CN111158443B - A heat-dissipating server - Google Patents
A heat-dissipating server Download PDFInfo
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- CN111158443B CN111158443B CN201911386478.1A CN201911386478A CN111158443B CN 111158443 B CN111158443 B CN 111158443B CN 201911386478 A CN201911386478 A CN 201911386478A CN 111158443 B CN111158443 B CN 111158443B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本发明公开了一种可散热服务器，包括主机箱、设置于主机箱的散热风扇和若干个待散热部件，还包括用于检测待散热部件的温度传感器、用于为待散热部件散热的散热装置以及用于控制散热装置移动的控制装置，温度传感器与控制装置连接；当待散热部件的温度大于或等于预设值时，控制装置控制散热装置贴合待散热部件，以实现待散热部件对进行降温；当待散热部件的温度低于预设值时，控制装置控制散热装置缩回，以避让散热风扇的气流。本发明提供的可散热服务器中包括进行整体散热的散热风扇以及针对待散热部件进行单个散热的散热装置，二者配合能够实现主机箱内的准确的散热从而保持主机箱内的装置的运行稳定。
The invention discloses a heat-dissipating server, comprising a main box, a cooling fan arranged in the main box, a plurality of components to be radiated, a temperature sensor for detecting the components to be radiated, and a cooling device for radiating heat for the components to be radiated and a control device for controlling the movement of the heat dissipation device, the temperature sensor is connected to the control device; when the temperature of the part to be dissipated is greater than or equal to a preset value, the control device controls the heat dissipation device to fit the part to be dissipated, so as to realize the pairing of the parts to be dissipated. Cooling; when the temperature of the component to be radiated is lower than the preset value, the control device controls the cooling device to retract to avoid the airflow of the cooling fan. The heat-dissipating server provided by the present invention includes a heat-dissipating fan for overall heat dissipation and a heat-dissipating device for individual heat-dissipation for the components to be cooled.
Description
Technical Field
The invention relates to the technical field of server design, in particular to a server capable of dissipating heat.
Background
The high temperature of the server can cause unstable operation of the system, shorten the service life and even possibly burn some components. And the heat dissipation of the air conditioner greatly increases the power consumption, and the energy consumption of some server racks in the power consumption data center of each machine room can reach millions or millions of kilowatts of each machine cabinet every year. With the development of cloud computing big data, the number of cores of a CPU is continuously increased, the air conditioner of a machine room is increased, the power cost is increased day by day, and the heat dissipation of a server is particularly important.
The existing server heat dissipation mode mainly adopts a fan structure arranged on a server, but the heat dissipation mode of the type has low flexibility and cannot realize accurate heat dissipation of overheated parts.
In summary, how to provide a server capable of accurately achieving heat dissipation is an urgent problem to be solved by those skilled in the art.
Disclosure of Invention
In view of the above, an object of the present invention is to provide a heat-dissipatable server, which is used to implement accurate heat dissipation operation on internal devices and avoid uneven local heat dissipation.
In order to achieve the above purpose, the invention provides the following technical scheme:
a server capable of dissipating heat comprises a mainframe box, a heat dissipation fan arranged on the mainframe box, and a plurality of components to be dissipated, and is characterized by further comprising a temperature sensor for detecting the components to be dissipated, a heat dissipation device for dissipating heat of the components to be dissipated, and a control device for controlling the heat dissipation device to move, wherein the temperature sensor is connected with the control device;
when the temperature of the part to be cooled is greater than or equal to a preset value, the control device controls the cooling device to be attached to the part to be cooled so as to cool the part to be cooled; when the temperature of the part to be cooled is lower than the preset value, the control device controls the cooling device to retract so as to avoid the airflow of the cooling fan.
Preferably, at least two cooling fans are arranged on the main chassis, the parts to be cooled are distributed in the airflow direction of the corresponding cooling fans, and the cooling device is located between the airflows of the two cooling fans.
Preferably, the heat dissipation device is arranged on both sides of each heat dissipation fan;
the control device is used for controlling the heat dissipation devices on the two sides of the air flow corresponding to the part to be dissipated to extend out and be attached to the part to be dissipated so as to dissipate heat.
Preferably, the four groups of cooling fans are transversely and sequentially arranged on one side face of the mainframe box, the side face is divided into four equal areas, each group comprises two cooling fans which are longitudinally distributed, and the cooling device is arranged between the two groups of cooling devices.
Preferably, all the parts to be cooled are provided with corresponding temperature sensors, all the temperature sensors are connected to the control device, and the control device stores the spatial positions of the parts to be cooled corresponding to the temperature sensors.
Preferably, the heat dissipation device is a stretchable and elastic heat dissipation patch.
Preferably, the heat dissipation device is mounted on a side shell of the main cabinet, an elastic door capable of being automatically closed is arranged on the side shell, and the pushing force extending out of the heat dissipation device can be used for pushing the elastic door open.
Preferably, the heat dissipation device comprises a heat dissipation patch and a tape device, the heat dissipation patch is connected to an extending end of the tape device, and the control device is connected with the tape device to control the rotation of the tape device.
Preferably, the tape measure device is provided with a heat conducting member for conducting heat from the heat dissipating patch out of the main case.
Preferably, the heat dissipation patches are arranged on two sides of the extending end.
The server capable of radiating heat provided by the invention comprises a radiating fan for radiating heat integrally and a radiating device for radiating heat of a part to be radiated individually, the radiating fan and the radiating device are matched to realize accurate heat radiation in the mainframe box, and the radiating device is a movable device, so that when the server is not used, the space in the mainframe box is not occupied, the radiating work of the radiating fan is prevented from being influenced, and the operation stability of the device in the mainframe box is kept.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic diagram of a heat-dissipatable server according to an embodiment of the present invention;
fig. 2 is a front view of a side surface of a heat-dissipatable server provided with fans.
In FIGS. 1-2:
1 is a main case, 2 is a cooling fan, 3 is a part to be cooled, 4 is a temperature sensor, 5 is a cooling device, 51 is a tape measure device, and 52 is a cooling patch.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The core of the invention is to provide a heat-radiating server which is used for realizing accurate heat-radiating operation of an internal device and avoiding the condition of uneven local heat radiation.
The server capable of dissipating heat comprises a mainframe box 1, a heat dissipation fan 2 arranged on the mainframe box 1, and a plurality of parts to be dissipated 3, and is characterized by further comprising a temperature sensor 4 for detecting the parts to be dissipated 3, a heat dissipation device 5 for dissipating heat of the parts to be dissipated 3, and a control device for controlling the heat dissipation device 5 to move, wherein the temperature sensor 4 is connected with the control device;
when the temperature of the part 3 to be cooled is greater than or equal to a preset value, the control device controls the cooling device 5 to be attached to the part 3 to be cooled so as to cool the part 3 to be cooled; when the temperature of the part 3 to be cooled is lower than the preset value, the control device controls the cooling device 5 to retract so as to avoid the airflow of the cooling fan 2.
It should be noted that, a heat dissipation fan 2 is arranged on the main chassis 1, and at least two components 3 to be cooled are arranged in the main chassis 1, and the heat dissipation fan 2 is used for realizing the overall heat dissipation and cooling in the main chassis 1.
The cooling device 5 can be various types of cooling devices, and is a common cooling fin, has a temperature conduction function, and can be directly attached to a device to be cooled for conducting and cooling. The heat sink 5 is disposed on the inner wall of the main chassis 1, or in an interlayer of the inner wall. The heat dissipation device 5 has a telescopic function, can extend out and be close to the joint on the structure to be cooled when in use, can retract when in use, and occupies a small space. The radiating fins can be arranged on the telescopic rods or other telescopic devices and have the function of controlling movement.
Treat at each and treat that all be provided with corresponding temperature sensor 4 on heat dissipation part 3, a treat heat dissipation part 3 for measuring the correspondence, temperature sensor 4 connection controlling means, controlling means connects heat abstractor 5, a temperature signal for receiving temperature sensor 4 and sending after, judge whether exceed predetermined normal temperature scope, if exceed normal temperature scope, then send signal to heat abstractor 5 that corresponds, or the work of heat abstractor 5 that direct control corresponds, heat abstractor 5 receives control and removes to treating heat dissipation part 3, so that the laminating is treating on heat dissipation part 3, the realization is treated the heat dissipation operation of heat dissipation part 3. The heat dissipation device 5 can solve the problem that the overall heat dissipation and cooling of the heat dissipation fan 2 cannot achieve accurate cooling, and overall and local control of the temperature in the mainframe box 1 is achieved.
The application can dispel the heat the server including carrying out whole radiating radiator fan 2 and carrying out single radiating heat abstractor 5 to treating heat dissipation part 3, the accurate heat dissipation in mainframe box 1 can be realized in the cooperation of the two, and heat abstractor 5 is mobile device, when not using, can not occupy the space in mainframe box 1, avoids influencing radiator fan 2's heat dissipation work to keep the operation of the device in mainframe box 1 stable.
In the above embodiment, the heat dissipation device 5 needs to be arranged so as not to affect the operation of the heat dissipation fan 2, and generally, the functional components in the main chassis 1 need to be arranged according to a certain rule, so that the wind energy of the heat dissipation fan 2 can flow smoothly.
On the basis of the above embodiment, at least two heat dissipation fans 2 are disposed on the main chassis 1, the parts 3 to be heat dissipated are distributed in the airflow direction of the corresponding heat dissipation fans 2, and the heat dissipation device 5 is located between the airflows of the two heat dissipation fans 2.
The parts 3 to be cooled are sequentially arranged along the airflow direction of the cooling fans 2, referring to fig. 1, the parts 3 to be cooled are directly opposite to the cooling fan 2 on the leftmost side, the other parts 3 to be cooled are respectively required to be directly opposite to the corresponding cooling fans 2, and one cooling fan 2 corresponds to a group of parts 3 to be cooled. In the horizontal direction, radiator fan 2 arranges in proper order to form a plurality of air current flow directions, heat abstractor 5 sets up between two air currents, is located two sets of between the parts 3 that wait to dispel the heat promptly, makes things convenient for the removal of heat dissipation part 3.
On the basis of the above embodiment, both sides of each cooling fan 2 are provided with the cooling devices 5; the control device is used for controlling the heat dissipation devices 5 on two sides of the air flow corresponding to the part 3 to be dissipated to extend out and be attached to the part 3 to be dissipated so as to dissipate heat.
Specifically, in this embodiment, the heat dissipation devices 5 are disposed on two sides of each heat dissipation fan 2, and the arrangement positions of the heat dissipation devices 5 are increased, so that the heat dissipation devices 5 can be more conveniently contacted with the parts to be dissipated.
The control device simultaneously controls the two heat dissipation devices which are closest to the part to be cooled 3 to be cooled to work simultaneously, so that the part to be cooled 3 is cooled efficiently.
On the basis of the above embodiment, referring to fig. 2, four sets of heat dissipation fans 2 are transversely and sequentially disposed on one side surface of the main chassis 1, and the side surface is divided into four equal areas, each set includes two heat dissipation fans 2 distributed longitudinally, and the heat dissipation device 5 is disposed between two sets of heat dissipation devices 5.
In the present embodiment, a manner of arranging the heat dissipation fans 2 and the heat dissipation devices 5 is provided, which facilitates uniform cooling of the structure inside the main cabinet 1 in a horizontal and vertical manner, and the specific number and arrangement form are not limited to the above.
Alternatively, the temperature sensors 4 may be provided in a concentrated manner for the members 3 to be heat-dissipated in one area, or the temperature sensors 4 may be provided for each of the members 3 to be heat-dissipated.
On the basis of any one of the above embodiments, all the parts 3 to be heat-dissipated are provided with corresponding temperature sensors 4, all the temperature sensors 4 are connected to the control device, and the control device stores the spatial positions of the parts 3 to be heat-dissipated, which correspond to the temperature sensors 4.
The heat dissipation device provided in the present application is various, and in one embodiment, the heat dissipation device 5 is a retractable and elastic heat dissipation patch 52.
The heat dissipation patch 52 has elastic expansion and contraction capability, and is driven by the driving device to extend and protrude to fit the member to be heat dissipated 3 or to contract to separate from the member to be heat dissipated 3. Specifically, the driving device may be a telescopic rod or the like.
Alternatively, the heat sink patches 52 may be a means for facilitating heat transfer to dissipate heat from the structure with which they are in contact. Specifically, the heat dissipation film may be a heat dissipation film, such as a PVC heat dissipation film, a heat conductive silicone pad, or a heat dissipation film made of other materials.
On the basis of any of the above embodiments, the heat sink 5 is installed on the side casing of the main cabinet 1, and the side casing is provided with an elastic door capable of being automatically closed, and the pushing force of the heat sink 5 extending out can be used to push the elastic door open.
The lateral part casing of mainframe box 1 has the intermediate layer, and the space in the intermediate layer can be used for holding heat abstractor 5, sets up elastic door on the lateral part casing, and elastic device connects on door and the lateral part casing of mainframe box 1 to with its self-closing, heat abstractor 5 sets up in the intermediate layer, can directly promote the elastic door in order to open when receiving the signal and need stretch out the work, realizes shifting out.
On the basis of the above embodiment, the heat sink 5 includes the heat dissipation patch 52 and the tape measure device 51, the heat dissipation patch 52 is connected to the extending end of the tape measure device 51, and the control device is connected to the tape measure device 51 to control the rotation of the tape measure device 51.
Specifically, the rotating shaft of the tape measure device 51 is connected with the output shaft of the control device, the rotation of the output shaft of the control device is used for driving the tape measure device 51 to rotate, the free end of the tape measure device 51 is driven to move outwards, and the heat dissipation patches 52 are arranged on the free end and can be attached to different devices after extending to different positions, so that the temperature can be reduced.
The heat sink 5 is implemented by selecting the structure of the tape measure device 51 so as to extend different distances when in use and retract to be stored when not in use.
Optionally, the heat dissipation patch 52 may also be a heat dissipation fin, which is attached to the component 3 to be heat dissipated, and is used to increase the surface area of the component 3 to be heat dissipated, so as to facilitate the cooling operation of the component 3 to be heat dissipated.
Optionally, the tape measure device 51 is provided with a heat conducting member for conducting heat from the heat sink patches 52 out of the main housing 1.
Optionally, heat dissipation patches 52 are disposed on both sides of the protruding end. If the extending end is of a structure with a certain thickness, a third heat dissipation patch can be arranged on the front side of the extending end.
In a specific embodiment provided by the present application, heat dissipation devices 5 made of a special material are disposed at corresponding positions on both sides of each fan mounted on the main chassis 1, if there are 4 fans, 5 heat dissipation devices 5 need to be attached, and each heat dissipation device 5 is responsible for heat dissipation of all components in the corresponding channel. It should be noted that, the control device of the present application needs to store the positions of all the components to be heat-dissipated 3, so that when a certain component to be heat-dissipated 3 needs to be cooled, the heat dissipation device 5 can be controlled to extend out by an accurate distance, so as to be attached to the component to be heat-dissipated 3.
The control device is connected with a temperature sensor 4, and the temperature sensor 4 is arranged on the part 3 to be cooled and used for sensing temperature so as to send a signal to the control device. When the over-temperature of a certain part 3 to be cooled of the corresponding channel is sensed, the control device controls the cooling device 5 to extend and form a cooling patch to cool the overheated part 3 to be cooled; when the temperature of the temperature sensor 4 is reduced to a normal value, the control device controls the heat dissipation device 5 to automatically return to the original position, so that the wind of the fan is not blocked.
On the other hand, after shutdown or when the server component is not at an excessive temperature, the heat sink 5 is in a contracted state.
In addition to the main structure and connection relationship of the heat-dissipatable server provided in the above embodiments, please refer to the prior art for the structure of other parts of the heat-dissipatable server, which is not described herein again.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The heat-dissipatable server provided by the present invention is described in detail above. The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911386478.1A CN111158443B (en) | 2019-12-29 | 2019-12-29 | A heat-dissipating server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911386478.1A CN111158443B (en) | 2019-12-29 | 2019-12-29 | A heat-dissipating server |
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| CN111158443A CN111158443A (en) | 2020-05-15 |
| CN111158443B true CN111158443B (en) | 2021-06-29 |
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| CN201911386478.1A Active CN111158443B (en) | 2019-12-29 | 2019-12-29 | A heat-dissipating server |
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Families Citing this family (1)
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| CN118151729B (en) * | 2024-05-13 | 2024-07-30 | 北京亿安天下科技股份有限公司 | Heat-dissipation artificial intelligence power calculation server and heat dissipation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI437951B (en) * | 2009-09-08 | 2014-05-11 | Sunonwealth Electr Mach Ind Co | Heat dispensing module |
| TWI410211B (en) * | 2011-04-07 | 2013-09-21 | Hon Hai Prec Ind Co Ltd | Data center and heat dissipating system of the same |
| CN205721554U (en) * | 2016-04-01 | 2016-11-23 | 雷鸣 | A kind of main frame self-checking device |
| CN107683077A (en) * | 2017-11-24 | 2018-02-09 | 石明忠 | A kind of Wireless Telecom Equipment rack |
| CN108289402B (en) * | 2018-01-30 | 2019-09-03 | 重庆市长寿区臻波通讯设备有限公司 | The radiator structure of communication terminal |
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