CN111342254A - Signal connector between printed circuit boards, main board and electronic equipment - Google Patents

Abstract

The embodiment of the invention relates to a signal connector, a mainboard and electronic equipment between printed circuit boards, wherein the signal connector is used for being arranged between a first printed circuit board and a second printed circuit board which are opposite to each other; the signal connector comprises a shielding component and at least one conductive connecting piece; the conductive connecting piece comprises a first end and a second end which are opposite, the first end is electrically connected with a first connecting pin of the first printed circuit board, and the second end is electrically connected with a second connecting pin of the second printed circuit board; the conductive connector and the shielding assembly are electrically insulated from each other; the shielding assembly is positioned between the conductive connecting piece and the interference source and reused as a supporting assembly, so that the distance between the first printed circuit board and the second printed circuit board is kept unchanged; the material of the shielding component is a metal material. The embodiment of the invention can solve the problems that the existing signal connector between printed circuit boards is unreasonable in design, poor in heat dissipation effect and incapable of meeting the requirements of users.

Description

Signal connectors between printed circuit boards, motherboards and electronics

technical field

The embodiments of the present invention relate to the technical field of electronic technology, in particular to a signal connector between printed circuit boards, a main board and an electronic device.

Background technique

With the development of 5G technology, the modular design of printed circuit boards (PCB boards) for high-frequency and high-speed signal interconnection is becoming more and more extensive. The main design method is that multiple printed circuit boards with different functions pass through the printed circuit boards. The signal connectors between them are connected as one. However, due to the unreasonable design of the existing signal connectors between printed circuit boards, the heat dissipation effect is poor and cannot meet the needs of users. Therefore, an urgent problem to be solved at present is the lack of a signal connector between printed circuit boards with better heat dissipation performance.

SUMMARY OF THE INVENTION

At least one embodiment of the present invention provides a signal connector between printed circuit boards, a main board and an electronic device, which solves the problem that the existing signal connector between printed circuit boards has poor heat dissipation due to unreasonable design and cannot meet the user needs.

In a first aspect, an embodiment of the present invention provides a signal connector between printed circuit boards, the signal connector is used to be installed between a first printed circuit board and a second printed circuit board that are opposite to each other; the first printed circuit board and the second printed circuit board are opposite to each other. The side of the printed circuit board close to the second printed circuit board is provided with at least one first connection pin; the side of the second printed circuit board close to the first printed circuit board is provided with at least one second connection pin foot;

The signal connector includes a shield assembly and at least one conductive connector;

The conductive connector includes an opposite first end and a second end, the first end is electrically connected with the first connection pin, and the second end is electrically connected with the second connection pin; the conductive connector and the shielding assembly are electrically insulated from each other;

The shielding assembly is located between the conductive connector and the interference source, and the shielding assembly is reused as a support assembly, so that the distance between the first printed circuit board and the second printed circuit board remains unchanged ; The material of the shielding component is a metal material.

Further, the shielding assembly and the first printed circuit board and the second printed circuit board together form a closed hollow area; the at least one conductive connection member is located in the hollow area.

Further, a first ground pin is provided on the first printed circuit board;

The vertical projection of the shielding component on the first printed circuit board is within the vertical projection of the first ground pin on the first printed circuit board; and the shielding component faces the first printed circuit Each position on the surface of the board is electrically connected to the first ground pin.

Further, the signal connector further includes at least one insulating sleeve, the insulating sleeve is sleeved on the conductive connection piece and is located between the conductive connection piece and the shielding assembly.

Further, a conductive metal layer is wrapped on the outer surface of the insulating sleeve facing away from the conductive connector, and the conductive metal layer is grounded.

Further, a second ground pin is provided on the first printed circuit board;

The vertical projection of the conductive metal layer on the first printed circuit board is within the vertical projection of the second ground pin on the first printed circuit board; and the conductive metal layer faces the first Each position on the surface of the printed circuit board is electrically connected to the second ground pin.

Further, at least one of the first end and the second end of the conductive connector is electrically connected to the corresponding connection pin by direct contact;

The first printed circuit board and the second printed circuit board are fixed as a whole through a detachable structure.

Further, take the direction perpendicular to the plane where the first printed circuit board is located as the first direction;

the conductive connector can expand and contract along the first direction;

When the signal connector is installed between the first printed wiring board and the second printed wiring board, the conductive connector is in a compressed state in the first direction.

Further, the conductive connecting member is a metal spring.

Further, the first end of the conductive connector is electrically connected to the first connection pin by welding, and the second end is electrically connected to the corresponding connection pin by direct contact.

In a second aspect, an embodiment of the present invention further provides a mainboard, which includes a signal connector between any of the above-mentioned printed circuit boards.

In a third aspect, an embodiment of the present invention further provides an electronic device, including any of the above motherboards.

The signal connector between the printed circuit boards provided in the embodiment of the present invention is located between the conductive connector and the interference source through the shielding component, and the shielding component is multiplexed as a supporting component, so that the first printed circuit board is The distance between the circuit board and the second printed circuit board remains unchanged; the material of the shielding component is a metal material, and the essence of this setting is that the shielding component has the function of heat dissipation at the same time, which solves the problem of the existing printed circuit board. Due to the unreasonable design of the signal connectors between the printed circuit boards, the heat dissipation effect is poor and cannot meet the needs of users. The purpose of improving the heat dissipation effect of the signal connectors between the printed circuit boards is achieved.

Description of drawings

In order to illustrate the technical solutions of the embodiments of the present invention more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some of the present invention. Embodiments For those of ordinary skill in the art, other drawings can also be obtained according to these drawings.

1 is a schematic partial structure diagram of a signal connector between printed circuit boards provided by an embodiment of the present invention;

FIG. 2 is a schematic three-dimensional structure diagram after the signal connector between the printed circuit boards in FIG. 1 is installed between two printed circuit boards facing each other;

Fig. 3 is a schematic view of the cross-sectional structure along A1-A2 in Fig. 2;

4 is a schematic top view of the signal connector between the printed circuit boards in FIG. 2;

FIG. 5 is a schematic top-view structural diagram of another signal connector between printed circuit boards according to an embodiment of the present invention;

FIG. 6 is a schematic diagram of a partial three-dimensional structure of the signal connector of FIG. 5;

7 is a schematic partial three-dimensional structure diagram of another signal connector according to an embodiment of the present invention;

8 is a schematic cross-sectional structural diagram of another signal connector between printed circuit boards provided on the first printed circuit board but not mounted on the second printed circuit board according to an embodiment of the present invention;

FIG. 9 is a schematic cross-sectional structure diagram after installing a second printed circuit board on the basis of FIG. 8;

10 is a schematic structural diagram of a motherboard according to an embodiment of the present invention;

11 is a schematic structural diagram of another motherboard according to an embodiment of the present invention;

FIG. 12 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.

Detailed ways

In order to understand the above objects, features and advantages of the present invention more clearly, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It is to be understood that the described embodiments are some, but not all, embodiments of the present invention. The specific embodiments described herein are only used to explain the present invention, but not to limit the present invention. Based on the described embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art fall within the protection scope of the present invention.

It should be noted that, in this document, relational terms such as "first" and "second" etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply these There is no such actual relationship or sequence between entities or operations.

Aiming at the problem that the signal connector between the printed circuit boards in the prior art is unreasonable in design, the heat dissipation effect is poor, and cannot meet the needs of users, the embodiment of the present disclosure provides a signal connector between the printed circuit boards, by making the signal connection The shielding component in the device also has the function of heat dissipation, which solves the problem that the existing signal connectors between printed circuit boards have poor heat dissipation effect and cannot meet the needs of users due to unreasonable design, and improve the signal connection between printed circuit boards. The purpose of the cooling effect of the device.

FIG. 1 is a schematic partial structure diagram of a signal connector between printed circuit boards according to an embodiment of the present invention. FIG. 2 is a schematic three-dimensional structure diagram after the signal connector between the printed circuit boards in FIG. 1 is installed between two printed circuit boards facing each other. FIG. 3 is a schematic diagram of a cross-sectional structure along A1-A2 in FIG. 2 . 1-3, the signal connector 30 between the printed circuit boards is used to be installed between the first printed circuit board 10 and the second printed circuit board 20 which are opposite to each other; the first printed circuit board 10 is close to the second printed circuit board 10. One side of the printed circuit board 20 is provided with at least one first connection pin 11; the side of the second printed circuit board 20 close to the first printed circuit board 10 is provided with at least one second connection pin 21; the signal connector 30 includes A shielding component 31 and at least one conductive connector 32; the conductive connector 32 includes an opposite first end and a second end, the first end is electrically connected to the first connection pin 11, and the second end is electrically connected to the second connection pin 21 is electrically connected; the conductive connector 32 and the shielding component 31 are electrically insulated from each other; the shielding component 31 is located between the conductive connector 32 and the interference source (not shown in the figure), and the shielding component 31 is multiplexed as a supporting component, so that the first The distance between the printed circuit board 10 and the second printed circuit board 20 remains unchanged; the material of the shielding component 31 is a metal material.

Wherein, the interference source is a component that forms an electromagnetic wave or electromagnetic field that easily interferes with the electrical signal transmitted by the conductive connector 32, and the component may be installed on the first printed circuit board 10 and/or the second printed circuit board 20, It may not be installed on the first printed circuit board 10 and the second printed circuit board 20, which is not limited in this application. The function of the shielding component 31 is to effectively suppress various electromagnetic interferences propagating through space.

Those skilled in the art can understand that, in practice, multiple components are often disposed on the side of the first printed circuit board 10 close to the second printed circuit board 20 ; similarly, the second printed circuit board 20 is close to the first printed circuit board 10 There are often multiple elements on one side. Assuming that the height of the components disposed on the side of the first printed circuit board 10 close to the second printed circuit board 20 in the Y-axis direction is H1, the components disposed on the side of the second printed circuit board 20 close to the first printed circuit board 10 The height in the Y-axis direction is H2, and it is necessary to make the distance H between the first printed circuit board 10 and the second printed circuit board 20 satisfy H≥H1+H2, so that each element on the printed circuit board will not be squeezed due to damaged by pressure. In the above technical solution, the purpose of arranging the shielding component 31 to be reused as the supporting component is to make the distance H≧H1+H2 between the first printed circuit board 10 and the second printed circuit board 20, and to maintain the distance H without Change.

In order to reuse the shielding component 31 as a supporting component, the shielding component 31 needs to have a certain thickness in the X direction in FIG. 3 , so that the shielding component 31 has a certain bearing capacity in the Y direction in the figure, so that the first The distance between the printed wiring board 10 and the second printed wiring board 20 remains unchanged. Therefore, when the shielding component 31 is reused as a supporting component, the volume of the shielding component 31 needs to be larger.

On this basis, the material of the shielding component 31 is a metal material, such as copper. Since the metal material has better thermal conductivity, and the shielding component 31 has a larger volume, which is beneficial to heat dissipation, the shielding component 31 can have a better heat dissipation effect. During use, the heat generated by the conductive connector 32 due to the transmission of signals can be dissipated through the shielding component 31, which reduces the possibility of heat accumulation around the conductive connector 32, and solves the problem of the design of the existing signal connectors between printed circuit boards. Unreasonable, its heat dissipation effect is poor, and it cannot meet the needs of users, and achieves the purpose of improving the heat dissipation effect of the signal connector between the printed circuit boards.

In the above solution, the vertical projection of the shielding component 31 on the first printed circuit board 10 may form a closed figure or an unclosed figure. This application does not limit this. If the vertical projection of the shielding component 31 on the first printed circuit board 10 forms a closed figure, the closed figure may be a polygon, a circle, an ellipse, or the like. In the actual setting, optionally, it is customized according to actual needs. Exemplarily, FIG. 4 is a schematic top-view structural diagram of the signal connector between the printed circuit boards in FIG. 2 . In FIG. 4 , the vertical projection of the shield assembly 31 on the first printed wiring board 10 is a hollow quadrilateral.

Continuing to refer to FIGS. 4 and 2 , since the vertical projection of the shielding assembly 31 on the first printed circuit board 10 forms a closed figure, optionally, the shielding assembly 31 is common with the first printed circuit board 10 and the second printed circuit board 20 A closed hollow area is enclosed; at least one conductive connection 32 is located within the hollow area. This arrangement can improve the protection effect of the shielding component 31 on the electrical signal transmitted by the conductive connector 32, prevent it from being interfered, and at the same time reduce the radiation of the electrical signal transmitted by the conductive connector 32 and reduce the probability of leakage of the electrical signal.

Optionally, in the above technical solution, the shielding component 31 may be grounded at a single point with the first printed circuit board 10, or may be grounded at multiple points, which is not limited in this application. Among them, compared with single-point grounding, the area of the part where the shielding component 31 is electrically connected to the ground pin in the multi-point grounding is larger, which can reduce the ground loop impedance and reduce the leakage of the electrical signal transmitted by the conductive connector 32 in any direction. risk, suitable for high-frequency electrical signal transmission.

Optionally, continue to refer to FIG. 3 , the first printed circuit board 10 is provided with a first ground pin 12 ; the vertical projection of the shielding component 31 on the first printed circuit board 10 is located on the first ground pin 12 on the first printed circuit board 10 . In the vertical projection on the circuit board 10 ; and the shielding component 31 is electrically connected to the first ground pin 12 at each position of the surface of the shielding component 31 facing the first printed circuit board 10 . The essence of this arrangement is to ground the shielding component 31 at multiple points, so as to reduce the impedance of the ground loop and minimize the risk of leakage of the electrical signal transmitted by the conductive connector 32 in any direction.

FIG. 5 is a schematic top-view structural diagram of another signal connector between printed circuit boards according to an embodiment of the present invention. FIG. 6 is a partial perspective structural diagram of the signal connector of FIG. 5 . 5 and 6 , optionally, the signal connector further includes at least one insulating sleeve 33 , the insulating sleeve 33 is sleeved on the conductive connector 32 and is located between the conductive connector 32 and the shielding assembly 31 . On the one hand, the insulating sleeve 33 can fix the position of the conductive connector 32 and the shielding component 31, ensure that the conductive connector 32 and the shielding component 31 are always electrically insulated, and prevent the occurrence of electrical conduction due to the shaking of the main board including the signal connector. On the other hand, the insulating sleeve 33 can further play a supporting role, so that the distance between the first printed circuit board 10 and the second printed circuit board 20 remains unchanged, so as to improve the motherboard stability.

Optionally, on the basis of the above technical solution, the outer surface of the insulating sleeve 33 away from the conductive connector 32 is wrapped with a conductive metal layer 34, and the conductive metal layer 34 is grounded. At this time, the insulating sleeve 33 is located between the conductive connector 32 and the between the conductive metal layers 34 . Optionally, the material of the conductive metal layer 34 is copper or the like. In this way, the conductive metal layer 34 can also play a shielding role, which can not only shield the interference caused by the interference source located on the side of the shielding component 31 away from the conductive connector 32 to the signal transmitted by the conductive connector 32, but also shield other adjacent conductive The signal transmitted by the connection piece 32 interferes with the signal transmitted by the conductive connection piece 32 surrounded by the insulating sleeve 33 . In addition, the radiation of the electrical signal transmitted by the conductive connector 32 can also be reduced, and the probability of leakage of the electrical signal can be reduced. In addition, the conductive metal layer 34 has better thermal conductivity, which can further increase the heat dissipation area and provide a heat dissipation effect.

Optionally, in practice, the conductive connector 32 and the conductive metal layer 34 may be fabricated first, and then an insulating material is filled between the conductive connector 32 and the conductive metal layer 34 . Optionally, the insulating material is a liquid insulating material. After the liquid insulating material is filled between the conductive connector 32 and the conductive metal layer 34 , the liquid insulating material is cured to form the insulating sleeve 33 .

Similarly, in the above technical solution, the conductive metal layer 34 may be grounded at a single point with the first printed circuit board 10, or may be grounded at multiple points, which is not limited in this application. Among them, compared with single-point grounding, the area of the part where the conductive metal layer 34 is electrically connected to the ground pin in the multi-point grounding is larger, which can reduce the ground loop impedance and reduce the electrical signal transmitted by the conductive connector 32 in any direction. Risk of leakage, suitable for high frequency electrical signal transmission.

Optionally, the first printed circuit board is provided with a second ground pin; the vertical projection of the conductive metal layer on the first printed circuit board is within the vertical projection of the second ground pin on the first printed circuit board; and Each position of the surface of the conductive metal layer facing the first printed circuit board is electrically connected to the second ground pin. The essence of this arrangement is to ground the conductive metal layer at multiple points, so as to reduce the impedance of the ground loop and minimize the risk of leakage of the electrical signal transmitted by the conductive connector in any direction.

Optionally, the first ground pin is multiplexed into the second ground pin, that is, the size of the first ground pin is increased, so that the vertical projections of the shielding component and the conductive metal layer on the first printed circuit board are located in the second ground pin. The ground pins are within the vertical projection of the first printed wiring board.

FIG. 7 is a schematic partial three-dimensional structure diagram of another signal connector according to an embodiment of the present invention. 7, optionally, the shielding assembly includes a first shielding wall 311 and a second shielding wall 312; the first shielding wall 311 is opposite to the second shielding wall 312; the first shielding wall 311, the second shielding wall 312, the A printed circuit board (not shown in FIG. 7 ) and a second printed circuit board (not shown in FIG. 7 ) together form a closed annular hollow area; a plurality of partition walls 35 are arranged in the annular hollow area, and the partition walls will The annular hollow area is divided into a plurality of closed sub-areas; the materials of the first shielding wall 311, the second shielding wall 312 and the partition wall 35 are all metal materials, such as copper; the first shielding wall 311 and the second shielding wall 312 are all complex. It is used as a support component, so that the distance between the first printed circuit board and the second printed circuit board remains unchanged; at least part of the sub-area is provided with a conductive connector 32; the conductive connector 32 is connected to the first shielding wall 311, Both the second shielding wall 312 and the partition wall 35 are electrically insulated. Since both the first shielding wall 311 and the second shielding wall 312 are multiplexed as support components, the distance between the first printed circuit board and the second printed circuit board can be further kept unchanged. In addition, since the materials of the first shielding wall 311 , the second shielding wall 312 and the partition wall 35 are all metal materials, the heat dissipation effect can be further improved. In addition, this arrangement can further improve the protection effect of the electrical signal transmitted by the conductive connector 32, prevent it from being interfered, and at the same time reduce the radiation of the electrical signal transmitted by the conductive connector 32 and reduce the probability of leakage of the electrical signal.

Similarly, the first shielding wall 311 , the second shielding wall 312 and the partition wall 35 can be grounded with the first printed circuit board 10 at a single point or at multiple points, which is not limited in this application. Among them, compared with single-point grounding, the first shielding wall 311, the second shielding wall 312 and the partition wall 35 in the multi-point grounding have a larger area where the ground pins are electrically connected, which can reduce the ground loop impedance and reduce the conductive The risk of leakage of the electrical signal transmitted by the connector 32 in any direction is suitable for high-frequency electrical signal transmission.

If multi-point grounding is adopted, optionally, the first printed circuit board is provided with a third ground pin, and when the signal connector is installed between the first printed circuit board and the second printed circuit board, the first shielding wall, The vertical projections of the second shielding wall and the partition wall on the first printed circuit board are all located within the vertical projection of the third ground pin on the first printed circuit board; and the first shielding wall, the second shielding wall and the partition wall face Each position on the surface of the first printed circuit board is electrically connected to the third ground pin.

On the basis of the above technical solutions, optionally, at least one of the first end and the second end of the conductive connector 32 is electrically connected to the corresponding connecting pin by direct contact; the first printed circuit board 10 and the second The two printed circuit boards 20 are fixed as a whole through a detachable structure. The detachable structure includes at least one of a screw and a buckle.

In the traditional soldering method, the used solder, tin, has poor conductivity, and the soldering method will increase the impedance between the conductive connector 32 and the corresponding connection pin. In addition, due to process limitations, the electrical connection yield of the soldering method is low. The above technical solution electrically connects the conductive connector 32 with the corresponding connection pin by means of direct contact, instead of electrically connecting the conductive connector 32 with the corresponding connection pin by traditional soldering, it can reduce the electrical connection between the conductive connector 32 and the corresponding connection pin. The impedance between the corresponding connection pins can be improved, and the electrical connection yield between the printed circuit board and the conductive connection member 32 can be improved. This method is especially suitable for the transmission of 3.5GHZ and above signals. In addition, since the conductive connector 32 is only in direct contact with the corresponding connection pins, rather than being welded, it is beneficial to the repeated use of the printed circuit board, and the maintenance procedures and costs of the printed circuit board can be reduced.

8 is a schematic cross-sectional structural diagram of another signal connector between printed circuit boards provided on the first printed circuit board but not mounted on the second printed circuit board according to an embodiment of the present invention. In FIG. 8 , by way of example, the second end of the conductive connection member 32 is electrically connected with the corresponding connection pin in a direct contact manner. The first ends of the conductive connectors 32 are electrically connected to the corresponding connection pins by welding.

On the basis of the above technical solutions, in order to enable the conductive connector to effectively transmit electrical signals between the first printed circuit board and the second printed circuit board, optionally, the conductive connector can The direction is the first direction; the conductive connecting piece can expand and contract along the first direction; when the signal connector is installed between the first printed circuit board and the second printed circuit board, the conductive connecting piece is in a compressed state in the first direction.

8, when the signal connector is mounted on the first printed circuit board 10, but not mounted on the second printed circuit board, the conductive connector 32 is in the first direction (ie, the Y direction in FIG. 8) is higher than the shield assembly 31 . FIG. 9 is a schematic cross-sectional structure diagram of the second printed circuit board installed on the basis of FIG. 8 . Comparing FIGS. 8 and 9 , after the second printed circuit board 20 is mounted, the conductive connecting member 32 is at the same height as the shielding component 31 in the first direction (ie, the Y direction in FIG. 9 ). Since the first printed circuit board 10 and the second printed circuit board 20 are fixed as a whole, when the signal connector is installed between the first printed circuit board 10 and the second printed circuit board 20, the conductive connection member 32 is in the first printed circuit board 10 and the second printed circuit board 20. In the compressed state in the direction (ie, the Y direction in FIG. 9 ), the conductive connecting member 32 will exert pressure on the second printed circuit board 20 directed by the conductive connecting member 32 toward the second printed circuit board 20 . The pressure will make the second end of the conductive connector 32 press against the corresponding connecting pin on the second printed circuit board 20, which can improve the stability of the electrical connection there.

Optionally, the conductive connector 32 is a metal spring.

Optionally, the first end of the conductive connector is electrically connected to the first connection pin by welding, and the second end is electrically connected to the corresponding connection pin by direct contact. In this way, during installation, the first end of the conductive connector can be electrically connected to the first connection pin by welding, and the position of the conductive connector and the first printed circuit board is fixed at this time, which is convenient for subsequent direct contact The second end of the conductive connector is electrically connected to the corresponding connecting pin in a manner to reduce the difficulty of installation.

FIG. 10 is a schematic structural diagram of a motherboard according to an embodiment of the present invention. FIG. 11 is a schematic structural diagram of another motherboard according to an embodiment of the present invention. Referring to FIG. 10 and FIG. 11 , the motherboard includes any one of the signal connectors 100 provided in the embodiments of the present invention. The mainboard further includes at least two printed wiring boards 200 (exemplarily, only two printed wiring boards 200 are included in FIG. 10 , and only three printed wiring boards 200 are included in FIG. 11 ). The signal connector 100 is installed between two adjacent printed circuit boards 200 to realize electrical signal transmission between the two adjacent printed circuit boards 200 .

Optionally, the above-mentioned printed circuit board 200 includes at least one application processor board (ie, CPU board) and one radio frequency board.

Since the motherboard provided by the embodiment of the present invention includes any one of the signal connectors provided by the embodiment of the present invention, it has the same or corresponding beneficial effects as the signal connector included in the motherboard, which is not repeated here.

In addition, it should be noted that with the development of 5G technology, the modular design of printed circuit boards for high-frequency and high-speed signal interconnection is becoming more and more extensive. The above technical solution can use the way of continuously stacking printed circuit boards in the vertical direction, and realize the signal interconnection of multiple printed circuit boards through signal connectors, which is conducive to realizing the independence of each module of the printed circuit board in circuit design and actual production, and at the same time there are It is beneficial to the reduction of the area of the main board, the overall height of the main board stack design can be reduced to a certain extent, and it is beneficial to realize the lightness and thinness of the electronic equipment including the main board design of this form.

FIG. 12 is a schematic structural diagram of an electronic device according to an embodiment of the present invention. Referring to FIG. 12 , the electronic device includes any one of the mainboards 101 provided in the embodiments of the present invention.

The electronic device may specifically be a mobile phone, a tablet computer, a notebook computer, a smart speaker, a TV, a smart wearable device, an information inquiry machine in a public place, and the like.

Since the electronic device provided by the embodiment of the present invention includes any mainboard provided by the embodiment of the present invention, which has the same or corresponding beneficial effects as the mainboard included in the electronic device, details are not described herein again.

It should be noted that, herein, the terms "comprising", "comprising" or any other variation thereof are intended to encompass non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements, It also includes other elements not expressly listed or inherent to such a process, method, article or apparatus. Without further limitation, an element qualified by the phrase "comprising a..." does not preclude the presence of additional identical elements in a process, method, article or apparatus that includes the element.

It will be understood by those skilled in the art that although some of the embodiments described herein include certain features, but not others, included in other embodiments, that combinations of features of the different embodiments are intended to be within the scope of the present invention And form different embodiments.

Although the embodiments of the present invention have been described with reference to the accompanying drawings, various modifications and variations can be made by those skilled in the art without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope of the appended claims within the limits of the requirements.

Claims (12)

1. A signal connector between printed circuit boards, characterized in that the signal connector is used to be installed between a first printed circuit board and a second printed circuit board that are opposite to each other; the first printed circuit board At least one first connection pin is disposed on the side close to the second printed circuit board; at least one second connection pin is disposed on the side of the second printed circuit board close to the first printed circuit board; The signal connector includes a shield assembly and at least one conductive connector; The conductive connector includes an opposite first end and a second end, the first end is electrically connected with the first connection pin, and the second end is electrically connected with the second connection pin; the conductive connector and the shielding assembly are electrically insulated from each other; The shielding assembly is located between the conductive connector and the interference source, and the shielding assembly is reused as a support assembly, so that the distance between the first printed circuit board and the second printed circuit board remains unchanged ; The material of the shielding component is a metal material. 2. The signal connector between printed circuit boards according to claim 1, characterized in that, The shielding assembly, together with the first printed circuit board and the second printed circuit board, encloses a closed hollow area; the at least one conductive connector is located in the hollow area. 3. The signal connector between printed circuit boards according to claim 1, wherein, A first ground pin is provided on the first printed circuit board; The vertical projection of the shielding component on the first printed circuit board is within the vertical projection of the first ground pin on the first printed circuit board; and the shielding component faces the first printed circuit Each position on the surface of the board is electrically connected to the first ground pin. 4 . The signal connector between printed circuit boards according to claim 1 , wherein the signal connector further comprises at least one insulating sleeve, the insulating sleeve is sleeved on the conductive connector, and between the conductive connector and the shield assembly. 5 . The signal connector between printed circuit boards according to claim 4 , wherein the outer surface of the insulating sleeve facing away from the conductive connector is wrapped with a conductive metal layer, and the conductive metal layer is grounded. 6 . 6. The signal connector between printed circuit boards according to claim 5, wherein a second ground pin is provided on the first printed circuit board; The vertical projection of the conductive metal layer on the first printed circuit board is within the vertical projection of the second ground pin on the first printed circuit board; and the conductive metal layer faces the first Each position on the surface of the printed circuit board is electrically connected to the second ground pin. 7. The signal connector between printed circuit boards according to claim 1, wherein, At least one of the first end and the second end of the conductive connector is electrically connected to the corresponding connecting pin by direct contact; The first printed circuit board and the second printed circuit board are fixed as a whole through a detachable structure. 8 . The signal connector between printed circuit boards according to claim 7 , wherein a direction perpendicular to the plane where the first printed circuit board is located is the first direction; 8 . the conductive connector can expand and contract along the first direction; When the signal connector is installed between the first printed wiring board and the second printed wiring board, the conductive connector is in a compressed state in the first direction. 9. The signal connector between printed circuit boards according to claim 8, characterized in that: The conductive connecting piece is a metal spring. 10. The signal connector between printed circuit boards according to any one of claims 7-9, wherein the first end of the conductive connector is electrically connected to the first connection pin by welding. connected, and the second end is electrically connected to the corresponding connection pin by direct contact. 11. A mainboard, characterized in that it comprises the signal connector between printed circuit boards according to any one of claims 1-10. 12. An electronic device, comprising the main board of claim 11.

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