CN111277938A - Packaging structure of microphone - Google Patents
Packaging structure of microphone Download PDFInfo
- Publication number
- CN111277938A CN111277938A CN202010156028.XA CN202010156028A CN111277938A CN 111277938 A CN111277938 A CN 111277938A CN 202010156028 A CN202010156028 A CN 202010156028A CN 111277938 A CN111277938 A CN 111277938A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- sound
- package structure
- sound hole
- microphone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The invention discloses a packaging structure of a microphone. The packaging structure of the microphone according to the embodiment of the invention comprises: a first circuit board formed with a first sound hole penetrating the first circuit board; the second circuit board is fixed on the first surface of the first circuit board, and a second sound hole penetrating through the second circuit board is formed; a housing coupled to the first surface of the second circuit board to define a cavity; and a silicon microphone located inside the cavity and fixed on a second surface of the second circuit board, wherein the first sound hole and the second sound hole communicate with each other and are staggered from each other on a main surface of the second circuit board. According to the packaging structure of the microphone, foreign matters can be prevented from polluting the microphone, so that the reliability of a product is improved.
Description
Technical Field
The invention relates to the technical field of microphones, in particular to a packaging structure of a microphone.
Background
A microphone is a transducer that converts sound into an electronic signal. With the development of society, a great deal of new microphone technology is gradually developed. MEMS (Micro-Electro-Mechanical systems) microphones are now increasingly used.
As shown in fig. 1, the conventional microphone package structure includes a first circuit board 10, a third circuit board 30, and a fourth circuit board 40. The first circuit board 10 is located on the top of the package structure and includes a first substrate 101, a copper layer 105 covering the surface of the first substrate 101, and a substrate oil 106 covering the surface of the copper layer 105. The first circuit board 10 is provided with a first sound hole 301. The fourth circuit board 40 is located at the bottom of the package structure and includes a fourth substrate 104, a copper layer 105 covering the surface of the fourth substrate 104, and a substrate oil 106 covering the surface of the copper layer 105. The housing is connected with the first circuit board 10 and the fourth circuit board 40, respectively, to define a cavity. The housing is, for example, a third circuit board 30, and includes a third substrate 103 and a copper layer 105 covering a surface of the third substrate 103. The microphone structure is located inside the cavity, below the first sound hole 301 and attached to the lower surface of the first circuit board 10. The microphone structure comprises, for example, a diaphragm structure 201, a MEMS chip 202 and a connection line 203 for electrical connection. In the prior art, the microphone structure is directly arranged below the sound hole, and foreign matters such as dust and the like easily enter the microphone structure through the sound hole to pollute the microphone structure and influence the performance of the microphone.
Therefore, a new packaging structure of the microphone is desired, which can prevent foreign matters from entering and affecting the performance of the microphone structure.
Disclosure of Invention
In view of the above problems, an object of the present invention is to provide a microphone package structure, so as to prevent foreign matters from contaminating the microphone structure and improve the reliability of the product.
According to an aspect of the present invention, there is provided a packaging structure of a microphone, including: a first circuit board formed with a first sound hole penetrating the first circuit board; the second circuit board is fixed on the first surface of the first circuit board, and a second sound hole penetrating through the second circuit board is formed; a housing coupled to the first surface of the second circuit board to define a cavity; and a silicon microphone located inside the cavity and fixed on a second surface of the second circuit board, wherein the first sound hole and the second sound hole communicate with each other and are staggered from each other on a main surface of the second circuit board.
Preferably, the package structure further includes: the spacing layer is respectively connected with the first circuit board and the second circuit board and used for spacing the first circuit board and the second circuit board, and a sound conduction channel is arranged on the spacing layer; the sound conduction channel is respectively connected with the first sound hole and the second sound hole.
Preferably, the spacing layer is cut to form the sound conduction channel.
Preferably, the sound conduction channel is a closed figure.
Preferably, the spacing layer is a prepreg layer, and the prepreg layer is subjected to laser cutting to form the sound conduction channel.
Preferably, the housing comprises: a third circuit board connected with the second circuit board to define the cavity.
Preferably, the package structure further includes: and the fourth circuit board is positioned at the bottom of the packaging structure and connected with the shell to limit the cavity.
Preferably, the lower surface of the first circuit board and/or the upper surface of the second circuit board are smooth planes.
Preferably, the silicon microphone comprises: the vibrating diaphragm structure is positioned below the second sound hole, is connected with the second circuit board and is used for converting a sound signal into an electric signal; the micro-electro-mechanical system chip is positioned in the cavity, is connected with the second circuit board and is used for processing an electric signal; and the connecting wire is used for electrically connecting the diaphragm structure and the micro electro mechanical system chip and electrically connecting the micro electro mechanical system chip and the second circuit board.
Preferably, the first circuit board and the second circuit board have the same planar size.
According to the packaging structure of the microphone provided by the embodiment of the invention, the first sound hole and the second sound hole are arranged in a staggered manner, so that foreign matters can be prevented from entering a device, the microphone structure is prevented from being directly polluted by the foreign matters, and the reliability of a product is improved.
According to the packaging structure of the microphone, the conventional process method and materials can be used, and the mass production is compatible.
Drawings
The above and other objects, features and advantages of the present invention will become more apparent from the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:
fig. 1 shows a schematic structural diagram of a package structure according to the prior art;
FIG. 2 shows a schematic structural diagram of a package structure according to an embodiment of the invention;
FIG. 3 illustrates a top view of a first circuit board according to an embodiment of the present invention;
FIG. 4 shows a top view of a spacer layer according to an embodiment of the invention;
FIG. 5 shows a top view of a second circuit board according to an embodiment of the invention;
fig. 6 shows a top view of a first circuit board according to another embodiment of the invention.
Detailed Description
Various embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Like elements in the various figures are denoted by the same or similar reference numerals. For purposes of clarity, the various features in the drawings are not necessarily drawn to scale. Moreover, certain well-known elements may not be shown in the figures.
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. In the following description, numerous specific details of the invention, such as structure, materials, dimensions, processing techniques and techniques of components, are set forth in order to provide a more thorough understanding of the invention. However, as will be understood by those skilled in the art, the present invention may be practiced without these specific details.
It will be understood that when a layer, region or layer is referred to as being "on" or "over" another layer, region or layer in describing the structure of the component, it can be directly on the other layer, region or layer or intervening layers or regions may also be present. Also, if the component is turned over, one layer or region may be "under" or "beneath" another layer or region.
Fig. 2 shows a schematic structural diagram of a package structure according to an embodiment of the present invention. As shown in fig. 2, the package structure according to the embodiment of the present invention includes a first circuit board 10, a second circuit board 20, a third circuit board 30, a fourth circuit board 40, and a silicon microphone.
Specifically, the first circuit board 10 is formed with a first sound hole 301 penetrating the first circuit board 10. The first circuit board 10 is located, for example, on top of the package structure. The second circuit board 20 is fixed to a first surface (lower surface) of the first circuit board 10. The second circuit board 20 has a second sound hole 302 formed therethrough. The housing is coupled to a first surface (e.g., an upper surface) of the second circuit board 20 to define a cavity. Optionally, the housing comprises for example a third circuit board 30. The silicon microphone is located inside the cavity and is fixed to a second surface (e.g., a lower surface) of the second circuit board 20. The first sound hole 301 and the second sound hole 302 communicate with each other and are staggered from each other on a main surface (for example, a first surface) of the second circuit board 20.
In the above embodiments of the present invention, the first sound hole and the second sound hole of the package structure according to the embodiments of the present invention are disposed in a staggered manner, so that a foreign object can be prevented from entering the device, and the microphone structure is prevented from being directly contaminated by the foreign object, thereby improving the reliability of the product.
In an alternative embodiment of the invention, the housing comprises for example a third circuit board 30. The third circuit board 30 is located above the fourth circuit board 40 and around the fourth circuit board 40.
In an alternative embodiment of the invention, the package structure further comprises a spacer layer 107. The spacer layer 107 is disposed between the first circuit board 10 and the second circuit board 20. The first circuit board 10 and the second circuit board 20 are pressed together through the spacer layer 107. The spacing layer 107 is provided with a sound conduction channel 303. The sound conduction channel 303 is connected to the first sound hole 301 and the second sound hole 302, respectively. External sound signals are transmitted in the form of sound waves. The sound wave is conducted to the silicon microphone through the first sound hole, the sound conduction channel and the second sound hole in sequence.
In an alternative embodiment of the present invention, the first circuit board 10, the second circuit board 20 and the fourth circuit board 40 have the same planar size. The upper surface of the fourth circuit board 40 is provided with, for example, pads for connection of the third circuit board 30 and the fourth circuit board 40. The lower surface of the second circuit board 20 is provided with, for example, pads for connection of the third circuit board 30 and the fourth circuit board 40.
In the above embodiments of the present invention, the package structure according to the embodiments of the present invention can use conventional processes and materials, and can be produced in a large scale.
In an alternative embodiment of the invention, the package structure comprises a first circuit board 10, a second circuit board 20, a third circuit board 30, a fourth circuit board 40, a spacer layer 107 and a silicon microphone.
The fourth circuit board 40 includes, for example, a fourth substrate 104, a copper layer 105 covering a surface of the fourth substrate 104, and a substrate oil 106 covering a surface of the copper layer 105. The fourth substrate 104 is, for example, a PCB carrier. The fourth circuit board 40 is located at the bottom of the package structure and is also used to carry other components of the package structure. Preferably, the upper and lower surfaces of the fourth substrate 104 are covered with copper layers 105. The surfaces of the copper layers 105 on the upper and lower surfaces of the fourth substrate 104 are covered with the substrate oil 106.
The third circuit board 30 is disposed above the fourth circuit board 40 and around the fourth circuit board 40. The third circuit board 30 includes a third substrate 103 and a copper layer 105 covering a surface of the third substrate 103. Optionally, the third substrate 103 is a PCB substrate.
The second circuit board 20 is disposed above the third circuit board 30. The second circuit board 20 is provided with a second sound hole 302. The second circuit board 20 includes a second substrate 102, a copper layer 105 covering a surface of the second substrate 102, and a substrate oil 106 covering a surface of the copper layer 105. The second substrate 102 is, for example, a PCB carrier. Preferably, the upper and lower surfaces of the second substrate 102 are covered with copper layers 105. The surface of the copper layer 105 of the lower surface of the second substrate 102 is covered with a substrate oil 106; the surface of copper layer 105 on the upper surface of second substrate 102 is free of solder resist (no substrate oil 106).
A silicon microphone is attached to the lower surface of the second circuit board 20. The silicon microphone comprises, for example, a diaphragm structure 201, a MEMS chip and a connection line 203 for electrical connection.
The diaphragm structure 201 is disposed on the lower surface of the second circuit board 20 and below the second sound hole 302 to receive a sound signal (acoustic wave signal) transmitted through the first sound hole 301. A MEMS chip (micro electro mechanical system chip) 202 is disposed on the lower surface of the second circuit board 20 and is connected to the diaphragm structure 201 and the second circuit board 20 through different connecting wires 203, respectively. The connection line 203 is, for example, a gold wire or a silver wire.
An external sound signal is transmitted in the form of a sound wave to the diaphragm structure 201 through the second sound hole 302, so as to cause the diaphragm structure 201 to vibrate. The diaphragm structure 201 converts the sound signal into an electrical signal and transmits the electrical signal to the MEMS chip 202 through the connection line 203. The MEMS chip 202 is used for processing the electrical signal and transmitting the processed electrical signal to the second circuit board 20 through the connection line 203.
The second circuit board 20 is provided with the first circuit board 10 thereon. The first circuit board 10 is provided with a first sound hole 301. The first circuit board 10 includes, for example, a first substrate 101, a copper layer 105 covering a surface of the first substrate 101, and a substrate oil 106 covering a surface of the copper layer 105. The first substrate 101 is, for example, a PCB carrier. Preferably, the upper and lower surfaces of the first substrate 101 are covered with copper layers 105. The surface of the copper layer 105 on the upper surface of the first substrate 101 is covered with a substrate oil 106; the surface of the copper layer 105 of the lower surface of the first substrate 101 is free of solder resist (free of substrate oil 106).
External sound signals are transmitted in the form of sound waves. The sound waves are transmitted to the diaphragm structure 201 through the first sound hole 301 and the second sound hole 302 in this order, causing vibration of the diaphragm structure 201. The diaphragm structure 201 converts the sound signal into an electrical signal and transmits the electrical signal to the MEMS chip 202 through the connection line 203. The MEMS chip 202 is used for processing the electrical signal and transmitting the processed electrical signal to the second circuit board 20 through the connection line 203.
A spacer layer 107 is positioned between the first circuit board 10 and the second circuit board 20 for connecting and isolating the first circuit board 10 and the second circuit board 20.
In the above embodiment of the present invention, the first sound hole and the second sound hole of the package structure according to the embodiment of the present invention are disposed in a staggered manner, so that the probability of foreign matters entering the device can be reduced, the MEMS membrane (diaphragm structure) is prevented from being directly contaminated by the foreign matters, and the reliability of the product is improved.
In an alternative embodiment of the present invention, the material of the first substrate 101, the second substrate 102, the third substrate 103 and the fourth substrate 104 is FR4 (glass fiber) base material.
In an alternative embodiment of the invention, the thickness of the spacer layer 107 may be set according to different sound effects and dust-proof effects. The thickness of the spacer layer 107 is, for example, between several micrometers and several hundred micrometers.
In an alternative embodiment of the invention, the spacer layer 107 is made of an insulating prepreg (PP glue). The prepreg is used for laminating the first circuit board 10 and the second circuit board 20. A prepreg layer is provided above the second circuit board 20. . The first circuit board 10 is press-fitted on the spacer layer (prepreg layer) 107. The spacing layer 107 and the gap between the first circuit board 10 and the second circuit board 20 form a sound conduction path 303. Optionally, the lower surface of the first circuit board 10 is solder resist free (substrate-free oil layer 106). The lower surface of the first circuit board 10 is, for example, a copper layer 105. The lower surface of the first circuit board 10 is a smooth plane. The upper surface of the second circuit board 20 is solder resist free (substrate-free oil layer 106). The upper surface of the second circuit board 20 is, for example, a copper layer 105. The upper surface of the second circuit board 20 is a smooth plane. The spacing layer 107 forms the sound conduction channel 303, for example, by cutting, which is a smooth flat surface. The inner walls of the sound conduction channel 303 are smooth and flat.
In the above embodiment, the lower surface of the first circuit board 10 and the upper surface of the second circuit board 20 are solder resist-free. The inner wall of the sound conduction channel 303 is a smooth flat surface. The sound waves are transmitted in the sound conduction channel 303 with a good transmission effect.
Fig. 3 shows a top view of a first circuit board according to an embodiment of the invention. As shown in fig. 3, the first circuit board 10 according to the embodiment of the present invention is provided with a first sound hole 301. The first sound hole 301 is for transmission of sound waves.
In an alternative embodiment of the invention, the surface of the first circuit board 10 is covered with a copper layer. Optionally, the inner wall of the first acoustic hole 301 is covered with a copper layer.
FIG. 4 shows a top view of a spacer layer according to an embodiment of the present invention. As shown in fig. 4, the spacing layer 107 according to an embodiment of the present invention is provided with a sound conduction channel 303. The sound conduction channel 303 is used for conduction of sound waves.
In an alternative embodiment of the invention, the spacer layer 107 is made of an insulating prepreg (PP glue). Alternatively, the spacer layer 107 is laser cut to form a closed pattern. The laser cutting simultaneously forms the sound conduction channel 303. The sound conduction channel 303 is used for conduction of sound waves.
In the above embodiment, the spacer layer 107 is formed into a closed pattern by laser cutting, which ensures the air tightness of the package structure.
Fig. 5 shows a top view of a second circuit board according to an embodiment of the invention. As shown in fig. 5, the second circuit board 20 according to the embodiment of the present invention is provided with a second sound hole 302. The second sound hole 302 is used for transmission of sound waves.
In an alternative embodiment of the invention, the surface of the second circuit board 20 is covered with a copper layer. Optionally, the inner wall of the second sound hole 302 is covered with a copper layer.
Fig. 6 shows a top view of a first circuit board according to another embodiment of the invention. As shown in fig. 6, the first circuit board 10 according to another embodiment of the present invention is provided with a plurality of first sound holes 301. The first sound hole 301 is for transmission of sound waves.
In an alternative embodiment of the invention, the surface of the first circuit board 10 is covered with a copper layer. Optionally, the inner wall of the first acoustic hole 301 is covered with a copper layer.
In an alternative embodiment of the present invention, a plurality of first sound holes 301 are provided on the first circuit board 10. The plurality of first sound holes 301 are connected to the sound conduction channels 303, respectively. The external sound waves are transmitted into the sound conduction channel 303 through the plurality of first sound holes 301. Alternatively, a plurality of first sound holes 301 are arrayed on the first circuit board 10.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
While embodiments in accordance with the invention have been described above, these embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments described. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention and various embodiments with various modifications as are suited to the particular use contemplated. The invention is limited only by the claims and their full scope and equivalents.
Claims (10)
1. A microphone package structure, comprising:
a first circuit board formed with a first sound hole penetrating the first circuit board;
the second circuit board is fixed on the first surface of the first circuit board, and a second sound hole penetrating through the second circuit board is formed;
a housing coupled to the first surface of the second circuit board to define a cavity; and
a silicon microphone positioned inside the cavity and fixed on the second surface of the second circuit board,
wherein the first sound hole and the second sound hole communicate with each other and are staggered from each other on a main surface of the second circuit board.
2. The package structure of claim 1, further comprising:
a spacing layer connected to the first circuit board and the second circuit board, respectively, for spacing the first circuit board and the second circuit board,
wherein a sound conduction channel is arranged on the spacing layer;
the sound conduction channel is respectively connected with the first sound hole and the second sound hole.
3. The package structure of claim 2, wherein the spacer layer is cut to form the sound conduction channel.
4. The package structure of claim 2, wherein the sound conduction channel is a closed figure.
5. The package structure according to claim 2, wherein the spacer layer is a prepreg layer,
and carrying out laser cutting on the prepreg layer to form the sound conduction channel.
6. The package structure of claim 1, wherein the housing comprises:
a third circuit board connected with the second circuit board to define the cavity.
7. The package structure of claim 1, further comprising:
and the fourth circuit board is positioned at the bottom of the packaging structure and connected with the shell to limit the cavity.
8. The package structure of claim 1, wherein a lower surface of the first circuit board and/or an upper surface of the second circuit board is a smooth plane.
9. The package structure of claim 1, wherein the silicon microphone comprises:
the vibrating diaphragm structure is positioned below the second sound hole, is connected with the second circuit board and is used for converting a sound signal into an electric signal;
the micro-electro-mechanical system chip is positioned in the cavity, is connected with the second circuit board and is used for processing an electric signal; and
and the connecting wire is used for electrically connecting the diaphragm structure and the micro electro mechanical system chip and electrically connecting the micro electro mechanical system chip and the second circuit board.
10. The package structure of claim 1, wherein the first circuit board and the second circuit board have the same planar dimensions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010156028.XA CN111277938A (en) | 2020-03-09 | 2020-03-09 | Packaging structure of microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010156028.XA CN111277938A (en) | 2020-03-09 | 2020-03-09 | Packaging structure of microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111277938A true CN111277938A (en) | 2020-06-12 |
Family
ID=71000611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010156028.XA Pending CN111277938A (en) | 2020-03-09 | 2020-03-09 | Packaging structure of microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111277938A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025007306A1 (en) * | 2023-07-05 | 2025-01-09 | 瑞声声学科技(深圳)有限公司 | Mems microphone |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050094832A1 (en) * | 2003-11-05 | 2005-05-05 | Bse Co., Ltd | Method of mounting condenser microphone on main PCB and condenser microphone adapted for the same |
| CN201042078Y (en) * | 2007-05-26 | 2008-03-26 | 歌尔声学股份有限公司 | Silicon microphone with dustproof sound hole |
| US20080232630A1 (en) * | 2007-03-19 | 2008-09-25 | National Chung-Hsing University | Condenser microphone package |
| CN101426166A (en) * | 2008-11-07 | 2009-05-06 | 歌尔声学股份有限公司 | Silicon microphone |
| CN201274566Y (en) * | 2008-09-26 | 2009-07-15 | 瑞声声学科技(深圳)有限公司 | MEMS microphone |
| CN101646120A (en) * | 2009-06-05 | 2010-02-10 | 瑞声声学科技(深圳)有限公司 | Capacitance microphone |
| CN201491259U (en) * | 2009-06-05 | 2010-05-26 | 瑞声声学科技(常州)有限公司 | Silicon-based condenser microphone |
| CN201491261U (en) * | 2009-06-05 | 2010-05-26 | 瑞声声学科技(常州)有限公司 | capacitance microphone |
| CN201528409U (en) * | 2009-10-19 | 2010-07-14 | 瑞声声学科技(深圳)有限公司 | MEMS Microphone |
| CN201528422U (en) * | 2009-10-19 | 2010-07-14 | 瑞声声学科技(深圳)有限公司 | condenser microphone |
| JP2013030822A (en) * | 2011-06-24 | 2013-02-07 | Funai Electric Co Ltd | Microphone unit and sound input device including the same |
| US20130070951A1 (en) * | 2010-06-01 | 2013-03-21 | Funai Electric Co., Ltd. | Microphone unit and sound input device incorporating same |
| CN204929255U (en) * | 2015-09-14 | 2015-12-30 | 北京卓锐微技术有限公司 | Microphone encapsulation |
| CN105721998A (en) * | 2016-04-27 | 2016-06-29 | 歌尔声学股份有限公司 | Separated cavity packaging structure of integrated sensor |
| CN110662148A (en) * | 2019-09-06 | 2020-01-07 | 歌尔股份有限公司 | MEMS microphone |
-
2020
- 2020-03-09 CN CN202010156028.XA patent/CN111277938A/en active Pending
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050094832A1 (en) * | 2003-11-05 | 2005-05-05 | Bse Co., Ltd | Method of mounting condenser microphone on main PCB and condenser microphone adapted for the same |
| US20080232630A1 (en) * | 2007-03-19 | 2008-09-25 | National Chung-Hsing University | Condenser microphone package |
| CN201042078Y (en) * | 2007-05-26 | 2008-03-26 | 歌尔声学股份有限公司 | Silicon microphone with dustproof sound hole |
| CN201274566Y (en) * | 2008-09-26 | 2009-07-15 | 瑞声声学科技(深圳)有限公司 | MEMS microphone |
| CN101426166A (en) * | 2008-11-07 | 2009-05-06 | 歌尔声学股份有限公司 | Silicon microphone |
| CN201491259U (en) * | 2009-06-05 | 2010-05-26 | 瑞声声学科技(常州)有限公司 | Silicon-based condenser microphone |
| CN101646120A (en) * | 2009-06-05 | 2010-02-10 | 瑞声声学科技(深圳)有限公司 | Capacitance microphone |
| CN201491261U (en) * | 2009-06-05 | 2010-05-26 | 瑞声声学科技(常州)有限公司 | capacitance microphone |
| CN201528409U (en) * | 2009-10-19 | 2010-07-14 | 瑞声声学科技(深圳)有限公司 | MEMS Microphone |
| CN201528422U (en) * | 2009-10-19 | 2010-07-14 | 瑞声声学科技(深圳)有限公司 | condenser microphone |
| US20130070951A1 (en) * | 2010-06-01 | 2013-03-21 | Funai Electric Co., Ltd. | Microphone unit and sound input device incorporating same |
| JP2013030822A (en) * | 2011-06-24 | 2013-02-07 | Funai Electric Co Ltd | Microphone unit and sound input device including the same |
| CN204929255U (en) * | 2015-09-14 | 2015-12-30 | 北京卓锐微技术有限公司 | Microphone encapsulation |
| CN105721998A (en) * | 2016-04-27 | 2016-06-29 | 歌尔声学股份有限公司 | Separated cavity packaging structure of integrated sensor |
| CN110662148A (en) * | 2019-09-06 | 2020-01-07 | 歌尔股份有限公司 | MEMS microphone |
Non-Patent Citations (2)
| Title |
|---|
| 詹跃明: "《表面组装技术》", 30 September 2018, 重庆大学出版社 * |
| 陈春成: "我国电子电镀技术现状及发展动态(续)", 《电镀与环保》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025007306A1 (en) * | 2023-07-05 | 2025-01-09 | 瑞声声学科技(深圳)有限公司 | Mems microphone |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102742301B (en) | Micro-electro-mechanical transducer and corresponding packaging technology | |
| EP1219136B1 (en) | A pressure transducer | |
| KR860000640B1 (en) | Electro-acoustic transducer and its manufacturing method | |
| US10745269B2 (en) | MEMS package | |
| JP5348073B2 (en) | Electroacoustic transducer mounting substrate, microphone unit, and manufacturing method thereof | |
| US20080219482A1 (en) | Condenser microphone | |
| CN101374373A (en) | Vibration sensor | |
| JP2008271425A (en) | Acoustic sensor and fabricating method therefor | |
| CN101426164B (en) | electroacoustic sensing device | |
| JP2007043327A (en) | Condenser microphone | |
| CN111277938A (en) | Packaging structure of microphone | |
| KR20190029957A (en) | Microphone device | |
| US20090141913A1 (en) | Microelectromechanical system | |
| JP5097603B2 (en) | Microphone unit | |
| CN115278478A (en) | Bone voiceprint sensor and electronic equipment | |
| CN113518292B (en) | MEMS Vibration Sensor Die | |
| US7224812B2 (en) | Condenser microphone and method for making the same | |
| JP2007060389A (en) | Silicon microphone package | |
| JP4476055B2 (en) | Condenser microphone and manufacturing method thereof | |
| CN102209287B (en) | MEMS (micro electro mechanical system) microphone chip and manufacture method thereof | |
| CN216291435U (en) | Packaging board of MEMS microphone and microphone | |
| CN219577258U (en) | Vibration assembly, packaging structure and microphone | |
| KR101949594B1 (en) | Mems transducer package and mems device inlcuding the same | |
| CN214756912U (en) | A MEMS microphone package board and microphone | |
| JP2009055490A (en) | Microphone apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 5 / F, building C, swan block, Wuxi Software Park, 111 Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province, 214000 Applicant after: Wuxi Weigan Semiconductor Co.,Ltd. Address before: 5 / F, building C, swan block, Wuxi Software Park, 111 Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province, 214000 Applicant before: Wuxi Weil Semiconductor Co.,Ltd. |
|
| CB02 | Change of applicant information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200612 |
|
| RJ01 | Rejection of invention patent application after publication |