CN111148364B - Flexible stretchable circuit and manufacturing method thereof - Google Patents
Flexible stretchable circuit and manufacturing method thereof Download PDFInfo
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- CN111148364B CN111148364B CN201811309941.8A CN201811309941A CN111148364B CN 111148364 B CN111148364 B CN 111148364B CN 201811309941 A CN201811309941 A CN 201811309941A CN 111148364 B CN111148364 B CN 111148364B
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1322—Encapsulation comprising more than one layer
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides a flexible stretchable circuit and a manufacturing method thereof, and relates to the technical field of electronics. The manufacturing method of the flexible stretchable circuit provided by the invention comprises the following steps: providing a hard substrate, and forming a low-melting-point metal circuit on the surface of the hard substrate; forming a first packaging material layer on the low-melting-point metal circuit; the first packaging material layer is used as a flexible and stretchable substrate in the flexible and stretchable circuit; placing the resulting structure in a first environment until the flexible stretchable substrate completes the glass transition; step S4, placing the obtained structure in a second environment, separating the flexible stretchable substrate from the hard substrate, and attaching the low-melting-point metal circuit to the flexible stretchable substrate; forming a second packaging material layer on the low-melting-point metal circuit in a second environment; the resulting structure is placed in a third environment resulting in a flexible, stretchable circuit. The technical scheme of the invention can manufacture the flexible stretchable circuit so as to simultaneously meet the requirements on flexibility and stretchability of the circuit.
Description
Technical Field
The invention relates to the technical field of electronics, in particular to a flexible stretchable circuit and a manufacturing method thereof.
Background
As a new electronic device, the flexible circuit is widely applied to the fields of intelligent wearing, artificial skin, foldable electronic devices and the like. At present, the mainstream flexible circuit is mainly based on conductive materials such as copper wires, aluminum foils and silver pastes, and the manufactured device can meet basic requirements such as bending and shearing, but cannot meet the requirement of high-strength stretching due to the limitation of the conductive materials.
Disclosure of Invention
The invention provides a flexible stretchable circuit and a manufacturing method thereof, which can manufacture the flexible stretchable circuit so as to simultaneously meet the requirements on flexibility and stretchability of the circuit.
In a first aspect, the invention provides a method for manufacturing a flexible stretchable circuit, which adopts the following technical scheme:
the manufacturing method of the flexible stretchable circuit comprises the following steps:
step S1, providing a hard substrate, and forming a low-melting-point metal circuit on the surface of the hard substrate by using a low-melting-point metal with a melting point lower than room temperature;
step S2, forming a first packaging material layer on the low-melting-point metal circuit, wherein the first packaging material layer is flexible and stretchable; wherein the first layer of encapsulant material acts as a flexible stretchable substrate in the flexible stretchable circuit;
step S3, placing the structure obtained in step S2 in a first environment, wherein the temperature of the first environment is lower than or equal to the glass transition temperature of the flexible stretchable substrate until the glass transition of the flexible stretchable substrate is completed;
step S4, placing the structure obtained in step S3 in a second environment, wherein the temperature of the second environment is higher than the glass transition temperature of the first packaging material and lower than the melting point of the low-melting-point metal, and separating the flexible stretchable substrate from the hard substrate, wherein the low-melting-point metal circuit is attached to the flexible stretchable substrate;
step S5, forming a second packaging material layer on the low melting point metal circuit in the second environment, wherein the second packaging material layer is flexible and stretchable;
step S6, placing the structure obtained in the step S5 in a third environment, wherein the temperature of the third environment is higher than or equal to the melting point of the low-melting-point metal, and obtaining the flexible stretchable circuit;
the method of making the flexible stretchable circuit further comprises: between the step S2 and the step S3, a step S3' of pressing the flexible stretchable substrate and the hard substrate using a mold is performed.
Optionally, in step S2, the first encapsulant is in a liquid state, and the first encapsulant layer is formed by a cross-linking reaction of the first encapsulant in the liquid state.
Optionally, the first encapsulant material comprises a two-component addition type silicone, a two-component condensation type silicone, a two-component reaction type PBAT, or an aqueous one-component elastomeric polyurethane.
Optionally, the mould comprises two hinged stainless steel plates having a thickness of 1cm ± 0.1mm and a plurality of fasteners.
Optionally, in the step S3, the stainless steel plate with which the flexible stretchable substrate is in direct contact is at a near-cold end.
Optionally, in step S5, the second encapsulant is in a liquid state, and the second encapsulant layer is formed by performing a cross-linking reaction on the first encapsulant in the liquid state.
Optionally, when the second packaging material layer is completely gelled and is not completely cured in the step S5, the step S6 is performed.
Optionally, the first encapsulating material and the second encapsulating material are made of the same material.
Optionally, the hard substrate is a polyolefin film, and the first packaging material is silicone rubber or PBAT; or the hard base material is a polyester film, and the first packaging material is thermoplastic polyurethane.
Optionally, the thickness of the first packaging material layer is greater than 2 times the thickness of the low melting point metal circuit, and the thickness of the second packaging material layer is greater than 2 times the thickness of the low melting point metal circuit.
Optionally, the third environment has a relative humidity of less than 10%.
In a second aspect, the present invention provides a flexible stretchable circuit formed using the method of forming a flexible stretchable circuit described in any one of the above.
The invention provides a flexible stretchable circuit and a manufacturing method thereof, wherein the manufacturing method of the flexible stretchable circuit comprises the following steps: step S1, providing a hard substrate, and forming a low-melting-point metal circuit on the surface of the hard substrate by using a low-melting-point metal with the melting point lower than room temperature; step S2, forming a first packaging material layer on the low melting point metal circuit, wherein the first packaging material layer is flexible and stretchable; wherein the first layer of encapsulant material serves as a flexible stretchable substrate in the flexible stretchable circuit; step S3, placing the structure obtained in step S2 in a first environment, wherein the temperature of the first environment is lower than or equal to the glass transition temperature of the flexible stretchable substrate until the glass transition of the flexible stretchable substrate is completed; step S4, placing the structure obtained in the step S3 in a second environment, wherein the temperature of the second environment is higher than the glass transition temperature of the first packaging material and lower than the melting point of the low-melting-point metal, separating the flexible stretchable substrate from the hard substrate, and attaching the low-melting-point metal circuit to the flexible stretchable substrate; step S5, forming a second packaging material layer on the low melting point metal circuit in a second environment, wherein the second packaging material layer is flexible and stretchable; and S6, placing the structure obtained in the step S5 in a third environment, wherein the temperature of the third environment is higher than or equal to the melting point of the low-melting-point metal, and obtaining the flexible stretchable circuit. The flexible stretchable circuit of the circuit manufactured by the manufacturing method comprises the flexible stretchable base material, the low-melting-point metal circuit which is in a liquid state at room temperature and the flexible stretchable second packaging material layer, so that the flexible stretchable circuit can well meet the requirements on the flexibility and the stretchability of the circuit.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a flow chart of a method for manufacturing a flexible and stretchable circuit according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a process for manufacturing a flexible and stretchable circuit according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a mold according to an embodiment of the present invention;
FIG. 4 is a schematic cross-sectional view along the direction AA' in FIG. 2 according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the technical features in the embodiments of the present invention may be combined with each other without conflict.
An embodiment of the present invention provides a method for manufacturing a flexible stretchable circuit, and specifically, as shown in fig. 1 and fig. 2, fig. 1 is a flowchart of a method for manufacturing a flexible stretchable circuit according to an embodiment of the present invention, and fig. 2 is a schematic diagram of a process for manufacturing a flexible stretchable circuit according to an embodiment of the present invention, where the method for manufacturing a flexible stretchable circuit includes:
step S1 is to provide a hard substrate 1, and form a low-melting-point metal circuit 2 on the surface of the hard substrate 1 by using a low-melting-point metal having a melting point lower than room temperature.
Illustratively, the low-melting-point metal circuit can be formed on the surface of the hard substrate by various ways such as printing, spraying and the like according to actual requirements. The specific material of the low melting point metal can be reasonably selected according to the requirements on the melting point and the performance of the low melting point metal. In addition, the low melting point metal may be doped with various fillers to improve the performance of the low melting point metal, which is not limited herein.
The hard substrate 1 may be a polyolefin PVC film, a polyester film, a polyamide film, or the like.
Step S2, forming a first packaging material layer on the low melting point metal circuit 2, wherein the first packaging material layer is flexible and stretchable.
Wherein the first layer of encapsulant material functions as the flexible stretchable substrate 3 in the flexible stretchable circuit.
Optionally, the first encapsulating material includes silicone rubber, PBAT (thermoplastic biodegradable plastic, which is a copolymer of butylene adipate and butylene terephthalate), thermoplastic polyurethane, and the like, so that the elongation at break of the formed first encapsulating material layer may reach 300% or more.
The first packaging material layer can be a formed film or a film formed by a cross-linking reaction of a liquid first packaging material. When the first encapsulating material layer is a molding film, the operation of step S2 is simple, and only the first encapsulating material layer needs to be covered on the low melting point metal circuit 2; when the first encapsulant is in a liquid state and the first encapsulant layer is formed by a cross-linking reaction of the liquid first encapsulant, the first encapsulant layer and the low-melting-point metal circuit are firmly bonded, which is favorable for better attaching the low-melting-point metal circuit 2 to the flexible stretchable substrate 3 when the flexible stretchable substrate 3 is separated from the hard substrate 1 in the subsequent step S4, and the low-melting-point metal circuit 2 is not easily broken in the stretching process, which is specifically described in detail in the following content after the embodiment of the present invention.
Optionally, the first encapsulant comprises two-component addition type silicone, two-component condensation type silicone, two-component reaction type PBAT, or aqueous one-component elastic polyurethane, so that the first encapsulant can undergo a cross-linking reaction to form a first encapsulant layer having good flexibility and stretchability.
In addition, the inventors found that when the first encapsulating material is selected according to the material of the hard substrate 1, it may contribute to the effect of separating the flexible stretchable substrate 3 and the hard substrate 1 in the subsequent step S4, specifically, the first encapsulating material is selected which is capable of attaching the hard substrate 1 but not too strong in adhesion. Illustratively, the hard substrate 1 is a polyolefin thin film, and the first packaging material is silicone rubber or PBAT; alternatively, the hard base material 1 is a polyester film, and the first sealing material is a thermoplastic polyurethane.
Optionally, the thickness of the first packaging material layer is greater than 2 times the thickness of the low melting point metal circuit 2, so that the first packaging material layer can well cover the low melting point metal circuit 2, and the flexible stretchable substrate 3 as the first packaging material layer can well support the low melting point metal circuit 2.
Step S3, the structure obtained in step S2 is placed in a first environment, the temperature T1 of the first environment is lower than or equal to the glass transition temperature Tg of the flexible stretchable substrate 3 until the glass transition of the flexible stretchable substrate 3 is completed.
For polymers, the glass transition is the transition between the glassy and high elastic state of an amorphous polymer. The temperature at which the glass transition occurs is called the glass transition temperature Tg and is a characteristic temperature of the polymer. It is the upper limit of the service temperature of the amorphous thermoplastic and the lower limit of the service temperature of the rubber. In step S3, the flexible stretchable substrate 3 undergoes a glass transition in the first environment, i.e., the flexible stretchable substrate 3 is transformed from a high elastic state to a glassy state, and the flexible stretchable substrate 3 has no flexibility and stretchability in the glassy state, so that it can be easily separated from the hard substrate 1 in the subsequent step S4, and the low melting point metal circuit 2 is not damaged greatly during the separation process.
Alternatively, the temperature T1 of the first environment ranges from 4K to 175K, which may be selected according to the glass transition temperature of the flexible stretchable substrate 3. The adopted cold medium comprises liquid nitrogen, liquid helium, liquid hydrogen, liquid oxygen and the like, and the adopted refrigeration mode comprises a compressor, direct contact of the cold medium or a Stirling engine and the like.
The inventors found that, in step S3, when the structure obtained in step S2 is placed in the first environment due to the low temperature of the first environment, the flexible stretchable substrate 3 is subject to cold shrinkage deformation and is easily detached from the rigid substrate 1, so that the subsequent steps cannot be performed. In order to solve this problem, in an embodiment of the present invention, the method of manufacturing the flexible stretchable circuit further includes performing step S3' between step S2 and step S3, of pressing the flexible stretchable substrate 3 and the hard substrate 1 with a mold to prevent cold-shrink deformation of the flexible stretchable substrate 3 in step S3.
Alternatively, as shown in fig. 3, fig. 3 is a schematic structural diagram of a mold provided in an embodiment of the present invention, and the mold 5 includes two hinged stainless steel plates 51 and a plurality of fasteners 52. The stainless steel plate 51 is selected because the stainless steel plate 51 has good thermal conductivity and is not easily corroded. The spacing between the two stainless steel plates 51 may be selected according to the thickness of the structure obtained in step S2, and is preferably slightly larger than the thickness of the structure obtained in step S2. Alternatively, the stainless steel plate 51 has a thickness of 1cm ± 0.1mm so that the weight of the mold 5 is not too large, the low melting point metal circuit 2 is not crushed while functioning to press the flexible stretchable substrate 3 and the hard substrate 1, and has good thermal conductivity.
Further, in the embodiment of the present invention, selectively, in the step S3, the stainless steel plate directly contacted with the flexible stretchable substrate 3 is at a near-cold end (i.e., closer to the cold source), and the stainless steel plate directly contacted with the hard substrate 1 is at a far-cold end, so that the cooling effect of the flexible stretchable substrate 3 is better, which is beneficial to improving the effect of separating the flexible stretchable substrate 3 from the hard substrate 1 in the subsequent step S4, and energy consumption can be further saved.
And S4, placing the structure obtained in the step S3 in a second environment, wherein the temperature T2 of the second environment is higher than the glass transition temperature of the first packaging material and lower than the melting point of the low-melting-point metal, separating the flexible stretchable substrate 3 from the hard substrate 1, and attaching the low-melting-point metal circuit 2 to the flexible stretchable substrate 3.
Alternatively, the temperature T2 of the second environment ranges from 240K to 273K, which may be selected according to the glass transition temperature of the flexible stretchable substrate 3 and the melting point of the low melting point metal, and the employed refrigeration method may be a compressor.
Step S5, in a second environment, forming a second packaging material layer 4 on the low melting point metal circuit 2, wherein the second packaging material layer 4 is flexible and stretchable.
Optionally, the second encapsulating material includes silicone rubber, PBAT, thermoplastic polyurethane, etc., so that the elongation at break of the formed second encapsulating material layer may reach 300% or more.
The second packaging material layer can be a formed film or a film formed by a cross-linking reaction of a liquid second packaging material. When the second packaging material layer 4 is a formed film, after the second packaging material layer is covered on the low-melting-point metal circuit 2, hot pressing is needed to be carried out on the second packaging material layer so that the second packaging material layer 4 is not easy to fall off; when the second packaging material is in a liquid state and the second packaging material layer 4 is formed by a cross-linking reaction of the liquid second packaging material, the low-melting-point metal circuit 2 can be melted before the second packaging material layer 4 is completely cured, so that the low-melting-point metal circuit 2 is not easily broken in a stretching process.
Optionally, the second encapsulant material comprises two-component addition type silicone, two-component condensation type silicone, two-component reaction type PBAT, or aqueous one-component elastic polyurethane, so that the second encapsulant material can undergo a cross-linking reaction to form the second encapsulant material layer 4 with better flexibility and stretchability.
Preferably, the first packaging material and the second packaging material are made of the same material, so that the flexible stretchable substrate 3 and the second packaging material layer 4 have good compatibility and stable structure, and in the stretching process, the flexible stretchable substrate 3 and the second packaging material layer 4 have the same stretching ratio, so that the flexible stretchable substrate and the second packaging material layer are not separated in the stretching process.
Alternatively, the thickness of the second encapsulating material layer 4 is greater than 2 times the thickness of the low melting point metal circuit 2, so that the low melting point metal circuit 2 can be covered well even in the case where the low melting point metal circuit 2 is melted to expand in volume.
And S6, placing the structure obtained in the step S5 in a third environment, wherein the temperature T3 of the third environment is higher than or equal to the melting point of the low-melting-point metal, and obtaining the flexible and stretchable circuit.
Specifically, in the structure obtained in step S5, in the third environment, the low melting point metal circuit 2 is melted into a liquid state, and has flexibility and stretchability, thereby obtaining a flexible stretchable circuit.
Optionally, the temperature T3 of the third environment ranges from 288K to 298K, and may be specifically selected according to the melting point of the low-melting-point metal.
In addition, the inventors found that if the humidity of the third environment is high, when the structure obtained in step S5 is placed in the third environment, mist is easily formed on the structure obtained in step S5, which easily causes short circuit or open circuit of the low melting point metal circuit 2. In order to avoid the above problem, in the embodiment of the present invention, the relative humidity of the third environment is lower than 10%.
Alternatively, when the second encapsulant layer 4 is gelled and is not completely cured in step S5, step S6 is performed, so that the low melting point metal circuit 2 is not easily broken during the stretching process, for the following reasons:
as shown in fig. 4, fig. 4 is a schematic cross-sectional view along direction AA' in fig. 2 according to an embodiment of the present invention, in which a first encapsulant layer (i.e., the flexible stretchable substrate 3 shown in fig. 4) is formed by a cross-linking reaction of a liquid first encapsulant material, and a second encapsulant layer 4 is formed by a cross-linking reaction of a liquid second encapsulant material, when the first encapsulant layer is formed on the low melting point metal circuit 2 in step S2, the first encapsulant layer forms a semicircular groove at a corresponding position of the low melting point metal circuit 2, after the flexible stretchable substrate 3 is separated from the rigid substrate 1 in step S4, the low melting point metal circuit 2 is attached to the flexible stretchable substrate 3, and a surface of the low melting point metal circuit 2 away from the flexible stretchable substrate 3 is planar, and the second encapsulant layer 4 is formed on the low melting point metal circuit 2 in step S5, and when the second packaging material layer 4 is gelled and is not completely cured, executing step S6, wherein the second packaging material layer 4 is not easy to flow and deform in step S6, and the volume expansion generated when the low melting point metal circuit 2 is melted can deform the second packaging material layer 4, so that the second packaging material layer 4 also forms a semicircular groove at the corresponding position of the low melting point metal circuit 2, the semicircular groove on the flexible stretchable substrate 3 and the semicircular groove on the second packaging material layer 4 form a micro channel, the shape of the micro channel is completely matched with the shape of the low melting point metal circuit 2, so as to limit the low melting point metal circuit 2 therein, thereby preventing the low melting point metal circuit 2 from breaking during stretching.
In addition, the embodiment of the invention also provides a flexible stretchable circuit which is manufactured and formed by using the manufacturing method of the flexible stretchable circuit. The details of the manufacturing method of the flexible stretchable circuit described above are all applicable to the flexible stretchable circuit, and are not described herein again.
The embodiment of the invention provides a flexible stretchable circuit and a manufacturing method thereof, wherein the manufacturing method of the flexible stretchable circuit comprises the following steps: step S1, providing a hard substrate 1, and forming a low-melting-point metal circuit 2 on the surface of the hard substrate 1 by using a low-melting-point metal with a melting point lower than room temperature; step S2, forming a first packaging material layer on the low melting point metal circuit 2, wherein the first packaging material layer is flexible and stretchable; wherein the first layer of encapsulation material acts as the flexible stretchable substrate 3 in the flexible stretchable circuit; step S3, placing the structure obtained in step S2 in a first environment, the temperature T1 of the first environment being lower than or equal to the glass transition temperature of the flexible stretchable substrate 3 until the glass transition of the flexible stretchable substrate 3 is completed; step S4, placing the structure obtained in step S3 in a second environment, wherein the temperature T2 of the second environment is higher than the glass transition temperature of the first packaging material and lower than the melting point of the low-melting-point metal, separating the flexible stretchable substrate 3 from the hard substrate 1, and attaching the low-melting-point metal circuit 2 to the flexible stretchable substrate 3; step S5, forming a second packaging material layer 4 on the low melting point metal circuit 2 in a second environment, wherein the second packaging material layer 4 is flexible and stretchable; and S6, placing the structure obtained in the step S5 in a third environment, wherein the temperature of the third environment is higher than or equal to the melting point of the low-melting-point metal, and obtaining the flexible stretchable circuit. The flexible stretchable circuit of the circuit manufactured by the manufacturing method comprises the flexible stretchable base material 3, the low-melting-point metal circuit 2 which is in a liquid state at room temperature and the flexible stretchable second packaging material layer 4, so that the flexible stretchable circuit can well meet the requirements on the flexibility and the stretchability of the circuit.
The following embodiments of the present invention describe alternative low melting point metals, rigid substrates, flexible stretchable substrates, first environments, second environments, and third environments in the fabrication of flexible stretchable circuits.
Example 1
| Low melting point metal | Gallium-indium eutectic alloy (melting point 15.9 degree) |
| Hard base material | PVC film |
| Flexible stretchable substrate | PBAT film (glass)Melting temperature-120 deg.C) |
| First environment | The temperature is-120 deg.C, and the treatment time is 40min |
| Second environment | The temperature is-20 ℃, and the treatment time is 4h |
| Third Environment | The temperature is 20 ℃, and the treatment time is 20min |
Example 2
| Low melting point metal | Gallium-tin eutectic alloy (melting point 20.4 ℃ C.) |
| Hard base material | PVC film |
| Flexible stretchable substrate | Addition type silica gel film (glass transition temperature-170 degree) |
| First environment | The temperature is-180 deg.C, and the treatment time is 40min |
| Second environment | The temperature is-20 ℃, and the treatment time is 6h |
| Third Environment | The temperature is 30 ℃, and the treatment time is 20min |
Example 3
| Low melting point metal | Gallium indium tin eutectic alloy (melting point 11 ℃ C.) |
| Hard base material | PET film |
| Flexible stretchable substrate | TPU film (glass transition temperature-140 ℃ C.) |
| First environment | The temperature is 150 ℃ below zero, and the treatment time is 10min |
| Second environment | The temperature is 30 ℃ below zero, and the treatment time is 3h |
| Third Environment | The temperature is 20 ℃, and the treatment time is 20min |
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (9)
1. A method of making a flexible stretchable circuit, comprising:
step S1, providing a hard substrate, and forming a low-melting-point metal circuit on the surface of the hard substrate by using a low-melting-point metal with a melting point lower than room temperature;
step S2, forming a first packaging material layer on the low-melting-point metal circuit, wherein the first packaging material layer is flexible and stretchable; wherein the first layer of encapsulant material acts as a flexible stretchable substrate in the flexible stretchable circuit;
step S3, placing the structure obtained in step S2 in a first environment, wherein the temperature of the first environment is lower than or equal to the glass transition temperature of the flexible stretchable substrate until the glass transition of the flexible stretchable substrate is completed;
step S4, placing the structure obtained in step S3 in a second environment, wherein the temperature of the second environment is higher than the glass transition temperature of the first packaging material and lower than the melting point of the low-melting-point metal, and separating the flexible stretchable substrate from the hard substrate, wherein the low-melting-point metal circuit is attached to the flexible stretchable substrate;
step S5, forming a second packaging material layer on the low melting point metal circuit in the second environment, wherein the second packaging material layer is flexible and stretchable;
step S6, placing the structure obtained in the step S5 in a third environment, wherein the temperature of the third environment is higher than or equal to the melting point of the low-melting-point metal, and the flexible and stretchable circuit is obtained;
the method of making the flexible stretchable circuit further comprises: between the step S2 and the step S3, a step S3' of pressing the flexible stretchable substrate and the hard substrate using a mold is performed.
2. The method for manufacturing a flexible stretchable circuit according to claim 1, wherein in the step S2, the first packaging material is in a liquid state, and the first packaging material layer is formed by a cross-linking reaction of the first packaging material in the liquid state.
3. The method for manufacturing a flexible stretchable circuit according to claim 1, wherein in the step S5, the second packaging material is in a liquid state, and the second packaging material layer is formed by a cross-linking reaction of the first packaging material in the liquid state.
4. The method as claimed in claim 3, wherein the step S6 is performed when the second packaging material layer is completely gelled and is not completely cured in the step S5.
5. The method of claim 1, wherein the first encapsulant and the second encapsulant are the same.
6. The method of claim 1, wherein the rigid substrate is a polyolefin film, and the first encapsulant is silicone rubber or PBAT; or the hard base material is a polyester film, and the first packaging material is thermoplastic polyurethane.
7. The method of claim 1, wherein the thickness of the first layer of encapsulant is greater than 2 times the thickness of the low melting point metal circuit, and the thickness of the second layer of encapsulant is greater than 2 times the thickness of the low melting point metal circuit.
8. A method of making a flexible stretchable circuit according to claim 1, wherein the third environment has a relative humidity of less than 10%.
9. A flexible stretchable circuit characterized by being formed by the method for manufacturing a flexible stretchable circuit according to any one of claims 1 to 8.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101681695A (en) * | 2006-09-06 | 2010-03-24 | 伊利诺伊大学评议会 | controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics |
| CN105592640A (en) * | 2014-10-22 | 2016-05-18 | 中国科学院理化技术研究所 | Preparation method of flexible printed circuit |
| CN108668431A (en) * | 2017-03-28 | 2018-10-16 | 国家纳米科学中心 | Preparation method and application of flexible and stretchable conductive circuit and circuit |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US7145229B2 (en) * | 2002-11-14 | 2006-12-05 | The Regents Of The University Of California | Silicone metalization |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101681695A (en) * | 2006-09-06 | 2010-03-24 | 伊利诺伊大学评议会 | controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics |
| CN105592640A (en) * | 2014-10-22 | 2016-05-18 | 中国科学院理化技术研究所 | Preparation method of flexible printed circuit |
| CN108668431A (en) * | 2017-03-28 | 2018-10-16 | 国家纳米科学中心 | Preparation method and application of flexible and stretchable conductive circuit and circuit |
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