CN111182277B - Transmission system for DVI signals over long distances using optical fiber - Google Patents
Transmission system for DVI signals over long distances using optical fiber Download PDFInfo
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- CN111182277B CN111182277B CN201911326307.XA CN201911326307A CN111182277B CN 111182277 B CN111182277 B CN 111182277B CN 201911326307 A CN201911326307 A CN 201911326307A CN 111182277 B CN111182277 B CN 111182277B
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- 239000013307 optical fiber Substances 0.000 title claims abstract description 42
- 230000005540 biological transmission Effects 0.000 title claims abstract description 41
- 238000006243 chemical reaction Methods 0.000 claims abstract description 116
- 239000003990 capacitor Substances 0.000 claims description 48
- 230000003287 optical effect Effects 0.000 claims description 20
- 239000000835 fiber Substances 0.000 claims description 6
- 230000008054 signal transmission Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 8
- 238000004891 communication Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 238000002059 diagnostic imaging Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N7/00—Television systems
- H04N7/22—Adaptations for optical transmission
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/222—Studio circuitry; Studio devices; Studio equipment
- H04N5/262—Studio circuits, e.g. for mixing, switching-over, change of character of image, other special effects ; Cameras specially adapted for the electronic generation of special effects
- H04N5/268—Signal distribution or switching
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/76—Television signal recording
- H04N5/765—Interface circuits between an apparatus for recording and another apparatus
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention discloses a transmission system for optical fiber remote transmission DVI signals, which comprises a first DVI interface, a first ESD module, a first photoelectric signal conversion chip, an optical fiber wire, a second photoelectric signal conversion chip, a second ESD module and a second DVI interface, wherein the first DVI interface is connected with the first photoelectric signal conversion chip through the first ESD module, the first photoelectric signal conversion chip is connected with the second photoelectric signal conversion chip through the optical fiber wire, and the second photoelectric signal conversion chip is connected with the second DVI interface through the second ESD module. The invention realizes the remote transmission of DVI signals and can support 200 m transmission.
Description
Technical Field
The invention belongs to the technical field of signal transmission structures, and particularly relates to a transmission system for transmitting DVI signals remotely through optical fibers.
Background
At present, the rapid development of high-definition digital multimedia interface technology and multimedia video transmission bring diversified demands. More and more application scenes, such as large medical imaging systems, high-definition computer displays, high-definition projectors and other devices, need to be remotely connected to a remote display interface through a DVI interface. DVI (Digital Visual Interface) is to transmit digital signals based on TMDS (Transition Minimized DIFFERENTIAL SIGNALING, transition minimum differential signal) technology. The TMDS encodes 8-bit data (each roadbed color signal in R, G, B) into 10-bit data (comprising row field synchronous information, clock information, data DE, error correction and the like) through minimum conversion by using an advanced encoding algorithm, and the data is transmitted by adopting differential signals after DC balance, so that the TMDS has better electromagnetic compatibility compared with LVDS and TTL.
The current DVI interface cable is suitable for transmitting high-speed video and display EDID information in a short distance, but with the increase of the cable length, the problems of environment interference, data loss, signal attenuation, picture distortion and the like are caused to signals when the cable is transmitted in a long distance, and the long distance is generally more than 100 meters.
Accordingly, the prior art is in need of improvement.
Disclosure of Invention
The invention mainly aims to provide a transmission system for transmitting DVI signals remotely through optical fibers, which aims to solve the technical problems in the background art and realize remote transmission through optical fiber wires.
The invention relates to a transmission system for optical fiber remote transmission DVI signals, which comprises a first DVI interface, a first ESD module, a first photoelectric signal conversion chip, an optical fiber wire, a second photoelectric signal conversion chip, a second ESD module and a second DVI interface, wherein the first DVI interface is connected with the first photoelectric signal conversion chip through the first ESD module, the first photoelectric signal conversion chip is connected with the second photoelectric signal conversion chip through the optical fiber wire, and the second photoelectric signal conversion chip is connected with the second DVI interface through the second ESD module.
Preferably, the first ESD module includes a first ESD chip and a second ESD chip, a tenth pin of the first ESD chip is connected to a second pin of the first photoelectric signal conversion chip through a third capacitor, a ninth pin of the first ESD chip is connected to a third pin of the first photoelectric signal conversion chip through a fourth capacitor, a seventh pin of the first ESD chip is connected to a fourth pin of the first photoelectric signal conversion chip through a fifth capacitor, a sixth pin of the first ESD chip is connected to a fifth pin of the first photoelectric signal conversion chip through a sixth capacitor, a tenth pin of the second ESD chip is connected to a sixth pin of the first photoelectric signal conversion chip through a seventh capacitor, a ninth pin of the second ESD chip is connected to a seventh pin of the first photoelectric signal conversion chip through a eighth capacitor, a seventh pin of the second ESD chip is connected to a eighth pin of the first photoelectric signal conversion chip through a tenth capacitor, and a sixth pin of the second ESD chip is connected to a ninth pin of the first photoelectric signal conversion chip through a tenth capacitor.
Preferably, the second ESD module includes a third ESD chip and a fourth ESD chip, a tenth pin on the third ESD chip is connected to the second pin of the second photoelectric signal conversion chip through a thirty-ninth capacitor, a ninth pin on the third ESD chip is connected to the third pin of the second photoelectric signal conversion chip through a forty-fifth capacitor, a seventh pin on the third ESD chip is connected to the sixth pin of the second photoelectric signal conversion chip through a forty-first capacitor, a sixth pin on the third ESD chip is connected to the seventh pin of the second photoelectric signal conversion chip through a forty-second capacitor, a tenth pin on the fourth ESD chip is connected to the eighth pin of the second photoelectric signal conversion chip through a forty-third capacitor, a ninth pin on the fourth ESD chip is connected to the ninth pin of the second photoelectric signal conversion chip through a forty-fifth capacitor, a seventh pin of the fourth ESD chip is connected to the tenth pin of the second photoelectric signal conversion chip through a forty-sixth capacitor, and a sixth pin of the fourth ESD chip is connected to the eleventh pin of the second photoelectric signal conversion chip through a forty-sixth capacitor.
Preferably, the first I2C module is further connected to the first photoelectric signal conversion chip.
Preferably, the device further comprises a first tail fiber, a first MPO adapter, a second MPO adapter and a second tail fiber, wherein the first DVI interface is connected with one end of the first MPO adapter through the first tail fiber, the second DVI interface is connected with one end of the second MPO adapter through the second tail fiber, and the other end of the first MPO adapter is connected with the other end of the second MPO adapter through an optical fiber line.
Preferably, the first photoelectric signal conversion chip is connected with the first direct current circuit.
Preferably, the photoelectric conversion device further comprises a second direct current circuit connected with the second photoelectric signal conversion chip.
Preferably, the second I2C module is connected with the second electric signal conversion chip.
The transmission system for the DVI signal through the optical fiber realizes the remote transmission of TMDS signals, EDID signals and HPD signals through the DVI signal, and has the advantages of no attenuation, no interference, no loss, low power consumption, high reliability and maximum transmission distance of 200 meters in the transmission process.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings may be obtained according to the drawings without inventive effort to those skilled in the art.
FIG. 1 is a schematic block diagram of a transmission system for transmitting DVI signals over long distances over optical fibers;
FIG. 2 is a schematic diagram of the physical structure of a transmission system for transmitting DVI signals over long distances with optical fibers;
Fig. 3 is a schematic circuit connection diagram of a first optical-electrical signal conversion chip, a first ESD module, and a first I2C module in a transmission system for transmitting DVI signals over a long distance by using an optical fiber;
fig. 4 is a schematic circuit connection diagram of a second optical-electrical signal conversion chip, a second ESD module, and a second I2C module in a transmission system for transmitting DVI signals over a long distance by using an optical fiber.
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
It is noted that related terms such as "first," "second," and the like may be used to describe various components, but these terms are not limiting of the components. These terms are only used to distinguish one element from another element. For example, a first component could be termed a second component, and, similarly, a second component could be termed a first component, without departing from the scope of the present invention. The term "and/or" refers to any one or more combinations of related items and descriptive items.
Fig. 1, fig. 2, fig. 3 and fig. 4 show a schematic block diagram of a transmission system for transmitting DVI signals remotely from an optical fiber, fig. 2 shows a physical structure schematic diagram of the transmission system for transmitting DVI signals remotely from an optical fiber, fig. 3 shows a circuit connection schematic diagram of a first photoelectric signal conversion chip, a first ESD module and a first I2C module in the transmission system for transmitting DVI signals remotely from an optical fiber, fig. 4 shows a circuit connection schematic diagram of a second photoelectric signal conversion chip, a second ESD module and a second I2C module in the transmission system for transmitting DVI signals remotely from an optical fiber, the transmission system for transmitting DVI signals remotely from an optical fiber according to the present invention includes a first DVI interface 10, a first ESD module, a first photoelectric signal conversion chip U2, an optical fiber 30, a second photoelectric signal conversion chip U30, a second ESD module and a second DVI interface 20, wherein the first DVI interface is connected to the first photoelectric signal conversion chip through the first ESD module and the second photoelectric signal conversion chip and the second ESD module are connected to the second interface module through the second ESD module. The transmission system for transmitting DVI signals remotely by the optical fiber realizes the transmission of TMDS signals, EDID signals and HPD signals remotely by the DVI signals, and has the advantages of no attenuation, no interference, no loss, low power consumption, high reliability and a transmission distance of 200 meters at most.
As shown in fig. 3, preferably, the first ESD module includes a first ESD chip U3 and a second ESD chip U15, the tenth pin OUTPUT1 of the first ESD chip is connected to the second pin DATA CHANNEL + of the first photoelectric signal conversion chip through the third capacitor C3, the ninth pin OUTPUT2 of the first ESD chip is connected to the third pin DATA CHANNEL-of the first photoelectric signal conversion chip through the fourth capacitor C4, the seventh pin OUTPUT3 of the first ESD chip is connected to the fourth pin DATA CHANNEL + of the first photoelectric signal conversion chip through the fifth capacitor C5, the sixth pin OUTPUT4 of the first ESD chip is connected to the fifth pin DATA CHANNEL-of the first photoelectric signal conversion chip through the sixth capacitor C6, the tenth pin OUTPUT1 of the second ESD chip is connected to the sixth pin DATA CHANNEL + of the first photoelectric signal conversion chip through the seventh capacitor C7, the ninth pin OUTPUT2 of the second ESD chip is connected to the fourth pin DATA CHANNEL + of the first photoelectric signal conversion chip through the eighth capacitor C8, the sixth pin OUTP4 of the first ESD chip is connected to the eighth pin 3724+ of the first photoelectric signal conversion chip through the eighth capacitor C6, and the tenth pin OUTPut4 of the second ESD chip is connected to the eighth pin of the eighth chip through the eighth capacitor C9. The preferred embodiment specifically defines a circuit for the first ESD module, transmits DVI signals received from the first DVI interface to the first photoelectric signal conversion chip, and plays a role in protecting data. The first ESD chip U3 and the second ESD chip U15 are RClamp and 0524P, and the first photoelectric signal conversion chip is TX06.
As shown in fig. 4, preferably, the second ESD module includes a third ESD chip U9 and a fourth ESD chip U16, the tenth pin OUTPUT1 on the third ESD chip is connected to the second pin DATA CHANNEL + of the second photoelectric signal conversion chip U30 through a thirty-ninth capacitor C39, the ninth pin OUTPUT2 on the third ESD chip is connected to the third pin DATA CHANNEL + of the second photoelectric signal conversion chip through a fortieth capacitor C40, the seventh pin OUTPUT3 on the third ESD chip is connected to the sixth pin DATA CHANNEL1+ of the second photoelectric signal conversion chip through a fortieth first capacitor C41, the sixth pin OUTPUT4 on the third ESD chip is connected to the seventh pin DATA CHANNEL + of the second photoelectric signal conversion chip through a fortieth capacitor C42, the ninth pin OUTPUT2 on the fourth ESD chip is connected to the eighth pin DATA CHANNEL + of the second photoelectric signal conversion chip through a fortieth capacitor C40, the seventh pin OUTPUT3 on the fourth ESD chip is connected to the fortieth pin of the fourth ESD chip through a fortieth capacitor C4 through a fortieth capacitor C42, and the fortieth pin OUTPUT4 on the fourth ESD chip is connected to the fortieth pin DATA CHANNEL + of the fourth ESD chip through a fortieth capacitor C4 through a fortieth capacitor C. The preferred embodiment specifically limits a circuit of the first ESD module, the second photoelectric signal conversion chip converts an optical signal transmitted by an optical fiber line into a DVI signal and transmits the DVI signal to the third ESD chip and the fourth ESD chip for outputting to the second DVI interface, the third ESD chip and the fourth ESD chip play a role in protecting data, the model number of the third ESD chip U9 and the model number of the fourth ESD chip U16 are RClamp0524P, and the model number of the second photoelectric signal conversion chip is RX06.
As shown in FIG. 3, the device also preferably comprises a first I2C module connected with the first photoelectric signal conversion chip, wherein the first I2C module comprises a first I2C chip U1 with the model of P82B96, a first pin SCL2 of the first I2C chip U1 is connected with a tenth pin SCL of the first photoelectric signal conversion chip, a second pin SDA2 of the first I2C chip U1 is connected with an eleventh pin SDA of the first photoelectric signal conversion chip, and the device realizes an I2C data transmission function and supports a DDC communication function.
As shown in FIG. 4, the integrated circuit preferably further comprises a second I2C module connected with the second photoelectric signal conversion chip, wherein the second I2C module comprises a second I2C chip U7, a first pin SCL2 of the second I2C chip U7 is connected with a fourth pin SCL of the second photoelectric signal conversion chip, a second pin SDA2 of the second I2C chip U7 is connected with a fifth pin SDA of the second photoelectric signal conversion chip, and an I2C data transmission function is realized and a DDC communication function is supported.
As shown in fig. 2, the fiber optic cable further preferably includes a first pigtail 51, a first MPO adapter 52, a second MPO adapter 53, and a second pigtail 54, wherein the first DVI interface is connected to one end of the first MPO adapter through the first pigtail, the second DVI interface is connected to one end of the second MPO adapter through the second pigtail, and the other end of the first MPO adapter is connected to the other end of the second MPO adapter through the optical fiber cable 30. The preferred embodiment specifically defines the physical structure among the optical fiber line, the second photoelectric signal conversion chip and the first photoelectric signal conversion chip, so that the DVI signal is firstly converted into an optical signal and then converted into the DVI signal.
As shown in fig. 3, the first direct current circuit is preferably further connected with the first photoelectric signal conversion chip, the first direct current circuit comprises a third resistor R3, a fourth resistor R4, a fifth resistor R5, a sixth resistor R6, a seventh resistor R7, an eighth resistor R8, a ninth resistor R9 and a tenth resistor R10, the first direct current circuit is connected with a power supply end to provide stable voltage, and as shown in fig. 4, the second direct current circuit is preferably further connected with the second photoelectric signal conversion chip, the second direct current circuit comprises a second inductance coil L2, a third inductance coil L3, a fourth inductance coil L4, a fifth inductance coil L5, a sixth inductance coil L6, a seventh inductance coil L7, an eighth inductance coil L8 and a ninth inductance coil L9, and the second direct current circuit is connected with the power supply end to provide stable voltage for the second photoelectric signal conversion chip.
The above preferred embodiment is realized in such a manner that the sixteenth optical fiber line transmits an optical signal to the twenty-second photodiode D22 through the optical fiber line, the fourteenth pin avss1 of the first optical signal conversion chip is connected to the thirteenth pin VCSEL2 of the first optical signal conversion chip through the sixteenth vertical cavity surface emitting laser D16, the twelfth pin PD <2> of the second optical signal conversion chip is connected to the thirteenth pin FIT <2> of the second optical signal conversion chip through the twenty-second photodiode D22, the sixteenth pin avss 16 of the first optical signal conversion chip is connected to the twenty-fifth pin VCSEL1 of the first optical signal conversion chip through the seventeenth vertical cavity surface emitting laser D17, the thirteenth pin PD <1> of the second optical signal conversion chip is connected to the fifteenth pin FIT <1> of the second optical signal conversion chip through the twenty-third photodiode D22, the sixteenth pin avss3 of the first optical signal conversion chip is connected to the twenty-eighth pin VCSEL 25 through the twenty-eighth optical fiber line, the fourteenth pin avss2 of the first optical signal conversion chip is connected to the twenty-fifth pin VCSEL1 of the first optical signal conversion chip through the seventeenth vertical cavity surface emitting laser D17, the twenty-eighth pin PD 2 of the twenty-eighth optical signal conversion chip is connected to the twenty-eighth pin 10 through the twenty-eighth optical fiber line, the twenty-eighth pin 10 is connected to the twenty-eighth pin 10 through the twenty-eighth pin photodiode D18, and the twenty-eighth pin 10 is connected to the twenty-eighth pin 10 through the twenty-eighth pin photodiode 2 of the twenty-eighth optical signal conversion chip through the seventeenth optical fiber line The pin avss5 is connected to the twenty-first pin VCSEL < SCL/SDA > of the first photoelectric signal conversion chip through the twenty-first photodiode D20, the twenty-first pin pd_scl/SDA of the second photoelectric signal conversion chip is connected to the twenty-first pin av33 of the second photoelectric signal conversion chip through the twenty-sixth photodiode D26, the twenty-second pin avss6 of the first photoelectric signal conversion chip is connected to the twenty-third pin PD < SCL/SDA/HPD > of the first photoelectric signal conversion chip through the twenty-first photodiode D21, and the twenty-second pin vcsel_scl/SDA/HPD of the second photoelectric signal conversion chip is connected to the twenty-third pin avss of the second photoelectric signal conversion chip through the twenty-seventh vertical cavity surface emitting laser D27. The above preferred embodiment realizes optical signal transmission between the first photoelectric signal conversion chip and the second photoelectric signal conversion chip through 6 optical fiber lines.
The foregoing description is only of the preferred embodiments of the present invention, and is not intended to limit the scope of the invention, but rather is intended to cover any equivalents of the structures or equivalent processes disclosed herein or in the alternative, which may be employed directly or indirectly in other related arts.
Claims (6)
1. The transmission system for optical fiber remote transmission of DVI signals is characterized by comprising a first DVI interface, a first ESD module, a first photoelectric signal conversion chip, an optical fiber wire, a second photoelectric signal conversion chip, a second ESD module and a second DVI interface, wherein the first DVI interface is connected with the first photoelectric signal conversion chip through the first ESD module, the first photoelectric signal conversion chip is connected with the second photoelectric signal conversion chip through the optical fiber wire, the second photoelectric signal conversion chip is connected with the second DVI interface through the second ESD module,
The first ESD module comprises a first ESD chip and a second ESD chip, the tenth pin of the first ESD chip is connected with the second pin of the first photoelectric signal conversion chip through a third capacitor, the ninth pin of the first ESD chip is connected with the third pin of the first photoelectric signal conversion chip through a fourth capacitor, the seventh pin of the first ESD chip is connected with the fourth pin of the first photoelectric signal conversion chip through a fifth capacitor, the sixth pin of the first ESD chip is connected with the fifth pin of the first photoelectric signal conversion chip through a sixth capacitor, the tenth pin of the second ESD chip is connected with the sixth pin of the first photoelectric signal conversion chip through a seventh capacitor, the ninth pin of the second ESD chip is connected with the seventh pin of the first photoelectric signal conversion chip through an eighth capacitor, the seventh pin of the second ESD chip is connected with the eighth pin of the first photoelectric signal conversion chip through a tenth capacitor,
The second ESD module comprises a third ESD chip and a fourth ESD chip, wherein a tenth pin on the third ESD chip is connected with a second pin of the second photoelectric signal conversion chip through a thirty-ninth capacitor, a ninth pin on the third ESD chip is connected with a third pin of the second photoelectric signal conversion chip through a forty-fifth capacitor, a seventh pin on the third ESD chip is connected with a sixth pin of the second photoelectric signal conversion chip through a forty-first capacitor, a sixth pin on the third ESD chip is connected with a seventh pin of the second photoelectric signal conversion chip through a forty-second capacitor, a tenth pin of the fourth ESD chip is connected with an eighth pin of the second photoelectric signal conversion chip through a forty-third capacitor, a ninth pin of the fourth ESD chip is connected with a ninth pin of the second photoelectric signal conversion chip through a forty-fifth capacitor, a seventh pin of the fourth ESD chip is connected with a tenth pin of the second photoelectric signal conversion chip through a forty-sixth capacitor, and a sixth pin of the fourth ESD chip is connected with an eleventh pin of the second photoelectric signal conversion chip through a forty-sixth capacitor.
2. The optical fiber remote DVI signal transmission system of claim 1, further comprising a first I2C module coupled to the first optical to electrical signal conversion chip.
3. The transmission system for the remote transmission of DVI signals over optical fibers of claim 1 further comprising a first pigtail, a first MPO adapter, a second MPO adapter, and a second pigtail, the first DVI interface being adapted to the first MPO via the first pigtail
One end of the device is connected, the second DVI interface is connected with one end of the second MPO adapter through a second tail fiber, and the other end of the first MPO adapter is connected with the other end of the second MPO adapter through an optical fiber line.
4. A transmission system for optical fiber remote transmission of DVI signals according to claim 1 further comprising a first dc circuit connected to the first optical to electrical signal conversion chip.
5. A transmission system for optical fiber remote transmission of DVI signals according to claim 1 further comprising a second dc circuit connected to the second optical to electrical signal conversion chip.
6. The transmission system for optical fiber remote transmission of DVI signals of claim 1 further comprising a second I2C module coupled to the second electrical signal conversion chip.
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| CN201911326307.XA CN111182277B (en) | 2019-12-20 | 2019-12-20 | Transmission system for DVI signals over long distances using optical fiber |
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| CN201911326307.XA CN111182277B (en) | 2019-12-20 | 2019-12-20 | Transmission system for DVI signals over long distances using optical fiber |
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| CN111182277A CN111182277A (en) | 2020-05-19 |
| CN111182277B true CN111182277B (en) | 2025-01-07 |
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| CN111866405A (en) * | 2020-07-08 | 2020-10-30 | 华东计算技术研究所（中国电子科技集团公司第三十二研究所） | Video matrix equipment based on optical fiber transmission |
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| CN210670386U (en) * | 2019-12-20 | 2020-06-02 | 深圳市巨潮科技股份有限公司 | Transmission system for transmitting DVI signals in long distance by optical fiber |
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| KR200244696Y1 (en) * | 2001-05-26 | 2001-10-29 | (주)오피트정보통신 | Digital Vidio Signal Interface Module For Transmitting Long Distance |
| CN203301663U (en) * | 2013-05-31 | 2013-11-20 | 深圳市载德光电技术开发有限公司 | DVI signal multimode single-optical-fiber transmitter |
| CN106449636B (en) * | 2016-10-12 | 2019-12-10 | 矽力杰半导体技术(杭州)有限公司 | ESD protection device and method of manufacturing the same |
| CN106657941B (en) * | 2016-12-28 | 2023-06-02 | 深圳市巨潮科技股份有限公司 | Photoelectric hybrid DisplayPort remote transmission device and method |
| CN109391781A (en) * | 2018-11-12 | 2019-02-26 | 中国兵器装备集团上海电控研究所 | CAN instruction switching multichannel multi-format photoelectric video signal output system and method |
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| CN210670386U (en) * | 2019-12-20 | 2020-06-02 | 深圳市巨潮科技股份有限公司 | Transmission system for transmitting DVI signals in long distance by optical fiber |
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