[go: up one dir, main page]

CN111221224A - Calibration ruler and position calibration method using same - Google Patents

Calibration ruler and position calibration method using same Download PDF

Info

Publication number
CN111221224A
CN111221224A CN202010125179.9A CN202010125179A CN111221224A CN 111221224 A CN111221224 A CN 111221224A CN 202010125179 A CN202010125179 A CN 202010125179A CN 111221224 A CN111221224 A CN 111221224A
Authority
CN
China
Prior art keywords
calibration
exposure
scale
calibration scale
direct
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202010125179.9A
Other languages
Chinese (zh)
Other versions
CN111221224B (en
Inventor
刘栋
张雷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yuanzhuo Micro Nano Technology Suzhou Co ltd
Original Assignee
Advanced Micro Intelligent System & Creative Optics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Intelligent System & Creative Optics Inc filed Critical Advanced Micro Intelligent System & Creative Optics Inc
Priority to CN202010125179.9A priority Critical patent/CN111221224B/en
Priority to CN202310408652.8A priority patent/CN116679531A/en
Publication of CN111221224A publication Critical patent/CN111221224A/en
Application granted granted Critical
Publication of CN111221224B publication Critical patent/CN111221224B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70775Position control, e.g. interferometers or encoders for determining the stage position
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073Alignment marks and their environment
    • G03F9/7076Mark details, e.g. phase grating mark, temporary mark
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

The invention discloses a calibration scale and a position calibration method using the same, wherein the calibration scale is in a strip shape, is fixed on one side of a workpiece platform and synchronously moves along with the workpiece platform, the surface of the calibration scale is coated with a photosensitive material, an exposure mark can be formed on the photosensitive material through exposure, and after exposure, the mark becomes gradually lighter along with the lapse of time and finally disappears, so that the exposure can be repeatedly carried out on the calibration scale, and the repeated utilization is realized. And after the calibration scale is assembled, fixing the calibration scale to one side of the workpiece table. The positional relationship of the components related to the exposure can be obtained by measuring the position of the workpiece stage by exposing the marks on the scale. The adopted moving mechanism only relates to the moving mechanism of the workpiece table, and errors among a plurality of moving mechanisms are avoided.

Description

Calibration ruler and position calibration method using same
Technical Field
The invention relates to the technical field of photoetching, in particular to a calibration scale for photoetching direct-writing equipment and a position calibration method using the calibration scale, and belongs to the technical field of direct-writing photoetching rapid exposure.
Background
Photolithography is a technique used to print a pattern having features on a surface of a substrate. Such substrates may include substrates used in the manufacture of semiconductor devices, various integrated circuits, flat panel displays (e.g., liquid crystal displays), circuit boards, biochips, micromechanical electronic chips, optoelectronic circuit chips, and the like. The direct writing photoetching technology is used for replacing the traditional image direct transfer technology of exposure of a mask plate, a film negative film and the like, and plays a very important role in the field of semiconductor and PCB production. In order to expose a desired pattern, the exposure position of the pattern needs to be precisely controlled, and the position between related components of the exposure apparatus is important, and precise positioning is a prerequisite for obtaining the desired exposure.
At present, laser direct writing equipment mostly uses a motor module form to calibrate the position relationship between related components of the lithography equipment. Relatively speaking, the structure is more complicated, and the cost is higher, is unfavorable for installation and maintenance.
Disclosure of Invention
The invention aims to provide a calibration scale for photoetching direct-writing equipment and a position calibration method using the calibration scale, which effectively reduce the equipment cost, simplify the structure and the position relation calibration flow, simplify the installation and maintenance and remove errors caused by using a plurality of moving mechanisms.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows: the utility model provides a calibration ruler, calibration ruler is the strip, the surface coating of calibration ruler has photosensitive material.
Further, the photosensitive material is coated on the upper surface or the lower surface of the calibration scale.
Furthermore, the photosensitive material coated on the calibration ruler has the function of gradually fading after being sensitized.
Further, the photosensitive material is attached to the calibration scale in the form of a film.
Furthermore, the calibration ruler is in a rectangular strip shape.
Further, the calibration ruler is made of a light-transmitting material.
A calibration method of direct-write lithography equipment is characterized in that a calibration scale is fixed at one end of a workpiece table of the direct-write lithography equipment, firstly, the workpiece table moves to the position below an exposure lens of the direct-write lithography equipment, and the exposure lens exposes and marks on a photosensitive material of the calibration scale; after exposure is finished, the workpiece table drives the calibration scale to reach the capture range of the alignment camera of the direct-writing photoetching equipment, the alignment camera captures the exposure marks on the calibration scale, and the position relation between the exposure lens and the alignment camera is obtained according to the position information of the exposure position and the capture position of the workpiece table.
A calibration method of direct-writing photoetching equipment comprises the steps of fixing a calibration scale at one end of a workpiece table of the direct-writing photoetching equipment, moving the workpiece table to enable the calibration scale to be located below an exposure lens, starting exposure of all lenses, enabling the exposure lens to expose marks on the calibration scale, sequentially moving the workpiece table after the exposure of the exposure lens on the calibration scale is finished, enabling the exposure marks on the calibration scale to be sequentially located below a same alignment camera, enabling the same alignment camera to capture the exposure marks on the calibration scale, and obtaining the position relation between the lenses according to the position information of the workpiece table.
A calibration method of a direct-writing photoetching device comprises the steps of fixing a calibration scale at one end of a workpiece table of the direct-writing photoetching device, firstly moving the workpiece table to enable the calibration scale to be positioned below an exposure lens of the direct-writing photoetching device of which the position relation is to be determined, starting the exposure lens to expose, generating a pair of graphs on the calibration scale, sequentially moving the graphs to a capture range of an alignment camera of the same direct-writing photoetching device, sequentially capturing exposure marks by the alignment camera, obtaining the position relation between two exposure lenses according to the position information of the workpiece table, and repeating the operation to obtain the position relation between all the exposure lenses.
The surface of the calibration scale is coated with the photosensitive material, an exposure mark can be formed on the photosensitive material through exposure, and after exposure, the graph becomes lighter gradually along with the lapse of time and finally disappears, so that the calibration scale can be repeatedly exposed, and the repeated utilization is realized. And after the calibration scale is assembled, the calibration scale is fixed to one side of the motion platform. The positional relationship of the components related to the exposure can be obtained by measuring the position of the workpiece stage by exposing the marks on the scale. The adopted moving mechanism only relates to the moving mechanism of the workpiece table, and errors among a plurality of moving mechanisms are avoided. Meanwhile, the calibration scale can reduce the production cost on the basis of reducing the design complexity, and is favorable for the maintenance and calibration of equipment.
Drawings
FIG. 1 is a scale schematic.
FIG. 2 is a scale with a photosensitive material applied to the upper surface.
The lower surface of the scale of fig. 3 is coated with a photosensitive material.
Figure 4 shows the exposure marks on the scale as a function of time.
FIG. 5 is a schematic view of a scale and a work head.
FIG. 6 is a schematic diagram illustrating calibration of positional relationship between the alignment camera and the exposure lens.
Fig. 7 shows a first calibration of the positional relationship of the exposure lens.
Fig. 8 shows a second exposure lens position relationship calibration.
Detailed Description
As shown in fig. 1-3, a calibration ruler for calibrating a position relationship, the calibration ruler 1 is a strip, preferably a rectangular strip, and other irregular patterns of the strip can also be used. The surface coating of calibration scale 1 has photosensitive material 10, photosensitive material 10 can coat with the upper surface 11 of calibration scale, also can coat with the lower surface 12 of calibration scale, work as photosensitive material 10 coat with during calibration scale lower surface 12, the printing opacity material needs to be chooseed for use to calibration scale 1, and the machine vision system after guaranteeing that the material of selecting can normal sensitization and sensitization handles for example printing opacity material such as glass.
The photosensitive material 10 coated on the calibration scale 1 has a function of gradually fading after being exposed, as shown in fig. 4, the photosensitive material 10 coated on the calibration scale 1 is exposed to light at a time t1 to form an exposure mark 13, the exposure mark 13 gradually fades with time, and the exposure mark 13 exposed on the photosensitive material 10 completely disappears until a time tn, so that the photosensitive material 10 can be repeatedly exposed for use, i.e. can be exposed again at the same position every time tn.
The photosensitive material 10 can also be a material for primary exposure, and is attached to the calibration scale 1 in the form of a film, after the primary exposure is completed, the used photosensitive material 10 is removed, and a new photosensitive material 10 is replaced.
The calibration scale 1 is applied to direct-write lithography equipment and can be used for calibrating the position relation between exposure lenses. The calibration ruler 1 is fixed at the front end or the rear end of a workpiece table 2 of the direct-write lithography apparatus, and as shown in fig. 5-6, the calibration of the position relationship between the alignment camera and the exposure lens can be completed by using the calibration ruler 1. First, the workpiece stage 2 moves to (x _ e, y _ e), below the exposure lens, and the exposure lens exposes the photosensitive material 10 of the calibration scale 1 to form the exposure mark 13, wherein the exposure mark 13 may be a solid circle, or other square, diamond regular pattern or irregular pattern. After exposure is finished, the workpiece table 2 drives the calibration scale 1 to a capture range of an alignment camera of the direct-writing photoetching equipment, the alignment camera captures an exposure mark 13 on the calibration scale, at the moment, the position of the workpiece table is (x _ m, y _ m), and the position relation between the exposure lens and the alignment camera is obtained by utilizing the exposure position and the capture position of the workpiece table 2. Thus, when exposing a multilayer pattern, it is ensured that the exposure of the two layer patterns starts from the same position.
As shown in fig. 7, calibration of the positional relationship between lenses is completed using the calibration scale 1. Moving the workpiece stage 2 to make the calibration scale 1 located below the exposure lens, starting exposure of all lenses, and exposing the exposure lens on the calibration scale to form exposure marks, wherein in this embodiment, 4 exposure lenses are taken as an example, and the exposure marks are solid circles, but the number of the exposure lenses and the exposure pattern may be set in various ways, and are not limited thereto. And after the exposure lens is exposed on the calibration scale, sequentially moving the workpiece table 2 to enable the exposure marks on the calibration scale to be sequentially positioned below the same alignment camera, so that the same alignment camera captures the exposure marks on the calibration scale, and obtaining the position relation between the exposure lenses according to the position information of the workpiece table 2.
As shown in fig. 8, the calibration of the positional relationship between the exposure lenses is completed using the calibration scale 1. The position relation between the exposure lenses is realized by multiple exposures, and the position relation between the two lenses is determined by each exposure. Firstly, moving the workpiece table 2 to enable the calibration scale 1 to be positioned below a lens of which the position relation is to be determined, starting the exposure lens to expose, generating a pair of exposure marks on the calibration scale, sequentially moving the exposure marks to the same capture range of the alignment camera, capturing the exposure marks by the alignment camera, and calculating according to the position information of the workpiece table to obtain the position relation between the two lenses. Two exposure marks are exposed at one time, so that a plurality of exposure marks can be prevented from being exposed at one time, and the exposure marks can be aimed at different photosensitive material characteristics due to the fact that the alignment camera obtains the exposure marks for too long time and the exposure marks disappear.
In fig. 7 and 8, the exposure marks corresponding to Len1, Len2, Len3, Len4 correspond to exposure marks for exposure by exposure lens one, exposure lens two, exposure lens three, and exposure lens four.
The calibration scale 1 is strip-shaped and is fixed on one side of the workpiece table 2, the calibration scale moves synchronously with the workpiece table 2, the surface of the calibration scale 1 is coated with the photosensitive material 10, an exposure mark 13 can be formed on the photosensitive material 10 through exposure, and after exposure, the exposure mark gradually becomes light and finally disappears along with the lapse of time, so that the calibration scale can be repeatedly exposed, and the repeated utilization is realized. The scale 1 is fixed to one side of the workpiece table 2 after the assembly. The positional relationship of the components related to exposure can be obtained by exposing the marks 13 on the scale 1 and by measuring the position of the work table 2. The adopted moving mechanism only relates to the moving mechanism of the workpiece table 2, and errors among a plurality of moving mechanisms are avoided.
The calibration scale can reduce the production cost on the basis of reducing the design complexity, and is beneficial to the maintenance and calibration of equipment.

Claims (9)

1. The utility model provides a calibration ruler, calibration ruler is the strip, its characterized in that: the surface of the calibration ruler is coated with a photosensitive material.
2. The calibration ruler of claim 1, wherein: the photosensitive material is coated on the upper surface or the lower surface of the calibration scale.
3. The calibration ruler of claim 1, wherein: the photosensitive material coated on the calibration ruler has the function of gradually fading after being sensitized.
4. The calibration ruler of claim 1, wherein: the photosensitive material is attached to the calibration scale in the form of a film.
5. The calibration ruler of claim 1, wherein: the calibration ruler is in a rectangular strip shape.
6. The calibration ruler according to claim 1, characterized in that: the calibration ruler is made of light-transmitting materials.
7. A calibration method of a direct-write lithography apparatus is characterized by comprising the following steps: fixing the calibration scale of any one of claims 1-6 to one end of a workpiece stage of the direct-write lithography apparatus, first, moving the workpiece stage to a position below an exposure lens of the direct-write lithography apparatus, and exposing marks on the photosensitive material of the calibration scale by the exposure lens; after exposure is finished, the workpiece table drives the calibration scale to reach the capture range of the alignment camera of the direct-writing photoetching equipment, the alignment camera captures the exposure marks on the calibration scale, and the position relation between the exposure lens and the alignment camera is obtained according to the position information of the exposure position and the capture position of the workpiece table.
8. A calibration method of a direct-write lithography apparatus is characterized by comprising the following steps: fixing the calibration scale of any one of claims 1 to 6 to one end of a workpiece stage of the direct-write lithography apparatus, moving the workpiece stage to position the calibration scale below the exposure lens, starting exposure of all lenses, exposing marks on the calibration scale by the exposure lens, and after the exposure of the exposure lens on the calibration scale is completed, sequentially moving the workpiece stage to position the exposure marks on the calibration scale below the same alignment camera, so that the same alignment camera captures the exposure marks on the calibration scale, and obtaining a position relationship between the lenses according to position information of the workpiece stage.
9. A calibration method of a direct-write lithography apparatus is characterized by comprising the following steps: fixing the calibration scale of any one of claims 1 to 6 at one end of a workpiece stage of the direct-write lithography apparatus, first moving the workpiece stage to make the calibration scale be located below an exposure lens of the direct-write lithography apparatus whose positional relationship is to be determined, starting exposure of the exposure lens, generating a pair of patterns on the calibration scale, sequentially moving the patterns to a capture range of an alignment camera of the same direct-write lithography apparatus, sequentially capturing the exposure marks by the alignment camera, obtaining the positional relationship between the two exposure lenses according to the positional information of the workpiece stage, and repeating the above operations to obtain the positional relationship between all the exposure lenses.
CN202010125179.9A 2020-02-27 2020-02-27 Calibration ruler and position calibration method using same Active CN111221224B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202010125179.9A CN111221224B (en) 2020-02-27 2020-02-27 Calibration ruler and position calibration method using same
CN202310408652.8A CN116679531A (en) 2020-02-27 2020-02-27 Direct-writing lithography equipment and calibration method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010125179.9A CN111221224B (en) 2020-02-27 2020-02-27 Calibration ruler and position calibration method using same

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202310408652.8A Division CN116679531A (en) 2020-02-27 2020-02-27 Direct-writing lithography equipment and calibration method thereof

Publications (2)

Publication Number Publication Date
CN111221224A true CN111221224A (en) 2020-06-02
CN111221224B CN111221224B (en) 2023-04-14

Family

ID=70829841

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202310408652.8A Pending CN116679531A (en) 2020-02-27 2020-02-27 Direct-writing lithography equipment and calibration method thereof
CN202010125179.9A Active CN111221224B (en) 2020-02-27 2020-02-27 Calibration ruler and position calibration method using same

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN202310408652.8A Pending CN116679531A (en) 2020-02-27 2020-02-27 Direct-writing lithography equipment and calibration method thereof

Country Status (1)

Country Link
CN (2) CN116679531A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113009795A (en) * 2021-03-01 2021-06-22 锡凡半导体无锡有限公司 Image detection device and detection method using same
CN113467203A (en) * 2021-06-10 2021-10-01 东莞市多普光电设备有限公司 Method for aligning platform by using camera, aligning device and direct imaging photoetching equipment
CN113467194A (en) * 2021-07-05 2021-10-01 东莞市多普光电设备有限公司 Ambient temperature compensation method, alignment device and direct-writing imaging photoetching equipment
CN114114855A (en) * 2021-12-09 2022-03-01 苏州源卓光电科技有限公司 Exposure abnormity detection method of laser direct writing system
CN116300342A (en) * 2023-05-19 2023-06-23 广东科视光学技术股份有限公司 Measurement method, calculation equipment and storage medium for angle of direct-writing photoetching lens
CN117092892A (en) * 2023-10-21 2023-11-21 广东科视光学技术股份有限公司 Method and device for measuring angle of direct-writing photoetching lens, electronic equipment and medium

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5331371A (en) * 1990-09-26 1994-07-19 Canon Kabushiki Kaisha Alignment and exposure method
US20090262319A1 (en) * 2008-03-10 2009-10-22 Hiroyasu Matsuura Maskless exposure method
WO2019049732A1 (en) * 2017-09-05 2019-03-14 株式会社ブイ・テクノロジー Exposure device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5331371A (en) * 1990-09-26 1994-07-19 Canon Kabushiki Kaisha Alignment and exposure method
US20090262319A1 (en) * 2008-03-10 2009-10-22 Hiroyasu Matsuura Maskless exposure method
WO2019049732A1 (en) * 2017-09-05 2019-03-14 株式会社ブイ・テクノロジー Exposure device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113009795A (en) * 2021-03-01 2021-06-22 锡凡半导体无锡有限公司 Image detection device and detection method using same
CN113467203A (en) * 2021-06-10 2021-10-01 东莞市多普光电设备有限公司 Method for aligning platform by using camera, aligning device and direct imaging photoetching equipment
CN113467203B (en) * 2021-06-10 2024-01-23 东莞市多普光电设备有限公司 Method for aligning platform by camera, aligning device and direct imaging lithography equipment
CN113467194A (en) * 2021-07-05 2021-10-01 东莞市多普光电设备有限公司 Ambient temperature compensation method, alignment device and direct-writing imaging photoetching equipment
CN113467194B (en) * 2021-07-05 2024-04-02 东莞市多普光电设备有限公司 Ambient temperature compensation method, alignment device and direct-writing imaging lithography equipment
CN114114855A (en) * 2021-12-09 2022-03-01 苏州源卓光电科技有限公司 Exposure abnormity detection method of laser direct writing system
CN114114855B (en) * 2021-12-09 2025-02-11 源卓微纳科技(苏州)股份有限公司 A method for detecting exposure anomaly in laser direct writing system
CN116300342A (en) * 2023-05-19 2023-06-23 广东科视光学技术股份有限公司 Measurement method, calculation equipment and storage medium for angle of direct-writing photoetching lens
CN117092892A (en) * 2023-10-21 2023-11-21 广东科视光学技术股份有限公司 Method and device for measuring angle of direct-writing photoetching lens, electronic equipment and medium
CN117092892B (en) * 2023-10-21 2023-12-26 广东科视光学技术股份有限公司 Method and device for measuring angle of direct-writing photoetching lens, electronic equipment and medium

Also Published As

Publication number Publication date
CN116679531A (en) 2023-09-01
CN111221224B (en) 2023-04-14

Similar Documents

Publication Publication Date Title
CN111221224B (en) Calibration ruler and position calibration method using same
KR100988437B1 (en) Glass or metal etching method using negative photoresist and manufacturing method of cliché using the same
US20080223839A1 (en) Laser Machining Apparatus
CN102103332B (en) High-speed digital scanning direct write photoetching device
CN109870883B (en) Position compensation method for calibration plate of direct-writing exposure machine
CN105388707B (en) drawing device
CN106997156B (en) The exposure method of high-precision line pattern is prepared on high radian 3 D stereo
Hansotte et al. High speed maskless lithography of printed circuit boards using digital micromirrors
CN109240047B (en) Direct-writing type exposure machine and calibration method thereof
CN209433438U (en) A kind of caliberating device of the exposure cameras for direct-write type lithography machine
US4397543A (en) Mask for imaging a pattern of a photoresist layer, method of making said mask, and use thereof in a photolithographic process
CN100437357C (en) Exposure apparatus extendible corresponding to substrate for printed circuitboard
CN114518695A (en) Correction method and exposure method of double-sided exposure system
CN113473717A (en) Method for manufacturing circuit board solder resist pattern in partition mode
CN105158877A (en) Multiplying power calibration method of zooming objective lens of write-through photoetching machine
CN211741829U (en) Direct-writing type exposure machine
CN110441993B (en) Marking method for front and back imaging alignment of laser direct imaging equipment
US9529275B2 (en) Lithography scanner throughput
CN113960894A (en) A proximity contact exposure device
CN112987517A (en) Alignment device and alignment method for PCB inner-layer board
CN222028522U (en) Calibration device
JP2009152327A (en) Inkjet coating device for resist film formation
CN217944329U (en) IC mask version pad pasting device
CN112684679A (en) Calibration method for upper and lower graph alignment of double-sided digital photoetching system
CN111308868A (en) Calibration method for alignment camera

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: 215026 Room 102, building C5, No. 192, Tinglan lane, Suzhou Industrial Park, Jiangsu Province

Patentee after: Yuanzhuo Micro Nano Technology (Suzhou) Co.,Ltd.

Address before: 215026 Room 102, building C5, No. 192, Tinglan lane, Suzhou Industrial Park, Jiangsu Province

Patentee before: ADVANCED MICRO OPTICS.INC

CP01 Change in the name or title of a patent holder