CN111351566A - Vibration sensor with monitoring function and vibration signal monitoring method thereof - Google Patents

Abstract

A vibration sensor with monitoring function comprises a substrate, a micro-electromechanical vibration sensing chip and a special application integrated circuit chip. The micro-electromechanical vibration sensing chip is arranged on the substrate and used for sensing the vibration born by the object to be tested so as to generate a plurality of vibration signals. The application specific integrated circuit chip is arranged on the substrate and electrically connected to the micro-electromechanical vibration sensing chip, and comprises a sampling module, a conversion module and an analysis module. The sampling module receives the vibration signals, converts the vibration signals into digital signals, and filters the digital signals to generate a plurality of time domain data. The conversion module converts the time domain data into frequency domain data according to a preset quantity value. The analysis module executes a comparison program to compare the frequency domain data with a preset frequency spectrum characteristic table and sends out a notification signal according to a comparison result of the comparison program. The invention further provides a vibration signal monitoring method.

Description

Vibration sensor with monitoring function and vibration signal monitoring method thereof

technical field

The present invention relates to a vibration sensor, in particular to a vibration sensor with monitoring function. The invention also relates to the vibration signal monitoring method of the vibration sensor.

Background technique

Sensors are important devices for intelligent machinery and intelligent manufacturing. Among them, the vibration sensor can detect the vibration signal of the object to be tested, such as machine tool, motor, ball screw and feeding device, etc. The state data of the object to be tested can be obtained by analyzing the above-mentioned vibration signal.

Since the vibration signal needs to undergo complex signal conversion and signal analysis, the existing vibration sensor cannot directly analyze the frequency domain data of the vibration signal. These vibration signals need to be transmitted to the monitoring machine outside the vibration sensor, and then the microcontroller inside the monitoring machine uses the signal analysis software to perform signal conversion and signal analysis to obtain information on the vibration state of the object to be measured, so it is extremely inefficient. .

In addition, because the existing monitoring machine for executing the signal analysis software is too large, it is extremely difficult to integrate with the existing vibration sensor, and it is not easy to apply to the related application fields of intelligent machinery and intelligent manufacturing.

In order to meet different monitoring requirements, multiple vibration sensors may need to be installed on the object to be tested, and a high sampling frequency and a wide frequency domain monitoring range are required, so a large amount of data needs to be transmitted. Therefore, when the existing vibration sensor transmits a vibration signal to a monitoring machine outside the vibration sensor, data is easily lost or the data transmission time is too long, so that the object to be measured cannot be monitored in real time.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide a vibration sensor with monitoring function and a vibration signal monitoring method thereof, so as to solve the problem that the existing vibration sensor and monitoring machine are inefficient in use, cannot monitor the object to be measured in real time, and cannot be applied to intelligent machinery related application areas of intelligent manufacturing.

The present invention provides a vibration sensor with monitoring function, which includes a substrate, a micro-electromechanical vibration sensing chip and a special application integrated circuit chip. The micro-electromechanical vibration sensing chip is arranged on the substrate, and is used for detecting the vibration suffered by the object to be tested to generate a plurality of vibration signals. The special application integrated circuit chip is arranged on the substrate and is electrically connected to the micro-electromechanical vibration sensing chip, which includes a sampling module, a conversion module and an analysis module. The sampling module includes an analog front-end unit, an analog-to-digital conversion unit and a filtering unit. The analog front end unit receives the vibration signals. The analog-to-digital conversion unit converts the vibration signals into a plurality of digital signals. The filtering unit filters the digital signals to generate a plurality of time domain data. The conversion module includes a conversion unit and a time interval unit. The time interval unit transmits a preset quantity value to the conversion unit. The converting unit converts the time-domain data into frequency-domain data, and the quantity of the time-domain data is equal to a preset quantity. The analysis module executes a comparison procedure to compare the frequency domain data with the preset spectrum feature table, and sends a notification signal according to the comparison result of the comparison procedure.

The present invention provides another vibration signal monitoring method, which includes the following steps: detecting the vibration suffered by the object to be tested to generate a plurality of vibration signals; receiving the vibration signals, and converting the vibration signals into a plurality of digital signals ; filter the digital signals to generate a plurality of time domain data; convert the time domain data into a frequency domain data, the quantity value of the time domain data is equal to the preset quantity value; and perform a comparison The program compares the frequency domain data with the preset spectrum feature table, and sends a notification signal according to the comparison result of the comparison program.

Continuing from the above, the vibration sensor with monitoring function and the vibration signal monitoring method thereof according to the embodiment of the present invention can provide the following technical effects:

(1) In an embodiment of the present invention, the special application integrated circuit chip of the vibration sensor with monitoring function can analyze the frequency domain data of the vibration signal, thereby reducing the analysis time and improving the efficiency of real-time monitoring.

(2) In an embodiment of the present invention, the special application integrated circuit chip of the vibration sensor with monitoring function can analyze the frequency domain data of the vibration signal without transmitting the vibration signal to a monitoring machine outside the vibration sensor, Therefore, it will not cause data loss and can shorten the data transmission time.

(3) In an embodiment of the present invention, the conversion module of the special application integrated circuit chip of the vibration sensor with monitoring function has a special circuit structure and operation mechanism, so the sampling module of the special application integrated circuit chip does not need to perform secondary sampling , so that the vibration sensor can achieve improved efficiency.

(4) In an embodiment of the present invention, the conversion module of the special application integrated circuit chip of the vibration sensor with monitoring function has a special circuit structure and operation mechanism, so it can be updated by changing the data of the filter unit of the special application integrated circuit chip The sensing bandwidth of the vibration sensor can be adjusted by the speed, so as to be suitable for the objects to be tested with various vibration bandwidths, and the application object of the vibration sensor with monitoring function is expanded.

(5) In an embodiment of the present invention, the special application integrated circuit chip of the vibration sensor with monitoring function has the functions of integrating vibration signal sensing and vibration signal analysis and a special storage space management mechanism, so that the storage space can be more effectively The use of the vibration sensor with monitoring function can be more miniaturized, so it can meet the needs of related application fields of intelligent machinery and intelligent manufacturing.

Description of drawings

FIG. 1 is a schematic diagram of a vibration sensor with monitoring function according to a first embodiment of the present invention.

FIG. 2 is a flowchart of the first embodiment of the present invention.

3 is a circuit diagram of a vibration sensor with a monitoring function according to a second embodiment of the present invention.

4 is a circuit diagram of a special application integrated circuit chip of the vibration sensor with monitoring function according to the second embodiment of the present invention.

FIG. 5 is a flowchart of a second embodiment of the present invention.

6A is a first schematic diagram of the storage space management mechanism of the vibration sensor with monitoring function according to the second embodiment of the present invention.

6B is a second schematic diagram of the storage space management mechanism of the vibration sensor with monitoring function according to the second embodiment of the present invention.

6C is a third schematic diagram of the storage space management mechanism of the vibration sensor with monitoring function according to the second embodiment of the present invention.

6D is a fourth schematic diagram of the storage space management mechanism of the vibration sensor with monitoring function according to the second embodiment of the present invention.

Symbol Description

1.2 Vibration sensor

11 Substrate

12, 22 MEMS vibration sensing chip

13, 23 Special application integrated circuit chip

231 Sampling Module

2311 Analog Front End Unit

2312 Analog to Digital Conversion Unit

2313 filter unit

232 conversion module

2321 Conversion Unit

2322 Switching Unit

2323 storage unit

2324 time interval unit

2325 Conversion factor unit

233 Analysis Module

14, 24 memory elements

TD, TD’ time domain data

FD, TD’ frequency domain data

VS Vibration Signal

S notification signal

T Preset spectrum characteristic table

N preset quantity value

C conversion factor

P1, P2 storage space

A ₁ ～A _n , A ₁ '～A _n ' frequency domain points

S21～S25, S51～S58 Step flow

Detailed ways

Embodiments of the vibration sensor with monitoring function and the vibration signal monitoring method thereof according to the present invention will be described below with reference to the relevant drawings. For the purpose of clarity and convenience in the description of the drawings, the dimensions and proportions of the components in the drawings may be will be rendered exaggerated or reduced. In the following description and/or claims, when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may be present; When "directly connected" or "directly coupled" to another element, there are no intervening elements present. For ease of understanding, the same elements in the following embodiments are denoted by the same symbols.

Please refer to FIG. 1 , which is a schematic diagram of the vibration sensor with monitoring function according to the first embodiment of the present invention. As shown in the figure, the vibration sensor 1 includes a substrate 11 , a microelectromechanical vibration sensing chip 12 , an application-specific integrated circuit chip 13 and an optional memory element 14 . In the early stage of development of the vibration sensor with monitoring function, the memory element 14 is provided outside the application-specific integrated circuit chip 13 . The memory element 14 provides storage spaces of different sizes for the vibration signals of different objects to be tested to store the vibration signals and the analyzed data. However, when mass-producing the vibration sensor with monitoring function, the storage unit (not shown) in the special application integrated circuit chip 13 can be used to replace the memory element 14 to reduce the overall volume of the vibration sensor 11 and simplify the operation of the vibration sensor 11 assembly process. The microelectromechanical vibration sensing chip 12 is disposed on the substrate, and is used for detecting the vibration of the object to be tested to generate a plurality of vibration signals. The object to be tested can be, for example, a machine tool, a motor, a ball screw, a feeding device, and other devices that generate vibration during operation.

The memory element 14 can be selectively disposed on the substrate 11 according to different requirements, and is used to store a preset spectrum characteristic table and various parameters, such as calibration parameters, filter parameters, and conversion parameters. Memory element 14 may be, for example, a one-time programmable memory, a multiple-time programmable memory, flash memory, or electronically erasable rewritable read only memory.

The special application integrated circuit chip 13 is disposed on the substrate 11 and is electrically connected to the MEMS vibration sensing chip 12 and the memory element 14 . The application-specific integrated circuit chip 13 receives the vibration signals, converts the vibration signals into a plurality of digital signals, and filters the digital signals to generate a plurality of time-domain data. Then, a specific amount of time-domain data is converted into a frequency-domain data according to a preset value N. When converting a specific amount of time-domain data into a frequency-domain data, the specific amount is equal to the preset amount. Finally, the application-specific integrated circuit chip 13 executes the comparison procedure and sends a notification signal according to the comparison result to indicate the vibration state information of the object to be tested. The information of the vibration state of the DUT can be, for example, abnormal vibration warning, spectrum characteristic diagnosis, health state or remaining life estimation.

It can be seen from the above that the vibration sensor 1 has a special application integrated circuit chip 13 that integrates the spectrum conversion function and the signal analysis function, so the vibration sensor 1 can perform real-time analysis on the frequency domain data of the vibration signal, so that the analysis time is greatly reduced, so the efficiency can be improved. Elevate effectively.

Please refer to FIG. 2 , which is a flow chart of the vibration sensor 1 monitoring the vibration signal of the object to be measured according to the first embodiment of the present invention. As shown in the figure, the vibration signal monitoring method of the vibration sensor 1 of this embodiment includes the following steps:

Step S21: Detecting vibrations suffered by the object to be tested to generate a plurality of vibration signals.

Step S22: Receive the vibration signals and convert the vibration signals into a plurality of digital signals.

Step S23: Filter the digital signals to generate a plurality of time domain data.

Step S24 : Convert the time domain data into frequency domain data according to a preset quantity value, and the quantity value of the time domain data is equal to the preset quantity value.

Step S25: Execute a comparison procedure, compare the frequency domain data with the preset frequency spectrum feature table, and send a notification signal according to the comparison result of the comparison procedure.

Please refer to FIG. 3 and FIG. 4 , which are a circuit diagram of a vibration sensor with monitoring function and a circuit diagram of a special application integrated circuit chip according to the second embodiment of the present invention. As shown in FIG. 3 , the vibration sensor 2 includes a MEMS vibration sensing chip 22 , an application-specific integrated circuit chip 23 and a memory element 24 selectively used according to different usage requirements.

The micro-electromechanical vibration sensing chip 22 detects the vibration suffered by the DUT to generate a plurality of vibration signals VS. The object to be tested can be various devices that generate vibration during operation, such as machine tools, motors, ball screws, feeding devices, etc.

The memory element 24 is used to store the preset spectral characteristic table T and various parameters, such as calibration parameters, filter parameters, and conversion parameters. In this embodiment, the memory element is a memory unit built in the application-specific integrated circuit chip 23 .

The MEMS vibration sensing chip 22 is electrically connected to the ASIC chip 23 to transmit the vibration signal to the ASIC chip 23 .

FIG. 4 illustrates the circuit design of the application specific integrated circuit chip 23 . As shown in FIG. 4 , the special application integrated circuit chip 23 includes a sampling module 231 , a conversion module 232 and an analysis module 233 .

The sampling module 231 includes an analog front-end unit 2311 , an analog-to-digital conversion unit 2312 and a filtering unit 2313 . The analog front end unit 2311 receives the vibration signals VS. The analog front-end unit 2311, for example, can be an analog front-end circuit or a signal receiving circuit or the like. The analog-to-digital conversion unit 2312 converts the vibration signals into a plurality of digital signals. The analog-to-digital conversion unit 2312 can be, for example, an analog/digital converter or a discrete signal converter or the like. The filtering unit 2313 filters the digital signals to generate a plurality of time domain data TD. The filtering unit 2313 can be, for example, a digital filter or a noise filter.

The conversion module 232 includes a conversion unit 2321 , a switching unit 2322 , a storage unit 2323 , a time interval unit 2324 and a conversion coefficient unit 2325 . When the filtering unit 2313 generates the time domain data TD, the switching unit 2322 switches to the filtering unit 2313 to receive the time domain data TD, and transmit the time domain data TD to the storage unit 2323 . The switching unit 2322 can be, for example, a multiplexer or a switch.

The storage unit 2323 stores the time domain data TD in a storage unit 2323 , and then transmits the time domain data TD to the conversion unit 2321 . The storage unit 2323 has a special storage space management mechanism; wherein, after the storage unit 2323 transmits the time domain data TD to the conversion unit 2321, the storage unit 2323 can release the storage space for storing the time domain data TD at the same time, so that another Some time domain data TD can be stored in this storage space. For example, the storage unit 2323 can release the write protection mechanism of the storage space or delete the time-domain data TD in the storage space to release the storage space, so that other time-domain data TD can be stored in the storage space. The storage unit 2323 can be, for example, a register or a random access memory.

The time interval unit 2324 transmits a preset quantity value N to the conversion unit 2321, and the conversion coefficient unit 2325 transmits the conversion coefficient C to the conversion unit 2321. The above-mentioned preset quantity value N is equal to the quantity value of the time domain data TD . In one embodiment, the preset number value N is equal to the sampling number set by the sampling module 231 . In another embodiment, the preset number value N is not equal to the sampling number set by the sampling module 231 . The converting unit 2321 can perform time domain-frequency domain conversion according to the preset quantity value N and the conversion coefficient C to convert the time domain data TD into a frequency domain data FD. Therefore, the preset quantity value N can be adjusted according to the actual state. For example, if the preset number value N is set to 3, the conversion unit 2321 can convert three pieces of time domain data TD into one piece of frequency domain data FD according to the preset number value N and conversion coefficient C . When the converting unit 2321 generates the frequency domain data FD, the switching unit 2322 switches to the converting unit 2321 , receives the frequency domain data FD, and then transmits the frequency domain data FD to the storage unit 2323 . The time interval unit 2324 can be, for example, a register or a random access memory. The conversion coefficient unit 2325 can be, for example, a register or a read-only memory.

It can be seen from the above that the conversion module 232 has a special circuit structure and operation mechanism, that is, the time interval unit 2324 can transmit a preset quantity value N to the conversion unit 2321 . In one embodiment, the preset number value N is equal to the number value of the time domain data TD and the sampling number set by the sampling module 231 . In another embodiment, the preset quantity value N is equal to the quantity value of the time domain data TD but not equal to the sampling quantity set by the sampling module 231 . Therefore, in the special application integrated circuit chip 23, there is no need to set another sampling module between the filtering unit 2313 and the switching unit 2322. In other words, the conversion module 232 does not need to perform subsampling before converting the time domain data to frequency domain data. Therefore, the vibration sensor 2 of this embodiment can reduce the risk of data loss when converting time domain data into frequency domain data, so as to achieve a more accurate analysis result. In addition, since the conversion module 232 has the above-mentioned special circuit structure and operation mechanism, the sensing bandwidth of the vibration sensor 2 can be adjusted by changing the output data rate (ODR) of the filter unit 2313 to be suitable for different vibrations bandwidth of the DUT.

The storage unit 2323 stores the frequency domain data FD in another storage space, and then transmits the frequency domain data FD to the analysis module 233, and also manages the storage space through the aforementioned storage space management mechanism. For example, after the storage unit 2323 transmits the frequency domain data FD to the analysis module 233, the storage unit 2323 can simultaneously release the storage space for storing the frequency domain data FD, so that another frequency domain data FD can be stored in this storage space. More specifically, the storage unit 2323 can be divided into at least two storage spaces, and the capacity of these storage spaces is determined by a preset quantity value N, so that these storage spaces can be used most effectively. For example, the storage unit 2323 can release the write protection mechanism of the storage space or delete the frequency domain data FD in the storage space to release the storage space so that another frequency domain data FD can be stored in the storage space. It can be seen from the above that the vibration sensor 2 can implement a special storage space management mechanism, so that the storage unit 2323 of the vibration sensor 2 can selectively activate the write protection mechanism or release a part of the storage space, so that the storage space can be used more effectively without the need for Memory elements external to the application specific integrated circuit chip 23 are used.

The analysis module 233 executes a comparison procedure to compare the frequency domain data FD with the preset frequency spectrum feature table T. The computing unit 2331 sends a notification signal S according to the comparison result of the comparison program. The analysis module 233 can be, for example, a comparator or a logic operation unit or the like. When the analysis module 233 executes the comparison procedure, it compares the frequency domain points A _{1 ˜A n of the frequency domain data FD with the frequency domain points A 1 ′ ˜A n ′} of the preset frequency spectrum feature table T, and calculates and obtains The total difference value between the frequency domain points A _{1 ˜A n of the frequency domain data FD and the frequency domain points A 1 ′˜A n ′ of} the preset frequency spectrum feature table T. When the analysis module 233 confirms that the comparison result is that the total difference value is greater than a threshold value, the notification signal S is set as a warning signal. When the notification signal S is set as a warning signal, it means that the vibration state of the object to be tested has exceeded the acceptable range. At this time, the user should look for the reason why the vibration state exceeds the acceptable range and improve the vibration state of the test object.

Since the vibration signals undergo complex spectrum conversion and signal analysis, the existing vibration sensors transmit these vibration signals to a monitoring machine outside the vibration sensor. The microcontroller inside the monitoring machine performs spectrum conversion and signal analysis through signal analysis software to obtain information on the vibration state of the object to be tested, so it lacks efficiency and cannot meet the needs of practical applications. However, according to the embodiment of the present invention, the special application integrated circuit chip of the vibration sensor with monitoring function can analyze the frequency domain data of the vibration signal, so the analysis time can be reduced, and the real-time monitoring efficiency can be greatly improved.

In order to meet different monitoring requirements, multiple vibration sensors may need to be installed on the object to be tested, and a higher sampling frequency and a wider frequency domain monitoring range are required. The transmission system of the existing vibration sensor needs to transmit a large amount of data, so it is easy to cause data loss or make the data transmission time too long, and it is impossible to monitor the object to be measured in real time. However, according to the embodiment of the present invention, the special application integrated circuit chip of the vibration sensor with monitoring function can analyze the frequency domain data of the vibration signal without transmitting the vibration signal to an external monitoring machine, so it will not cause Data is lost and data transfer time can be drastically reduced.

In addition, according to the embodiment of the present invention, the conversion module of the special application integrated circuit chip of the vibration sensor with monitoring function has a special circuit structure and operation mechanism, so the special application integrated circuit chip does not need another sampling module for secondary sampling, Enables vibration sensors to achieve higher efficiency.

In addition, according to the embodiment of the present invention, the conversion module of the special application integrated circuit chip of the vibration sensor with monitoring function has a special circuit structure and operation mechanism, so only the data update rate of the filter unit of the special application integrated circuit chip needs to be changed, namely The sensing bandwidth of the vibration sensor can be adjusted so as to be suitable for objects to be tested with various vibration bandwidths, thereby expanding the application objects of the vibration sensor with monitoring function.

Furthermore, since the existing monitoring machine for executing the signal analysis software is too bulky, it is extremely difficult to integrate with the existing vibration sensor, so it is not easy to apply to the related application fields of intelligent machinery and intelligent manufacturing. According to the embodiment of the present invention, the special application integrated circuit chip of the vibration sensor with monitoring function has the functions of integrating vibration signal sensing and vibration signal analysis and a special storage space management mechanism, so that the storage space can be used more effectively, and the The vibration sensor with monitoring function can be more miniaturized, so it can meet the needs of related application fields of intelligent machinery and intelligent manufacturing.

Please refer to FIG. 5 , which is a flowchart of the second embodiment of the present invention. As shown in the figure, the vibration signal monitoring method of the vibration sensor 2 of this embodiment includes the following steps:

Step S51 : Detecting the vibration suffered by the object to be tested to generate a plurality of vibration signals.

Step S52: Receive the vibration signals and convert the vibration signals into a plurality of digital signals.

Step S53: Filter the digital signals to generate a plurality of time-domain data, and store the time-domain data in a storage space.

Step S54: Provide a preset quantity value and a conversion coefficient, convert the time domain data into a frequency domain data according to the preset quantity value and the conversion coefficient, and store the frequency domain data in another storage space.

Step S55: Release the storage space for storing the time-domain data after the time-domain data is converted into frequency-domain data.

Step S56: Execute a comparison procedure to compare the frequency domain points of the frequency domain data with the frequency domain points of the preset spectrum feature table and obtain a total difference value.

Step S57: After the comparison procedure is executed, the storage space for storing the frequency domain data is released.

Step S58: When the comparison result is that the total difference value is greater than a threshold value, set the notification signal as a warning signal.

Please refer to FIGS. 6A to 6D , which are first to fourth schematic diagrams of the storage space management mechanism of the vibration sensor with monitoring function according to the second embodiment of the present invention. As shown in FIG. 6A , the storage unit 2323 includes a storage space P1 and a storage space P2. The capacity of the storage space P1 corresponds to the preset quantity value N and the sampling quantity, and the capacity of the storage space P2 also corresponds to the preset quantity value N and the sampling quantity. The filtering unit 2313 generates the time domain data TD, and transmits the time domain data TD to the storage unit 2323 through the switching unit 2322, and the storage unit 2323 stores the time domain data TD in the storage space P1.

As shown in FIG. 6B , after the storage unit 2323 transmits the time domain data TD to the conversion unit 2321 , the storage unit 2323 can simultaneously release the storage space P1 for storing the time domain data TD. The converting unit 2321 generates the frequency domain data FD, and transmits the frequency domain data FD to the storage unit 2323 through the switching unit. The storage unit 2323 stores the frequency domain data FD in the storage space P2.

As shown in FIG. 6C , after the storage unit 2323 transmits the frequency domain data FD to the analysis module 233 , the storage unit 2323 can simultaneously release the storage space P2 for storing the frequency domain data FD. Since the storage unit 2323 has released the storage space P1, the next time-domain data TD' generated by the filtering unit 2313 can be stored in the storage space P1.

As shown in FIG. 6D, after the storage unit 2323 transmits the time domain data TD' to the conversion unit 2321, the storage unit 2323 can simultaneously release the storage space P1 for storing the time domain data TD'. Since the storage unit 2323 has released the storage space P2, the next frequency domain data FD' generated by the conversion unit 2321 can be stored in the storage space P2.

As can be seen from the above, since the storage unit 2323 of the vibration sensor 2 is divided into a storage space P1 and a storage space P2, and the capacities of the storage space P1 and the storage space P2 are both corresponding to the preset quantity value N and the number of samples, the storage unit 2323 The capacity of the vibration sensor can be reduced enough to store all the necessary data, and the above-mentioned special storage space design can greatly reduce the storage space of the vibration sensor.

In addition, the vibration sensor 2 has a special storage space management mechanism, so that the storage space can be recycled more effectively, thus further reducing the storage space of the vibration sensor 2 . Therefore, the above-mentioned storage space management mechanism is combined with the design of the storage space, so that the vibration sensor 2 can be more miniaturized, and it is not necessary to set another memory element outside the special application integrated circuit chip, so it can meet the requirements of intelligent machinery and intelligent manufacturing. requirements of the application area.

To sum up, according to the embodiments of the present invention, the special application integrated circuit chip of the vibration sensor with monitoring function can analyze the frequency domain data of the vibration signal, so the analysis time can be reduced, and the efficiency of real-time monitoring can be greatly improved .

In addition, according to the embodiment of the present invention, the special application integrated circuit chip of the vibration sensor with monitoring function can analyze the frequency domain data of the vibration signal without transmitting the vibration signal to the monitoring machine outside the vibration sensor, so it does not need to transmit the vibration signal to the monitoring machine outside the vibration sensor. It will result in data loss and can greatly reduce the data transfer time.

In addition, according to the embodiment of the present invention, the conversion module of the special application integrated circuit chip of the vibration sensor with monitoring function has a special circuit structure and operation mechanism, so the special application integrated circuit chip does not need to be provided with another sampling module, and does not need to be Subsampling enables vibration sensors to achieve higher efficiency.

In addition, according to the embodiment of the present invention, the conversion module of the special application integrated circuit chip of the vibration sensor with monitoring function has a special circuit structure and operation mechanism, so that the data update rate of the filter unit of the special application integrated circuit chip can be changed, namely The sensing bandwidth of the vibration sensor can be adjusted, and it is more flexible in use, so as to adapt to the objects to be tested with various vibration bandwidths, and expand the application objects of the vibration sensor with monitoring function.

Furthermore, according to the embodiment of the present invention, the special application integrated circuit chip of the vibration sensor with monitoring function has the functions of integrating vibration signal sensing and vibration signal analysis and a special storage space management mechanism, so that the storage space can be used more effectively. , so that the vibration sensor with monitoring function can be more miniaturized, so it can meet the needs of related application fields of intelligent machinery and intelligent manufacturing.

The above description is exemplary only, not limiting. Any other equivalent modifications or changes without departing from the spirit and scope of the present invention should be included in the appended claims.

Claims (24)

1. A vibration sensor with monitoring function, comprising: a substrate; and A micro-electromechanical vibration sensing chip, disposed on the substrate, wherein the micro-electromechanical vibration sensing chip is used to detect the vibration suffered by an object to be tested to generate a plurality of vibration signals; A special application integrated circuit chip, disposed on the substrate and electrically connected to the MEMS vibration sensing chip, includes: A sampling module, including: an analog front-end unit; an analog-to-digital conversion unit; and a filter unit; The analog front-end unit receives the plurality of vibration signals, the analog-to-digital conversion unit converts the plurality of vibration signals into a plurality of digital signals, and the filtering unit filters the plurality of digital signals to Generate multiple time domain data; A conversion module, including: a conversion unit; and a time interval unit; Wherein, the time interval unit transmits a preset quantity value to the conversion unit, The converting unit converts the plurality of time domain data into a frequency domain data, and the quantity value of the plurality of time domain data is equal to the preset quantity value; and an analysis module for executing a comparison program, wherein the comparison program compares the frequency domain data with a preset spectrum characteristic table, and sends a notification signal according to a comparison result of the comparison program . 2 . The vibration sensor according to claim 1 , wherein the preset quantity value of the time interval unit is equal to a sampling quantity set by the sampling module. 3 . 3. The vibration sensor according to claim 1, wherein the conversion module further comprises a conversion coefficient unit, the conversion coefficient unit transmits a conversion coefficient to the conversion unit, the conversion unit according to the preset A magnitude value and the conversion coefficient convert the plurality of time-domain data into the frequency-domain data. 4. The vibration sensor according to claim 1, further comprising at least one memory element, wherein the at least one memory element is electrically connected to the application-specific integrated circuit chip, and stores the predetermined spectrum characteristic table. 5. The vibration sensor according to claim 1, wherein the comparison program compares the frequency domain point of the frequency domain data with the frequency domain point of the preset frequency spectrum feature table and obtains a total difference value, when When the analysis module confirms that the comparison result is that the total difference value is greater than a threshold value, the notification signal is set as a warning signal. 6. The vibration sensor according to claim 1, wherein the conversion module comprises a storage unit, a storage space of the storage unit is used to store the plurality of time domain data, and another storage space of the storage unit for storing the frequency domain data. 7. The vibration sensor according to claim 6, wherein the capacity of the storage space and the capacity of the another storage space correspond to the preset quantity values. 8. The vibration sensor of claim 6, wherein the storage unit releases the storage space after the plurality of time domain data are transmitted to the conversion unit. 9 . The vibration sensor according to claim 8 , wherein the storage unit releases the write protection mechanism of the storage space to release the storage space, so that another time domain data covers the storage space. 10 . 10. The vibration sensor according to claim 8, wherein the storage unit deletes the plurality of time domain data in the storage space to release the storage space, so that another time domain data is stored in the storage space . 11. The vibration sensor of claim 6, wherein after the storage unit transmits the frequency domain data to the analysis module, the storage unit releases the other storage space. 12 . The vibration sensor according to claim 11 , wherein the storage unit releases the write protection mechanism of the other storage space to release the other storage space, so that another frequency domain data is overlaid on the other storage space. 13 . a storage space. 13. The vibration sensor according to claim 11, wherein the storage unit deletes the frequency domain data of another storage space to release the another storage space, so that another frequency domain data is stored in the other storage space. a storage space. 14. The vibration sensor according to claim 6, wherein the conversion module further comprises a switching unit, the storage unit and the conversion unit are electrically connected to the sampling module through the switching unit, and are connected to the sampling module through the switching unit. The sampling module switches to the sampling module when generating the plurality of time-domain data, and switches to the converting unit when the converting unit generates the frequency-domain data. 15. A vibration signal monitoring method, comprising: Detecting the vibration suffered by an object to be tested to generate a plurality of vibration signals; receiving the plurality of vibration signals and converting the plurality of vibration signals into a plurality of digital signals; filtering the plurality of digital signals to generate a plurality of time domain data; converting the plurality of time-domain data into frequency-domain data according to a preset quantity value, the quantity value of the plurality of time-domain data being equal to the preset quantity value; and A comparison procedure is executed to compare the frequency domain data with a preset spectrum characteristic table, and a notification signal is sent according to a comparison result of the comparison procedure. 16. The vibration signal monitoring method according to claim 15, wherein the step of converting the plurality of time domain data into the frequency domain data further comprises: providing a conversion factor; and The plurality of time domain data are converted into the frequency domain data according to the preset quantity value and the conversion coefficient. 17. The vibration signal monitoring method according to claim 15, wherein the comparison procedure is performed to compare the frequency domain data with the preset frequency spectrum characteristic table, and the comparison according to the comparison procedure As a result, the step of sending the notification signal further includes: Comparing the frequency domain points of the frequency domain data with the frequency domain points of the preset spectrum feature table to obtain a total difference value; and When the comparison result is that the total difference value is greater than a threshold value, the notification signal is set as a warning signal. 18. The vibration signal monitoring method according to claim 15, further comprising: A storage space is provided for storing the plurality of time-domain data, and another storage space is provided for storing the frequency-domain data, and the capacity of the storage space and the capacity of the another storage space correspond to the preset set value. 19. The vibration signal monitoring method according to claim 18, wherein the step of providing the storage space for storing the plurality of time domain data, and providing the another storage space for storing the frequency domain data is further Include: The storage space is released after the plurality of time domain data are converted into the frequency domain data. 20. The vibration signal monitoring method according to claim 19, wherein the step of releasing the storage space after the plurality of time domain data is converted into the frequency domain data further comprises: The write protection mechanism of the storage space is released to release the storage space, so that another time domain data covers the storage space. 21. The vibration signal monitoring method according to claim 19, wherein the step of releasing the storage space after the plurality of time-domain data is converted into the frequency-domain data further comprises: Deleting the plurality of time domain data in the storage space to release the storage space so that another time domain data is stored in the storage space. 22. The vibration signal monitoring method according to claim 18, wherein the step of providing the storage space for storing the plurality of time domain data, and providing the another storage space for storing the frequency domain data is further Include: After the comparison procedure is performed, the other storage space is released. 23. The vibration signal monitoring method according to claim 22, wherein after executing the comparison procedure, the step of releasing the other storage space further comprises: The write protection mechanism of the other storage space is released to release the other storage space, so that another frequency domain data covers the other storage space. 24. The vibration signal monitoring method according to claim 22, wherein after executing the comparison procedure, the step of releasing the other storage space further comprises: The frequency domain data in another storage space is deleted to release the other storage space, so that another frequency domain data is stored in the other storage space.

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