CN111376400A - Wafer cutting machine and use method thereof - Google Patents
Wafer cutting machine and use method thereof Download PDFInfo
- Publication number
- CN111376400A CN111376400A CN201811626816.XA CN201811626816A CN111376400A CN 111376400 A CN111376400 A CN 111376400A CN 201811626816 A CN201811626816 A CN 201811626816A CN 111376400 A CN111376400 A CN 111376400A
- Authority
- CN
- China
- Prior art keywords
- wafer
- cutting
- cutting machine
- pattern detection
- infrared pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Dicing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention provides a wafer cutting machine and a use method of the wafer cutting machine, the wafer cutting machine comprises a cutting disc for placing a wafer, a cutting knife arranged above the cutting disc, a main shaft for controlling the cutting knife to cut the wafer, and an infrared pattern detection device arranged below the cutting disc, the cutting disc is transparent, and the wafer cutting machine comprises a control device electrically connected with the main shaft and the infrared pattern detection device. The wafer cutting machine and the use method of the wafer cutting machine can detect the track of the cutting knife under the condition of no shutdown, have high detection efficiency, can find the track in time when the track deviates, and have high detection precision.
Description
Technical Field
The invention relates to a wafer cutting machine and a use method of the wafer cutting machine.
Background
In the prior art, when manufacturing chips, a diamond cutter is used to cut and separate the finished circuit chips on a wafer into single crystal grains at a high rotation speed according to the use requirement. During cutting, the cutter needs to be set according to a program and cut according to a preset cutting track. Due to the influence of factors such as machine precision, wafer surface color difference and the like, during cutting, the cutting quality needs to be monitored by using a CCD (charge coupled device), and whether cutting deviation exists or not is checked, which is called as tool mark detection.
In the existing tool mark detection, a CCD is arranged on a tool shaft for detection, but water mist is formed on a wafer because the surface of a product needs to be continuously cleaned by water and the tool needs to be cooled during cutting, so that the CCD cannot check the tool mark during cutting.
The existing tool mark detection can only pause cutting in the cutting process, an instrument is used for drying water mist on the surface of a wafer, and a CCD is moved to a specified point position to check whether a cut product has deviation or not. The service efficiency of the machine table can not be maximized, the intermediate product can not be monitored in time in the process of detecting the tool marks twice, and a large amount of products can be scrapped in case of abnormality.
In view of the above, there is a need to improve the existing dicing saw and the method for using the dicing saw to solve the above problems.
Disclosure of Invention
The invention aims to provide a wafer cutting machine 100 and a use method thereof, so as to solve the problem that the conventional wafer cutting machine needs to be stopped to detect the track of a cutting knife when the wafer is cut.
In order to achieve the above object, the present invention provides a wafer cutting machine, which includes a cutting disc for placing a wafer, a cutting knife disposed above the cutting disc, a spindle for controlling the cutting knife to cut the wafer, and an infrared pattern detection device disposed below the cutting disc, wherein the cutting disc is transparent, and the wafer cutting machine includes a control device electrically connected to the spindle and the infrared pattern detection device.
As a further improvement of the invention, the wafer cutting machine comprises at least two cutting knives and at least two infrared pattern detection devices, and the number of the cutting knives is equal to that of the infrared pattern detection devices.
As a further improvement of the invention, the cutting disc is made of a ceramic material.
As a further improvement of the present invention, the wafer cutting machine further comprises a fixing device for fixing the wafer.
As a further development of the invention, the holding device is a vacuum-pumping device which cooperates with the cutting disc.
As a further improvement of the present invention, the control device includes an alarm device, and the alarm device is electrically connected to the control device.
The invention also provides a use method of the wafer cutting machine, which comprises the following steps:
s1: fixing the wafer on the cutting disc;
s2: the control device controls the spindle and the infrared pattern detection device to move so that the cutting knife and the infrared pattern detection device correspond to a cutting point on the wafer in the horizontal direction;
s3: the control device controls the cutting knife and the infrared pattern detection device to move along the same preset track;
s4: when the infrared pattern detection device detects that the cutting deviates from the preset track, the control device controls the cutting knife to stop cutting.
As a further improvement of the present invention, the method for using the wafer cutting machine further includes step S5 after step S4: the control device controls the alarm device to give an alarm.
As a further improvement of the invention, the use method of the wafer cutting machine further comprises the step S1 between S1 and S21: the control device controls the infrared pattern detection device to photograph the wafer, and the control device analyzes the photograph fed back by the infrared pattern detection device so as to confirm the cutting point.
The invention has the beneficial effects that: according to the wafer cutting machine, the transparent cutting disc is arranged, the infrared pattern detection device is arranged on one side opposite to the cutting knife, so that the track of the cutting knife can be detected while the cutting knife works, and the intervention is performed when the cutting knife deviates from the normal track; the use method of the wafer cutting machine is simple to operate, can carry out detection without stopping, and is high in operation efficiency and detection precision.
Drawings
FIG. 1 is a schematic structural diagram of a wafer dicing machine according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1, a wafer cutting machine 100 includes a cutting disc 1 for placing a wafer 200, a cutting blade 2 disposed above the cutting disc 1, a spindle 3 for controlling the cutting blade 2 to cut the wafer 200, an infrared pattern detection device 4 disposed below the cutting disc 1, a fixing device for fixing the wafer 200, a control device, and an alarm device.
The cutting disc 1 is transparent, in the embodiment, the cutting disc 1 is made of transparent ceramic materials, so that the infrared pattern detection device 4 can conveniently detect the running track of the cutting knife 2 above the cutting disc 1 through the cutting disc 1.
The wafer cutting machine 100 further includes a fixing device for fixing the wafer 200. The fixing device is a vacuum pumping device matched with the cutting disc 1 for use. When the wafer 200 is placed on the cutting disk 1, a vacuum pumping device is started to form a negative pressure environment on the cutting disk 1, so that the wafer 200 is fixed on the cutting disk 1.
The control device is electrically connected with the main shaft 3, the infrared pattern detection device 4 and the alarm device. The control device can control the spindle 3 and the infrared pattern detection device 4 to move according to a preset track according to a preset program. When the infrared pattern detection device 4 detects that the cutter connected with one end of the main shaft 3 deviates from a preset track during cutting, the control device controls the alarm device to give an alarm sound and controls the main shaft 3 to stop moving.
The wafer cutting machine 100 comprises at least two cutting knives 2 and the infrared pattern detection devices 4, wherein the number of the cutting knives 2 is equal to that of the infrared pattern detection devices 4. In this embodiment, the number of the cut-to-cut devices and the number of the infrared pattern detection devices 4 are two.
The use method of the wafer cutting machine 100 comprises the following steps:
s1: fixing the wafer 200 on the cutting disc 1;
S11: the control device controls the infrared pattern detection device 4 to photograph the wafer 200, and the control device feeds back the wafer 200 according to the infrared pattern detection device 4Analyzing the photo to confirm the cutting point;
s2: the control device controls the spindle 3 and the infrared pattern detection device 4 to move, so that the cutting knife 2 and the infrared pattern detection device 4 correspond to a cutting point on the wafer 200 in the horizontal direction;
s3: the control device controls the cutting knife 2 and the infrared pattern detection device 4 to move along the same preset track;
s4: when the infrared pattern detection device 4 detects that the cutting deviates from a preset track, the control device controls the cutting knife 2 to stop cutting;
s5: the control device controls the alarm device to give an alarm.
According to the wafer cutting machine 100, the transparent cutting disc 1 is arranged, and the infrared pattern detection device 4 is arranged on one side opposite to the cutting knife 2, so that the track of the cutting knife 2 can be detected while the cutting knife 2 works, and the intervention is performed when the cutting knife 2 deviates from the normal track; the use method of the wafer cutting machine 100 is simple to operate, can be used for detection without stopping, and is high in operation efficiency and detection precision.
Although the present invention has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the spirit and scope of the present invention.
Claims (9)
1. A wafer cutting machine is characterized in that: the wafer cutting machine comprises a cutting disc for placing a wafer, a cutting knife arranged above the cutting disc, a main shaft for controlling the cutting knife to cut the wafer, and an infrared pattern detection device arranged below the cutting disc, wherein the cutting disc is transparent, and the wafer cutting machine comprises a control device electrically connected with the main shaft and the infrared pattern detection device.
2. The wafer cutting machine according to claim 1, characterized in that: the wafer cutting machine comprises at least two cutting knives and at least two infrared pattern detection devices, and the number of the cutting knives is equal to that of the infrared pattern detection devices.
3. The wafer cutting machine according to claim 1, characterized in that: the cutting disc is made of ceramic materials.
4. The wafer cutting machine according to claim 1, characterized in that: the wafer cutting machine further comprises a fixing device for fixing the wafer.
5. The wafer cutting machine according to claim 4, characterized in that: the fixing device is a vacuum pumping device matched with the cutting disc for use.
6. The wafer cutting machine according to claim 1, characterized in that: the control device comprises an alarm device, and the alarm device is electrically connected with the control device.
7. Use of the wafer cutter according to any of claims 1 to 6, characterized in that: the use method of the wafer cutting machine comprises the following steps:
s1: fixing the wafer on the cutting disc;
s2: the control device controls the spindle and the infrared pattern detection device to move so that the cutting knife and the infrared pattern detection device correspond to a cutting point on the wafer in the horizontal direction;
s3: the control device controls the cutting knife and the infrared pattern detection device to move along the same preset track;
s4: when the infrared pattern detection device detects that the cutting deviates from the preset track, the control device controls the cutting knife to stop cutting.
8. The use method of the wafer cutting machine according to claim 7, wherein the wafer cutting machine further comprises an alarm device, and the alarm device is characterized in that: the method for using the wafer cutting machine further comprises a step S5 after the step S4: the control device controls the alarm device to give an alarm.
9. The use method of the wafer cutting machine according to claim 7, characterized in that: the use method of the wafer cutting machine further comprises the step S1 between S1 and S21: the control device controls the infrared pattern detection device to photograph the wafer, and the control device analyzes the photograph fed back by the infrared pattern detection device so as to confirm the cutting point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811626816.XA CN111376400A (en) | 2018-12-28 | 2018-12-28 | Wafer cutting machine and use method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811626816.XA CN111376400A (en) | 2018-12-28 | 2018-12-28 | Wafer cutting machine and use method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111376400A true CN111376400A (en) | 2020-07-07 |
Family
ID=71218126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811626816.XA Withdrawn CN111376400A (en) | 2018-12-28 | 2018-12-28 | Wafer cutting machine and use method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111376400A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116674101A (en) * | 2023-08-03 | 2023-09-01 | 江苏京创先进电子科技有限公司 | Wafer circular cutting method, system and equipment |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030027494A1 (en) * | 2001-07-31 | 2003-02-06 | Yang Sun Mo | Apparatus for cutting a wafer |
| JP2005085972A (en) * | 2003-09-09 | 2005-03-31 | Disco Abrasive Syst Ltd | Alignment method for cutting device |
| JP2006278869A (en) * | 2005-03-30 | 2006-10-12 | Disco Abrasive Syst Ltd | Cutting method and cutting device of wafer |
| KR100824255B1 (en) * | 2006-11-08 | 2008-04-24 | (주) 엔지온 | Semiconductor manufacturing method |
| JP2010082644A (en) * | 2008-09-30 | 2010-04-15 | Disco Abrasive Syst Ltd | Machining apparatus |
| JP2011187829A (en) * | 2010-03-10 | 2011-09-22 | Disco Corp | Method of confirming laser machined groove |
| CN102254863A (en) * | 2010-04-30 | 2011-11-23 | 三星钻石工业股份有限公司 | Breaking apparatus and breaking method for substrate made of brittle materials |
| JP2012084746A (en) * | 2010-10-13 | 2012-04-26 | Disco Abrasive Syst Ltd | Division method of multilayer ceramic substrate |
| CN103786269A (en) * | 2012-10-29 | 2014-05-14 | 三星钻石工业股份有限公司 | Device and method for fracturing fragile-material substrate |
-
2018
- 2018-12-28 CN CN201811626816.XA patent/CN111376400A/en not_active Withdrawn
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030027494A1 (en) * | 2001-07-31 | 2003-02-06 | Yang Sun Mo | Apparatus for cutting a wafer |
| JP2005085972A (en) * | 2003-09-09 | 2005-03-31 | Disco Abrasive Syst Ltd | Alignment method for cutting device |
| JP2006278869A (en) * | 2005-03-30 | 2006-10-12 | Disco Abrasive Syst Ltd | Cutting method and cutting device of wafer |
| KR100824255B1 (en) * | 2006-11-08 | 2008-04-24 | (주) 엔지온 | Semiconductor manufacturing method |
| JP2010082644A (en) * | 2008-09-30 | 2010-04-15 | Disco Abrasive Syst Ltd | Machining apparatus |
| JP2011187829A (en) * | 2010-03-10 | 2011-09-22 | Disco Corp | Method of confirming laser machined groove |
| CN102254863A (en) * | 2010-04-30 | 2011-11-23 | 三星钻石工业股份有限公司 | Breaking apparatus and breaking method for substrate made of brittle materials |
| JP2012084746A (en) * | 2010-10-13 | 2012-04-26 | Disco Abrasive Syst Ltd | Division method of multilayer ceramic substrate |
| CN103786269A (en) * | 2012-10-29 | 2014-05-14 | 三星钻石工业股份有限公司 | Device and method for fracturing fragile-material substrate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116674101A (en) * | 2023-08-03 | 2023-09-01 | 江苏京创先进电子科技有限公司 | Wafer circular cutting method, system and equipment |
| CN116674101B (en) * | 2023-08-03 | 2023-11-03 | 江苏京创先进电子科技有限公司 | Wafer circular cutting method, system and equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9105708B2 (en) | Wafer processing method | |
| US9694467B2 (en) | Polishing method of polishing a substrate | |
| TWI648127B (en) | Plate processing method | |
| KR20160013812A (en) | Method for processing wafer | |
| KR20150007944A (en) | Method for processing wafers | |
| JP5208644B2 (en) | Processing method and processing apparatus | |
| KR20140133451A (en) | Wafer cutting method | |
| KR20160019849A (en) | Method and device for dividing brittle material substrate | |
| JP2012256749A (en) | Cutting device | |
| JP2009176983A (en) | Processing method of wafer | |
| CN110600372B (en) | Three-side cutting method for wafer | |
| JP5991890B2 (en) | Wafer processing method | |
| JP2018192603A (en) | Cutting blade detection mechanism for cutting apparatus | |
| CN111376400A (en) | Wafer cutting machine and use method thereof | |
| JP6898105B2 (en) | How to process plate-shaped objects | |
| JP2008062353A (en) | Grinding method and grinding device | |
| JP2020077668A (en) | Processing device | |
| JP2016159409A (en) | Cutting device | |
| GB2212081A (en) | Process and apparatus for manufacturing discs | |
| JP5102138B2 (en) | Protective tape peeling device | |
| JP2015205372A (en) | Cutting method | |
| JP2013035074A (en) | Cutting device | |
| JP2520705Y2 (en) | Blade management device | |
| JP5925987B2 (en) | Cutting equipment | |
| JP2020110855A (en) | Processing method for work-piece |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20200707 |
|
| WW01 | Invention patent application withdrawn after publication |