CN111132458B - Microwave signal vertical interconnection structure and interconnection method between printed circuit boards - Google Patents
Microwave signal vertical interconnection structure and interconnection method between printed circuit boards Download PDFInfo
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- CN111132458B CN111132458B CN201911367698.XA CN201911367698A CN111132458B CN 111132458 B CN111132458 B CN 111132458B CN 201911367698 A CN201911367698 A CN 201911367698A CN 111132458 B CN111132458 B CN 111132458B
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- 238000000034 method Methods 0.000 title claims abstract description 29
- 230000008054 signal transmission Effects 0.000 claims abstract description 113
- 239000002313 adhesive film Substances 0.000 claims abstract description 39
- 239000002184 metal Substances 0.000 claims description 58
- 238000010168 coupling process Methods 0.000 claims description 21
- 238000005859 coupling reaction Methods 0.000 claims description 21
- 230000008878 coupling Effects 0.000 claims description 20
- 229910052755 nonmetal Inorganic materials 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 230000000712 assembly Effects 0.000 claims description 5
- 238000000429 assembly Methods 0.000 claims description 5
- 101710161460 3-oxoacyl-[acyl-carrier-protein] synthase Proteins 0.000 claims description 3
- 238000001465 metallisation Methods 0.000 claims description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims 1
- 239000012159 carrier gas Substances 0.000 claims 1
- 101710146995 Acyl carrier protein Proteins 0.000 description 22
- 239000007769 metal material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000005570 vertical transmission Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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Abstract
The invention relates to a vertical interconnection structure and an interconnection method of microwave signals among printed circuit boards, belongs to the technical field of microwave signal transmission, and solves the problems of low interconnection density and the like of the existing microwave signal interconnection mode applied among multilayer printed circuit boards. The microwave signal shielding plate comprises a first microwave signal plate, a second microwave signal plate, a conductive adhesive film and a microwave signal shielding plate; microwave signal transmission lines are arranged on the first microwave signal plate and the second microwave signal plate; the first microwave signal board and the microwave signal shielding board are arranged and contacted with each other to form a microwave signal transmission assembly, the microwave signal transmission assembly is perpendicular to the second microwave signal board, and microwave signals are vertically transmitted into the second microwave signal board interface through the first microwave signal board. The invention realizes the vertical interconnection of high-density and low-profile microwave signals without adopting a microwave connector, and has the advantages of good consistency, high reliability and high interconnection density.
Description
Technical Field
The invention relates to the technical field of microwaves, in particular to a microwave signal vertical interconnection structure and an interconnection method between printed circuit boards.
Background
In a phased array antenna feed integrated assembly and system, the transmission direction of signals in a microwave receiving and transmitting channel is usually vertical to the transmission direction of signals in an antenna feed network and is respectively arranged on two multilayer printed circuit boards. If the assembly relationship between two multilayer printed boards is vertical, the microwave signal is transmitted from one printed board to the other printed board, and the microwave connector is generally adopted at present.
However, the microwave connector occupies a certain volume, and cannot achieve higher interconnection density. If the microwave connector is not adopted, the microwave signal vertical interconnection between the multilayer printed boards cannot be realized by bonding wire bonding, solder ball bonding and other modes.
Disclosure of Invention
In view of the foregoing, embodiments of the present invention are directed to a vertical microwave signal interconnection device for use between multilayer printed circuit boards and an assembly method thereof, so as to solve the problem of low interconnection density of the conventional microwave signal interconnection method applied between multilayer printed circuit boards.
The purpose of the invention is mainly realized by the following technical scheme:
the invention discloses a microwave signal vertical interconnection structure between printed circuit boards, which comprises a first microwave signal board, a second microwave signal board, a conductive adhesive film and a microwave signal shielding board, wherein the first microwave signal board is arranged on the first microwave signal board;
microwave signal transmission lines are arranged on the first microwave signal plate and the second microwave signal plate; the first microwave signal plate and the microwave signal shielding plate are arranged and contacted with each other to form a microwave signal transmission assembly, and the two outer side surfaces of the microwave signal transmission assembly are provided with the microwave signal shielding plates; a hard flat plate for clamping the microwave signal transmission assembly is arranged on the outer side of the microwave signal transmission assembly, a pressing block is arranged above the microwave signal transmission assembly, and a light thin layer is arranged between the bottom of the pressing block and the microwave signal transmission assembly;
the microwave signal transmission assembly is perpendicular to the second microwave signal board, the first microwave signal board is connected with the second microwave signal board through an ACF (anisotropic conductive film) or ACP (acyl carrier protein) conductive film, and microwave signals are vertically transmitted into a second microwave signal board interface through the first microwave signal board.
In one possible design, the microwave signal transmission line is arranged on the surface of the first microwave signal board and forms a first microstrip line; the first microstrip line extends to the edge of the first microwave signal plate and leads out a first signal contact; first metal grounding contacts are respectively arranged on two sides of the first signal contact, and a first white-remaining area is arranged between the first metal grounding contacts and the first signal contact; the first signal contact, the first metal grounding contact and the first blank area form a first interconnection interface of the first microwave signal plate; the first interconnection interface is correspondingly connected with the second microwave signal board interface.
In one possible design, the microwave signal transmission line is disposed inside the first microwave signal board and forms a first strip line; the first strip line extends to the edge of the second microwave signal plate and leads out a second signal contact; second metal grounding contacts are respectively arranged on two sides of the second signal contact, and a second white region is arranged between the second metal grounding contacts and the second signal contact; and the second signal contact, the second metal grounding contact and the second blank area form a second interconnection interface of the first microwave signal plate, and the second interconnection interface is correspondingly and vertically connected with the second microwave signal plate interface.
In a possible design, the microwave signal shielding plates on two sides of the first microwave signal plate are provided with corresponding first grooves, projections of the first signal contacts on the microwave signal shielding plates on two sides are in the first grooves, and the length of the first grooves is equal to the length of the first microstrip lines.
In a possible design, the microwave signal shielding plates on two sides of the first microwave signal plate are provided with corresponding second grooves, projections of the second signal contacts on the microwave signal shielding plates on two sides are in the second grooves, and the length of the second grooves is smaller than that of the first strip-shaped wires.
In one possible design, a third signal contact is arranged on the second microwave signal plate, the third signal contact is rectangular, a rectangular grounding ring is arranged outside the third signal contact, a third blank area is arranged between the third signal contact and the rectangular grounding ring, and the third signal contact, the rectangular grounding ring and the third blank area form a second microwave signal plate interface.
In one possible design, the microwave signal transmission line is arranged inside the second microwave signal board and forms a second strip line, and the third signal contact is connected with the second strip line through the metalized hole; and through shielding holes and non-through shielding holes are alternately arranged on the outer sides of the metalized holes along the circumferential direction, and are connected with the rectangular grounding ring.
In a possible design, the microwave signal transmission line is arranged inside the second microwave signal plate and forms a second strip line, a first metal shielding plate is arranged in the second microwave signal plate, a coupling seam is arranged on the first metal shielding plate, and the third signal contact transmits electromagnetic energy to the second strip line through the coupling seam.
In one possible design, the microwave signal transmission line on the second microwave signal board is a second stripline; the third signal contact is connected with the second strip line through the metalized hole; and through shielding holes and non-through shielding holes are alternately arranged on the outer sides of the metalized holes along the circumferential direction, and are connected with the rectangular grounding ring.
In a possible design, or be equipped with the metal shield plate in the second microwave signal board, be equipped with the coupling seam on the metal shield plate, the third signal contact passes through the coupling seam and transmits electromagnetic energy to the second stripline on.
In one possible design, the height of the first signal contact, the first metal ground contact, the second signal contact and the second metal ground contact is 10 μm to 80 μm; the height of the third signal contact and the rectangular grounding ring is 10-80 mu m.
In one possible design, the microwave shielding plate is made of metal.
On the other hand, the invention also discloses a microwave signal vertical interconnection method applied among multilayer printed circuit boards, which adopts the microwave signal vertical interconnection structure among the printed circuit boards, when the first microwave signal board adopts the first microstrip line, the microwave signal transmission line is arranged in the second microwave signal board and forms a second strip line, and the microwave signal vertical interconnection method comprises the following steps:
In a third aspect, the present invention further discloses a vertical microwave signal interconnection method applied between multilayer printed circuit boards, in which, by using the vertical microwave signal interconnection structure between printed circuit boards, when a first microwave signal board adopts a first strip line, a microwave signal transmission line on a second microwave signal board is a second strip line, the vertical microwave signal interconnection method includes the following steps:
Compared with the prior art, the invention can realize at least one of the following beneficial effects:
(1) when the assembly relationship between the two multilayer printed boards is vertical, a microwave signal is transmitted from one printed board to the other printed board, and the prior art adopts a microwave connector implementation mode; however, the microwave connector occupies a certain volume, and cannot achieve higher interconnection density. If the microwave connector is not adopted, the microwave signal vertical interconnection between the multilayer printed boards cannot be realized by bonding wire bonding, solder ball bonding and other modes. According to the microwave signal vertical interconnection structure, on the basis that a microwave connector is not adopted, the microwave signal interconnection mode among the multilayer printed circuit boards is realized, the microwave signal vertical interconnection structure is suitable for a miniaturized and high-integration phased array radar system, and the problems that the interconnection density is low and the like in the existing microwave signal interconnection mode applied among the multilayer printed circuit boards are solved.
(2) This application is equipped with just corresponding first recess on the microwave signal shield plate of first microwave signal board both sides, and the projection of first signal contact on the microwave signal shield plate of both sides is in first recess, and the length of first recess equals first microstrip line length, and then avoids the microwave signal shield plate of first signal contact metal material.
(3) The conductive adhesive film adopted by the application is an ACF conductive adhesive film or an ACP conductive adhesive film; after the first interconnection interface and the second microwave signal interface are accurately aligned, the microwave signal transmission assembly and the second microwave signal board are pressed, the ACF conductive adhesive film or the ACP conductive adhesive film is solidified after heating and pressurizing for a period of time, the insulating film on the periphery of the particles is damaged when the bump contacts are hot pressed, so that the particles are conducted in the vertical direction, and finally, the stable interconnection structure with vertical conduction and transverse insulation is formed.
(4) This application is in first interconnect department, first signal contact and first metal ground contact's height is 10 mu m ~ 80 mu m, the part that first signal contact and first metal ground contact are higher than first microwave signal board is first lug connection, the height of third signal contact and rectangle ground loop is 10 mu m ~ 80 mu m, the part that third signal contact and rectangle ground loop are higher than the second microwave signal board is the third lug connection, receive the conducting film of ACF or ACP between first lug connection and the third lug connection and switch on through the conducting film of ACF, and then make the microwave signal pass into the second microwave signal board by first microwave signal board perpendicularly.
In the invention, the technical schemes can be combined with each other to realize more preferable combination schemes. Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and drawings.
Drawings
The drawings are only for purposes of illustrating particular embodiments and are not to be construed as limiting the invention, wherein like reference numerals are used to designate like parts throughout.
Fig. 1 is a schematic view of a vertical interconnection structure of microwave signals applied between multilayer printed circuit boards according to embodiment 1 of the present invention;
fig. 2 is a schematic diagram of a vertical interconnection of microwave signals according to embodiment 1 of the present invention;
fig. 3 is a schematic structural diagram of a first interconnect interface according to embodiment 1 of the present invention;
fig. 4 is a schematic structural diagram of a second interconnect interface according to embodiment 2 of the present invention;
fig. 5 is a schematic view of a second microwave signal board interface according to embodiment 1 of the present invention;
fig. 6 is a schematic view of a first groove structure on a shielding plate according to embodiment 1 of the present invention;
fig. 7 is a schematic diagram illustrating a microwave signal transmission assembly according to embodiment 1 of the present invention;
fig. 8 is a schematic view illustrating an assembly process of a microwave signal vertical interconnect structure according to embodiment 1 of the present invention;
FIG. 9 is a vertical cross-sectional view of a metallized hole in the case of a second strip line on a second microwave signal board provided in example 3;
FIG. 10 is a top view of the metallized hole in the case of the second strip line on the second microwave signal board provided in example 3;
FIG. 11 is a vertical sectional view of a coupling slit in the case of a second strip line on a second microwave signal board according to example 3;
FIG. 12 is a plan view of a coupling slit in the case of a second strip line on a second microwave signal board according to example 3;
fig. 13 is a vertical cross-sectional view of a metalized hole when a second microstrip line is disposed on a second microwave signal board provided in embodiment 3;
fig. 14 is a top view of a metallized hole in a second microstrip line on a second microwave signal board provided in embodiment 3;
fig. 15 is a vertical sectional view of a coupling slot in the case of a second microstrip line on a second microwave signal board provided in embodiment 3;
fig. 16 is a top view of a coupling slot in the case of a second microstrip line on a second microwave signal board provided in embodiment 3.
Reference numerals:
1-a first microwave signal plate; 2-a second microwave signal plate; 3-microwave signal shielding plate; 4-microwave signal transmission line; 5-a first signal contact; 6-a second signal contact; 7-a first metal ground contact; 8-a second metal ground contact; 9-a third signal contact; 10-rectangular ground ring; 11-a first groove; 12-briquetting; 13-light film; 14-metal or non-metal flat plate; 15-connecting the surface with the first microwave signal plate; 16-through shield holes; 17-metallized holes; 18-a non-through shielding hole; 19-a second stripline; 20-coupling slot; 21-second microstrip line.
Detailed Description
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate preferred embodiments of the invention and together with the description, serve to explain the principles of the invention and not to limit the scope of the invention.
Example 1
The present embodiment provides a vertical interconnection structure of microwave signals between printed circuit boards, as shown in fig. 1-3 and 5-8, including a first microwave signal board 1, a second microwave signal board 2, a conductive adhesive film, and a microwave signal shielding board 3; microwave signal transmission lines 4 are arranged on the first microwave signal plate 1 and the second microwave signal plate 2; the first microwave signal plates 1 and the microwave signal shielding plates 3 are arranged at intervals and contacted with each other to form a microwave signal transmission assembly, and the microwave signal shielding plates 3 are arranged on the two outer side surfaces of the microwave signal transmission assembly; the microwave signal transmission assembly is perpendicular to the second microwave signal plate 2, the first microwave signal plate 1 is connected with the second microwave signal plate 2 through a conductive adhesive film, and microwave signals are vertically transmitted into the second microwave signal plate 2 through the first microwave signal plate 1.
Specifically, the microwave signal vertical interconnection structure is mainly applied among multilayer printed circuit boards, and comprises a first microwave signal plate 1, a second microwave signal plate 2 and microwave signal shielding plates 3, wherein the first microwave signal plate 1 and the microwave signal shielding plates 3 are arranged at intervals, the microwave signal shielding plates 3 are arranged between two adjacent first microwave signal plates 1 and at two sides of the two adjacent first microwave signal plates 1, and the microwave signal shielding plates 3 are used for shielding microwave signals of a vertical interconnection part between the two adjacent first microwave signal plates 1 and improving the isolation degree of the vertical interconnection part; the microwave signal transmission assembly comprises a first microwave signal plate 1 and microwave signal shielding plates 3 arranged on two sides of the first microwave signal plate, and is formed after clamping treatment, the microwave signal transmission assembly is integrally pressed on a second microwave signal plate 2 and is vertically arranged with the second microwave signal plate 2, a microwave signal transmission line 4 on the first microwave signal plate 1 is connected with an interface on the first microwave signal plate 1, an interface on the first microwave signal plate 1 is connected with a second microwave signal interface, a microwave signal is vertically transmitted into the second microwave signal interface through the microwave signal transmission assembly, and the microwave signal is transmitted through the microwave signal transmission line 4 on the second microwave signal plate 2, and finally, the microwave signal is vertically transmitted under the condition that a microwave connector is not arranged.
When the assembly relationship between the two multilayer printed boards is vertical, a microwave signal is transmitted from one printed board to the other printed board, and the prior art adopts a microwave connector implementation mode; however, the microwave connector occupies a certain volume, and cannot achieve higher interconnection density. If the microwave connector is not adopted, the microwave signal vertical interconnection between the multilayer printed boards cannot be realized by bonding wire bonding, solder ball bonding and other modes. According to the microwave signal vertical interconnection structure, on the basis that a microwave connector is not adopted, the microwave signal interconnection mode among the multilayer printed circuit boards is realized, the microwave signal vertical interconnection structure is suitable for a miniaturized and high-integration phased array radar system, and the problems that the interconnection density is low and the like in the existing microwave signal interconnection mode applied among the multilayer printed circuit boards are solved.
When the microwave signal transmission line 4 is arranged on the surface of the first microwave signal plate 1, a first microstrip line is formed; the first microstrip line extends to the edge of the first microwave signal plate 1 and leads out a first signal contact 5; first metal grounding contacts 7 are respectively arranged on two sides of the first signal contact 5, and a first blank area is arranged between the first metal grounding contacts 7 and the first signal contact 5; the first signal contact 5, the first metal grounding contact 7 and the first margin area form a first interconnection interface of the first microwave signal plate 1; the first interconnection interface is correspondingly connected with the second microwave signal board 2 interface.
Exemplarily, the microwave signal transmission line 4 is disposed in the middle of the surface of the first microwave signal board 1 and is parallel to the edge of the first microwave signal board 1, the microwave signal transmission line 4 is a first microstrip line, two ends of the first microstrip line extend to the edge of the first microwave signal board 1 and lead out a first signal contact 5, the first signal contact 5 is disposed on the other side of the first microwave signal board 1, and the first signal contact 5 is perpendicular to the first microstrip line; first metal grounding contacts 7 perpendicular to the first signal contacts 5 are arranged on two sides of the first signal contacts 5, and first blank areas with the same width are arranged between the two first metal grounding contacts 7 and the first signal contacts 5; the first signal contact 5, the first metal grounding contact 7 and the first margin area jointly form a first interconnection interface of the first microwave signal plate 1; the first interconnection interface is correspondingly connected with the second microwave signal plate 2 interface; after the microwave signal is transmitted into the microwave signal transmission assembly, the microwave signal is transmitted into the second microwave signal plate 2 through the first interconnection interface and the second microwave signal interface, and finally, the vertical interconnection of the microwave signal is realized under the condition that the microwave connector is not arranged.
In order to avoid the first signal contact 5 contacting the microwave signal shielding plate 3 made of metal material, the microwave signal shielding plates on two sides of the first microwave signal plate 1 are provided with corresponding first grooves 11, the projections of the first signal contact 5 on the microwave signal shielding plates on two sides are arranged in the first grooves 11, and the length of the first grooves 11 is equal to the length of the first microstrip line.
Specifically, two surfaces of the first microwave signal plate 1, which are in contact with the microwave signal shielding plate 3, are respectively provided with a first microstrip line, a first groove 11 is correspondingly arranged at a projection position of the first microstrip line on the microwave shielding plate adjacent to the first microwave signal plate 1, the width of the first groove 11 is greater than that of the first signal contact 5, an opening of the first groove 11 is connected with one side of the first metal grounding contact 7, which is close to the first signal contact 5, and the length of the first groove 11 is equal to that of the first microstrip line, so that the first microstrip line is prevented from contacting the microwave signal shielding plate 3 made of a metal material.
In order to enable the interface of the second microwave signal board 2 to correspond to and be matched with the first interconnection interface, a third signal contact 9 is arranged on the second microwave signal board 2, the third signal contact 9 is rectangular, a rectangular grounding ring 10 is arranged on the outer side of the third signal contact 9, a third blank area is arranged between the third signal contact 9 and the rectangular grounding ring 10, and the third signal contact 9, the rectangular grounding ring 10 and the third blank area form the interface of the second microwave signal board 2.
Specifically, a third signal contact 9 is arranged on one surface, which is in contact with the microwave signal transmission assembly, of the second microwave signal plate 2, the third signal contact 9 is rectangular, a rectangular grounding ring 10 is arranged on the inner side of the third signal contact 9, a third blank area is arranged between the rectangular third signal contact 9 and the rectangular grounding ring 10, the third signal contact 9, the rectangular grounding ring 10 and the third blank area form an interface of the second microwave signal plate 2, and the second microwave interface is vertically interconnected with the first interconnection interface; the conductive film is arranged between the first interconnection interface and the second microwave signal interface, and the conductive film is a transparent high-molecular connecting material with three characteristics of adhesion, conductivity and insulation, and is remarkably characterized by conduction in the vertical direction and insulation in the horizontal direction.
The heights of the first signal contact 5 and the first metal grounding contact 7 are 10-80 mu m; the height of the third signal contact 9 and the rectangular ground ring 10 is 10 μm to 80 μm.
Specifically, at the first interconnection port, the heights of the first signal contact 5 and the first metal ground contact 7 are 10 μm to 80 μm, the portions of the first signal contact 5 and the first metal ground contact 7, which are higher than the first microwave signal plate 1, are first bump joints, the heights of the third signal contact 9 and the rectangular ground ring 10 are 10 μm to 80 μm, the portions of the third signal contact 9 and the rectangular ground ring 10, which are higher than the second microwave signal plate 2, are third bump joints, and the first bump joints and the third bump joints are connected through an ACF (anisotropic conductive film) or an ACP (acyl carrier protein) conductive film after being pressed together, so that the microwave signals are vertically transmitted from the first microwave signal plate 1 to the second microwave signal plate 2.
In order to ensure the shielding effect between two adjacent first microwave signal plates 1, the microwave shielding plate arranged between two adjacent first microwave signal plates 1 is made of metal.
It should be emphasized that the conductive adhesive film adopted in the present application is an ACF conductive adhesive film or an ACP conductive adhesive film; after the first interconnection interface and the second microwave signal interface are accurately aligned, the microwave signal transmission assembly and the second microwave signal board 2 are pressed, the ACF conductive adhesive film or the ACP conductive adhesive film is solidified after heating and pressurizing for a period of time, the insulating film on the periphery of the particles is damaged when the bump contacts are hot-pressed, so that the particles are conducted in the vertical direction, and finally, the stable interconnection structure with vertical conduction and transverse insulation is formed.
The microwave signal vertical interconnection structure provided by the embodiment realizes the vertical transmission of microwave signals under the condition of not adopting a microwave connector, and can be used for the interconnection of microwave channels and antennas in phased array antenna feed integrated components and systems.
Example 2
The difference between the vertical interconnection structure for microwave signals between multi-layer printed circuit boards provided in this embodiment and embodiment 1 is only that the arrangement positions of the microwave signal transmission lines 4 on the first microwave signal board 1 are different, and other structures and functions are the same, and are not described herein again.
As shown in fig. 1-2 and 4-8, the microwave signal transmission line 4 of the present embodiment is disposed inside the first microwave signal board 1 and forms a first strip line; the first strip line extends to the edge of the second microwave signal plate 2 and leads out a second signal contact 6; two sides of the second signal contact 6 are provided with grounding contacts, and a second blank area is arranged between the second metal grounding contact 8 and the second signal contact 6; the second signal contact 6, the second metal grounding contact 8 and the second margin region form a second interconnection interface of the first microwave signal plate 1, and the second interconnection interface is correspondingly connected with the second microwave signal plate 2 interface.
Exemplarily, the microwave signal transmission line 4 is disposed in the middle of the inside of the second microwave signal board 2 and is parallel to the edge of the second microwave signal board 2, the microwave signal transmission line 4 is a first strip line, two ends of the first strip line extend to the edge of the second microwave signal board 2 and lead out a second signal contact 6, the second signal contact 6 is disposed on the other side of the first microwave signal board 1, and the second signal contact 6 is perpendicular to the first strip line; second metal grounding contacts 8 perpendicular to the second signal contacts 6 are arranged on two sides of the second signal contacts 6, and second white regions with the same width are arranged between the two second metal grounding contacts 8 and the second signal contacts 6; the second signal contact 6, the second metal grounding contact 8 and the second margin area jointly form a second interconnection interface of the first microwave signal plate 1; the second interconnection interface is correspondingly connected with the second microwave signal plate 2 interface; after the microwave signal is transmitted into the microwave signal transmission assembly, the microwave signal is transmitted into the second microwave signal plate 2 through the second interconnection interface and the second microwave signal interface, and finally, the vertical interconnection of the microwave signal is realized under the condition that the microwave connector is not arranged.
In order to avoid the second signal contact 6 contacting the microwave signal shielding plate 3 made of metal material, the microwave signal shielding plates on the two sides of the first microwave signal plate 1 are provided with corresponding second grooves, the projections of the first signal contacts 5 on the microwave signal shielding plates on the two sides are arranged in the second grooves, and the length of the second grooves is smaller than that of the first strip-shaped line.
Specifically, a first strip line is arranged inside the first microwave signal plate 1, a second groove is correspondingly arranged at the projection position of the first strip line on the microwave shielding plate adjacent to the first microwave signal plate 1, the width of the second groove is larger than that of the second signal contact 6, the opening of the second groove is connected with one side, close to the second signal contact 6, of the first metal grounding contact 7, the length of the second groove is smaller than that of the first strip line, so that the first strip line is prevented from contacting the microwave signal shielding plate 3 made of a metal material, and it needs to be explained that the length of the second groove can be adjusted according to the actual application condition.
The height of the second signal contact 6 and the second metal grounding contact 8 is 10-80 μm; the height of the third signal contact 9 and the rectangular ground ring 10 is 10 μm to 80 μm.
Specifically, at the second interconnection port, the heights of the second signal contact 6 and the second metal grounding contact 8 are 10 μm to 80 μm, the portions of the second signal contact 6 and the second metal grounding contact 8, which are higher than the first microwave signal plate 1, are second bump joints, the heights of the third signal contact 9 and the rectangular grounding ring 10 are 10 μm to 80 μm, the portions of the third signal contact 9 and the rectangular grounding ring 10, which are higher than the second microwave signal plate 2, are third bump joints, and the first bump joints and the third bump joints are conducted through an ACF (anisotropic conductive film) or an ACP (acyl carrier protein) conductive film after being pressed;
or, the second bump contact and the third bump contact are conducted through the ACF conductive film or the ACP conductive film after being pressed, so that the microwave signal is vertically transmitted from the first microwave signal board 1 to the second microwave signal board 2.
The microwave signal vertical interconnection structure provided by the embodiment realizes vertical transmission of microwave signals without adopting a microwave connector, and can be used for interconnection of microwave channels and antennas in phased array antenna feeder integrated components and systems.
Example 3
As shown in fig. 9 to 6, one structure of the second microwave signal plate of the present embodiment is:
the microwave signal transmission line is arranged in the second microwave signal plate and forms a second strip line 19, and the third signal contact is connected with the second strip line 19 through the metalized hole 17; through shielding holes 16 and non-through shielding holes 18 which are arranged at intervals are formed in the outer side of the metalized hole 17 along the circumferential direction, and the through shielding holes 16 and the non-through shielding holes 18 are connected with the rectangular grounding ring.
The second structure of the second microwave signal plate of this embodiment is:
the microwave signal transmission line is arranged in the second microwave signal plate and forms a second strip line 19, a metal shielding plate is arranged in the second microwave signal plate, a coupling seam 20 is arranged on the metal shielding plate, and the third signal contact transmits electromagnetic energy to the second strip line 19 through the coupling seam 20.
The third structure of the second microwave signal plate of this embodiment is:
when the microwave signal transmission line on the second microwave signal board is a second microstrip line 21, the third signal contact is connected with the second microstrip line 21 through the metalized hole 17; through shielding holes 16 and non-through shielding holes 18 which are arranged at intervals are formed in the outer side of the metalized hole 17 along the circumferential direction, and the through shielding holes 16 and the non-through shielding holes 18 are connected with the rectangular grounding ring.
The fourth structure of the second microwave signal board of this embodiment is:
the microwave signal transmission line on the second microwave signal plate is a second microstrip line 21; a metal shielding plate is arranged in the second microwave signal plate, a coupling seam 20 is arranged on the metal shielding plate, and the third signal contact transmits electromagnetic energy to the second microstrip line 21 through the coupling seam 20.
Example 4
In this embodiment, a vertical interconnection method of microwave signals applied between multiple layers of printed circuit boards is provided, where, by using the vertical interconnection structure of microwave signals applied between multiple layers of printed circuit boards provided in embodiment 1, when the first microwave signal board 1 employs the first microstrip line, the microwave signal transmission line is disposed inside the second microwave signal board 2 and forms the second strip line 19, and the vertical interconnection method of microwave signals in this embodiment includes the following steps:
In step 3, in order to avoid the top of the microwave signal transmission assembly from being compressed by some plates due to the tolerance on the lengths of the first microwave signal plate 1 and the microwave signal shielding plate 3, the bottom of the pressing block 12 is provided with a layer of light film 13, the light film 13 can avoid the above situation, and the pressing block 12 can ensure that the pressure on each first microwave signal plate 1 and the microwave signal shielding plate 3 is uniform and stable.
It should be noted that, the ACF conductive adhesive film or the ACP conductive adhesive film needs to be bonded and cured at a specific temperature and pressure, and the temperature of the whole bonding process can be provided by a constant temperature oven. And the temperature of the bonding process needs to be provided by the compact 12.
Example 4
In this embodiment, a vertical interconnection method of microwave signals applied between multiple layers of printed circuit boards is provided, where, by using the vertical interconnection structure of microwave signals applied between multiple layers of printed circuit boards provided in embodiment 2, when the first microwave signal board 1 employs the first strip line, the microwave signal transmission line on the second microwave signal board 2 is the second microstrip line 21, and the vertical interconnection method of microwave signals in this embodiment includes the following steps:
In step 3, in order to avoid the top of the microwave signal transmission assembly from being compressed by some plates due to the tolerance on the lengths of the first microwave signal plate 1 and the microwave signal shielding plate 3, the bottom of the pressing block 12 is provided with a layer of light film 13, the light film 13 can avoid the above situation, and the pressing block 12 can ensure that the pressure on each first microwave signal plate 1 and the microwave signal shielding plate 3 is uniform and stable.
It should be noted that, the ACF conductive adhesive film or the ACP conductive adhesive film needs to be bonded and cured at a specific temperature and pressure, and the temperature of the whole bonding process can be provided by a constant temperature oven. And the temperature of the bonding process needs to be provided by the compact 12.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention.
Claims (12)
1. A microwave signal vertical interconnection structure between printed circuit boards is characterized by comprising a first microwave signal board, a second microwave signal board, a conductive adhesive film and a microwave signal shielding board;
microwave signal transmission lines are arranged on the first microwave signal plate and the second microwave signal plate; the first microwave signal plate and the microwave signal shielding plate are arranged and contacted with each other to form a microwave signal transmission assembly, and two outer side surfaces of the microwave signal transmission assembly are provided with the microwave signal shielding plates; a hard flat plate for clamping the microwave signal transmission assembly is arranged on the outer side of the microwave signal transmission assembly, a pressing block is arranged above the microwave signal transmission assembly, and a light thin layer is arranged between the bottom of the pressing block and the microwave signal transmission assembly;
the microwave signal transmission assembly is perpendicular to the second microwave signal board, the first microwave signal board is connected with the second microwave signal board through an ACF (anisotropic conductive film) or ACP (acyl carrier gas) conductive film, and microwave signals are vertically transmitted into a second microwave signal board interface through the first microwave signal board.
2. The vertical interconnection structure for microwave signals between printed circuit boards according to claim 1, wherein a third signal contact is disposed on the second microwave signal board, the third signal contact is rectangular, a rectangular ground ring is disposed outside the third signal contact, a third blanking area is disposed between the third signal contact and the rectangular ground ring, and the third signal contact, the rectangular ground ring and the third blanking area form a second microwave signal board interface.
3. The vertical microwave signal interconnection structure between printed circuit boards of claim 2, wherein the microwave signal transmission line is disposed inside the second microwave signal board and forms a second strip line, and the third signal contact is connected to the second strip line through a metallized hole; the metallization hole outside is equipped with alternately along the circumferencial direction and link up shielding hole and non-through shielding hole, link up shielding hole and non-through shielding hole and all be connected with the rectangle ground loop.
4. The vertical interconnection structure for microwave signals between printed circuit boards according to claim 2, wherein the microwave signal transmission line is disposed on a surface of the second microwave signal board and forms a second strip line, a metal shielding plate is disposed in the second microwave signal board, a coupling slit is disposed on the metal shielding plate, and the third signal contact transmits electromagnetic energy to the second strip line through the coupling slit.
5. The vertical interconnection structure of microwave signals between printed circuit boards according to claim 3 or 4, wherein the microwave signal transmission line is disposed on a surface of the first microwave signal board and forms a first microstrip line; the first microstrip line extends to the edge of the first microwave signal plate and leads out a first signal contact; first metal grounding contacts are respectively arranged on two sides of the first signal contact, and a first blank area is arranged between the first metal grounding contacts and the first signal contact; the first signal contact, the first metal grounding contact and the first blank area form a first interconnection interface of the first microwave signal plate; the first interconnection interface is correspondingly connected with the second microwave signal board interface.
6. The vertical interconnection structure for microwave signals between printed circuit boards according to claim 3 or 4, wherein the microwave signal transmission line is provided inside the first microwave signal board and forms a first strip line; the first strip line extends to the edge of the second microwave signal plate and leads out a second signal contact; second metal grounding contacts are respectively arranged on two sides of the second signal contact, and a second white space is arranged between the second metal grounding contacts and the second signal contact; and the second signal contact, the second metal grounding contact and the second blank area form a second interconnection interface, and the second interconnection interface is correspondingly and vertically connected with the second microwave signal board interface.
7. The vertical interconnection structure for microwave signals between printed circuit boards according to claim 5, wherein the microwave signal shielding plates on both sides of the first microwave signal plate are provided with corresponding first grooves, the projections of the first signal contacts on the microwave signal shielding plates on both sides fall in the first grooves, and the length of the first grooves is equal to the length of the first microstrip lines.
8. The vertical interconnection structure for microwave signals between printed circuit boards according to claim 6, wherein the microwave signal shielding plates on both sides of the first microwave signal plate are provided with corresponding second grooves, projections of the second signal contacts on the microwave signal shielding plates on both sides fall in the second grooves, and the length of the second grooves is smaller than that of the first strip line.
9. A vertical interconnection method of microwave signals applied between multilayer printed circuit boards, wherein the vertical interconnection structure of microwave signals between printed circuit boards according to claim 3 is adopted, and when the first microwave signal board adopts the first microstrip line, the microwave signal transmission line is provided on the surface of the second microwave signal board and forms the second strip line, the vertical interconnection method of microwave signals comprises the following steps:
the method comprises the following steps that 1, a first microwave signal plate and microwave shielding plates are arranged between the first microwave signal plate and the second microwave signal plate, the microwave signal shielding plates are arranged on two sides of the first microwave signal plate and form microwave signal transmission assemblies, and the microwave signal transmission assemblies are clamped by metal or nonmetal hard plates;
step 2, coating an ACF conductive adhesive film or an ACP conductive adhesive film on the contact surface of the microwave signal transmission assembly and the second microwave signal plate, then integrally placing the clamped microwave signal transmission assembly on the second microwave signal plate, and enabling the first interconnection interface of the first microwave signal plate to be matched with the second microwave signal plate interface;
and 3, arranging a pressing block with certain mass above the microwave signal transmission assembly, arranging a layer of light film at the bottom of the pressing block, pressing the microwave signal transmission assembly down by the pressing block, conducting the first bump contact and the third bump contact after being pressed together through an ACF (anisotropic conductive film) or an ACP (ACP) conductive film, and connecting the third signal contact with the second strip line through a metalized hole.
10. A vertical interconnection method of microwave signals applied between multilayer printed circuit boards, wherein the vertical interconnection structure of microwave signals between printed circuit boards according to claim 3 is used, and when a first strip line is used for a first microwave signal board, a microwave signal transmission line on a second microwave signal board is a second strip line, the vertical interconnection method of microwave signals comprising the steps of:
step 1, arranging a first microwave signal plate and microwave shielding plates, wherein the microwave signal shielding plates are arranged on two sides of the first microwave signal plate and form a microwave signal transmission assembly, and the microwave signal transmission assembly is clamped by a metal or nonmetal hard plate;
step 2, coating an ACF conductive adhesive film or an ACP conductive adhesive film on the contact surface of the microwave signal transmission assembly and the second microwave signal plate, then integrally placing the clamped microwave signal transmission assembly on the second microwave signal plate, and enabling a second interconnection interface of the first microwave signal plate to be matched with an interface of the second microwave signal plate;
and 3, arranging a pressing block with certain mass above the microwave signal transmission assembly, arranging a layer of light film at the bottom of the pressing block, pressing the microwave signal transmission assembly down by the pressing block, conducting the second bump joint and the third bump joint through an ACF (anisotropic conductive film) or an ACP (Acrylonitrile contact) conductive film after being pressed, and connecting the third signal contact with the second strip line through a metalized hole.
11. A vertical interconnection method of microwave signals applied between multilayer printed circuit boards, characterized in that, by using the vertical interconnection structure of microwave signals between printed circuit boards of claim 4, when the first microwave signal board uses the first microstrip line, the microwave signal transmission line is disposed on the surface of the second microwave signal board and forms the second strip line, the vertical interconnection method of microwave signals comprises the following steps:
the method comprises the following steps that 1, a first microwave signal plate and microwave shielding plates are arranged between the first microwave signal plate and the second microwave signal plate, the microwave signal shielding plates are arranged on two sides of the first microwave signal plate and form microwave signal transmission assemblies, and the microwave signal transmission assemblies are clamped by metal or nonmetal hard plates;
step 2, coating an ACF conductive adhesive film or an ACP conductive adhesive film on the contact surface of the microwave signal transmission assembly and the second microwave signal plate, then integrally placing the clamped microwave signal transmission assembly on the second microwave signal plate, and enabling the first interconnection interface of the first microwave signal plate to be matched with the second microwave signal plate interface;
and 3, placing a pressing block with certain mass above the microwave signal transmission assembly, arranging a layer of light film at the bottom of the pressing block, pressing the microwave signal transmission assembly down by the pressing block, conducting the first bump joint and the third bump joint through an ACF (anisotropic conductive film) or an ACP (Acp conductive film) after being pressed, and transmitting electromagnetic energy to a second strip line by the third signal contact through the coupling seam.
12. A vertical interconnection method of microwave signals applied between multilayer printed circuit boards, wherein the vertical interconnection structure of microwave signals between printed circuit boards according to claim 4 is used, and when a first strip line is used for a first microwave signal board, a microwave signal transmission line on a second microwave signal board is a second strip line, the vertical interconnection method of microwave signals comprising the steps of:
step 1, arranging a first microwave signal plate and microwave shielding plates, wherein the microwave signal shielding plates are arranged on two sides of the first microwave signal plate and form a microwave signal transmission assembly, and the microwave signal transmission assembly is clamped by a metal or nonmetal hard plate;
step 2, coating an ACF conductive adhesive film or an ACP conductive adhesive film on the contact surface of the microwave signal transmission assembly and the second microwave signal plate, then integrally placing the clamped microwave signal transmission assembly on the second microwave signal plate, and enabling a second interconnection interface of the first microwave signal plate to be matched with an interface of the second microwave signal plate;
and 3, placing a pressing block with certain mass above the microwave signal transmission assembly, arranging a layer of light film at the bottom of the pressing block, pressing the microwave signal transmission assembly down by the pressing block, conducting the second bump joint and the third bump joint through an ACF (anisotropic conductive film) or an ACP (anisotropic conductive film) after being pressed, and transmitting electromagnetic energy to a second strip line through the third signal contact through the coupling seam.
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| CN110021831A (en) * | 2019-04-17 | 2019-07-16 | 中国电子科技集团公司第十三研究所 | Microwave vertical transition connection structure and microwave device |
| CN214378932U (en) * | 2020-10-30 | 2021-10-08 | 中兴通讯股份有限公司 | Signal interconnection device and communication equipment |
| CN117250413B (en) * | 2023-11-20 | 2024-02-20 | 南京奥联智驾科技有限公司 | Testing device for antenna |
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