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CN111092091B - Active backlight LED light source board and backlight module driven by a-Si TFT device - Google Patents

Active backlight LED light source board and backlight module driven by a-Si TFT device Download PDF

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Publication number
CN111092091B
CN111092091B CN201811169334.6A CN201811169334A CN111092091B CN 111092091 B CN111092091 B CN 111092091B CN 201811169334 A CN201811169334 A CN 201811169334A CN 111092091 B CN111092091 B CN 111092091B
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light emitting
source
driving
light
drain
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CN111092091A (en
Inventor
闫晓林
林智远
马刚
谢相伟
陈光郎
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TCL Technology Group Co Ltd
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TCL Technology Group Co Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142Two-dimensional arrangements, e.g. asymmetric LED layout
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133602Direct backlight
    • G02F1/133603Direct backlight with LEDs
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/213Channel regions of field-effect devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/23Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
    • H10D64/251Source or drain electrodes for field-effect devices

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Thin Film Transistor (AREA)

Abstract

本发明适用于显示技术领域,提供了一种a‑Si TFT器件驱动的主动背光LED光源板和背光模组,光源板的发光单元包括发光元件以及驱动发光元件的驱动薄膜晶体管,驱动薄膜晶体管的第一源极的一部分和第一漏极的一部分呈梳齿状交错分布,另一部分呈螺旋状交错分布,所述第一有源层对应所述第一源极和第一漏极之间形成沟道,所述沟道一部分呈螺旋状,另一部分呈方波状,以增加沟道的宽度。本发明通过第一源极和第一漏极之间以螺旋状和梳齿状进行交错分布,第一有源层对应形成螺旋状和梳齿状的沟道,能够提高沟道的宽长比,提高其驱动能力,允许更大的驱动电流通过用于驱动发光元件发光,满足作为背光使用的驱动电流的要求。

The present invention is applicable to the field of display technology, and provides an active backlight LED light source board and backlight module driven by an a-Si TFT device, wherein the light-emitting unit of the light source board includes a light-emitting element and a driving thin film transistor for driving the light-emitting element, wherein a portion of the first source electrode and a portion of the first drain electrode of the driving thin film transistor are staggered in a comb-like shape, and another portion is staggered in a spiral shape, and a channel is formed between the first active layer corresponding to the first source electrode and the first drain electrode, wherein a portion of the channel is spiral-shaped and another portion is square-wave-shaped to increase the width of the channel. The present invention can improve the width-to-length ratio of the channel by staggering the first source electrode and the first drain electrode in a spiral and comb-like shape, and improve its driving capability, allowing a larger driving current to pass through to drive the light-emitting element to emit light, thereby meeting the driving current requirements for use as a backlight.

Description

Active backlight LED light source plate driven by a-Si TFT device and backlight module
Technical Field
The invention belongs to the technical field of display, and particularly relates to an active backlight LED light source plate driven by an a-Si TFT device and a backlight module.
Background
Currently, TFTs (Thin Film Transistor, thin film field effect transistors) are mainly used to drive each pixel, such as a liquid crystal display array, an organic light emitting diode display array, and the like. The currently mainstream TFTs can be classified into three major categories, a-Si (Amorphous Silicon ), IGZO (Indium Gallium Zinc Oxide, indium gallium zinc oxide) and LTPS (Low Temperature Poly-silicon, low temperature polysilicon), according to the semiconductor materials used. The a-Si material has low quality and small carrier mobility, so that the a-Si TFT can bear small current density, and the carrier mobility in IGZO and LTPS is large and can bear larger current density.
For a single TFT, at a particular current density, the maximum current that it can pass is proportional to its channel width to length ratio (aspect ratio). In order to limit the leakage current of the TFT and ensure the stability of the device, the channel length of the TFT must be greater than a certain value.
Current LCD arrays, OLED arrays have a high resolution, so the Pitch (Pitch) between two adjacent pixels is relatively small, approximately between 0.1mm and 1mm, as shown in fig. 1 and 2. For a current driving element such as an organic light emitting diode 001 (fig. 1), the area occupied by the TFT 002 is generally relatively large in the total area of the pixel, and the space for further increasing the current density by increasing the area is not large. In another case, for a liquid crystal display application, the area occupied by the liquid crystal (opening region) 003 must reach a certain ratio (fig. 2), and thus the area occupied by the TFT 002' is limited. Therefore, in these conventional applications, the area of the TFT cannot be large, and when a large current is required, a larger current density can be obtained only using a TFT of a higher mobility material such as IGZO or LTPS.
The Mini-LED (Mini light emitting diode) backlight technology is one of the novel display technologies which are emerging in recent years, and has the advantages of high dynamic resolution, power saving, simple algorithm and the like. The current common Mini-LED backlight technology adopts a driving mode of welding an integrated circuit on a PCB (Printed Circuit Board ) backboard, so that the problems of high PCB design difficulty, multiple welding times and high production cost are caused, and the application of more TFT driving technologies in the OLED field is less applied to the Mini-LED backlight display. The main reason for this is that the current density required for backlight LEDs is typically relatively large (mA level), and conventional a-Si TFTs are difficult to meet their current density requirements, while the cost of new technologies such as LTPS is relatively high.
In a backlight Mini-LED array, the size of Pitch can reach 10-100mm, which is far larger than the traditional application scene of TFT. In this case, there is a large amount of available area in Pitch, and therefore, even if a-Si is used as a TFT material, it is highly possible to obtain a TFT having a large drive current by using the large amount of area.
Disclosure of Invention
The invention aims to provide an active backlight LED light source board driven by an a-Si TFT device, which aims to solve the technical problem that the traditional a-Si TFT is applied to an LED to meet the requirement of driving current used as a backlight module.
The invention is realized in that the light source plate comprises a plurality of light emitting units arranged on a substrate, wherein each light emitting unit comprises a light emitting element and a driving thin film transistor for driving the light emitting element;
The driving thin film transistor comprises a first grid electrode, a first active layer, a first source electrode and a first drain electrode, wherein one part of the first source electrode and one part of the first drain electrode are distributed in a comb-tooth-shaped staggered mode, the other part of the first source electrode and the other part of the first drain electrode are distributed in a spiral staggered mode, a channel is formed between the first active layer and the first source electrode and corresponds to the first source electrode and the first drain electrode, one part of the channel is in a spiral mode, and the other part of the channel is in a square wave mode so as to increase the width of the channel.
In an embodiment, the area ratio of the projected area of the driving thin film transistor in the light emitting unit is 70% -95%.
In an embodiment, a passivation layer is disposed on the driving thin film transistor, a first via hole is disposed on the passivation layer corresponding to the first drain electrode, and the light emitting element is electrically connected to the first drain electrode through the first via hole.
In an embodiment, the projection of the light emitting element is located at a central position of the light emitting unit.
In an embodiment, the first via hole is filled with a first metal conductive post, the passivation layer is provided with a wire, and the light emitting element is electrically connected with the first drain electrode through the wire and the first metal conductive post.
In an embodiment, the light emitting unit further includes a switching thin film transistor for controlling the driving thin film transistor, and a capacitor for providing a sustain voltage for turning on the driving thin film transistor.
In an embodiment, the switching thin film transistor includes a second gate electrode, a second active layer, a second source electrode, and a second drain electrode, the second drain electrode being connected to the first gate electrode of the driving thin film transistor.
In one embodiment, the switching thin film transistor and the capacitor are disposed at one side of the driving thin film transistor.
In an embodiment, a second via hole is disposed on the passivation layer corresponding to the first source electrode, a second metal conductive pillar is filled in the second via hole, and the first source electrode is led out to the upper surface of the passivation layer through the second metal conductive pillar.
Another objective of the present invention is to provide a backlight module including the light source board described in the above embodiments.
Compared with the prior art, the light source plate has the advantages that the plurality of light emitting units are arranged on the substrate, each light emitting unit comprises the light emitting element and the driving thin film transistor for driving the light emitting element, the driving thin film transistor comprises the first grid electrode, the first active layer, the first source electrode and the first drain electrode, one part of the first source electrode and one part of the first drain electrode are distributed in a comb-tooth-shaped staggered mode, the other part of the first source electrode and the other part of the first drain electrode are distributed in a spiral staggered mode, a channel is formed between the first active layer and the first source electrode corresponding to the first drain electrode, one part of the channel is spiral, the other part of the channel is square-wave-shaped, the width-length ratio of the channel can be obviously improved, the driving capability of the channel is improved, and larger driving current is allowed to pass through the driving thin film transistor for driving the light emitting element to emit light, and the driving current requirement used as backlight is met.
Drawings
FIG. 1 is a schematic diagram of a conventional LCD array structure;
FIG. 2 is a schematic diagram of a conventional OLED array structure;
FIG. 3 is a schematic diagram of a liquid crystal display device according to an embodiment of the invention;
FIG. 4 is a schematic side view of a backlight module according to an embodiment of the invention;
FIG. 5 is a schematic diagram of a side view of a light emitting unit on an active backlight LED light source board driven by an a-Si TFT device according to an embodiment of the invention;
FIG. 6 is a schematic diagram of a driving circuit in a light emitting unit according to an embodiment of the present invention;
Fig. 7 is a schematic structural view of a driving TFT provided in the first embodiment of the present invention;
Fig. 8 is a schematic structural view of a light emitting unit according to a second embodiment of the present invention;
Fig. 9 is a schematic structural view of a driving TFT provided in a third embodiment of the present invention;
Fig. 10 is a schematic structural view of a light emitting unit provided in a fourth embodiment of the present invention;
fig. 11 is a schematic structural view of a light emitting unit provided in a fifth embodiment of the present invention;
Fig. 12 to 14 are schematic structural views of a light emitting unit provided in a sixth embodiment of the present invention;
fig. 15 to 17 are schematic top view structures of a light emitting unit according to a seventh embodiment of the present invention.
The meaning of the labels in the figures is:
A liquid crystal display device 1, a liquid crystal display panel 2, and a backlight module 3;
A light source plate 4, a diffusion plate 5;
A substrate 40, a light emitting unit 41, a light emitting element 42, a driving TFT 44, a switching TFT45, a capacitor 46, an auxiliary element 47, a row control line 48, a column control line 49;
A gate insulating layer 52;
a first gate electrode 441, a first active layer 442, a first intrinsic semiconductor layer 4421, an ohmic contact layer 4422, a first source electrode 443, a first drain electrode 444;
a second gate electrode 451, a second active layer 452, a second source electrode 453, and a second drain electrode 454;
channel 4420, first channel 4425, second channel 4426;
first comb handle 4431, first comb teeth 4432, second comb handle 4441, second comb teeth 4442;
source bar 4433, source comb teeth 4434, drain bar 4443, drain comb teeth 4444;
A passivation layer 71, a wire 72, a power supply wire 73;
First via 74, first metal conductive post 75, second via 76, second metal conductive post 77,
A sub-TFT 80, a first electrical conductor 87, a second electrical conductor 88, and a third electrical conductor 89.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper," "lower," "left," "right," and the like are used for convenience of description based on the orientation or positional relationship shown in the drawings, and do not denote or imply that the devices or elements being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present patent. The terms "first," "second," and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "a plurality of" is two or more, unless specifically defined otherwise.
In order to explain the technical scheme of the invention, the following is a detailed description with reference to the specific drawings and embodiments.
Fig. 3 is a schematic structural view of a liquid crystal display device 1 according to an embodiment of the present invention. The liquid crystal display device 1 comprises a backlight module 3 and a liquid crystal display panel 2, wherein light rays emitted by the backlight module 3 enter the liquid crystal display panel 2 and are refracted by liquid crystal molecules in the liquid crystal layer to form a picture for display.
Referring to fig. 4 and 5, the backlight module 3 includes a light source board 4 for providing light. In this embodiment, the backlight module 3 is a direct type backlight module, and a diffusion plate 5 is disposed in front of the light source plate 4. The light source board 4 includes a substrate 40 and a plurality of light emitting elements 42 uniformly arranged on the substrate 40, wherein light emitted by the light emitting elements 42 is incident forward, enters the diffusion plate 5 through the rear surface of the diffusion plate 5, is diffused and homogenized by the diffusion plate 5 to form a surface light source, and is emitted from the front surface of the diffusion plate 5 and is provided to the liquid crystal display panel 2.
Referring to fig. 6 in combination, a row control line 48 and a column control line 49 are further disposed on the substrate 40, where the row control line 48 and the column control line 49 are used to control the plurality of light emitting units 41 to independently operate, so that each light emitting unit 41 can be independently controlled in the backlight module 3, which is beneficial to improving the display effect. Specifically, the light emitting unit 41 includes the above-described light emitting element 42 and a driving circuit for driving the light emitting element 42 to emit light.
The driving circuit may include a switching element 45, a driving element 44, and a capacitor 46. The switching element is a thin film transistor (hereinafter referred to as a switching TFT 45), is connected to the row control line 48 and the column control line 49, controls the introduction of a signal to the column control line 49 according to a timing signal of the row control line 48, the driving element 44 is a thin film transistor (hereinafter referred to as a driving TFT 44), is turned on according to a signal to the column control line 49 from the switching TFT 45 to drive the light emitting element 42 to emit light, and the capacitor 46 is used for storing a signal to the column control line 49 from the switching TFT 45 to supply bias and sustain voltages to the driving TFT 44.
Specifically, as shown in fig. 5 and 6, a plurality of row control lines 48, a first gate 441, and a second gate 451 are formed on the substrate 40 through a single photomask process, and the second gate 451 is connected to the row control lines 48. A gate insulating layer 52 is formed on the row control line 48, the first gate electrode 441, and the second gate electrode 451, and a first active layer 442 and a second active layer 452 are formed on the gate insulating layer 52. A first source electrode 443 and a first drain electrode 444 are simultaneously formed over both sides of the first active layer 442, a second source electrode 453 and a second drain electrode 454 are formed over both sides of the second active layer 452, and a plurality of column control lines 49 are formed through a photomask process, and the second source electrode 453 is connected to the column control lines 49. The second drain electrode 454 is also connected to the first gate electrode 441 through a connection hole penetrating the gate insulating layer 52.
The switching TFT 45 includes a second gate electrode 451, a second active layer 452, a second source electrode 453, and a second drain electrode 454. The switching TFT 45 may be an a-Si TFT or an oxide semiconductor TFT, and the present invention is not limited thereto. Also, the drive current required for the switching TFT 45 is generally small, and is preferably an a-Si TFT.
One end of the capacitor 46 is connected to the negative electrode of the driving power source, and the other end is connected between the first gate 441 and the second drain 454.
The driving TFT 44 includes a first gate electrode 441, a first active layer 442, a first source electrode 443, and a first drain electrode 444. When the driving TFT 44 is turned on, a current flows between the first source 441 and the first drain 443 for driving the light emitting element 42 to operate. The light emitting element 42 may be connected between the positive electrode of the driving power source and the first source 443, or between the first drain 444 and the negative electrode of the driving power source, and the light emitting element 42 shown in fig. 6 is connected between the first drain 444 and the negative electrode of the driving power source.
The maximum current that can pass between the first source 443 and the first drain 444 of the driving TFT 44 determines the driving current of the light source panel 4, and when used in a backlight unit, the driving current of the light source panel 4 generally needs to be in the order of milliamperes to meet the brightness requirement, and thus the driving TFT 44 capable of withstanding the corresponding driving current should be designed or used.
In the liquid crystal display device 1 provided in the embodiment of the present invention, the light emitting element 42 is a mini light emitting diode (mini-LED) having a size of about 200 μm. In the light source board 4, the total number of mini-LEDs on the substrate 40 is about several thousand, and the distance between two adjacent mini-LEDs is about 10-100 micrometers, so that the side length of one light emitting unit 41 is 10-100 mm, which is far greater than the size of the mini-LEDs. The area ratio of the mini-LED and the switching element 45 and the capacitor 46 in the light emitting unit 41 is small, and thus, other areas than the area occupied by the mini-LED, the switching TFT 45 and the capacitor 46 can be used for the design of the driving TFT 44. In an embodiment, the area ratio occupied by the driving TFT 44 in the light emitting unit 41 is 70% -95, preferably 75% -85%, and more preferably 80% -85%, so that the driving TFT 44 occupies a larger area for providing a larger width-to-length ratio of the channel 4420.
The technical scheme provided by the invention is not only suitable for Mini-LED backlight sources, but also suitable for light-emitting arrays formed by light-emitting units with other sizes, such as light-emitting arrays formed by elements such as traditional LEDs. For other sizes of light emitting elements, the TFT duty ratio in each cell is correspondingly different depending on the size of the light emitting cell. By adopting the technical scheme provided by the invention, the drive can be provided for all the light-emitting elements needing larger drive current.
In this embodiment, the driving TFT 44 is an a-Si TFT, and the light source board 4 of the present invention is an active backlight LED light source board driven by an a-Si TFT device. The first active layer 442 of the driving TFT 44 includes a first intrinsic semiconductor layer 4421 formed on the gate insulating layer 52 and ohmic contact layers 4422 formed over both sides of the first intrinsic semiconductor layer 4421. The material of the first intrinsic semiconductor layer 4421 is amorphous silicon, and the ohmic contact layer 4422 is amorphous silicon doped with N-type ions, such As nitrogen (N), phosphorus (P), and arsenic (As). The a-Si TFT has the advantages of simple manufacturing process, low cost, high yield and low off-state leakage current, but has low material mobility. Therefore, for the use of mini-LEDs in the backlight module 3, it is necessary to solve how to improve the driving capability of the a-Si TFT.
The specific structure of the a-Si TFT will be described below to provide a large driving capability of the driving TFT 44.
In the driving TFT 44 provided in the embodiment of the present invention, the first source electrode 443 and the first drain electrode 444 are designed to be staggered so as to form a continuous and meandering gap between the first source electrode 443 and the first drain electrode 444, instead of the conventional rectangular shape (refer to the dashed rectangle in fig. 1 and 2), and the first active layer 442 forms a continuous and meandering channel 4420 corresponding to the meandering gap between the staggered first source electrode 443 and the first drain electrode 444. The minimum distance that current flows between the first source 443 and the first drain 444 is the length of the channel 4420, the total length of the meandering gap between the first source 443 and the first drain 444 is the width of the channel 4420, and the channel 4420 is formed in a continuous and meandering manner, so that the width of the channel 4420 and the width-to-length ratio thereof can be increased, and a larger driving current can be allowed to pass.
Defining the projections of the first source 443 and the first drain 444 in the substrate plane as a plane geometry a and a plane geometry B, respectively, satisfying the following conditions:
The areas of A and B are not 0;
Defining the distance from any point X to A in the plane as the minimum value in the set formed by the distances between X and all points on A, wherein the distances from more than 80% of the points on the edge of B to A are the same, the distances from d1, d1>0, and the distances from less than 20% of the points on the edge of A to A are all greater than d1;
The side lengths L A and L B of A and B and the areas S A and S B meet the following conditions of L A 2/SA>104,LB 2/SB>104;
Neither A nor B must be continuous.
Specifically, referring to fig. 7, a schematic structure of a driving TFT 44 according to a first embodiment of the present invention is shown. The staggered distribution is comb-shaped staggered distribution. The first source 443 has a comb shape and includes a first comb handle 4431 and a plurality of first comb teeth 4432 connected to the first comb handle 4431, and the first drain 444 has a comb shape and includes a second comb handle 4441 and a plurality of second comb teeth 4442 connected to the second comb handle 4441. The first comb teeth 4432 and the second comb teeth 4442 are arranged between the first comb handle 4431 and the second comb handle 4441 in a mutually spaced mode, a second comb tooth 4442 is arranged between the two first comb teeth 4432, and a first comb tooth 4432 is arranged between the two second comb teeth 4442.
In an embodiment, the first comb handle 4431 and the first comb teeth 4432 are disposed on two sides of the first active layer 442 respectively, so as to maximize the width of the channel 4420, and the channel 4420 has a square wave shape between the first comb teeth 4432 and the second comb teeth 4442.
The first comb handle 4431 is preferably connected with the first comb teeth 4432 at a vertical angle, and the second comb handle 4441 is preferably connected with the second comb teeth 4442 at a vertical angle, so that the utilization rate of the area of the light emitting unit 41 is improved.
The distance between one first comb tooth 4432 and one second comb tooth 4442 closest to the first comb tooth, that is, the width of the cross section of the square wave is the length L of the channel 4420, and the total length of the square wave is the width W of the channel 4420, thereby greatly increasing the width-to-length ratio of the channel 4420 and the maximum current and driving capability of the driving TFT44 in a limited area.
In one embodiment, the distance between one first comb 4432 and the nearest second comb 4442, i.e., the length L of the channel 4420, is 1 micron to 10 microns, and the minimum is 1 micron, so as to obtain the maximum width and the maximum width-to-length ratio of the channel of the driving TFT 44. On the basis of such a small length L, the width of the channel 4420 is substantially proportional to the sum of the numbers of the first and second comb teeth 4432 and 4442, and thus, the width-to-length ratio of the driving TFT 44 is greatly improved.
The number of first and second teeth 4432, 4442 may be plural, for example, 2, 3. N is a natural number, and meanwhile, the number of the first comb teeth 4432 and the number of the second comb teeth 4442 can be the same or different; for example, the first source 443 may include 10 first comb teeth 4432 and the first drain 444 includes 11 second comb teeth 4442, for example, the first source 443 includes 12 first comb teeth 4432 and the first drain 444 includes 11 second comb teeth 4442, and for example, the first source 443 includes 10 first comb teeth 4432 and the first drain 444 includes 10 second comb teeth 4442. Fig. 7 is only for illustrating the present embodiment, and the present invention is not limited thereto.
The first gate 441 is square-wave shaped and disposed corresponding to the channel 4420, and the first gate 441 overlaps a portion of the first source 443 and the first drain 444.
As shown in fig. 8, a schematic structural diagram of a light emitting unit 41 according to a second embodiment of the present invention is provided. Wherein the area (projected area) of the driving TFT 44 is 70% -95, preferably 75% -85%, and more preferably 80% -85% of the area of the light emitting unit 41, as described in the first embodiment, the driving TFT 44 can occupy a larger area, so as to provide a larger width-to-length ratio of the channel 4420. The area ratio of the light emitting element 42, the switching TFT 45, and the capacitor 46 (hereinafter, the switching TFT 45 and the capacitor 46 are collectively referred to as the auxiliary element 47) to the area of the light emitting unit 41 is 30% or less, preferably 15% to 25%, and more preferably 15% to 20%, which is advantageous in that it is possible to ensure that the light emitting element 42 and the auxiliary element 47 have a sufficient area for design and to avoid the difficulty in design or production and manufacture due to the excessively small area of the auxiliary element 47. The driving TFT 44 occupies a larger area in the light emitting unit 41 and has a larger area for designing the first source 443 and the first drain 444, thereby greatly improving the driving capability of the driving TFT 44.
In an embodiment, the light emitting element 42 and the auxiliary element 47 may be disposed at any side of the driving TFT 44, preferably, at a side close to the first drain electrode 444, and in particular, at a side of the second comb handle 4441 or at a side of the second comb teeth 4442 to facilitate connection of the light emitting element 42 and the auxiliary element 47 to the first drain electrode 444. For example, in fig. 8, the light emitting element 42 and the auxiliary element 47 are disposed on one side of the second comb 4442, and the first source 443 and the first drain 444 are adjusted corresponding to the shapes of the light emitting element 42 and the auxiliary element 47. The second comb handle 4441 of the first drain electrode 444 is divided into two parts, and the lengths of the second comb teeth and the first comb teeth are respectively shortened. The channel 4420 is still square-wave shaped, except that a portion of the square wave has a correspondingly reduced height.
Of course, it is understood that the auxiliary element 47 of the light emitting element 42 may be disposed on the second comb handle 4441 side of the first drain electrode 444, and the middle portion of the second comb handle 4441 may be disposed closer to the first comb handle 4431. Any design that does not alter the comb-like staggered distribution of the first source 443 and the first drain 444 may be applied thereto.
As shown in fig. 9, a schematic structural diagram of a driving TFT 44 according to a third embodiment of the present invention is provided. The 'staggered distribution' is a spiral staggered distribution. The first source 443 and the first drain 444 are both in a stripe shape and are spirally distributed, the first source 443 is arranged between the gaps of the spiral first drain 444, and in fig. 9, the gaps between the first source 443 and the first drain 444 form channels 4420, and the channels 4420 are correspondingly also in a stripe shape and are spirally distributed. Current flows from the first source 443 to the first drain 444, the width of the gap between the first source 443 and the first drain 444 is the length of the channel 4420, and the total length of the spiral is the width of the channel 4420, thereby greatly increasing the width and width-to-length ratio of the channel 4420, thereby facilitating the improvement of the driving capability of the driving TFT 44.
The first source 443 and the first drain 444 are both rectangular spiral to correspond to the shape of the light emitting unit 41, thereby improving the area utilization of the light emitting unit 41.
The width of the gap between the first source 443 and the first drain 444, i.e., the length L of the channel 4420, is 1 to 10 micrometers, which may be a minimum of 1 micrometer.
The first gate 441 is correspondingly strip-shaped and spirally distributed, and is disposed corresponding to the spiral channel 4420 and overlaps a portion between the first source 443 and the first drain 444. It should be appreciated that the first gate 441 may correspond only to the channel 4420, and thus, in fig. 9, the first gate 441 is a gap corresponding to the first source 443 and the first drain 444.
It should be understood that the above-given comb-like staggered distribution and spiral-like staggered distribution are not mutually exclusive, and that the staggered distribution of the first source 443 and the first drain 444 may not be one in one driving TFT 44.
As shown in fig. 10, the structure of the light emitting unit 41 according to the fourth embodiment of the present invention is schematically shown, wherein the driving TFT 44 is shown in the above third embodiment, the projected area of the driving TFT is 70% -95, preferably 75% -85%, more preferably 80% -85%, and the area of the light emitting element 42 and the auxiliary element 47 is less than or equal to 30%, preferably 15% -25%, more preferably 15% -20% of the area of the light emitting unit 41. The driving TFT 44 occupies a larger area in the light emitting unit 41 and has a larger area for designing the first source 443 and the first drain 444, thereby greatly improving the driving capability of the driving TFT 44.
The light emitting element 42 and the auxiliary element 47 may be disposed at either side of the driving TFT 44. As shown in fig. 10, the spiral shape of the first source 443 and the first drain 444 is adaptively adjusted according to the light emitting element 42, the switching TFT 45, and the capacitor 46 to maximize the area of the light emitting unit 41.
As shown in the present embodiment, the light emitting element 42 and the auxiliary element 47 are disposed at one side of the driving TFT 44 and occupy one corner of the light emitting unit 41, and at this time, the first source 443 and the first drain 444 may be distributed in a rectangular spiral shape at one side of the light emitting element 42 and the auxiliary element 47, and a part of the area of the light emitting unit 41 is inevitably wasted. If the area of the light emitting unit 41 is utilized as much as possible, the first source 443 and the first drain 444 cannot be staggered according to a simple rectangular spiral shape, and other staggered distributions, such as comb-tooth-shaped staggered distribution, can be designed on the basis of the spiral shape. At least a portion of the first source 443 and the first drain 444 are stripe-shaped and are staggered in a spiral shape, and a portion of the first source 443 and the first drain 444 may be stripe-shaped and are staggered in other shapes.
Specifically, the first source 443 includes source bars 4433 in a spiral shape, the first drain 444 includes drain bars 4443 in a spiral shape, the source bars 4433 and the drain bars 4443 are spirally staggered to form a spiral first gap, and the first active layer 442 includes a spiral first channel 4425 formed corresponding to the first gap between the source bars 4433 and the drain bars 4443. The first source 443 further includes source comb teeth 4434 extending from the source stripe 4433, the second drain 454 further includes drain comb teeth 4444 extending from the drain stripe 4443, the source comb teeth 4434 are spaced apart from the drain comb teeth 4444 and form a second gap preventing waves, and the channel 4420 further includes a second channel 4426 having square waves formed between the source comb teeth 4434 and the drain comb teeth 4444.
The first channel 4425 and the second channel 4426 are connected to form a complete channel 4420, and the overall length of the channel 4420 is consistent by further designing the comb-shaped staggered distribution on the basis of the spiral staggered distribution, so that the stability of the driving current of the driving TFT 44 is guaranteed.
It is to be understood that the staggered distribution is not limited to the above-given comb-like staggered distribution and spiral staggered distribution, and that the comb-like staggered distribution and the spiral staggered distribution are not limited to the specific illustrations of the above two embodiments, and any staggered distribution that can cause the channels 4420 to meander and maximize the area of the light emitting unit 41 should fall within the disclosure of the present invention.
As shown in fig. 11, a schematic structural diagram of a light emitting unit 41 according to a fifth embodiment of the present invention is provided, in which, in addition to the above-described third and fourth embodiments, a light emitting element 42 and an auxiliary element 47 are disposed at a central position of the light emitting unit 41, and the light emitting element 42 is connected to a first drain 444 at a terminal of the first drain 444 at the center of the light emitting unit 41. This has advantages in that not only the light emitted from the light emitting element 42 can be made more symmetrical, but also the electrical connection between the light emitting element 42 and the driving TFT 44 can be made more convenient without changing the spiral shape of the first source 443 and the first drain 444 as in the fourth embodiment of fig. 10, thereby reducing the difficulty in process design and manufacturing.
As can be seen from the description of the embodiments above, in the scheme provided by the present invention, the driving TFT 44 is fabricated with a larger area in the entire light emitting unit 41, and the first source 443 and the first drain 444 of the driving TFT 44 are designed to be staggered, and the channel 4420 is formed zigzag and continuously. For the driving TFT 44, the driving current I thereof can be approximately described by the following relationship (1)
Where W is the width of channel 4420, L is the length of channel 4420, and k1 is the scaling factor. The invention increases the width W of the conductive channel 4420 as much as possible under the condition that the length L of the channel 4420 is constant, thereby improving the current driving capability of the a-Si TFT. With the solution provided by the present invention, the length L of the channel 4420 is not easily changed after the minimum, but the TFT element fills the whole area as much as possible, so as to satisfy
W=k 2 a formula (2);
Where a is the total area of the driving TFT 44 and k2 is the scaling factor. The driving TFT 44 should occupy a large area in the light emitting cell 41 to elevate W, the length L of the channel 4420 being constant, and the width W being approximately proportional to the area of the light emitting cell 41. Can be obtained by combining the formula (1) with the formula (2)
I=ka formula (3);
Wherein the method comprises the steps of Accordingly, in the embodiment of the present invention, the driving current is proportional to the area of the driving TFT 44.
The driving current of a-Si TFT with the traditional size is (10 -6~10-5) uA level, while in the invention, the side length of a light-emitting unit 41 in a backlight module 3 using Mini-LED is (10 1~103) times of the pixel point in OLED display, and the area is (10 2~106) times, so that the driving current can be enlarged by about (10 2~106) times, the driving current reaches (10 -4~101) mA level, and the driving requirement of the Mini-LED in the backlight module 3 can be met.
The above embodiments describe how to increase the area utilization of the driving TFT 44 in the light emitting unit 41 in the planar area of the light emitting unit 41 to increase the aspect ratio and driving capability of the driving TFT 44, and on the basis of this, the following embodiments are also provided to further increase the area occupancy of the driving TFT 44.
As shown in fig. 12 to 14, a schematic structural diagram of a light emitting unit 41 according to a sixth embodiment of the present invention is provided. The driving TFT 44 and the auxiliary element 47 of the light emitting unit 41 are provided as one layer on the substrate 40, the projected area occupied by the driving TFT 44 and the auxiliary element 47 is the area of the entire light emitting unit 41, and the light emitting element 42 is provided as another layer above the driving TFT 44 and the auxiliary element 47 (filling of the light emitting element 42 means that the light emitting element 42 is provided in a different layer from the driving TFT 44), whereby the area of the light emitting element 42 is saved for the design of the driving TFT 44, the area ratio and the width-to-length ratio occupied by the driving TFT 44 can be further improved, and the driving capability of the driving TFT 44 can be improved.
The passivation layer 71 is formed on the first source 443 and the first drain 444, and the passivation layer 71 has a first via 74 corresponding to the first drain 444 and a second via 76 corresponding to the first source 443, the first via 74 is filled with a first metal conductive pillar 75, the second via 76 is filled with a second metal conductive pillar 77 to draw the first source 443 and the first drain 444 to the surface of the passivation layer 71, respectively, and the passivation layer 71 is further formed with a wire 72 for connecting the first drain 444 and the light emitting element 42 and a power line 73 for connecting a driving power supply and the first source 443. Thereby, the light emitting element 42 does not occupy the area of the light emitting unit 41, the area of the driving TFT 44 can be further increased, the width of the channel 4420 can be further increased, and the driving capability can be further increased.
In the present embodiment, the shape of the first source 443 and the first drain 444 may be substantially any shape. Preferably, the shapes of the first source electrode 443 and the first drain electrode 444 adopt the comb-tooth shape described in the first embodiment and/or the spiral shape described in the third embodiment, and since the auxiliary element 47 and the driving TFT 44 are disposed below the passivation layer 71, the driving TFT 44 may adopt the design as shown in fig. 10 in the same layer, that is, in common to occupy the total area of the light emitting unit 41. In this way, the width-to-length ratio of the driving TFT 44 is also greatly increased in addition to the increase in the area occupied by the driving TFT 44.
Preferably, the first metal conductive post 75 and the second metal conductive post 77 are disposed near two ends of the trench 4420, respectively, which has the advantage that the distance between the first metal conductive post 75 and the second metal conductive post 77 can be increased as much as possible or even maximized, thereby avoiding any possible electrical connection between the first metal conductive post 75 and the second metal conductive post 77 due to process problems during the process of depositing and etching the metal layers of the conductive posts.
The auxiliary member 47 may be located at one side or the center of the driving TFT 44 as shown with reference to fig. 10 and 11. Since the connection between the light emitting element 42 and the first drain electrode 444 is achieved through the wire 72 and the first metal conductive post 75, the projection of the light emitting element 42 in the light emitting unit 41 may be located at virtually any position, such as an edge position or a center position. In a preferred embodiment, the light emitting element 42 is located at the center in the light emitting unit 41, and as such, the light emitted from the light emitting element 42 can be more symmetrical, which is beneficial to improving the uniformity of the backlight source of the backlight module 3 for the use of the light emitting unit 41 in the backlight module 3.
As shown in fig. 15 to 17, a structure of a light emitting unit 41 according to a seventh embodiment of the present invention is schematically shown. In the present embodiment, the driving TFT 44 is constituted by M-layer (M is a positive integer greater than or equal to 2) sub-TFTs 80 sequentially formed on the substrate 40. The one layer of sub-TFTs 80 closest to the substrate 40 is the first layer of sub-TFTs 80, and the one layer of sub-TFTs 80 furthest from the substrate 40 is the mth layer of sub-TFTs 80. Each of the sub-TFTs 80 is provided in a bottom gate type, and includes a sub-gate electrode formed on the substrate 40, a sub-gate insulating layer 52 formed on the first substrate 40, a sub-active layer formed on the sub-gate insulating layer 52, and sub-source and sub-drain electrodes formed on the sub-active layer. The sub-active layer includes a sub-intrinsic semiconductor layer formed on the sub-gate insulating layer 52 and sub-ohmic contact layers formed over both sides of the sub-intrinsic semiconductor layer. The material of the sub-intrinsic semiconductor layer is amorphous silicon, and the sub-ohmic contact layer is amorphous silicon doped with N-type ions, such As nitrogen (N), phosphorus (P), and arsenic (As), i.e., each sub-TFT 80 is an a-Si TFT. A passivation layer 71 is disposed between adjacent two sub-TFTs 80.
The M-layer sub-gates are electrically connected by a first electrical conductor 87. The first electrical conductor 87 is disposed outside the M-layer sub-source, sub-drain and sub-active layer, and only penetrates the M-1 layer sub-gate insulating layer 52 and the M-1 layer passivation layer 71. As shown in fig. 17, the first electrical conductor 87 is illustrated with a broken line, which means that the first electrical conductor 87 is located outside the region that can be shown in fig. 17, and does not mean that a metal structure such as a sub-source is penetrated, as will be understood. The M-layer sub-gates constitute a first gate 441.
The M-layer sub-sources are electrically connected by a second electrical conductor 88. The second electrical conductor 88 extends through the M-1 gate insulation layer 52 and the M-1 passivation layer 71. The M-layer sub-source constitutes a first source 443.
The second electrical conductor 88 is further electrically connected to the second metal conductive post 77 disposed on the mth layer of sub-source, so that the M layer of sub-source is led out above the passivation layer 71 and is connected to the driving power source through the power line 73.
The M-layer sub-drains are electrically connected by a third electrical conductor 89. The third electrical conductor 89 extends through the M-1 gate insulation layer 52 and the M-1 passivation layer 71. The M-layer sub-drain constitutes a first drain 444.
The third electrical conductor 89 is further electrically connected to the first metal conductive post 75 disposed on the mth layer of sub-drain, so that the M layer of sub-drain is led out above the passivation layer 71 and connected to the light emitting element 42 through the wire 72.
The auxiliary element 47 is disposed in a layer of the mth layer sub-TFT 80, and the switching TFT 45 may be disposed in the same layer as the mth layer sub-TFT 80 (the second gate 451 is disposed in the same layer as the mth layer sub-gate, and the second source 453 and the second drain 454 are disposed in the same layer as the mth layer sub-source and the sub-drain). The second drain 454 of the switching TFT 45 is connected to the sub-gate of the mth layer sub-TFT 80, one end of the capacitor 46 is connected between the sub-gate of the mth layer sub-TFT 80 and the second drain 454, and the other end of the capacitor 46 is connected between the driving power source anode and the mth layer sub-source.
In the present embodiment, by the arrangement of the M-layer sub-TFTs 80, the area of the switching TFT 45 is increased by about M times, thereby increasing the driving capability thereof. The ratio of the width to the length of each sub-TFT 80 is not changed, and the scaling factor K2 is increased by a factor of about M.
In this embodiment, each of the sub-TFTs 80 may be arranged in a comb-like staggered arrangement as described in the first embodiment and/or in a spiral staggered arrangement as described in the third embodiment. In this way, the width-to-length ratio of the driving TFT 44 is also greatly increased in addition to the increase in the area occupied by the driving TFT 44.
In a preferred embodiment, the third electrical conductor 89 corresponds to the position of the first metal conductive post 75, the second electrical conductor 88 corresponds to the position of the second metal conductive post 77, and the first metal conductive post 75 and the second metal conductive post 77 are disposed at two ends of the trench 4420, respectively, which has advantages of maximizing the distance between the second electrical conductor 88 and the third electrical conductor 89, avoiding any possible electrical connection between the second electrical conductor and the third electrical conductor during each deposition and etching process, and using a photomask for penetrating the gate insulation layer 52 and the passivation layer 71, thereby reducing the production cost and the complexity of the process.
The projection of the light emitting element 42 in the light emitting unit 41 may be located virtually anywhere. In a preferred embodiment, the light emitting element 42 is located at the center in the light emitting unit 41, and as such, the light emitted from the light emitting element 42 can be more symmetrical, which is beneficial to improving the uniformity of the backlight source of the backlight module 3 for the use of the light emitting unit 41 in the backlight module 3.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.

Claims (8)

1. A light source board is characterized by comprising a plurality of light emitting units arranged on a substrate, wherein each light emitting unit comprises a light emitting element and a driving thin film transistor for driving the light emitting element;
The driving thin film transistor comprises a first grid electrode, a first active layer, a first source electrode and a first drain electrode, wherein one part of the first source electrode and one part of the first drain electrode are distributed in a comb-tooth shape in a staggered manner, the other part of the first source electrode and the other part of the first drain electrode are distributed in a spiral shape in a staggered manner, a channel is formed between the first active layer and the first source electrode and the first drain electrode, one part of the channel is in a spiral shape, and the other part of the channel is in a square wave shape so as to increase the width of the channel;
The area ratio of the projection area of the driving thin film transistor in the light-emitting unit is 70% -95%, and the projection of the light-emitting element is positioned at the center of the light-emitting unit.
2. The light source board of claim 1, wherein a passivation layer is disposed on the driving thin film transistor, a first via is disposed on the passivation layer corresponding to the first drain, and the light emitting element is electrically connected to the first drain through the first via.
3. The light source board of claim 2, wherein the first via is filled with a first metal conductive pillar, a wire is disposed on the passivation layer, and the light emitting element is electrically connected to the first drain electrode through the wire and the first metal conductive pillar.
4. The light source board of claim 1, wherein the light emitting unit further comprises a switching thin film transistor for controlling the driving thin film transistor, and a capacitor for providing a sustain voltage for turning on the driving thin film transistor.
5. The light source plate of claim 4, wherein the switching thin film transistor comprises a second gate electrode, a second active layer, a second source electrode, and a second drain electrode, the second drain electrode being connected to the first gate electrode of the driving thin film transistor.
6. The light source plate of claim 4, wherein the switching thin film transistor and the capacitor are disposed on one side of the driving thin film transistor.
7. The light source board of claim 2, wherein a second via is disposed on the passivation layer corresponding to the first source, the second via is filled with a second metal conductive pillar, and the first source is led out to an upper surface of the passivation layer through the second metal conductive pillar.
8. A backlight module comprising the light source plate of any one of claims 1 to 7.
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CN111092092B (en) * 2018-10-08 2025-06-06 Tcl科技集团股份有限公司 Active backlight LED light source board and backlight module driven by a-Si TFT device
US11587917B2 (en) 2020-05-06 2023-02-21 Tcl China Star Optoelectronics Technology Co., Ltd. Backlight module, display panel and electronic device
CN111580304B (en) * 2020-05-06 2021-09-24 Tcl华星光电技术有限公司 Backlight module, display panel and electronic device
CN112736178B (en) * 2020-12-23 2022-04-26 惠州市华星光电技术有限公司 Mini-LED device and manufacturing method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202142535U (en) * 2011-07-22 2012-02-08 京东方科技集团股份有限公司 Film field effect transistor and LCD
CN102800692A (en) * 2012-08-09 2012-11-28 深圳市华星光电技术有限公司 Thin film transistor construction with large channel width and thin film transistor substrate circuit
CN105118865A (en) * 2015-09-22 2015-12-02 京东方科技集团股份有限公司 Film transistor, pixel structure, display substrate, display panel and display device
CN209199929U (en) * 2018-10-08 2019-08-02 Tcl集团股份有限公司 Light source board and backlight module
CN209199928U (en) * 2018-10-08 2019-08-02 Tcl集团股份有限公司 Light source board, backlight module and display device
CN209401628U (en) * 2018-10-08 2019-09-17 Tcl集团股份有限公司 The active backlight LED light source board and backlight module of a-Si TFT device drive

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3939666B2 (en) * 2002-01-18 2007-07-04 株式会社半導体エネルギー研究所 LIGHT EMITTING DEVICE AND ELECTRONIC DEVICE
KR20070070649A (en) * 2005-12-29 2007-07-04 삼성에스디아이 주식회사 Electron emitting device, backlight unit having the same, flat panel display device having the same, and driving method of electron emitting device
JP4348644B2 (en) * 2006-09-26 2009-10-21 セイコーエプソン株式会社 Thin film transistor, electro-optical device and electronic apparatus
CN104575383A (en) * 2015-01-14 2015-04-29 广东威创视讯科技股份有限公司 LED lamp module, manufacturing method thereof and LED lamp plate

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202142535U (en) * 2011-07-22 2012-02-08 京东方科技集团股份有限公司 Film field effect transistor and LCD
CN102800692A (en) * 2012-08-09 2012-11-28 深圳市华星光电技术有限公司 Thin film transistor construction with large channel width and thin film transistor substrate circuit
CN105118865A (en) * 2015-09-22 2015-12-02 京东方科技集团股份有限公司 Film transistor, pixel structure, display substrate, display panel and display device
CN209199929U (en) * 2018-10-08 2019-08-02 Tcl集团股份有限公司 Light source board and backlight module
CN209199928U (en) * 2018-10-08 2019-08-02 Tcl集团股份有限公司 Light source board, backlight module and display device
CN209401628U (en) * 2018-10-08 2019-09-17 Tcl集团股份有限公司 The active backlight LED light source board and backlight module of a-Si TFT device drive

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