CN111263536A - Production method of multilayer printed circuit board - Google Patents
Production method of multilayer printed circuit board Download PDFInfo
- Publication number
- CN111263536A CN111263536A CN202010201064.3A CN202010201064A CN111263536A CN 111263536 A CN111263536 A CN 111263536A CN 202010201064 A CN202010201064 A CN 202010201064A CN 111263536 A CN111263536 A CN 111263536A
- Authority
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- China
- Prior art keywords
- circuit board
- plate
- inner layer
- prepreg
- printed circuit
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 claims abstract description 35
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 23
- 238000010030 laminating Methods 0.000 claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 claims abstract description 14
- 239000010949 copper Substances 0.000 claims abstract description 14
- 238000000151 deposition Methods 0.000 claims abstract description 11
- 238000005553 drilling Methods 0.000 claims abstract description 11
- 238000004381 surface treatment Methods 0.000 claims abstract description 11
- 238000009713 electroplating Methods 0.000 claims abstract description 7
- 239000003292 glue Substances 0.000 claims abstract description 7
- 230000007547 defect Effects 0.000 claims abstract description 4
- 238000004806 packaging method and process Methods 0.000 claims abstract description 4
- 229920001131 Pulp (paper) Polymers 0.000 claims description 16
- 239000000835 fiber Substances 0.000 claims description 16
- 239000003365 glass fiber Substances 0.000 claims description 15
- 238000000227 grinding Methods 0.000 claims description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 9
- 239000011889 copper foil Substances 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 9
- 229920002120 photoresistant polymer Polymers 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 9
- 238000005406 washing Methods 0.000 claims description 9
- 238000007788 roughening Methods 0.000 claims description 8
- 238000010009 beating Methods 0.000 claims description 6
- 238000010586 diagram Methods 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 238000005516 engineering process Methods 0.000 claims description 4
- 239000012779 reinforcing material Substances 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 claims description 3
- 230000001680 brushing effect Effects 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000005202 decontamination Methods 0.000 claims description 3
- 230000003588 decontaminative effect Effects 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 239000004745 nonwoven fabric Substances 0.000 claims description 3
- 238000005554 pickling Methods 0.000 claims description 3
- 239000000049 pigment Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 238000005488 sandblasting Methods 0.000 claims description 3
- 238000005201 scrubbing Methods 0.000 claims description 3
- 238000002791 soaking Methods 0.000 claims description 3
- 230000003746 surface roughness Effects 0.000 claims description 3
- 230000001590 oxidative effect Effects 0.000 claims description 2
- 239000000654 additive Substances 0.000 abstract description 4
- 230000000996 additive effect Effects 0.000 abstract description 4
- 230000000704 physical effect Effects 0.000 abstract description 3
- 239000003153 chemical reaction reagent Substances 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 49
- 238000011161 development Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000036314 physical performance Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a method for producing a multilayer printed circuit board, which specifically comprises the following steps: s1: preparing an inner layer plate; s2: carrying out surface treatment on the inner-layer plate; s3: preparing a prepreg; s4: laminating the inner layer plate and the prepreg through a laminating machine; s5: drilling and depositing copper, and communicating the upper and lower inner layer boards of the laminated circuit board through the processes of drilling, deburring, removing glue residues, chemically depositing copper and electroplating; s6: preparing an outer plate; s7: performing wet ink character printing by adopting full-automatic equipment; s8: and (4) detecting the size, surface defects and electrical property of the printed circuit board product, and packaging qualified products. The invention produces the inner layer board by the subtractive method and produces the outer layer board by the additive method, and the two methods are combined, thereby greatly improving the production efficiency, improving the physical property of the prepreg by improving and optimizing the reagent formula of the prepreg and the surface structure of the inner layer board, improving the strength of the multilayer circuit board and avoiding looseness.
Description
Technical Field
The invention relates to the technical field of printed circuit board production, in particular to a method for producing a multilayer printed circuit board.
Background
The printed circuit board is also called as printed circuit board, it is the provider of electric connection of electronic components, its development has been over 100 years history, its design is mainly the territory design, the main advantage of adopting the circuit board is to greatly reduce the mistake of wiring and assembly, has improved automation level and production labor rate, can be divided into single-sided board, double-sided board, four-layer board, six-layer board and other multilayer circuit boards according to the number of layers of circuit board, in recent decades, the printed circuit board manufacturing industry of our country has developed rapidly, total output double-position is the first in the world, because the electronic product is different day by day, price war has changed the structure of the supply chain, China has industrial distribution, cost and market advantage concurrently, have become the most important printed circuit board production base in the world, the printed circuit board develops from single-layer board to double-sided board, multilayer board and flexible board, the development of high density and high reliability, continuously reducing volume, reducing cost and improving performance, so that the printed circuit board still keeps powerful vitality in the development process of future electronic products, the development trend of the production and manufacturing technology of the printed circuit board in the future is to develop towards high density, high precision, fine aperture, fine lead, small spacing, high reliability, multilayering, high-speed transmission, light weight and thinness in performance, in order to increase the area capable of wiring, more single or double-sided wiring boards are used, a printed circuit board with one double-sided as an inner layer, two single-sided as an outer layer or two double-sided as an inner layer and two single-sided as an outer layer is used, the printed circuit board which is alternately connected together through a positioning system and insulating bonding materials and conducting patterns are interconnected according to the design requirement becomes a four-layer or six-layer printed circuit board, also called a multilayer printed circuit board, the existing multilayer printed circuit board has low strength, easy loosening between layers and low production efficiency, so that the prior art needs to be improved to solve the problems.
Disclosure of Invention
The invention aims to provide a method for producing a multilayer printed circuit board, which aims to solve the problems that the existing multilayer printed circuit board in the background art is low in strength, easy to loosen between layers and low in production efficiency.
In order to achieve the purpose, the invention provides the following technical scheme: a method for producing a multilayer printed circuit board specifically comprises the following steps:
s1: preparing an inner layer plate;
s2: carrying out surface treatment on the inner-layer plate;
s3: preparing a prepreg;
s4: laminating the inner layer plate and the prepreg through a laminating machine;
s5: drilling and depositing copper, and communicating the upper and lower inner layer boards of the laminated circuit board through the processes of drilling, deburring, removing glue residues, chemically depositing copper and electroplating;
s6: preparing an outer plate;
s7: performing wet ink character printing by adopting full-automatic equipment;
s8: and (4) detecting the size, surface defects and electrical property of the printed circuit board product, and packaging qualified products.
Preferably, the specific production method of the inner layer plate comprises the following steps:
s11: cutting the copper-clad plate into small plates meeting the size requirements of printing or customer finished products;
s21: performing decontamination and coarsening treatment, namely sequentially performing washing, pickling, washing, scrubbing, washing and drying on the cut small plates to remove dirt on the surfaces of the small plates and enable the surface roughness to meet production requirements;
s31: attaching a wet film to the surface of a copper-clad plate, making a pre-designed circuit diagram on a light-transmitting film mask, printing a required part to be opaque, coating photosensitive pigment on the wet film, placing the prepared film mask on a circuit board, irradiating for several minutes by ultraviolet light, and displaying the pattern on the wet film by a developer after removing the mask;
s41: the inner layer plate is put into the corrosive liquid, the part which is not covered by the wet film is corroded away, and finally the film removing operation is carried out.
Preferably, the surface treatment of the inner plate is specifically as follows: processing a plurality of pits distributed in a lattice shape on the surface of an inner layer plate, wherein the cross section of each pit is in an inverted round table shape, and then sequentially carrying out surface treatment items such as soaking in dilute acid, brushing with a brush roller, roughening, oxidizing, drying and the like on the inner layer plate, wherein the roughening treatment is carried out by adopting a corona, sand blasting, ceramic grinding plate, needle roller grinding plate, volcanic ash grinding plate or non-woven fabric grinding plate method.
Preferably, the prepreg is made by impregnating epoxy resin and a reinforcing material, the reinforcing material is provided with a mixture of wood pulp fibers and glass fibers, and the specific production method of the prepreg comprises the following steps:
s12: uniformly mixing wood pulp fibers and glass fibers according to the proportion of 1: 4, wherein the beating degree of the wood pulp fibers is set to be 35 DEG SR, and the beating degree of the glass fibers is set to be 30 DEG SR;
s22: producing glass fiber and wood pulp fiber wet-process non-woven mats by using a wet-process non-woven technology;
s32: and gluing the thin felt, wherein the glue is set to be impregnated with epoxy resin, and thus the prepreg is obtained.
Preferably, the specific method of pressing is as follows: punching is carried out at four corners of the inner plate, and a plurality of inner plates are fixed on a film pressing plate of a laminating machine through rivets to prevent deviation, and the layers are isolated by a prepreg, copper foils are arranged on the top surface and the bottom surface, then the upper and lower pressing plates of the laminating machine are heated and pressurized, and the resin of the prepreg is melted, flowed and solidified, so that the layers are bonded together to form a semi-finished multilayer plate with inner layer patterns.
Preferably, the specific production method of the outer plate comprises the following steps:
s13: covering a photoresist on the surface of the copper foil of the semi-finished circuit board after drilling and copper deposition and compacting;
s23: making a pre-designed circuit diagram on a negative film, printing a required part into a transparent color, exposing by ultraviolet light and developing so as to expose the required part;
s33: using electroplating to thicken the copper thickness of the formal circuit on the circuit board to a required specification, and plating a layer of anti-etching resistance agent metal thin tin;
s43: then removing the film to remove the photoresist, and etching the copper foil layer under the photoresist by an etching method;
s53: finally, removing tin by using a tin removing liquid.
Compared with the prior art, the invention has the beneficial effects that:
(1) the invention produces the inner layer plate by the subtractive method and produces the outer layer plate by the additive method, and the two methods are combined, thereby greatly improving the production efficiency.
(2) According to the invention, the physical performance of the prepreg is improved by improving and optimizing the reagent formula of the prepreg, the strength, the elongation at break and the folding resistance of the prepreg can be obviously improved by adding the wood pulp fiber, the strength of the multilayer circuit board is improved, and the looseness of the multilayer circuit board is avoided.
(3) The surface of the inner layer plate is processed with lattice-shaped pits and various roughening measures, and the surface state of the inner layer plate can be obviously changed through the surface treatment, so that the surface area and the polarity of the inner layer plate are greatly improved, the binding force of a binding interface is fully improved, the connection between the prepreg and the inner layer plate can be tighter, and the finished printed circuit board is not easy to loosen.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The embodiment provided by the invention comprises the following steps: a production method of a multilayer printed circuit board specifically comprises the following steps:
s1: preparing an inner layer plate;
s2: carrying out surface treatment on the inner-layer plate;
s3: preparing a prepreg;
s4: laminating the inner layer plate and the prepreg through a laminating machine;
s5: drilling and depositing copper, and communicating the upper and lower inner layer boards of the laminated circuit board through the processes of drilling, deburring, removing glue residues, chemically depositing copper and electroplating;
s6: preparing an outer plate;
s7: performing wet ink character printing by adopting full-automatic equipment;
s8: and (4) detecting the size, surface defects and electrical property of the printed circuit board product, and packaging qualified products.
Further, the inner layer board is produced by a subtractive method, and the specific production method of the inner layer board comprises the following steps:
s11: cutting the copper-clad plate into small plates meeting the size requirements of printing or customer finished products;
s21: performing decontamination and coarsening treatment, namely sequentially performing washing, pickling, washing, scrubbing, washing and drying on the cut small plates to remove dirt on the surfaces of the small plates and enable the surface roughness to meet production requirements;
s31: attaching a wet film to the surface of a copper-clad plate, making a pre-designed circuit diagram on a light-transmitting film mask, printing a required part to be opaque, coating photosensitive pigment on the wet film, placing the prepared film mask on a circuit board, irradiating for several minutes by ultraviolet light, and displaying the pattern on the wet film by a developer after removing the mask;
s41: the inner layer plate is put into the corrosive liquid, the part which is not covered by the wet film is corroded away, and finally the film removing operation is carried out.
Further, the surface treatment of the inner-layer plate is specifically as follows: the surface of the inner plate is processed into a plurality of pits which are distributed in a lattice shape, the cross section of each pit is arranged to be in an inverted round table shape, and then the inner plate is sequentially subjected to surface treatment items such as soaking with dilute acid, brushing with a brush roller, roughening, oxidation and drying, wherein the roughening treatment is carried out by adopting corona, sand blasting, ceramic grinding plate, needle roller grinding plate, volcanic ash grinding plate or non-woven fabric grinding plate methods.
Further, the prepreg is made by impregnating epoxy resin and reinforced material, and the reinforced material is glass fiber cloth, reinforced material sets up the mixture of wood pulp fiber and glass fiber, the glass fiber cloth of making by glass fiber and wood pulp fiber, and the physical properties of prepreg can be obviously improved in the addition of wood pulp fiber, and the concrete production method of prepreg includes the following steps:
s12: uniformly mixing wood pulp fibers and glass fibers according to the proportion of 1: 4, wherein the beating degree of the wood pulp fibers is set to be 35 DEG SR, and the beating degree of the glass fibers is set to be 30 DEG SR;
s22: producing glass fiber and wood pulp fiber wet-process non-woven mats by using a wet-process non-woven technology;
s32: and gluing the thin felt, wherein the glue is set to be impregnated with epoxy resin, and thus the prepreg is obtained.
Further, the specific method for pressing is as follows: punching is carried out at four corners of the inner plate, and a plurality of inner plates are fixed on a film pressing plate of a laminating machine through rivets to prevent deviation, and the layers are isolated by a prepreg, copper foils are arranged on the top surface and the bottom surface, then the upper and lower pressing plates of the laminating machine are heated and pressurized, and the resin of the prepreg is melted, flowed and solidified, so that the layers are bonded together to form a semi-finished multilayer plate with inner layer patterns.
Further, the outer plate is produced by an additive method, and the specific production method of the outer plate comprises the following steps:
s13: covering a photoresist on the surface of the copper foil of the semi-finished circuit board after drilling and copper deposition and compacting;
s23: making a pre-designed circuit diagram on a negative film, printing a required part into a transparent color, exposing by ultraviolet light and developing so as to expose the required part;
s33: using electroplating to thicken the copper thickness of the formal circuit on the circuit board to a required specification, and plating a layer of anti-etching resistance agent metal thin tin;
s43: then removing the film to remove the photoresist, and etching the copper foil layer under the photoresist by an etching method;
s53: finally, removing tin by using a tin removing liquid.
The working principle is as follows: the invention produces the inner layer board by a subtractive method, produces the outer layer board by an additive method, and adds a certain amount of wood pulp fiber when producing the prepreg, thereby improving the physical property of the prepreg, obviously improving the strength, the elongation at break and the folding endurance of the prepreg, processing the surface of the inner layer board before laminating, and carrying out lattice-shaped pits and various roughening measures, thereby obviously changing the surface state of the inner layer board, increasing the surface area and the polarity of the inner layer board, fully improving the binding force of a binding interface, leading the connection between the prepreg and the inner layer board to be tighter, and leading the finished product of the printed circuit board not to be easy to loosen.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
The above are only preferred embodiments of the present invention, and the present invention is not limited thereto, and any modifications to the technical solutions described in the above embodiments, and equivalents of some technical features are included in the scope of the present invention.
Claims (6)
1. A method for producing a multilayer printed circuit board is characterized in that: the method specifically comprises the following steps:
s1: preparing an inner layer plate;
s2: carrying out surface treatment on the inner-layer plate;
s3: preparing a prepreg;
s4: laminating the inner layer plate and the prepreg through a laminating machine;
s5: drilling and depositing copper, and communicating the upper and lower inner layer boards of the laminated circuit board through the processes of drilling, deburring, removing glue residues, chemically depositing copper and electroplating;
s6: preparing an outer plate;
s7: performing wet ink character printing by adopting full-automatic equipment;
s8: and (4) detecting the size, surface defects and electrical property of the printed circuit board product, and packaging qualified products.
2. A method for producing a multilayer printed circuit board according to claim 1, characterized in that: the specific production method of the inner layer plate comprises the following steps:
s11: cutting the copper-clad plate into small plates meeting the size requirements of printing or customer finished products;
s21: performing decontamination and coarsening treatment, namely sequentially performing washing, pickling, washing, scrubbing, washing and drying on the cut small plates to remove dirt on the surfaces of the small plates and enable the surface roughness to meet production requirements;
s31: attaching a wet film to the surface of a copper-clad plate, making a pre-designed circuit diagram on a light-transmitting film mask, printing a required part to be opaque, coating photosensitive pigment on the wet film, placing the prepared film mask on a circuit board, irradiating for several minutes by ultraviolet light, and displaying the pattern on the wet film by a developer after removing the mask;
s41: the inner layer plate is put into the corrosive liquid, the part which is not covered by the wet film is corroded away, and finally the film removing operation is carried out.
3. A method for producing a multilayer printed circuit board according to claim 1, characterized in that: the surface treatment of the inner-layer plate comprises the following specific steps: processing a plurality of pits distributed in a lattice shape on the surface of an inner layer plate, wherein the cross section of each pit is in an inverted round table shape, and then sequentially carrying out surface treatment items such as soaking in dilute acid, brushing with a brush roller, roughening, oxidizing, drying and the like on the inner layer plate, wherein the roughening treatment is carried out by adopting a corona, sand blasting, ceramic grinding plate, needle roller grinding plate, volcanic ash grinding plate or non-woven fabric grinding plate method.
4. A method for producing a multilayer printed circuit board according to claim 1, characterized in that: the prepreg is prepared by impregnating epoxy resin and a reinforcing material, the reinforcing material is provided with a mixture of wood pulp fibers and glass fibers, and the specific production method of the prepreg comprises the following steps:
s12: uniformly mixing wood pulp fibers and glass fibers according to the proportion of 1: 4, wherein the beating degree of the wood pulp fibers is set to be 35 DEG SR, and the beating degree of the glass fibers is set to be 30 DEG SR;
s22: producing glass fiber and wood pulp fiber wet-process non-woven mats by using a wet-process non-woven technology;
s32: and gluing the thin felt, wherein the glue is set to be impregnated with epoxy resin, and thus the prepreg is obtained.
5. A method for producing a multilayer printed circuit board according to claim 1, characterized in that: the specific method for pressing comprises the following steps: punching is carried out at four corners of the inner plate, and a plurality of inner plates are fixed on a film pressing plate of a laminating machine through rivets to prevent deviation, and the layers are isolated by a prepreg, copper foils are arranged on the top surface and the bottom surface, then the upper and lower pressing plates of the laminating machine are heated and pressurized, and the resin of the prepreg is melted, flowed and solidified, so that the layers are bonded together to form a semi-finished multilayer plate with inner layer patterns.
6. A method for producing a multilayer printed circuit board according to claim 1, characterized in that: the specific production method of the outer plate comprises the following steps:
s13: covering a photoresist on the surface of the copper foil of the semi-finished circuit board after drilling and copper deposition and compacting;
s23: making a pre-designed circuit diagram on a negative film, printing a required part into a transparent color, exposing by ultraviolet light and developing so as to expose the required part;
s33: using electroplating to thicken the copper thickness of the formal circuit on the circuit board to a required specification, and plating a layer of anti-etching resistance agent metal thin tin;
s43: then removing the film to remove the photoresist, and etching the copper foil layer under the photoresist by an etching method;
s53: finally, removing tin by using a tin removing liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010201064.3A CN111263536A (en) | 2020-03-20 | 2020-03-20 | Production method of multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010201064.3A CN111263536A (en) | 2020-03-20 | 2020-03-20 | Production method of multilayer printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN111263536A true CN111263536A (en) | 2020-06-09 |
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| CN202010201064.3A Pending CN111263536A (en) | 2020-03-20 | 2020-03-20 | Production method of multilayer printed circuit board |
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| CN (1) | CN111263536A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112770507A (en) * | 2020-12-10 | 2021-05-07 | 惠州市特创电子科技股份有限公司 | Corona resistance welding circuit board and preparation method thereof |
| CN115484743A (en) * | 2022-10-12 | 2022-12-16 | 江西弘信柔性电子科技有限公司 | Method for manufacturing multi-copper-layer flexible plate |
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| CN102174770A (en) * | 2011-01-27 | 2011-09-07 | 深圳昊天龙邦复合材料有限公司 | Prepreg containing aromatic synthetic fiber paper and printed circuit board manufactured from same |
| US10349533B1 (en) * | 2018-09-29 | 2019-07-09 | Hongqisheng Precision Electronics (Qinhuangdao) Co., Ltd. | Multilayer circuit board and method of manufacturing the same |
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- 2020-03-20 CN CN202010201064.3A patent/CN111263536A/en active Pending
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| CN102174770A (en) * | 2011-01-27 | 2011-09-07 | 深圳昊天龙邦复合材料有限公司 | Prepreg containing aromatic synthetic fiber paper and printed circuit board manufactured from same |
| US10349533B1 (en) * | 2018-09-29 | 2019-07-09 | Hongqisheng Precision Electronics (Qinhuangdao) Co., Ltd. | Multilayer circuit board and method of manufacturing the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112770507A (en) * | 2020-12-10 | 2021-05-07 | 惠州市特创电子科技股份有限公司 | Corona resistance welding circuit board and preparation method thereof |
| CN115484743A (en) * | 2022-10-12 | 2022-12-16 | 江西弘信柔性电子科技有限公司 | Method for manufacturing multi-copper-layer flexible plate |
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Application publication date: 20200609 |