematically described after being deformed.

The tray positioning unit 200 includes: a tray stopper 210 that determines the + x direction position of the tray P after stopping the movement of the tray P.

As shown in fig. 2 to 4 a, the tray stoppers 210 are arranged on the-y direction side and the + y direction side of the tray passing region R3, respectively, while sandwiching the tray passing region R3 (see reference symbol R3 in fig. 4 d) as a region through which the tray P passes.

The tray stopper 210 is provided therein with a tray stopper 212. The tray stopper 212 is used to block the flow of the tray P, and may be an appropriate member such as an L-shaped member or a rod-shaped member.

The tray positioning unit 200 is configured to: the tray P conveyed to the vicinity of the tray stopper 210 is detected by a tray passage sensor (not shown), and the tray stopper 212 is projected by an air cylinder or the like from a direction perpendicular to the + x direction (the-y direction or the + y direction in the drawing) toward the tray passage region R3. By this, the tray P that has flowed is caused to interfere with the tray stopper 212, and the movement of the tray P is stopped when the tray P does not flow any further (see fig. 4 c and 4 d).

(3-2) separation of tray p and conveying force transmitting part 110

The tray positioning unit 200 includes a tray conveying unit elevation driving unit 130 that drives the tray conveying unit 100 up and down (as described below, the tray conveying unit elevation driving unit 130 has a function of separating trays and a function of positioning in the + z direction, and thus also constitutes a part of the tray positioning unit 200).

The tray conveying unit elevation driving unit 130 (not shown) is configured to: the entire tray conveying unit 100 can be moved up and down in the + z direction/-z direction (see arrow 130a in fig. 4 d, arrow l in fig. 7 d, and arrow q in fig. 8 d). The conveying-force transmitting part 110 also moves up and down along with it.

The tray conveying unit elevation driving unit 130 may be configured by, for example, a motor and a ball screw (not shown) connected to the entire tray conveying unit 100, and may be configured by a solenoid, an air cylinder, or the like.

On the other hand, the tray table 230 is firmly fixed to the base 500 (see fig. 2,3, and 4 (d)). The tray placing table 230 is disposed at a position directly below the tray P (viewed from the tray) whose movement is stopped by the tray stopper 210.

The relationship between the level (level) of the upper end surface of the tray placement table 230 and the level of the upper end surface of the conveying force transmitting portion 110 is set as follows: in a normal operation state, a gap SP1 (refer to fig. 4(d)) can be formed (a gap of an interval SP1 is secured) between the lower end of the tray passing region R3 (in other words, the lower end surface of the tray p) and the upper end surface of the tray placing table 230. Therefore, in a normal operation state, the tray P and the tray table 230 do not interfere with each other, and the tray P can smoothly flow.

On the other hand, when the tray conveying unit 100 is lowered by the tray conveying unit elevation driving part 130, the amount of lowering in the tray conveying unit elevation driving part 130 is set to: so that the level of the upper end surface of the conveying force transmitting portion 110 is lower than the level of the upper end surface of the tray placing table 230.

Therefore, after the movement of the tray P is stopped by the tray stopper 210, once the tray conveying unit 100 starts to descend together with the tray P (in a state where the tray P is already placed on the conveying force transmitting portion 110) by the tray conveying unit elevation driving portion 130, the lower end surface of the tray P placed on the upper end surface of the conveying force transmitting portion 110 eventually comes into contact with the upper end surface of the tray placing table 230, and the lower end surface of the tray P separates from the upper end surface of the conveying force transmitting portion 110 (relatively, the tray P is floated from the conveying force transmitting portion 110). That is, the contact between the lower end surface of the tray P and the upper end surface of the conveying force transmitting portion 110 is released. And, the tray P is placed only on the tray placing table 230.

As described above, the tray conveying unit 100 is lowered together with the tray P by the tray conveying unit elevation driving part 130, and the tray P is configured such that: is placed on the tray placing table 230.

(3-3) positioning of the tray P

The tray positioning unit 200 is configured to: after separating the tray P from the conveying force transmitting portion 110, the position of the tray P is determined.

The tray positioning unit 200 is, for example, configured by: the tray stopper 210, the tray conveying unit elevation driving part 130, the tray placing table 230, and the cam follower 220 realize the positioning of the tray P.

Specifically, the tray positioning unit 200 is configured as follows to determine the position of the tray P in each direction.

(a) The tray stopper 212 is configured to: projects from the direction perpendicular to the + x direction toward the tray passing region R3. In this way, the movement of the conveyed tray P is stopped, and the position of the tray P in the + x direction is fixed in advance. This enables the position of the tray P in the + x direction to be determined.

(b) After the position of the tray P in the + x direction is fixed, the tray conveying unit 100 is lowered together with the tray P by the tray conveying unit elevation driving unit 130, and the tray P is configured such that: is placed on the tray placing table 230. In this way, the position of the tray P in the + z direction can be determined after the position of the tray P in the + z direction is fixed in advance.

(c) Cam followers 220 (see fig. 2 to 4) are disposed on the + y direction side and the-y direction side of the upper end surface of the conveying force transmitting portion 110, respectively, in a state of sandwiching the tray passing region R3.

The cam follower 220 is set to: when the tray P is in the open state in which the tray P does not flow, the relationship between the roller surface (no reference numeral) of the cam follower 220 and the tray passing region R3 is such that the gap between the both is zero or the product is plus (there are some gaps) within a tolerance range in which the product is considered to be good.

If the tray P is conveyed to the laminating area R1 in a state where the tray P is slightly shifted in the + y direction/-y direction, the end face (+ y direction side/-y direction side face) of the tray P abuts against the roller face of the cam follower 220, and the tray P is pressed in the original + y direction/-y direction, thereby being corrected to the target position in the + y direction/-y direction (refer to fig. 4(b) and 4 (d)). In this way, when the tray P is conveyed to the laminating area R1, the position of the tray P in the + y direction/-y direction can be automatically determined.

Further, fig. 4(b) is a view shown for explaining the cam follower 220, which is a front view of a main portion viewed from the direction of an arrow D in fig. 4 (a).

(d) The tray stoppers 210 are disposed on the-y direction side and the + y direction side (both sides) of the tray passage region R3, respectively, in a state of sandwiching the tray passage region R3.

Therefore, even if the posture of the tray P being conveyed is incorrect (even if there is a shift in the θ direction), the tray stoppers 210 wait on both the-y direction side and the + y direction side of the tray passing region R3, and as a result, the tray P is pushed in the + x direction by the two conveying force transmitting portions 110 (on the-y direction side and the + y direction side), and the end surfaces of the tray P are pressed against the tray stoppers 210 (particularly, the tray stoppers 212) on both the sides. In this way, the posture of the tray P in the θ direction can be determined after the posture of the tray P in the θ direction is fixed.

The tray P whose position (and posture) is determined in the above manner is configured such that: and is integrated with the heating head 320 at the time of lamination processing described later.

(4) Lamination unit 300

The laminating unit 300 heats and presses the work W placed on the tray P to laminate. In other words, the laminating unit 300 performs main pressure bonding (laminating process) on the single PC on the substrate BD.

(4-1) head mechanism 380

As shown in fig. 3, the laminating unit 300 has: a laminated unit main body 305, an outer peripheral edge portion 307 including a lower edge portion 312 at a lower end, and the like. The laminating unit 300 has a work accommodating portion 310 that can accommodate the work W from the lower edge portion 312 up to the inside. The inside of the workpiece accommodating portion 310 is provided with a heating head 320 (not shown in fig. 3).

The lamination unit main body 305, the outer peripheral edge portion 307, the heating tip 320, and the like are collectively referred to as "a head mechanism body 380". (4-2) head mechanism body elevating drive part 350

As shown in fig. 2 and 3, the laminating unit 300 includes a head mechanism body elevation driving unit 350. The head mechanism body elevation driving unit 350 is constituted by a motor 352, a ball screw 354, a guide 356, and the like, and drives the head mechanism body 380 up and down.

(4-3) detailed information of the head mechanism body 380

Fig. 5 is a diagram illustrating a main part (head mechanism 380) of the laminating unit 300 according to the first embodiment. Fig. 5(a) to 5(C) are enlarged cross-sectional views of the main part of the region surrounded by the broken line C in fig. 3.

The details of the header mechanism 380 will be described with reference to fig. 5 (a).

Fig. 5(a) shows a single body state of the head mechanism body 380 (single body state of the head mechanism body).

The lamination unit main body 305 is connected to the head mechanism body elevation driving unit 350, and directly receives a driving force from the head mechanism body elevation driving unit 350 (see also fig. 3).

An outer peripheral edge portion 307 is provided near the peripheral edge of the lower side of the lamination unit main body 305. The outer peripheral edge portion 307 is capable of moving up and down with respect to the lamination unit body 305.

The outer peripheral edge portion 307 is pressed downward with respect to the lamination unit main body 305 by the return spring 322. Therefore, the outer peripheral edge 307 is located at a lower position (origin position) shown in fig. 5 a when not in contact with the tray P.

A second sealing member 324 is inserted into a portion where the outer peripheral edge portion 307 slides with respect to the laminated unit main body 305 (between the outer peripheral edge portion 307 and the laminated unit main body 305), and the sliding portion is sealed to block the flow of air.

The positional relationship of the lower edge 312 as the lower side of the outer peripheral edge 307 is set as: and abuts against the peripheral edge of the positioned tray P.

By bringing the lower edge 312 into contact with the pallet P, a temporary cavity CH can be formed by the workpiece housing section 310 and the upper end surface of the pallet P (see fig. 5 (b)).

Further, a sealing member (first sealing member 314) that abuts the upper end surface of the tray P is attached to the lower edge portion 312. By providing the sealing member (first sealing member 314) in the lower edge portion 312, the airtightness of the cavity CH can be further improved when the lower edge portion 312 comes into contact with the tray P to form the temporary cavity CH.

The sealing member may be made of rubber or the like. The hardness of the sealing member should not be so hard as to be compatible with the abutment surface of the tray P, but on the other hand it should not be too soft from the viewpoint of durability. Further, the surface that abuts against the lower edge 312 on the tray P side is preferably a smooth surface.

(4-4) heating head 320

As shown in fig. 5(a), a heating head 320 for heating and pressurizing the workpiece W is disposed inside the lamination unit main body 305. The heating head 320 heats and pressurizes the workpiece W accommodated in the workpiece accommodating portion 310.

Heating head 320 has: and a heating surface 326 having a shape conforming to the upper end surface WSF of the workpiece W in the direction in which the workpiece W abuts. In other words, the heating surface 326 is formed in an uneven shape so as to conform to the cross-sectional shape of the workpiece W.

Heater head 320 houses heater 330 for providing heat.

(4-5) State transition of head mechanism 380

Fig. 5(b) shows a state in which the lower edge portion 312 is in contact with the tray P and then the cavity CH is formed (cavity forming state), and fig. 5(c) shows a state in which the workpiece W is pressed against the heating surface 326 of the heating head 320 and then heated and pressurized (lamination state).

(a) When the head mechanism body 380 is in a single body state, the outer peripheral edge portion 307 is positioned at a lower position (origin position) by the return spring 322 (head mechanism body single body state) (see fig. 5 a).

(b) When the head mechanism body 380 is lowered by the head mechanism body elevation driving unit 350, the lower edge 312 (specifically, the first sealing member 314) comes into contact with the peripheral edge of the tray. At this time, the outer peripheral edge portion 307 is pressed downward by the return spring 322, and the lower edge portion 312 and the upper end surface of the pallet P are sealed, so that a temporary cavity CH is formed by the work accommodating portion 310 and the pallet P (cavity forming state) (see fig. 5 (b)).

In this state, the gas in the cavity CH can be exhausted (evacuated) from the exhaust port 340 by using an exhaust device 400 (not shown in fig. 5) (see fig. 7 (e)).

(c) Once the head mechanism body 380 is further lowered, the heating surface 326 of the heating head 320 comes into contact with the workpiece W. In this state, when the heating head 320 is further moved downward, pressure is applied from the heating head 320 (heating surface 326) to the workpiece W, and the workpiece W can be heated and pressurized (lamination state) (see fig. 5 c).

At this time, since the pallet P is placed on the pallet placing table 230 after being firmly fixed, it is possible to stably resist the pressing of the heating head 320 against the workpiece W.

In addition, even in this state, the formation of the cavity CH can be maintained, and the gas in the cavity CH can be continuously exhausted (evacuated).

(d) Thereafter, the head mechanism body 380 is raised by the head mechanism body elevation driving unit 350, and the state can be sequentially reversed in accordance with the state of fig. 5(c), the state of fig. 5(b), and the state of fig. 5 (a).

As described above, the laminated substrate manufacturing apparatus 1 is configured to: in a state where the work W is placed on the tray P, the heating surface 326 can be pressed against the work W while exhausting the air from the cavity CH, thereby laminating the work W.

3. Embodiment one of the methods for manufacturing a laminated substrate (operation of the laminated substrate manufacturing apparatus 1)

A method for manufacturing a laminated substrate (operation of the laminated substrate manufacturing apparatus 1) will be described with reference to fig. 6 to 8.

Fig. 6 is a flowchart for explaining a method of manufacturing a laminated substrate according to an embodiment. Fig. 7 and 8 are schematic views showing the operation of the laminated substrate manufacturing apparatus 1 according to the first embodiment. Fig. 7 a to 7 e show the states of the feeding step S10 and a part of the step (cavity forming step S22) of the laminating step S20, and fig. 8 a to 8 e show the states of the rest of the laminating step S20, the head mechanism body retracting step S30, and the blanking step S40. Only fig. 7(c) is a plan view, and the remaining figures are front views.

A method for manufacturing a laminated substrate according to an embodiment laminates a workpiece W, which is in a state where a plurality of individual PCs are pre-bonded to a substrate BD, as an object to be laminated, and includes, as shown in fig. 6, at least: a feeding step S10 including a tray stopping step S12 and a tray positioning step S14; and a laminating step S20 including a cavity forming step S22, a vacuum-pumping step S24, and a heating/pressing step S26.

The method may further include, immediately after the laminating process S20: a head mechanism body retraction step S30 including a vacuum evacuation release step S32, a thermal head separation step S34, and a cavity removal step S36; and a material removing process S40, which comprises a tray positioning eliminating step S42.

(1) Tray stopping step S12

First, a pallet P is loaded, and the work W to which the pre-press bonding in the upstream process has been applied is placed on the pallet P. At this time, in a state where the workpiece W is placed, the tray P is conveyed in the direction of the arrow j in the + x direction while being brought into contact with the conveying force transmitting portion 110 (see fig. 7 (a)).

Next, if the tray P conveyed to the vicinity of the tray stopper 210 is detected by a tray passage sensor (not shown), the tray stopper 212 is protruded in the direction of the arrow K from the direction perpendicular to the + x direction with respect to the tray passage region R3 (not shown in fig. 7), and the operation of the conveyed tray P is stopped (see fig. 7 b and 7 c).

(2) Tray positioning step S14

The + x direction positioning of the tray P is performed at the same time by performing the tray stopping step S12 described above. Meanwhile, even if the + y direction/-y direction position of the tray P is shifted, since the cam follower 220 is configured to: the tray P is pressed in the + y direction/-y direction with respect to the end face thereof, and thus the positioning in the + y direction/-y direction of the tray P is automatically performed. The posture of the tray P in the θ direction is also determined by this.

Next to the state shown in fig. 7(b) and 7(c), the tray conveying unit 100 is lowered in the direction of arrow l together with the tray P by the tray conveying unit elevation driving unit 130. In this way, since the tray P is placed on the tray placement table 230, the position of the tray P in the + z direction is pre-fixed, and the positioning of the tray P in the + z direction is performed (see fig. 7 (d)).

In this way, the stopped tray P is separated from the conveying force transmitting portion 110, and the position of the tray P is determined.

By performing the above steps, the feeding step S10 can be performed, and the workpiece W and the tray P can be added in the subsequent laminating step S20.

(3) Cavity forming step S22

Subsequently, the head mechanism body elevation driving portion 350 (not shown in fig. 7, and the same applies hereinafter) is operated to lower the head mechanism body 380 in the arrow m direction, and thus the lower edge 312 of the laminating unit 300 (head mechanism body 380) is lowered toward the tray P. Then, the lower edge portion 312 (specifically, the first sealing member 314) is brought into contact with the tray P, and the lower edge portion 312 is sealed with the upper end surface of the tray P, thereby forming a temporary cavity CH by the work accommodating portion 310 and the tray P (see fig. 7 (e)).

In this case, the laminating unit 300 (specifically, the head mechanism body 380) has a work accommodating portion 310 capable of accommodating the work W from the lower edge portion 312 to the inside, and a heating head 320 for heating and pressurizing the work W is disposed inside the work accommodating portion 310.

(4) Evacuation step S24

Next, the gas in the cavity CH is exhausted (evacuated) from the exhaust port 340 using an exhaust device 400 such as a vacuum pump (see fig. 7 e).

In this case, the cavity CH is preferably set to a level of-40 kPa to-120 kPa. Further, it is more preferable that the pressure is set to a level of-70 kPa to-80 kPa.

(5) Heating and pressurizing step S26

Subsequently, the head mechanism body elevation driving unit 350 is operated to further lower the head mechanism body 380 in the direction of the arrow n, and the heating surface 326 of the laminating unit 300 (specifically, the heating head 320) is pressed against the workpiece W to heat and pressurize the workpiece W (see fig. 8 a). At this time, the gas in the cavity CH continues to be exhausted.

Although the conditions for performing the heating and pressurizing step S26 may vary depending on the specifications of the workpiece W, the temperature of the heater 330 may be set to a predetermined temperature in the range of 150 to 200 ℃, and the time for heating and pressurizing may be set to a predetermined time in the range of 1 to 2 minutes, for example.

By performing the above steps, the laminating step S20 can be performed, and a laminated substrate can be obtained.

(6) Evacuation releasing step S32

Next, the path between the exhaust device 400 and the exhaust port 340 is blocked, and the evacuation is released by opening the inside of the cavity CH through the exhaust port 340 in the same manner as the atmosphere (see fig. 8 (b)).

(7) Heating head separating step S34

Subsequently, the head mechanism body elevation driving unit 350 is operated to raise the head mechanism body 380 in the direction of the arrow o, and separate the heating head 320 (heating surface 326) from the workpiece W (see fig. 8 b, which shows a state before separation).

(8) Cavity eliminating step S36

Next, the head mechanism body elevation driving section 350 is operated to further elevate the head mechanism body 380 in the direction of the arrow P, and the lower edge 312 in contact with the pallet P is separated from the pallet P, and the cavity CH formed temporarily is removed, thereby opening the workpiece accommodating section 310, the pallet P, and the workpiece W to the atmosphere (see fig. 8 (c)).

(9) Tray positioning eliminating step S42

Subsequently, the tray conveying unit 100 is raised in the arrow q direction by the tray conveying unit elevation driving section 130, and the tray P placed on the tray placing table 230 is separated from the tray placing table 230 and placed again on the upper end surface of the conveying force transmitting section 110 (see fig. 8 (d)).

Thereafter, the tray stopper 212 of the tray stopper 210 is retracted from the tray passage region R3 to freely flow the tray P, and the tray P is discharged in the direction of the downstream arrow R (see fig. 8 (e)).

By performing the above steps, the laminated substrate (product W') after the lamination process is completed can be removed, and the process can be shifted to the next process.

4. Effects of the laminated substrate manufacturing apparatus 1 and the laminated substrate manufacturing method according to the first embodiment

(1) The laminated substrate manufacturing apparatus 1 according to the first embodiment is configured to: the laminating area R1 where the heating heads 320 are arranged and the area R2 where the tray conveying unit 100 is arranged are arranged in a state where the tray conveying unit 100 is overlapped, and the workpiece W is laminated by pressing the heating surface 326 against the workpiece W in a state where the workpiece W is placed on the tray P and the inside of the cavity CH is exhausted.

That is, the work W is taken into the laminating area R1 together with the tray P (feeding) and the laminating process is performed on the work W in a state where the work W is placed on the tray P, so that the product W 'after the laminating process is completed can be conveyed (flowed) together with the tray P to the downstream process (discharging) in a state where the product W' is placed on the tray P.

Therefore, in the case where the conventional step of taking out and stacking the works, which have been preliminarily pressure-bonded, one by one into the cavity, or taking in (feeding) the works, which have been prepared one by one, into the cavity, and taking out (removing) the processed product from the cavity after the completion of the laminating process is not required, the laminating process can be performed by feeding and removing the work to and from the laminating region while the works are still placed on the pallet on the conveying path of the pallet (in the same state as in the conveying process).

Therefore, according to the laminated board manufacturing apparatus 1, the work can be fed and removed more efficiently than in the conventional case.

Further, the laminated substrate manufacturing apparatus 1 according to the first embodiment includes a tray conveying unit 100 for intermittently conveying the tray P on which the workpiece W is placed, and is configured such that: in a state where the work W is placed on the tray P, the heating surface 326 is pressed against the work W while exhausting the air from the cavity CH, and the work W is laminated. That is, the present invention is configured to: the work W preliminarily pressed and joined in the upstream process is directly taken into the laminated substrate manufacturing apparatus 1 by the tray conveying unit 100, and is laminated by forming a temporary cavity CH directly for each tray.

Therefore, as long as the conveyance by the tray conveyor (not shown) outside the laminated substrate manufacturing apparatus 1 is performed at substantially the same throughput, the standby time from the preliminary press bonding until the lamination processing is performed is substantially constant. Therefore, the problem that the waiting time until the lamination process is performed varies greatly as in the conventional art does not arise.

Further, according to the laminated substrate manufacturing apparatus 1, since the heating surface 326 is laminated while being in contact with each workpiece, the heat and the magnitude of the pressure applied to each workpiece W can be made to meet the same condition. Therefore, the problem that the magnitude of the heat and the force to be applied, which can be received by the conventional workpiece, varies depending on the position of the stacked layers does not occur.

Further, since the laminated substrate manufacturing apparatus 1 performs lamination by using the heating head 320, and the heating head 320 has the heating surface 326 conforming to the shape of the upper end surface WSF side of the workpiece W, even when the upper end surface WSF side of the workpiece W is uneven due to the difference in height of the individual PCs placed on the substrate BD, desired lamination can be performed without causing positional deviation, or the like of the individual PCs.

As described above, according to the laminated substrate manufacturing apparatus 1 of the first embodiment, variations due to various elements such as standby time, heat, the magnitude of the force to be pressurized, and positional deviation can be suppressed, and thus variations in the pressure bonding state can be suppressed, and therefore, the workpiece W can be laminated while suppressing variations in quality as compared with the conventional apparatus.

(2) A sealing member (first sealing member 314) that abuts the upper end surface of the tray P is attached to the lower edge 312 of the laminating unit 300.

Therefore, when the lower edge 312 abuts against the tray P to form the temporary cavity CH, the airtightness of the cavity CH can be improved. Further, the exhaust efficiency in the cavity CH can be improved, thereby shortening the cycle time. Even if the surface state of the tray P varies to some extent, the sealing member (first sealing member 314) can be sandwiched between the tray P and the lower edge portion 312 to secure the package. Further, friction of the sealing member (first sealing member 314) makes it difficult for the tray to shift with respect to the heating head, and thus variation in the quality of the laminated substrate due to the shift can be further suppressed.

(3) Since the basic components of the method for manufacturing a laminated substrate according to the first embodiment have the same configurations as those of the apparatus 1 for manufacturing a laminated substrate according to the first embodiment, the method for manufacturing a laminated substrate according to the first embodiment can obtain the same effects as those obtained by the apparatus 1 for manufacturing a laminated substrate.

[ second embodiment ] to provide a medicine for treating diabetes

Next, the structure of the laminated substrate manufacturing line 10 according to the second embodiment will be described with reference to fig. 9. Fig. 9 is a schematic diagram showing the laminated substrate production line 10 according to the second embodiment.

The laminated substrate production line 10 according to the second embodiment pre-bonds a plurality of single PCs to the substrate BD and further performs main bonding to manufacture a laminated substrate.

The laminated substrate production line 10 according to the second embodiment includes: a pre-crimping device 7 for pre-crimping a plurality of single-chip PCs onto the substrate BD; a tray distributing device 8 for distributing the tray P removed from the pre-pressing device 7 to any one of the plurality of tray conveying devices 9; a plurality of tray conveying devices 9 each having one end connected to the tray distributing device 8 and conveying the trays P distributed from the tray distributing device 8; and a plurality of laminated substrate manufacturing apparatuses 1 each connected to the other end of each of the plurality of tray conveying apparatuses 9 (see fig. 9).

Further, reference numeral 5 denotes a tray merging device, and reference numeral 6 denotes a next process device which performs a next process. The laminated substrate manufacturing apparatus 1 is the same as the laminated substrate manufacturing apparatus 1 according to the first embodiment.

Since the laminated substrate production line 10 according to the second embodiment includes the laminated substrate manufacturing apparatus 1 according to the first embodiment, the same advantages as those of the laminated substrate manufacturing apparatus 1 according to the first embodiment are obtained.

In addition, when the cycle time (for example, 1 to 2 minutes) of the main pressure bonding step performed by the laminated substrate manufacturing apparatus 1 is longer than the cycle time (for example, 30 to 40 seconds) of the preliminary pressure bonding step performed by the preliminary pressure bonding apparatus 7, the tact time of the entire production line can be made uniform by arranging the laminated substrate manufacturing apparatus 1 in parallel with one preliminary pressure bonding apparatus 7.

Further, by arranging the laminated substrate manufacturing apparatuses 1 in parallel, the work W pre-pressed in the upstream pre-pressing step can be immediately put into the vacant laminated substrate manufacturing apparatus 1. Therefore, the standby time from the preliminary press bonding until the lamination process is performed can be made substantially constant. Therefore, the problem that the standby time until the laminating process is performed varies greatly in the conventional art can be suppressed.

[ DEFORMATION ] OF THE PREFERRED EMBODIMENT

The present invention has been described above based on the above embodiments, but the present invention is not limited to the above embodiments. Various embodiments can be implemented without departing from the scope of the invention, and for example, the following modifications are also possible.

(1) The number, material, shape, position, size, and the like of the components described in the above embodiments are merely examples, and can be changed within a range not impairing the effect of the present invention.

For example, in the first embodiment, the workpiece W of the laminated substrate manufacturing apparatus 1 is described assuming that a plurality of single PCs are mounted in advance on each substrate BD, but the present invention is not limited thereto. It is also possible to laminate workpieces pre-mounted with a single piece on each substrate BD.

(modification 1)

Since it is certainly possible to laminate a single veneer as long as a plurality of veneers can be laminated and the same operational effects are exerted, this kind of laminated substrate manufacturing apparatus is also equivalent to the laminated substrate manufacturing apparatus 1 of the present invention.

(2) As shown in fig. 10 a, a sealing member (third sealing member 234) made of resin or the like may be attached to the upper end surface of the tray table 230.

When the tray P is placed on the upper end surface of the tray placement table 230, the third sealing member 234 can alleviate the impact, and the tray P can be placed in conformity with the tray placement table 230, so that the positioning of the tray P can be performed more accurately. Further, a sealing member (third sealing member 234) made of resin or the like may be attached to the lower end surface of the tray P.

Further, a table air outlet 235 may be provided in the tray table 230 (see fig. 2, 4 a, and 4 d as well).

When the tray P is placed on the tray table 230, air existing between the upper end surface of the tray table 230 and the lower end surface of the tray P may be exhausted by an exhaust device (not shown) connected to the table exhaust port 235. In this way, since the tray P is more closely attached to the tray placing table 230, the positioning of the tray P (the laminated substrate manufacturing apparatus 2 in the second modification) can be more accurately performed.

Fig. 10 is a diagram for explaining the laminated substrate manufacturing apparatus 2 according to the second modification and the laminated substrate manufacturing apparatus 3 according to the third modification.

(3) As shown in fig. 10(b), a through hole Ph may be provided in the tray body to pass through the upper end surface and the lower end surface. Further, the through hole Ph of the tray P' is arranged such that: when the tray P' is positioned, it is located at a position corresponding to the table outlet 235.

Namely, it is possible to constitute: a table air outlet 235, a suction path (no reference numeral), and the like are provided on the tray placing table 230 side, and the inside of the cavity CH is exhausted through the through hole Ph in the thickness direction of the tray P' (the laminated substrate manufacturing apparatus 3 in the third modification).

With such a configuration, when the exhaust unit 400 such as a relatively heavy vacuum pump is provided below the base 500, the suction path between the exhaust unit 400 and the cavity CH is provided on the tray table 230 side, and the total length of the suction path is shorter than that when the suction path is provided on the laminating unit 300 side, so that the exhaust loss can be reduced. Further, since the suction path is not provided in the movable portion such as the head mechanism body 380 but in the fixed portion such as the tray table 230, the laminated substrate manufacturing apparatus having a simple structure can be provided.

(4) In the first embodiment, a free-flow type apparatus in which trays P are sequentially moved from upstream to downstream by using a conveyor or the like as a unit is described as an example of the tray conveying unit 100. However, the present invention is not limited thereto.

For example, a table conveyance type device that conveys the tray P while indexing (index) the tray in the R direction around the rotation axis AX1 as shown in fig. 11 may be used instead of the conveyor belt or the like (the laminated substrate manufacturing apparatus 4 in the fourth modification).

Fig. 11 is a diagram showing the laminated substrate manufacturing apparatus 4 according to the fourth modification. FIG. 11(a) is a plan view, and FIG. 11(b) is a sectional view taken along the line u-u in FIG. 11 (a). In the figure, reference numerals TBa, TBb, and TBc denote index tables, reference numeral ST1 denotes a feeding station (station) for feeding and feeding the tray P, reference numeral ST2 denotes a pre-press bonding station for pre-press bonding the workpieces W (substrates and pieces) placed on the tray P, and reference numeral ST3 denotes a main press bonding station for main press bonding (laminating) the workpieces W placed on the tray P.

In the fourth modification, the laminating unit 300 in the first embodiment is disposed at the pre-press bonding station ST3, and the laminating unit 300 (head mechanism 380) is lowered in the directions of arrows V and W, whereby the laminating process can be performed at the position ST3 while the workpiece W is still placed on the tray P (see fig. 11 b).

(5) In the first embodiment, when the tray P is positioned, the tray P is separated from the conveying force transmitting portion 110 and the tray P is positioned by moving one side of the tray conveying unit 100 by the tray conveying unit elevation driving portion 130. However, the present invention is not limited thereto. For example, a guide hole and a guide pin, not shown, may be provided between the tray P and the tray placing table 230, and one side of the tray placing table 230 may be moved to position the tray P by snapping the guide hole and the guide pin (modification example five).

(6) In the first embodiment, a heating surface with a pre-formed unevenness is applied as the heating surface 326 of the heating head 320. However, the present invention is not limited thereto. For example, the heating head 320 may be configured such that a tube (not shown) is expanded to conform the shape of the heating head to the shape of the irregularities of the workpiece (modification six).

Description of the symbols

1,2,3,4 … laminated substrate manufacturing apparatus, 5 … tray merging apparatus, 6 … next process apparatus, 7 … pre-press bonding apparatus, 8 … tray distribution apparatus, 9 … tray conveyance apparatus, 10 … laminated substrate production line, 100 … tray conveyance unit, 105 … tray conveyance unit frame, 110 … conveyance force transmission section, 115 … conveyance power source, 130 … tray conveyance unit elevation drive section, 200 … tray positioning unit, 210 … tray stopper, 212 … tray stopper, 220 … cam follower, 230 … tray placement table, 234 … third sealing member, 235 … table exhaust port, 300 … laminating unit, 305 … laminating unit body, 307 … outer peripheral edge portion, 310 … workpiece housing portion, 312 … lower edge portion 314, 314 … first sealing member, 320 … heating head, 322 39 322 … return spring, 326 324 … second sealing member, 326 … heating surface, 330 … heater … heating surface 330, … heater, 340 … exhaust port, 350 … head mechanism body lifting drive part, 352 … motor, 354 … ball screw, 356 … guide, 380 … head mechanism body, 400 … exhaust device, 500 … base, device described in 700 … patent document 1, 711 … pallet, 713 … multilayer printed wiring laminated member, 715 … elastic washer, 716a,716b … hot plate, 718 … exhaust port, 900 … substrate joining device, 903 … joining mechanism, 904 … conveying mechanism, 909 … substrate placing mechanism, and 941 … robot arm.

Claims

1. A laminated substrate manufacturing apparatus for laminating a plurality of work pieces, each of which is in a state of being pre-pressed on a substrate, as an object to be laminated, the laminated substrate manufacturing apparatus comprising:

a tray conveying unit for intermittently conveying a tray on which the workpiece is placed;

a tray positioning unit which stops the movement of the tray conveyed and separates the tray from the conveying force transmission part of the tray conveying unit so as to determine the position of the tray; and

a laminating unit having a work accommodating portion capable of accommodating the work from a lower edge portion to an inner side, and provided with a heating head for heating and pressurizing the work accommodated inside the work accommodating portion,

wherein the tray conveying means is disposed in a state where a lamination area where the heating head is disposed and an area where the tray conveying means is disposed are overlapped when the laminated substrate manufacturing apparatus is viewed from a plane,

the heating head has a heating surface whose shape matches the shape of the upper end face side of the workpiece,

the laminating unit is configured to: the lower edge portion is lowered toward the positioned pallet, and a temporary cavity is formed by the work accommodating portion and the pallet by the contact of the lower edge portion with the pallet,

the laminated substrate manufacturing apparatus is configured to: pressing the heating surface toward the work in a state where the work is placed on the tray and the inside of the cavity has been exhausted to laminate the work,

when the vertical direction is defined as + z direction, the direction for conveying the tray is defined as + x direction, and the direction perpendicular to the + z direction and the + x direction is defined as + y direction,

the tray positioning unit has:

a tray stopper provided with a tray stopper portion, and determining a position of the tray in a + x direction by stopping a movement of the tray being conveyed by protruding the tray stopper portion from a direction perpendicular to the + x direction toward a tray passing area; and

a tray conveying unit lifting drive part which drives the tray conveying unit up and down,

the laminated substrate manufacturing apparatus further includes:

a tray placement table disposed at a position directly below the tray stopped from moving by the tray stopper,

and the laminated substrate manufacturing apparatus is configured to: the tray conveying unit is lowered together with the tray by the tray conveying unit elevation driving part, so that the tray is placed on the tray placing table.

2. The laminated substrate manufacturing apparatus according to claim 1, wherein:

wherein a sealing member that abuts an upper end surface of the tray is provided at the lower edge portion of the lamination unit.

3. The laminated substrate manufacturing apparatus according to claim 1 or 2, wherein:

wherein a workbench air outlet is arranged on the tray placing table.

4. The laminated substrate manufacturing apparatus according to claim 1 or 2, wherein:

the area of the individual piece of the workpiece is smaller than the area of the substrate when the workpiece placed on the tray is viewed in plan from a direction perpendicular to the main surface of the tray.

5. The laminated substrate manufacturing apparatus according to claim 1 or 2, wherein:

wherein, the substrate is a flexible substrate.

6. A laminated substrate production line, comprising:

a pre-crimping device for pre-crimping the plurality of single sheets onto the substrate;

a tray distributing device for distributing the tray removed from the pre-crimping device to any one of the plurality of tray conveying devices;

a plurality of tray conveying devices, each of which has one end connected to the tray distributing device and conveys the trays distributed from the tray distributing device; and

a plurality of laminated substrate manufacturing apparatuses each connected to the other end of each of the plurality of tray conveying apparatuses,

wherein the laminated substrate manufacturing apparatus is the laminated substrate manufacturing apparatus according to any one of claims 1 to 5.

7. A method of manufacturing a laminated substrate, which laminates a work in a state where a plurality of individual pieces are pre-bonded to a substrate as an object to be laminated, is manufactured by the laminated substrate manufacturing apparatus according to claim 1, and includes:

a feeding step comprising: a tray stopping step of stopping the movement of the tray; and a tray positioning step of separating the stopped tray from the conveying force transmission part and determining the position of the tray; and

a laminating step comprising: a cavity forming step of lowering the lower edge portion of a laminating unit having a work accommodating portion capable of accommodating the work from the lower edge portion to the inside and provided with a heating head for heating and pressurizing the work accommodated in the work accommodating portion toward the tray and forming a temporary cavity by the work accommodating portion and the tray by the lower edge portion coming into contact with the tray; a vacuumizing step, wherein air is exhausted from the cavity; and a heating and pressing step of pressing the heating surface of the laminating unit against the workpiece to heat and press the workpiece.