CN111152345A - 一种加快超厚砖辊道窑烧成工艺 - Google Patents
一种加快超厚砖辊道窑烧成工艺 Download PDFInfo
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Abstract
本发明公开了一种加快超厚砖辊道窑烧成工艺,包括以下步骤,步骤一,砖坯干燥;步骤二,砖坯施釉;步骤三,砖坯印花;步骤四,强化干燥;步骤五,砖坯烧成;步骤六,砖坯急冷;步骤七,砖坯缓冷;步骤七,砖坯尾冷;将含水率在5‑6%的砖坯通过三层辊道干燥器后变成含水率在0.8%以下的干燥坯,且第一层辊道干燥器干燥温度为80‑100℃,第二层辊道干燥器干燥温度为90‑200℃,第三层辊道干燥器干燥温度为190‑300℃;该发明,通过对砖坯的多次干燥处理,有利于对超厚砖内部的水分进行蒸发,从而便于对超厚砖进行施釉处理,且当对砖坯进行高温烧制的过程中,利用对施釉后的砖坯进行强化干燥进行预加热,有利于加快氧化分解反应,从而缩短了对超厚砖的烧制时间。
Description
技术领域
本发明涉及超厚砖烧成技术领域,具体为一种加快超厚砖辊道窑烧成工艺。
背景技术
辊道窑又称辊底窑。主要用于瓷砖等陶瓷建材的生产。辊道窑是连续烧成的窑,以转动的辊子作为坯体运载工具的隧道窑。陶瓷产品放置在许多条间隔很密的水平耐火辊上,靠辊子的转动使陶瓷从窑头传送到窑尾,故而称为辊道窑,其中在使用辊道窑对超厚砖进行烧制的过程中,由于超厚砖的厚度宽,不利于对其干燥,从而延长了对砖坯进行施釉的时间,且在使用辊道窑对超厚砖进行烧制的过程中浪费了烧制时间,且烧制完成后,对高温的砖坯进行降温的过程中,由于砖坯处于高温状态,在对砖坯进行急剧降温的过程中易导致砖坯的破裂,降低了对超厚砖的生产质量。
发明内容
本发明的目的在于提供一种加快超厚砖辊道窑烧成工艺,以解决上述背景技术中提出的问题。
为了解决上述技术问题,本发明提供如下技术方案:一种加快超厚砖辊道窑烧成工艺,包括以下步骤,步骤一,砖坯干燥;步骤二,砖坯施釉;步骤三,砖坯印花;步骤四,强化干燥;步骤五,砖坯烧成;步骤六,砖坯急冷;步骤七,砖坯缓冷;步骤七,砖坯尾冷;
其中在上述步骤一中,将含水率在5-6%的砖坯通过三层辊道干燥器后变成含水率在0.8%以下的干燥坯;
其中在上述步骤二中,利用辊道将干燥后的砖坯输运至直线淋釉器的下部,通过直线淋釉器对干燥后的砖坯表面进行上釉处理;
其中在上述步骤三中,将步骤二中上釉处理后的砖坯利用辊道运输与砖坯进行印花处理;
其中在上述步骤四中,将步骤三中的印花通过辊道输运至干燥窑中对砖坯进行强化干燥;
其中在上述步骤五中,将步骤四中的干燥后的砖坯在进入窑炉前先上底浆随后通过辊道输运至辊道窑的内部进行烧成,烧制温度为1180-1220℃;
其中在上述步骤六中,将步骤五中烧成而成的砖坯通过辊道输运至急冷区使砖坯温度下降到600-650℃;
其中在上述步骤七中,将步骤六中急冷后的砖坯通过辊道输运至缓冷区使砖坯温度下降到450-610℃;
其中在上述步骤八中,将步骤七中缓冷后的砖坯通过辊道输运至冷风区通过冷风对砖坯进行降温,使砖坯温度下降至出厂温度。
根据上述技术方案,所述步骤一中第一层辊道干燥器干燥温度为80-100℃,第二层辊道干燥器干燥温度为90-200℃,第三层辊道干燥器干燥温度为190-300℃;
根据上述技术方案,所述步骤三中的印花处理为丝网印花、胶辊印花和喷墨印花中的其中一种。
根据上述技术方案,所述步骤四中的干燥温度为280-320℃。
根据上述技术方案,所述步骤五中的底浆为氧化铝和氧化镁加入一定比例的水在球磨机内部研磨而成,研磨时间为2-4h。
根据上述技术方案,所述步骤五中辊道窑的长度为160m,且辊道窑为S型窑炉。
根据上述技术方案,所述步骤六中的降温速率为90℃/min。
根据上述技术方案,所述步骤七中的降温速率为25℃/min。
与现有技术相比,本发明所达到的有益效果是:该加快超厚砖辊道窑烧成工艺,通过对砖坯进行多次干燥处理,有利于对砖坯内部的水分进行充分蒸发,避免了砖坯内部残留有水分不利于进行施釉;同时对施釉后的砖坯进行强化干燥进行预加热,有利于加快氧化分解反应,从而缩短了对超厚砖的烧制时间,进而加快了对超厚砖的烧制时间;且利用对烧制后的砖坯进行多次降温处理,避免了对砖坯进行急剧降温的过程中导致砖坯的破裂,从而提高了对超厚砖的生产质量。
附图说明
附图用来提供对本发明的进一步理解,并且构成说明书的一部分,与本发明的实施例一起用于解释本发明,并不构成对本发明的限制。在附图中:
图1是本发明的工艺流程图。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
请参阅图1,本发明提供一种技术方案:一种加快超厚砖辊道窑烧成工艺,包括以下步骤,步骤一,砖坯干燥;步骤二,砖坯施釉;步骤三,砖坯印花;步骤四,强化干燥;步骤五,砖坯烧成;步骤六,砖坯急冷;步骤七,砖坯缓冷;步骤七,砖坯尾冷;
其中在上述步骤一中,将含水率在5-6%的砖坯通过三层辊道干燥器后变成含水率在0.8%以下的干燥坯,且第一层辊道干燥器干燥温度为80-100℃,第二层辊道干燥器干燥温度为90-200℃,第三层辊道干燥器干燥温度为190-300℃;
其中在上述步骤二中,利用辊道将干燥后的砖坯输运至直线淋釉器的下部,通过直线淋釉器对干燥后的砖坯表面进行上釉处理;
其中在上述步骤三中,将步骤二中上釉处理后的砖坯利用辊道运输与砖坯进行印花处理,且印花处理为丝网印花、胶辊印花和喷墨印花中的其中一种;
其中在上述步骤四中,将步骤三中的印花通过辊道输运至干燥窑中对砖坯进行强化干燥,且干燥温度为280-320℃;
其中在上述步骤五中,将步骤四中的干燥后的砖坯在进入窑炉前先上底浆随后通过辊道输运至辊道窑的内部进行烧成,且底浆为氧化铝和氧化镁加入一定比例的水在球磨机内部研磨而成,研磨时间为2-4h,且烧制温度为1180-1220℃,同时辊道窑的长度为160m,且辊道窑为S型窑炉;
其中在上述步骤六中,将步骤五中烧成而成的砖坯通过辊道输运至急冷区使砖坯温度下降到600-650℃,且降温速率为90℃/min;
其中在上述步骤七中,将步骤六中急冷后的砖坯通过辊道输运至缓冷区使砖坯温度下降到450-610℃,且降温速率为25℃/min;
其中在上述步骤八中,将步骤七中缓冷后的砖坯通过辊道输运至冷风区通过冷风对砖坯进行降温,使砖坯温度下降至出厂温度。
基于上述,本发明,首先将砖坯进行干燥处理,利用对砖坯的多次干燥,有利于对超厚砖坯内部的水分充分蒸发,避免了砖坯内部残留有水分不利于进行施釉,随后将干燥后的砖坯通过使用直线淋釉器对砖坯进行施釉处理,随后将施釉后的砖坯进行强化干燥,加快了施釉后的砖坯进行固化,从而便于对砖坯进行烧制,缩短了施釉后的砖坯固化时间,从而加快了对超厚砖的烧成,当烧成后,利用多次对处于高温状态的砖坯进行多次降温,避免了对砖坯进行急剧降温的过程中导致砖坯的破裂,从而提高了对超厚砖的生产质量。
需要说明的是,在本文中,诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来,而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且,术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含,从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素,而且还包括没有明确列出的其他要素,或者是还包括为这种过程、方法、物品或者设备所固有的要素。
最后应说明的是:以上所述仅为本发明的优选实施例而已,并不用于限制本发明,尽管参照前述实施例对本发明进行了详细的说明,对于本领域的技术人员来说,其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换。凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。
Claims (8)
1.一种加快超厚砖辊道窑烧成工艺,包括以下步骤,步骤一,砖坯干燥;步骤二,砖坯施釉;步骤三,砖坯印花;步骤四,强化干燥;步骤五,砖坯烧成;步骤六,砖坯急冷;步骤七,砖坯缓冷;步骤七,砖坯尾冷;其特征在于:
其中在上述步骤一中,将含水率在5-6%的砖坯通过三层辊道干燥器后变成含水率在0.8%以下的干燥坯;
其中在上述步骤二中,利用辊道将干燥后的砖坯输运至直线淋釉器的下部,通过直线淋釉器对干燥后的砖坯表面进行上釉处理;
其中在上述步骤三中,将步骤二中上釉处理后的砖坯利用辊道运输与砖坯进行印花处理;
其中在上述步骤四中,将步骤三中的印花通过辊道输运至干燥窑中对砖坯进行强化干燥;
其中在上述步骤五中,将步骤四中的干燥后的砖坯在进入窑炉前先上底浆随后通过辊道输运至辊道窑的内部进行烧成,烧制温度为1180-1220℃;
其中在上述步骤六中,将步骤五中烧成而成的砖坯通过辊道输运至急冷区使砖坯温度下降到600-650℃;
其中在上述步骤七中,将步骤六中急冷后的砖坯通过辊道输运至缓冷区使砖坯温度下降到450-610℃;
其中在上述步骤八中,将步骤七中缓冷后的砖坯通过辊道输运至冷风区通过冷风对砖坯进行降温,使砖坯温度下降至出厂温度。
2.根据权利要求1所述的一种加快超厚砖辊道窑烧成工艺,其特征在于:所述步骤一中第一层辊道干燥器干燥温度为80-100℃,第二层辊道干燥器干燥温度为90-200℃,第三层辊道干燥器干燥温度为190-300℃。
3.根据权利要求1所述的一种加快超厚砖辊道窑烧成工艺,其特征在于:所述步骤三中的印花处理为丝网印花、胶辊印花和喷墨印花中的其中一种。
4.根据权利要求1所述的一种加快超厚砖辊道窑烧成工艺,其特征在于:所述步骤四中的干燥温度为280-320℃。
5.根据权利要求1所述的一种加快超厚砖辊道窑烧成工艺,其特征在于:所述步骤五中的底浆为氧化铝和氧化镁加入一定比例的水在球磨机内部研磨而成,研磨时间为2-4h。
6.根据权利要求1所述的一种加快超厚砖辊道窑烧成工艺,其特征在于:所述步骤五中辊道窑的长度为160m,且辊道窑为S型窑炉。
7.根据权利要求1所述的一种加快超厚砖辊道窑烧成工艺,其特征在于:所述步骤六中的降温速率为90℃/min。
8.根据权利要求1所述的一种加快超厚砖辊道窑烧成工艺,其特征在于:所述步骤七中的降温速率为25℃/min。
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