CN111276454A - Laminated flexible microelectronic packaging structure - Google Patents
Laminated flexible microelectronic packaging structure Download PDFInfo
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- CN111276454A CN111276454A CN202010082437.XA CN202010082437A CN111276454A CN 111276454 A CN111276454 A CN 111276454A CN 202010082437 A CN202010082437 A CN 202010082437A CN 111276454 A CN111276454 A CN 111276454A
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- shell
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a laminated flexible microelectronic packaging structure, relates to the technical field of electronic element processing, and solves the problems that the existing packaging structure mainly utilizes bonding and sealing to ensure the water resistance and moisture resistance of an internal core, has a common heat dissipation effect and does not have a secret leakage prevention function. A stacked flexible microelectronic package structure comprising an upper case; a plurality of groups of round holes are formed in the middle of the upper surface shell; the bottom of the upper watchcase is fixedly provided with a lower watchcase through a bolt; the top of the upper meter shell is fixedly provided with a shell; a metal radiating fin is fixedly arranged on the inner side of the top of the upper meter shell; the inner side of the lower meter shell is fixedly provided with an inner bottom shell, a knowledge protection function is provided for the packaging structure through the arrangement of the blade and the pull-up opening, the pull-up opening and the hook foot are of a slightly inclined staggered structure and can slide, elastically deform and be fixed through an inclined plane, the hook foot is locked and fixed through elasticity after installation, and when the package is disassembled, the hook foot barb is matched with the pull-up opening to pull up the blade, so that the chip is damaged from the bottom.
Description
Technical Field
The invention relates to the technical field of electronic element processing, in particular to a laminated flexible microelectronic packaging structure.
Background
Microelectronic packaging technology is a technology in which integrated circuits are packaged with insulating plastic or ceramic materials. Taking a CPU as an example, the volume and appearance actually seen are not the size and appearance of a real CPU core, but are the products of packaged components such as the CPU core. Packaging techniques are necessary and critical for the chip. Because the chip must be isolated from the outside to prevent the electrical performance degradation caused by the corrosion of the chip circuit by impurities in the air.
The patent with the patent number of micro-electro-mechanical system and the packaging method thereof, for example, through retrieval, discloses a device packaging structure of a micro-electro-mechanical system and a packaging method thereof, the device packaging structure of the micro-electro-mechanical system comprises a substrate and a cover plate, wherein at least one first enclosing frame is arranged on the substrate, devices of the micro-electro-mechanical system are placed in the first enclosing frame, the devices of the micro-electro-mechanical system are electrically connected with the substrate, at least one second enclosing frame is arranged on the cover plate, the second enclosing frame is fixedly connected with the corresponding first enclosing frame, and the devices of the micro-electro-mechanical system placed in the corresponding first enclosing frame are sealed. The invention realizes the packaging protection of the MEMS device by using a simple process, and simultaneously does not influence the function of the MEMS device. The closed space manufactured by the method protects and ensures the perfect exertion of the functions of the MEMS device.
For another example, patent No. CN103342338A discloses a wafer level packaging method and a packaging structure for a mems chip, wherein the packaging structure includes: the chip comprises an upper surface and a lower surface opposite to the upper surface, and is provided with a mechanical device, a first electric connector and a groove communicated with the mechanical device; the first protective outer cover substrate is matched with the upper surface of the micro-electro-mechanical system chip to form a cavity, and the groove is communicated with the cavity; the second protective outer cover substrate is pressed with the lower surface of the micro-electro-mechanical system chip to seal the groove; and the second electric connecting piece is arranged on one side of the lower surface of the micro-electro-mechanical system chip and is electrically connected with the first electric connecting piece. Compared with the prior art, the invention can form a mechanical device in the process of packaging the MEMS wafer, so that the mechanical device is not easy to mix impurities, and the reliability of the packaging structure is ensured.
However, the packaging structure used at present mainly utilizes bonding sealing to ensure the waterproof and moistureproof performance of an internal core, has a simple heat dissipation structure and a general heat dissipation effect, does not have a leakage prevention function, does not have the function of a self-destruction chip when a general chip is forcedly dismounted, has insufficient knowledge protection capability, does not meet the existing requirements, and provides a laminated flexible microelectronic packaging structure for the packaging structure.
Disclosure of Invention
Problem (A)
The invention aims to provide a laminated flexible microelectronic packaging structure, which aims to solve the problems that the existing packaging structure proposed in the background technology mainly utilizes bonding and sealing to ensure the water resistance and moisture resistance of an internal core, has a simple heat dissipation structure and a common heat dissipation effect, does not have a leakage prevention function, does not have the function of a self-destruction chip when a common chip is forcibly dismounted, and has insufficient knowledge protection capability.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme: a stacked flexible microelectronic package structure comprising an upper case; a plurality of groups of round holes are formed in the middle of the upper surface shell; the bottom of the upper watchcase is fixedly provided with a lower watchcase through a bolt; the top of the upper meter shell is fixedly provided with a shell; a metal radiating fin is fixedly arranged on the inner side of the top of the upper meter shell; an inner bottom shell is fixedly arranged on the inner side of the lower meter shell.
Preferably, the upper watch shell and the lower watch shell are fixedly connected through bolts arranged on the periphery; a plurality of groups of inserting structures are integrally arranged on the periphery of the bottom of the upper meter shell; a plurality of groups of inserting structures are integrally arranged on the periphery of the top of the lower shell, and two sides of the inserting structures of the upper shell and the lower shell can be spliced in an inosculating manner; and elliptic grooves are formed in the protruding positions of the tops between the inserting structures of the upper watchcase and the lower watchcase.
Preferably, the protruding parts of the top parts between the plugging structures of the lower watch case are all provided with elliptical grooves, and sealing plugs are fixedly arranged in the elliptical grooves when the plugging structures are fixed; the through-hole has all been seted up in the middle of the sealing plug, and the sealing plug is oval-shaped silica gel material.
Preferably, the metal radiating fin further comprises a radiating pin; the top of the metal radiating fin is integrally provided with a plurality of groups of radiating pins, and the number of the radiating pins is the same as that of the round holes in the upper surface shell.
Preferably, the upper watch case further comprises a hook foot; round holes are formed in the periphery of the bottom of the metal radiating fin, and the positions of the round holes and the positions of the radiating pins are staggered; four groups of hook feet are integrally arranged at the bottom of the upper watch case, the bottoms of the hook feet are all provided with hook structures and are inclined inwards by 45 degrees, and meanwhile, the hook feet are arranged in the circular holes of the metal radiating fins.
Preferably, a plurality of groups of cylindrical structures are integrally arranged at the bottom of the shell, and the number of the circular hole structures is the same as that of the circular holes in the upper surface shell; the shell cylinder structures are inserted into the circular holes in the upper shell and fixed in an interference fit manner; the heat dissipation pins are fixed by the fact that the bottom of the upper meter shell penetrates through the round hole and is inserted into the cylindrical structure of the upper meter shell in an interference fit mode.
Preferably, the inner bottom shell further comprises a blade; four groups of blades are rotatably arranged on the periphery of the top of the inner bottom shell through a rotating shaft structure, and the blades are inclined inwards by 40 degrees.
Preferably, the inner bottom shell further comprises a pulling opening; the connecting shaft of the inner bottom shell is of an arc-shaped block structure, and the middle of each arc-shaped block is provided with a pulling opening; the top of the front end of the pull-up opening is integrally provided with barb structures, and the barbs at the bottom of the hook legs are interlocked with the barb structures at the top of the pull-up opening after installation.
III) beneficial effects
The invention provides a laminated flexible microelectronic packaging structure, which provides a knowledge protection function for the packaging structure by arranging a blade and a pull-up opening, wherein the pull-up opening and a hook foot are of a slightly inclined staggered structure and can be elastically deformed and fixed by sliding an inclined plane; secondly, metal radiating fin and metal casing's setting provides good thermal diffusivity for packaging structure, and metal radiating fin inside contacts with the chip top completely, and metal radiating fin passes through radiating pin and metal casing direct contact simultaneously, and the cooperation radiating pin has promoted packaging structure's heat radiating area in a large number, is favorable to quick heat dissipation.
Drawings
FIG. 1 is a schematic perspective view of an embodiment of the present invention;
FIG. 2 is a schematic perspective exploded view of an embodiment of the present invention;
FIG. 3 is a bottom exploded view of the embodiment of the present invention;
FIG. 4 is a schematic bottom view of the upper housing according to the embodiment of the present invention;
figure 5 is a schematic perspective view in half section of a lower case according to an embodiment of the present invention;
fig. 6 is a schematic perspective view of a sealing plug according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of a half-sectional structure of the inner bottom case according to the embodiment of the present invention;
FIG. 8 is an enlarged partial structural view of part A in the embodiment of the present invention;
in fig. 1 to 8, the correspondence between the part names or lines and the reference numbers is:
1. upper watch case, 101, hook foot, 2, lower watch case, 3, sealing plug, 4, metal heat sink, 401, heat sink, 5, metal shell, 6, inner bottom shell, 601, blade, 602, and lifting opening.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1 to 8, an embodiment of the present invention includes: a laminated flexible microelectronic package structure comprising an upper case 1; a plurality of groups of round holes are arranged in the middle of the upper watchcase 1; the bottom of the upper watchcase 1 is fixedly provided with a lower watchcase 2 through a bolt; wherein, the top convex parts between the splicing structures of the lower shell 2 are all provided with elliptical grooves, and when the splicing structures are fixed, sealing plugs 3 are all fixedly arranged in the elliptical grooves; through holes are formed in the middle of the sealing plugs 3, and the sealing plugs 3 are all made of elliptic silica gel materials; a metal shell 5 is fixedly arranged at the top of the upper watchcase 1; wherein, the bottom of the metal shell 5 is integrally provided with a plurality of groups of cylinder structures, and the number of the circular hole structures is the same as that of the circular holes in the upper surface shell 1; the cylindrical structures of the metal shell 5 are inserted into the circular holes in the upper meter shell 1 and fixed through interference fit; the heat dissipation pins 401 are fixed by the interference fit by inserting the bottom of the upper watch case 1 into the cylindrical structure of the metal case 5 through the round hole; a metal radiating fin 4 is fixedly arranged on the inner side of the top of the upper watchcase 1; wherein, the metal heat sink 4 further comprises a heat sink pin 401; the top of the metal radiating fin 4 is integrally provided with a plurality of groups of radiating pins 401, and the number of the radiating pins 401 is the same as that of the round holes in the upper meter shell 1; wherein, the upper watch case 1 also comprises a hook foot 101; round holes are formed in the periphery of the bottom of the metal radiating fin 4, and the positions of the round holes and the radiating pins 401 are staggered; four groups of hook feet 101 are integrally arranged at the bottom of the upper watch case 1, the bottoms of the hook feet 101 are all provided with hook structures and are inclined inwards by 45 degrees, and meanwhile, the hook feet 101 are arranged in circular holes of the metal radiating fins 4; an inner bottom shell 6 is fixedly arranged on the inner side of the lower watchcase 2; wherein, the inner bottom shell 6 also comprises a blade 601; four groups of blades 601 are rotatably arranged around the top of the inner bottom shell 6 through a rotating shaft structure, and the blades 601 are inclined inwards by 40 degrees.
Wherein, the upper surface shell 1 and the lower surface shell 2 are fixedly connected by bolts arranged on the periphery; a plurality of groups of inserting structures are integrally arranged on the periphery of the bottom of the upper meter shell 1; a plurality of groups of inserting structures are integrally arranged on the periphery of the top of the lower shell 2, and two sides of the inserting structures of the upper shell 1 and the lower shell 2 can be spliced in a matching way; the top protruding parts between the plugging structures of the upper meter shell 1 and the lower meter shell 2 are provided with elliptical grooves.
Wherein, the inner bottom shell 6 also comprises a pulling-up port 602; the connecting shaft of the inner bottom shell 6 is of an arc surface block structure, and the middle of each arc surface block is provided with a pulling-up port 602; the top of the front end of the pull-up opening 602 is integrally provided with a barb structure, and the barb of the bottom of the hook foot 402 is interlocked with the barb structure at the top of the pull-up opening 602 after installation.
The working principle is as follows: a plurality of groups of round holes are arranged in the middle of the upper watch case 1; the lower watchcase 2 is fixedly arranged at the bottom of the upper watchcase 1 through a bolt; a metal shell 5 is fixedly arranged at the top of the upper watch shell 1; a metal radiating fin 4 is fixedly arranged on the inner side of the top of the upper watch case 1; an inner bottom shell 6 is fixedly arranged on the inner side of the lower watchcase 2; the upper meter shell 1 and the lower meter shell 2 are fixedly connected by bolts arranged on the periphery; a plurality of groups of inserting structures are integrally arranged on the periphery of the bottom of the upper meter shell 1; a plurality of groups of plug-in structures are integrally arranged on the periphery of the top of the lower watch case 2, and the two sides of the plug-in structures of the upper watch case 1 and the lower watch case 2 are spliced in a matching way; an elliptic groove is formed at the top protruding part between the splicing structures of the upper watch shell 1 and the lower watch shell 2; an elliptical groove is formed in the top protruding part between the plug-in structures of the lower watch case 2, and a sealing plug 3 is fixedly arranged in the elliptical groove when the plug-in structures are fixed; a through hole is arranged in the middle of the sealing plug 3; a plurality of groups of radiating pins 401 are integrally arranged on the top of the metal radiating fin 4; a plurality of groups of cylinder structures are integrally arranged at the bottom of the metal shell 5; inserting the cylindrical structure of the metal shell 5 into a round hole in the upper watch case 1 and fixing the cylindrical structure by interference fit, and inserting the heat dissipation pin 401 into the cylindrical structure of the metal shell 5 from the bottom of the upper watch case 1 through the round hole and fixing the cylindrical structure by interference fit; four groups of blades 601 are rotatably arranged around the top of the inner bottom shell 6 through a rotating shaft structure, and a pull-up opening 602 is formed in the middle of the cambered surface block; set up barb structure at the front end top integral type of drawing rising mouth 602, with hook foot 101 bottom barb and the interlocking of drawing rising mouth 602 top barb structure after the installation, set up the chip core into cross structure during the use, leave at the four corners and establish scarce groove structure so that the assembly, after the assembly, if when suffering the dismantlement, hook foot 101 will draw rising mouth 602 and pull, pull up blade 601 and destroy the chip to technical theftproof is carried out.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (8)
1. A stacked flexible microelectronic package structure, characterized by: comprising an upper watch case (1); a plurality of groups of round holes are formed in the middle of the upper watch case (1); the bottom of the upper watchcase (1) is fixedly provided with a lower watchcase (2) through a bolt; the top of the upper watchcase (1) is fixedly provided with a shell (5); a metal radiating fin (4) is fixedly arranged on the inner side of the top of the upper meter shell (1); an inner bottom shell (6) is fixedly arranged on the inner side of the lower meter shell (2).
2. A stacked flexible microelectronic package structure according to claim 1, characterized in that: the upper meter shell (1) and the lower meter shell (2) are fixedly connected through bolts arranged on the periphery; a plurality of groups of inserting structures are integrally arranged on the periphery of the bottom of the upper meter shell (1); a plurality of groups of inserting structures are integrally arranged on the periphery of the top of the lower watch case (2), and two sides of the inserting structures of the upper watch case (1) and the lower watch case (2) can be spliced in a matching way; and elliptical grooves are formed in the top protruding parts between the inserting structures of the upper meter shell (1) and the lower meter shell (2).
3. A stacked flexible microelectronic package structure according to claim 1, characterized in that: elliptical grooves are formed in the protruding positions of the top parts between the inserting structures of the lower watch case (2), and sealing plugs (3) are fixedly arranged in the elliptical grooves when the inserting structures are fixed; the middle of the sealing plug (3) is provided with a through hole, and the sealing plug (3) is made of oval silica gel.
4. A stacked flexible microelectronic package structure according to claim 1, characterized in that: the metal radiating fin (4) further comprises a radiating pin (401); the top of the metal radiating fin (4) is integrally provided with a plurality of groups of radiating pins (401), and the number of the radiating pins (401) is the same as that of the round holes in the upper meter shell (1); and a strong glue is smeared on the contact surface between the top of the metal radiating fin (4) and the bottom of the upper meter shell (1).
5. A stacked flexible microelectronic package structure according to claim 1, characterized in that: the upper watch case (1) also comprises a hook foot (101); round holes are formed in the periphery of the bottom of the metal radiating fin (4), and the round holes are staggered with the radiating pins (401); go up watchcase (1) bottom integral type and be provided with four groups hook foot (101), and the bottom of hook foot (101) all sets up to the couple structure and inwards inclines 45, hook foot (101) set up in metal fin (4) round hole simultaneously.
6. A stacked flexible microelectronic package structure according to claim 1, characterized in that: a plurality of groups of cylinder structures are integrally arranged at the bottom of the shell (5), and the number of the circular hole structures is the same as that of the circular holes in the upper shell (1); the cylindrical structures of the shell (5) are inserted into the round holes in the upper shell (1) and fixed through interference fit; the heat dissipation pins (401) are fixed by the fact that the bottom of the upper meter shell (1) penetrates through the round hole and is inserted into the cylindrical structure of the shell (5) through interference fit.
7. A stacked flexible microelectronic package structure according to claim 1, characterized in that: the inner bottom shell (6) also comprises a blade (601); four groups of blades (601) are rotatably arranged on the periphery of the top of the inner bottom shell (6) through a rotating shaft structure, and the blades (601) are inclined inwards by 40 degrees.
8. A stacked flexible microelectronic package structure according to claim 1, characterized in that: the inner bottom shell (6) also comprises a pulling-up opening (602); the connecting shaft of the inner bottom shell (6) is of an arc-shaped block structure, and the middle of each arc-shaped block is provided with a pull-up opening (602); the top of the front end of the pull-up opening (602) is integrally provided with barb structures, and the barbs at the bottom of the hook feet (402) are interlocked with the barb structures at the top of the pull-up opening (602) after installation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010082437.XA CN111276454A (en) | 2020-02-07 | 2020-02-07 | Laminated flexible microelectronic packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010082437.XA CN111276454A (en) | 2020-02-07 | 2020-02-07 | Laminated flexible microelectronic packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111276454A true CN111276454A (en) | 2020-06-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010082437.XA Withdrawn CN111276454A (en) | 2020-02-07 | 2020-02-07 | Laminated flexible microelectronic packaging structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN111276454A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113394189A (en) * | 2021-06-11 | 2021-09-14 | 广州市粤创芯科技有限公司 | Integrated circuit packaging structure with double rows of pins and packaging process thereof |
-
2020
- 2020-02-07 CN CN202010082437.XA patent/CN111276454A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113394189A (en) * | 2021-06-11 | 2021-09-14 | 广州市粤创芯科技有限公司 | Integrated circuit packaging structure with double rows of pins and packaging process thereof |
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Application publication date: 20200612 |
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| WW01 | Invention patent application withdrawn after publication |