CN111223879B - Display substrate, manufacturing method thereof and display device - Google Patents

Abstract

The invention provides a display substrate, a manufacturing method thereof and a display device, wherein the display substrate comprises a substrate base plate, the substrate base plate comprises a first surface and a second surface which are arranged in a reverse manner, the substrate base plate comprises a display area and a binding area positioned on one side of the display area, the binding area comprises a first area and a second area on the first surface of the substrate base plate, the first area is provided with a chip on film, and the second area is an area without the chip on film; on the first surface of the substrate, the second area is provided with a filling structure, and the height difference between the filling structure and the flip-chip film in the direction vertical to the first surface is smaller than a preset value. The invention aims to provide a display substrate, a manufacturing method thereof and a display device, which can reduce the break difference of a binding region, improve the working environment of friction hair and greatly reduce the damage probability of the friction hair, thereby reducing the occurrence probability of Rubbing Mura and improving the production efficiency.

Description

A display substrate, its manufacturing method, and display device

technical field

The present invention relates to the field of display technology, and in particular, to a display substrate, a manufacturing method thereof, and a display device.

Background technique

With the continuous advancement of flat panel display technology, liquid crystal displays have been successfully used in various display devices such as notebooks, monitors, and televisions. In the production process of liquid crystal displays, various undesirable phenomena will occur due to design or process reasons, which have a great impact on the continuity of production and production efficiency. Rubbing Mura is one of them.

In the production process of the liquid crystal display, it is necessary to rub the surface of the PI film (polyimide film) on the surface of the substrate to form a channel on the surface to align the liquid crystal. In the process of friction alignment, Rubbing Mura will appear due to various reasons. Among them, the end difference at the edge of the substrate damages the friction hair is one of the most important reasons. In traditional display products, including display area and binding area, COF (Chip On Flex, or, Chip On Film, often called chip on film) is arranged in the binding area, and the areas on both sides of COF are blank areas. No material is filled. During the rubbing alignment process, due to the existence of blank areas, there is a height difference. When the rubbing cloth passes through the frame area, the rubbing hair will be damaged. In the place where the rubbing hair is damaged, the surface of the PI film cannot be effectively formed. channel, resulting in the occurrence of Rubbing Mura.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide a display substrate, a method for manufacturing the same, and a display device, which can reduce the break in the binding area, improve the working environment of the friction hair, greatly reduce the damage probability of the friction hair, and reduce the occurrence of Rubbing Mura. chance to improve production efficiency.

The technical scheme provided by the present invention is as follows:

A display substrate includes a base substrate, the base substrate includes a first surface and a second surface arranged opposite to each other, the base substrate includes a display area and a binding area on one side of the display area, On the first surface of the base substrate, the binding area includes a first area and a second area, the first area is provided with a flip-chip film, and the second area is not provided with the flip-chip the area of the film;

On the first surface of the base substrate, the second region is provided with a filling structure, and a height difference between the filling structure and the flip chip film in a direction perpendicular to the first surface is smaller than a predetermined value.

Exemplarily, the display substrate is provided with a plurality of conductive film layers in the display area, and the plurality of conductive film layers include: a metal conductive layer formed on the first surface of the base substrate; ITO conductive layer; wherein the filling structure includes a dummy conductive film layer made of the same material as the conductive film layer in the display area, and the dummy conductive film layer is insulated from the conductive film layer in the display area .

Exemplarily, the metal conductive layer includes a gate line metal layer;

The ITO conductive layer includes a first ITO conductive layer and a second ITO conductive layer, and the second ITO conductive layer is formed on a side of the first ITO conductive layer away from the first surface;

Wherein, the dummy conductive film layer includes:

a dummy gate line metal layer with the same material as the gate line metal layer and provided in the same layer, and the dummy gate line metal layer is insulated from the gate line metal layer in the display area;

And/or, a dummy second ITO conductive layer of the same material and disposed on the same layer as the second ITO conductive layer, and the dummy second ITO conductive layer is insulated from the second ITO conductive layer.

Exemplarily, the filling structure includes a first part and a second part, wherein,

The first part is opposite to the second part and is located on the side of the second part close to the chip on film, and is formed by using the pseudo second ITO conductive layer;

The second part is formed by using the dummy gate line metal layer and the dummy second ITO conductive layer, and the dummy second ITO conductive layer is located at a portion of the dummy gate line metal layer away from the first surface. side.

Exemplarily, the display substrate includes a positioning mark formed by using a gate line metal layer, and at a position close to the positioning mark, the filling structure is formed by using the dummy second ITO conductive layer.

Exemplarily, the dummy conductive film layer includes a plurality of strip-like structures arranged in parallel.

Exemplarily, the display substrate is an array substrate.

A display device includes the above-mentioned display substrate.

A method for manufacturing a display substrate, comprising:

A base substrate is provided, the base substrate includes a first surface and a second surface arranged opposite to each other, the base substrate includes a display area and a binding area on one side of the display area, the binding area including the first area and the second area;

On the first surface of the base substrate, a chip-on-chip film is formed in the first region of the bonding region, and a filling structure is formed in the second region, and the filling structure and the flip-chip are formed The height difference of the thin film in a direction perpendicular to the first surface is less than a predetermined value.

Exemplarily, in the method, on the first surface of the base substrate, a chip-on-chip film is formed in the first region of the bonding region, and a filler is formed in the second region structure, including:

A gate line metal layer is formed in the display region by the same patterning process, and a dummy gate line metal layer is formed in the second region;

The same patterning process is used to form a second ITO conductive layer in the display area, and a dummy second ITO conductive layer is formed in the second area.

The beneficial effects brought by the present invention are as follows:

In the above solution, a filling structure is provided in the area where the chip-on-chip film is not provided in the binding area of the display substrate, and the area around the chip-on-chip film is filled with the filling structure, so that the bonding area of the display substrate is broken. Reduce the friction hair, thereby improving the working environment of the friction hair, greatly reducing the damage probability of the friction hair, reducing the occurrence probability of Rubbing Mura, and improving the yield of the product.

Description of drawings

FIG. 1 is a schematic diagram showing a partial structure of a binding area of a display substrate provided by an embodiment of the present invention;

FIG. 2 is a schematic cross-sectional structure diagram of the B-B direction in FIG. 1 .

Detailed ways

In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are some, but not all, embodiments of the present disclosure. Based on the described embodiments of the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the protection scope of the present disclosure.

Unless otherwise defined, technical or scientific terms used in this disclosure shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. As used in this disclosure, "first," "second," and similar terms do not denote any order, quantity, or importance, but are merely used to distinguish the various components. Likewise, words such as "a," "an," or "the" do not denote a limitation of quantity, but rather denote the presence of at least one. "Comprises" or "comprising" and similar words mean that the elements or things appearing before the word encompass the elements or things recited after the word and their equivalents, but do not exclude other elements or things. Words like "connected" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "Down", "Left", "Right", etc. are only used to represent the relative positional relationship, and when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

Aiming at the problem in the prior art that there is a blank area around the chip-on-film of the display substrate binding area, which leads to a large break in the binding area, and when frictional alignment is performed, it is easy to cause damage to the friction hairs and cause poor frictional alignment. For example, a display substrate, a method for manufacturing the same, and a display device are provided, which can reduce the breakage of the bonding area of the display substrate, improve the working environment of the friction hair, and greatly reduce the damage probability of the friction hair, thereby reducing the friction of the Rubbing Mura. Occurrence probability, improve product yield.

As shown in FIG. 1 , a display substrate provided in an embodiment of the present invention includes a base substrate 100 , the base substrate 100 includes a first surface and a second surface disposed opposite to each other, and the base substrate 100 includes a display area AA and a second surface. The binding area located on one side of the display area AA, on the first surface of the base substrate 100, the binding area includes a first area and a second area, and the first area is provided with a cover. On the first surface of the base substrate 100, the second area is provided with a dummy filling structure ) 300, the height difference between the filling structure 300 and the chip on film 200 in the direction perpendicular to the first surface is less than a predetermined value.

In the above solution, a filling structure 300 is provided in the second area of the display substrate where the chip-on-film 200 is not provided in the binding area, and the blank area around the chip-on-film 200 is filled by the filling structure 300 to The breakage of the binding area of the display substrate is reduced, thereby improving the working environment of the friction hair, greatly reducing the damage probability of the friction hair, reducing the occurrence probability of Rubbing Mura, and improving the product yield.

It should be noted that the height difference between the filling structure 300 and the chip-on-film 200 in the direction perpendicular to the first surface is less than a predetermined value, wherein the value range of the predetermined value is not limited, and may be Design according to actual needs, as long as the predetermined value is less than the height difference between the chip on film 200 and the first surface.

In the embodiment provided by the present invention, the display substrate is provided with a plurality of conductive film layers in the display area AA, and the plurality of conductive film layers include: the first layer formed on the base substrate 100 Metal conductive layer and ITO conductive layer on one surface, for example, taking the display substrate as an array substrate as an example, the metal conductive layer may include a gate line metal layer, a gate metal layer (gate metal layer and gate line The metal layer may be of the same material and provided in the same layer), data line metal layer, etc.; the ITO conductive layer may include a first ITO conductive layer (1ITO), a second ITO conductive layer (2ITO), etc., the second ITO conductive layer It is formed on the side of the first ITO conductive layer away from the first surface. For example, taking the display substrate as an array substrate as an example, the first ITO conductive layer may be a pixel electrode layer, and the second ITO conductive layer may be a pixel electrode layer. The ITO electrode layer may be a COM signal line layer or the like. Wherein, the filling structure 300 may include a dummy conductive film layer (dummy conductive film layer) made of the same material as the conductive film layer in the display area AA, and the dummy conductive film layer is connected to the conductive film layer in the display area AA. Insulation settings between.

Using the above solution, the filling structure 300 can be formed by using a metal conductive layer or an ITO conductive layer in the display area AA. The filling structure 300 is formed by the same patterning process.

It should be noted that, in practical applications, the filling structure 300 may also be made of other materials, which is not limited, for example, it may also be formed of insulating layer materials and the like. However, using the metal conductive layer or the ITO conductive layer material has a simpler patterning process than using other materials.

In addition, in an exemplary embodiment, the dummy conductive film layer includes:

A dummy gate metal layer (dummy gate layer) 310 with the same material and same layer as the gate line metal layer, and the dummy gate metal layer 310 is insulated from the gate line metal layer in the display area AA. ;

And/or, a dummy second ITO conductive layer (dummy 2ITO layer) 320 with the same material and same layer as the second ITO conductive layer, and the dummy second ITO conductive layer 320 and the second ITO conductive layer Insulation set.

With the above solution, the dummy conductive film layer of the filling structure 300 may be the dummy gate line metal layer 310 of the same layer and material as the gate line of the display area AA, or may be the same layer as the second ITO conductive layer and The dummy second ITO conductive layer 320 of the same material may be one or both of the dummy gate line metal layer 310 and the dummy second ITO conductive layer 320 to form the filling structure 300 .

Using the above solution, taking the array substrate as an example, since the sum of the thicknesses of the gate line metal layer and the second ITO conductive layer in the display area AA is closer to the thickness of the chip on film 200 , in the second area of the bonding area , Preferably, the filling structure 300 is formed by using the gate line metal layer and the second ITO conductive layer, so that the height difference between the filling structure 300 and the chip-on-chip film 200 is smaller, and the process and structure are simpler. In addition, it should be noted that the dummy conductive film layer in the filling structure 300 may only play a filling role, and is insulated from other conductive film layers in the display area and the binding area, and is not electrically connected.

Of course, it can be understood that, in practical applications, for different types and models of display products, the filling structure 300 can also be formed by using suitable film layer materials according to the thickness of each film layer in the display area AA. Do limit.

In addition, in an exemplary embodiment of the present invention, as shown in FIG. 1 and FIG. 2 , the filling structure 300 includes a first part 300a and a second part 300b, wherein the first part 300a is opposite to the second part 300a The part 300b, located on the side close to the chip on film 200, is formed by using the dummy second ITO conductive layer 320; the second part 300b is formed by using the dummy gate line metal layer 310 and the dummy second ITO conductive layer A layer 320 is formed, and the dummy second ITO conductive layer 320 is located on a side of the dummy gate line metal layer 310 away from the first surface.

With the above solution, since the area where the chip on film 200 is located or the position close to the chip on film 200 has a structure formed by the gate line metal layer, only the pseudo-first layer is used in the position close to the chip on film 200 . Two ITO conductive layers 320 are used for filling, and positions away from the chip-on-chip film 200 are filled with a dummy gate line metal layer 310 and the dummy second ITO conductive layer 320 .

It should be noted that, the positions close to the chip on film 200 and the positions far from the chip on film 200 can be defined according to practical applications, which are not limited.

In an example, the display substrate includes an alignment mark 201 formed by using a gate line metal layer, and at a position close to the alignment mark 201 , the filling structure 300 is formed by using the dummy second ITO conductive layer 320 .

With the above solution, the display substrate includes the positioning mark 201 for binding and positioning, which is formed by using a gate line metal layer. Therefore, in order to avoid the dummy gate line metal layer 310 being too close to this part of the gate line metal layer, causing defects Influence, for example, it is too close to the positioning mark, making it difficult to identify the positioning mark, etc., only the pseudo second ITO conductive layer 320 is used to fill the position close to the positioning mark, and the position far from the positioning mark is filled with The dummy gate line metal layer 310 and the dummy second ITO conductive layer 320 are filled.

In addition, as shown in FIG. 1 and FIG. 2 , in an exemplary embodiment, the dummy conductive film layer includes a plurality of strip-like structures arranged in parallel.

With the above solution, the dummy conductive film layer has a stripe grating structure. This is because when the dummy conductive film layer is formed by a metal layer, the metal layer is an opaque material, which affects the light transmittance. The layers are designed in strips to increase light transmittance. Of course, it can be understood that when the dummy conductive film layer is a light-transmitting material, for example, it is only formed of an ITO conductive layer, it may not be a strip-shaped structure. This is not limited.

In addition, it should be noted that the display substrate provided in the embodiment of the present invention may be an array substrate or other types of substrates, which is not limited thereto.

Embodiments of the present invention further provide a display device, including the display substrate provided by the embodiments of the present invention.

The embodiment of the present invention also provides a method for manufacturing a display substrate, which is used for manufacturing the display substrate provided by the embodiment of the present invention, and the method includes the following steps:

Step S1, providing a base substrate 100, the base substrate 100 includes a first surface and a second surface arranged opposite to each other, and the base substrate 100 includes a display area AA and a binding on one side of the display area AA. a fixed area, the binding area includes a first area and a second area;

Step S2, on the first surface of the base substrate 100, the chip on film 200 is formed in the first area of the bonding area, and the filling structure 300 is formed in the second area. The height difference between the structure 300 and the chip-on-film 200 in a direction perpendicular to the first surface is smaller than a predetermined value.

In the method, the step S2 specifically includes:

The same patterning process is used to form a conductive film layer in the display area AA, and a dummy conductive film layer is formed in the second area.

Specifically, the step S2 includes:

Step S21, using the same patterning process to form a gate line metal layer in the display area AA, and form a dummy gate line metal layer 310 in the second area;

Step S22 , using the same patterning process to form a second ITO conductive layer in the display area AA, and form a dummy second ITO conductive layer 320 in the second area.

The following points need to be noted:

(1) The accompanying drawings of the embodiments of the present disclosure only relate to the structures involved in the embodiments of the present disclosure, and other structures may refer to general designs.

(2) In the drawings for describing the embodiments of the present disclosure, the thicknesses of layers or regions are exaggerated or reduced for clarity, ie, the drawings are not drawn on actual scale. It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element, or Intermediate elements may be present.

(3) The embodiments of the present disclosure and the features in the embodiments may be combined with each other to obtain new embodiments without conflict.

The above descriptions are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto, and the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims (6)

1. A display substrate, comprising a base substrate, the base substrate comprising a first surface and a second surface arranged opposite to each other, the base substrate comprising a display area and a binding area on one side of the display area , on the first surface of the base substrate, the binding area includes a first area and a second area, the first area is provided with a chip on film, and the second area is not provided with the The area of the chip-on-film; It is characterized in that, on the first surface of the base substrate, the second region is provided with a filling structure, and the height difference between the filling structure and the chip on film in a direction perpendicular to the first surface less than the predetermined value; The display substrate is provided with a plurality of conductive film layers in the display area, and the plurality of conductive film layers include: a metal conductive layer and an ITO conductive layer formed on the first surface of the base substrate; The filling structure includes a dummy conductive film layer made of the same material as the conductive film layer in the display area, and the dummy conductive film layer is insulated from the conductive film layer in the display area; The metal conductive layer includes a gate line metal layer; The ITO conductive layer includes a first ITO conductive layer and a second ITO conductive layer, and the second ITO conductive layer is formed on a side of the first ITO conductive layer away from the first surface; Wherein, the dummy conductive film layer includes: a dummy gate line metal layer with the same material as the gate line metal layer and provided in the same layer, and the dummy gate line metal layer is insulated from the gate line metal layer in the display area; And/or, a pseudo second ITO conductive layer of the same material and the same layer as the second ITO conductive layer, and the pseudo second ITO conductive layer is insulated from the second ITO conductive layer; The filling structure includes a first portion and a second portion, wherein, The first part is opposite to the second part and is located on the side of the second part close to the chip on film, and is formed by using the pseudo second ITO conductive layer; The second part is formed by using the dummy gate line metal layer and the dummy second ITO conductive layer, and the dummy second ITO conductive layer is located at a portion of the dummy gate line metal layer away from the first surface. side; The display substrate includes a positioning mark formed by using a gate line metal layer, and at a position close to the positioning mark, the filling structure is formed by using the dummy second ITO conductive layer. 2. The display substrate according to claim 1, wherein, The dummy conductive film layer includes a plurality of strip-like structures arranged in parallel. 3. The display substrate according to any one of claims 1 to 2, wherein, The display substrate is an array substrate. 4. A display device, comprising the display substrate according to any one of claims 1 to 3. 5. A method for manufacturing a display substrate, applied to the display substrate according to any one of claims 1-3, characterized in that, comprising: A base substrate is provided, the base substrate includes a first surface and a second surface arranged opposite to each other, the base substrate includes a display area and a binding area on one side of the display area, the binding area including the first area and the second area; On the first surface of the base substrate, a chip-on-chip film is formed in the first region of the bonding region, and a filling structure is formed in the second region, and the filling structure and the flip-chip are formed The height difference of the thin film in a direction perpendicular to the first surface is less than a predetermined value. 6 . The method for manufacturing a display substrate according to claim 5 , wherein for manufacturing the display substrate according to claim 1 , in the method, the first part of the base substrate On the surface, a chip on film is formed in the first area of the binding area, and a filling structure is formed in the second area, which specifically includes: A gate line metal layer is formed in the display region by the same patterning process, and a dummy gate line metal layer is formed in the second region; The same patterning process is used to form a second ITO conductive layer in the display area, and a dummy second ITO conductive layer is formed in the second area.

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