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CN111092038A - Combined wafer box - Google Patents

Combined wafer box Download PDF

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Publication number
CN111092038A
CN111092038A CN201911256893.5A CN201911256893A CN111092038A CN 111092038 A CN111092038 A CN 111092038A CN 201911256893 A CN201911256893 A CN 201911256893A CN 111092038 A CN111092038 A CN 111092038A
Authority
CN
China
Prior art keywords
net
wafers
isolation net
box body
fixed pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201911256893.5A
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Chinese (zh)
Inventor
许正根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201911256893.5A priority Critical patent/CN111092038A/en
Publication of CN111092038A publication Critical patent/CN111092038A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333Trays for chips

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention relates to the technical field of integrated circuits and discloses a combined wafer box which comprises a box body, wherein a dividing net is movably arranged on the inner wall of the box body, and the dividing net comprises a fixed pipe and an isolation net. The combined wafer box has the advantages that when the fixed tube and the isolation net are not inflated, the occupied space is small, the number of wafers placed is not reduced, after the wafers are placed, the fixed tube and the isolation net are inflated, the fixed tube expands to be tightly attached to a carrier of the wafers, the fixing effect and the buffering effect are better, the fragmentation of the wafers is reduced, meanwhile, when the wafers are cracked due to large impact, the isolation net isolates two wafers, the probability that fragments damage other wafers is reduced, the box body and the separation net are combined and are separately cleaned, narrow gaps do not exist, the cleaning effect is better, the number of internal particles is small, meanwhile, expansion joints rub with each other to generate static electricity when the isolation net expands, tiny particles in a wafer box can be restrained, and the probability that the particles pollute the wafers is further reduced.

Description

Combined wafer box
Technical Field
The invention relates to the technical field of integrated circuits, in particular to a combined wafer box.
Background
The wafer box is used for transporting and storing wafers, the phenomenon of breakage and damage of the wafers can occur in the transportation process, as a plurality of wafers are stored in the wafer box, wafer fragments can diffuse in the box and pollute other wafers, along with the progress of the process, the requirements on the quality of the wafers are higher and higher, the wafers can be scrapped due to slight pollution, the value of the wafers is higher and higher, the loss caused by pollution caused by damage of the wafers is more and more important, partition plates are arranged in some wafer boxes and are used for separating the wafer box into a plurality of parts so as to reduce the loss caused by accidental fragments, however, the partition plates cannot be arranged too much, otherwise, the capability of loading the wafers in the wafer box is reduced, and a single chamber still has a plurality of wafers and can be polluted by the fragments.
Further, the requirement for improving the cleanliness of the wafer surface is higher and higher, although the wafer box is in a closed state, the friction between the wafer carrier and the wafer box slot and between the box cover and the box body can generate particles, and the box cover can adsorb the particles in the air when opened, so that the wafers in the box can be polluted along with the increase of the particles in the box.
Disclosure of Invention
Aiming at the defects of the background technology, the invention provides a technical scheme of a combined wafer box, which has the advantages of high cleanliness and easy cleaning and solves the problems in the background technology.
The invention provides the following technical scheme: a combined wafer box comprises a box body, wherein a dividing net is movably mounted on the inner wall of the box body and comprises a fixed pipe and an isolating net, the fixed pipe is tightly attached to the inner wall of the dividing net, the fixed pipe and the isolating net are inflated and expanded, meshes of the isolating net are sealed after the isolating net is inflated and expanded, and static electricity can be generated by friction of the isolating net.
Preferably, the fixed pipes are connected in series through connecting belts, positioning plates are arranged at the front end and the rear end of the dividing net, and the positioning plates are movably connected with the inner side wall of the box body through clamping strip clamping groove structures.
Preferably, the fixed pipe is communicated with the isolation net, and the bottom of the fixed pipe is communicated with the telescopic pipe and is connected with an external inflating device through the telescopic pipe.
Preferably, the isolation net comprises expansion joints and limiting pipes, the limiting pipes are in a tightened state, and the expansion joints and the limiting pipes are in a crisscross state.
Preferably, the expansion joint is a double-layer structure of an expansion air bag outside the middle vent pipe.
The invention has the following beneficial effects:
1. according to the combined wafer box, the fixed tube and the isolation net occupy less space when not inflated, the number of wafers is not reduced, the fixed tube and the isolation net are inflated after the wafers are placed, the fixed tube expands to be tightly attached to the carrier of the wafers, the fixing effect and the buffering effect are better, the fragmentation of the wafers is reduced, and meanwhile, when the wafers are cracked due to large impact, the two wafers are isolated by the isolation net, the probability that fragments damage other wafers is reduced, and the loss is effectively reduced.
2. This combination formula wafer box, box body and cutting net are the combination form, separately clear up, do not have narrow and small gap, and clean effect is better, and inside particulate matter is whole less, and the expansion joint rubs mutually when the separation net inflation simultaneously and produces static, can restrain the tiny particle in the wafer case, further reduces the probability that the particulate matter pollutes the wafer, guarantees that the quality of wafer does not descend.
Drawings
FIG. 1 is a front view of the present invention;
FIG. 2 is a top view of a cutting web according to the present invention;
FIG. 3 is a side view of the present invention;
FIG. 4 is a schematic view of a partial structure of a partition net according to the present invention;
fig. 5 is a schematic view of an expansion joint of the present invention.
In the figure: 1. a box body; 2. dividing the net; 21. a fixed tube; 22. an isolation net; 22a, a limiting pipe; 22b, an expansion joint; 23. a connecting belt; 24. positioning a plate; 25. a telescopic tube.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-5, a combined wafer box comprises a box body 1, a dividing net 2 is movably mounted on the inner wall of the box body 1, the box body 1 and the dividing net 2 are separately arranged, the dividing net 2 is provided with a plurality of groups which can be combined as required to make the cleaning simpler and improve the cleanness, the dividing net 2 comprises a fixed tube 21 and an isolating net 22, the fixed tube 21 is tightly attached to the inner wall of the dividing net 2, the fixed tube 21 and the isolating net 22 are inflated and expanded, the adjacent fixed tubes 21 on the same side can be contacted with each other after being expanded, a wafer is inserted between the two fixed tubes 21, the fixed tube 21 is expanded to clamp the wafer more fixedly, and has the buffer function to reduce the wafer crushing probability, the isolating net 22 is inflated and expanded to seal meshes, the isolating net 22 completely isolates the wafer after being expanded, the wafer crushing has lower influence on other wafers, the isolating net 22 can generate static electricity by friction to adsorb micro particles in the space of the wafer box, reducing the probability of particle contamination of the wafer.
Wherein, fixed pipe 21 passes through connecting band 23 and establishes ties, and connecting band 23 makes for elastic material, and the front and back end of cutting apart net 2 all is equipped with locating plate 24, and locating plate 24 is through the inside wall swing joint of card strip draw-in groove structure and box body 1, and fixed pipe 21, connecting band 23 and locating plate 24 constitute a whole, and locating plate 24 fixed position, fixed pipe 21 supports each other after sufficient gas inflation, and then makes whole assurance fixed, and fixed pipe 21 is when aerifing, and fixed pipe 21 can relative movement.
Wherein, the fixed pipe 21 is communicated with the separation net 22, the bottom of the fixed pipe 21 is communicated with the telescopic pipe 25 and is connected with an external inflation device through the telescopic pipe 25, the telescopic pipe 25 is a telescopic pipe body, the embodiment uses a corrugated pipe, and the telescopic pipe 25 is provided with an inflation valve which penetrates through the side wall of the box body 1 and is connected with the external inflation device through the inflation valve.
The isolation net 22 comprises expansion joints 22a and limiting pipes 22b, the limiting pipes 22b are in a tightened state and limit the whole moving space of the isolation net 22, so that the isolation net 22 is prevented from contacting with wafers, the expansion joints 22a and the limiting pipes 22b are in a crisscross state, and the expansion joints 22a expand and block the space between the wafers.
The expansion joint 22a is a double-layer structure of an expansion air bag outside the middle breather pipe, so that the expansion effect is better, and the plugging effect is better.
The working principle and the using process of the invention are as follows:
the box body 1 and the segmentation net 2 are taken out in a dust-free environment, the segmentation net 2 is placed in the box body 1 for arrangement, a communicating pipe of a telescopic pipe 25 is communicated with an inflation valve of the box body 1, positioning plates 24 at two ends are inserted into corresponding slots of the box body 1, wafers are sequentially inserted between two fixed pipes 21, after the wafers are placed, a box cover of the box body 1 is closed, the fixed pipes 21 and the isolation net 22 are inflated through the inflation valve, the fixed pipes 21 are expanded to tightly attach to carriers on the outer side of the wafers to clamp the wafers, meanwhile, the isolation net 22 is expanded to seal a space between the two wafers, expansion joints 22a rub with each other to generate static electricity when being expanded, particles in the box are more easily attached to the surface of the isolation net 22, the probability that the particles are attached to the wafers is reduced, and the box body 1 and the segmentation net 2 are separately.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (5)

1. A modular wafer box, includes box body (1), its characterized in that: the inner wall of the box body (1) is movably provided with a separation net (2), the separation net (2) comprises a fixed pipe (21) and an isolation net (22), the fixed pipe (21) is tightly attached to the inner wall of the separation net (2), the fixed pipe (21) and the isolation net (22) are inflated and expanded, the isolation net (22) is inflated and expanded to seal meshes, and static electricity can be generated by friction of the isolation net (22).
2. The modular wafer cassette of claim 1, wherein: the fixed pipe (21) is connected in series through a connecting belt (23), the front end and the rear end of the dividing net (2) are respectively provided with a positioning plate (24), and the positioning plates (24) are movably connected with the inner side wall of the box body (1) through clamping strip clamping groove structures.
3. The modular wafer cassette of claim 1, wherein: the fixed pipe (21) is communicated with the isolation net (22), and the bottom of the fixed pipe (21) is communicated with a telescopic pipe (25) and is connected with an external inflating device through the telescopic pipe (25).
4. The modular wafer cassette of claim 1, wherein: the isolation net (22) comprises expansion joints (22a) and limiting pipes (22b), the limiting pipes (22b) are in a tightened state, and the expansion joints (22a) and the limiting pipes (22b) are in a crisscross state.
5. The modular wafer cassette of claim 4, wherein: the expansion joint (22a) is a double-layer structure of an expansion air bag outside the middle vent pipe.
CN201911256893.5A 2019-12-10 2019-12-10 Combined wafer box Pending CN111092038A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911256893.5A CN111092038A (en) 2019-12-10 2019-12-10 Combined wafer box

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911256893.5A CN111092038A (en) 2019-12-10 2019-12-10 Combined wafer box

Publications (1)

Publication Number Publication Date
CN111092038A true CN111092038A (en) 2020-05-01

Family

ID=70394944

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201911256893.5A Pending CN111092038A (en) 2019-12-10 2019-12-10 Combined wafer box

Country Status (1)

Country Link
CN (1) CN111092038A (en)

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050098473A1 (en) * 2003-11-10 2005-05-12 3M Innovative Properties Company Container for containing semiconductor wafers
US20100032331A1 (en) * 2008-08-07 2010-02-11 Pao-Yi Lu Carrier of reticle pod and the fixing element thereof
TW201009986A (en) * 2008-08-27 2010-03-01 Gudeng Prec Industral Co Ltd A wafer container with at least one supporting module having a long slot
CN101685790A (en) * 2008-09-27 2010-03-31 家登精密工业股份有限公司 Front opening wafer box configured with inflatable support member module
WO2011135639A1 (en) * 2010-04-28 2011-11-03 パナソニック株式会社 Container and method for storing semiconductor wafer
CN202159652U (en) * 2011-07-21 2012-03-07 家登精密工业股份有限公司 Front-loading pods with inflatable support modules
TW201215549A (en) * 2010-10-12 2012-04-16 Gudeng Prec Industral Co Ltd A wafer container with at least one supporting module having a long slot
TW201226288A (en) * 2010-12-27 2012-07-01 Gudeng Prec Industral Co Ltd A wafer container with at least one supporting module having a long slot
CN102610547A (en) * 2011-01-25 2012-07-25 家登精密工业股份有限公司 Front opening wafer box configured with inflatable support member module
US20130186803A1 (en) * 2012-01-20 2013-07-25 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer transfer pod for reducing wafer particulate contamination
US20150083638A1 (en) * 2013-09-25 2015-03-26 International Business Machines Corporation Package assembly for thin wafer shipping and method of use
CN106848003A (en) * 2017-04-11 2017-06-13 常州亿晶光电科技有限公司 Graphite boat ceramic jacket rapid installation device
CN109606940A (en) * 2018-11-27 2019-04-12 江门市利诺达电路科技有限公司 A kind of packing box of circuit board
CN208938943U (en) * 2018-08-22 2019-06-04 浙江众晶电子有限公司 It is a kind of for storing the container of monocrystalline silicon piece
CN209045515U (en) * 2018-11-12 2019-06-28 上海华力微电子有限公司 A kind of wafer cassette that can be reduced wafer transport and scrap

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050098473A1 (en) * 2003-11-10 2005-05-12 3M Innovative Properties Company Container for containing semiconductor wafers
US20100032331A1 (en) * 2008-08-07 2010-02-11 Pao-Yi Lu Carrier of reticle pod and the fixing element thereof
TW201009986A (en) * 2008-08-27 2010-03-01 Gudeng Prec Industral Co Ltd A wafer container with at least one supporting module having a long slot
CN101685790A (en) * 2008-09-27 2010-03-31 家登精密工业股份有限公司 Front opening wafer box configured with inflatable support member module
WO2011135639A1 (en) * 2010-04-28 2011-11-03 パナソニック株式会社 Container and method for storing semiconductor wafer
TW201215549A (en) * 2010-10-12 2012-04-16 Gudeng Prec Industral Co Ltd A wafer container with at least one supporting module having a long slot
TW201226288A (en) * 2010-12-27 2012-07-01 Gudeng Prec Industral Co Ltd A wafer container with at least one supporting module having a long slot
CN102610547A (en) * 2011-01-25 2012-07-25 家登精密工业股份有限公司 Front opening wafer box configured with inflatable support member module
CN202159652U (en) * 2011-07-21 2012-03-07 家登精密工业股份有限公司 Front-loading pods with inflatable support modules
US20130186803A1 (en) * 2012-01-20 2013-07-25 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer transfer pod for reducing wafer particulate contamination
US20150083638A1 (en) * 2013-09-25 2015-03-26 International Business Machines Corporation Package assembly for thin wafer shipping and method of use
CN106848003A (en) * 2017-04-11 2017-06-13 常州亿晶光电科技有限公司 Graphite boat ceramic jacket rapid installation device
CN208938943U (en) * 2018-08-22 2019-06-04 浙江众晶电子有限公司 It is a kind of for storing the container of monocrystalline silicon piece
CN209045515U (en) * 2018-11-12 2019-06-28 上海华力微电子有限公司 A kind of wafer cassette that can be reduced wafer transport and scrap
CN109606940A (en) * 2018-11-27 2019-04-12 江门市利诺达电路科技有限公司 A kind of packing box of circuit board

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Application publication date: 20200501