CN111220626A - Bearing device, bearing method and testing equipment - Google Patents
Bearing device, bearing method and testing equipment Download PDFInfo
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- CN111220626A CN111220626A CN202010166209.0A CN202010166209A CN111220626A CN 111220626 A CN111220626 A CN 111220626A CN 202010166209 A CN202010166209 A CN 202010166209A CN 111220626 A CN111220626 A CN 111220626A
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- G—PHYSICS
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
- G01N2021/0106—General arrangement of respective parts
- G01N2021/0112—Apparatus in one mechanical, optical or electronic block
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Abstract
本发明公开了一种承载装置、承载方法及检测设备，所述承载装置包括第一基板和第二基板，所述第一基板和第二基板以层叠形式设置并被配置为相对移动；所述第一基板设有至少三个不共线的调节柱，所述第一基板具有第一限位机构，所述第一限位机构用于使调节柱沿第一轨迹移动，所述第二基板具有第二限位机构，所述第二限位机构用于使所述调节柱沿第二轨迹移动；所述第一轨迹和第二轨迹相交于一点，当所述第一基板和第二基板相对移动至多个连续的位置时，至少三个调节柱的中心共圆周，且所述圆周的第一圆心相同而半径不同。该承载装置便于放置待承载物并使得放置在其上的待承载物的中心与承载装置的中心重叠，而且对准过程简单、快速。
The invention discloses a carrying device, a carrying method and a detection device, the carrying device includes a first substrate and a second substrate, the first substrate and the second substrate are arranged in a stacked form and configured to move relatively; the The first base plate is provided with at least three non-collinear adjustment columns, the first base plate has a first limit mechanism, the first limit mechanism is used to move the adjustment columns along a first track, and the second base plate There is a second limit mechanism, the second limit mechanism is used to make the adjustment column move along the second track; the first track and the second track intersect at a point, when the first substrate and the second substrate When relatively moving to a plurality of consecutive positions, the centers of the at least three adjusting columns are in the same circle, and the first circle centers of the circles are the same but have different radii. The carrying device is convenient for placing the object to be carried and makes the center of the object to be carried placed on it overlap with the center of the carrying device, and the alignment process is simple and fast.
Description
Technical Field
The invention relates to the technical field of semiconductor detection equipment, in particular to a bearing device for bearing a wafer in the wafer production and detection processes. The invention also relates to a method for bearing the wafer and wafer detection equipment.
Background
In order to solve the above problems, defects on the surface of a wafer are usually detected before or during the chip preparation process.
At present, the common technology for detecting the surface defects of the wafer is an optical detection technology, which has the advantages of high detection speed, no pollution and the like.
Therefore, when the wafer is detected, the wafer needs to be placed at the center of the detection table, so that the detection device can conveniently detect the wafer.
Disclosure of Invention
The invention aims to provide a bearing device. The bearing device is convenient for placing the object to be carried and enables the center of the object to be carried placed on the bearing device to be overlapped with the center of the bearing device, and the alignment process is simple and quick.
The invention also aims to provide a method for carrying an object to be carried by adopting the carrying device.
Another object of the invention is to provide a detection device provided with said carrying means.
In order to achieve the above object, the present invention provides a carrier device including a first substrate and a second substrate, the first substrate and the second substrate being disposed in a stacked form, the second substrate and the first substrate being configured to move relatively; the first substrate is provided with at least three non-collinear adjusting columns, the first substrate is provided with a first limiting mechanism, the first limiting mechanism is used for enabling the adjusting columns to move along a first track, the second substrate is provided with a second limiting mechanism, and the second limiting mechanism is used for enabling the adjusting columns to move along a second track; the projection of the first track and the projection of the second track are intersected at one point, when the first substrate and the second substrate relatively move to a plurality of continuous positions, the centers of at least three adjusting columns are concentric, the circumference has a first circle center, the first circle centers of the circumferences at the plurality of continuous positions are the same and have different radiuses, and the adjusting columns are positioned at the upper ends of the areas above the second substrate to form action parts for driving the object to be loaded to move.
Preferably, the second substrate and the first substrate are configured to translate along a translation line parallel to the plane of the circumference.
Preferably, the at least three adjustment posts include a first adjustment post, a second adjustment post, and a third adjustment post; a first trajectory of the first and second adjustment posts is symmetric about the translation line; the first track of the third adjusting column is the same as the first track of the first adjusting column, or the first track of the third adjusting column is the same as the first track of the second adjusting column; a second trajectory of the first and second adjustment posts is symmetric about the translation line; the second track of the third adjusting column is the same as the second track of the first adjusting column, or the second track of the third adjusting column is the same as the second track of the second adjusting column, and the relative moving direction of the second substrate and the first substrate is equal to the included angle formed by the first track and the second track.
Preferably, the first limiting mechanism is a first clamping groove or a first sliding mechanism; the second limiting mechanism is a second clamping groove or a second sliding mechanism; one end of the adjusting column is limited by the first clamping groove or the first sliding mechanism, and the part of the adjusting column between the two ends is limited by the second clamping groove or the second sliding mechanism.
Preferably, the adjusting column is in a T shape, the diameter of the upper end of the adjusting column is larger than that of the lower end of the adjusting column, and the outer peripheral surface of the upper end of the adjusting column forms a part which is contacted with an object to be carried.
Preferably, the first sliding mechanism comprises a sliding groove and a sliding block which are arranged on the top of the first substrate; the lower extreme of adjusting the post connect in the slider, the slider sets up in the sliding tray, just the slider can slide in the sliding tray, so that adjust the post and can follow the sliding tray slides.
Preferably, the device further comprises a driving mechanism and a transmission mechanism; the driving mechanism is arranged on the first substrate and connected with the second substrate through the transmission mechanism so as to drive the second substrate to move relative to the first substrate.
Preferably, the first substrate is provided with a plurality of positioning columns, the second substrate is provided with positioning grooves corresponding to the positioning columns, and the positioning columns and the positioning grooves are matched with each other to limit the position change of the second substrate relative to the first substrate.
Preferably, the reference column is round wheel shape, the outer peripheral face of reference column is equipped with annular groove, the constant head tank is the breach groove of opening towards the outside, the breach groove is arc or linear type, be equipped with on the lateral wall in breach groove with annular groove matched with arc arch of reference column.
Preferably, the substrate further comprises a plurality of carrying columns arranged on the first substrate, the carrying columns are distributed around the center of the first substrate, and the top of each carrying column is provided with a carrying surface for placing an object to be carried; the bearing surface is higher than the upper surface of the second substrate, the second substrate is provided with notches or grooves corresponding to the bearing columns, and clearance allowance is formed between the bearing columns and the notches or grooves in the forward and backward rotating directions of the second substrate.
Preferably, the number of the bearing columns is greater than or equal to three.
Preferably, the centers of the first substrate and the second substrate are provided with hollow circles, and the positions of the hollow circles are provided with adsorption devices for adsorbing the object to be carried.
Preferably, the display device further comprises an elastic component, and two ends of the elastic component are respectively connected to the first substrate and the second substrate.
Preferably, the adjusting columns include a first group of adjusting columns and/or a second group of adjusting columns, and the distance from the second group of adjusting columns and the limiting mechanisms correspondingly arranged to the second group of adjusting columns to the first circle center is greater than the distance from the first group of adjusting columns and the limiting mechanisms correspondingly arranged to the first group of adjusting columns to the first circle center, so that the adjusting columns are respectively used for placing objects to be carried, which have different sizes.
Preferably, the height of the top of the first group of adjusting columns from the upper surface of the second base plate is smaller than the height of the top of the second group of adjusting columns from the upper surface of the second base plate.
In order to achieve the above another object, the present invention provides a carrying method, which uses any one of the above carrying devices, including:
the second base plate is driven to move along a first direction relative to the first base plate, so that the radius of a circumference formed by the at least three adjusting columns is increased;
placing an object to be carried in a carrying area above a first substrate of the carrying device;
driving the second substrate to move along a second direction relative to the first substrate, wherein the second direction is opposite to the movement direction of the first direction, and the radius of the circumference is reduced; and then the center of the object to be loaded placed in the loading area is driven to axially coincide with the circle center of the first substrate of the loading device.
To achieve the above further object, the present invention provides a detection apparatus comprising:
the carrying device is used for adjusting the center position of an object to be carried to be detected;
the detection system is used for detecting the object to be carried, which is adjusted by the carrying device;
and the manipulator is used for placing the object to be carried in the carrying area of the carrying device before detection and taking the object to be carried out from the carrying area of the carrying device after detection.
The bearing device provided by the invention is provided with a first base plate and a second base plate which can move relative to the first base plate, the first base plate is provided with a movable adjusting column, the first base plate is provided with a first limiting mechanism which can enable the adjusting column to move along a first track, and the second base plate is provided with a second limiting mechanism which can enable the adjusting column to move along a second track. When the first substrate and the second substrate relatively move to a plurality of continuous positions, the centers of at least three adjusting columns are on the same circumference, the circumference has a first circle center, and the first circle centers of the circumferences at the plurality of continuous positions are the same and have different radiuses, so that the adjusting columns can drive the object to be loaded to move to the position where the center is axially overlapped with the circle center of the first substrate through the action part in the moving process, so that the center alignment is realized, the object to be loaded is convenient to place, and the alignment process is simple, stable and rapid.
The invention also provides a bearing method and detection equipment, and the bearing method adopting the bearing device and the detection equipment provided with the bearing device also have corresponding technical effects because the bearing device has the technical effects.
Drawings
Fig. 1 is a top view of a carrying device according to an embodiment of the present invention;
FIG. 2 is an isometric view of the carrier of FIG. 1 after the second substrate is separated from the first substrate;
FIG. 3 is a top view of another embodiment of a carrier apparatus;
FIG. 4 is a schematic view illustrating the second substrate of the carrier apparatus shown in FIG. 3 after being shifted to the left by a certain distance relative to the first substrate;
fig. 5 is a schematic view illustrating the second substrate of the carrying device shown in fig. 3 after being shifted to the right by a certain distance relative to the first substrate.
In the figure:
1. the first base plate 2, the second base plate 3, the adjusting columns (first group) 4, the clamping grooves (first group) 5, the driving mechanism 6, the transmission mechanism 61, the swing arms 7, the sliding blocks (first group) 8, the sliding grooves (first group) 9, the positioning columns 91, the annular grooves 10, the positioning grooves 101, the arc-shaped protrusions 11, the bearing columns (first group) 12, the notches 13, the springs 14, the adjusting columns (second group) 15, the clamping grooves (second group) 16, the sliding grooves (second group) 17, the sliding blocks (second group) 18, the bearing columns (second group) 19, the through grooves 21, the first adjusting columns 22, the second adjusting columns 23 and the third adjusting columns
Detailed Description
In order that those skilled in the art will better understand the disclosure, the invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
In this specification, terms such as "upper, lower, inner, and outer" are established based on positional relationships shown in the drawings, and the corresponding positional relationships may vary depending on the drawings, and therefore, the terms are not to be construed as absolutely limiting the scope of protection; moreover, relational terms such as "first" and "second," and the like, may be used solely to distinguish one element from another element having the same name, without necessarily requiring or implying any actual such relationship or order between such elements.
Referring to fig. 1 and fig. 2, fig. 1 is a top view of a carrying device according to an embodiment of the present invention; fig. 2 is an isometric view of the carrier of fig. 1 after the second substrate is separated from the first substrate.
In an embodiment, the carrying device provided by the invention is used for carrying a wafer so as to place the wafer to be detected on the detection table and adjust the wafer to the central position of the detection table, thereby ensuring the detection accuracy.
As shown in the figure, the carrying device mainly comprises a first substrate 1, a second substrate 2, adjusting columns and other components, wherein the main body of the first substrate 1 is substantially square with four cut-off corners, the shape of the second substrate 2 is the same as that of the first substrate 1, and in other embodiments, the outer peripheries of the first substrate and the second substrate may be circular, rectangular or irregular.
The first substrate 1 includes a first face; the second substrate 2 includes a second face and a third face opposite to each other.
The second substrate 2 is disposed in parallel with the first substrate 1 in a stacked manner, and specifically, the second surface is disposed toward the first surface. And a proper distance is kept between the first substrate 1 and the second substrate 2.
In this embodiment, the second substrate has a rotation axis that rotates relative to the first substrate.
The center of the first substrate 1 is provided with a first hollow circle, the center of the second substrate 2 is provided with a second hollow circle, and the centers of the first hollow circle and the second hollow circle are overlapped or not overlapped in the axial direction. In this embodiment, the first hollow region and the second hollow region are circular. In other embodiments, the first and second hollow regions are elliptical, polygonal, or irregularly shaped. In another embodiment, the first substrate does not have the first hollow region, and/or the second substrate does not have the second hollow region.
In this embodiment, the rotating shaft passes through a center of the first hollow area, and the rotating shaft passes through a circle of the second hollow area. In other embodiments, the axis of rotation does not pass through the center of the first hollow region and/or the axis of rotation does not pass through the center of the second hollow region.
The upper surface of the first substrate 1 is provided with a plurality of adjusting columns 3 distributed around the center of the circle, and the number of the first adjusting columns is greater than or equal to 3, specifically, in this embodiment, the number of the first adjusting columns 3 is 4.
The centers of the first adjusting columns 3 are located in the same plane, the plane where the first adjusting columns 3 are located is perpendicular to the rotating shaft, and the center of the rotating shaft and the focus of the rotating shaft are the rotating center.
Each adjusting column 3 is movably connected to the first base plate 1 through the lower end of the adjusting column, the circular arcs formed by the distribution of the four adjusting columns 3 exceed the semi-circle, namely the four adjusting columns 3 are distributed along the circumferential circular arcs larger than 180 degrees by taking the circle centers of the first base plate 1 and the second base plate 2 as the center.
The second substrate 2 is provided with a clamping groove 4 corresponding to each adjusting column 3, the adjusting columns 3 penetrate through the clamping grooves 4, the adjusting columns exceed the third surface of the second substrate 2, and the third surface of the second substrate 2 deviates from one side of the second surface to drive the wafer to be aligned.
The first substrate 1 is provided with a lateral extension part, the lateral extension part is provided with a driving mechanism 5 and a transmission mechanism 6, the driving mechanism 5 is fixedly arranged on the lateral extension part, and the power output end of the driving mechanism is connected with the second substrate 2 through the transmission mechanism 6 so as to drive the second substrate 2 to rotate around the rotating shaft relative to the first substrate 1. The driving mechanism 5 can be a motor or other power source, the transmission mechanism 6 can be a chain transmission mechanism, the transmission mechanism 6 can be movably connected with the driving mechanism 5 and the second substrate 2 respectively, the transmission mechanism 6 shown in the figure is provided with a generally triangular swing arm 61, the wider end of the swing arm 61 is connected with the second substrate 2, one end of the swing arm 61 is connected with the driving mechanism 5, and the connecting hole position of the swing arm 61 and the driving mechanism 5 is oblong. Like this, when the motor operation, the driving medium of being connected with swing arm 61 is concertina movement, and then promotes second base plate 2 anticlockwise rotation through swing arm 61, perhaps pulls second base plate 2 clockwise turning.
The second substrate 2 can drive the adjusting column 3 to move relative to the first substrate 1 through the clamping groove 4 in the rotating process, so that the distance between the adjusting column 3 and the circle center of the first substrate 1 is reduced or enlarged simultaneously. When the second substrate 2 rotates forward (clockwise or counterclockwise) relative to the first substrate 1, the distance between the adjusting columns 3 and the center of the first substrate 1 can be increased simultaneously, so as to leave a sufficient space for placing the object to be carried, and when the second substrate 2 rotates backward (counterclockwise or clockwise) relative to the first substrate 1, the distance between the adjusting columns 3 and the center of the first substrate 1 can be decreased simultaneously.
Because the centers of the plurality of adjusting columns 3 are concentric, the circumference has a first circle center, the first circle centers are the same, the first circle center coincides with the circle center of the first substrate 1 in the embodiment, and the adjusting columns 3 can drive the wafer to move to the position where the center coincides with the circle center of the first substrate 1 in the axial direction in the moving process, so that the center alignment is realized, the wafer taking and placing are convenient, and the alignment process is simple, stable and rapid.
The first substrate is provided with a first limiting mechanism, the first limiting mechanism is used for enabling the adjusting column to move along a first track, and the first limiting mechanism is a first clamping groove or a first sliding mechanism; the second substrate is provided with a second limiting mechanism, the second limiting mechanism is used for enabling the adjusting column to move along a second track, and the second limiting mechanism is a second clamping groove or a second sliding mechanism; the projections of the first and second trajectories intersect at a point.
Each adjusts post 3 and installs on first base plate 1 through slide mechanism is movably respectively, and slide mechanism mainly comprises slider 7 and sliding tray 8, and sliding tray 8 is fixed to be set up in the first face of first base plate 1, adjusts the lower extreme and slider 7 fixed connection of post 3, and slider 7 sets up in sliding tray 8 and can slide in sliding tray 8 to make and adjust post 3 and can slide along the long limit of sliding tray 8.
The sliding groove 8 on the first substrate 1 is a linear sliding groove, the clamping groove 4 on the second substrate 2 is a linear through groove, the clamping groove 4 comprises a long edge and a short edge, the diamond shape is formed in the top view, the length of the long edge is larger than that of the short edge and is larger than the diameter of the adjusting column 3, and the adjusting column 3 can move in the clamping groove 4 along the long edge direction.
In other embodiments, the first sliding groove 8 may be arc-shaped.
The sliding groove 8 extends on the first surface of the first substrate 1 along a radial direction passing through the circle center, one end of the first track is close to the first circle center, and the other end of the first track is far away from the first circle center; the clamping groove 4 is arranged on the second substrate 2, one end of the second track is close to the first circle center, and the other end of the second track is far away from the first circle center; and the first trajectory and the second trajectory are not parallel, and orthographic projections of the two intersect. The first track and the second track are moving routes of the central point of the first adjusting column 3, the adjusting column 3 is arranged in the clamping groove 4 and can only move along the long edge direction of the clamping groove 4, and the actual moving route of the adjusting column 3 is jointly limited by the long edge direction of the sliding groove 8 and the long edge direction of the clamping groove 4.
The adjusting columns 3 are T-shaped, the diameter of the upper ends of the adjusting columns is larger than that of the lower ends of the adjusting columns, the outer peripheral surfaces of the upper ends of the adjusting columns form parts contacted with wafers, when the adjusting columns are installed, the lower ends of the adjusting columns 3 can penetrate through the clamping grooves 4 in the second substrate 2 from top to bottom to be connected with the first sliding blocks 7 in the sliding grooves 8 in the first substrate 1, and when the outer peripheral surfaces of the upper ends of all the adjusting columns 3 are tangent to the wafers in the adjusting process, the wafers are located at positions with centers axially coincident with the circle centers of the first substrate 1 and the second substrate.
The carrier further includes a positioning mechanism for defining relative movement between the first substrate and the second substrate. Specifically, in the present embodiment, the positioning mechanism is configured to relatively rotate the first substrate and the second substrate only about the rotation axis.
The positioning structure includes: positioning column 9 and positioning groove 10.
In this embodiment, the positioning mechanism is configured to convert the translational motion transmitted by the driving mechanism 5 and the transmission mechanism 6 into a rotational motion of the first substrate relative to the second substrate. The first substrate 1 can be provided with a plurality of positioning posts 9, which are four positioning posts 9 shown in the figure, and meanwhile, the second substrate 2 is provided with positioning grooves 10 corresponding to the positioning posts 9, and the rotation range of the second substrate 2 relative to the first substrate 1 can be limited by the mutual matching of the positioning posts 9 and the positioning grooves 10.
For example, the positioning posts 9 may be in the shape of a circular wheel, the peripheral surface of the positioning posts is provided with an annular groove 91, the positioning slots 10 are notched slots with openings facing outward, the notched slots are in the shape of an arc, the number of the positioning slots 10 shown in the figure is two, each side is provided with one, the positioning slots 10 are distributed in a symmetrical manner, the positioning slots 10 on each side correspond to the two positioning posts 9, and the arc-shaped side walls of the positioning posts are provided with arc-shaped protrusions 101 which are matched with the annular groove 91 of the. Of course, each positioning column 9 can be provided with one positioning groove 10 independently, and the distance between the positioning column 9 and the two ends of the positioning groove 10 limits the angle at which the second substrate 2 can rotate relative to the first substrate 1, so that the deformation caused by the extrusion of the first adjusting column 3 and the side wall of the clamping groove 4 due to the overlarge rotation angle of the second substrate can be avoided.
When first base plate 1 rotates for second base plate 2, arc protrusion 101 in constant head tank 10 slides in annular groove 91 of reference column 9 all the time to make second base plate 2 only can follow curved breach groove and rotate, guarantee that first base plate 1 and second base plate 2 keep appropriate interval all the time, avoid the direct and first base plate 1's of lower surface of second base plate 2 upper surface contact, the friction, make second base plate 2 can rotate steadily, can not upper and lower cluster or skew.
In at least one embodiment, the first substrate 1 is further provided with a supporting pillar 11, which is illustrated as four supporting pillars 11, the four supporting pillars 11 are distributed around the center of the first substrate 1, each supporting pillar 11 is semicircular in cross section, the inner side of the supporting pillar 11 is a plane, the outer side of the supporting pillar is an arc surface, the top of the supporting pillar is in a step shape with the outer side higher than the inner side, and the step surface of the supporting pillar forms a supporting surface for placing a wafer; the second substrate 2 is provided with notches 12 corresponding to the bearing columns 11 one by one, the bearing columns 11 penetrate through the notches 12 in the second substrate 2 and exceed one side of the third surface, which deviates from the first substrate, to extend, the bearing surface of the bearing columns is higher than the upper surface of the second substrate 2, so that the edge part of the wafer is supported, the wafer is prevented from being in direct contact with the second substrate 2, and the manipulator can be inserted into a gap between the bearing surface and the surface of the second substrate 2, so that the wafer is placed on the bearing surface or taken down from the bearing surface.
The gap 12 on the second substrate 2 has a certain radian, and a clearance margin is provided between the two ends of the gap 12 and the support column 11 in the forward and backward rotation directions of the second substrate 2, so as to prevent the second substrate 2 from interfering with the first support column 11 in the rotation process.
In another embodiment, the first supporting pillar 11 is located on the third surface of the second substrate and is fixedly connected to the second substrate.
In other embodiments, an adsorption device (not shown) is disposed at the hollow circle position of the first substrate 1 and the second substrate 2, and after the wafer is located at the center position of the wafer carrier, the adsorption device can generate a certain adsorption force on the wafer by a vacuum pumping manner, so as to fix the wafer.
In this embodiment, the bearing device may further include an elastic member disposed between the first substrate 1 and the second substrate 2, and two ends of the elastic member are respectively connected to the first substrate and the second substrate.
In particular, said elastic means comprise a spring 13. In this embodiment, the first substrate 1 and the second substrate 2 are respectively provided with a rectangular hole site for placing the spring 13, two ends of the rectangular hole site are thinned appropriately, and a connecting hole is formed at the thinned part, one end of the spring 13 is hooked on the connecting hole of the first substrate 1, and the other end is hooked on the connecting hole of the opposite end of the second substrate 2. Through installing spring 13 additional, can prevent that first regulation post 3 from to the wafer add the holding power too big, damage the wafer to can reduce the alignment error because of adjusting 3 wearing and tearing leads to.
Through the arrangement, the second substrate 2 can change position relative to the first substrate 1, and the position change amount of the second substrate is limited by the positioning column 9 and the positioning groove 10, when the position of the second substrate 2 relative to the first substrate 1 changes, the relative position of the adjusting columns 3 in the clamping groove 4 is driven to change, the distance of the adjusting columns 3 relative to the circle center O is further caused to change, and at the moment, a wafer to be detected can be placed on the first bearing column 11 of the wafer bearing device by using a manipulator; after the wafer is placed on the adjusting device, the driving mechanism drives the second substrate 2 to move in the opposite direction through the transmission mechanism, so that the position of the second substrate 2 relative to the first substrate 1 changes in the opposite direction (relative to the moving direction before the wafer is placed), and simultaneously drives the adjusting columns 3 to change in the opposite direction relative to the clamping grooves 4, so that the distances from the plurality of adjusting columns 3 to the circle center O are simultaneously reduced, and simultaneously drives the position of the wafer placed on the adjusting columns to change, and when the wafer to be measured and the plurality of adjusting columns 3 are in tangent positions, the center of the wafer is axially overlapped with the center of the wafer bearing device.
In this embodiment, two or more sets of adjusting posts and clamping grooves are simultaneously disposed on the first substrate 1 and the second substrate 2, that is, a set of adjusting posts 14 and clamping grooves 15 are disposed on the peripheries of the adjusting posts 3 and the clamping grooves 4, the distribution, matching manner, and sliding mechanism of the adjusting posts 14 and the clamping grooves 5 are substantially the same as those of the adjusting posts 3 and the clamping grooves 4, and the adjusting posts 3 and the clamping grooves 4 have sliding grooves 16, sliders 17, and support posts 18, except that the distance between the adjusting posts 14 and the clamping grooves 15 and the center O of the circle is greater than that between the adjusting posts 3 and the clamping grooves 4 and the center O of the circle, the adjusting posts 3 and the clamping grooves 4 are used for adjusting wafers with relatively small diameters, and the adjusting posts 14 and the clamping grooves 15 are used for adjusting wafers with relatively large. Therefore, the wafer bearing device can be used for placing wafers to be tested with different sizes, and the compatibility of the wafer bearing device is improved. When different objects to be supported are automatically centered, the first adjusting column 3 or the second adjusting column 14 only needs to generate small displacement, so that the objects to be supported can be quickly aligned.
The second sliding groove 16 is shown as a linear groove, the first sliding groove 8 in the same direction is also a linear groove, and the two can be in the same straight line, and the second sliding groove 16 and the first sliding groove 8 in the same direction are shown as a distance apart in the linear direction, as a possible improvement, the second sliding groove 16 and the first sliding groove 8 can also be connected into a whole through a connecting groove, so that only one sliding groove can be arranged to match with the adjusting column 3 and the adjusting column 14 at the same time. The connecting groove is a linear groove or an arc-shaped groove.
In addition, the thickness of the upper end of the adjusting column 14 is larger than that of the upper end of the adjusting column 3, and the tops of the adjusting column 3 and the adjusting column 14 are both provided with a straight groove so as to facilitate screwing operation; the height of the support posts 14 is greater than that of the support posts 3, the second substrate 2 is provided with through grooves 19 corresponding to the support posts 14, and clearance allowance is provided between the support posts 14 and the two ends of the through grooves 19 in the forward and backward rotation directions of the second substrate 2, so as to prevent the second substrate 2 from interfering with the support posts 14 in the rotation process.
Referring to fig. 3, fig. 4, and fig. 5, fig. 3 is a top view of another carrying device according to an embodiment of the disclosure; FIG. 4 is a schematic view illustrating the second substrate of the carrier apparatus shown in FIG. 3 after being shifted to the left by a certain distance relative to the first substrate; fig. 5 is a schematic view illustrating the second substrate of the carrying device shown in fig. 3 after being shifted to the right by a certain distance relative to the first substrate.
In another embodiment, the second substrate 2 and the first substrate 1 are configured to translate along a translation line (indicated by a dashed arrow) parallel to a plane where the circumference is located, the first substrate 1 and the second substrate 2 are schematically represented by circles in the figure, the first substrate 1 and the second substrate 2 may have various actual shapes and configurations, and the structures of the adjusting columns, the clamping slots, the sliding blocks, the sliding slots, and the like may be substantially the same as those of the first embodiment, except that the driving mechanism is used for driving the second substrate 2 to translate relative to the first substrate 1, and the adjusting columns can drive the object to be carried to move to the center to coincide with the center of the first substrate 1 during the moving process by the translation, so as to achieve the center alignment.
Specifically, the adjusting columns in this embodiment include a first adjusting column 21, a second adjusting column 22 and a third adjusting column 23, wherein the sliding grooves 8 of the first adjusting column 21 and the second adjusting column 22 are symmetrical about a translation line, the sliding grooves 8 define first tracks of the first adjusting column 21 and the second adjusting column 22, and the sliding grooves 8 of the third adjusting column 23 are the same as the sliding grooves 8 of the second adjusting column 22 and are parallel to each other; the clamping grooves 4 of the first adjusting column 21 and the second adjusting column 22 are symmetrical about a translation line, the clamping grooves 4 define a second track of the first adjusting column 21 and the second adjusting column 22, the clamping grooves 4 of the third adjusting column 23 are the same as the clamping grooves 4 of the second adjusting column 22, and when the adjusting device is observed from a top view, the clamping grooves 4 and the sliding grooves 8 of the second adjusting column 22 are translated to form the clamping grooves 4 and the sliding grooves 8 of the third adjusting column 23.
Of course, the first track of the third adjusting column 23 may also be the same as the first track of the first adjusting column 21, and the second track of the third adjusting column 23 may also be the same as the second track of the first adjusting column 21, that is, the clamping groove 4 and the sliding groove 8 of the third adjusting column 23 may be formed after the clamping groove 4 and the sliding groove 8 of the first adjusting column 21 are translated.
The clamping groove 4 and the sliding groove 8 of the first adjusting column 21 are linear grooves, the clamping groove 4 and the sliding groove 8 of the second adjusting column 22 are linear tracks, the clamping groove 4 and the sliding groove 8 are perpendicular to each other in projection, when the circle centers of the first substrate 1 and the second substrate 2 coincide, the first adjusting column 21 and the second adjusting column 22 are radially symmetrical along the diameter direction passing through the circle center, and the included angle formed by the translation line, the clamping groove 4 and the sliding groove 8 of the first adjusting column 21 and the clamping groove 4 and the sliding groove 8 of the second adjusting column 22 is equal to 45 degrees.
Thus, on the basis that the centers of the second substrate 2 and the first substrate 1 are overlapped, if the second substrate 2 moves leftwards relative to the first substrate 1 along the direction indicated by the arrow in fig. 4, the centers of the three adjusting columns are concentric, the first center of the circle is always overlapped with the center of the first substrate 1, and the radius of the circle gradually becomes smaller; if the second substrate 2 moves rightwards relative to the first substrate 1 along the direction indicated by the arrow in fig. 5, the centers of the three adjusting columns are concentric with a circle, the first circle center of the circle is always overlapped with the circle center of the first substrate 1, and the radius of the circle is gradually increased; the object to be carried can be put into after the circumference radius grow, and the object to be carried can be pressed from both sides tightly after the circumference radius diminishes to can drive the object to be carried and move to the center and the position of the centre of a circle axial coincidence of first base plate 1 at the translation in-process, realize the center and aim at, it not only is convenient for place the object to be carried, and the alignment process is simple, stable, swift moreover.
In this embodiment, the slot 4 may be a linear slot or an arc slot, and the sliding slot may also be a linear slot or an arc slot.
The above embodiments are merely preferred embodiments of the present invention, and are not limited thereto, and on the basis of the above embodiments, various embodiments can be obtained by performing targeted adjustment according to actual needs. For example, the sliding grooves 8 and 16 extend in a radial direction deviating from the center of the circle on the top of the first substrate 1, or the locking grooves 4 and 15 are arc-shaped locking grooves, or the adjusting columns 3 and 4 are split-type assembled structures and are formed by connecting two or three parts respectively, and so on. This is not illustrated here, since many implementations are possible.
In addition to the wafer carrying device, the present invention further provides a wafer carrying method, which uses the wafer carrying device to perform alignment adjustment on a wafer, and the method includes:
when the device is used for bearing a wafer with a smaller diameter, the driving mechanism 5 drives the second substrate 2 to rotate along the anticlockwise direction relative to the first substrate 1, so that the distances between the adjusting columns 3 and 14 relative to the circle centers of the first substrate 1 and the second substrate 2 are increased simultaneously;
placing the wafer on the bearing surface of the bearing column 11 through a mechanical arm;
driving the second substrate 2 to rotate clockwise relative to the first substrate 1, so that the distances between the adjusting columns 3 and the adjusting columns 14 relative to the circle centers of the first substrate 1 and the second substrate 2 become smaller simultaneously; and then the first adjusting column 3 drives the center of the wafer placed on the bearing column 11 to axially coincide with the circle centers of the first substrate 1 and the second substrate 2.
When the device is used for bearing a wafer with a larger diameter, the driving mechanism 5 drives the second substrate 2 to rotate along the anticlockwise direction relative to the first substrate 1, so that the distances between the first adjusting column 3 and the second adjusting column 14 relative to the circle centers of the first substrate 1 and the second substrate 2 are increased simultaneously;
placing the wafer on the bearing surface of the bearing column 18 through a mechanical arm;
the second substrate 2 is driven to rotate clockwise relative to the first substrate 1, and the spring 13 also generates a certain resilience force on the second substrate 2, so that the distances between the first adjusting column 3 and the adjusting column 14 relative to the circle centers of the first substrate 1 and the second substrate 2 are reduced simultaneously; and the center of the wafer placed on the bearing column 18 is driven by the adjusting column 14 to be axially coincident with the circle centers of the first substrate 1 and the second substrate 2.
The present invention also provides a detection apparatus comprising:
the carrying device as described above, the carrying device being configured to adjust a center position of a wafer to be detected;
the detection system is used for detecting the wafer adjusted by the bearing device;
the robot is configured to place the wafer on the bearing surface of the first bearing column 11 or the second bearing column 18 of the bearing device before the inspection, and remove the wafer from the bearing surface of the first bearing column 11 or the second bearing column 18 after the inspection.
The bearing device, the bearing method and the detection device provided by the invention are described in detail above. The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the core concepts of the present invention. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
Claims (17)
1. The bearing device is characterized by comprising a first substrate and a second substrate, wherein the first substrate and the second substrate are arranged in a laminated mode, and the second substrate and the first substrate are configured to move relatively; the first substrate is provided with at least three non-collinear adjusting columns, the first substrate is provided with a first limiting mechanism, the first limiting mechanism is used for enabling the adjusting columns to move along a first track, the second substrate is provided with a second limiting mechanism, and the second limiting mechanism is used for enabling the adjusting columns to move along a second track; the projections of the first track and the second track are intersected at one point, when the first substrate and the second substrate relatively move to a plurality of continuous positions, the centers of at least three adjusting columns are concentric, the circumference has a first circle center, the first circle centers of the circumferences at the plurality of continuous positions are the same and have different radiuses, and the adjusting columns are positioned in the area above the second substrate to form an action part for driving the object to be loaded to move.
2. The carrier device of claim 1, wherein the second substrate and the first substrate are configured to translate along a translation line parallel to a plane in which the circumference lies.
3. The carrier according to claim 2 wherein the at least three adjustment posts comprise a first adjustment post, a second adjustment post, and a third adjustment post; a first trajectory of the first and second adjustment posts is symmetric about the translation line; the first track of the third adjusting column is the same as the first track of the first adjusting column, or the first track of the third adjusting column is the same as the first track of the second adjusting column; a second trajectory of the first and second adjustment posts is symmetric about the translation line; the second track of the third adjusting column is the same as the second track of the first adjusting column, or the second track of the third adjusting column is the same as the second track of the second adjusting column, and the relative moving direction of the second substrate and the first substrate is equal to the included angle formed by the first track and the second track.
4. The carrying device according to claim 1, wherein the first limiting mechanism is a first slot or a first sliding mechanism; the second limiting mechanism is a second clamping groove or a second sliding mechanism; one end of the adjusting column is limited by the first clamping groove or the first sliding mechanism, and the part of the adjusting column between the two ends is limited by the second clamping groove or the second sliding mechanism.
5. The carrying device as claimed in claim 1, wherein the adjusting column is "T" shaped, the diameter of the upper end is larger than that of the lower end, and the outer circumference of the upper end forms a contact part with the object to be carried.
6. The carrier device according to claim 5, wherein the first sliding mechanism comprises a sliding groove and a sliding block arranged on the top of the first substrate; the lower extreme of adjusting the post connect in the slider, the slider sets up in the sliding tray, just the slider can slide in the sliding tray, so that adjust the post and can follow the sliding tray slides.
7. The carrier in accordance with claim 1 further comprising a drive mechanism and a transmission mechanism; the driving mechanism is arranged on the first substrate and connected with the second substrate through the transmission mechanism so as to drive the second substrate to move relative to the first substrate.
8. The carrying device as claimed in any one of claims 1 to 3, wherein the first substrate is provided with a plurality of positioning posts, the second substrate is provided with positioning grooves corresponding to the positioning posts, and the positioning posts and the positioning grooves cooperate with each other to limit the position change of the second substrate relative to the first substrate.
9. The carrying device as claimed in claim 8, wherein the positioning post is in the shape of a circular wheel, the positioning post has an annular groove on its outer peripheral surface, the positioning groove has a notch groove with an opening facing outward, the notch groove has an arc shape or a linear shape, and the side wall of the notch groove has an arc-shaped protrusion matching with the annular groove of the positioning post.
10. The carrying device according to any one of claims 1 to 3, further comprising carrying pillars disposed on the first substrate, wherein a plurality of the carrying pillars are distributed around a center of the first substrate, and a carrying surface for placing an object to be carried is disposed on a top of each of the carrying pillars; the bearing surface is higher than the upper surface of the second substrate, the second substrate is provided with notches or grooves corresponding to the bearing columns, and clearance allowance is formed between the bearing columns and the notches or grooves in the forward and backward rotating directions of the second substrate.
11. The carrier as claimed in claim 10 wherein the number of carrier posts is greater than or equal to three.
12. The carrying device according to claim 1, wherein the centers of the first and second substrates are provided with hollow circles, and the hollow circles are provided with adsorbing devices for adsorbing the object to be carried.
13. The carrier device according to claim 1, further comprising a resilient member having two ends connected to the first and second substrates, respectively.
14. The carrying device according to any one of claims 1 to 7, 9 and 11 to 13, wherein the adjusting columns comprise a first group of adjusting columns and/or a second group of adjusting columns, and the distance from the second group of adjusting columns and the limiting mechanisms correspondingly arranged to the second group of adjusting columns to the first circle center is larger than the distance from the first group of adjusting columns and the limiting mechanisms correspondingly arranged to the first group of adjusting columns to the first circle center, so as to be respectively used for placing objects to be carried with different sizes.
15. The carrier as claimed in claim 14, wherein the height of the tops of the first set of posts from the upper surface of the second base plate is less than the height of the tops of the second set of posts from the upper surface of the second base plate.
16. The carrying method is characterized in that the carrying device of any one of the claims 1 to 15 is adopted, and comprises the following steps:
the second base plate is driven to move along a first direction relative to the first base plate, so that the radius of a circumference formed by the at least three adjusting columns is increased;
placing an object to be carried in a carrying area above a first substrate of the carrying device;
driving the second substrate to move along a second direction relative to the first substrate, wherein the second direction is opposite to the movement direction of the first direction, and the radius of the circumference is reduced; and then the center of the object to be loaded placed in the loading area is driven to axially coincide with the circle center of the first substrate of the loading device.
17. A detection apparatus, comprising:
the carrying device according to any one of claims 1 to 15, which is used for adjusting the center position of an object to be carried to be detected;
the detection system is used for detecting the object to be carried, which is adjusted by the carrying device;
and the manipulator is used for placing the object to be carried in the carrying area of the carrying device before detection and taking the object to be carried out from the carrying area of the carrying device after detection.
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| CN2020101392373 | 2020-03-03 | ||
| CN202020243828 | 2020-03-03 | ||
| CN202010139237 | 2020-03-03 | ||
| CN2020202438280 | 2020-03-03 |
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| CN202020293555.0U Active CN211856399U (en) | 2020-03-03 | 2020-03-11 | Bearing device and detection equipment |
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| CN113465888A (en) * | 2021-06-30 | 2021-10-01 | 深圳中科飞测科技股份有限公司 | Adjusting device and adjusting method thereof |
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| CN111220626A (en) * | 2020-03-03 | 2020-06-02 | 深圳中科飞测科技有限公司 | Bearing device, bearing method and testing equipment |
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| CN211856399U (en) | 2020-11-03 |
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