Transmit-receive frequency division full duplex common-caliber phased array antenna
Technical Field
The invention relates to the technical field of antennas, in particular to a receiving and transmitting frequency division full duplex common-caliber phased array antenna.
Background
The system that adopts the full duplex mode of receiving and dispatching frequency division in order to satisfy communication service's demand among millimeter wave satellite communication etc. application fields, traditional terminal equipment generally adopts fixed wave beam antenna (such as reflector antenna) to combine mechanical scanning, to different receiving and dispatching operating frequency, can share same reflector, only need to use different feed sources and radio frequency front end respectively according to the difference of receiving and dispatching frequency, realize the transmission and the receipt of signal simultaneously at different receiving and dispatching frequency, simultaneously, on the basis of frequency division, further adopt the polarization isolation form of receiving and dispatching different rotation direction circular polarization to realize receiving and dispatching isolation, the reflector antenna of end use is dual-frenquency double circular polarization antenna.
Along with the development of millimeter wave phased array antenna technology, the application in terminal equipment such as communication and data transmission is gradually popularized, and the flexible and rapid electronic beam scanning system replaces the traditional system of combining fixed beam antennas with mechanical scanning, so that the application requirements of high speed, high precision and high reliability are met. However, because the millimeter wave frequency band has small wavelength, in order to meet the application requirement, the distance between channels is limited, in the prior art scheme, in combination with the circular polarization rotation direction requirement, as shown in fig. 1, only a transmitting antenna array surface and a receiving antenna array surface can be respectively designed by the transmitting frequency band and the receiving frequency band, namely, the transmitting antenna array uses the array antenna unit with single-transmitting radio frequency rate and single-left-hand circular polarization, the receiving antenna array uses the array antenna unit with single-receiving frequency and single-right-hand circular polarization, and meanwhile, signal transmitting and receiving work is carried out, and then two independent array surfaces are integrated on a structural plane.
In summary, under the same performance condition, the mechanical scanning structure of the traditional fixed beam antenna has large volume, heavy weight and poor beam flexibility, but the dual-frequency dual-circular polarized antenna is adopted to enable the receiving and transmitting aperture to be shared, the occupied area is small, and the transmitting antenna array and the receiving antenna array in the phased array antenna respectively need a single-frequency single-circular polarized array surface, so that the total aperture of the antenna is larger, and a larger installation area is needed for a platform carrier. Therefore, along with the comprehensive, complicated and diversified evolution of various platform carriers to satellite communication and application scenes and environments thereof, the phased array antenna with the traditional fixed beam antenna and the phased array antenna with the separate receiving and transmitting cannot adapt to the platform adaptability requirements of terminal equipment under the conditions of meeting functions and performances, such as low profile, miniaturization, light weight, high isolation of the receiving and transmitting antenna and the like. According to the technical scheme, the Ka frequency band patch and the K frequency band patch are arranged on the same layer, so that polarization of the two antennas in the plane direction is changed into approximate linear polarization, polarization isolation of different spiral directions is not caused, near-field mutual coupling between the two patches is only caused, isolation degree between the transmitting antenna and the receiving antenna is poor due to the fact that physical distances are close to each other, and finally a transmitting channel signal leaks into a receiving channel through the transmitting antenna to raise receiving noise, so that system performance is deteriorated.
In addition, the phased array antenna realization mode of each array surface is received and transmitted, and each array surface is received and transmitted and needs a set of large-scale T assembly or R assembly, so that the total number of used components is large, the material cost is high, and the requirements of various platforms on low cost, batch and industrialization of high-performance millimeter wave satellite communication terminal equipment are difficult to meet. For example, the invention patent with publication number of CN109904599a and patent name of K/Ka dual-band co-aperture antenna array, although the design of the back-end TR module, control circuit, power supply circuit, etc. has to be implemented in longitudinal height space, and finally the antenna array has high profile and large volume, and can not meet the requirements of the existing application scene.
Disclosure of Invention
The invention aims to solve the problems of high section, large volume, poor isolation between receiving and transmitting antennas and high cost of a phased array antenna in the prior art and provides a receiving and transmitting frequency division full duplex common-caliber phased array antenna.
The invention aims at realizing the technical scheme that the receiving-transmitting frequency division full duplex common-caliber phased array antenna comprises an antenna array, wherein the antenna array comprises a plurality of double-frequency antenna units and a set of TR (transmitter-receiver) components which are arranged from top to bottom, and the plurality of double-frequency antenna units and the TR components are integrated on the same multilayer microwave board to form the antenna array;
The dual-frequency antenna unit comprises a transmitting antenna working on the surface of the multi-layer transmitting microwave board and a receiving antenna working on the surface of the multi-layer receiving microwave board in the frequency band f 2, wherein the transmitting antenna and the receiving antenna are coaxially stacked from top to bottom and distributed at intervals of common grating lobe-free units;
The TR component comprises a plurality of independent transmitting channels and a plurality of independent receiving channels, each transmitting channel comprises a transmitting phase-shift attenuation circuit, a power amplification circuit and a receiving-blocking filter circuit which are sequentially connected, the receiving-blocking filter circuit is connected with the transmitting antenna, each receiving channel comprises a transmitting-blocking filter circuit, a low-noise amplification circuit and a receiving phase-shift attenuation circuit which are sequentially connected, and a receiving antenna in the dual-frequency antenna unit is connected with the transmitting-blocking filter circuit.
Specifically, the transmitting antenna and the receiving antenna are patch antennas.
Specifically, the TR component and the multiple dual-frequency antenna units in the antenna array are vertically interconnected with the coaxial switching through transmission lines distributed inside the multi-layer microwave board.
Specifically, a plurality of dual-frequency antenna units in the antenna array are arranged in a rectangular array with a common grating lobe-free unit interval to form a dual-frequency common-caliber antenna array surface.
Specifically, the phased array antenna further comprises a wave control circuit, and the output end of the wave control circuit is connected with the phase-shifting attenuation circuit.
Specifically, the phased array antenna further comprises a power supply conversion circuit, and the output end of the power supply conversion circuit is connected with the wave control circuit, the transmitting channel and the receiving channel.
Specifically, a plurality of transmitting phase-shifting attenuation circuits, a plurality of receiving phase-shifting attenuation circuits, a plurality of transmitting power dividers and a plurality of receiving power dividers in the antenna array are integrated into a multichannel phase-shifting chip by adopting a CMOS (complementary metal oxide semiconductor) process;
the power amplifying circuits and the low noise amplifying circuits in the antenna array are integrated into a multichannel TR final chip by adopting a GaAs process;
And the multichannel phase shifting chip and the multichannel TR final chip are mixed and packaged into a multichannel multifunctional integrated chip.
Specifically, the phased array antenna further comprises a feed network, wherein the feed network comprises a transmitting feed network, a receiving feed network, a plurality of transmitting power splitters and a plurality of receiving power splitters;
the transmitting feed network is connected with the transmitting power dividers, the output ends of the transmitting power dividers are connected with the transmitting phase-shifting attenuation circuit, the receiving feed network is connected with the receiving power dividers, and the receiving power dividers are connected with the output ends of the receiving phase-shifting attenuation circuit.
Specifically, strip line power dividers are arranged in the multilayer microwave board, microstrip line power dividers are arranged in the multichannel integrated chip, and the strip line power dividers and the microstrip line power dividers are cascaded to form the feed network.
Specifically, a plurality of transmitting channels and a plurality of receiving channels in the phased array antenna work simultaneously.
Compared with the prior art, the invention has the beneficial effects that:
(1) The phased array antenna comprises an antenna array, wherein the antenna array comprises a plurality of double-frequency antenna units and a set of TR (transmitter/receiver) assemblies which are arranged from top to bottom, the double-frequency antenna units comprise a transmitting antenna which works in a frequency band f 1 and a receiving antenna which works in a frequency band f 2, the transmitting antenna and the receiving antenna are coaxially and concentrically distributed from top to bottom, the space is a common grating lobe-free unit space, the antenna array has excellent transmit-receive polarization isolation, the simultaneous operation of transmitting and receiving is not affected, and the high performance requirement of satellite communication is met. Further, the dual-frequency antenna unit and the TR component are arranged from top to bottom and integrated on the same multi-layer microwave board to form an antenna array, and the arrangement mode can greatly reduce the volume of the phased array antenna, and is small in occupied area and low in whole antenna section.
(2) The transmitting antenna and the receiving antenna are specifically patch antennas, and the final antenna array surface section is low, the volume is small, the weight is light, and the platform environment adaptability is extremely high.
(3) The multiple double-frequency antenna units in the antenna array are arrayed in a rectangular array mode with the common grating lobe-free unit spacing to form the double-frequency common-caliber antenna array surface, phased array antenna transceiver antenna array surfaces with different working frequencies are integrated in one caliber, the occupied area of the antenna array surface is small, the extremely high caliber utilization rate is achieved, and the miniaturization requirement is met.
(4) The phase-shifting attenuation circuit and the power divider are integrated into a multi-channel phase-shifting chip by adopting a CMOS (complementary metal oxide semiconductor) process, the power amplification circuit and the low-noise amplification circuit are integrated into a multi-channel TR final chip by adopting a GaAs process, the multi-channel phase-shifting chip and the multi-channel TR final chip are mixed and packaged into a multi-channel multifunctional integrated chip, and the types and the scale quantity of components are greatly reduced and the material cost is reduced by integrating a plurality of channels and a plurality of multifunctional circuits through the chip. Further, through encapsulation, the assembly process of the TR component is greatly simplified, the production cost is remarkably reduced, and finally, the low cost of the phased array antenna is realized, thereby being beneficial to realizing batch and industrialization.
Drawings
The following detailed description of the present application is provided in connection with the accompanying drawings, which are included to provide a further understanding of the application, and in which like reference numerals are used to designate like or similar parts throughout the several views, and in which are shown by way of illustration of the application and not limitation thereof.
FIG. 1 is a schematic diagram of a conventional transmit-receive separation phased array antenna of the present invention;
fig. 2 is a functional block diagram of a phased array antenna of the present invention;
FIG. 3 is a schematic diagram of a 4T4R multi-channel multi-functional integrated chip circuit according to the present invention;
FIG. 4 is a schematic diagram of the phased array antenna workflow of the present invention;
fig. 5 is a schematic diagram of a phased array antenna cascade hierarchy of the present invention;
Fig. 6 is a schematic view of the appearance of a phased array antenna of the present invention;
fig. 7 is a schematic diagram of a phased array antenna 1024T/2048R common aperture antenna array layout according to the present invention.
In the figure, a transmitting antenna array surface 1, a receiving antenna array surface 2, a common-caliber antenna array surface 3, a transmitting radio frequency interface 4, a receiving radio frequency interface 5, a wave control interface 6 and a power supply interface 7
Detailed Description
The following description of the embodiments of the present invention will be made apparent and fully understood from the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that directions or positional relationships indicated as being "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are directions or positional relationships described based on the drawings are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements to be referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected via an intermediate medium, or communicating between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In addition, the technical features of the different embodiments of the present invention described below may be combined with each other as long as they do not collide with each other.
The phased array antenna has the advantages of low section, light weight, high performance, small number of components, miniaturization, extremely high platform environment adaptability and low cost, and can meet the requirements of various platforms on low cost, batch and industrialization of high-performance millimeter wave satellite communication terminal equipment. A receiving and transmitting frequency division full duplex common aperture phased array antenna, as shown in figure 2, specifically comprises 1 antenna array, wherein the antenna array comprises 2048 dual-frequency antenna units and 1 set of TR component which are arranged from top to bottom.
Further, the dual-frequency antenna unit comprises a transmitting antenna which works on the frequency band f 1 and is arranged on the multi-layer transmitting microwave board, and a receiving antenna which works on the frequency band f 2 and is arranged on the multi-layer receiving microwave board, and the multi-layer transmitting microwave board and the multi-layer receiving microwave board are coaxially stacked from top to bottom and are distributed in a stacked mode, and the multi-layer transmitting microwave board and the multi-layer receiving microwave board share the grating lobe-free unit interval. The working frequency band f 1 of the transmitting antenna is 29 GHz-31 GHz, the working frequency band f 2 of the receiving antenna is 19 GHz-21 GHz, and communication in the millimeter wave frequency band can be realized, so that the phased array antenna is applied to the fields of satellite communication and the like. More specifically, the theoretical value of the grating lobe-free unit spacing, that is, the maximum spacing of the grating lobes of the beam formed by the phased array antenna in the beam scanning range, is calculated as follows:
Wherein D is the interval between the antenna units, lambda is the wavelength of the radio frequency signal, and theta is the off-axis angle. In this embodiment, the transmitting working frequency is 30GHz, the receiving working frequency is 20GHz, according to the performance requirement of the phased array antenna, the scanning range of the antenna beam is 60 ° off-axis angle, the rotation angle is 360 °, the theoretical grating lobe-free unit spacing of the phased array antenna transmitting work is 5.36mm as known from the calculation formula of grating lobe-free spacing, the theoretical grating lobe-free unit spacing of the phased array antenna receiving work is 8.04mm, in order to make the phased array antenna with the full duplex common aperture of receiving and transmitting frequency have no grating lobes during the beam scanning, a smaller theoretical calculation value is selected as the grating lobe-free unit spacing value of the dual-frequency antenna unit, in this embodiment, the shared grating lobe-free unit spacing of the receiving and transmitting antenna is 5mm, and 2048 dual-frequency antenna units are arrayed in rectangular arrangement with the spacing of 5mm to form an antenna array.
Further, as shown in fig. 2, each transmitting channel comprises a transmitting phase-shifting attenuation circuit, a power amplifying circuit and a receiving and blocking filter circuit which are sequentially connected, the receiving and blocking filter circuit is connected with a transmitting antenna in the double-frequency antenna unit, each receiving channel comprises a transmitting and blocking filter circuit, a low-noise amplifying circuit and a receiving phase-shifting attenuation circuit, and a receiving antenna in the double-frequency antenna unit is connected with the transmitting and blocking filter. More specifically, the receiving filter arranged in the transmitting channel can restrain the signal of the receiving frequency band, so that the signal in the transmitting channel is prevented from leaking to the receiving channel to raise signal noise, the transmitting filter arranged in the receiving channel can restrain the signal of the transmitting frequency band, so that the signal in the receiving channel is prevented from leaking to the transmitting channel to raise signal noise, and the communication quality is ensured.
Further, the transmitting antenna and the receiving antenna are specifically patch antennas, and the phased array antenna is low in section.
Further, a set of TR components and 2048 dual-frequency antenna units in the antenna array are vertically interconnected with the coaxial conversion through transmission lines distributed inside the multi-layer microwave board, and the whole antenna section is low.
Further, 2048 dual-frequency antenna units are arranged in a 5mm shared grating lobe-free interval rectangular array to form a dual-frequency shared-aperture antenna array surface 3, the occupied area of the antenna array surface is small, and adjacent dual-frequency antenna units obtain excellent axial ratio characteristics through rotating array.
Further, the phased array antenna also comprises a wave control circuit, and the output end of the wave control circuit is connected with the phase-shifting attenuation circuit. Specifically, the output end of the wave control circuit is connected with the phase shifter and used for performing amplitude matching on 2048 transmitting antennas and 2048 receiving antennas so as to realize the receiving and transmitting of signals in a specified direction and form high-directionality communication.
Further, the phased array antenna also comprises a power supply conversion circuit, wherein the output end of the power supply conversion circuit is connected with the wave control circuit, a transmitting phase-shift attenuation circuit and a power amplification circuit in a transmitting channel, and a low-noise amplification circuit and a receiving phase-shift attenuation circuit in a receiving channel are connected to supply power for all circuits in the phased array antenna.
Further, strip line power dividers are arranged in the multi-layer microwave board to form 1 transmission feed network of 1 division 512 and 1 reception feed network of 1 division 512. Specifically, as shown in fig. 3, a transmitting 1-division 4 microstrip line power divider arranged in a multi-channel integrated chip, 1 input end of the transmitting 1-division 4 microstrip line power divider is connected with 1 output end of a 1-division 512 transmitting feed network, 4 output ends are connected with 4 transmitting phase-shifting attenuation circuits to distribute signals to different transmitting channels, a receiving 1-division 4 microstrip line power divider arranged in the multi-channel integrated chip, 1 output end of the receiving 1-division 4 microstrip line power divider is connected with 1 input end of the 1-division 512 receiving feed network, 4 input ends are connected with 4 receiving phase-shifting attenuation circuits, and signals from 4 different receiving channels are synthesized.
Further, 4 transmitting phase-shifting attenuation circuits of 4 transmitting channels, 4 receiving phase-shifting attenuation circuits of 4 receiving channels, 1-to-4 power divider of the transmitting channels and 1-to-4 power divider of the receiving channels are integrated into 1 4-channel phase-shifting chip by adopting a CMOS (complementary metal oxide semiconductor) process, 4 power amplifying circuits of 4 transmitting channels and low-noise amplifying circuits of 4 receiving channels in the TR assembly are integrated into 1-4-channel TR final chip by adopting a GaAs process, the 4-channel phase-shifting chip and the 4-channel TR final chip are mixed and packaged into a 4T4R multifunctional integrated chip, and the 4T4R multifunctional integrated chip and 4 double-frequency antenna units are vertically interconnected with each other through transmission lines and coaxial conversion distributed inside a multi-layer microwave board. As shown in fig. 5, the embodiment includes 512 4T4R multi-functional integrated chips, the size of the 4T4R multi-functional integrated chips is smaller than 10mm×10mm, which satisfies the space layout area of 4 transmitting channels and 4 receiving channels corresponding to 4 dual-frequency antenna units, and meets the design requirements of low profile and small volume.
Furthermore, 512 4T4R multifunctional integrated chips are arranged on the bottom layer of the multi-layer microwave board, and the top layer of the multi-layer microwave board is a double-frequency antenna array surface to form AoB frameworks. The multilayer microwave board is assembled in the cavity of the metal structure, and the cavity is internally provided with 1 wave control circuit for configuring the amplitude and phase of the antenna and 1 power supply conversion circuit for supplying power to the TR component and the wave control circuit. The power supply conversion circuit is connected with an external power supply through a power supply interface 7 arranged on the outer frame of the cavity so as to supply power to the whole phased array antenna, and the wave control circuit leads out a wave control interface 6 which is arranged on the outer frame of the cavity. More specifically, the outer frame of the cavity is provided with a transmitting radio frequency interface 4 connected with a transmitting feed interface and a receiving radio frequency interface 5 connected with a receiving feed interface, the appearance of the 2048T/2048R receiving-transmitting frequency division full duplex common-caliber phased array antenna is shown in figure 6, and the size of the whole phased array antenna is 320mm multiplied by 40mm, and the phased array antenna has the advantages of low section, small volume and small occupied area.
Further, 2048 transmitting channels and 2048 receiving channels simultaneously work at respective working frequencies and share 1 dual-frequency antenna array plane aperture.
Further, the working flow of the 2048T/2048R receiving and transmitting frequency division full duplex common caliber phased array antenna is that external power supply is started, and the external power supply is converted into various voltages required by each component in a wave control circuit and a TR assembly through a power supply conversion circuit and distributed and transmitted to the corresponding component.
The method comprises the steps of inputting transmission signals (29 GHz-31 GHz) from transmission channels by a transmission radio frequency interface, distributing the signals to 512 transmission channels in a 4T4R multifunctional integrated chip through transmission feed network equal power, enabling each transmission channel to comprise 1 phase-shifting attenuation circuit, enabling a wave control circuit to calculate according to position coordinates of each transmission antenna unit according to the requirements of a system on beam pointing angles at the moment, obtaining amplitude values and phase values of each transmission channel under the frequency of the transmission signals at the moment, outputting wave control signals to control phase-shifting quantity and attenuators of the transmission phase-shifting attenuation circuits, realizing amplitude and phase configuration at the transmission feed end of each antenna, enabling the transmission signals amplified by a power amplifier to operate at the transmission working frequency (29 GHz-31 GHz) after the reception working frequency (19 GHz-21 GHz) is suppressed by the receiving and blocking filter, and synthesizing transmission beams in a space according to a specified direction.
The method comprises the steps that received signals (19 GHz-21 GHz) from a certain angle direction target are received through the double-frequency antenna unit of the antenna array working at the receiving working frequency (19 GHz-21 GHz), the received signals enter 512 4T4R multifunctional integrated chips and are subjected to filter inhibition on the transmitting working frequency (29 GHz-31 GHz) in each receiving channel, noise is inhibited while the signals are amplified by the low-noise amplifier, the control of the receiving phase-shifting attenuation circuit by the output wave control signals output by the wave control circuit ensures that the antenna array can effectively synthesize the signals of the direction target, the signals are complexed into 1 path through the receiving feed network, and the signals enter the receiving channels through the receiving radio frequency interface.
As an option, the present embodiment further includes a 1024T/2048R common aperture antenna array, as shown in fig. 7, specifically including 256 4T4R multi-functional integrated chips and 256 4R multi-functional integrated chips, where each 4T4R multi-functional integrated chip includes 4 TR channels, and 1024 TR channels, and each 4R multi-functional integrated chip includes 4 single R channels, and 1024 single R channels. More specifically, 256 4T4R multifunctional integrated chips and 256 4R multifunctional integrated chips are arranged at the bottom layer of the multilayer microwave board, are vertically interconnected with 2048 double-frequency antenna units on the surface layer of the multilayer microwave board through transmission lines and coaxial conversion arranged inside the multilayer microwave board, and are arranged in a rectangular array with a spacing of 5mm to form a double-frequency common-caliber antenna array surface, wherein 1024 TR channels are distributed in the central area of the double-frequency common-caliber antenna array surface, and 1024 single R channels are distributed in the edge area of the double-frequency common-caliber antenna array surface. The embodiment can flexibly distribute the scale of the transmitting channel and the design of the transmitting power on the premise of ensuring the signal receiving capability so as to adapt to the application requirements of different satellite communication of various platforms.
The foregoing detailed description of the invention is provided for illustration, and it is not to be construed that the detailed description of the invention is limited to only those illustration, but that several simple deductions and substitutions can be made by those skilled in the art without departing from the spirit of the invention, and are to be considered as falling within the scope of the invention.