CN111073213A - Resin composition and high-frequency high-speed metal-based copper-clad plate - Google Patents
Resin composition and high-frequency high-speed metal-based copper-clad plate Download PDFInfo
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- CN111073213A CN111073213A CN201911382666.7A CN201911382666A CN111073213A CN 111073213 A CN111073213 A CN 111073213A CN 201911382666 A CN201911382666 A CN 201911382666A CN 111073213 A CN111073213 A CN 111073213A
- Authority
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- China
- Prior art keywords
- parts
- resin composition
- resin
- clad plate
- based copper
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 35
- 239000002184 metal Substances 0.000 title claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 37
- 229920005989 resin Polymers 0.000 claims abstract description 37
- 239000005062 Polybutadiene Substances 0.000 claims abstract description 19
- 229920002857 polybutadiene Polymers 0.000 claims abstract description 19
- 239000003999 initiator Substances 0.000 claims abstract description 16
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000000945 filler Substances 0.000 claims abstract description 8
- 229910052582 BN Inorganic materials 0.000 claims description 8
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- 230000008054 signal transmission Effects 0.000 abstract description 6
- 230000010365 information processing Effects 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 8
- 230000009477 glass transition Effects 0.000 description 7
- 238000012360 testing method Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 238000005191 phase separation Methods 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001938 differential scanning calorimetry curve Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/34—Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C08L61/04, C08L61/18 and C08L61/20
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B25/00—Layered products comprising a layer of natural or synthetic rubber
- B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B25/00—Layered products comprising a layer of natural or synthetic rubber
- B32B25/16—Layered products comprising a layer of natural or synthetic rubber comprising polydienes homopolymers or poly-halodienes homopolymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention provides a resin composition and a high-frequency high-speed metal-based copper-clad plate, wherein the resin composition comprises, by weight, 10-50 parts of modified polybutadiene resin, 10-60 parts of benzoxazine resin, 0.5-4 parts of initiator and 50 parts of filler. The high-frequency high-speed metal-based copper-clad plate comprises the resin composition. The resin composition can satisfy the requirements of high frequency of electronic signal transmission and high speed of information processing.
Description
Technical Field
The invention relates to the technical field of metal-based copper-clad plates, in particular to a resin composition and a high-frequency high-speed metal-based copper-clad plate.
Background
In recent years, with the rapid development of the information industry, the demand for low-dielectric metal-based copper clad laminate is increasing, and the sheet material is required to have lower dielectric constant and smaller dielectric loss. While the ordinary FR-4 has higher dielectric constant and higher dielectric loss, which cannot meet the requirements of high-frequency signal transmission speed and signal transmission integrity.
Disclosure of Invention
A first object of the present invention is to provide a resin composition that can satisfy the requirements for higher frequency of electronic signal transmission and higher speed of information processing.
The second purpose of the invention is to provide a high-frequency high-speed metal-based copper-clad plate with the resin composition.
In order to achieve the first object, the present invention provides a resin composition comprising, in parts by weight, 10 to 50 parts of a modified polybutadiene resin, 10 to 60 parts of a benzoxazine resin, 0.5 to 4 parts of an initiator, and 50 parts of a filler.
In a preferred embodiment, the modified polybutadiene resin is 20 to 40 parts.
One preferable embodiment is that the benzoxazine resin is 40 to 50 parts.
In a preferred embodiment, the initiator is 0.5 to 2 parts.
In a preferred embodiment, the filler is silicon powder or boron nitride.
In order to achieve the second object, the invention provides a high-frequency high-speed metal-based copper-clad plate, which comprises at least one insulating layer, wherein the insulating layer is made of the resin composition.
Preferably, the thickness of the insulating layer is in the range of 50 to 150 micrometers.
The resin composition has the beneficial effects that the resin composition is prepared from modified polybutadiene resin, benzoxazine resin, an initiator and a filler. The resin composition used as the polymer adhesive layer uses the modified polybutadiene resin, so that the advantages of the resin composition in the aspects of dielectric and flexibility can be well kept, and the adhesive force between the resin composition and the copper foil of the metal-based copper-clad plate is improved. The addition of the high heat-resistant benzoxazine resin ensures that the resin composition has excellent dielectric properties, and is beneficial to improving the problems of basically required flame retardant property, moisture absorption resistance, heat resistance, adhesion with copper foil and the like of the cured resin and the prepared resin.
The initiator is added, so that the problem that the residual double bonds of the benzoxazine resin can be copolymerized with other double bond-containing resins under the action of the initiator, the crosslinking density is improved, and the polybutadiene resin is easy to generate phase separation can be solved. In addition, the copper-clad plate prepared by using the resin composition has excellent dielectric property, good heat resistance and high glass transition temperature, and can meet the requirements of high frequency of electronic signal transmission and high speed of information processing in the industry of printed circuit copper-clad plates.
Detailed Description
In the following examples, JSR RB810 modified polybutadiene resin in japan was used as the modified polybutadiene resin, silica powder was used as the filler, and french arkema peroxide was used as the initiator.
Resin composition example 1
20 parts of modified polybutadiene resin (calculated by weight parts, the same below), 50 parts of benzoxazine resin, 2.0 parts of initiator, 40 parts of silicon micropowder and 10 parts of boron nitride.
Resin composition example 2
28 parts of modified polybutadiene resin, 40 parts of benzoxazine resin, 1.7 parts of initiator, 45 parts of silicon micropowder and 5 parts of boron nitride.
Resin composition example 3
35 parts of modified polybutadiene resin, 45 parts of benzoxazine resin, 2.0 parts of initiator, 42 parts of silicon micropowder and 8 parts of boron nitride.
Resin composition example 4
10 parts of modified polybutadiene resin, 60 parts of benzoxazine resin, 4.0 parts of initiator, 40 parts of silicon micropowder and 10 parts of boron nitride.
Resin composition comparative example 1
35 parts of modified polybutadiene resin, 1.0 part of initiator, 42 parts of silicon micropowder and 8 parts of boron nitride.
The above components may be mixed together using a ball mill, a tank mill, a sand mill, or the like, in combination with a high-shear stirring dispersion apparatus.
Method for measuring performance test
1. Dielectric constant and dielectric loss test: an impedance analyzer was used. The samples were treated at (23. + -. 2) ° C and relative temperature (50. + -. 5)% for at least 24 hours. If the sample is exposed to humid air for a long time, it should be exposed to humid air first
The air circulation oven of (2) was dried for 2h and then pre-treated at room temperature as described above. During testing, the thickness of the sample is measured by a micrometer, the thickness of the sample is input, the sample is inserted into the test fixture, and the electrode of the test fixture is kept in good contact with the sample. A test scan was performed to record the dielectric constant and dielectric loss tangent values. The dielectric constant is accurate to 0.1, and the dielectric loss tangent value is accurate to 0.001.
2. Glass transition temperature: using a differential scanning calorimeter, scanning is started at an initial temperature slightly above room temperature but well below the expected glass transition temperature of the sample (e.g., 30 ℃) at a ramp rate of (20. + -. 2) DEG C/min. After thermal deformation was observed, the temperature was increased further to 30 ℃ above the thermal deformation zone and scanning was stopped. The glass transition temperature Tg is obtained from the glass transition temperature DSC curve.
3. Peel strength: the peeling strength of the metal-based copper-clad plate after thermal stress is tested according to the peeling strength in GB/T4722. The thermal stress treatment was 288 ℃ floating for 10 seconds.
The compounding ratios and performance test results of the resin compositions of the examples and comparative examples are shown in the following tables.
TABLE 1
The resin composition adopts the modified polybutadiene resin and the benzoxazine resin, the dielectric constant Dk is below 3.8 and the dielectric loss Df is below 0.06 under the condition of 10GHz, the resin composition has excellent dielectric property, the glass transition temperature Tg is higher than 170 ℃, the glass transition temperature is high, the heat resistance is good, and the copper-clad plate manufactured by using the resin composition can meet the requirements of high frequency of electronic signal transmission and high speed of information processing in the industry of printed circuit copper-clad plates.
In addition, the initiator is added, so that the problem that the residual double bonds of the benzoxazine resin can be copolymerized with other double bond-containing resins under the action of the initiator, the crosslinking density is improved, and the polybutadiene resin is easy to generate phase separation can be solved.
High-frequency high-speed metal-based copper-clad plate embodiment
The high-frequency high-speed metal-based copper-clad plate comprises at least one insulating layer, wherein the insulating layer is prepared from the resin composition in each resin composition embodiment.
The surface of the metal substrate is coated with the glue for treatment, so that the binding force between the metal substrate and the insulating layer is improved, and the metal substrate and the insulating layer are prevented from generating undesirable phenomena such as layering, separation, fracture and the like in the processing process. Preferably, the insulating layer has a thickness in the range of 50 to 150 microns.
In addition, Ricon 152 modified polybutadiene resin of kreviley, france can be used as the modified polybutadiene resin. The filler can also be one of silicon micropowder or boron nitride. The above-described modifications also achieve the object of the present invention.
Finally, it should be emphasized that the above-described preferred embodiments of the present invention are merely examples of implementations, not limitations, and various changes and modifications may be made by those skilled in the art, without departing from the spirit and scope of the invention, and any changes, equivalents, improvements, etc. made within the spirit and scope of the present invention are intended to be embraced therein.
Claims (7)
1. The resin composition is characterized by comprising 10 to 50 parts by weight of modified polybutadiene resin, 10 to 60 parts by weight of benzoxazine resin, 0.5 to 4 parts by weight of initiator and 50 parts by weight of filler.
2. The resin composition according to claim 1, characterized in that:
the modified polybutadiene resin is 20-40 parts.
3. The resin composition according to claim 1 or 2, characterized in that:
the benzoxazine resin is 40 to 50 parts.
4. The resin composition according to claim 1 or 2, characterized in that:
the initiator is 0.5 to 2 parts.
5. The resin composition according to claim 1 or 2, characterized in that:
the filler is at least one of silicon micropowder and boron nitride.
6. A high-frequency high-speed metal-based copper-clad plate comprising at least one insulating layer, wherein the insulating layer is made of the resin composition according to any one of claims 1 to 5.
7. The high-frequency high-speed metal-based copper-clad plate according to any one of claims 1 to 4, wherein:
the thickness of the insulating layer is in the range of 50 to 150 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911382666.7A CN111073213A (en) | 2019-12-27 | 2019-12-27 | Resin composition and high-frequency high-speed metal-based copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911382666.7A CN111073213A (en) | 2019-12-27 | 2019-12-27 | Resin composition and high-frequency high-speed metal-based copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111073213A true CN111073213A (en) | 2020-04-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911382666.7A Pending CN111073213A (en) | 2019-12-27 | 2019-12-27 | Resin composition and high-frequency high-speed metal-based copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111073213A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102504532A (en) * | 2011-10-18 | 2012-06-20 | 广东生益科技股份有限公司 | Halogen-free low dielectric resin composition and prepreg and copper clad laminate made of same |
-
2019
- 2019-12-27 CN CN201911382666.7A patent/CN111073213A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102504532A (en) * | 2011-10-18 | 2012-06-20 | 广东生益科技股份有限公司 | Halogen-free low dielectric resin composition and prepreg and copper clad laminate made of same |
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Application publication date: 20200428 |