CN111241777B

CN111241777B - Method for updating and placing package pad in PCB Layout

Info

Publication number: CN111241777B
Application number: CN201911422704.7A
Authority: CN
Inventors: 马保军; 张治宇; 谭小兵; 齐前锋
Original assignee: Emdoor Digital Technology Co ltd
Current assignee: Emdoor Digital Technology Co ltd
Priority date: 2019-12-31
Filing date: 2019-12-31
Publication date: 2023-03-24
Anticipated expiration: 2039-12-31
Also published as: CN111241777A

Abstract

The invention relates to a method for updating and placing a package pad in PCB Layout, which comprises S1, selecting vector software and PCB Layout software; s2, acquiring a DXF format file of a device to be packaged newly; s3, selecting a packaging original file of a device as a first DXF format file; s4, acquiring a DXF specification of the device as a second DXF format file; s5, simultaneously opening a first DXF format file and a second DXF format file in the vector software, copying the second DXF format file into the first DXF format file, and overlapping the original points and respectively locating in different layers in the same DXF format file; s6, saving the DXF with the two example devices as a third DXF format file, and modifying the names of two different layers in the third DXF format file; and S7, importing a third DXF format file into the PCB Layout software, selecting a device with a silk-screen layer corresponding to the PCB Layout software, adding PIN, and finishing packaging manufacture. The invention solves the problems that the existing packaging method can not update the placement package and can not call the PAD.

Description

Method for updating and placing package pad in PCB Layout

Technical Field

The invention relates to the field of electronic circuit Layout, in particular to a method for updating and placing a package pad in a PCB Layout.

Background

The Layout and wiring of the electronic circuit PCB Layout and wiring play a key role in connecting hardware design and PCB production in the whole electronic product design, and a plurality of EDA PCB Layout and wiring tools are available in the market, and most of the EDA PCB Layout and wiring tools are the same in size and different in size. Generally, a Layout and wiring process of a PCB is such that a hardware engineer designs an electronic circuit schematic diagram by using EDA software and generates a NETLIST (commonly called NETLIST), and a PCB Layout engineer introduces the NETLIST into allegoro for Layout and wiring by using associated EDA software, thereby designing a file which can be produced by a factory producing PCB boards. There is a relatively important link, namely the establishment of the package, and the actual package representation form of the electronic device is the form of the electronic device on the PCB. Various problems often occur in package design, especially the problems that package PAD updating is unsuccessful and a placement link cannot be performed, so that many engineers cannot find the root of the problem, cannot find a corresponding solution, and stagnate in design planning time.

Referring to fig. 1, the specific operation flow of most EAD software such as Allegro PCB Layout is:

firstly, according to the specification of the electronic device and the connector, which is a DXF format document (theoretically, the unit is mm) which can be opened by CAD software and has the size marked, making correct surface-mountable electronic device and connector packaging (Footprint) according to the size in Allegro series software, and placing the packaging in a correct path folder set by the software to produce a callable file with a corresponding format.

Then importing a netlist (netlist) created before the root in the EDA (electronic design automation) PCB Layout software into the design Layout software, and importing a DXF (draw exchange format) plate frame of the structural design; all the related devices are packaged into a PCB frame through the Place quick placement function of the allegoro software, so that a corresponding relation is formed, and the network connection between the electronic circuit entity devices is connected in the allegoro PCB software in a packaging mode. And finally, finishing layout and wiring according to a structural drawing, and designing a complete PCB. Referring to fig. 2, the illustrated example board has two vertical HDMI (upper) and FPC (lower) pads, and a PCB board frame is provided on the periphery thereof

The quick placement of the device in the PCB layout design flow is a key point in the early stage of the design layout, and some problems that the package pad cannot be placed in the step may occur, and the problems are solved by some conventional methods, as follows:

1: all devices have packages, package pads and generate corresponding files, and theoretically, adding a correct device package placement library path in EDA allegoro software (not limited to the EDA software) can solve the problem.

2: the display interface in the alegoro EDA software does not have a complete PCB frame, all devices cannot be placed in the display interface because the placement (place) of an electronic device does not have a foot point, and the problem can be solved by newly drawing the PCB frame in the software display interface.

3: the newly added device is not packaged, and the packaged device does not produce the corresponding auxiliary file and is not added into the corresponding path packaging library.

The solution is to create a package (footprint) and a package PAD (footprint pin) and generate corresponding auxiliary files, and add all the package files into a package library to establish a correct associated path, so as to solve the problem that the package and PAD cannot be placed.

The summary of the above three problems has corresponding solutions, but the problem that the package of the device or the package PAD cannot be placed in the PCB panel frame or the problem that the new package cannot call the PDA occurs after the above series of conventional processes, which requires a lot of time to solve the problem.

In actual work, the problem is mostly related to the packaging problem of structural parts, for example, plug-in devices with related structures such as USB, HDMI, fan, type-c and the like, because the plug-in devices need to be newly built with packages and pads, the plug-in devices are all irregular devices and need to be processed by means of vector software CAD of a third party; because the EDA allguro software does not have the stronger vector coordinate function of software such as CAD (computer-aided design) and the like, the package is newly built in the EDA allguro software according to DXF (drawing exchange function) given by a supplier, one method is to draw the package and the package pad in the package software according to DXF coordinates, the method is long in time consumption and easy to generate coordinate errors, and some special-shaped pads cannot be drawn correctly, so that the method is less in use; another approach is to import DXF (theoretically in mm) with dimensions of 1,

many unforeseeable problems then arise during this one introduction, which requires much effort to solve, and sometimes inexperienced problems may not be completely solved.

Disclosure of Invention

The invention provides a method for updating a placement package PAD in a PCB Layout, and aims to solve the problems that the placement package cannot be updated and a PAD cannot be called in the conventional packaging method.

The invention provides a method for updating and placing a package pad in a PCB Layout, which comprises the following steps:

s1, selecting vector software and PCB Layout software;

s2, acquiring a new device to be packaged and having a DXF format file with a size vector;

s3, selecting a packaging original file of a device in an existing packaging database, enabling a geometric center point of the packaging original file to be at a 0.0 origin of a PCB Layout software display operation interface, and exporting a first DXF format file with a center mark and a packaging entity silk-screen layer through the PCB Layout software;

s4, acquiring a DXF specification of a device to be newly packaged from a device supplier to serve as a second DXF format file;

s5, simultaneously opening a first DXF format file and a second DXF format file in the vector software, copying the second DXF format file into the first DXF format file, and enabling device original points in the two DXF format files to be overlapped and to be respectively positioned in different layers in the same DXF format file;

s6, saving the DXF with the two example devices as a third DXF format file, and modifying the names of two different layers in the third DXF format file;

and S7, importing a third DXF format file into the PCB Layout software, selecting a device with a silk-screen layer corresponding to the PCB Layout software, adding PIN, and finishing packaging manufacture.

A project comprises the steps that firstly, a plate frame (DXF format) of a PCB and a specification (DXF specific size and relative position) of a newly packaged device are provided, a package is newly built according to the DXF format specification, required PINs PAD (PAD of the device package, namely PIN feet of the device, usually have digital numbers to represent electrical properties of the PAD, the PAD is a representation form of a weldable real object device on the PCB), the PAD of the newly built package according to the specification can be called when the package is built, and a file with a corresponding format can be generated after the PAD is built.

Simple packaging, the PCB Layout software can calculate the position of the relative geometric center of the PAD in the package by itself; and the complicated DXF format file of the specification is required to be called, in the process, the general design method directly leads the DXF format file into the PCB Layout software interface for manufacturing encapsulation, and then the encapsulation is manufactured according to the coordinates.

Most of this will be successful, but there are many uncertainty issues that arise, such as the inability of the packaged pad to be placed: sometimes, the position of the coordinate origin and sometimes the page display size are not matched, namely, the PAD can not be called out when the package is built. The package cannot be built normally and the display size of the page of the allegro production package cannot be changed because a DXF format file is imported that does not determine how much information is contained regardless of the size of the package. The reason is that the size of the operable display interface of the DXF format specification of the device on the vector software is greatly different from that of the operable display interface of the PCB Layout software needing to be packaged. It is also the core of the present invention that it is extremely time consuming to find a problem or to re-build the package.

Since the PCB Layout software can be imported and exported, the two-dimensional vector function of the vector software and the PCB electrical coordinate function of the PCB Layout software are perfectly combined by fully utilizing the function, and the problem is well solved.

By filtering out unwanted information, such as the previous pad, by using a DXF file derived from a previously called and normally used PCB Layout software encapsulated file, leaving only the DXF of the geometric center point and the coordinate origin as the first DXF format file,

operating in vector software, copying the package specification (device specification format file in DXF format as the second DXF format file), copying the needed information in the first DXF format file to coincide with the geometric coordinate origin, saving the DXF, and naming the third DXF format file with other names.

Then, the problem that PAD can not be called can be completely avoided by importing the third DXF format file in the package file PCB Layout software production interface.

As a further improvement of the present invention, in step S3, the unit is set to be mm when the first DXF format file is derived, and the precision is defaulted to be 4 significant digits after the decimal point; in step S7, when importing the third DXF format file, the unit is set to mm, and the precision is defaulted to 4 significant digits after the decimal point. The purpose is to reduce the problem of inconsistent proportion caused by converting other units, and the mm and the precision are set to 4-bit significant digits after decimal point as default during importing, so that the unpredictable problem caused by page size and precision among different software is avoided.

As a further improvement of the present invention, in step S4, after the DXF specification of the new package is given from the device vendor, the DXF specification of the new package is hidden, and information that is not needed for the new package is hidden.

As a further improvement of the present invention, the step S3 specifically further includes:

s31, selecting a DXF file exported by PCB Layout software which is called before and can be normally used, filtering out unnecessary information, and only leaving the DXF file of the geometric center point and the coordinate origin as a first DXF format file.

As a further improvement of the present invention, the step S5 specifically includes:

and S51, copying the second DXF format file in the vector software, copying the required information to be overlapped with the geometric coordinate origin of the first DXF format file, and storing the information.

As a further improvement of the present invention, in step S5, the devices in the two DXF format files are subjected to origin coincidence by using the capture origin function of the vector software.

As a further improvement of the present invention, in the step S3, the package source file of the device is a package source file that has been called and used in a large number.

As a further improvement of the invention, the vector software is 2D operation software or 3D structure operation software which can edit DXF format, and the PCB Layout software is EDA operation software.

As a further improvement of the invention, the file format of the PCB Layout software call also comprises a shape format file.

As a further improvement of the invention, the packaged device is a complex and irregular structure, or an electronic device with electrical characteristics.

The invention has the beneficial effects that: the invention solves the problems that the packaging pad can not be placed when the device is quickly placed in the PCB layout design flow in the earlier stage of the design layout and the PDA can not be called by newly-built packaging, particularly solves the problems of newly-built packaging and pad introduction of a complex irregular structural member, saves more time and energy of engineers to solve the problems, and also solves the problems that the engineers with insufficient experience can easily deal with the problems.

Drawings

FIG. 1 is an exemplary vertical HDMI of the invention requiring a package structure connector fabricated in the allegoro software;

FIG. 2 is an operation interface of the EDA allguro software quick placement device of the present invention;

FIG. 3 is a DXF specification of an exemplary vertical HDMI connector of the present invention;

FIG. 4 is an exemplary operational page size of a vertical HDMI within CAD software in accordance with the present invention;

FIG. 5 is an exemplary illustration of the overall operating display page size of the Allegro PCB per unit inch mil in accordance with the present invention;

FIG. 6 is an enlarged view of the dialog box of FIG. 5 in accordance with the present invention;

FIG. 7 is a graphical representation of the failure to place a device as occurs in the present invention;

FIG. 8 is an enlarged view of the FIG. 7 dialog box of the present invention;

FIG. 9 is a schematic diagram of the package of the horizontal HDMI with geometric center at 0.0 origin of the PCB layout software operation interface, which is massively called in EDA allegro software in the invention;

FIG. 10 is a diagram of the encapsulated DXF format of the horizontal HDMI derived in the present invention;

fig. 11 is a graph of the enclosure size for two different HDMI having the same geometric center coordinate origin with two different enclosure DXFs superimposed within one DXF in accordance with the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. The figures and embodiments illustrate an HDMI device, but the method of the present invention is not limited to applying this device.

The main purpose of the present invention is to design the Layout of the PCB by using EDA allegoro, but not limited to this software, and solve the problem that the partial package PAD cannot be updated in the actual Layout package setup design of the PCB Layout.

The invention is mainly applied to the field of packaging of electronic devices and structural connectors of PCB Layout, in particular to the field of related packaging manufacture of devices with complicated DXF format and the like.

As described in the background, the premise of designing any PCB Layout requires a schematic diagram and a structural PCB block diagram, netlists generated by the schematic diagram form a one-to-one correspondence, which is associated with hardware design,

the invention mainly relates to a DXF format designed by using Auto CAD software but not limited to 2D vector software, wherein the DXF format comprises a physical package recommended dimension marking vector diagram of an electronic device, a connector and the like, and the DXF format is combined with cadence allegoro software to manufacture a problem that a package PAD cannot be normally placed and updated in a packaging process.

In the design work of PCB Layout, all the steps of Layout, routing and the like of EDA (electronic design automation) cadence allegoro software (not limited to the software) are completed on the basis of electronic and connector device packages, a plurality of real objects such as resistors, capacitors, ICs (integrated circuits), CPUs (central processing units), connectors and the like exist on a complete circuit board, the real objects need to be attached to a naked PCB by a surface mount technology (SMT process), the packages are not completely placed in a PCB Layout software display interface, complete network attribute connection cannot be formed, and reasonable Layout cannot be achieved, so that the packages play a role in bridging and are very important.

In the existing package PAD technology, the problem that the package of the device or the package PAD can not be placed in a PCB frame still occurs after a series of conventional processing, or the problem that the new package can not call the PDA can not occur.

The reason for this problem is caused by the size vector DXF of the device, the package pad (containing shape files such as psm and ssm), the package of the device, and the Layout software of the PCB, and the operation display pages between these two are different in size and are not matched.

Theoretically, each software has a corresponding operation display page size, and when a file is imported and exported between different software, the operation display pages of the software are incompatible (have different sizes), so that bugs occur, and various problems which need to be solved in a time-consuming manner can occur.

The corresponding relationship of the operation display page size in the process design is as follows: the method comprises the steps of PCB Layout operation display page size > device packaging operation display page size > PAD packaging operation display page size > device DXF operation display page size.

As shown in FIG. 3, the DXF connector size labels provided by each connector supplier may not be the same in the operation display page size, and the Allegro package manufacturing software has more uncertainty, greater or lesser, in the operation display page size; some connector vendors provide connector sizing DXFs in 3D software derived formats such as pro/E, and thus the overall display page size of the connector sizing DXF is often uncontrolled.

As shown in fig. 4 to 6, after DXF is introduced, it is shown that the size of the operation display page of PCB Layout software becomes abnormal, and the unit cannot be modified to perform mm-mil conversion, and the precision cannot be converted after decimal point, and all the reasons are that some part of the labeled display data of the DXF format file of connector size label vector cannot be displayed in the PCB Layout software due to the inconsistent size of the operation display page, but actually is outside the page with the maximum display size of the PCB Layout software, and thus the package cannot be called, and the package pad cannot be placed and updated normally.

When the operation display page size of the connector dimension labeling vector DXF format file is larger than the page size of a PCB packaging device (when the page size is large), the file guided into the DXF format is deviated to a certain corner or the actual dimension of the device in the DXF is directly caused not to be in the allegro packaging manufacturing page, so that the dimension change of the distortion of the dimension of the allegro packaging manufacturing page is caused, and the problem that the packaging pad cannot be placed in the packaging manufacturing process is fundamental.

Fig. 7 and 8 are software screenshots of the phenomenon that device packages cannot be placed and package pads cannot be placed, and in summary, the reason is that the operation display page size of the file where the package pads are located is caused by unknown errors caused by importing DXF, and thus example package devices cannot be placed.

In summary, in order to solve the above problems, the following method is invented on the basis of reducing the complicated operation steps and improving the Layout efficiency.

A new device to be packaged and provided with a size vector DXF format file are taken firstly, and the DXF format file of the device is not imported into EDA allegoro software to manufacture the PCB package of the device according to the conventional steps.

As shown in fig. 9, a package original package file with a geometric center point of a package of a connector device located at the 0.0 origin of a PCB Layout software display operation interface and having been called in large numbers can be found in a package library of the package original package file, and a DXF format file with a center mark and a package solid screen printing layer can be derived through a self-contained function of the PCB Layout software, wherein a unit is set to be mm during derivation, and the precision is defaulted to be 4-bit effective digits after a decimal point, and it should be noted that 2D vector software such as Auto cad is generally operated by a mm unit, so as to reduce the problem of inconsistent proportion caused by converting other units, and also set to be mm during import, and the precision is defaulted to be 4-bit effective digits after the decimal point, so as to avoid unpredictable problems caused by page size and precision between different software.

As in fig. 10, by EDA software allegoro interface inner operation steps: file- -Export- -DXF- -choose the silk layer- -save the DXF name.

Then, operating in Auto CAD, and simultaneously opening two DXF format files, wherein one is a specification of a connector DXF needing new packaging given by a supplier, and hiding information which is not needed by the new packaging; second is a DXF formatted file that is exemplified (without limitation) in the first step as a horizontal HMDI wrapper;

two different DXFs capture the origin function through AUTO CAD, register the device origins of the two DXFs and copy the first DXF into the second DXF, register the origins, and are in different layers in the CAD, respectively. This is done to avoid unpredictable problems arising from inconsistent page sizes of DXFs and wrapper production software pages of the device specification.

As shown in fig. 11, reference numeral 1 is DXF requiring package creation, and reference numeral 2 is DXF of package silk-screen printing derived from mass production.

And finally, saving the DXF with the two example HDMI silk screens, modifying the names of two different layers in the DXF, avoiding the problem of importing to cover the original silk screen, selecting a required layer (required to be packaged by the HDMI) to be imported through a file-import-DXF-selecting a silk screen layer corresponding to the EDA allogoro (unit is also mm, and the precision is defaulted to be 4 effective digits after decimal point), and adding a conventional PIN (font pad) according to the DXF to complete the packaging manufacture with the effect as shown in FIG. 1.

The application range of the method for solving the packaging problem in the invention is as follows:

(1) Similar problems generated when DXF of the PCB frame is led into the allegoro PCB Layout, such as the series of problems that the package can not be completely placed, the page size of the PCB Layout is abnormal, and the like are also suitable for the invention.

(2) The special-shaped pad (shape format) and the hot air heat dissipation pad (shape format) which need to be called when the PCB Layout makes the pad are also suitable for the invention,

(3) When the PCB Layout manufactures the packaging of some common marks, such as logo, the marks such as PB, ESD and the like, and the special shape needing to be called is also suitable for the invention.

(4) The 2D operating software related to the invention patent is not limited to Auto CAD, but also can be applied to other software capable of editing DXF format.

(5) The 3D operation software mentioned in this patent is not limited to Pro/E, but also can be applied to other 3D structure-related software.

(6) The PCB Layout software operating software related to the invention patent is not limited to allegoro software, but also can be applied to other EDA software.

(7) The device package according to the present invention is not limited to a complicated structure package, and may be an electronic device package having electrical characteristics such as a CPU and an IC.

(8) The HDMI is only an example in the description of the present invention, and is not limited to this example.

The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.

Claims

1. A method for updating placement package pad in PCB Layout is characterized by comprising the following steps:

s1, selecting vector software and PCB Layout software;

s4, acquiring a DXF specification of the device to be newly packaged from a device supplier to serve as a second DXF format file;

2. The method for updating package pad placement in PCB Layout of claim 1, wherein in step S3, the unit for exporting the first DXF format file is set to mm, and the precision is defaulted to 4 significant digits after decimal point; in step S7, when importing the third DXF format file, the unit is set to mm, and the precision is defaulted to 4 significant digits after the decimal point.

3. The method for updating package pad in PCB Layout of claim 1, wherein in step S4, after the DXF specification of the package to be newly created is given from the device vendor, the DXF specification of the package to be newly created is hidden from the DXF specification of the package to be newly created.

4. The method for updating package pad placement in PCB Layout of claim 3, wherein the step S3 further comprises:

5. The method for updating package pad placement in PCB Layout of claim 4, wherein the step S5 specifically comprises:

6. The method for updating package pad placement in PCB Layout of claim 1, wherein in step S5, the device in two DXF format files are subjected to origin coincidence by a capture origin function of vector software.

7. The method for updating package pad placement in PCB Layout of claim 1, wherein in the step S3, the package source file of the device is selected from the package source files that have been called and used in a large amount.

8. The method for updating package pad placement in PCB Layout of any of claims 1 to 7, wherein the vector software is 2D operation software or 3D structure operation software capable of editing DXF format, and the PCB Layout software is EDA operation software.

9. The method for updating package pad placement in PCB Layout according to any of claims 1 to 7, wherein the file format of the PCB Layout software call further comprises shape format file.

10. The method for renewing the placement of package pad in PCB Layout according to any of claims 1 to 7, wherein the packaged device is a complex and irregular structure or an electronic device with electrical characteristics.