CN111196908A - UV (ultraviolet) curing conductive adhesive and preparation method thereof - Google Patents

Abstract

The invention discloses a UV curing conductive adhesive which comprises the following components in parts by mass: 10-25 parts of acrylic acid, 1-5 parts of photoinitiator, 1-6 parts of conductive agent, 1-3 parts of crosslinking agent, 30-45 parts of dispersant, 0.5-2 parts of filler, 0.5-2 parts of neutralizer and 30-60 parts of water. The conductive adhesive prepared by the invention has higher conductivity and stronger stability, and meanwhile, the conductive adhesive has good moisturizing effect and good adhesive force, is easy to tear and paste, and does not cause skin discomfort. The preparation method of the UV curing conductive adhesive is simple, and has the advantages of small environmental pollution, low energy consumption and high production efficiency.

Description

UV (ultraviolet) curing conductive adhesive and preparation method thereof

Technical Field

The invention relates to the technical field of medical conductive adhesives, in particular to a UV (ultraviolet) curing conductive adhesive and a preparation method thereof.

Background

The conductive adhesive is an adhesive which has certain conductivity after being cured or dried. The conductive adhesive may be classified into a room temperature curing conductive adhesive, a medium temperature curing conductive adhesive, a high temperature curing conductive adhesive, a UV (ultraviolet) curing conductive adhesive, and the like according to a curing system. The UV curing conductive adhesive is a new conductive adhesive developed in recent years, and compared with the common conductive adhesive, the UV curing conductive adhesive combines an ultraviolet curing technology with the conductive adhesive, gives the conductive adhesive new performance and expands the application range of the conductive adhesive. The preparation method has the characteristics of low curing temperature, high curing speed, simple equipment and the like, and has the advantages of small environmental pollution, low energy consumption, high efficiency and good chemical stability because no solvent is contained in the synthesis process and no heating is needed during curing, and the preparation method is widely applied to various medical instruments, such as manufacturing disposable electrocardio-electrodes and the like.

The UV curing conductive adhesive applied to medical instruments is a gel substance formed by polymerizing high molecular monomers in a certain proportion, the adhesive surface of the UV curing conductive adhesive can be instantly adhered to the surface of human skin, and after the UV curing conductive adhesive is combined with special medical equipment, current signals can be well transmitted.

The existing medical UV curing conductive adhesive needs to be contacted with human skin in the using process, and after the existing medical UV curing conductive adhesive is contacted with the human skin, stimulation and anaphylactic reaction can be generated particularly in the using process of children; when the medical instrument is pasted on the skin of a human body through the conductive adhesive, the optimal detection state can be achieved through position adjustment for several times, the viscosity of the existing conductive adhesive is often insufficient, after the position adjustment, the product is not tightly contacted with the skin of the human body, the detection result is inaccurate, or the viscosity of the conductive adhesive is too high, after the use, the conductive adhesive is not easy to peel off the skin, and residues are left on the surface of the skin, so that potential hazards exist.

Disclosure of Invention

The invention aims to provide a UV curing conductive adhesive, which can solve the problems that the conductive adhesive in the prior art is easy to yellow in the storage process due to the existence of acrylic acid, the viscosity of the conductive adhesive is insufficient, and the viscosity is reduced to cause poor signals or transmission interruption especially under the condition of sweat.

In order to solve the problems, the invention adopts the following technical scheme:

the invention provides a UV curing conductive adhesive, which comprises the following components in parts by mass:

10-25 parts of acrylic acid

1-5 parts of photoinitiator

1-6 parts of conductive agent

1-3 parts of cross-linking agent

30-45 parts of dispersant

0.5-2 parts of filler

0.5-2 parts of neutralizing agent

30-60 parts of water.

Specifically, the photoinitiator is 2-hydroxy-2-methyl-1-phenyl acetone or 1-hydroxycyclohexyl phenyl ketone.

Specifically, the cross-linking agent is N, N' -methylene bisacrylamide.

Specifically, the conductive agent is sodium salt or potassium salt, the dispersing agent is glycerin, the filler is fumed silica, and the neutralizing agent can be sodium carbonate solution with the mass percentage of 30%.

In a second aspect of the present invention, a method for preparing a UV curable conductive adhesive is provided, which is used for preparing the UV curable conductive adhesive, and includes the following steps:

the method comprises the following steps: weighing a cross-linking agent and water, adding the cross-linking agent and the water into a reaction kettle, then adding a neutralizing agent and a filling agent, stirring and fully mixing until the cross-linking agent and the water are completely dissolved;

step two: after stirring, adding acrylic acid into the reaction kettle, fully stirring, and then adding a dispersing agent for stirring;

step three: then adding a conductive agent into the reaction kettle, and fully stirring until the conductive agent is completely dissolved;

step four: adding a photoinitiator into the reaction kettle while stirring, and fully stirring for 2-3 hours to obtain a conductive adhesive solution;

step five: and D, carrying out a glue dispensing or gluing process on the conductive adhesive solution prepared in the step four, and carrying out ultraviolet curing to obtain the conductive adhesive.

The invention has the following beneficial effects: according to the invention, acrylic acid, a photoinitiator, a conductive agent, a cross-linking agent, a dispersing agent, a filling agent, a neutralizing agent and water are reasonably proportioned and are subjected to ultraviolet curing to prepare the conductive adhesive, the conductive adhesive has high conductivity, and meanwhile, the conductive adhesive has a good moisturizing effect, good adhesion, is easy to tear and adhere and can not cause skin discomfort; in addition, the conductive adhesive has high stability and long storage time, and the conductive adhesive is prevented from yellowing.

Drawings

The invention is described in further detail below with reference to specific embodiments and with reference to the following drawings.

FIG. 1 is a graph showing the effect of the amount of photoinitiator used in the present invention on the resistivity of a conductive paste.

Detailed Description

Example 1

The UV curing conductive adhesive in the embodiment comprises the following components in parts by mass:

acrylic acid 10g

2-hydroxy-2-methyl-1-phenylpropanone (3 g)

Sodium salt 2g

N, N' -methylenebisacrylamide 1g

35g of glycerol

Fumed silica 1.2g

1g of 30% sodium carbonate solution

50g of water.

The preparation method of the UV curing conductive adhesive comprises the following steps:

the method comprises the following steps: weighing 1g of N, N '-methylene bisacrylamide and 50g of water, adding the N, N' -methylene bisacrylamide and the water into a reaction kettle, then adding 1g of 30 mass percent sodium carbonate solution and 1.2g of gas phase silicon dioxide, stirring and fully mixing until the sodium carbonate solution and the gas phase silicon dioxide are completely dissolved, and standing and defoaming for 1 day;

step two: after stirring, adding 10g of acrylic acid into the reaction kettle, fully stirring, and then adding 35g of glycerol for stirring;

step three: then 2g of sodium salt is added into the reaction kettle, and the mixture is fully stirred until the sodium salt is completely dissolved;

step four: adding 3g of 2-hydroxy-2-methyl-1-phenyl acetone into the reaction kettle while stirring, and fully stirring for 2-3 hours to obtain a conductive adhesive solution;

step five: and D, carrying out a glue dispensing or gluing process on the conductive adhesive solution prepared in the step four, and carrying out ultraviolet curing to obtain the conductive adhesive.

Example 2

The UV curing conductive adhesive in the embodiment comprises the following components in parts by mass:

acrylic acid 12g

2-hydroxy-2-methyl-1-phenylpropanone 5g

Sodium salt 6g

2g of N, N' -methylenebisacrylamide

45g of glycerol

Fumed silica 2g

2g of 30% sodium carbonate solution

30g of water.

The preparation method of the UV curing conductive adhesive comprises the following steps:

the method comprises the following steps: weighing 2g of N, N '-methylene bisacrylamide and 30g of water, adding the N, N' -methylene bisacrylamide and the water into a reaction kettle, then adding 2g of 30 mass percent sodium carbonate solution and 2g of gas phase silicon dioxide, stirring and fully mixing until the sodium carbonate solution and the gas phase silicon dioxide are completely dissolved, and standing and defoaming for 1 day;

step two: after stirring, adding 12g of acrylic acid into the reaction kettle, fully stirring, adding 45g of glycerol, and stirring;

step three: then 6g of sodium salt is added into the reaction kettle, and the mixture is fully stirred until the sodium salt is completely dissolved;

step four: adding 5g of 2-hydroxy-2-methyl-1-phenyl acetone into the reaction kettle while stirring, and fully stirring for 2-3 hours to obtain a conductive adhesive solution;

step five: and D, carrying out a glue dispensing or gluing process on the conductive adhesive solution prepared in the step four, and carrying out ultraviolet curing to obtain the conductive adhesive.

Example 3

The UV curing conductive adhesive in the embodiment comprises the following components in parts by mass:

acrylic acid 25g

2-hydroxy-2-methyl-1-phenylpropanone 1g

Sodium salt 1g

N, N' -methylenebisacrylamide 3g

Glycerol 30g

Fumed silica 0.5g

0.5g of sodium carbonate solution with the mass percent of 30 percent

60g of water.

The preparation method of the UV curing conductive adhesive comprises the following steps:

the method comprises the following steps: weighing 3g of N, N '-methylene bisacrylamide and 60g of water, adding the N, N' -methylene bisacrylamide and the water into a reaction kettle, then adding 0.5g of 30 mass percent sodium carbonate solution and 0.5g of gas phase silicon dioxide, stirring and fully mixing until the sodium carbonate solution and the gas phase silicon dioxide are completely dissolved, and standing and defoaming for 1 day;

step two: after stirring, adding 25g of acrylic acid into the reaction kettle, fully stirring, adding 30g of glycerol, and stirring;

step three: then adding 1g of sodium salt into the reaction kettle, and fully stirring until the sodium salt is completely dissolved;

step four: adding 1g of 2-hydroxy-2-methyl-1-phenyl acetone into the reaction kettle while stirring, and fully stirring for 2-3 hours to obtain a conductive adhesive solution;

step five: and D, carrying out a glue dispensing or gluing process on the conductive adhesive solution prepared in the step four, and carrying out ultraviolet curing to obtain the conductive adhesive.

Example 4

The UV curing conductive adhesive in the embodiment comprises the following components in parts by mass:

acrylic acid 10g

3g of 1-hydroxycyclohexylphenylketone

Sodium salt 2g

N, N' -methylenebisacrylamide 1g

35g of glycerol

Fumed silica 1.2g

1g of 30% sodium carbonate solution

50g of water.

The preparation method of the UV curing conductive adhesive comprises the following steps:

the method comprises the following steps: weighing 1g of N, N '-methylene bisacrylamide and 50g of water, adding the N, N' -methylene bisacrylamide and the water into a reaction kettle, then adding 1g of 30 mass percent sodium carbonate solution and 1.2g of gas phase silicon dioxide, stirring and fully mixing until the sodium carbonate solution and the gas phase silicon dioxide are completely dissolved, and standing and defoaming for 1 day;

step two: after stirring, adding 10g of acrylic acid into the reaction kettle, fully stirring, and then adding 35g of glycerol for stirring;

step three: then 2g of sodium salt is added into the reaction kettle, and the mixture is fully stirred until the sodium salt is completely dissolved;

step four: adding 3g of 1-hydroxycyclohexyl phenyl ketone into the reaction kettle while stirring, and fully stirring for 2-3 hours to obtain a conductive adhesive solution;

step five: and D, carrying out a glue dispensing or gluing process on the conductive adhesive solution prepared in the step four, and carrying out ultraviolet curing to obtain the conductive adhesive.

Example 5

The UV curing conductive adhesive in the embodiment comprises the following components in parts by mass:

acrylic acid 12g

2-hydroxy-2-methyl-1-phenylpropanone 1g

Sodium salt 6g

2g of N, N' -methylenebisacrylamide

45g of glycerol

Fumed silica 2g

2g of 30% sodium carbonate solution

30g of water.

The preparation method of the UV curable conductive adhesive is the same as that of example 2.

Example 6

Acrylic acid 12g

2-hydroxy-2-methyl-1-phenylpropanone (3 g)

Sodium salt 6g

2g of N, N' -methylenebisacrylamide

45g of glycerol

Fumed silica 2g

2g of 30% sodium carbonate solution

30g of water.

The above-mentioned UV curable conductive paste was prepared in the same manner as in example 2.

Example 7

Acrylic acid 12g

2-hydroxy-2-methyl-1-phenylpropanone 7g

Sodium salt 6g

2g of N, N' -methylenebisacrylamide

45g of glycerol

Fumed silica 2g

2g of 30% sodium carbonate solution

30g of water.

The above-mentioned UV curable conductive paste was prepared in the same manner as in example 2.

The UV curing conductive adhesive prepared in the embodiments 1 to 4 is respectively subjected to bonding capability and conductivity detection, and experimental results show that the product has strong viscosity, is easy to tear and paste, does not cause skin discomfort, can be repeatedly used for more than 3 times, and still keeps certain viscosity when sweat occurs; the conductive adhesive does not turn yellow after being stored for a long time; through tests, the conductivity of the product of the invention is as follows: 1. alternating current impedance: the impedance of the electrode pair connected by the single glue to the glue is less than or equal to 3000 omega; 2. direct current offset voltage: the DC offset voltage of the electrode pair is less than or equal to 100 mV; 3. complex detuning instability and internal noise: no more than 150 μ V (peak-to-peak); 4. defibrillation overload recovery: the absolute value of the polarized electromotive force is not more than 100mV, the average change rate of every 10s is not more than +/-1 mV/s, and the alternating current impedance of the electrode pair after defibrillation is not more than 3000 omega; 5. bias current tolerance: within 8h, the voltage change of the electrode pair is less than or equal to 100 mV.

The effect of the amount of the photoinitiator on the resistivity of the conductive adhesive is tested in examples 2 and 5 to 7, and it can be seen from fig. 1 that the resistivity of the UV-curable conductive adhesive is in a descending trend with the increase of the photoinitiator, when the amount of the photoinitiator is 5g, the resistivity reaches a minimum value, the amount of the photoinitiator is continuously increased, and the resistivity is conversely increased, which may be because the photoinitiator remains in the system after the photo-initiation reaction is finished, and finally has a negative effect on the resistivity.

The present invention has been described in terms of specific examples, which are provided to aid understanding of the invention and are not intended to be limiting. For a person skilled in the art to which the invention pertains, several simple deductions, modifications or substitutions may be made according to the idea of the invention.

Claims (5)

1. The UV-curable conductive adhesive is characterized by comprising the following components in parts by mass:

10-25 parts of acrylic acid

1-5 parts of photoinitiator

1-6 parts of conductive agent

1-3 parts of cross-linking agent

30-45 parts of dispersant

0.5-2 parts of filler

0.5-2 parts of neutralizing agent

30-60 parts of water.

2. The UV-curable conductive adhesive according to claim 1, wherein the photoinitiator is 2-hydroxy-2-methyl-1-phenylpropanone or 1-hydroxycyclohexyl phenyl ketone.

3. The UV-curable conductive adhesive according to claim 1, wherein the crosslinking agent is N, N' -methylenebisacrylamide.

4. The UV-curable conductive paste according to claim 1, wherein the conductive agent is a sodium salt or a potassium salt, the dispersant is glycerin, and the filler is fumed silica.

5. A method for preparing the UV-curable conductive adhesive according to any one of claims 1 to 4, comprising the steps of:

the method comprises the following steps: weighing a cross-linking agent and water, adding the cross-linking agent and the water into a reaction kettle, then adding a neutralizing agent and a filling agent, stirring and fully mixing until the cross-linking agent and the water are completely dissolved;

step two: after stirring, adding acrylic acid into the reaction kettle, fully stirring, and then adding a dispersing agent for stirring;

step three: then adding a conductive agent into the reaction kettle, and fully stirring until the conductive agent is completely dissolved;

step four: adding a photoinitiator into the reaction kettle while stirring, and fully stirring for 2-3 hours to obtain a conductive adhesive solution;

step five: and D, carrying out a glue dispensing or gluing process on the conductive adhesive solution prepared in the step four, and carrying out ultraviolet curing to obtain the conductive adhesive.

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