CN111095505B - Adhesive film for semiconductor device manufacturing and manufacturing method thereof, and semiconductor device and manufacturing method thereof - Google Patents

Abstract

The manufacturing method of an adhesive film for semiconductor device manufacturing of the present disclosure includes the following steps in order: (A) preparing a carrier film having a strip shape with a width of at least 100 mm or less and an adhesive layer formed to cover the surface of the carrier film The step of the laminate; and (B) the step of die-cutting the adhesive layer to obtain a plurality of adhesive sheets arranged on the carrier film in a manner arranged in the longitudinal direction of the carrier film, wherein, When die-cutting is performed in the step (B), cuts are made in the adhesive layer and the carrier film so as to satisfy the conditions shown in the following inequality (1), and the adhesive sheet has a shape in at least one side of the rectangle or square. A shape having at least one of a convex part and a concave part is formed. In the formula, D is the depth of the cut relative to the carrier film (unit μm), and T is the thickness of the carrier film (unit μm). 0<D/T≤0.6(1).

Description

Adhesive film for semiconductor device manufacturing and manufacturing method thereof, and semiconductor device and its manufacturing method

Technical field

The present disclosure relates to an adhesive film used in a manufacturing process of a semiconductor device and a manufacturing method thereof, as well as a semiconductor device and a manufacturing method thereof.

Background technique

Conventionally, semiconductor devices have been manufactured through the following processes. First, the semiconductor wafer is bonded to the adhesive sheet for dicing, and in this state, the semiconductor wafer is diced into semiconductor chips. After that, a pick-up process, a mounting process, a reflow process, a chip bonding process, etc. are implemented. Patent Document 1 discloses an adhesive sheet (dicing-die bonding sheet) that has both the function of fixing the semiconductor wafer in the dicing process and the function of bonding the semiconductor chip and the substrate in the die bonding process.

Existing patent documents

patent documents

Patent Document 1: Japanese Patent Application Publication No. 2007-288170

Contents of the invention

The technical problem to be solved by the invention

However, in recent years, with the development of semiconductor devices for small devices such as smartphones, the manufacturing process of semiconductor devices has also changed significantly compared with the past. For example, the practical application of a process without performing the dicing process and the die bonding process using the adhesive sheet (dicing-die bonding sheet) described in Patent Document 1, or the process without performing the reflow process has been developed. At the same time, new methods are also required for adhesive films used in the manufacturing process of semiconductor devices. In addition to this situation, in order to cope with the increase in functionality and thinness of small-sized devices equipped with semiconductor devices, the inventors of the present invention have developed an adhesive that is convenient for bonding semiconductor chips of corresponding shapes to a limited specific area of a substrate. The development of splicing film.

In conventional semiconductor devices, generally speaking, the shape of the semiconductor chip is the same as the shape of the adhesive sheet used to bond the semiconductor chip to the substrate. For example, their shapes are rectangular or square. However, for example, when the area of the substrate to which the semiconductor chip is to be bonded is limited, or when electrical connection between the semiconductor chip and the substrate is required at a different position than conventional ones, an adhesive sheet with a more complicated shape than conventional shapes is used. Demand has increased.

An object of the present disclosure is to provide an adhesive film including a complex-shaped adhesive sheet useful for efficiently performing an adhesive process in a manufacturing process of a semiconductor device, and a method for manufacturing the adhesive film with sufficient stability. Another object of the present disclosure is to provide a semiconductor device using a complex-shaped adhesive sheet and a manufacturing method thereof.

Means used to solve technical problems

The present disclosure provides a method of manufacturing an adhesive film used in a manufacturing process of a semiconductor device. The manufacturing method includes the following steps in sequence:

(A) The step of preparing a laminate having at least a strip-shaped carrier film with a width of 100 mm or less and an adhesive layer formed to cover the surface of the carrier film;

(B) a process of die-cutting the adhesive layer to obtain a plurality of adhesive sheets arranged on the carrier film so as to be arranged in the longitudinal direction of the carrier film,

When die-cutting is performed in step (B), the adhesive layer and the carrier film are notched in such a manner that the conditions shown in the following inequality (1) are satisfied,

The adhesive sheet has a shape in which at least one of a convex portion and a concave portion is formed on at least one side of a rectangle or a square,

0<D/T≤0.6 (1)

[In the formula, D is the depth of the cut relative to the carrier film (unit: μm), and T is the thickness of the carrier film (unit: μm). ]

By passing through the above-mentioned steps (A) and (B), it is possible to manufacture a strip-shaped carrier film having a width of 100 mm or less and a plurality of adhesive sheets arranged on the carrier film so as to be arranged in the longitudinal direction of the carrier film. adhesive film. In the step (B), by making cuts so as to satisfy the conditions shown in the inequality (1), the adhesive film having the above structure can be produced with sufficient stability.

As mentioned above, the adhesive sheet has a more complicated shape than a rectangle or a square. The shape of the adhesive sheet may be appropriately set according to the shape of the region of the substrate to which the semiconductor chip is to be bonded or the shape of the semiconductor chip. For example, the adhesive sheet may have 6 or more corners, or may have 8 or more corners. An example of the shape of the adhesive sheet having six corners is an L-shape.

The adhesive film produced by the above-mentioned production method may further include a protective member covering the surfaces of the plurality of adhesive sheets. That is, the laminated body prepared in the (A) step may further have a protective film arranged to cover the adhesive layer, and in the (B) step, the laminated body prepared in the (A) step may be configured so as to satisfy the condition represented by the above inequality (1). The protective film, adhesive layer and carrier film are engraved with incisions. In the step (B), the protective film is die-cut together with the adhesive layer, so that the adhesive sheet is in a state covered with the protective member. This protective member covers the second surface of the adhesive sheet on the opposite side to the first surface on the carrier film side, and has the same shape as the adhesive sheet. By covering the adhesive sheet with the protective member, dust and the like can be prevented from adhering to the adhesive sheet before use.

The present disclosure provides an adhesive film used in a manufacturing process of a semiconductor device. The adhesive film includes: a strip-shaped carrier film with a width of 100 mm or less; a plurality of adhesive sheets arranged on the carrier film so as to be arranged in the longitudinal direction of the carrier film; and a plurality of adhesive sheets arranged along the length of the adhesive sheet. The incision is formed on the carrier film in the form of an outer edge. The depth of the incision and the thickness of the carrier film satisfy the conditions shown in the following inequality (1). The adhesive sheet has a convex portion formed on at least one side of the rectangle or square. and the shape of at least one of the recesses,

0<D/T≤0.6 (1)

[In the formula, D is the depth of the cut relative to the carrier film (unit: μm), and T is the thickness of the carrier film (unit: μm)].

According to this adhesive film, a plurality of adhesive sheets arranged on the carrier film can be picked up in order, and then each adhesive sheet can be arranged in a predetermined area of the substrate, and the bonding process of the substrate and the semiconductor chip can be efficiently performed. . For example, if a tape-shaped adhesive film is rolled into a reel, the bonding process can be performed more efficiently by the roll-to-roll method. The shape of the adhesive sheet may be appropriately set according to the shape of the region of the substrate to which the semiconductor chip is to be bonded or the shape of the semiconductor chip. The thickness of the carrier film is, for example, 10 to 200 μm.

The size, number, etc. of the adhesive sheets arranged on the carrier film may be appropriately set according to the design of the semiconductor device to be manufactured. For example, the area of one adhesive sheet may be in the range of 10 to 200 mm ² . The proportion of the area of the surface of the carrier film covered by the plurality of adhesive sheets may be 10 to 60% based on the area of the carrier film. One or more rows composed of the plurality of adhesive sheets may be formed on the carrier film.

The adhesive film may further include a protective member that covers the second surface of the adhesive sheet opposite to the first surface on the carrier film side and has the same shape as the adhesive sheet. By covering the adhesive sheet with the protective member, dust and the like can be prevented from adhering to the adhesive sheet before use.

From the viewpoint of the processability of the adhesive film (the viewpoint of preventing the adhesive sheet from being inadvertently peeled off from the carrier film during and after die-cutting), the adhesion force between the carrier film and the adhesive sheet is preferably 2 N/ m or above.

Invention effect

According to the present disclosure, it is possible to provide an adhesive film including a complex-shaped adhesive sheet useful for efficiently carrying out the bonding process in the manufacturing process of a semiconductor device, and a method for manufacturing the adhesive film with sufficient stability. In addition, according to the present disclosure, a semiconductor device using a complex-shaped adhesive sheet and a manufacturing method thereof can be provided.

Description of drawings

FIG. 1 is a perspective view schematically showing one embodiment of the adhesive film of the present disclosure.

FIG. 2 is a cross-sectional view along line II-II shown in FIG. 1 .

3(a) to 3(f) are plan views showing changes in the shape of the adhesive sheet.

FIG. 4 is a plan view showing an example of the arrangement of a T-shaped adhesive sheet and a semiconductor chip.

FIG. 5 is a cross-sectional view schematically showing a laminate in which a carrier film, an adhesive layer, and a protective film are laminated in this order.

FIG. 6 is a perspective view showing a state in which a plurality of adhesive sheets are formed on a carrier film by die-cutting.

7 is a cross-sectional view schematically showing how the adhesive sheet and the protective member covering the adhesive sheet are picked up from the carrier film.

8 is a cross-sectional view schematically showing an example of a semiconductor device manufactured using the adhesive sheet of the present disclosure.

9(a) is a cross-sectional view schematically showing an apparatus used for evaluation of pick-up properties in Examples and Comparative Examples, and is a cross-sectional view showing an adhesive sheet peeling off from a carrier film at a corner portion of a binder clip , Figure 9(b) is a cross-sectional view showing the state in which the adhesive sheet passes through the corner portion in a state of being in close contact with the carrier film.

Detailed ways

Embodiments of the present disclosure will be described below with reference to the drawings as appropriate. In addition, the present invention is not limited to the following embodiments. In this specification, (meth)acrylic acid means acrylic acid or methacrylic acid.

<Adhesive film for semiconductor device manufacturing>

FIG. 1 is a perspective view schematically showing the adhesive film of this embodiment. FIG. 2 is a cross-sectional view along line II-II shown in FIG. 1 . The adhesive film 10 shown in these figures includes: a strip-shaped carrier film 1 with a width of 100 mm or less; and 1 is arranged on the carrier film in the longitudinal direction (the direction of the arrow X shown in FIG. 1 ). a plurality of adhesive sheets 3p; a protective member 5p that covers the surface F2 of the adhesive sheet 3p and has the same shape as the adhesive sheet 3p; and is formed on the carrier along the outer edge of the adhesive sheet 3p Cut mark 1c on film 1. As shown in FIG. 2 , surface F2 (second surface) of the adhesive sheet 3 p is the surface opposite to the surface F1 (first surface) of the adhesive sheet 3 p on the carrier film 1 side.

The adhesive film 10 can be used in various bonding processes in the manufacturing process of semiconductor devices (for example, bonding between a semiconductor chip and a substrate). According to the adhesive film 10, a plurality of adhesive sheets 3p arranged in an array on the carrier film 1 can be picked up in order, and then each adhesive sheet 3p can be arranged on a predetermined area of the substrate, and the substrate and semiconductor can be efficiently connected. Chip bonding process. In addition, FIGS. 1 and 2 illustrate a case where one row 3A composed of a plurality of adhesive sheets 3 p is provided on the carrier film 1 , but two or more rows 3A may be provided on the carrier film 1 .

The adhesive sheet 3p of this embodiment has a shape like a thick T (T-shape) as shown in FIG. 1 . As shown in Figure 3(a), this shape has eight corners C1 to C8. In addition, this shape can be said to be a shape in which one convex portion is formed in the center of one side of the rectangle, or it can be said to be a shape in which one concave portion is formed at both ends of one side of the rectangle.

The shape of the adhesive sheet 3p is not limited to the shape shown in FIG. 3(a) , as long as it is a shape in which at least one of a convex part and a recessed part is formed on at least one side of a rectangle or a square. For example, it may be L-shaped as shown in FIG. 3(b) and may have six corners C1 to C6. As shown in FIG. 3(c) , a recessed portion may be formed in a rectangular or square shape and may have eight corners C1 to C8. Alternatively, as shown in Figure 3(d), a recess may be formed at one corner of the rectangle or square (the lower left in Figure 3(d)) and a convex part may be formed on one side (the right side in Figure 3(d)). The shape of the part has 10 corners C1 to C10. As shown in FIG. 3(e) , a rectangular or square shape may be formed in which a convex part is formed on one side and a concave part is formed on the other side, and has 12 corners C1 to C12. In addition, the shape of the concave portion or the convex portion may be triangular or arc-shaped as shown in FIG. 3(f).

The shape of the adhesive sheet may be appropriately set according to the shape of the region of the substrate to which the semiconductor chip is to be bonded or the shape of the semiconductor chip. In addition, when the shape of the semiconductor chip is, for example, a rectangle or a square, and a plurality of terminals are provided at the corners thereof, and it is necessary to connect these terminals to wirings on the substrate, the terminals and wirings can be connected so that the terminals and wirings are not covered by the adhesive sheet. Determine the shape of the adhesive sheet. FIG. 4 is a plan view showing an example of the arrangement of the T-shaped adhesive sheet 3 p and the rectangular semiconductor chip S. In the regions R1 and R2 shown in FIG. 4 , there is no adhesive between the substrate and the semiconductor chip, and the substrate and the semiconductor chip can be electrically connected in these regions R1 and R2 .

Assuming that the size of the adhesive sheet 3p in this embodiment is small enough, the area of one adhesive sheet 3p is, for example, 10 to 200 mm ² , or may be 20 to 160 mm ² or 25 to 100 mm ² . The proportion of the area of the surface of the carrier film 1 covered by the plurality of adhesive sheets 3p (the area ratio of the adhesive sheets) is, for example, 10 to 60% based on the area of the carrier film 1, and may also be 10 to 35%. % or 15~33%. This area ratio can be calculated by dividing the area A of one adhesive sheet 3p by the pitch (pitch P in FIG. 1 ) of the adhesive sheets 3p provided on the carrier film 1 and the width of the carrier film 1 ( The product of the width W) in Figure 1. That is, the area ratio R can be a value calculated using the following formula.

Area ratio R(%)=A/(P×W)×100

The adhesive sheet 3p and the protective member 5p covering it are formed by die cutting (refer to FIG. 6). During die-cutting, a cut 1c is formed on the carrier film 1 along the outer edge of the adhesive sheet 3p. When the depth of the cut 1c with respect to the carrier film 1 is Dμm and the thickness of the carrier film is Tμm (see FIG. 2 ), the depth of the cut 1c satisfies the condition represented by the following inequality (1), and preferably satisfies the inequality ( It is more preferable to satisfy the condition shown in 2) and the condition shown in inequality (3).

0<D/T≤0.6 (1)

0.1≤D/T≤0.6 (2)

0.15≤D/T≤0.6 (3)

When the value of D/T is a value greater than or above the lower limit value of the above-mentioned inequalities (1) to (3), even if the shape of the adhesive sheet 3p is complicated, the die-cutting shown in FIG. 6 can be performed satisfactorily. Specifically, when the adhesive sheet 3p and the protective member 5p do not adhere to the carrier film 1, it is possible to sufficiently suppress the remaining portions on the unnecessary portion 30 side. On the other hand, when the value of D/T is a value smaller than or below the upper limit value of the above-mentioned inequalities (1) to (3), the pickup shown in FIG. 7 can be performed satisfactorily. Specifically, in a state where a certain tension is applied to the adhesive film 10 , the surface of the adhesive film 10 on the carrier film 1 side is brought into contact with the wedge-shaped member 60 , and the adhesive film 10 is moved along the direction shown in FIG. 7 If the adhesive sheet 3p and the protective member 5p are moved in the direction of the arrow, as shown in the figure, the front sides of the adhesive sheet 3p and the protective member 5p are likely to float from the carrier film 1.

When the value of D/T exceeds 0.6, it is presumed that the adhesive composition constituting the adhesive sheet 3 p (adhesive layer 3 ) enters the cut mark 1 c, and thus the pick-up property is likely to become insufficient. For example, when the laminated body 20 receives excessive pressing force from the rotary body 51 and the roller 52 shown in FIG. 6 during die cutting, the value of D/T may become too large (the cut mark 1c may become too deep). )Propensity. It is presumed that this pressing force promotes the entry of the adhesive composition into the cut mark 1 c or the adhesive composition is easily exposed from the protective member 5 p. According to the inventors' studies, when using the adhesive film 10, from the viewpoint of pick-up properties, it is preferable that the exposure distance of the adhesive composition from the outer edge of the protective member 5p is less than 40 μm.

The structure of the adhesive film 10 is demonstrated below.

[Carrier film]

As mentioned above, the carrier film 1 is strip-shaped and has a width of 100 mm or less. The width of the carrier film 1 may be appropriately set according to the size of the adhesive sheet 3p arranged thereon and the number of rows 3A. For example, when the number of rows 3A is one as shown in FIG. 1 , the width of the carrier film 1 is preferably 10 to 50 mm, and may be 10 to 30 mm or 10 to 20 mm. When the width of the carrier film 1 is 10 mm or more, when the roll-to-roll method is used, it is easy to prevent the decrease in operability caused by the distortion of the carrier film 1 .

The material of the carrier film 1 is not particularly limited as long as it can sufficiently withstand the tension applied during the manufacturing process of the adhesive film 10 and the semiconductor device. The carrier film 1 is preferably transparent from the viewpoint of visibility of the adhesive sheet 3p and/or the protective member 5p disposed thereon. As the carrier film 1, polyester films such as polyethylene terephthalate films, polytetrafluoroethylene films, polyethylene films, polypropylene films, polymethylpentene films, and polyvinyl acetate films can be used. , poly-4-methylpentene-1, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer and other homopolymers or copolymers or their mixtures and other polyolefin films, polyvinyl chloride films, poly Imide film and other plastic films, etc. The carrier film 1 may have a single-layer structure or a multi-layer structure.

The thickness of the carrier film 1 may be appropriately selected within a range that does not impair operability, and may be, for example, 10 to 200 μm, 20 to 100 μm, or 25 to 80 μm. These thickness ranges are practical and economically effective ranges.

In order to improve the adhesion between the adhesive sheet 3p and the carrier film 1, the surface of the carrier film 1 can also be subjected to chemical or physical processes such as corona treatment, chromic acid treatment, ozone exposure, flame exposure, high-voltage electric shock exposure, and ionizing radiation treatment. surface treatment. As the carrier film 1, a film formed of a fluororesin with a low surface energy can also be used. Examples of such films include A-63 (release treatment agent: modified silicone type) manufactured by Teijin Film Solutions Co., Ltd. and A-31 (release treatment agent: Pt-based silicone type) manufactured by Teijin Film Solutions Co., Ltd. )wait.

In order to prevent the adhesion force of the adhesive sheet 3p to the carrier film 1 from becoming too high, a silicone release agent, a fluorine release agent, a long-chain alkyl acrylate release agent, etc. can be formed on the surface of the carrier film 1 Release layer composed of release agent.

The adhesion force between the carrier film 1 and the adhesive sheet 3p is preferably 2 N/m or more, more preferably 2 to 10 N/m, and may be 2 to 6 N/m or 2 to 4 N/m. When the adhesion force is 2 N/m or more, it is easy to prevent the adhesive sheet 3p from being inadvertently peeled off from the carrier film 1 during the production of the adhesive film 10. On the other hand, when it is 10 N/m or less, the adhesive film 3p is easily peeled off. When using the adhesive sheet 10, it is easy to stably pick up the adhesive sheet 3p and the protective member 5p covering it from the carrier film 1. In addition, the adhesion force of the adhesive sheet 3p to the carrier film 1 refers to the 90° peel strength. Specifically, it means that the carrier film 1 is prepared to have a 20 mm-width film formed of the same composition as the adhesive sheet 3p. The peel strength of the sample of the adhesive layer was measured when the adhesive layer was peeled off from the carrier film at an angle of 90° and a peeling speed of 50 mm/minute.

[Adhesive sheet]

The adhesive sheet 3 p is formed together with the protective member 5 p by simultaneously die-cutting the adhesive layer 3 formed to cover the surface of the carrier film 1 and the protective film 5 arranged to cover the adhesive layer 3 (Refer to Figure 6). The thickness of the adhesive sheet 3p may be appropriately selected within a range that does not impair operability, and may be, for example, 3 to 50 μm, 5 to 40 μm, or 7 to 30 μm. When the thickness of the adhesive sheet 3p is 3 μm or more, it is easy to ensure sufficient adhesiveness. On the other hand, when it is 50 μm or less, it is easy to suppress the adhesive composition constituting the adhesive sheet 3p from being exposed from the protective member 5p.

The adhesive composition constituting the adhesive sheet 3p may be appropriately used as long as it has properties that can be used without problems in the manufacturing process of semiconductor devices (for example, adhesiveness and heat resistance to heat of about 150° C.). Substances conventionally used in the manufacturing process of semiconductor devices may be used. The adhesive sheet 3p preferably contains a thermoplastic resin, a thermosetting resin, a curing accelerator and a filler, and may contain a photoreactive monomer, a photopolymerization initiator, etc. as needed. As substrates become thinner, substrates with low heat resistance tend to be used, which tends to require lowering the temperature of the manufacturing process of semiconductor devices. The adhesive sheet 3p is preferably capable of bonding objects under temperature conditions of 160° C. or lower.

(Thermoplastic resin)

As the thermoplastic resin, a resin having thermoplasticity, or a resin having thermoplasticity at least in an uncured state and forming a cross-linked structure after heating, can be used. As the thermoplastic resin, a (meth)acrylic copolymer having a reactive group (hereinafter sometimes referred to as a “reactive-containing (meth)acrylic copolymer").

When containing a reactive group-containing (meth)acrylic copolymer as the thermoplastic resin, the adhesive sheet 3p may also be a form that does not contain a thermosetting resin. That is, it may also be a form containing a reactive group-containing (meth)acrylic copolymer, a curing accelerator, and a filler.

Thermoplastic resin can be used individually by 1 type or in combination of 2 or more types.

Examples of the (meth)acrylic copolymer include (meth)acrylate copolymers such as acrylic resin and acrylic rubber, and acrylic rubber is preferred. Acrylic rubber is preferably formed by copolymerizing a monomer selected from (meth)acrylate and acrylonitrile, using acrylate as a main component.

Examples of (meth)acrylates include methyl acrylate, ethyl acrylate, propyl acrylate, isopropyl acrylate, butyl acrylate, isobutyl acrylate, hexyl acrylate, cyclohexyl acrylate, and 2-ethyl acrylate. Hexyl methacrylate, lauryl acrylate, methyl methacrylate, ethyl methacrylate, propyl methacrylate, isopropyl acrylate, butyl methacrylate, isobutyl methacrylate, hexyl methacrylate, Cyclohexyl methacrylate, 2-ethylhexyl methacrylate, lauryl methacrylate, etc.

As the (meth)acrylate copolymer, a copolymer containing butyl acrylate and acrylonitrile as copolymerization components and a copolymer containing ethyl acrylate and acrylonitrile as copolymerization components are preferred.

The reactive group-containing (meth)acrylic acid copolymer is preferably a reactive group-containing (meth)acrylic acid copolymer containing a (meth)acrylic acid monomer having a reactive group as a copolymerization component. Such a reactive group-containing (meth)acrylic acid copolymer can be obtained by copolymerizing a (meth)acrylic acid monomer having a reactive group and a monomer composition containing the above-mentioned monomer.

As the reactive group, from the viewpoint of improving heat resistance, epoxy group, carboxyl group, acryloyl group, methacryloyl group, hydroxyl group, and episulfide group are preferable, and among these, epoxy group is more preferable from the viewpoint of crosslinkability. group and carboxyl group.

In this embodiment, the reactive group-containing (meth)acrylic copolymer is preferably an epoxy group-containing (meth)acrylic copolymer containing a (meth)acrylic acid monomer having an epoxy group as a copolymerization component. In this case, examples of the (meth)acrylic monomer having an epoxy group include glycidyl acrylate, 4-hydroxybutyl acrylate glycidyl ether, 3,4-epoxycyclohexylmethyl acrylate, and methyl acrylate. Glycidyl acrylate, 4-hydroxybutyl methacrylate glycidyl ether, 3,4-epoxycyclohexylmethyl methacrylate, etc. From the viewpoint of heat resistance, the (meth)acrylic acid monomer having a reactive group is preferably glycidyl acrylate or glycidyl methacrylate.

The Tg of the thermoplastic resin is preferably -50°C to 50°C. When the Tg of the thermoplastic resin is 50° C. or less, the flexibility of the adhesive sheet 3p can be easily ensured. In addition, when there are unevenness when being attached to an adherend, it becomes easy to follow and has moderate adhesiveness. On the other hand, when the Tg of the thermoplastic resin is -50° C. or higher, the flexibility of the adhesive sheet 3p is easily suppressed from becoming too high, and excellent handleability, adhesiveness, and peelability can be achieved.

The Tg of a thermoplastic resin is a mid-point glass transition temperature value obtained by differential scanning calorimetry (DSC). Specifically, the Tg of a thermoplastic resin is the midpoint glass transition temperature determined by a method based on JIS K 7121:1987 by measuring the heat change at a temperature rise rate of 10°C/min and a measurement temperature of -80 to 80°C. .

The weight average molecular weight of the thermoplastic resin is preferably 100,000 or more and 2,000,000 or less. When the weight average molecular weight is 100,000 or more, heat resistance can be easily ensured when used for temporary fixation. On the other hand, when the weight average molecular weight is 2 million or less, it is easy to suppress the decrease in fluidity and adhesiveness when used for temporary fixation. From the above viewpoint, the weight average molecular weight of the thermoplastic resin is more preferably 500,000 or more and 2,000,000 or less, and further preferably 1,000,000 or more and 2,000,000 or less. In addition, the weight average molecular weight is a polystyrene-converted value obtained by gel permeation chromatography (GPC) using a calibration curve obtained from standard polystyrene.

When the (meth)acrylic copolymer having a reactive group contains glycidyl acrylate or glycidyl methacrylate as a copolymer component, their content is calculated based on the total amount, based on the total amount of the copolymer component, and is preferably 0.1 ~20 mass%, more preferably 0.5-15 mass%, further preferably 1.0-10 mass%. When the content is within the above range, it is easy to achieve all of the flexibility, adhesiveness and peelability of the adhesive sheet 3p at a higher level.

As the above-mentioned (meth)acrylic acid copolymer having a reactive group, one obtained by polymerization methods such as bead polymerization and solution superposition can also be used. Alternatively, commercially available products such as HTR-860P-3CSP (trade name, manufactured by Nagasechemtex Co., Ltd.) can also be used.

(Thermosetting resin)

The thermosetting resin can be used without particular limitation as long as it is a resin that is cured by heat. Examples of the thermosetting resin include epoxy resin, acrylic resin, silicone resin, phenolic resin, thermosetting polyimide resin, polyurethane resin, melamine resin, urea-formaldehyde resin, and the like. These resins can be used individually by 1 type or in combination of 2 or more types.

The epoxy resin is not particularly limited as long as it is cured and has a heat-resistant effect. As the epoxy resin, bifunctional epoxy resins such as bisphenol A type epoxy, novolak type epoxy resins such as phenol novolak type epoxy resin and cresol novolac type epoxy resin can be used. As the epoxy resin, conventionally known resins such as polyfunctional epoxy resin, glycidylamine type epoxy resin, heterocyclic ring-containing epoxy resin, and alicyclic epoxy resin can be used.

Examples of the bisphenol A type epoxy resin include Epikote 807, Epikote 815, Epikote 825, Epikote 827, Epikote 828, Epikote 834, Epikote 1001, Epikote 1004, Epikote 1007, and Epikote 1009 (all manufactured by Mitsubishi Chemical Co., Ltd.) , DER-330, DER-301, DER-361 (all manufactured by Dow Chemical Co., Ltd.), YD8125, YDF8170 (all manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd.), etc.

Examples of the phenol novolac type epoxy resin include Epikote 152, Epikote 154 (both manufactured by Mitsubishi Chemical Co., Ltd.), EPPN-201 (manufactured by Nippon Kayaku Co., Ltd.), DEN-438 (manufactured by Dow Chemical Co., Ltd.), and the like.

Examples of o-cresol novolac type epoxy resin include YDCN-700-10 (manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd.), EOCN-102S, EOCN-103S, EOCN-104S, EOCN-1012, EOCN-1025, EOCN-1027 (all manufactured by Nippon Kayaku Co., Ltd.), YDCN701, YDCN702, YDCN703, YDCN704 (all manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd.), etc.

Examples of polyfunctional epoxy resins include Epon 1031S (manufactured by Mitsubishi Chemical Co., Ltd.), ARALDITE0163 (manufactured by BASF JAPAN Co., Ltd.), Denacol EX-611, EX-614, EX-614B, EX-622, EX-512, EX -521, EX-421, EX-411, EX-321 (all manufactured by Nagasechemtex Co., Ltd.), etc.

Examples of amine-type epoxy resins include Epikote 604 (manufactured by Mitsubishi Chemical Co., Ltd.), YH-434 (manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd.), TETRAD-X, and TETRAD-C (both manufactured by Mitsubishi Gas Chemical Co., Ltd. ), ELM-120 (manufactured by Sumitomo Chemical Co., Ltd.), etc.

Examples of heterocyclic ring-containing epoxy resins include ARALDITE PT810 (manufactured by BASF JAPAN Co., Ltd.), ERL4234, ERL4299, ERL4221, and ERL4206 (all produced by Union Carbide Co., Ltd.). These epoxy resins can be used individually by 1 type or in combination of 2 or more types.

As a part of the epoxy resin curing agent of the thermosetting resin component, a commonly used known resin can be used. Specific examples include bisphenols having two or more phenolic hydroxyl groups in one molecule, such as amines, polyamides, acid anhydrides, polysulfides, boron trifluoride, bisphenol A, bisphenol F, and bisphenol S. , phenol novolac resin, bisphenol A novolac resin, cresol novolac resin and other phenolic resins. As the epoxy resin curing agent, phenolic resins such as phenol novolac resin, bisphenol A novolac resin, and cresol novolak resin are preferred, especially from the viewpoint of excellent resistance to electrical corrosion when absorbing moisture.

In addition, epoxy curing agents can be used simultaneously with epoxy resin or alone.

Among the above-mentioned phenolic resin curing agents, it is preferable to use those having the following properties: Phenolite LF4871, Phenolite TD-2090, Phenolite TD-2149, Phenolite VH-4150, Phenolite VH4170 (all trade names manufactured by DIC Co., Ltd.), H-1 (Meiwa Kasei Co., Ltd.) (manufactured by Mitsubishi Chemical Co., Ltd., trade name), Epicure MP402FPY, Epicure YL6065, EpicureYLH129B65, Milex XL, Milex XLC, Milex XLC-LL, Milex RN, Milex RS, and Milex VR (all manufactured by Mitsubishi Chemical Corporation, trade name).

The content of the thermosetting resin in the adhesive sheet 3p is preferably 10 to 500 parts by mass, more preferably 30 to 450 parts by mass, and even more preferably 50 to 400 parts by mass relative to 100 parts by mass of the thermoplastic resin. When the content of the thermosetting resin is within the above range, it is easy to achieve excellent adhesiveness of the adhesive sheet 3p after thermosetting.

(Curing accelerator)

Examples of curing accelerators include imidazoles, dicyandiamide derivatives, dicarboxylic acid dihydrazide, triphenylphosphine, tetraphenylphosphonium tetraphenylborate, and 2-ethyl-4-methylimidazole. -Tetraphenylborate, 1,8-diazabicyclo[5,4,0]undecene-7-tetraphenylborate, etc. These substances can be used individually by 1 type or in combination of 2 or more types.

When the adhesive sheet 3p contains a (meth)acrylic copolymer having an epoxy group, it is preferable to contain a curing accelerator for accelerating the curing of the epoxy group contained in the acrylic copolymer. Examples of the curing accelerator that accelerates curing of the epoxy group include phenol-based curing agents, acid anhydride-based curing agents, amine-based curing agents, imidazole-based curing agents, imidazoline-based curing agents, triazine-based curing agents, and phosphine-based curing agents. agent. Among them, from the viewpoint of rapid curing properties, heat resistance, and peelability, an imidazole-based curing agent that can be expected to shorten the process time and improve the workability is preferable. These compounds can be used individually by 1 type or in combination of 2 or more types.

The content of the curing accelerator in the adhesive sheet 3p is preferably 0.01 to 50 parts by mass, more preferably 0.02 to 20 parts by mass, and even more preferably 0.025 to 10 parts by mass based on 100 parts by mass of the thermoplastic resin. When the content of the curing accelerator is within the above range, there is a tendency that the curability of the adhesive sheet 3p can be improved and the decrease in storage stability can be sufficiently suppressed.

(inorganic filler)

The adhesive sheet 3p preferably contains an inorganic filler. Examples of inorganic fillers include metal fillers such as silver powder, gold powder, and copper powder, and non-metal inorganic fillers such as silica, alumina, boron nitride, titanium dioxide, glass, iron oxide, and ceramics. Inorganic fillers can be selected based on desired functionality.

The inorganic filler preferably has an organic group on its surface. By modifying the surface of the inorganic filler with an organic group, it is easy to achieve both the dispersibility in an organic solvent when preparing the varnish used to form the adhesive sheet 3p and the high elastic modulus and excellent peelability of the adhesive sheet 3p. .

The inorganic filler having an organic group on the surface can be obtained, for example, by mixing a silane coupling agent represented by the following formula (B-1) and an inorganic filler and stirring at a temperature of 30° C. or higher. The modification of the surface of the inorganic filler by organic groups can be confirmed by UV measurement, IR measurement, XPS measurement, etc.

[Chemical formula number 1]

In formula (B-1), s represents 0 or an integer of 1 to 10, and R ¹¹ , R ¹² and R ¹³ each independently represent an alkyl group having 1 to 10 carbon atoms.

Examples of the alkyl group having 1 to 10 carbon atoms include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, isopropyl, and isobutyl wait.

The alkyl group having 1 to 10 carbon atoms is preferably a methyl group, an ethyl group and a pentyl group from the viewpoint of ease of acquisition. From the viewpoint of heat resistance, X is preferably an amino group, a glycidoxy group, a mercapto group and an isocyanate group, and more preferably a glycidyloxy group and a mercapto group. From the viewpoint of suppressing film fluidity at high heat and improving heat resistance, s in formula (B-1) is preferably 0 to 5, and more preferably 0 to 4.

Examples of the silane coupling agent include trimethoxyphenylsilane, dimethyldimethoxyphenylsilane, triethoxyphenylsilane, dimethoxymethylphenylsilane, and vinyltrimethoxysilane. Silane, vinyltriethoxysilane, vinyltris(2-methoxyethoxy)silane, N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane, N- (2-Aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane Silane, 3-glycidoxypropylmethyldimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-isocyanatepropyltriethoxysilane, 3- Methacryloyloxypropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, N-(1,3-dimethylbutylidene)-3 -(Triethoxysilyl)-1-propanamine, N,N'-bis(3-(trimethoxysilyl)propyl)ethylenediamine, polyoxyethylene propyltrialkoxy Silane, polyethoxydimethylsiloxane, etc.

Among them, 3-aminopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-isocyanatepropyltriethoxysilane, and 3-mercaptopropyltrimethoxysilane are preferred, and more preferred Trimethoxyphenylsilane, 3-glycidoxypropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane. A silane coupling agent can be used individually by 1 type or in combination of 2 or more types.

From the viewpoint of achieving a balance between heat resistance and storage stability, the content of the coupling agent is preferably 0.01 to 50 parts by mass, and more preferably 0.05 to 20 parts by mass relative to 100 parts by mass of the inorganic filler. From the viewpoint of improving the performance, it is more preferably 0.5 to 10 parts by mass.

The content of the inorganic filler in the adhesive sheet 3p is preferably 600 parts by mass or less, more preferably 500 parts by mass or less, and even more preferably 400 parts by mass or less based on 100 parts by mass of the thermoplastic resin. The lower limit of the content of the inorganic filler is not particularly limited, but it is preferably 5 parts by mass or more, and more preferably 8 parts by mass or more based on 100 parts by mass of the thermoplastic resin. By setting the content of the inorganic filler within the above range, shrinkage associated with thermal curing can be suppressed, and it is easy to achieve both high elastic modulus and excellent peelability of the adhesive sheet 3p.

(organic filler)

The adhesive sheet 3p may contain an organic filler. Examples of the organic filler include carbon, rubber-based fillers, silicone-based fine particles, polyamide fine particles, polyimide fine particles, and the like. The content of the organic filler is preferably 300 parts by mass or less, more preferably 200 parts by mass or less, and even more preferably 100 parts by mass or less based on 100 parts by mass of the thermoplastic resin. The lower limit of the content of the organic filler is not particularly limited, but is preferably 5 parts by mass or more based on 100 parts by mass of the thermoplastic resin.

(Organic solvents)

The adhesive sheet 3p can also be diluted with an organic solvent if necessary. The organic solvent is not particularly limited and can be determined from the boiling point, volatility during film formation, etc. Specifically, methanol, ethanol, 2-methoxyethanol, 2-ethoxyethanol, 2-butoxyethanol, methyl ethyl ketone, acetone, methyl isobutyl ketone, toluene, xylene and other lower boiling point solvents This is preferable from the viewpoint that the film is less likely to be cured during film formation. In addition, for the purpose of improving film-forming properties, it is preferable to use relatively high boiling point solvents such as dimethylacetamide, dimethylformamide, N-methylpyrrolidone, and cyclohexanone. These solvents can be used individually by 1 type or in combination of 2 or more types.

[protection component]

The protective member 5 p is formed by simultaneously die-cutting the adhesive layer 3 formed to cover the surface of the carrier film 1 and the protective film 5 arranged to cover the adhesive layer 3 , and adhering it. Tablets 3p are formed together (see Fig. 6). Since the protective member 5p of this embodiment is formed simultaneously with the adhesive sheet 3p by die-cutting, it has substantially the same shape as the adhesive sheet 3p. The protective film 5 may be any one that can be press-processed in the manufacturing process of the adhesive film 10 and the protective member 5p can be easily peeled off from the adhesive sheet 3p in the manufacturing process of the semiconductor device.

The adhesion force between the adhesive sheet 3p and the protective member 5p is preferably 16 N/m or less, more preferably 10 N/m or less, and may be 5 N/m or less or 4.5 N/m or less. In particular, when the adhesive sheet 3p is formed of a thermosetting resin composition, it is preferable that the adhesion force of the protective member 5p to the adhesive sheet 3p after heat treatment at 100° C. for 10 minutes is within the above range. When the adhesion force is 16 N/m or less, the adhesive sheet 3 p covered with the protective member 5 p can be temporarily pressure-bonded to the adherend (for example, a substrate) at 100° C. for 3 seconds, and then use an adhesive tape. The protective member 5p can be easily peeled off from the adhesive sheet 3p. In addition, the adhesion force of the protective member 5p to the adhesive sheet 3p refers to the 90° peel strength. Specifically, it means that it is prepared to be placed on an adhesive layer having the same composition as the adhesive sheet 3p and having a width of 20 mm. The peel strength measured when a sample with a protective film of the same width is peeled off the adhesive layer at an angle of 90° and a peeling speed of 300 mm/minute.

As the protective film 5, polyester films such as polyethylene terephthalate films, polytetrafluoroethylene films, polyethylene films, polypropylene films, polymethylpentene films, and polyvinyl acetate films can be used. , poly-4-methylpentene-1, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer and other homopolymers or copolymers or their mixtures and other polyolefin films, polyvinyl chloride films, poly Imide film and other plastic films, etc. The protective film 5 may have a single-layer structure or a multi-layer structure. By covering the adhesive layer 3 with the protective film 5, it is possible to prevent excessive tension from being applied to the adhesive layer 3 and prevent foreign matter from being mixed into the adhesive layer 3 during die cutting.

The thickness of the protective film 5 may be appropriately selected within a range that does not impair operability. For example, it may be 10 to 200 μm, or may be 20 to 100 μm or 25 to 80 μm. These thickness ranges are practical and economically effective ranges.

The light transmittance of the protective member 5 p is preferably lower than the light transmittance of the carrier film 1 . By adopting this structure, the position, orientation, etc. of the adhesive sheet 3p can be recognized using equipment such as a camera, and the bonding process in the manufacturing process of the semiconductor device can be easily automated. For example, as the protective member 5p, it is preferable to use a member colored so that the transmittance of light with a wavelength of 500 nm is less than 10% (more preferably less than 7%).

<Manufacturing method of adhesive film>

Next, the manufacturing method of the adhesive film 10 is demonstrated. The manufacturing method of this embodiment includes the following steps.

(A) Prepare a strip-shaped carrier film 1 having a width of 100 mm or less, an adhesive layer 3 formed to cover the surface of the carrier film 1 , and a protective film arranged to cover the adhesive layer 3 5. The process of laminate 20.

(B) The adhesive layer 3 and the protective film 5 in the laminated body 20 are die-cut to obtain a plurality of adhesive sheets 3 p arranged on the carrier film 1 so as to be arranged in the longitudinal direction of the carrier film 1 process.

FIG. 5 is a cross-sectional view schematically showing the laminated body 20 prepared in step (A). The laminated body 20 can be produced as follows. First, a coating liquid in which the raw material resin composition of the adhesive layer 3 is dissolved in a solvent such as an organic solvent is prepared as a varnish. After the coating liquid is coated on the carrier film 1 , the solvent is removed to form the adhesive layer 3 . Examples of coating methods include blade coating, roll coating, spray coating, gravure coating, rod coating, and shower coating. Next, the protective film 5 is bonded to the surface of the adhesive layer 3 under conditions of normal temperature to 60°C. Thus, the laminated body 20 can be obtained. Alternatively, a laminated film may be produced by forming the adhesive layer 3 on a wide carrier film and then bonding the protective film 5 to cover it, and then cut (cut) the film to 100 mm or less. width, thereby obtaining the laminated body 20.

FIG. 6 is a perspective view of a state in which a plurality of adhesive sheets 3 p and a protective member 5 p covering the adhesive sheets 3 p are formed on the carrier film 1 by die cutting in the step (B). As shown in FIG. 6 , the laminate 20 is continuously formed on the carrier film 1 by passing between a rotary body 51 having a plurality of blades 51 c for die-cutting on the outer peripheral surface and a roller 52 paired with the rotary body 51 . The adhesive sheet 3p and the protective member 5p are formed corresponding to the shape of the blade 51c. At this time, the surface of the laminate 20 on the protective film 5 side faces the rotating body 51 , and the surface on the carrier film 1 side faces the roll 52 . By adjusting the distance between the rotation axis 51a of the rotary body 51 and the rotation axis 52a of the roll 52, or changing the height of the blade 51c, the depth of the cut formed on the laminated body 20 by the blade 51c can be adjusted.

As described above, during die-cutting, the cut 1 c is formed on the carrier film 1 along the outer edge of the adhesive sheet 3 p. When the depth of the cut 1c with respect to the carrier film 1 is Dμm and the thickness of the carrier film is Tμm (see FIG. 2 ), the depth of the cut 1c satisfies the condition represented by the following inequality (1), and preferably satisfies the inequality ( The conditions shown in 2) and more preferably the conditions shown in inequality (3) are satisfied.

0<D/T≤0.6 (1)

0.1≤D/T≤0.6 (2)

0.15≤D/T≤0.6 (3)

When the value of D/T is a value greater than or above the lower limit value of the above-mentioned inequalities (1) to (3), the die cutting shown in FIG. 6 can be performed satisfactorily. on the other hand. When the value of D/T is a value less than or equal to the upper limit value of the above-mentioned inequalities (1) to (3), the pickup shown in FIG. 7 can be performed satisfactorily.

As shown in FIG. 6 , the laminated body 20 that has passed between the rotating body 51 and the roller 52 is separated into the adhesive film 10 and the unnecessary portion 30 , and is wound around respective reels (not shown). The unnecessary portion 30 is composed of the adhesive layer 3 and the protective film 5 from which the adhesive sheet 3p and the protective member 5p are removed.

<How to use adhesive film>

Next, a method of using the adhesive film 10 will be described. FIG. 7 is a cross-sectional view schematically showing how the adhesive sheet 3 p and the protective member 5 p covering the adhesive sheet 3 p are picked up from the carrier film 1 . In a state where a certain tension is applied to the adhesive film 10 , the adhesive film 10 is moved in the direction of the arrow shown in FIG. 7 while the surface on the carrier film 1 side of the adhesive film 10 is in contact with the wedge-shaped member 60 . Thereby, as shown in this figure, the adhesive sheet 3p and the front side of the protective member 5p are in the state which floated from the carrier film 1. In this state, the adhesive sheet 3p and the protective member 5p are picked up using, for example, a suction device 65 with an attractive force. For example, by using a device such as a camera that recognizes the protective member 5p as the pickup device 65, information such as the presence and orientation of the adhesive sheet 3p and the protective member 5p can be grasped. Based on this information, the subsequent bonding process can be appropriately implemented.

Next, the adhesive sheet 3p covered with the protective member 5p is placed at a predetermined position and direction on the substrate (not shown). In this state, the adhesive sheet 3p is temporarily pressure-bonded to the substrate directly. Temporary pressure bonding may be performed for 0.1 to 10 seconds, for example, under the conditions of a temperature of 60 to 150° C. and a pressing force of 0.03 to 1 MPa. By temporary pressure bonding, the adhesive sheet 3p is in close contact with the substrate to an extent that it is weak but does not peel off from the substrate. In this state, the protective member 5p is peeled off from the adhesive sheet 3p using a tape or the like. After a semiconductor chip (not shown) having a shape different from that of the adhesive sheet 3p is placed on the surface of the adhesive sheet 3p exposed by peeling of the protective member 5p, the semiconductor chip is pressure-bonded to the substrate. For example, the pressure bonding may be performed for 0.1 to 10 seconds under the conditions of a temperature of 60 to 150° C. and a pressing force of 0.05 to 1 MPa. In addition, as the substrate becomes thinner, the heating temperature is expected to be lower. The pressure bonding temperature is preferably 160°C or lower, and the subsequent thermal curing temperature is also preferably 160°C or lower.

<Semiconductor device>

FIG. 8 is a cross-sectional view schematically showing an example of a semiconductor device manufactured using the adhesive sheet 3p. The semiconductor device 100 shown in this figure includes a semiconductor chip S, a substrate 50 to which the semiconductor chip S is electrically connected, and an adhesive sheet 3 p disposed between the semiconductor chip S and the substrate 50 to bond the semiconductor chip S and the substrate 50 . The shape of the semiconductor chip S is, for example, a rectangle or a square, and the shape of the adhesive sheet 3 p is T-shaped. The shape of the semiconductor chip S is different from the shape of the adhesive sheet 3 p. By adopting this structure, as shown in FIG. 4 , in the regions R1 and R2, the substrate 50 and the semiconductor chip S can be electrically connected using the conductive materials A1 and A2.

The manufacturing method of the semiconductor device 100 includes the following steps: preparing a laminate (not shown) in which the substrate 50, the adhesive sheet 3p and the semiconductor chip S are sequentially laminated; and heating the laminate to separate the substrate with the adhesive sheet. 50. The process of bonding the semiconductor chip S. The temperature when bonding the substrate 50 and the semiconductor chip S is preferably low, for example, 160° C. or lower.

The embodiments of the present disclosure have been described in detail above, but the present disclosure is not limited to the above-described embodiments. For example, in the above-mentioned embodiment, the protective film 5 colored so that the presence, orientation, etc. of the protective member 5p can be grasped using a camera or the like is exemplified, but instead, the protective film 5 may be placed at a predetermined position of the protective member 5p. Mark it. In addition, if the adhesive sheet 3p is colored, the protective member 5p does not need to be provided. In addition, when the orientation of the adhesive sheet 3p is not a problem (for example, when the shape of the adhesive sheet 3p is circular), there is no need to identify the orientation.

Example

The present disclosure will be described below based on examples. The present disclosure is not limited to the following examples.

<Example 1>

(Preparation of adhesive varnish)

Apply a vacuum while mixing the following materials to obtain an adhesive varnish.

· Thermoplastic resin: HTR-860P-3 (trade name, manufactured by Nagasechemtex Co., Ltd., glycidyl group-containing acrylic rubber, molecular weight: 1 million, Tg: -7°C) 100 parts by mass

· Thermosetting resin: YDCN-700-10 (trade name, manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd., o-cresol novolak type epoxy resin, epoxy equivalent: 210) 30 parts by mass

·Thermosetting resin: LF-4871 (trade name, manufactured by DIC Co., Ltd., bisphenol A type epoxy resin, epoxy equivalent: 118) 95 parts by mass

·Thermosetting resin: YDF-8170C (trade name, manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd., bisphenol F type epoxy resin, epoxy equivalent: 157) 100 parts by mass

·Curing accelerator: 2PZ-CN (trade name, manufactured by Shikoku Chemical Industry Co., Ltd., imidazole compound) 0.3 parts by mass

·Surface treatment filler: SC-2050-HLG (trade name, manufactured by Admatechs Co., Ltd.) 330 parts by mass

·Silane coupling agent: A-189 (trade name, manufactured by NUC Co., Ltd., γ-mercaptopropyltrimethoxysilane) 0.9 parts by mass

·Silane coupling agent: A-1160 (trade name, manufactured by NUC Co., Ltd., γ-ureidopropyltriethoxysilane) 2 parts by mass

(Preparation of adhesive film)

The above-mentioned adhesive varnish was coated on surface release-treated polyethylene terephthalate (manufactured by Teijin Film Solutions Co., Ltd., trade name: Teijin Tetoron Film A-53, thickness T: 38 μm). After the drying process, a film in which an adhesive layer having a thickness of 25 μm was formed on one surface of the polyethylene terephthalate film (carrier film) was obtained. This film was bonded to a colored 50 μm-thick polyethylene film (TDM-1, manufactured by Tamapoly Co., Ltd.) to obtain a laminated film. This laminated film was cut into a width of 15 mm to obtain a strip-shaped laminated body.

The laminate obtained as above was die-cut using the apparatus configured as shown in FIG. 6 to obtain the adhesive film of this example. The shape of the adhesive sheet was a rectangular shape of about 7 mm in length and about 6 mm in width, with some corners missing (area: 29 mm ² ). The pitch P is approximately 9 mm. The depth D of the cut relative to the carrier film was 13 μm, and the value of D/T (=13/38) was approximately 0.3. The depth D of the cut is measured based on the electron microscope image of any 10 cuts formed on the carrier film, and the average value is taken. The same applies to the following Examples and Comparative Examples.

<Example 2>

An adhesive film was produced in the same manner as in Example 1, except that a carrier film having a different surface treatment from the carrier film used in Example 1 was used, and the depth D of the cut relative to the carrier film was changed. As a carrier film, a surface release-treated polyethylene terephthalate film (manufactured by Teijin Film Solutions Co., Ltd., trade name: Teijin TetoronFilm A-63, thickness T: 38 μm) was used. The depth D of the cut relative to the carrier film was 18 μm, and the value of D/T (=18/38) was approximately 0.5.

<Example 3>

An adhesive film was produced in the same manner as in Example 2 except that the depth D of the cut relative to the carrier film was changed. The depth D of the cut relative to the carrier film was 21 μm, and the value of D/T (=21/38) was approximately 0.6.

<Comparative example 1>

An adhesive film was produced in the same manner as in Example 1 except that the depth D of the cut relative to the carrier film was changed. The depth D of the cut relative to the carrier film was 26 μm, and the value of D/T (=26/38) was approximately 0.7.

<Comparative example 2>

An adhesive film was produced in the same manner as in Example 1 except that the depth D of the cut relative to the carrier film was changed. The depth D of the cut relative to the carrier film was 33 μm, and the value of D/T (=33/38) was approximately 0.9.

<Comparative Example 3>

An adhesive film was produced in the same manner as in Example 1, except that a carrier film having a different surface treatment from the carrier film used in Example 1 was used, and the depth D of the cut relative to the carrier film was changed. As a carrier film, a surface release-treated polyethylene terephthalate film (manufactured by Teijin Film Solutions Co., Ltd., trade name: Teijin TetoronFilm A-31, thickness T: 38 μm) was used. The depth D of the cut relative to the carrier film was 29 μm, and the value of D/T (=29/38) was approximately 0.8.

The following items were evaluated for the adhesive films of Examples and Comparative Examples. The results are shown in Table 1 and Table 2.

(1) Carrier film adhesion (90° peel strength)

Cut the undie-cut laminated film (carrier film/adhesive layer/protective film) into a width of 20 mm. Use double-sided tape to stick one side of the carrier film to the aluminum plate, and then peel off the protective film. Thereafter, while maintaining the angle of the adhesive layer with respect to the carrier film at 90°, the adhesive layer is lifted upward to peel the adhesive layer from the carrier film. The lifting speed is 50mm/minute, and the measured ambient temperature is 23±2℃. Determine the force required to lift. The measured value (mN) and the sample width (20 mm) were substituted into the following formula to calculate the adhesion force between the carrier film and the adhesive layer.

Adhesion force (N/m) = measured value (mN)/20 (mm)

Evaluate based on the following criteria.

A: Adhesion force is above 2N/m

B: Adhesion force is lower than 2N/m

(2) Exposure distance of the adhesive composition constituting the adhesive sheet

Based on the microscope image of the upper surface of the adhesive film (surface on the protective member side), the distance from the position where the adhesive composition is most exposed from the outer edge of the protective member was measured.

Evaluate based on the following criteria.

A: Exposure distance is 20μm or less

B: The exposure distance exceeds 20μm

(3) Pick-up ability

Fix a binder clip (width 32mm) to the end of the board to create a device with the structure shown in Figure 9(a). With a certain tension applied to the adhesive films (width 15 mm) of the Examples and Comparative Examples, the surface of the carrier film side of the adhesive film 10 was brought into contact with the corner C of the binder clip B. The adhesive film 10 is moved in the direction of the arrow shown in the figure at a speed of 50 mm/minute. The bending angle of the adhesive film 10 in the corner portion C is approximately 150°. It was visually observed whether the 25 consecutively arranged adhesive sheets 3p (and the protective member 5p) were peeled off from the carrier film and floated at the corner C (see Fig. 9(a) ). As shown in FIG. 9( b ), the adhesive sheet 3 p passing through the corner C while being attached to the carrier film 1 is counted as a “non-peeled adhesive sheet”.

Evaluation is based on the following criteria.

A: Among 25 adhesive sheets, the number of unpeeled adhesive sheets is less than 2

B: Among the 25 adhesive sheets, there are 3 or more unpeeled adhesive sheets.

Table 1

Table 2

Industrial availability

According to the present disclosure, it is possible to provide an adhesive film that is useful for efficiently carrying out the bonding process of the manufacturing process of a semiconductor device even if the area of the substrate to which the semiconductor chip is to be bonded is limited or the shape of the semiconductor chip is special, and to stably manufacture the same. Method of bonding membrane.

Symbol Description

1 carrier film, 1c cut, 3 adhesive layer, 3p adhesive sheet, 5 protective film, 5p protective member, 10 adhesive film, 50 substrate, 100 semiconductor device, corners of C1 to C12 adhesive sheets, The surface of the F1 adhesive sheet (first surface), the surface of the F2 adhesive sheet (second surface), and the S semiconductor chip.

Claims (16)

1. A method for manufacturing an adhesive film, which is a method for manufacturing an adhesive film for semiconductor device manufacturing, including the following steps in order: (A) Prepare a strip-shaped carrier film having at least a width of 100 mm or less, an adhesive layer formed to cover the surface of the carrier film, and a protector arranged to cover the adhesive layer. The process of laminating a film; and (B) a process of die-cutting the adhesive layer to obtain a plurality of adhesive sheets arranged on the carrier film so as to be arranged in the longitudinal direction of the carrier film, Wherein, when the die-cutting is performed in the (B) process, the protective film, the adhesive layer and the carrier film are notched in such a manner that the conditions shown in the following inequality (1) are satisfied. , The adhesive sheet has a shape in which at least one of a convex portion and a concave portion is formed on at least one side of a rectangle or a square, The light transmittance of the protective film is lower than the light transmittance of the carrier film, and as the protective film, a film colored to have a transmittance of less than 10% for light with a wavelength of 500 nm is used, 0＜D/T≤0.6 (1) In the formula, D is the depth of the cut relative to the carrier film, in μm; T is the thickness of the carrier film, in μm. 2. The method of manufacturing an adhesive film according to claim 1, wherein the adhesive sheet has six or more corners. The manufacturing method of the adhesive film according to claim 2, wherein the shape of the adhesive sheet is L-shaped. 4. The method of manufacturing an adhesive film according to claim 1, wherein the adhesive sheet has eight or more corners. 5. An adhesive film for use in manufacturing semiconductor devices, comprising: Strip-shaped carrier film with a width of less than 100mm; A plurality of adhesive sheets arranged on the carrier film in a manner arranged in the length direction of the carrier film; incisions formed on the carrier film along the outer edge of the adhesive sheet, and a protective member covering a second surface of the adhesive sheet opposite to the first surface on the carrier film side and having the same shape as the adhesive sheet, Wherein, the depth of the cut and the thickness of the carrier film satisfy the conditions shown in the following inequality (1), The adhesive sheet has a shape in which at least one of a convex portion and a concave portion is formed on at least one side of a rectangle or a square, The light transmittance of the protective member is lower than the light transmittance of the carrier film, and as the protective member, a member colored to have a transmittance of less than 10% for light with a wavelength of 500 nm is used, 0＜D/T≤0.6 (1) In the formula, D is the depth of the cut relative to the carrier film, in μm; T is the thickness of the carrier film, in μm. 6. The adhesive film according to claim 5, wherein the adhesive sheet has six or more corners. 7. The adhesive film according to claim 6, wherein the adhesive sheet is L-shaped. 8. The adhesive film according to claim 5, wherein the adhesive sheet has eight or more corners. 9. The adhesive film according to any one of claims 5 to 8, wherein the adhesive sheet has an area of 10 to 200 ^mm2 . 10. The adhesive film according to any one of claims 5 to 8, wherein the proportion of the area of the surface of the carrier film covered by the plurality of adhesive sheets is based on the area of the carrier film. The benchmark is 10 to 60%. The adhesive film according to any one of claims 5 to 8, wherein the adhesive force between the carrier film and the adhesive sheet is 2 N/m or more. 12. The adhesive film according to any one of claims 5 to 8, wherein the carrier film has a thickness of 10 to 200 μm. 13. A semiconductor device having: substrate; semiconductor chips; and The adhesive sheet of the adhesive film according to any one of claims 5 to 12, wherein the adhesive sheet is disposed between the substrate and the semiconductor chip to bond the substrate and the semiconductor chip, The shape of the semiconductor chip is different from the shape of the adhesive sheet. 14. A method of manufacturing a semiconductor device using the adhesive sheet of the adhesive film according to any one of claims 5 to 12. 15. The method of manufacturing a semiconductor device according to claim 14, comprising the following steps: The process of preparing a laminate in which the substrate, the adhesive sheet, and the semiconductor chip are laminated in this order; and The step of bonding the substrate and the semiconductor chip using the adhesive sheet by heating the laminated body, Wherein, the shape of the semiconductor chip is different from the shape of the adhesive sheet. 16. The method of manufacturing a semiconductor device according to claim 15, wherein the semiconductor chip is bonded to the substrate using the adhesive sheet by heating the laminated body to a temperature of 160° C. or lower. superior.