CN111319177B - Biomimetic adhesive material of mushroom-shaped end and preparation method thereof - Google Patents
Biomimetic adhesive material of mushroom-shaped end and preparation method thereof Download PDFInfo
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- CN111319177B CN111319177B CN202010137559.4A CN202010137559A CN111319177B CN 111319177 B CN111319177 B CN 111319177B CN 202010137559 A CN202010137559 A CN 202010137559A CN 111319177 B CN111319177 B CN 111319177B
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- 239000000463 material Substances 0.000 title claims abstract description 46
- 239000000853 adhesive Substances 0.000 title claims abstract description 36
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 36
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 230000003592 biomimetic effect Effects 0.000 title abstract description 9
- 239000011664 nicotinic acid Substances 0.000 claims abstract description 35
- 239000011521 glass Substances 0.000 claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 28
- 239000000741 silica gel Substances 0.000 claims description 26
- 229910002027 silica gel Inorganic materials 0.000 claims description 26
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 17
- 229910052710 silicon Inorganic materials 0.000 claims description 17
- 239000010703 silicon Substances 0.000 claims description 17
- 239000007788 liquid Substances 0.000 claims description 13
- 229920002120 photoresistant polymer Polymers 0.000 claims description 12
- 108010025899 gelatin film Proteins 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 10
- 239000010409 thin film Substances 0.000 claims description 10
- 239000010408 film Substances 0.000 claims description 7
- 239000000243 solution Substances 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- 238000003698 laser cutting Methods 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 238000004528 spin coating Methods 0.000 claims description 3
- 238000009987 spinning Methods 0.000 claims description 3
- 230000002209 hydrophobic effect Effects 0.000 claims description 2
- 239000011550 stock solution Substances 0.000 claims description 2
- 230000010062 adhesion mechanism Effects 0.000 abstract description 4
- 230000001788 irregular Effects 0.000 abstract description 4
- 238000009736 wetting Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 230000009194 climbing Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000036316 preload Effects 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 238000005411 Van der Waals force Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000037396 body weight Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004299 exfoliation Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/02—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C41/04—Rotational or centrifugal casting, i.e. coating the inside of a mould by rotating the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/02—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C41/14—Dipping a core
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B1/00—Devices without movable or flexible elements, e.g. microcapillary devices
- B81B1/006—Microdevices formed as a single homogeneous piece, i.e. wherein the mechanical function is obtained by the use of the device, e.g. cutters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
- B81C1/00055—Grooves
- B81C1/00071—Channels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
- B81C1/00111—Tips, pillars, i.e. raised structures
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Materials For Medical Uses (AREA)
Abstract
本发明公开了一种蘑菇状端头的仿生粘附材料及其制备方法。仿生粘附材料包括端头、柱体和基底；端头的下表面通过柱体连接到基底，上表面密布亚微米级别的沟壑结构。端头为圆形、多边形或不规则形状。制备方法包括制备硅‑玻璃模具和制备蘑菇状端头的仿生粘附材料。本发明可以为粘附机理的研究提供多种形状的蘑菇状端头仿生粘附材料。端头上表面自然形成的亚微米级别的沟壑结构，大幅度提升了仿生粘附材料的粘附性能。硅‑玻璃模具使得连接柱体与基底的接触端消除了圆角，进而在浸入预制液时可以充分的与预制液接触，增加了仿生粘附材料的结构强度。同时，连接柱体与基底之间形成的浸润圆角很好地提高了仿生粘附材料的结构强度。
The invention discloses a biomimetic adhesive material of a mushroom-shaped end and a preparation method thereof. The biomimetic adhesive material includes a tip, a cylinder and a base; the lower surface of the tip is connected to the base through the cylinder, and the upper surface is densely covered with submicron gully structures. The ends are round, polygonal or irregular in shape. The preparation method includes preparing a silicon-glass mold and preparing a biomimetic adhesive material for mushroom-shaped ends. The invention can provide mushroom-shaped end bionic adhesion materials in various shapes for the study of the adhesion mechanism. The sub-micron gully structure naturally formed on the top surface of the end greatly improves the adhesion performance of the bionic adhesive material. The silicon-glass mold eliminates the rounded corners of the contact end connecting the cylinder and the substrate, so that it can fully contact the prefabricated solution when immersed in the prefabricated solution, which increases the structural strength of the biomimetic adhesive material. At the same time, the wetting fillet formed between the connecting cylinder and the base greatly improves the structural strength of the biomimetic adhesive material.
Description
Technical Field
The invention relates to the technical field of bionic structure manufacturing in a micro-mechanical system, in particular to a bionic adhesion material of a mushroom-shaped end head and a preparation method thereof
Background
Adhesion (Adhesion) is a phenomenon in which objects exhibit attraction to each other when in contact. In nature, organisms have evolved footpads that can be used to climb, for example, a gecko that climbs freely. Inspired by the above, the study on the adhesion mechanism of gecko climbing has become a focus of attention of a plurality of subject groups at home and abroad. In 2000, Autumn et al reported in the Top-level journal, Nature, that the adhesion of gecko foot pads results from intermolecular forces, van der Waals forces. Arzt et al in 2003 proposed the principle of exfoliation and splitting by studying the relationship among organism body weight, footpad structure size, and adhesion properties. Currently, biomimetic adhesive materials have been applied in a variety of fields such as biomedical engineering, precision industrial manufacturing, and climbing robots. However, the bionic adhesive material has more structural parameters, which are related to each other, and finding a suitable set of structural parameters is still a complicated task. Moreover, the bionic adhesive materials of the mushroom-shaped ends are all round, so that the research on the adhesion mechanism of the bionic adhesive materials is greatly limited.
For the preparation of biomimetic adhesive materials, a great number of reports have been reported in the literature. At present, there are two main methods of preparation by inverse molding, i.e., an SOI silicon mold method and a double-layer photoresist mold method. The top layer of SOI silicon is etched to form a first layer of patterned structure by silicon etching, the silicon dioxide of the middle layer is etched to form a second layer of patterned structure by hydrofluoric acid, and the bionic adhesion material is prepared by soft materials such as silica gel and the like through a reverse mould method. Or, carrying out two times of etching on the spin-coated two layers of photoresist with different properties (positive and negative) to obtain the double-layer photoresist mould. Both of the above approaches, however, have limitations. The SOI silicon die method has low applicability, and one die can only prepare a bionic adhesive material with one structural size; and the size of the end head is only slightly larger than that of the column body, otherwise great difficulty is caused to demoulding; moreover, it is very costly. The double-layer photoresist mold is easily damaged at the time of mold release, and thus has no reusability.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides a bionic adhesive material of a mushroom-shaped end head and a preparation method thereof.
The technical scheme of the invention is as follows:
a bionic adhesive material of mushroom-shaped end comprises an end, a cylinder and a base; the lower surface of the end head is connected to the base through a column body, and submicron-level gully structures are densely distributed on the upper surface of the end head.
Further, the end head is circular, polygonal or irregular.
A preparation method of bionic adhesive material of mushroom-shaped end comprises the following steps:
the method comprises the following steps: preparing a silicon-glass mold comprising:
carrying out deep silicon etching on the silicon wafer from the upper surface to form a pit, wherein the depth of the pit is greater than the height of the column;
the silicon wafer is subjected to thinning, grinding and polishing treatment from the lower surface, so that the pits become through holes;
carrying out anodic bonding on the silicon wafer and the first glass substrate to obtain a silicon-glass mold;
carrying out hydrophobic treatment on the surface of the silicon-glass mold;
step two: preparing a bionic adhesive material of a mushroom-shaped end, comprising:
pouring the silica gel prefabricated liquid into a silicon-glass mold for spin coating, vacuumizing and curing;
stripping the cured silica gel film from the silicon-glass mold, wherein the silica gel film comprises a film layer and a cylinder with one end connected to the film layer;
adhering a thin film layer of the silica gel film to a second glass substrate with the upper surface coated with photoresist in a spinning mode;
laser cutting the thin film layer of the silica gel thin film around the cylinder, wherein the cutting depth is greater than the thickness of the thin film layer;
immersing the other end of the cylinder into a silica gel prefabricated liquid which is spin-coated on a third glass substrate;
and after the silica gel prefabricated liquid is solidified, dissolving the photoresist, and removing the second glass substrate and the part of the thin film layer, which is not connected with the cylinder, to obtain the bionic adhesive material with the mushroom-shaped end.
Further, the silica gel pre-prepared solution is Dow Corning 184, and the weight ratio of the silica gel pre-prepared solution is 10: preparing stock solution and curing solution according to the volume ratio of 1, and vacuumizing after preparation.
Further, the photoresist is AZ 5214.
The invention can provide mushroom-shaped end bionic adhesive materials with various shapes for the research of the adhesion mechanism. Due to thermal expansion and cold contraction, submicron-level gully structures are naturally formed on the upper surface of the end head, so that the adhesion performance of the bionic adhesion material is greatly improved. The contact end of the connecting cylinder and the substrate is eliminated by the silicon-glass mold, so that the connecting cylinder can be fully contacted with the prefabricated liquid when being immersed in the prefabricated liquid, and the structural strength of the bionic adhesive material is improved. Meanwhile, the infiltration fillet formed between the connecting column body and the substrate well improves the structural strength of the bionic adhesive material.
Drawings
FIG. 1 is a bionic adhesive material with mushroom-shaped end.
FIG. 2 shows another bionic adhesive material with mushroom-shaped ends.
Fig. 3 shows a submicron-scale gap structure on the top surface of the tip.
FIG. 4 is a working principle of the bionic adhesion material with mushroom-shaped ends.
FIG. 5 shows the results of adhesion strength test of the biomimetic adhesive material with mushroom-shaped tips.
FIG. 6 is a preparation method of a bionic adhesive material with mushroom-shaped ends.
In the figure: 1-end, 2-connecting column and 3-base.
Detailed Description
The invention is further described with reference to the following figures and specific embodiments.
Referring to fig. 1, the bionic adhesive material structure of the mushroom-shaped end comprises an end 1, a connecting cylinder 2 and a base 3, wherein the end 1 and the connecting cylinder 2 form a mushroom-shaped end structure, and the other end of the connecting cylinder 2 is connected with the base 3.
Referring to fig. 1, the head 1 has a size larger than that of the coupling cylinder 2.
Referring to fig. 1 and 2, the tip 1 may be circular, polygonal, and other irregular shapes.
Referring to fig. 3, submicron-level gully structures are densely distributed on the upper surface of the end.
Referring to fig. 4, the working principle of the bionic adhesion material of the mushroom-shaped end is as follows:
under the action of preload, the adhesive material is contacted with the glass substrate; when the preload is reversed, the adhesive material adheres to the glass substrate until peeling occurs. The submicron-level gully structure densely distributed on the upper surface of the mushroom-shaped end can greatly reduce the contact rigidity, increase the contact area and generate a hook-lock effect with the irregular bulges on the glass substrate, so that the adhesion performance of the bionic adhesion material can be greatly improved.
Referring to fig. 5, the bionic adhesive material of the mushroom-shaped tip has an adhesive strength more than 3 times that of the conventional bionic adhesive material.
Referring to fig. 6, the preparation method of the bionic adhesion material of the mushroom-shaped tip is divided into two parts, specifically:
part (a) preparation of a silicon-glass mold.
S1: and (3) ultrasonically cleaning a silicon wafer with the thickness of 500 microns by using acetone, absolute ethyl alcohol and deionized water in sequence, and then carrying out deep silicon etching on the silicon wafer to form a pit. The etch depth was 280 microns, 30 microns greater than the height of the connecting pillars.
S2: and (3) shearing, grinding and polishing the etched silicon wafer from the lower surface to enable the etched pits to be through holes, wherein the residual thickness is 250 micrometers.
S3: and carrying out anodic bonding on the rest silicon wafers and the glass substrate to obtain the silicon-glass mold.
S4: and performing surface hydrophobization treatment on the silicon-glass mold after anodic bonding.
The silicon-glass mold obtained in the way eliminates the round angle at the bottom of the pit, and the connecting cylinder can be fully contacted with the prefabricated liquid when being immersed in the prefabricated liquid, so that the structural strength of the bionic adhesive material is increased.
Preparing the bionic adhesive material of the mushroom-shaped end of part (II).
S1: preparing a silica gel prefabricated liquid (Dow Corning 184) according to the volume ratio of 10:1, and vacuumizing. And then pouring the prefabricated liquid onto a silicon-glass mold for spin coating, vacuumizing and curing.
S2: and stripping the cured silica gel film, wherein the silica gel film comprises a film layer on the upper surface of the mold and a connecting cylinder in the pit. And (3) turning the silica gel film to enable the film layer of the silica gel film to be adhered to the glass substrate of which the upper surface is coated with the photoresist AZ5214 serving as a sacrificial layer in a spinning mode.
S3: carrying out patterned laser cutting on the silica gel film, wherein the cutting depth is slightly larger than the thickness of the film;
s4: immersing the other end of the connecting column body into silica gel prefabricated liquid spin-coated on a glass substrate;
s5: after curing, the sacrificial layer AZ5214 is dissolved.
The bionic adhesive material with the mushroom-shaped end can be obtained by the method.
Other similar materials may be used for the silica gel pre-solution and the photoresist.
Claims (3)
1. A preparation method of bionic adhesion material of mushroom-shaped end is characterized by comprising the following steps:
the method comprises the following steps: preparing a silicon-glass mold comprising:
carrying out deep silicon etching on the silicon wafer from the upper surface to form a pit, wherein the depth of the pit is greater than the height of the column;
the silicon wafer is subjected to thinning, grinding and polishing treatment from the lower surface, so that the pits become through holes;
carrying out anodic bonding on the silicon wafer and the first glass substrate to obtain a silicon-glass mold;
carrying out hydrophobic treatment on the surface of the silicon-glass mold;
step two: preparing a bionic adhesive material of a mushroom-shaped end, comprising:
pouring the silica gel prefabricated liquid into a silicon-glass mold for spin coating, vacuumizing and curing;
stripping the cured silica gel film from the silicon-glass mold, wherein the silica gel film comprises a film layer and a cylinder with one end connected to the film layer;
adhering a thin film layer of the silica gel film to a second glass substrate with the upper surface coated with photoresist in a spinning mode;
laser cutting the thin film layer of the silica gel thin film around the cylinder, wherein the cutting depth is greater than the thickness of the thin film layer;
immersing the other end of the cylinder into a silica gel prefabricated liquid which is spin-coated on a third glass substrate;
and after the silica gel prefabricated liquid is solidified, dissolving the photoresist, and removing the second glass substrate and the part of the thin film layer, which is not connected with the cylinder, to obtain the bionic adhesive material with the mushroom-shaped end.
2. The method of claim 1, wherein the pre-formed silica gel solution is Dow Corning 184, in a ratio of 10: preparing stock solution and curing solution according to the volume ratio of 1, and vacuumizing after preparation.
3. The method of claim 1, wherein the photoresist is AZ 5214.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101774528A (en) * | 2010-01-04 | 2010-07-14 | 中国科学院合肥物质科学研究院 | Cross-scale biomimetic micro-nano branch structure array and preparation method thereof |
| CN108017035A (en) * | 2016-10-28 | 2018-05-11 | 中国科学院深圳先进技术研究院 | A kind of bionic gecko dry glue and preparation method thereof |
| KR101863817B1 (en) * | 2017-01-17 | 2018-06-01 | 울산과학기술원 | Manufacturing method of dry adhesive structure |
| CN109273366A (en) * | 2018-07-17 | 2019-01-25 | 西南交通大学 | Method for preparing flexible structure of "island-connecting cylinder-substrate" structure |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5879794A (en) * | 1994-08-25 | 1999-03-09 | W. L. Gore & Associates, Inc. | Adhesive-filler film composite |
| US8563117B2 (en) * | 2006-08-04 | 2013-10-22 | Phillip B. Messersmith | Biomimetic modular adhesive complex: materials, methods and applications therefore |
| US8524092B2 (en) * | 2006-12-14 | 2013-09-03 | Carnegie Mellon University | Dry adhesives and methods for making dry adhesives |
| KR20090055951A (en) * | 2007-11-29 | 2009-06-03 | 한국기계연구원 | Dry Attachment Manufacturing Method Using Simple Molding |
| US9159595B2 (en) * | 2010-02-09 | 2015-10-13 | Suss Microtec Lithography Gmbh | Thin wafer carrier |
| CN101823685B (en) * | 2010-04-30 | 2012-03-28 | 华中科技大学 | A kind of preparation method of biomimetic micro-nano structure |
| EP2804919A4 (en) * | 2012-01-19 | 2015-09-09 | Univ Tulane | USE OF A SHEAR TO INCORPORATE AN INCLINATION IN THE MICROSTRUCTURE OF REVERSIBLE ADHESIVES INSPIRED BY GECKO |
| US20210347092A1 (en) * | 2018-08-14 | 2021-11-11 | Texas Tech University System | Methods and systems for making tilted and curved structures with high aspect ratios |
| CN109533960B (en) * | 2018-12-13 | 2020-05-15 | 西安交通大学 | A vacuum adsorption structure assisted by gecko bionic structure and its production method |
| CN110355911A (en) * | 2019-07-12 | 2019-10-22 | 南京航空航天大学 | A kind of feet imitates the preparation method of gecko pasting material |
| CN110642222B (en) * | 2019-09-29 | 2022-12-30 | 中国科学技术大学 | High-length-diameter-ratio micron column array, and preparation method and application thereof |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101774528A (en) * | 2010-01-04 | 2010-07-14 | 中国科学院合肥物质科学研究院 | Cross-scale biomimetic micro-nano branch structure array and preparation method thereof |
| CN108017035A (en) * | 2016-10-28 | 2018-05-11 | 中国科学院深圳先进技术研究院 | A kind of bionic gecko dry glue and preparation method thereof |
| KR101863817B1 (en) * | 2017-01-17 | 2018-06-01 | 울산과학기술원 | Manufacturing method of dry adhesive structure |
| CN109273366A (en) * | 2018-07-17 | 2019-01-25 | 西南交通大学 | Method for preparing flexible structure of "island-connecting cylinder-substrate" structure |
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