CN111261607A - Method for manufacturing chip - Google Patents
Method for manufacturing chip Download PDFInfo
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- CN111261607A CN111261607A CN202010207580.7A CN202010207580A CN111261607A CN 111261607 A CN111261607 A CN 111261607A CN 202010207580 A CN202010207580 A CN 202010207580A CN 111261607 A CN111261607 A CN 111261607A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
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Abstract
The invention discloses a manufacturing method of a chip, wherein the chip comprises a plastic package body, and the method comprises the following steps: and opening element grooves on the surface of the plastic package body and connecting grooves on the surface of the plastic package body, embedding the calibration elements into the element grooves, and arranging a connecting mechanism in the connecting grooves to connect the calibration elements with the pin ends of the chip. By the manufacturing method of the chip, the element groove and the connecting groove are formed on the surface of the plastic package body of the packaged chip, the calibration element is embedded into the element groove, and the calibration element is connected with the pin end, so that the low-cost and rapid packaging circuit is achieved, and the chip packaging of different radio frequency ports and grounding ends can be flexibly realized.
Description
Technical Field
The invention relates to the technical field of radio frequency chip testing, in particular to a manufacturing method of a chip.
Background
When the radio frequency chip is calibrated by using test equipment, chips with fixed resistance values, such as calibration chips, are required to be calibrated before testing, the calibration chips are required to be consistent with the radio frequency chip in size and only have different functions, so that the calibration chips are required to be redesigned and manufactured, in the process, a packaging scheme is required to be specially designed for the calibration chips, resistors are attached to a packaging substrate through an SMT (surface mount technology), and then circuit connection is realized through plastic packaging.
However, in the redesign and manufacturing process of the calibration chip, additional design development and investment are required, and a full-flow packaging operation is required, so that the required time of the process is long, and the calibration requirement before testing cannot be quickly met when the radio frequency chip is calibrated by using testing equipment.
Disclosure of Invention
In view of this, the embodiment of the present invention provides a method for manufacturing a chip.
In order to achieve the above purpose, the embodiments of the present invention provide the following technical solutions:
a method of manufacturing a chip, the chip including a plastic package, the method comprising:
forming element device grooves on the surface of the plastic package body and forming connecting grooves on the surface of the plastic package body;
embedding a calibration component into the component groove;
and arranging a connecting mechanism in the connecting groove to connect the calibration component with the pin end of the chip.
Preferably, the depth of the element groove is not less than the thickness of the calibration element to be buried and not more than the thickness of the plastic package body, and the cross section size is matched with the calibration element.
Preferably, the component grooves are formed by a laser technology.
Preferably, the connecting groove includes:
a first connecting groove connecting the component groove and the first pin end, and a second connecting groove connecting the component groove and the second pin end.
Preferably, the component slot is located in a region formed around the plurality of pin ends.
Preferably, the connecting groove includes:
a first connection groove connecting the component groove and the radio frequency port, and a second connection groove connecting the component groove and the ground terminal.
Preferably, the connecting grooves are formed by a laser technology.
Preferably, the width of the connecting groove is not greater than the width of the calibration component to be buried.
Preferably, the calibration component includes: and (6) calibrating the resistance.
Preferably, after the connecting groove is formed on the surface of the plastic package, before the calibration component is embedded into the component groove, the method further includes:
and taking out the pre-installed components in the chip.
Preferably, set up coupling mechanism in the spread groove will the calibration components and parts with the pin end of chip is connected, includes:
filling soldering paste in the connecting groove to connect the calibration component with the pin end of the chip;
or, solder wires are embedded in the connecting grooves to connect the calibration components with the pin ends of the chip.
Preferably, after a connection mechanism is disposed in the connection groove to connect the calibration component and the pin end of the chip, the method further includes:
and filling the element groove and the connecting groove to make the element groove and the connecting groove flush with the plastic package body around the element groove and the connecting groove.
As can be seen from the above, the present invention discloses a method for manufacturing a chip, the chip including a plastic package body, the method including: and opening element grooves on the surface of the plastic package body and connecting grooves on the surface of the plastic package body, embedding the calibration elements into the element grooves, and connecting the calibration elements with the pin ends of the chip in the connecting grooves. By the manufacturing method of the chip, the element groove and the connecting groove are formed on the surface of the plastic package body of the packaged chip, the calibration element is embedded into the element groove, and the calibration element is connected with the pin end, so that the low-cost and rapid packaging circuit is achieved, and the chip packaging of different radio frequency ports and grounding ends can be flexibly realized.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a flowchart of a method for manufacturing a chip according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a component groove formed on a surface of a plastic package of a packaged chip according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a connection slot formed on a surface of a plastic package of a packaged chip according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of embedding a calibration component in a component slot of a packaged chip according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram illustrating a connection between the calibration component and the pin terminal in the connection slot according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of another chip structure according to an embodiment of the present invention;
fig. 7 is a schematic diagram of a chip structure according to an embodiment of the present invention;
fig. 8 is a schematic diagram of a chip structure according to an embodiment of the present invention.
In one embodiment of fig. 2-5, 7 and 8, 11 is a device slot, 12 is a first connection slot, 13 is a second connection slot, 14 is an rf port, 15 is a ground, 16 is a calibration device, 17 is a first connection mechanism, and 18 is a second connection mechanism;
in another embodiment of fig. 6, 21 is a component slot, 22 is a first connection slot, 23 is a second connection slot, 24 is an rf port, 25 is a ground, 26 is an alignment component, 27 is a first connection mechanism, and 28 is a second connection mechanism.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In this application, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The invention provides a manufacturing method of a chip, wherein the chip comprises a plastic package body. The chip can be used for calibration, and the invention is not limited to the use thereof. Referring to fig. 1, a flow chart of a manufacturing method of a chip according to the invention is schematically illustrated, and is described with reference to fig. 2 as an example, the manufacturing method at least includes the following steps:
step S101: and forming element device grooves on the surface of the plastic package body.
It should be noted that, a packaged chip refers to a packaged chip, and includes: the chip calibration device comprises a frame, pin ends and a plastic package body, wherein the frame and the pin ends are packaged together by the plastic package body, at least part of a wiring part of each pin end is exposed outside the plastic package body, and element device grooves are formed in the surface of the plastic package body of a packaged chip, as shown in fig. 2, so that the element device grooves 11 capable of containing calibration elements are formed.
Step S102: and opening a connecting groove on the surface of the plastic package body.
In step S102, the connection groove is a groove connecting the component groove and the two pin ends.
Step S103: and embedding a calibration component into the component groove.
In step S103, embedding the calibration component into the component groove is to place the calibration component into the component groove so that the calibration component is not exposed out of the component groove, as shown in an embodiment of fig. 4, where the calibration component 16 in fig. 4 is a 50-ohm resistor.
Step S104: and arranging a connecting mechanism in the connecting groove to connect the calibration component with the pin end of the chip.
It should be noted that the reference numbers of the steps are only for reference, and the present embodiment does not limit the order of the steps. For example, a connecting groove can be formed on the surface of the plastic package body, and then a component groove can be formed on the surface of the plastic package body; or firstly, a component groove is formed on the surface of the plastic package body, and then a connecting groove is formed on the surface of the plastic package body.
According to the chip manufacturing method disclosed by the application, the element device groove and the connecting groove are formed in the surface of the plastic package body of the packaged chip, the calibration element is embedded into the element device groove, and the calibration element is connected with the pin ends, so that a low-cost and rapid packaging circuit is achieved.
Furthermore, the depth of the element groove is not less than the thickness of the calibration element to be buried and not more than the thickness of the plastic package body, and the section size is matched with the calibration element.
It should be noted that, in circuit packaging, the process of assembling an integrated circuit into a chip final product is simply to put a produced integrated circuit bare chip on a substrate having a bearing function, lead out pins, and then fix and package the bare chip into a whole, so that a component groove with a depth not less than the thickness of a calibration component to be buried, not more than the thickness of the plastic package body, and a cross-sectional size matched with the calibration component needs to be formed on the surface of the plastic package body of a packaged chip.
Furthermore, the component groove is formed by a laser technology.
It should be noted that the laser technology is also called laser processing, and is a processing process that uses a high-energy-density light beam to irradiate a material surface to vaporize the material or change the color of the material.
Further, the connecting groove includes:
a first connecting groove connecting the component groove and the first pin end, and a second connecting groove connecting the component groove and the second pin end.
It should be noted that, in the present application, the calibration component is packaged in the chip circuit, and needs to be connected to the pin terminals in the chip, therefore, a first connection groove connecting the component groove and the first pin terminal and a second connection groove connecting the component groove and the second pin terminal need to be opened on the surface of the plastic package body of the packaged chip, the calibration component is embedded in the component groove, and then the calibration component is connected to the first pin terminal and the second pin terminal through the opened first connection groove and second connection groove, so as to complete the assembly of the calibration component, i.e. the packaging of the calibration component.
Further, the device trench is located in an area formed around the plurality of pin ends.
Preferably, the component slot is located in a region surrounded by the plurality of pin ends. The structure of the device can be described with reference to fig. 2, that is, the device slot 11 is disposed in the space between the plurality of pin terminals to facilitate the arrangement of the connection slots and the connection mechanisms, and the space is larger than the size of the calibration device to be buried later.
Further, the connecting groove includes:
a first connection groove connecting the component groove and the radio frequency port, and a second connection groove connecting the component groove and the ground terminal.
That is, in the present embodiment, as shown in fig. 3, the first pin terminal may be embodied as the rf port 14, and the second pin terminal may be embodied as the ground terminal 15. It should be noted that, in the present application, the calibration component is connected to the ground terminal and the rf port of the packaged chip, and therefore, a first connection groove 12 for connecting the component groove 11 and the rf port 14 and a second connection groove 13 for connecting the component groove 11 and the ground terminal 15 need to be formed on the surface of the plastic package of the packaged chip, and then the calibration component 16, the rf port 14 and the ground terminal 15 form a connected circuit through the formed first connection groove 12 and second connection groove 13, as shown in fig. 7 and 8.
Furthermore, the connecting groove is formed through a laser technology.
The characteristics of the laser technology suitable for chip processing have been described above, and are not described herein again.
Preferably, the width of the connecting groove is not greater than the width of the calibration component to be buried.
It should be noted that, the width of the connection groove formed on the surface of the plastic package of the packaged chip should be set according to actual requirements, but the width of the connection groove formed should not be larger than the width of the calibration component to be buried, so that the calibration component can be prevented from moving.
It should be further noted that, if the resistor device is adopted as the calibration component in the present application, optionally, the length of the resistor device is 0.4mm, the width is 0.2mm, and the thickness is 0.2mm, a connection groove with a width of 40um to 200um needs to be opened on the surface of the plastic package body of the packaged chip, and 40um is the minimum processing width of the laser grooving device, so in the present application, the minimum grooving width of the connection groove is set according to the grooving device, the present application does not limit the minimum grooving width, but the width opened on the surface of the plastic package body of the packaged chip cannot be greater than the width of the calibration component to be buried, so that the effect of preventing the calibration component from moving can be achieved.
Preferably, the calibration component includes: and (6) calibrating the resistance.
It should be noted that, the calibration component can be selected according to actual requirements, and the calibration component is a calibration resistor in this application, and therefore, the calibration resistor needs to be embedded into the component slot.
Further, after the connecting groove is opened on the surface of the plastic package body, before the calibration component is embedded into the component groove, the method further includes:
and taking out the pre-installed components in the chip.
It should be noted that, when the packaged chip has the pre-mounted component, a step of taking out the pre-mounted component first needs to be added; when the packaged chip does not have the pre-mounted component, the calibration component is directly embedded.
It should be noted that, in practical applications, it is not necessary to take out the pre-mounted component in the packaged chip, for example, the pre-mounted component in the packaged chip may not be taken out when the function of the calibration component is not affected.
Further, set up coupling mechanism in the spread groove will calibration components and parts with the pin end of chip is connected, includes:
filling soldering paste in the connecting groove to connect the calibration component with the pin end of the chip;
or, solder wires are embedded in the connecting grooves to connect the calibration components with the pin ends of the chip.
The solder paste is a novel soldering material produced along with SMT, and is a paste mixture formed by mixing solder powder, soldering flux, other surfactants, thixotropic agents and the like. The method is mainly used for welding electronic components such as PCB surface resistance, capacitance, IC and the like in the SMT industry.
The tin wire is composed of tin alloy and an auxiliary agent, wherein the alloy component is tin-lead, and the lead-free auxiliary agent is uniformly poured into the middle part of the tin alloy.
The different assistants of solder wire kind are also different, and the assistant part improves the supplementary heat conduction of solder wire in welding process, gets rid of the oxidation, reduces by welding material surface tension, gets rid of by welding material surface greasy dirt, increase area of weld. The solder wire is characterized in that the solder wire has a certain length and diameter and can be used in cooperation with an electric iron or laser in the welding of electronic devices.
The final state of the chip adopting the manufacturing method of the scheme comprises two types:
firstly, if only simple calibration and verification are needed, the element groove and the connecting groove are not sealed;
if the method is used on the basis of mass production, the influence of the use environment on the method needs to be considered, the element device groove and the connecting groove need to be filled (such as resin is used), and planarization treatment is carried out, so that the element device groove and the connecting groove are flush with the surrounding plastic package body after treatment; thus, the components and the connecting mechanism are sealed in the chip and are of a built-in structure. In view of the second final state, the chip manufacturing method provided in this embodiment further includes, after the connecting mechanism is disposed in the connecting groove to connect the calibration component and the pin end of the chip, that:
and filling the element groove and the connecting groove to make the element groove and the connecting groove flush with the plastic package body around the element groove and the connecting groove.
In correspondence with the above-mentioned chip manufacturing method, the present application also discloses, with reference to fig. 7 and 8, a chip obtained according to the manufacturing method, the chip comprising: the plastic package body encapsulates the frame and the pin ends together, and at least part of a wiring part of the pin ends is exposed outside the plastic package body; the plastic package body is provided with:
a component slot 11 for embedding a calibration component 16;
a connecting groove connected between the lead end and the component groove 11 for providing a connecting mechanism between the lead end and the calibration component 16.
After the calibration component 16 is embedded in the component groove 11, the calibration component 16 needs to be connected to other pin terminals of the chip, and therefore, a connection mechanism for connecting the calibration component 16 and the pin and a connection groove for embedding the connection mechanism are provided between the pin terminals and the calibration component 16.
According to the chip disclosed by the invention, the element groove and the connecting groove are formed in the plastic package body of the packaged chip, the calibration element is embedded into the element groove, and the calibration element is connected with the pin end, so that a low-cost and rapid packaging circuit is achieved, and the packaging of calibration chips with different pin ends can be flexibly realized, as shown in fig. 6 and 8.
Further, the depth of the component groove 11 is not less than the thickness of the calibration component 16 to be buried and not more than the thickness of the plastic package body, and the cross-sectional dimension is matched with the calibration component 16.
It should be noted that, since the component groove 11 needs to accommodate the calibration component 16 to be buried, the depth of the component groove 11 cannot be smaller than the thickness of the calibration component 16 to be buried and cannot be larger than the thickness of the plastic package, and the cross-sectional dimension is matched with the calibration component 16, and because the cross-sectional dimension is larger than the thickness of the plastic package, the calibration component 16 cannot be buried.
Further, the component groove 11 is formed on the surface of the plastic package body by a laser grooving technology.
The characteristics of the laser technology suitable for chip processing have been described above, and are not described herein again.
Further, as shown in fig. 3, the coupling groove includes:
a first connection groove 12 connecting the component groove 11 and the first lead end;
and a second connecting groove 13 connecting the element groove 11 and the second pin end. That is, the pin terminals in the chip include a first pin terminal and a second pin terminal.
It should be noted that, in general, the calibration component 16 is connected to at least two pin terminals of the chip, and therefore, a first connection groove 12 is required to be formed for the first pin terminal, and a second connection groove 13 is required to be formed for the second pin terminal.
Preferably, the component slot is located in the area formed by the plurality of pin ends, and the structure can be described with reference to fig. 3, so that the layout of the connection slot and the connection mechanism is facilitated, and the space of the component slot is larger than the size of the calibration component to be buried later.
Further, as shown in fig. 3, the coupling groove includes:
a first connection slot 12 connecting the component slot 11 and the radio frequency port 14;
and a second connection groove 13 connecting the element groove 11 and the ground terminal 15.
That is, in the present embodiment, as shown in fig. 3, the first pin terminal may be embodied as the rf port 14, and the second pin terminal may be embodied as the ground terminal 15. It should be noted that, during the use process of the calibration component 16, the calibration component is connected between two pin terminals to be tested of the chip, and in the present invention, the ground terminal 15 and the radio frequency port 14 of the chip are specifically connected, but not limited thereto.
Furthermore, the connecting groove is formed in the surface of the plastic package body through a laser grooving technology.
The characteristics of the laser technology suitable for chip processing have been described above, and are not described herein again. Further, the chip further comprises: the calibration component 16 embedded in the component groove 11 can be configured as shown in fig. 8.
Further, the calibration component 16 includes a resistor.
It should be noted that the calibration component 16 may be a desired type of electronic component, and in the present invention, the calibration component 16 is specifically a resistor, but the calibration component 16 is not limited to a resistor.
Further, still include: the connecting mechanism is arranged in the connecting groove, one end of the connecting mechanism is connected to the pin end, and the other end of the connecting mechanism is used for connecting the calibration component.
It should be noted that the connection mechanism is mainly used for connecting the calibration component 16 to the chip pin terminals, and the connection mechanism includes a first connection mechanism 17 for cooperating with a first pin terminal (here, specifically, the rf port 14) and a second connection mechanism 18 for cooperating with a second pin terminal (here, specifically, the ground terminal 15), as shown in fig. 5.
Fig. 6 shows another embodiment of the present invention, which is to provide the component groove 21 and the first and second connection grooves 22 and 23 at different positions for the pin terminals (such as the rf port 24 and the ground terminal 25) at different positions from those in fig. 7 and 8; in fig. 8, the calibration component 26 has been embedded in the component groove 21, the first connection mechanism 27 has been disposed in the first connection groove 22, and the first connection mechanism 28 has been disposed in the first connection groove 22.
The final state of the chip adopting the scheme comprises two types:
firstly, if only simple calibration and verification are needed, the element groove and the connecting groove are not sealed;
if the method is used on the basis of mass production, the influence of the use environment on the method needs to be considered, the element device groove and the connecting groove need to be filled (such as resin is used), and planarization treatment is carried out, so that the element device groove and the connecting groove are flush with the surrounding plastic package body after treatment; thus, the components and the connecting mechanism are sealed in the chip and are of a built-in structure.
For the second final state, the chip provided in this embodiment further includes: and the filling bodies are arranged in the element grooves and the connecting grooves and are flush with the plastic package bodies around the element grooves and the connecting grooves.
Further, the connection mechanism includes: solder paste or solder wire.
The features of the solder paste or wire suitable for chip processing have been described above and will not be described further.
To facilitate understanding of the above solution, the present solution is further described below with reference to a specific embodiment:
a method of manufacturing a chip, comprising the steps of:
1. a circuit groove is firstly formed on the surface of a plastic package body on a chip, such as a radio frequency chip finished product, by a laser grooving technology, the grooving depth is required to be larger than the resistor thickness in the embedding period, for example, a resistor device, such as a component, is taken as an example (assuming that the length is 0.4mmx, the width is 0.2mmx, and the thickness is 0.2mm), a groove with the length of 0.4mm and the width of 0.2mm is required to be formed by laser, and the depth is required to be larger than 0.2mm but not to exceed the chip packaging thickness, as shown in fig. 7.
2. Then a slot of width 50um is laser cut, and the second slot is required to connect the previous larger slot with the required two pin ends, as shown in fig. 7.
3. The required buried resistance, such as the 50 ohm resistance of the above dimensions, is shown in fig. 8.
4. And connecting the pin end with the resistor to complete the packaging of the chip to be calibrated, as shown in fig. 8.
The invention has the advantages that:
1. the packaging method is simple and easy to implement, and can realize rapid packaging.
2. The input cost is very low, and a packaging circuit and a corresponding packaging process do not need to be newly designed.
3. The calibration chip of different radio frequency ports and the grounding terminal can be flexibly realized, and the connection of different radio frequency ports and the grounding terminal can be realized.
The embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, the system or system embodiments are substantially similar to the method embodiments and therefore are described in a relatively simple manner, and reference may be made to some of the descriptions of the method embodiments for related points. The above-described system and system embodiments are only illustrative, wherein the units described as separate parts may or may not be physically separate, and the parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.
Those of skill would further appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the various illustrative components and steps have been described above generally in terms of their functionality in order to clearly illustrate this interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (12)
1. A method for manufacturing a chip, wherein the chip comprises a plastic package body, the method comprising:
forming element device grooves on the surface of the plastic package body and forming connecting grooves on the surface of the plastic package body;
embedding a calibration component into the component groove;
and arranging a connecting mechanism in the connecting groove to connect the calibration component with the pin end of the chip.
2. The method for manufacturing the chip as claimed in claim 1, wherein the depth of the component groove is not less than the thickness of the calibration component to be buried and not more than the thickness of the plastic package body, and the cross-sectional dimension is adapted to the calibration component.
3. The method of claim 1 wherein the component trenches are formed by laser scribing.
4. The method of manufacturing a chip according to claim 1, wherein the connection grooves include:
a first connecting groove connecting the component groove and the first pin end, and a second connecting groove connecting the component groove and the second pin end.
5. The method of manufacturing a chip according to claim 4, wherein the component groove is located in a region surrounded by a plurality of lead ends.
6. The method of manufacturing a chip according to claim 1, wherein the connection grooves include:
a first connection groove connecting the component groove and the radio frequency port, and a second connection groove connecting the component groove and the ground terminal.
7. The method of manufacturing a chip according to claim 1, wherein the connecting grooves are formed by a laser technique.
8. The method for manufacturing a chip according to claim 1, wherein the width of the connecting groove is not greater than the width of the calibration component to be buried.
9. The method of manufacturing a chip according to claim 1, wherein the calibration component includes: and (6) calibrating the resistance.
10. The method for manufacturing a chip according to claim 1, further comprising, after the connecting grooves are opened in the surface of the plastic package and before the step of embedding the calibration component in the component groove:
and taking out the pre-installed components in the chip.
11. The method of manufacturing a chip according to claim 1, wherein the disposing a connection mechanism in the connection groove to connect the calibration component with the pin end of the chip comprises:
filling soldering paste in the connecting groove to connect the calibration component with the pin end of the chip;
or, solder wires are embedded in the connecting grooves to connect the calibration components with the pin ends of the chip.
12. The method for manufacturing a chip according to claim 1, wherein after the connecting mechanism is disposed in the connecting groove to connect the calibration component and the pin end of the chip, the method further comprises:
and filling the element groove and the connecting groove to make the element groove and the connecting groove flush with the plastic package body around the element groove and the connecting groove.
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| US20160358848A1 (en) * | 2014-03-12 | 2016-12-08 | Intel Corporation | Microelectronic package having a passive microelectronic device disposed within a package body |
| CN103985677A (en) * | 2014-06-11 | 2014-08-13 | 扬州江新电子有限公司 | Ultrathin plastic package semiconductor component frame, ultrathin plastic package semiconductor component and manufacturing method of ultrathin plastic package semiconductor component |
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