CN111312642A - A silicon wafer extraction and positioning device and transfer system - Google Patents

Abstract

The invention discloses a silicon wafer drawing and placing positioning device and a transferring system, and belongs to the technical field of silicon wafer manufacturing equipment. The invention discloses a silicon wafer drawing and positioning device which comprises a drawing and placing mechanism and a positioning mechanism, wherein the drawing and placing mechanism comprises a drawing and placing part, a driving mechanism and a slide rail, and a plurality of positioning stations are arranged on a positioning table of the positioning mechanism; the driving mechanism drives the drawing and placing piece to move on the sliding rail along the first direction, and meanwhile, the vacuum chuck of the drawing and placing piece and the positioning table move relatively in the second direction, so that silicon wafers are placed in different positioning stations arranged along the first direction on the positioning table, the drawing and placing positioning of a plurality of silicon wafers in the flower basket is completed, the contact friction between the silicon wafers and the drawing and placing positioning device is avoided, and the silicon wafers are prevented from being damaged in the drawing and placing positioning process to reduce the power generation efficiency of the prepared solar cell. The silicon wafer transfer system is convenient to use, the silicon wafer is not easy to damage in the transfer process, and the yield of the silicon wafer is improved.

Description

A silicon wafer extraction and positioning device and transfer system

technical field

The invention relates to the technical field of silicon wafer manufacturing equipment, and more particularly, to a silicon wafer extraction and positioning device and a transfer system.

Background technique

With the development of the photovoltaic industry, people have higher and higher requirements for the quality of silicon wafers. At present, in the production process of silicon wafers, the silicon wafers need to be cleaned and textured, and after the processing is completed, the silicon wafers stacked in the flower basket need to be taken out in turn and placed in the carrier plate, and then the silicon wafers are transported to the downstream process.

The Chinese patent document entitled a silicon wafer transfer device and a silicon wafer transfer system (application number 2018212059743) for invention and creation discloses a device for transferring silicon wafers by means of negative pressure adsorption. The device includes a transport table, a suction The assembly and the limiting structure, the transport table is used to transport the first silicon wafer and the second silicon wafer to the designated position successively; the suction assembly is located above the designated position and can align the first silicon wafer that arrives at the designated position first, so that the first silicon wafer reaches the designated position first. A accommodating space for accommodating the second silicon wafer is formed between a silicon wafer and the transport table; the limiting structure corresponds to a designated position. In the silicon wafer transfer device, the first silicon wafer that first reaches the designated position is separated from the transport table under the force of the suction assembly, and the second silicon wafer is transported into the accommodating space through the transport table, so that the second silicon wafer is located in the first silicon wafer. The bottom of a silicon wafer, so as to realize the stacking of silicon wafers during transportation; and the limit structure can limit the position of the first silicon wafer and the second silicon wafer, avoid the deviation of the first silicon wafer or the second silicon wafer, which is beneficial to the silicon wafer. Shipping and stacking of sheets.

However, unlike the above-mentioned silicon wafer transfer device, after the silicon wafer is taken out from the flower basket, it needs to be positioned and arranged on the extraction positioning device in an orderly manner, so as to facilitate the group transfer of silicon wafers .

The existing silicon wafer extraction, positioning and transfer systems also use the belt transmission method to transfer the silicon wafers. Referring to Figures 1 and 2, after the lift drive mechanism lifts the flower basket to a preset position, the extraction and positioning device equipped with the carrier plate extends toward the flower basket and extends under the flower basket, and then the flower basket descends, so that the silicon inside the flower basket is lowered. The wafer is in contact with the conveyor belt of the extraction and positioning device, and the conveyor belt takes out the silicon wafers in the flower basket in turn. At the same time, during the transfer process, by controlling the lifting and lowering of the flower basket and the operation of the conveyor belt, multiple silicon wafers can be arranged neatly on the conveyor belt.

However, in the process of frictional contact between the transfer belt and the silicon wafer, the transfer belt easily damages the surface of the silicon wafer, thereby reducing the product yield.

SUMMARY OF THE INVENTION

1. The technical problem to be solved by the invention

The purpose of the present invention is to overcome the deficiencies in the prior art that silicon wafers are easily damaged by contact and friction with the extraction and positioning device during the transfer process, and provide a silicon wafer extraction and positioning device. In this scheme, the pumping part is driven to move on the slide rail by the driving mechanism, and the vacuum suction cup and the positioning table are controlled to move relatively in the second direction, so that the silicon wafers are taken out from the flower basket and placed in different positioning stations to prevent the silicon wafers from being damaged. The contact friction between the sheet and the extraction and positioning device.

Another object of the present invention is to provide a silicon wafer transfer system. The transfer system of this solution is easy to use, and the silicon wafer is not easily damaged during the transfer process, which is helpful to improve the yield of the silicon wafer.

2. Technical solutions

In order to achieve the above object, the technical scheme provided by the invention is:

A silicon wafer extraction and positioning device of the present invention is used for taking out the silicon wafers in the flower basket, comprising:

a positioning mechanism, wherein a plurality of positioning stations are arranged along the first direction on the positioning table of the positioning mechanism;

a pumping and unloading mechanism, the pumping and unloading mechanism includes a pumping part, a sliding rail and a driving mechanism, a vacuum suction cup is arranged on the pumping part; the sliding rail is arranged along the first direction;

The silicon wafer extraction and positioning device is configured such that: the drive mechanism drives the extraction member to move on the slide rail, and the vacuum suction cup and the positioning table can move relatively in the second direction, so as to remove the silicon wafers. Sheets are placed on different said positioning stations.

Further, the positioning mechanism further includes a lifting member, and the positioning platform is arranged on the moving end of the lifting member.

Further, a lifting mechanism is also included, and the lifting mechanism is used to drive the drawing mechanism to move in the second direction relative to the positioning mechanism.

Further, the positioning table includes a first positioning member and a second positioning member, the upper sides of the first positioning member and the second positioning member are arranged in the same plane, and the first positioning member and the second positioning member are arranged in the same plane. The pieces are located on both sides of the slide rail.

Further, the extracting member further includes a sliding seat slidably matched with the sliding rail, and the vacuum suction cup is arranged on the support portion of the sliding seat.

Further, an adsorption hole is opened on the upper side of the vacuum suction cup, and a vacuum generator is arranged on the sliding seat, and the vacuum generator is used to form a negative pressure environment between the upper side of the vacuum suction cup and the silicon wafer.

Further, the first positioning member and the second positioning member are provided with positioning portions at corresponding positions, and the positioning portion of the first positioning member and the positioning portion of the second positioning member cooperate to form the positioning station.

Further, the positioning part is provided with a first positioning bump and a second positioning bump, the first positioning bump is used to limit the position of the silicon wafer in the first direction, the second positioning bump The dots are used to limit the position of the silicon wafer in a third direction, the third direction being perpendicular to the second direction.

A silicon wafer transfer system of the present invention includes at least one transfer unit, the transfer unit includes a flower basket, and an extraction and positioning device for taking out silicon wafers in the flower basket, wherein the extraction and positioning device is The above-mentioned extraction and positioning device.

Further, there are at least two transfer units, and the extraction and positioning devices of the at least two transfer units are arranged in a third direction.

3. Beneficial effects

Adopting the technical scheme provided by the present invention, compared with the prior art, has the following beneficial effects:

(1) A silicon wafer extraction and positioning device of the present invention, the drive mechanism of the extraction mechanism drives the extraction part to move along the first direction on the slide rail, and the vacuum suction cup of the extraction part and the positioning table are in the second Relatively moving in the direction, so that the silicon wafers are placed in different positioning stations arranged along the first direction on the positioning table, and the extraction and positioning of multiple silicon wafers in the flower basket is completed, avoiding the gap between the silicon wafers and the extraction positioning device. Therefore, the silicon wafer is prevented from being damaged during the extraction and positioning process, thereby reducing the power generation efficiency of the prepared solar cell.

(2) In the present invention, the pumping part further comprises a sliding seat that is slidingly matched with the sliding rail, the vacuum suction cup is arranged on the support part of the sliding seat; the upper side of the vacuum suction cup is provided with an adsorption hole, and the sliding seat is provided with a vacuum generator , the vacuum generator is used to form vacuum adsorption between the upper side of the vacuum suction cup and the silicon wafer, so only a small adsorption force can be used to fix the vacuum suction cup and the silicon wafer, so as to prevent the suction force of the vacuum suction cup from being too strong. A mark is formed on the surface of the silicon wafer to avoid damage to the silicon wafer during the extraction and positioning process.

(3) A silicon wafer transfer system of the present invention is composed of at least one transfer unit, and the transfer unit includes a flower basket and a pumping and positioning device, which is easy to use, and the silicon wafer is not easily damaged during the transfer process, which improves the yield of the silicon wafer; When there are at least two transfer units, the pumping and positioning devices between different transfer units are arranged side by side, which is convenient for synchronously transporting the silicon wafers on the positioning table in the multiple pumping and positioning devices to the downstream process, which improves the production efficiency of solar cells.

Description of drawings

1 is a schematic structural diagram of an existing silicon wafer transfer system;

2 is a schematic structural diagram of an existing silicon wafer extraction and positioning device;

3 is a schematic structural diagram of the silicon wafer extraction and positioning device of the present invention;

4 is a schematic structural diagram of a positioning mechanism in the present invention;

Fig. 5 is the structural representation of the drawing and discharging mechanism in the present invention;

6 is a schematic structural diagram of the silicon wafer transfer system of the present invention;

FIG. 7 is a schematic diagram of the arrangement of the transfer units in the present invention.

Description of the symbols in the schematic diagram: 100, storage device; 110, flower basket; 120, extraction part; 130, lifting part; 200, belt extraction and positioning device; 210, conveyor belt; 300, positioning mechanism; 310, positioning table; 311 312, the second positioning piece; 320, the positioning station; 321, the first positioning bump; 322, the second positioning bump; 323, the sensor; 330, the jacking piece; 331, the screw die group; 332, drive motor; 400, extraction mechanism; 410, extraction part; 411, vacuum suction cup; 412, vacuum generator; 413, support part; 414, sliding seat; 420, slide rail; 430, driving mechanism; 431, driving part; 432, transmission part; 500, silicon wafer.

Detailed ways

In order to further understand the content of the present invention, the present invention will be described in detail with reference to the accompanying drawings and embodiments.

The structures, proportions, sizes, etc. shown in the accompanying drawings of this specification are only used to cooperate with the contents disclosed in the specification for the understanding and reading of those who are familiar with the technology, and are not used to limit the conditions for the implementation of the present invention. Therefore, Without technical substantive significance, any structural modification, proportional relationship change or size adjustment should still fall within the technology disclosed in the present invention without affecting the effect that the present invention can produce and the purpose that can be achieved. The content must be within the scope of coverage. At the same time, terms such as "up", "down", "left", "right", "middle", etc. quoted in this specification are only for the convenience of description and clarity, and are not used to limit the scope of implementation. The change or adjustment of the relative relationship shall also be regarded as the scope of the present invention without substantially changing the technical content.

Referring to FIG. 1 , in the related art, after the cleaning and texturing process of solar silicon wafers, the silicon wafers in the flower basket are usually extracted and positioned in a plurality of positioning stations of the positioning table by means of belt conveying. Specifically, referring to FIG. 2 , the belt-type drawing and positioning device 200 is provided with a transmission belt 210 . When the device extracts and locates the silicon wafers, the front end of the conveyor belt 210 protrudes toward the storage device 100 and extends under the flower basket 110 , and the silicon wafer 500 is released from the flower basket 110 under the action of the pull-out member 120 and contacts the conveyor belt 210, and then continue to be transported by the conveyor belt 210 to a preset position.

In this belt conveying method, when the silicon wafer 500 is extracted and positioned, the silicon wafer 500 is in contact with the conveyor belt 210, and at the same time, it relies on the friction force between itself and the belt to achieve movement, so it is easy to move on the surface of the silicon wafer 500. The formation of belt marks even makes it easy to hide dirt in the belt marks, thereby affecting the power generation efficiency of the prepared solar cells and reducing the yield of products.

The silicon wafer extraction and positioning device of this embodiment uses vacuum adsorption to extract the silicon wafer from the flower basket and place it on the positioning table of the positioning mechanism, which can avoid frictional contact between the surface of the silicon wafer and other components in the system as much as possible. , which can effectively avoid damage to the surface of the silicon wafer during the extraction and positioning process. At the same time, the silicon wafer transfer system equipped with the extraction and positioning device of the present embodiment is convenient to use, has high efficiency, and has good product protection.

Example 1

3 , the silicon wafer extraction and positioning device of this embodiment includes a positioning mechanism 300 and an extraction mechanism 400, wherein the extraction mechanism 400 is used to extract the silicon wafer 500 in the flower basket 110 and put it into the positioning mechanism 300, The positioning mechanism 300 is used to position the multiple silicon wafers 500 on it, so as to facilitate the group transfer of the multiple silicon wafers 500 to the downstream process.

The positioning mechanism 300 includes a positioning table 310 . The positioning table 310 is arranged with a plurality of positioning stations 320 arranged along the first direction, and the positioning stations 320 are used for accommodating a single silicon wafer 500 . The drawing-out mechanism 400 is attached to the positioning mechanism 300 , and includes a drawing-out member 410 , a sliding rail 420 and a driving mechanism 430 . Wherein, a vacuum suction cup 411 for adsorbing the silicon wafer 500 is arranged on the extraction part 410; the slide rail 420 is arranged along the first direction, that is, the slide rail 420 is arranged parallel to the upper side of the positioning table 310; the extraction part 410 and the slide rail 420 is a slip fit.

The driving mechanism 430 is used to drive the draw-out member 410 to slide on the slide rail 420, and the driving mechanism 430 may be a chain drive mechanism or a belt drive mechanism. Specifically, the driving mechanism 430 may include a driving member 431 and a transmission member 432. The driving member 431 may be a motor, such as a servo motor or a stepping motor. The driving member 431 drives the extraction member 410 to move through the transmission member 432, and the transmission member 432 may Either the drive chain or the drive belt.

In order to facilitate the placement of the silicon wafer 500 on the positioning table 310, and to prevent the positioning table 310 from interfering with the movement of the extraction member 410, the extraction member 410 and the positioning table 310 should be relatively movable in the second direction, so as to achieve mutual avoidance of the two. The second direction specifically refers to the direction disposed on the upper side of the positioning table 310 . For example, in FIG. 3 , the first direction and the upper side of the positioning table 310 are both horizontal directions, and the second direction is the vertical direction.

Specifically, referring to FIG. 4 , the positioning mechanism 300 of this embodiment may further include a lifting member 330 , the lifting member 300 may be fixedly arranged on the bottom surface or the base, and the moving end thereof is connected with the positioning table 310 , for example It is connected to the lower side of the positioning table 310 , or is connected to at least one side of the left and right sides of the positioning table 310 . When the moving end of the lifting member 300 moves up or down, the positioning table 310 connected to it will rise or fall relative to the extraction member 410 , so that the positioning table 310 can be relative to the vacuum suction cup 411 in the extraction member 410 . The adsorbed silicon wafer 500 rises or falls.

The lifting member 330 may be an air cylinder or a hydraulic cylinder, and the moving end of the air cylinder or the hydraulic cylinder is connected with the positioning table. The lifter 330 can also be composed of a lead screw module 331 and a drive motor 332, so that the drive motor 332 controls the positioning stage to move in the second direction through the lead screw module 331. The drive motor 332 can be a servo motor or a stepping motor. motor.

As an implementation of this embodiment, the positioning table 310 may specifically be composed of a first positioning member 311 and a second positioning member 312 arranged in parallel. The upper sides of the first positioning member 311 and the second positioning member 312 are located in the same plane, and the first positioning member 311 and the second positioning member 312 are respectively located on both sides of the slide rail 420 , that is, the extraction member 410 on the slide rail 420 It can move along the first direction between the first positioning member 311 and the second positioning member 312 .

When the vacuum chuck 411 of the extraction part 410 adsorbs the silicon wafer 500, the positioning table 310 moves from the bottom to the top of the silicon wafer 500 relative to the extraction part 410, and the first positioning part 311 and the second positioning part 312 are respectively connected with The two edges of the silicon wafer 500 are in contact. At this time, the adsorption state of the vacuum chuck 411 is destroyed, and the silicon wafer 500 can be separated from the vacuum chuck 411 , and the silicon wafer 500 can be placed on the positioning table 310 to complete the removal of the silicon wafer 500 from the flower basket 110 Extraction to positioning mechanism 300 .

In order to realize the lifting and accommodating of the silicon wafer 500 by the first positioning member 311 and the second positioning member 312, the first positioning member 311 and the second positioning member 312 are provided with positioning portions at corresponding positions. Specifically, the positioning portion may be a groove, and the shape of the groove corresponds to the shape of the silicon wafer 500. The first positioning member 311 and the second positioning member 312 lift the silicon wafer 500 from the vacuum suction cup 411. The edge of the 500 can be snapped into the groove, so as to realize the automatic positioning of the silicon wafer 500 .

As another possible implementation manner, the positioning portion may also be surrounded by the first positioning bumps 321 and the second positioning bumps 322 . Specifically, the first positioning bumps 321 are used to limit the displacement of the silicon wafer 500 in the first direction, that is, the first positioning bumps 321 are matched with the edge of the silicon wafer 500 perpendicular to the first direction; the second positioning bumps 322 For limiting the displacement of the silicon wafer 500 in the third direction, that is, the second positioning bumps 322 are matched with the edge of the silicon wafer 500 perpendicular to the third direction. The third direction is perpendicular to the second direction and perpendicular to the first direction, so that the silicon wafer 500 can be positioned by restricting the two directions of freedom of the silicon wafer 500 in the plane where the upper side of the positioning table 310 is located.

There are at least two first positioning bumps 321 , and the two first positioning bumps 321 are located on different sides of the silicon wafer 500 . In addition, adjacent positioning stations 320 may share one first positioning bump 321 . At least one second positioning bump 322 is set. When one second positioning bump 322 is set, the same positioning station 320 is connected to the second positioning bump 322 on the first positioning member 311 and the second positioning member 312 The straight line may be perpendicular to the first direction; when there are more than two second positioning bumps 322, the positions of the second positioning bumps 322 on the first positioning member 311 and the second positioning member 312 of the same positioning station 320 may be correspond to each other, thereby improving the positioning accuracy of the positioning station 320 .

As a further optimization of this embodiment, the first positioning bumps 321 and the second positioning bumps 322 may have rounded corners, that is, the first positioning bumps 321 and the second positioning bumps 322 may have a structure that is large at the top and small at the bottom , such as a circular truncated structure, so as to facilitate the edge of the silicon wafer 500 to be clamped, and prevent the edge of the silicon wafer 500 from being damaged due to extrusion.

5 , the drawing member 410 of the drawing mechanism 400 may specifically include a sliding seat 414 slidably matched with the sliding rail 420 , the sliding seat 414 is provided with a support portion 413 , and the support portion 413 is provided with a vacuum suction cup 411 . The vacuum suction cup 411 may be disposed higher than the sliding seat 414 , so as to prevent mutual interference between the sliding rail 420 and the positioning table 310 .

One end of the vacuum suction cup 411 can be connected to the support portion 413 , and the other end of the vacuum suction cup 411 can be suspended above the slide rail 420 , so that the vacuum suction cup 411 can be easily extended into the flower basket 110 . The vacuum generator 412 for forming a negative pressure environment between the vacuum suction cup 411 and the silicon wafer 500 can be set on the sliding seat 414, on the support part 413, or on the ground or the base; vacuum The specific structure of the generator is not limited, and may be a vacuum generator commonly used in related fields, and may be implemented according to known content in the prior art or a method suggested by a manufacturer, and thus the relevant content will not be repeated in this embodiment.

As a further optimization, the suction hole of the suction part 410 can be arranged on the upper side of the vacuum suction cup 411 , that is, the silicon wafer 500 is placed on the upper side of the vacuum suction cup 411 when the suction member is pumping the silicon wafer 500 . Therefore, the adsorption force between the vacuum suction cup 411 and the silicon wafer 500 only needs to oppose the air resistance and/or the inertia of the silicon wafer 500 to change the motion state of the silicon wafer 500 . Therefore, compared with opening the suction holes on the lower side of the vacuum suction cup 411 , the method of opening the suction holes on the upper side of the vacuum suction cup 411 requires less suction force, which can prevent the surface of the silicon wafer 500 from being too large due to the suction force. Snap marks appear.

Referring to FIG. 6 , this embodiment further provides a silicon wafer transfer system. The silicon wafer transfer system includes at least one silicon wafer transfer unit, and the silicon wafer transfer unit specifically includes a flower basket 110 and an extraction and positioning device for taking out the silicon wafer 500 in the flower basket 110 .

Since the silicon wafers 500 in the flower basket 110 are stacked along the second direction, in order to facilitate the removal of multiple wafers 500, the wafer transfer unit may further include a lifting member 130, which may be an air cylinder or an oil pressure Cylinder, or motor, when the lifting part is a motor, it can be driven by a belt module or a screw module.

When the wafer transfer system includes more than two wafer transfer units, the flower baskets 110 of different wafer transfer units can be arranged in the same storage device 100 . Different flower baskets 110 can be lifted and lowered respectively through different lifting members 130 , or can be lifted and lowered simultaneously through the same lifting member 130 . Referring to FIG. 7 , the extraction and positioning devices of different wafer transfer units can be arranged along the third direction, so that all positioning stations in the wafer transfer system are distributed in an orthogonal array, which is convenient for multiple pumping and positioning devices. The silicon wafers on the positioning table are transported to the downstream process synchronously.

As an illustration, the working process of the silicon wafer transfer system in this embodiment may be:

After the flower basket 110 is lifted to the preset position, the extractor 410 moves toward the flower basket 110 along the slide rail 420 , the vacuum suction cup 411 enters under the silicon wafer 500 in the flower basket 110 , and the silicon wafer 500 falls with the flower basket 110 and falls on the vacuum suction cup 411 On the other hand, under the action of the vacuum generator 412 , the vacuum suction cup 411 forms a vacuum between the vacuum suction cup 411 and the silicon wafer 500 , and the silicon wafer 500 is adsorbed on the vacuum suction cup 411 . The extractor 410 moves along the slide rail 420 away from the flower basket 110 , and then stops at the position corresponding to the positioning station 320 , and then performs vacuum breaking. The positioning mechanism 300 rises, and after the silicon wafer 500 falls into the positioning station 320, the extractor 410 moves along the slide rail 420 toward the flower basket 110, so that the vacuum suction cup 411 returns to the lower part of the silicon wafer 500 in the flower basket 110 to wait for the next silicon wafer 500 descends, at this time, the positioning mechanism 300 descends, and the process repeats, thereby sequentially extracting and positioning the plurality of silicon wafers 500 in the flower basket 110 .

Example 2

In this embodiment, the positioning mechanism 300 is fixed relative to the ground or the base, and the vacuum suction cup 411 of the extraction mechanism 400 can move relative to the positioning mechanism 300 in the second direction.

Specifically, as an embodiment, the silicon wafer extraction and positioning device further includes a lifting mechanism, and the lifting mechanism is used to drive the extraction structure 400 to move in the second direction. The lifting mechanism can be an air cylinder, a hydraulic cylinder, or a motor. When the lifting member is a motor, a belt module or a screw module can be used for transmission. The lifting mechanism is fixed on the ground or the base, and the slide rail 420 of the extraction structure 400 is connected with the moving end of the lifting mechanism, so as to realize the lifting and lowering of the extraction structure 400 , thereby realizing the lifting and lowering of the vacuum suction cup 411 relative to the positioning table 310 .

As another embodiment, in the extraction member 410 of the extraction and extraction mechanism 400 , the sliding seat 414 and the vacuum suction cup 411 can move relatively in the second direction. The support portion 413 may be a telescopic structure, which can be extended and retracted to control the lifting and lowering of the vacuum suction cup 411 relative to the sliding seat 414 , and the support portion 413 may specifically be an air cylinder, a hydraulic cylinder, or a motor.

The present invention and its embodiments have been described above schematically, and the description is not restrictive, and what is shown in the accompanying drawings is only one of the embodiments of the present invention, and the actual structure is not limited thereto. Therefore, if those of ordinary skill in the art are inspired by it, without departing from the purpose of the present invention, any structural modes and embodiments similar to this technical solution are designed without creativity, which shall belong to the protection scope of the present invention. .

Claims (10)

1. A silicon wafer drawing and positioning device is used for taking out silicon wafers (500) in a flower basket (110), and is characterized in that: comprises the steps of (a) preparing a mixture of a plurality of raw materials,

the positioning mechanism (300), a plurality of positioning stations (320) are arranged on a positioning table (310) of the positioning mechanism (300) along a first direction;

the drawing and releasing mechanism (400), the drawing and releasing mechanism (400) comprises a drawing and releasing piece (410), a sliding rail (420) and a driving mechanism (430), and a vacuum sucker (411) is arranged on the drawing and releasing piece (410); the sliding rail (420) is arranged along a first direction;

the silicon wafer drawing and positioning device is configured to: the driving mechanism (430) drives the drawing and placing piece (410) to move on the sliding rail (420), and the vacuum chuck (411) and the positioning table (310) can move relatively in a second direction so as to place the silicon wafer (500) on different positioning stations (320).

2. The silicon wafer drawing and positioning device according to claim 1, wherein: the positioning mechanism (300) further comprises a jacking piece (330), and the positioning table (310) is arranged on the moving end of the jacking piece (330).

3. The silicon wafer drawing and positioning device according to claim 1, wherein: the drawing and releasing mechanism (400) is driven to move along a second direction relative to the positioning mechanism (300).

4. The silicon wafer drawing and positioning device according to any one of claims 1 to 3, wherein: the positioning table (310) comprises a first positioning piece (311) and a second positioning piece (312), the upper side faces of the first positioning piece (311) and the second positioning piece (312) are configured in the same plane, and the first positioning piece (311) and the second positioning piece (312) are located on two sides of the sliding rail (420).

5. The silicon wafer drawing and positioning device according to claim 4, wherein: the drawing and releasing piece (410) further comprises a sliding seat (414) in sliding fit with the sliding rail (420), and the vacuum sucker (411) is arranged on a supporting part (413) of the sliding seat (414).

6. The silicon wafer drawing and positioning device according to claim 5, wherein: the upper side surface of the vacuum chuck (411) is provided with an adsorption hole, the sliding seat (414) is provided with a vacuum generator (412), and the vacuum generator (412) is used for forming a negative pressure environment between the upper side surface of the vacuum chuck (411) and the silicon wafer (500).

7. The silicon wafer drawing and positioning device according to claim 4, wherein: the first positioning piece (311) and the second positioning piece (312) are provided with positioning parts at corresponding positions, and the positioning parts of the first positioning piece (311) and the second positioning piece (312) are matched to form the positioning station (320).

8. The silicon wafer drawing and positioning device according to claim 7, wherein: the positioning part is provided with a first positioning salient point (321) and a second positioning salient point (322), the first positioning salient point (321) is used for limiting the position of the silicon chip (500) in the first direction, the second positioning salient point (322) is used for limiting the position of the silicon chip (500) in the third direction, and the third direction is perpendicular to the second direction.

9. A silicon wafer transfer system comprising at least one transfer unit, said transfer unit comprising a basket (110) and a take-and-place positioning device for taking out silicon wafers (500) from said basket (110), characterized in that: the drawing and releasing positioning device is the drawing and releasing positioning device as claimed in any one of claims 1-8.

10. The wafer transfer system of claim 9, wherein: the transfer units are at least arranged in two, and the drawing and placing positioning devices of the at least two transfer units are arranged along a third direction.

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