CN111223940B - Chip packaging structure, detecting head and detector - Google Patents
Chip packaging structure, detecting head and detector Download PDFInfo
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- CN111223940B CN111223940B CN201911231086.8A CN201911231086A CN111223940B CN 111223940 B CN111223940 B CN 111223940B CN 201911231086 A CN201911231086 A CN 201911231086A CN 111223940 B CN111223940 B CN 111223940B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/50—Encapsulations or containers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/95—Circuit arrangements
- H10F77/953—Circuit arrangements for devices having potential barriers
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
本申请提供一种芯片封装结构、探测头和探测器，芯片封装结构包括：导电外壳、导电内芯、信号接头和绝缘弹性体；待安装芯片、导电内芯和绝缘弹性体均设置在导电外壳内部；信号接头的外表面与导电外壳连接；待安装芯片的正面电极与导电外壳的一侧接触，背面电极与导电内芯接触；导电内芯远离待安装芯片背面电极的一侧与信号接头的内表面连接，且远离待安装芯片背面电极的一侧设置有绝缘弹性体；绝缘弹性体远离导电内芯的一侧与导电外壳接触。本申请实施例通过芯片的电极分别与导电外壳、导电内芯接触，形成导电回路，防止因为发热问题导致连接处断裂的情况发生。
The present application provides a chip package structure, a probe head and a detector. The chip package structure includes: a conductive outer shell, a conductive inner core, a signal connector and an insulating elastomer; the chip to be mounted, the conductive inner core and the insulating elastomer are all arranged in the conductive outer shell Internal; the outer surface of the signal connector is connected to the conductive shell; the front electrode of the chip to be installed is in contact with one side of the conductive shell, and the back electrode is in contact with the conductive inner core; the side of the conductive inner core away from the back electrode of the chip to be installed is in contact with the signal connector. The inner surface is connected, and the side away from the back electrode of the chip to be mounted is provided with an insulating elastomer; the side of the insulating elastomer away from the conductive inner core is in contact with the conductive outer shell. In the embodiment of the present application, the electrodes of the chip are respectively contacted with the conductive outer shell and the conductive inner core to form a conductive loop, so as to prevent the breakage of the connection due to the heating problem.
Description
Technical Field
The application relates to the field of electronic packaging, in particular to a chip packaging structure, a probe and a detector.
Background
With the rapid development of electronic technology, the miniaturization of packages, the densification of assembly, and the continuous emergence of various novel packaging technologies, the requirements on the quality of electronic assemblies are also higher and higher.
For a radiation detector for sensing radiation, a common electronic package is formed by connecting a contact point on a detection chip to a pin of a package housing through a wire, and filling, fixing and sealing the whole chip with epoxy resin. The detection chip is easy to generate heat during working, so that the connection part of the detection chip and the traditional electronic package is easy to break, and the detector can not detect seriously.
Disclosure of Invention
An object of the embodiments of the present application is to provide a chip package structure, a probe and a probe, so as to solve the problem that a joint between a conventional electronic package structure and a chip is prone to fracture during operation.
In a first aspect, an embodiment provides a chip package structure, including: the conductive shell, the conductive inner core, the signal connector and the insulating elastomer; the chip to be mounted, the conductive inner core and the insulating elastomer are all arranged inside the conductive shell; the signal connector is of a hollow structure, and the outer surface of the signal connector is connected with the conductive shell; the first surface of the chip to be mounted is provided with a front electrode, and the second surface of the chip to be mounted is provided with a back electrode; the front electrode of the chip to be mounted is in contact with one side of the conductive shell, and the back electrode is in contact with the conductive inner core; one side of the conductive inner core, which is far away from the back electrode of the chip to be installed, is connected with the inner surface of the signal connector, and the side, which is far away from the back electrode of the chip to be installed, is provided with the insulating elastomer; one side of the insulating elastomer, which is far away from the conductive inner core, is in contact with the conductive outer shell; the insulating elastic body is used for providing elastic force so that the front electrode of the chip to be installed is in contact with the conductive shell, and the back electrode of the chip to be installed is in contact with the conductive inner core.
This application embodiment is through setting up electrically conductive shell, electrically conductive inner core and insulating elastomer, through setting up the chip inside electrically conductive shell, the pressure that provides through insulating elastomer makes the electrode of chip respectively with electrically conductive shell, electrically conductive inner core contact, forms electrically conductive return circuit, prevents to lead to the cracked condition of junction to take place because the problem of generating heat of chip at the during operation.
In an alternative embodiment, the insulating elastic body comprises an insulating gasket and an elastic sheet, wherein a first end of the insulating gasket is in contact with a first end of the elastic sheet, and a second end of the insulating gasket is in contact with the conductive inner core; the second end of the elastic piece is in contact with the conductive shell.
This application embodiment separates electrically conductive shell and electrically conductive inner core through insulating gasket through setting up insulating gasket and flexure strip, and the rethread flexure strip provides pressure, from this, can more effectually prevent that electrically conductive shell and electrically conductive inner core contact from leading to the problem of short circuit to appear.
In an optional embodiment, a first limiting member is disposed on a side of the inner wall of the conductive housing, which is far away from the chip to be mounted, and the first limiting member is engaged with the elastic sheet.
This application embodiment sets up the locating part through on the inner wall at conductive housing, from this, through the position of the fixed flexure strip that the locating part can be better, prevents the flexure strip offset in chip package structure, leads to the inhomogeneous problem of elasticity that provides to appear.
In an optional embodiment, a second limiting member corresponding to the first limiting member is disposed at a first end of the insulating spacer, and the second limiting member is engaged with the elastic sheet.
According to the embodiment of the application, the second limiting part corresponding to the first limiting part is arranged at the first end of the insulating gasket, and the position of the elastic sheet can be effectively fixed through the cooperation of the first limiting part and the second limiting part, so that the position deviation of the elastic sheet in a chip packaging structure is prevented, and the problem of uneven elasticity is caused.
In an optional embodiment, the conductive housing includes a conductive base and a conductive cover plate, the chip to be mounted is disposed on the conductive base, and the conductive base is detachably connected to the conductive cover plate.
The embodiment of the application can dismantle the electrically conductive base and the electrically conductive apron of connection through the setting, can install, change, dismantle the chip more high-efficiently from this, the maintenance of the chip of being convenient for.
In an optional embodiment, an internal thread is arranged on the inner peripheral wall of the conductive base, an external thread is arranged on the outer peripheral wall of the conductive cover plate, and the conductive base and the conductive cover plate are detachably connected through the internal thread and the external thread.
This application embodiment is mutually supported through setting up internal thread and external screw thread for electrically conductive base can realize dismantling the connection through the cooperation of internal thread and external screw thread with electrically conductive apron, simultaneously, can also adjust the relative position of electrically conductive apron in electrically conductive base through rotatory electrically conductive apron, realizes the regulation to the pressure that insulating elastomer applyed.
In an optional implementation manner, the conductive inner core includes a conductive pin and a conductive inner base, one side of the conductive inner base is attached to the back electrode of the chip to be mounted, the other side of the conductive inner base is connected to the conductive pin, and one side of the conductive pin, which is far away from the conductive inner base, is in contact with the inner surface of the signal connector.
The embodiment of the application can be attached to the back electrode of the chip to be installed in a large area through the conductive inner base and the conductive needle in the conductive inner base, so that the stability of connection between the conductive inner core and the chip to be installed is guaranteed.
In an alternative embodiment, a first insulating member is disposed between the conductive housing and the chip to be mounted, the first insulating member is sleeved outside the chip to be mounted and the conductive core, and the first insulating member is used for separating the peripheral wall of the chip to be mounted from the conductive housing.
This application embodiment establishes through setting up the cover and treats the chip of installing and the outside first insulator of electrically conductive inner core, realizes the function that the perisporium that will treat the chip of installing separates with electrically conductive shell, prevents to treat the perisporium of installing the chip and the condition that the short circuit takes place in electrically conductive shell contact.
In an alternative embodiment, an electrical conductor is arranged between the conductive housing and the first surface of the chip to be mounted, and the electrical conductor is used for electrically connecting the front electrode of the chip to be mounted with the conductive housing; and a second insulating part is arranged between the conductive shell and the first surface of the chip to be installed, the second insulating part is connected with the first insulating part, and the second insulating part is used for separating the area except the front electrode in the first surface of the chip to be installed from the conductive shell.
This application embodiment through at electrically conductive shell with set up electric conductor and second insulator between the first face of waiting to install the chip, realize will waiting to install the separation between the region except that the positive electrode and the electrically conductive shell in the first face of chip, prevent to wait to install the condition emergence that the region except that the positive electrode leads to the short circuit with electrically conductive shell contact in the first face of chip.
In an alternative embodiment, the chip to be mounted is a radiation detection chip.
This application embodiment sets up to the radiation detection chip through waiting to install the chip for chip package structure can with the cooperation of radiation detection chip, prevent that the radiation detection chip from causing the cracked condition of junction to take place because the problem of generating heat at the during operation, influence going on of radiation detection work.
In an alternative embodiment, a window is provided on a side of the conductive housing that is in contact with the front electrode of the chip to be mounted, the window being configured to provide a passage for radiation to enter the chip to be mounted.
The embodiment of the application provides a channel for a ray to enter the chip by arranging the window so as to ensure the normal operation of the detection work of the radiation detection chip.
In a second aspect, an embodiment provides a probe head comprising: a chip to be mounted and the chip package structure of any one of the foregoing embodiments, wherein the chip to be mounted is disposed inside the chip package structure, and the chip to be mounted is configured to convert an obtained ray into an electrical signal.
The embodiment of the application can realize the function that the detection head converts the obtained rays into the electric signals through the mutual matching of the chip packaging structure and the radiation detection chip, and the chip packaging structure can provide guarantee for the stability of the work of the radiation detection chip.
In a third aspect, embodiments provide a probe, comprising: the radiation analyzer and the detection head of the foregoing embodiment, the detection head is connected to the radiation analyzer through a signal connector, and the detection head is configured to transmit an electrical signal corresponding to a radiation to the radiation analyzer through the signal connector.
The embodiment of the application mutually supports through radiation analysis appearance and detecting head, after the detecting head converts the ray into the signal of telecommunication, can give radiation analysis appearance with signal of telecommunication transmission for radiation analysis appearance can guarantee going on smoothly of radiation analysis work with the signal of telecommunication that processing analysis ray corresponds.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.
Fig. 1 is a schematic cross-sectional view of a chip package structure according to an embodiment of the present disclosure;
figure 2 is a schematic diagram of the operation of a probe head according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of a detector according to an embodiment of the present application.
Icon: 110-a conductive housing; 1101-a first limit stop; 111-a conductive base; 112-a conductive cover plate; 120-a conductive inner core; 121-conductive pins; 122-a conductive inner mount; 130-an insulating elastomer; 131-insulating spacers; 1311-first end of insulating spacer; 1312-a second end of the insulating spacer; 1313 — a second limit stop; 132-an elastic sheet; 1321-a first end of an elastic sheet; 1322-a second end of the flexible sheet; 140-a first insulator; 150-a second insulator; 160-an electrical conductor; 200-a chip to be mounted; 210 — a first side of a chip to be mounted; 220-second side of chip to be mounted; 300-a signal connector; 10-a probe head; 20-a radiation analyzer; 1-detector.
Detailed Description
The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.
The application provides a chip packaging structure for packaging a chip to be mounted, wherein the chip to be mounted can be a semiconductor chip, an integrated circuit chip or a radiation detection chip, and the like.
Simultaneously, the shape of the chip packaging structure provided by the application can be set according to the shape of the chip to be installed, and when the chip to be installed is a wafer, the shape of the chip packaging structure can be cylindrical correspondingly. When the chip to be mounted is a cube, the shape of the chip packaging structure may also be a cube, and the following description will take the chip to be mounted as a wafer as an example.
Fig. 1 is a schematic cross-sectional view of a chip package structure provided in an embodiment of the present application, where the chip package structure includes: a conductive outer shell 110, a conductive inner core 120, a signal connector 300 and an insulating elastic body 130; the chip 200 to be mounted, the conductive inner core 120 and the insulating elastic body 130 are all arranged inside the conductive outer shell 110; the signal connector 300 has a hollow structure, and the outer surface of the signal connector 300 is connected to the conductive housing 110. The first surface 210 of the chip to be mounted is provided with a front electrode, and the second surface 220 of the chip to be mounted is provided with a back electrode; and the front electrode of the chip 200 to be mounted contacts one side of the conductive outer shell 110, and the back electrode contacts the conductive inner core 120. One side of the conductive inner core 120, which is far away from the back electrode of the chip 200 to be mounted, is connected to the inner surface of the signal connector 300, and one side of the conductive inner core, which is far away from the back electrode of the chip 200 to be mounted, is provided with the insulating elastic body 130. The side of the insulating elastomer 130 away from the conductive inner core 120 is in contact with the conductive outer shell 110; the insulating elastic body 130 is used to provide elastic force to make the front electrode of the chip to be mounted 200 contact with the conductive outer shell 110, and the back electrode of the chip to be mounted 200 contact with the conductive inner core 120.
For the chip 200 to be mounted with the front electrode on the first side and the back electrode on the second side, the chip 200 to be mounted is disposed in the chip package structure, the front electrode of the chip 200 to be mounted can be in contact with the conductive shell 110, and the conductive shell 110 is in contact with the outer surface of the signal connector 300, so as to form a positive circuit for transmitting an electrical signal by the chip 200 to be mounted. The back electrode of the chip 200 to be mounted is in contact with the conductive core 120, and the conductive core 120 is in contact with the inner surface of the signal connector 300, so as to form a negative circuit for transmitting an electrical signal by the chip 200 to be mounted. When the chip 200 to be mounted acquires an electrical signal, the electrical signal may be transmitted to the signal connector 300 through the positive and negative loops, so as to perform subsequent signal analysis.
The insulating elastic body 130 is disposed between the conductive outer shell 110 and the conductive inner core 120, so that the possibility of short circuit between a positive loop and a negative loop of the chip 200 to be mounted for transmitting an electrical signal is reduced under the condition that the conductive outer shell 110 and the conductive inner core 120 are insulated, and the chip 200 to be mounted is prevented from being incapable of working normally due to the short circuit. Meanwhile, the insulating elastic body 130 can also provide pressure to make the front electrode of the chip 200 to be mounted closely contact with the conductive shell 110 and the back electrode closely contact with the conductive inner core 120, and the chip 200 to be mounted is electrically connected with the chip packaging structure without using a wire welding mode through the close attachment of the electrodes and the chip packaging structure, so that the influence of problems such as the breakage of welding points of wires, heating and the like on the signal quality of the detector 1 is avoided.
It can be noted that the inner surface of the signal connector 300 is provided with an inner conductor, the outer surface of the signal connector 300 is provided with an outer conductor, and the inner conductor and the outer conductor are isolated by an insulating material and play a role in fixing the inner conductor and the outer conductor. The signal connector 300 may enable the reception of electrical signals through the mating of the inner and outer conductors. The connection between the signal connector 300 and the chip package structure may be in various manners, and the conductive shell 110 may be provided with a through hole, and the size of the through hole may be slightly larger than that of the signal connector 300, so that the signal connector 300 may be inserted into the conductive shell 110. For the outer conductor of the signal connector 300, the outer surface of the signal connector 300 may contact the conductive shell 110, and the outer conductor of the signal connector 300 is electrically connected to the conductive shell 110. The contact between the outer surface of the signal connector 300 and the conductive shell 110 can be realized by matching the internal thread and the external thread. For the inner conductor of the signal connector 300, the inner surface of the signal connector 300 may contact the conductive inner core 120 disposed in the conductive outer shell 110, and the inner conductor of the signal connector 300 is electrically connected to the conductive inner core 120. The specific connection mode of the signal connector 300 and the chip package structure is not limited, and may be adjusted according to actual requirements.
It should be noted that, when the chip 200 to be mounted is a radiation detection chip, the signal connector 300 may correspondingly transmit an electrical signal corresponding to a ray detected by the radiation detection chip, and the signal connector 300 may be a radio frequency connector such as an SMA-KK interface, an SMB interface, an SMP interface, a BNC interface, an LEMO interface, or a TNC interface, and the type of the signal connector 300 is not limited, and may be set according to an actual detection requirement.
As an embodiment of the present application, the insulating elastic body 130 includes an insulating pad 131 and an elastic sheet 132, a first end 1311 of the insulating pad is in contact with a first end 1321 of the elastic sheet, and a second end 1312 of the insulating pad is in contact with the conductive core 120; second end 1322 of the flexible sheet is in contact with conductive housing 110.
The peripheral wall of the insulating spacer 131 may also contact with the conductive shell 110 to separate the conductive core 120 from the conductive shell 110, so as to prevent the conductive core 120 from contacting with the conductive shell 110 to cause short circuit during the operation of the chip 200 to be mounted, which may result in damage to the chip 200 to be mounted. The material of the insulating spacer 131 may be an insulating material with high mechanical strength, such as polytetrafluoroethylene, aramid polymer, and the like, and the specific material of the insulating spacer 131 is not limited and may be selected according to the actual insulating requirement.
Meanwhile, the elastic piece 132 may be used to provide an elastic force to press the insulating gasket 131 to make the conductive core 120 closely contact with the back electrode of the chip 200 to be mounted, and also to make the front electrode of the chip 200 to be mounted closely contact with the conductive shell 110. In order to provide a suitable elastic force, the elastic sheet 132 may be a wave spring, the wave spring may have three or five peaks, and the specific number of peaks of the wave spring is not limited and may be adjusted according to the required elastic force and the size of the chip 200 to be mounted. The elastic sheet 132 may be made of carbon steel or other material with high tension, and the elastic sheet 132 may fix the connection between the chip package structure and the chip 200 to be mounted through elasticity, so as to avoid the occurrence of poor contact caused by displacement during use.
It should be noted that the elastic member for providing elastic force in the insulating elastic body 130 may be the elastic piece 132, or may be a plurality of spherical elastic bodies, and the spherical elastic bodies are disposed inside the conductive shell 110, and a first end of the spherical elastic body is in contact with the first end 1311 of the insulating pad, and a second end of the spherical elastic body is in contact with the conductive shell 110. A plurality of springs may also be provided, the plurality of springs being disposed inside the conductive housing 110, a first end of the springs being in contact with the first end 1311 of the insulating spacer, and a second end of the springs being in contact with the conductive housing 110. The specific type of the elastic member is not limited, and can be adjusted according to the actual fixing requirement.
On the basis of the above embodiment, a first limiting member 1101 is disposed on a side of the inner wall of the conductive housing 110, which is far away from the chip 200 to be mounted, and the first limiting member 1101 is engaged with the elastic sheet 132.
In order to secure the position of the elastic piece 132 in the chip package structure, the occurrence of positional deviation caused by the use of the chip package structure is prevented. A first stopper 1101 may be provided in the conductive housing 110 to define the position of the elastic sheet 132. The first position-limiting member 1101 may be a groove in the conductive housing 110, and a top view shape of the groove is the same as a top view shape of the elastic sheet 132, so that the second end 1322 of the elastic sheet may be embedded in the groove to fix the position of the elastic sheet 132. The first limiting member 1101 may also be a protrusion on the inner wall of the conductive housing 110, which is matched with the elastic sheet 132 in shape, so that the elastic sheet 132 is matched with the first limiting member 1101, thereby fixing the position of the elastic sheet 132. The specific shape of the first stopper 1101 is not limited, and may be adjusted according to the actual shape of the elastic piece 132.
It should be noted that a limiting member may also be disposed on the insulating spacer 131 to cooperate with the first limiting member 1101 to achieve a better effect of fixing the position of the elastic sheet 132. Namely: the first end 1311 of the insulating spacer is provided with a first stopper 1101, and the second stopper 1313 is engaged with the elastic piece 132.
The second position-limiting member 1313 may be a groove in the insulating pad 131, and the shape of the groove in the top view is the same as that of the elastic sheet 132, so that the first end 1321 of the elastic sheet may be embedded in the groove to fix the position of the elastic sheet 132. The second limiting member 1313 may also be a protrusion on the first end 1311 of the insulating pad, which fits the shape of the elastic piece 132, so that the elastic piece 132 fits into the second limiting member 1313, thereby fixing the position of the elastic piece 132. The specific shape of the second stopper 1313 is not limited, and may be adjusted according to the actual shape of the elastic piece 132.
As an embodiment of the present application, the conductive housing 110 includes a conductive base 111 and a conductive cover plate 112, the chip 200 to be mounted is disposed on the conductive base 111, and the conductive base 111 is detachably connected to the conductive cover plate 112.
Therefore, the conductive shell 110 is detachably connected with the conductive base 111 and the conductive cover plate 112, so that the mounting and dismounting processes of the chip 200 to be mounted can be more convenient and faster. For example, when the chip 200 to be mounted is mounted, the conductive cover plate 112 and the conductive base 111 are detached, the chip 200 to be mounted can be disposed in the conductive base 111, and then the conductive cover plate 112 is disposed on the side of the conductive base 111 away from the chip 200 to be mounted through detachable connection, so as to complete the mounting of the chip 200 to be mounted. When the chip is invalid, the conductive cover plate 112 and the conductive base 111 are detached, so that the chip can be rapidly replaced or maintained, and after replacement or maintenance is completed, the conductive cover plate 112 can be detachably connected to one side of the conductive base 111 far away from the chip 200 to be mounted, so that the chip can be detached.
The conductive base 111 and the conductive cover plate 112 may be made of metal materials, such as aluminum alloy or stainless steel, which have high conductivity and are wear-resistant, or conductive ceramics, which have high conductivity, and the specific materials of the conductive base 111 and the conductive cover plate 112 are not limited, and may be adjusted according to actual conductive requirements.
On the basis of the above embodiment, an internal thread is arranged on the inner peripheral wall of the conductive base 111, an external thread is arranged on the outer peripheral wall of the conductive cover plate 112, and the conductive base 111 and the conductive cover plate 112 are detachably connected through the internal thread and the external thread.
It should be noted that, in order to connect the conductive base 111 and the conductive cover 112, the conductive base 111 and the conductive cover 112 may be tightly connected by providing internal and external threads to engage with each other. In order to detach the conductive base 111 and the conductive cover plate 112, the conductive cover plate 112 and the conductive base 111 can be quickly separated by screwing out the conductive cover plate 112 by providing internal threads and external threads.
Meanwhile, it is also considered that the insulating elastic body 130 is arranged in the conductive housing 110, when the conductive base 111 and the conductive cover plate 112 are tightly connected by engaging the internal and external threads, the elastic force of the insulating elastic body 130 can be adjusted by pressing the end of the insulating elastic body 130 contacting the conductive housing 110 in a manner of continuously screwing in the conductive cover plate 112, so that the insulating elastic body 130 simultaneously acts on the conductive core 120 and the chip 200 to be mounted, thereby enabling the front electrode of the chip 200 to be mounted to be in closer contact with the conductive housing 110 and the back electrode of the chip 200 to be mounted to be in closer contact with the conductive core 120.
As an embodiment of the present application, the conductive inner core 120 includes a conductive pin 121 and a conductive inner base 122, one side of the conductive inner base 122 is attached to the back electrode of the chip 200 to be mounted, the other side of the conductive inner base 122 is connected to the conductive pin 121, and one side of the conductive pin 121 far away from the conductive inner base 122 is in contact with the inner surface of the signal connector 300.
Therefore, in order to make the conductive inner core 120 more stably contact with the back electrode of the chip 200 to be mounted, one side of the conductive pin 121 may be connected to the conductive inner base 122 by attaching the conductive inner base 122 to the back electrode of the chip 200 to be mounted, and the other side of the conductive pin 121 contacts with the inner surface of the signal connector 300, so as to form a negative loop of the chip 200 to be mounted for transmitting an electrical signal. The shape of the conductive inner base 122 may be the same as the shape of the back electrode of the chip 200 to be mounted, and the conductive inner core 120 may be more closely attached to the back electrode of the chip 200 to be mounted, so as to ensure the stability of the connection between the conductive inner core 120 and the chip 200 to be mounted. The chip 200 to be mounted and the conductive inner core 120 can also be electrically connected by setting conductive silver paste or other methods, the connection relationship between the chip 200 to be mounted and the conductive inner core 120 is not limited, and the adjustment can be performed according to actual packaging requirements.
It should be noted that the conductive inner base 122 and the conductive pin 121 are used to provide a negative circuit for the chip 200 to be mounted to transmit an electrical signal, the conductive inner base 122 and the conductive pin 121 may be made of conductive materials such as brass and aluminum with good conductivity and high mechanical strength, and the specific material types of the conductive inner base 122 and the conductive pin 121 are not limited and may be selected according to actual conductive requirements.
As an embodiment of the present application, a first insulating member 140 is disposed between the conductive outer shell 110 and the chip 200 to be mounted, the first insulating member 140 is sleeved outside the chip 200 to be mounted and the conductive inner core 120, and the first insulating member 140 is used for separating the peripheral wall of the chip 200 to be mounted from the conductive outer shell 110.
It should be noted that, in order to prevent the chip 200 to be mounted from short circuit during use, the peripheral wall of the chip 200 to be mounted may be separated from the conductive outer shell 110 by sleeving the first insulator on the outer portions of the chip 200 to be mounted and the conductive inner core 120, and the conductive inner core 120 contacting the chip 200 to be mounted may be separated from the conductive outer shell 110, so as to prevent short circuit from occurring due to the contact between the peripheral wall of the chip 200 to be mounted or the conductive inner core 120 and the conductive outer shell 110.
On the basis of the above embodiment, a conductive body 160 is disposed between the conductive shell 110 and the first surface 210 of the chip to be mounted, and the conductive body 160 is used for electrically connecting the front electrode of the chip 200 to be mounted with the conductive shell 110; a second insulating member 150 is disposed between the conductive housing 110 and the first surface 210 of the chip to be mounted, the second insulating member 150 is connected to the first insulating member 140, and the second insulating member 150 is used to separate an area of the first surface 210 of the chip to be mounted, except for the front surface electrode, from the conductive housing 110.
It should be noted that, in order to further prevent the chip 200 to be mounted from short circuit during use, the second insulating member 150 may be disposed between the first surface 210 of the chip to be mounted and the conductive shell 110, the second insulating member is connected to the first insulating member, and the conductive body 160 is disposed between the conductive shell 110 and the first surface 210 of the chip to be mounted. Thus, the region of the first surface 210 of the chip to be mounted, excluding the front electrode, is surrounded by the second insulator and spaced apart from the conductive housing 110, and the front electrode of the chip to be mounted 200 is electrically connected to the conductive housing 110 through the conductive body 160, so as to avoid a short circuit occurring due to the contact between the first surface 210 of the chip to be mounted and the conductive housing 110.
The material of the first insulator and the second insulator may be an insulating material with high mechanical strength, such as polytetrafluoroethylene, aramid polymer, and the like, and the specific material of the first insulator and the second insulator is not limited and may be selected according to the actual insulating requirement. The conductive body 160 may be a metal, an alloy; electromagnetic shielding may also be used, for example: the volume resistivity of the electromagnetic shielding rubber ring is less than 0.01 omega cm, and the 200kHz shielding energy efficiency is more than 60 dB. When the conductive body 160 is an electromagnetic shielding ring, the conductive body 160 can reduce the influence of electromagnetic radiation on the electrical signal transmission of the chip 200 to be mounted through the chip package structure while conducting electricity. The specific material of the conductive body 160 is not limited and can be selected according to the actual conductive requirements.
As an implementation manner, when the chip 200 to be mounted is a radiation detection chip, the radiation may be detected through a detection area on the radiation detection chip, the radiation chip to be detected converts the radiation into an electrical signal, and the electrical signal is transmitted to the signal connector 300 through the chip package structure. In order to provide a path for radiation to enter the chip 200 to be mounted, a window may be disposed on a side of the conductive housing 110 contacting with the front electrode of the chip 200 to be mounted, so that radiation may enter the detection region of the chip 200 to be mounted through the window for subsequent analysis of the radiation. The radiation detection chip can be of various types, can be a silicon detection chip, and can be adjusted according to actual detection requirements.
Fig. 2 is a schematic diagram of the operation of a probe head 10 according to an embodiment of the present invention, and the probe head 10 according to the embodiment of the present invention includes: the chip packaging structure comprises a chip 200 to be installed and the chip packaging structure, wherein the chip 200 to be installed is arranged inside the chip packaging structure, and the chip 200 to be installed is used for converting obtained rays into electric signals.
The radiation is incident to the detection area of the chip 200 to be mounted through the chip packaging mechanism, and the detection area of the chip 200 to be mounted can perform a physical reaction after the radiation is incident to generate an electron-hole pair, that is, the radiation is converted into an electrical signal. And the electrons are transmitted to the conductive housing 110 through the front electrode of the chip 200 to be mounted, and transmitted to the outer surface of the signal connector 300 through the conductive housing 110; the holes are transmitted to the conductive core 120 through the back electrode of the chip 200 to be mounted, and transmitted to the inner surface of the signal connector 300 through the conductive core 120, thereby implementing a process of transmitting an electrical signal to the signal connector 300.
Fig. 3 is a schematic structural diagram of a detector 1 provided in an embodiment of the present application, and based on the same inventive concept, the embodiment of the present application provides a detector 1, including: the radiation analyzer 20 and the above-mentioned detecting head 10, the detecting head 10 is connected with the radiation analyzer 20 through a signal connector 300, and the detecting head 10 is used for transmitting an electric signal corresponding to the radiation analyzer 20 through the signal connector 300.
It is worth noting that, in order to collect electrons, the front electrode and the back electrode of the chip to be mounted 200 can also collect electrons and holes more rapidly by applying a bias voltage to the front electrode and the back electrode of the chip to be mounted 200 on the inner surface and the outer surface of the signal connector 300.
To sum up, the embodiment of the present application provides a chip package structure, a probe and a detector, the chip package structure includes: a conductive outer shell 110, a conductive inner core 120, a signal connector 300 and an insulating elastic body 130; the chip 200 to be mounted, the conductive inner core 120 and the insulating elastic body 130 are all arranged inside the conductive outer shell 110; the signal connector 300 is a hollow structure, and the outer surface of the signal connector 300 is connected with the conductive shell 110; the first surface 210 of the chip to be mounted is provided with a front electrode, and the second surface is provided with a back electrode; the front electrode of the chip 200 to be mounted contacts one side of the conductive shell 110, and the back electrode contacts the conductive inner core 120; one side of the conductive inner core 120, which is far away from the back electrode of the chip 200 to be mounted, is connected to the inner surface of the signal connector 300, and the insulating elastic body 130 is arranged on one side of the conductive inner core, which is far away from the back electrode of the chip 200 to be mounted; the side of the insulating elastomer 130 away from the conductive inner core 120 is in contact with the conductive outer shell 110; the insulating elastic body 130 is used to provide elastic force to make the front electrode of the chip to be mounted 200 contact with the conductive outer shell 110, and the back electrode of the chip to be mounted 200 contact with the conductive inner core 120. According to the embodiment of the application, the conductive shell 110, the conductive inner core 120 and the insulating elastic body 130 are arranged, the chip is arranged in the conductive shell 110, the electrodes of the chip are respectively contacted with the conductive shell 110 and the conductive inner core 120 through the pressure provided by the insulating elastic body 130, a conductive loop is formed, and the situation that the joint is broken due to the heating problem of the chip in working is prevented.
In the embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other ways. The above-described embodiments of the apparatus are merely illustrative, and for example, the division of the units is only one logical division, and there may be other divisions when actually implemented, and for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection of devices or units through some communication interfaces, and may be in an electrical, mechanical or other form.
In addition, units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
Furthermore, the functional modules in the embodiments of the present application may be integrated together to form an independent part, or each module may exist separately, or two or more modules may be integrated to form an independent part.
It should be noted that the functions, if implemented in the form of software functional modules and sold or used as independent products, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present application or portions thereof that substantially contribute to the prior art may be embodied in the form of a software product stored in a storage medium and including instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: various media capable of storing program codes, such as a usb disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk, or an optical disk.
In this document, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.
The above description is only an example of the present application and is not intended to limit the scope of the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (9)
1. A chip package structure, comprising:
the conductive shell, the conductive inner core, the signal connector and the insulating elastomer; the chip to be mounted, the conductive inner core and the insulating elastomer are all arranged inside the conductive shell; the signal connector is of a hollow structure, and the outer surface of the signal connector is connected with the conductive shell;
the first surface of the chip to be mounted is provided with a front electrode, and the second surface of the chip to be mounted is provided with a back electrode; the front electrode of the chip to be mounted is in contact with one side of the conductive shell, and the back electrode is in contact with the conductive inner core;
the chip to be installed is a radiation detection chip, a window is arranged on one side of the conductive shell which is in contact with the front electrode of the chip to be installed, and the window is used for providing a channel for ray to enter the chip to be installed;
one side of the conductive inner core, which is far away from the back electrode of the chip to be installed, is connected with the inner surface of the signal connector, and the side, which is far away from the back electrode of the chip to be installed, is provided with the insulating elastomer;
one side of the insulating elastomer, which is far away from the conductive inner core, is in contact with the conductive outer shell; the insulating elastic body is used for providing elastic force so that the front electrode of the chip to be installed is in contact with the conductive shell, and the back electrode of the chip to be installed is in contact with the conductive inner core.
2. The chip packaging structure according to claim 1, wherein the insulating elastic body comprises an insulating pad and an elastic sheet, a first end of the insulating pad is in contact with a first end of the elastic sheet, and a second end of the insulating pad is in contact with the conductive inner core; the second end of the elastic piece is in contact with the conductive shell.
3. The chip package structure according to claim 2, wherein a first position-limiting member is disposed on a side of the inner wall of the conductive housing, the side being away from the chip to be mounted, and the first position-limiting member is engaged with the elastic sheet.
4. The chip package structure according to claim 3, wherein a second position limiting member corresponding to the first position limiting member is disposed at the first end of the insulating spacer, and the second position limiting member is engaged with the elastic sheet.
5. The chip package structure according to claim 1, wherein the conductive housing includes a conductive base and a conductive cover, the chip to be mounted is disposed on the conductive base, and the conductive base is detachably connected to the conductive cover.
6. The chip package structure according to claim 5, wherein an inner peripheral wall of the conductive base is provided with an inner thread, an outer peripheral wall of the conductive cover plate is provided with an outer thread, and the conductive base and the conductive cover plate are detachably connected through the inner thread and the outer thread.
7. The chip packaging structure according to claim 1, wherein a first insulating member is disposed between the conductive outer shell and the chip to be mounted, the first insulating member being sleeved outside the chip to be mounted and the conductive inner core, the first insulating member being used for separating a peripheral wall of the chip to be mounted from the conductive outer shell;
a conductor is arranged between the conductive shell and the first surface of the chip to be installed, and the conductor is used for electrically connecting the front electrode of the chip to be installed with the conductive shell;
and a second insulating part is arranged between the conductive shell and the first surface of the chip to be installed, the second insulating part is connected with the first insulating part, and the second insulating part is used for separating the area except the front electrode in the first surface of the chip to be installed from the conductive shell.
8. A probe head, comprising: a chip to be mounted and the chip packaging structure of any one of the preceding claims 1 to 7, the chip to be mounted being arranged inside the chip packaging structure, the chip to be mounted being configured to convert the obtained radiation into an electrical signal.
9. A probe, comprising: a radiation analyzer and a detector head as claimed in claim 8, said detector head being connected to said radiation analyzer by a signal connection, said detector head being adapted to transmit an electrical signal corresponding to radiation to said radiation analyzer through said signal connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911231086.8A CN111223940B (en) | 2019-12-04 | 2019-12-04 | Chip packaging structure, detecting head and detector |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911231086.8A CN111223940B (en) | 2019-12-04 | 2019-12-04 | Chip packaging structure, detecting head and detector |
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| CN111223940A CN111223940A (en) | 2020-06-02 |
| CN111223940B true CN111223940B (en) | 2021-12-31 |
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| CN1971905A (en) * | 2005-11-23 | 2007-05-30 | 塞米克朗电子有限及两合公司 | Pressure contact type power semiconductor module |
| CN101036425A (en) * | 2004-08-03 | 2007-09-12 | 英飞凌科技股份公司 | Component arrangement with an optimized assembly capability |
| CN206301801U (en) * | 2016-12-07 | 2017-07-04 | 广州市晧达电子科技有限责任公司 | A kind of insulated gate bipolar transistor |
| CN109427703A (en) * | 2017-08-21 | 2019-03-05 | 三菱电机株式会社 | Power module and power-converting device |
| CN109427709A (en) * | 2017-09-01 | 2019-03-05 | 清华大学 | Electric device and electric device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005054543A1 (en) * | 2005-11-14 | 2007-05-31 | Peter Köllensperger | Semiconductor switch with integrated control circuit |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101036425A (en) * | 2004-08-03 | 2007-09-12 | 英飞凌科技股份公司 | Component arrangement with an optimized assembly capability |
| CN1971905A (en) * | 2005-11-23 | 2007-05-30 | 塞米克朗电子有限及两合公司 | Pressure contact type power semiconductor module |
| CN206301801U (en) * | 2016-12-07 | 2017-07-04 | 广州市晧达电子科技有限责任公司 | A kind of insulated gate bipolar transistor |
| CN109427703A (en) * | 2017-08-21 | 2019-03-05 | 三菱电机株式会社 | Power module and power-converting device |
| CN109427709A (en) * | 2017-09-01 | 2019-03-05 | 清华大学 | Electric device and electric device |
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