CN111328180A - FPC circuit board - Google Patents
FPC circuit board Download PDFInfo
- Publication number
- CN111328180A CN111328180A CN201811529989.XA CN201811529989A CN111328180A CN 111328180 A CN111328180 A CN 111328180A CN 201811529989 A CN201811529989 A CN 201811529989A CN 111328180 A CN111328180 A CN 111328180A
- Authority
- CN
- China
- Prior art keywords
- layer
- circuit board
- wiring layer
- fpc
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000010410 layer Substances 0.000 claims abstract description 56
- 239000011241 protective layer Substances 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000036039 immunity Effects 0.000 description 1
- 238000000370 laser capture micro-dissection Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0257—Overvoltage protection
- H05K1/0259—Electrostatic discharge [ESD] protection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses an FPC (flexible printed circuit) circuit board, which comprises a substrate layer, wherein a first wiring layer is arranged on the substrate layer, an insulating layer is arranged on the first wiring layer, a second wiring layer is arranged on the insulating layer, a protective layer is arranged on the second wiring layer, an anti-static layer is arranged on the protective layer, the substrate layer is bonded with the first wiring layer, and the second wiring layer is bonded with the protective layer; the circuit board has the advantages of stable signal, stronger anti-interference performance, higher high and low temperature resistance, simple process and high manufacturing efficiency. The anti-tearing performance of the FPC circuit board can be enhanced, the reinforced part is arranged on the periphery of the FPC circuit board, and the anti-tearing hole can play a good anti-tearing effect.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to an FPC (flexible printed circuit) circuit board.
Background
The flexible printed circuit board is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent performance. The flexible printed circuit board or FPC for short has the characteristics of high wiring density, light weight and thin thickness. The method is mainly used for a plurality of products such as mobile phones, notebook computers, PDAs, digital cameras, LCMs and the like.
In the actual assembly process, the FPC board is very thin, and the phenomenon of tearing is easy to occur at the excessive position on the FPC board, so that the quality of the FPC board is influenced; the high temperature resistance is poor, and the flexible circuit board does not have the function of preventing static electricity, but in practical use, the flexible circuit board is expensive, and attention needs to be paid to prevent the static electricity from damaging the flexible circuit board in the using and processing processes.
Disclosure of Invention
The invention aims to provide an FPC circuit board.
The invention discloses an FPC (flexible printed circuit) circuit board, which comprises a substrate layer, wherein a first wiring layer is arranged on the substrate layer, an insulating layer is arranged on the first wiring layer, a second wiring layer is arranged on the insulating layer, a protective layer is arranged on the second wiring layer, an anti-static layer is arranged on the protective layer, the substrate layer and the first wiring layer are bonded together, and the second wiring layer and the protective layer are bonded together.
Preferably, the insulating layer is made of PET.
The circuit board has the advantages of stable signal, stronger anti-interference performance, higher high and low temperature resistance, simple process and high manufacturing efficiency. The anti-tearing performance of the FPC circuit board can be enhanced, the reinforced part is arranged on the periphery of the FPC circuit board, and the anti-tearing hole can play a good anti-tearing effect.
Drawings
FIG. 1 is a schematic structural view of the present invention;
wherein: 1-a substrate layer, 2-a first wiring layer, 3-an insulating layer, 4-a second wiring layer, 5-a protective layer and 6-an antistatic layer.
Detailed Description
Referring to fig. 1, the FPC board of this embodiment includes a substrate layer 1, a first wiring layer 2 is disposed on the substrate layer 1, an insulating layer 3 is disposed on the first wiring layer 2, a second wiring layer 4 is disposed on the insulating layer 3, a protective layer 5 is disposed on the second wiring layer 4, an antistatic layer 6 is disposed on the protective layer 5, the substrate layer 1 and the first wiring layer 2 are bonded together, and the second wiring layer 4 and the protective layer 5 are bonded together.
Preferably, in this embodiment, the insulating layer 3 is made of PET.
The circuit board of this embodiment is stable in signal, and interference immunity is stronger, more resistant high low temperature, and simple process, the preparation is efficient. The anti-tearing performance of the FPC circuit board can be enhanced, the reinforced part is arranged on the periphery of the FPC circuit board, and the anti-tearing hole can play a good anti-tearing effect.
Claims (2)
1. An FPC circuit board, its characterized in that: the circuit board comprises a substrate layer, a first wiring layer is arranged on the substrate layer, an insulating layer is arranged on the first wiring layer, a second wiring layer is arranged on the insulating layer, a protective layer is arranged on the second wiring layer, an anti-static layer is arranged on the protective layer, the substrate layer is bonded with the first wiring layer, and the second wiring layer is bonded with the protective layer.
2. An FPC board as claimed in claim 1, wherein: the insulating layer is made of PET.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811529989.XA CN111328180A (en) | 2018-12-14 | 2018-12-14 | FPC circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811529989.XA CN111328180A (en) | 2018-12-14 | 2018-12-14 | FPC circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111328180A true CN111328180A (en) | 2020-06-23 |
Family
ID=71172279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811529989.XA Withdrawn CN111328180A (en) | 2018-12-14 | 2018-12-14 | FPC circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111328180A (en) |
-
2018
- 2018-12-14 CN CN201811529989.XA patent/CN111328180A/en not_active Withdrawn
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20200623 |
|
| WW01 | Invention patent application withdrawn after publication |