CN111336346A - Method for manufacturing thin vacuum heat insulation sheet with supporting structure - Google Patents
Method for manufacturing thin vacuum heat insulation sheet with supporting structure Download PDFInfo
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- CN111336346A CN111336346A CN201811551939.1A CN201811551939A CN111336346A CN 111336346 A CN111336346 A CN 111336346A CN 201811551939 A CN201811551939 A CN 201811551939A CN 111336346 A CN111336346 A CN 111336346A
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- gap space
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- 238000009413 insulation Methods 0.000 title claims abstract description 75
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 title claims abstract description 25
- 239000002131 composite material Substances 0.000 claims abstract description 44
- 239000000084 colloidal system Substances 0.000 claims abstract description 31
- 238000010438 heat treatment Methods 0.000 claims abstract description 18
- 239000002657 fibrous material Substances 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 11
- 239000011347 resin Substances 0.000 claims abstract description 11
- 238000003466 welding Methods 0.000 claims abstract description 11
- 238000002156 mixing Methods 0.000 claims abstract description 10
- 238000007789 sealing Methods 0.000 claims abstract description 5
- 229910000679 solder Inorganic materials 0.000 claims description 90
- 238000001816 cooling Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 12
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000003365 glass fiber Substances 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 description 7
- 238000005476 soldering Methods 0.000 description 6
- 238000004891 communication Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000000306 component Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
- F16L59/00—Thermal insulation in general
- F16L59/02—Shape or form of insulating materials, with or without coverings integral with the insulating materials
- F16L59/028—Compositions for or methods of fixing a thermally insulating material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
- F16L59/00—Thermal insulation in general
- F16L59/02—Shape or form of insulating materials, with or without coverings integral with the insulating materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
- F16L59/00—Thermal insulation in general
- F16L59/02—Shape or form of insulating materials, with or without coverings integral with the insulating materials
- F16L59/029—Shape or form of insulating materials, with or without coverings integral with the insulating materials layered
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
- F16L59/00—Thermal insulation in general
- F16L59/06—Arrangements using an air layer or vacuum
- F16L59/065—Arrangements using an air layer or vacuum using vacuum
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Thermal Insulation (AREA)
Abstract
A method of making a thin vacuum insulation panel having a support structure, comprising the steps of: mixing a fiber material with a resin to form a composite gel; arranging a composite colloid on a first surface of the first lamellar structure; pressurizing and heating the first sheet structure to cure the composite material colloid on the first surface to form a support structure; arranging a second sheet structure on the first surface of the first sheet structure to form a gap space therebetween; welding the first sheet structure and the second sheet structure; and exhausting air in the gap space and sealing the periphery of the gap space to form the thin vacuum heat insulation sheet. The thin vacuum heat insulation sheet with the supporting structure manufactured by the method can effectively block heat conduction and heat convection between two sheet-shaped structures, and the thin vacuum heat insulation sheet cannot deform and collapse due to atmospheric pressure by virtue of the supporting structure, so that heat energy is effectively blocked.
Description
Technical Field
The present invention relates to a method for manufacturing a thin vacuum insulation panel, and more particularly, to a method for manufacturing a thin vacuum insulation panel having a supporting structure.
Background
The development trend of electronic and handheld communication devices is continuously towards thinning and high functionality, and demands on the operation speed and functions of a Microprocessor (Microprocessor) in the device are also increasing. The microprocessor is a core component of electronic and communication products, and is liable to generate heat under high-speed operation, and becomes a main heating element of the electronic device, causing a local processing Hot Spot (Hot Spot). Without a good thermal management scheme and a heat dissipation system, the microprocessor is often overheated and cannot perform its intended function, which may even affect the lifetime and reliability of the whole electronic device system. Therefore, excellent heat dissipation design is required for electronic products, and particularly, excellent thermal management capability is required for ultra-thin electronic devices such as smart phones (smartphones) and Tablet PCs (Tablet PCs). An effective solution for Heat dissipation and Heat dissipation in the processing hot spots of electronic and communication products is to contact one side of a graphite sheet (graphite sheet) or a flat Micro Heat Pipe (flat Heat Pipe) or a Vapor Chamber (Vapor Chamber) with a Heat source and the other side with a housing of the electronic device, and it is desired to quickly conduct and distribute the high-density Heat generated by a microprocessor to the housing and thereby radiate the Heat to the air in a more effective manner.
However, because some electronic or communication products, such as smart phones, are very thin and light, the thickness space between the microprocessor and the chassis hub for accommodating the heat dissipation elements is often less than 1 mm. Therefore, the other surface of the heat dissipating element in the heat source region is directly and thermally contacted with the cylindrical enclosure, and the high temperature generated by the hot spot is easily and directly conducted to the cylindrical enclosure, resulting in the excessive hot spot temperature on the surface of the cylindrical enclosure. Therefore, in order to avoid the excessive temperature on the surface of the cylindrical hub, a layer of insulation sheet needs to be arranged between the cylindrical hub in the hot spot region and the partial region of the heat dissipation element to prevent the conduction of the insulator heat flow. Meanwhile, a heat-insulating sheet is also needed to properly isolate the heat-generating components on the circuit board from other electronic or optoelectronic components that are sensitive to heat. Therefore, a solution to the problem of how to efficiently insulate heat in a limited thickness and space at a local position of a device is needed in a thin, small, light, and small electronic and communication device.
Disclosure of Invention
Accordingly, the present invention is directed to a method for manufacturing a thin vacuum insulation panel with a supporting structure, which can effectively overcome the defects of the prior art and effectively block heat energy in a limited thickness space.
In order to achieve the above object, the present invention discloses a method for manufacturing a thin vacuum insulation panel having a supporting structure, comprising the steps of:
mixing a fiber material and a resin to form a composite material colloid;
arranging the composite colloid on a first surface of a first sheet structure;
pressurizing and heating the first sheet structure to cure the composite material colloid on the first surface to form a supporting structure;
arranging a second sheet structure on the first surface of the first sheet structure so as to form a gap space between the second sheet structure and the first sheet structure;
welding the first sheet structure and the second sheet structure; and
the air in the gap space is pumped out and the periphery of the gap space is sealed to form a thin vacuum heat insulation sheet.
Wherein: the step of disposing the second sheet structure on the first surface of the first sheet structure to form the gap space between the second sheet structure and the first sheet structure further includes:
arranging the second sheet structure on the first surface of the first sheet structure, so that the gap space is formed between the second sheet structure and the first sheet structure through the supporting structure, and manufacturing a conduit to be communicated with the gap space;
and the step of evacuating the air in the gap space and sealing the gap space to form the thin vacuum insulation panel further comprises:
the air in the gap space is pumped out by the duct, and then the duct is blocked and sealed to form the thin vacuum heat insulation sheet.
Wherein: the step of disposing the second sheet-like structure on the first surface of the first sheet-like structure to form the gap space between the second sheet-like structure and the first sheet-like structure further comprises a step of:
arranging a solder around the first surface;
and the step of welding the first sheet structure and the second sheet structure further comprises:
and heating the solder to the melting point of the solder, and then cooling the solder to hermetically weld the first sheet structure and the second sheet structure.
Wherein: the first surface of the first sheet-shaped structure is provided with an outer annular solder mask layer and an inner annular solder mask layer, and the outer annular solder mask layer surrounds the outer side of the inner annular solder mask layer;
wherein, in the step of disposing the composite material colloid on the first surface of the first laminar structure, the composite material colloid is disposed on the inner side of the inner annular solder mask layer of the first surface; and
the step of disposing the solder material around the first surface further includes disposing the solder material around the first surface between the outer annular solder mask layer and the inner annular solder mask layer.
Wherein: and in the step of heating the solder to the melting point of the solder and then cooling the solder to hermetically weld the first sheet-like structure and the second sheet-like structure, the thermal conductivity of the support structure is lower than that of the solder after cooling, and the hardness of the support structure is higher than that of the solder after cooling.
Wherein: the step of disposing the second sheet-like structure on the first surface of the first sheet-like structure to form the gap space between the second sheet-like structure and the first sheet-like structure further comprises a step of:
arranging a solder around a second surface of the second sheet structure;
and the step of disposing the second sheet structure on the first surface of the first sheet structure to form the gap space between the second sheet structure and the first sheet structure further comprises:
the second surface of the second sheet structure is disposed on the first surface of the first sheet structure, so that the gap space is formed between the second sheet structure and the first sheet structure by the supporting structure.
And the step of welding the first sheet structure and the second sheet structure further comprises:
the solder is heated and cooled to solder the first sheet structure and the second sheet structure.
Wherein: the step of disposing the composite material adhesive on the first surface of the first sheet structure further includes disposing the composite material adhesive on the first surface of the first sheet structure by using a printing or dispensing method.
Wherein: in the step of mixing the fiber material and the resin into the composite material colloid, the fiber material is a glass fiber material.
Wherein: the thickness of the thin vacuum heat insulation sheet is less than 1mm, and the height of the gap space is less than 0.5 mm.
Also disclosed is a method for manufacturing a thin vacuum insulation panel having a support structure, comprising the steps of:
mixing a fiber material and a resin to form a composite material colloid;
arranging the composite colloid on a first surface of a first sheet structure;
pressurizing and heating the first sheet structure to cure the composite material colloid on the first surface to form a supporting structure;
arranging a second sheet structure on the first surface of the first sheet structure in a vacuum environment so as to form a gap space between the second sheet structure and the first sheet structure; and
heating the solder and cooling to hermetically weld the first sheet structure and the second sheet structure to form a thin vacuum heat insulation sheet.
In summary, the present invention provides a method for manufacturing a thin vacuum thermal insulation sheet with a supporting structure, which can effectively isolate heat conduction and heat convection between two thermal insulation sheets, and the supporting structure between two thermal insulation sheets can prevent the two thermal insulation sheets from deforming and collapsing due to air pressure, so as to effectively perform the function of thermal insulation.
Drawings
FIG. 1a is a schematic diagram of a thin vacuum insulation panel according to an embodiment of the invention.
FIG. 1b is a cross-sectional view taken along line A-A of FIG. 1 a.
FIG. 2 is a flow chart illustrating steps of a method of fabricating a thin vacuum insulation panel having a support structure according to one embodiment of the present invention.
Fig. 3a to 3c are schematic views illustrating a process of manufacturing a thin vacuum insulation panel according to an embodiment of the present invention.
FIG. 4 is a flow chart illustrating steps in a method of forming a thin vacuum insulation panel having a support structure according to one embodiment of the present invention.
Fig. 5a is a schematic view showing a simplified structure of a thin vacuum insulation panel including a duct according to an embodiment of the present invention.
FIG. 5B is a cross-sectional view taken along line B-B of FIG. 5 a.
FIG. 6 is a flow chart illustrating steps in a method of forming a thin vacuum insulation panel having a support structure according to one embodiment of the present invention.
FIG. 7a is a simplified schematic diagram of a thin vacuum insulation panel according to an embodiment of the present invention.
FIG. 7b is a cross-sectional view of the outer annular soldermask layer and the inner annular soldermask layer according to line C-C in FIG. 7 a.
FIG. 7C is a cross-sectional view taken along line C-C of FIG. 7 a.
FIG. 8 is a flow chart illustrating steps in a method of forming a thin vacuum insulation panel having a support structure according to one embodiment of the present invention.
FIG. 9 is a flow chart illustrating steps of a method of fabricating a thin vacuum insulation panel having a support structure according to another embodiment of the present invention.
Detailed Description
In order that the advantages, spirit and features of the invention will be readily understood and appreciated, embodiments thereof will be described in detail hereinafter with reference to the accompanying drawings. It is to be understood that these embodiments are merely representative of the present invention, and that the specific methods, devices, conditions, materials, etc., described herein are not intended to limit the present invention or the corresponding embodiments. Also, the devices shown in the drawings are merely for relative positional representation and are not drawn to scale as they are actually drawn.
In the description of the present invention, it is to be understood that the terms "longitudinal, transverse, upper, lower, front, rear, left, right, top, bottom, inner, outer" and the like refer to orientations or positional relationships based on those shown in the drawings, which are merely for convenience of description and simplicity of description, and do not indicate that the described devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
Please refer to fig. 1a, fig. 1b, fig. 2 and fig. 3a to 3 c. Fig. 1a is a schematic diagram showing a simple structure of a thin vacuum insulation panel 1 according to an embodiment of the present invention. FIG. 1b is a cross-sectional view taken along line A-A of FIG. 1 a. FIG. 2 is a flow chart illustrating steps of a method of fabricating a thin vacuum insulation panel having a support structure according to one embodiment of the present invention. Fig. 3a to 3c are schematic views illustrating a process of manufacturing a thin vacuum insulation panel 1 according to an embodiment of the present invention. In one embodiment of the present invention, a method for manufacturing a thin vacuum insulation panel with a supporting structure comprises the following steps: mixing the fiber material with the resin to become a composite gel 13 (S1); arranging the composite gel 13 on the first surface 111 of the first sheet structure 11 (S2); pressurizing and heating the first sheet structure 11 to cure the composite gel 13 on the first surface 111 to form the support structure 14 (S3); disposing the second sheet structure 12 on the first surface 111 of the first sheet structure 11 such that the second sheet structure 12 and the first sheet structure 11 form an interstitial space 15 therebetween (S4); welding the first sheet structure 11 and the second sheet structure 12 (S5); and extracting air of the gap space 15 and sealing the circumference of the gap space 15 to form the thin vacuum insulation panel 1 (S6).
In practice, the fiber material used in the present invention is glass fiber, but is not limited thereto, and the resin may be epoxy resin. The composite colloid 13 formed by mixing the fiber material and the resin may also include a curing agent and an organic solvent, wherein the curing agent can facilitate curing of the composite colloid 13, and the organic solvent can increase the fluidity of the composite colloid 13 to facilitate disposing the composite colloid 13 on the first surface 111 of the first lamellar structure 11. When the composite colloid 13 is disposed on the first sheet structure 11, the composite colloid 13 is disposed on the first surface 111, wherein the disposing manner may be a steel plate printing or a dispensing manner, so that the composite colloid 13 can be evenly distributed on the first sheet structure 11 during the pressing and heating processes. When the first sheet structure 11 containing the composite material colloid 13 is pressurized and heated, the curing agent in the composite material colloid 13 can be fixed on the first surface 111 of the first sheet structure 11 after being cured. The composite material gel 13 is heated and pressurized to form the support structure 14. Further, when the second sheet structure 12 is disposed on the first surface 111 of the first sheet structure 11, the second sheet structure 12, and the support structure 14 form an interstitial space 15 therebetween. The first sheet structure 11 and the second sheet structure 12 may be a metal of the same material, such as a copper sheet or a stainless steel sheet plated with a solderable material layer. Next, the peripheries of the first surface 111 of the first sheet structure 11 and the second surface 122 of the second sheet structure 12 are soldered using the solder 16, and then the air in the gap space is extracted. At this time, a space for sealing a vacuum is formed between the first sheet structure 11 and the second sheet structure 12 to form the thin vacuum insulation sheet 1. Since the efficiency of heat conduction and heat convection is very poor under vacuum, the first sheet structure 11 and the second sheet structure 12 have good thermal insulation capability, that is, the thin vacuum insulation panel 1 can effectively insulate the heat energy in the Z-axis direction. In the present embodiment, the thin vacuum insulation panel 1 is arranged from bottom to top in the first sheet structure 11, the first surface 111 of the first sheet structure 11, the solder 16 and the support structure 14, and the second surface 122 of the second sheet structure 12, and the second sheet structure 12 as shown in fig. 1b and fig. 3c, and the following embodiments are described in this arrangement.
Please refer to fig. 3c, fig. 4, fig. 5a and fig. 5 b. FIG. 4 is a flow chart illustrating steps in a method of forming a thin vacuum insulation panel having a support structure according to one embodiment of the present invention. Fig. 5a is a schematic view showing a simple structure of a thin vacuum insulation panel 1 including a duct 17 according to an embodiment of the present invention. FIG. 5B is a cross-sectional view taken along line B-B of FIG. 5 a. When the gap space 15 is formed between the first sheet-like structure 11 and the second sheet-like structure 12, a duct 17 is further formed to communicate with the gap space (S41), and after air in the gap space 15 is extracted through the duct 17, the duct 17 is blocked to form the thin vacuum insulation panel 1 (S61). In practice, the material of the conduit 17 is the same metal as the first sheet structure 11 and the second sheet structure 12. The duct 17 is disposed between the first sheet structure 11 and the second sheet structure 12, and a first end 171 of the duct 17 is disposed in the interstitial space 15 and a second end 172 opposite the first end 171 is disposed in the environment. After the first sheet structure 11 and the second sheet structure 12 are welded to form a sealed space, air in the gap space 15 is drawn out from the second end 172 of the duct 17, and after the gap space 15 is evacuated, the second end 172 of the duct 17 can be sealed by welding or fusing to prevent outside air from entering the gap space 15 through the duct 17 again. Further, the second end 172 of the conduit 17 may be collapsed prior to being cut to the appropriate length. Therefore, the gap space 15 is evacuated by the conduit 17 to achieve the heat-blocking effect between the first sheet-like structure 11 and the second sheet-like structure 12.
Please refer to fig. 3c and fig. 6. FIG. 6 is a flow chart illustrating steps of a method of fabricating a thin vacuum insulation panel having a support structure according to one embodiment of the present invention. Wherein the solder 16 is arranged around the first surface 111 of the first sheet structure 11 before soldering the first sheet structure 11 and the second sheet structure 12 (S42); at the time of soldering, the solder 16 is heated to a solder melting point and then cooled to hermetically solder the first sheet structure 11 and the second sheet structure 12 (S51). In practice, the solder 16 may be a solder material, and the solder 16 is disposed on the first surface 111 of the first sheet structure 11 around the composite material colloid. Next, the second sheet structure 12 is disposed on the first sheet structure 11 and heated to the melting point of the solder, and at this time, the solder 16 melts and adheres to the first surface 111 of the first sheet structure 11 and the second surface 122 of the second sheet structure 12. When the solder 16 is cooled, the solder 16 is used to solder the first sheet structure 11 and the second sheet structure 12 to form a sealed space in which the air in the gap space 15 and the outside air cannot communicate with each other.
Please refer to fig. 3c and fig. 5b again. In one embodiment, the solder 16 is first disposed around the first surface 111 of the first sheet structure 11, the conduit 17 is then disposed on the solder 16, and finally the second sheet structure 12 is disposed on the first surface 111 of the first sheet structure 11 and then the solder 16 is heated for soldering. In another embodiment, the conduit 17 is disposed on the first sheet structure 11, and then the solder 16 is disposed on the first surface 111 of the first sheet structure 11, wherein a portion of the solder 16 is disposed on the conduit 17. Then, the second sheet structure 12 is disposed on the first surface 111 of the first sheet structure 11, and then the solder 16 is heated again for soldering. In another embodiment, the solder 16 is disposed around the first surface 111 of the first sheet structure 11, and then the second sheet structure 12 is disposed on the first sheet structure 11 and then the conduit 17 is inserted, wherein the conduit 17 is disposed in the solder. In practice, whether the conduit 17 is placed on the first sheet structure 11 before or after the solder 16 is placed, the solder 16 can completely weld the conduit between the first sheet structure 11 and the second sheet structure 12 after the first sheet structure 11 and the second sheet structure 12 are welded by heating. Therefore, after the duct 17 vacuums the air in the gap space 15 and cuts or welds the duct, the first sheet structure 11 and the second sheet structure 12 can be made to be an airtight space.
Please refer to fig. 7a, fig. 7b, fig. 7c and fig. 8. Fig. 7a is a schematic diagram showing a simple structure of a thin vacuum insulation panel 1 according to an embodiment of the present invention. Fig. 7b shows a cross-sectional view of the outer annular soldermask layer 1111 and the inner annular soldermask layer 1112 according to line C-C in fig. 7 a. FIG. 7C is a cross-sectional view taken along line C-C of FIG. 7 a. FIG. 8 is a flow chart illustrating steps in a method of forming a thin vacuum insulation panel having a support structure according to one embodiment of the present invention. In one embodiment, the first surface 111 of the first lamellar structure 11 has an outer annular soldermask layer 1111 and an inner annular soldermask layer 1112, and the outer annular soldermask layer 1111 is wrapped around the outside of the inner annular soldermask layer 1112. The support structure is disposed inside the inner annular solder resist layer 1112 of the first surface 111 (S21), and the solder 16 is disposed around between the outer annular solder resist layer 1111 and the inner annular solder resist layer 1112 of the first surface 111 (S43). In practice, after the solder 16 is soldered by heating, the arrangement range cannot be precisely controlled, so that there may be a lack of material or flash, a void or a gap may be formed, a sealed space cannot be formed, and the heat-blocking effect cannot be affected by a vacuum state. Therefore, the arrangement position of the solder 16 can be precisely controlled by the outer annular solder mask layer 1111 and the inner annular solder mask layer 1112 to produce the thin vacuum heat insulation sheet 1 with better yield. In addition, due to the characteristics of the glass fiber composite material, the support structure 14 is not softened by the temperature of soldering after being formed under normal pressure, so that after the solder 16 is heated to solder the first sheet structure 11 and the second sheet structure, the support structure 14 can still support the first sheet structure 11 and the second sheet structure to prevent the first sheet structure 11 and the second sheet structure from being deformed inward and collapsed after the gap space between the thin vacuum insulation panels 1 is evacuated.
In one embodiment, the thermal conductivity of the support structure 14 is lower than the thermal conductivity of the solder 16 after cooling, and the stiffness of the support structure 14 is higher than the stiffness of the solder 16 after cooling. In practice, since the gas pressure in the gap space 15 is less than the atmospheric pressure outside under the condition that the gap space 15 is in vacuum, the first sheet-like structure 11 and the second sheet-like structure 12 will be pressed by the atmospheric pressure and deformed toward the gap space 15, so that the support structure 14 formed by the composite material colloid through pressurization and heating can maintain the distance between the first sheet-like structure 11 and the second sheet-like structure 12 at both ends without deformation and collapse. Since both ends of the supporting structure 14 are respectively contacted with the first sheet structure 11 and the second sheet structure 12, when the thermal conductivity of the supporting structure 14 is lower than that of the solder 16, the thermal conduction effect of the supporting structure 14 between the first sheet structure 11 and the second sheet structure 12 can be reduced to ensure the heat blocking effect. When the gap space 15 is under vacuum, the farther away from the solder 16, the greater the external pressure, so the rigidity of the supporting structure 14 is higher than that of the solder 16 after cooling to avoid the deformation of the first sheet structure 11 and the second sheet structure 12. Since each supporting column of the supporting structure 14 is supported by the first sheet structure 11 and the second sheet structure 12 in a smaller volume and is subjected to a larger pressure than the solder 16, the rigidity of the supporting structure 14 is higher than the rigidity of the solder 16 after cooling to maintain the supporting function.
In one embodiment, before the first sheet structure 11 and the second sheet structure 12 are welded, the solder 16 is circumferentially disposed around the second surface 122 of the second sheet structure 12, and in the step of forming the gap space 15 between the second sheet structure 12 and the first sheet structure 11, the second surface 122 of the second sheet structure 12 is further disposed on the first surface 111 of the first sheet structure 11, so that the gap space 15 is formed between the second sheet structure 12 and the first sheet structure 11 by the supporting structure 14. In practice, since the solder 16 is used to solder the first sheet structure 11 and the second sheet structure 12 to each other during soldering, the solder 16 can be disposed on the second surface 122 of the second sheet structure 12 in addition to the first surface 111 of the first sheet structure 11. The functions of the relevant units in this embodiment are substantially the same as those of the corresponding units, and are not described herein again. The method of the present embodiment can simultaneously cure the support structure 14 and arrange the solder 16, and can shorten the manufacturing time of the thin vacuum insulation panel 1.
Because the volume and thickness of the mobile phone or tablet computer are both thin and light, the volume of the internal components of the mobile phone or tablet computer is limited, and certain heat dissipation and insulation functions are also required. In one embodiment, the thickness of the thin vacuum insulation panel 1 is less than 1mm, and the height of the gap space is less than 0.5 mm.
Please refer to fig. 9. FIG. 9 is a flow chart illustrating steps of a method of fabricating a thin vacuum insulation panel having a support structure according to another embodiment of the present invention. In another embodiment, the present invention also provides a method for manufacturing a thin vacuum insulation panel having a supporting structure, comprising the steps of: mixing the fiber material with a resin to become a composite gel (S1'); disposing a composite gel on a first surface of the first sheet structure (S2'); pressurizing and heating the first sheet structure to cure the composite gel on the first surface to form a support structure (S3'); disposing a second sheet structure on the first surface of the first sheet structure in a vacuum environment such that an interstitial space is formed between the second sheet structure and the first sheet structure (S4'); and hermetically welding the first sheet structure and the second sheet structure to form a thin vacuum insulation panel (S5'). In practice, since the second sheet structure is disposed on the first surface of the first sheet structure in a vacuum environment, the gap space formed by the first sheet structure, the second sheet structure and the supporting structure is also in a vacuum state, and when the thin vacuum heat insulation sheet is formed after airtight welding, the sealed space is also in a vacuum space to achieve the effect of heat resistance. The functions of the relevant units and the manufacturing steps S1 to S3 in this embodiment are substantially the same as the corresponding units and steps described above, and are not described again here.
In summary, the present invention provides a method for manufacturing a thin vacuum thermal insulation sheet with a supporting structure, which can effectively isolate the heat conduction and the heat convection between two thermal insulation sheets, and the supporting structure between two thermal insulation sheets can prevent the two thermal insulation sheets from deforming and collapsing due to the air pressure, so as to effectively perform the function of vacuum thermal insulation.
The above detailed description of the preferred embodiments is intended to more clearly illustrate the features and spirit of the present invention, and is not intended to limit the scope of the present invention by the preferred embodiments disclosed above. On the contrary, it is intended to cover various modifications and equivalent arrangements included within the scope of the claims. The scope of the claims is thus to be accorded the broadest interpretation so as to encompass all such modifications and equivalent arrangements as is within the scope of the appended claims.
Claims (10)
1. A method for manufacturing a thin vacuum insulation panel with a supporting structure is characterized by comprising the following steps:
mixing a fiber material and a resin to form a composite material colloid;
arranging the composite colloid on a first surface of a first sheet structure;
pressurizing and heating the first sheet structure to cure the composite material colloid on the first surface to form a supporting structure;
arranging a second sheet structure on the first surface of the first sheet structure so as to form a gap space between the second sheet structure and the first sheet structure;
welding the first sheet structure and the second sheet structure; and
the air in the gap space is pumped out and the periphery of the gap space is sealed to form a thin vacuum heat insulation sheet.
2. The method of manufacturing a thin vacuum insulation panel with a support structure according to claim 1, wherein: the step of disposing the second sheet structure on the first surface of the first sheet structure to form the gap space between the second sheet structure and the first sheet structure further includes:
arranging the second sheet structure on the first surface of the first sheet structure, so that the gap space is formed between the second sheet structure and the first sheet structure through the supporting structure, and manufacturing a conduit to be communicated with the gap space;
and the step of evacuating the air in the gap space and sealing the gap space to form the thin vacuum insulation panel further comprises:
the air in the gap space is pumped out by the duct, and then the duct is blocked and sealed to form the thin vacuum heat insulation sheet.
3. The method of manufacturing a thin vacuum insulation panel with a support structure according to claim 1, wherein: the step of disposing the second sheet-like structure on the first surface of the first sheet-like structure to form the gap space between the second sheet-like structure and the first sheet-like structure further comprises a step of:
arranging a solder around the first surface;
and the step of welding the first sheet structure and the second sheet structure further comprises:
and heating the solder to the melting point of the solder, and then cooling the solder to hermetically weld the first sheet structure and the second sheet structure.
4. The method of manufacturing a thin vacuum insulation panel with a support structure according to claim 3, wherein: the first surface of the first sheet-shaped structure is provided with an outer annular solder mask layer and an inner annular solder mask layer, and the outer annular solder mask layer surrounds the outer side of the inner annular solder mask layer;
wherein, in the step of disposing the composite material colloid on the first surface of the first laminar structure, the composite material colloid is disposed on the inner side of the inner annular solder mask layer of the first surface; and
the step of disposing the solder material around the first surface further includes disposing the solder material around the first surface between the outer annular solder mask layer and the inner annular solder mask layer.
5. The method of manufacturing a thin vacuum insulation panel with a support structure according to claim 3, wherein: and in the step of heating the solder to the melting point of the solder and then cooling the solder to hermetically weld the first sheet-like structure and the second sheet-like structure, the thermal conductivity of the support structure is lower than that of the solder after cooling, and the hardness of the support structure is higher than that of the solder after cooling.
6. The method of manufacturing a thin vacuum insulation panel with a support structure according to claim 1, wherein: the step of disposing the second sheet-like structure on the first surface of the first sheet-like structure to form the gap space between the second sheet-like structure and the first sheet-like structure further comprises a step of:
arranging a solder around a second surface of the second sheet structure;
and the step of disposing the second sheet structure on the first surface of the first sheet structure to form the gap space between the second sheet structure and the first sheet structure further comprises:
the second surface of the second sheet structure is disposed on the first surface of the first sheet structure, so that the gap space is formed between the second sheet structure and the first sheet structure by the supporting structure.
And the step of welding the first sheet structure and the second sheet structure further comprises:
the solder is heated and cooled to solder the first sheet structure and the second sheet structure.
7. The method of manufacturing a thin vacuum insulation panel with a support structure according to claim 1, wherein: the step of disposing the composite material adhesive on the first surface of the first sheet structure further includes disposing the composite material adhesive on the first surface of the first sheet structure by using a printing or dispensing method.
8. The method of manufacturing a thin vacuum insulation panel with a support structure according to claim 1, wherein: in the step of mixing the fiber material and the resin into the composite material colloid, the fiber material is a glass fiber material.
9. The method of manufacturing a thin vacuum insulation panel with a support structure according to claim 1, wherein: the thickness of the thin vacuum heat insulation sheet is less than 1mm, and the height of the gap space is less than 0.5 mm.
10. A method for manufacturing a thin vacuum insulation panel with a supporting structure is characterized by comprising the following steps:
mixing a fiber material and a resin to form a composite material colloid;
arranging the composite colloid on a first surface of a first sheet structure;
pressurizing and heating the first sheet structure to cure the composite material colloid on the first surface to form a supporting structure;
arranging a second sheet structure on the first surface of the first sheet structure in a vacuum environment so as to form a gap space between the second sheet structure and the first sheet structure; and
heating the solder and cooling to hermetically weld the first sheet structure and the second sheet structure to form a thin vacuum heat insulation sheet.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811551939.1A CN111336346A (en) | 2018-12-19 | 2018-12-19 | Method for manufacturing thin vacuum heat insulation sheet with supporting structure |
| PCT/CN2019/130281 WO2020125808A1 (en) | 2018-12-19 | 2019-12-31 | Method for fabricating thin vacuum heat insulating sheet having support structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811551939.1A CN111336346A (en) | 2018-12-19 | 2018-12-19 | Method for manufacturing thin vacuum heat insulation sheet with supporting structure |
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| Publication Number | Publication Date |
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| CN111336346A true CN111336346A (en) | 2020-06-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811551939.1A Pending CN111336346A (en) | 2018-12-19 | 2018-12-19 | Method for manufacturing thin vacuum heat insulation sheet with supporting structure |
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| Country | Link |
|---|---|
| CN (1) | CN111336346A (en) |
| WO (1) | WO2020125808A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114076534A (en) * | 2020-08-14 | 2022-02-22 | 广州力及热管理科技有限公司 | Manufacturing method of high-power temperature equalizing plate structure |
| TWI738479B (en) * | 2020-08-28 | 2021-09-01 | 大陸商廣州力及熱管理科技有限公司 | A metal sheet component with a cured composite material structure and manufacturing method thereof |
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| JPS59146993A (en) * | 1983-02-10 | 1984-08-23 | 松下電器産業株式会社 | Method for manufacturing a heat insulating structure |
| US4726974A (en) * | 1986-10-08 | 1988-02-23 | Union Carbide Corporation | Vacuum insulation panel |
| JP2009074604A (en) * | 2007-09-20 | 2009-04-09 | Sharp Corp | Vacuum insulation |
| CN202660158U (en) * | 2012-05-28 | 2013-01-09 | 徐林波 | Plate material packaged by metal thin plate in vacuum mode and product of plate material |
| WO2013153813A1 (en) * | 2012-04-11 | 2013-10-17 | パナソニック株式会社 | Vacuum heat insulator, and refrigerator-freezer and home wall provided with same |
| CN106415107A (en) * | 2014-05-30 | 2017-02-15 | 旭硝子株式会社 | Vacuum heat-insulating material |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4654546B2 (en) * | 2001-07-12 | 2011-03-23 | パナソニック株式会社 | Notebook computer |
| CN104243634A (en) * | 2013-06-13 | 2014-12-24 | 苏州沛德导热材料有限公司 | Mobile phone rear shell |
| CN108207097B (en) * | 2018-02-09 | 2022-04-29 | 中兴通讯股份有限公司 | A thermal insulation device and electronic product |
| TWM561392U (en) * | 2018-03-15 | 2018-06-01 | 華碩電腦股份有限公司 | Vacuum insulated plate |
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2018
- 2018-12-19 CN CN201811551939.1A patent/CN111336346A/en active Pending
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- 2019-12-31 WO PCT/CN2019/130281 patent/WO2020125808A1/en not_active Ceased
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59146993A (en) * | 1983-02-10 | 1984-08-23 | 松下電器産業株式会社 | Method for manufacturing a heat insulating structure |
| US4726974A (en) * | 1986-10-08 | 1988-02-23 | Union Carbide Corporation | Vacuum insulation panel |
| EP0263511A2 (en) * | 1986-10-08 | 1988-04-13 | Union Carbide Corporation | Vacuum insulation panel |
| JP2009074604A (en) * | 2007-09-20 | 2009-04-09 | Sharp Corp | Vacuum insulation |
| WO2013153813A1 (en) * | 2012-04-11 | 2013-10-17 | パナソニック株式会社 | Vacuum heat insulator, and refrigerator-freezer and home wall provided with same |
| CN202660158U (en) * | 2012-05-28 | 2013-01-09 | 徐林波 | Plate material packaged by metal thin plate in vacuum mode and product of plate material |
| CN106415107A (en) * | 2014-05-30 | 2017-02-15 | 旭硝子株式会社 | Vacuum heat-insulating material |
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| Publication number | Publication date |
|---|---|
| WO2020125808A1 (en) | 2020-06-25 |
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