CN111063665A - Special-shaped TWS SIP module and manufacturing method thereof - Google Patents
Special-shaped TWS SIP module and manufacturing method thereof Download PDFInfo
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- CN111063665A CN111063665A CN201911396758.0A CN201911396758A CN111063665A CN 111063665 A CN111063665 A CN 111063665A CN 201911396758 A CN201911396758 A CN 201911396758A CN 111063665 A CN111063665 A CN 111063665A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 94
- 238000000034 method Methods 0.000 claims abstract description 43
- 238000004806 packaging method and process Methods 0.000 claims abstract description 20
- 238000005520 cutting process Methods 0.000 claims abstract description 11
- 239000003292 glue Substances 0.000 claims description 29
- 150000001875 compounds Chemical class 0.000 claims description 11
- 239000000565 sealant Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 238000000227 grinding Methods 0.000 claims description 4
- 238000010329 laser etching Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 description 16
- 238000003698 laser cutting Methods 0.000 description 6
- 238000013461 design Methods 0.000 description 4
- 230000001788 irregular Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004836 Glue Stick Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
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Abstract
The invention provides a special-shaped TWS SIP module and a manufacturing method thereof, wherein the method comprises the following steps: after the mold device patch mounting is carried out on the front surface of the integral substrate, carrying out plastic package treatment on the front surface of the integral substrate to form a first plastic package layer; carrying out surface mounting treatment on the back surface of the integral substrate to form a mold area and a non-mold area on the back surface of the integral substrate, wherein the non-mold area is provided with non-mold devices in a surface mounting mode, and the mold area is provided with mold devices in a surface mounting mode; bonding and fixing a preset dam baffle plate on the periphery of the mold area to form a layer of dam on the periphery of the mold area; performing plastic packaging treatment inside the box dam to form a second plastic packaging layer; and carrying out plate cutting treatment on the integrated substrate according to the appearance of the special-shaped substrate so that the special-shaped substrate is separated from the integrated substrate together with the special-shaped TWS SIP module on the special-shaped substrate. The invention can effectively solve the problems of low efficiency, high cost and the like of the existing special-shaped TWS SIP module manufacturing process.
Description
Technical Field
The invention relates to the technical field of TWS SIP module design, in particular to a special-shaped TWS SIP module and a manufacturing method thereof.
Background
With the wide application of the TWS technology (True Wireless Stereo) In the field of bluetooth headsets, a TWS bluetooth headset has come, and a core component of the TWS bluetooth headset is a TWS SIP (System In package, a package form) module, where the TWS SIP module mainly includes a substrate and a functional device disposed on the substrate.
However, with the increase of human material demand, the structure ID (the structure of the housing and the base) of the TWS bluetooth headset is more and more in style, and in order to make the TWS SIP module better fit with the structure ID, the shape of the TWS SIP module needs to design corresponding structures such as bayonets, arcs and the like according to the requirement of the structure ID; however, in the conventional TWS SIP module processing technology, only a structure with a regular moment can be cut by using the SAW cutting technology, and the processing and manufacturing of the special-shaped structure cannot be met.
In addition, in order to better protect devices in the TWS SIP module, plastic package treatment needs to be performed on various devices, and the conventional plastic package treatment generally adopts an integral mold technology (the main process of the technology includes that a mold is arranged on an integral substrate, the integral substrate is placed in the mold, a certain amount of mold compound glue is placed on the mold and the integral substrate, and finally the mold compound glue is uniformly adhered to the integral substrate in modes of heating, pressurizing and the like, so that the devices are protected). However, because there are some devices (i.e. non-mold devices, such as connectors, test pads, SENSOR SENSORs, antenna clips, etc.) in the TWS SIP module, the mold cannot enter the whole SIP, and a bare substrate is required, so when the TWS SIP module performs mold removing, the mold removing needs to be performed on other conventional devices (i.e. mold devices) separately, that is, Selective mold removing, but the Selective mold needs to be provided for each type of conventional device separately, and the mold opening cost is high, and the cycle is long. In addition, even if the Selective mold is adopted for processing, since the mold is required to be removed after the mold is completed, the side wall of the formed plastic package layer needs to have a slope surface demolding angle, but the slope surface of the plastic package layer has great limitation on the internal layout of the TWS SIP module, and the TWS SIP module is not beneficial to miniaturization.
Based on the above problems, a need exists for an efficient and low-cost method for manufacturing a TWS SIP module.
Disclosure of Invention
In view of the above problems, an object of the present invention is to provide a special-shaped TWS SIP module and a method for manufacturing the same, so as to solve the problems of low process efficiency, high cost, and the like of the existing special-shaped TWS SIP module.
On one hand, the invention provides a special-shaped TWS SIP module which comprises a special-shaped substrate, wherein a mold area and a non-mold area are arranged on the reverse side of the special-shaped substrate, a non-mold device is arranged in the non-mold area, and mold devices are arranged in the mold area and the front side of the special-shaped substrate; and the number of the first and second electrodes,
and a first plastic packaging layer covering the mold device is arranged on the front surface of the special-shaped substrate, a dam baffle is arranged on the periphery of the mold area, and a second plastic packaging layer covering the mold device is arranged in the dam baffle.
In addition, it is preferable that the dam guard is made of mold compound glue.
In addition, preferably, the side walls of the dam baffle are perpendicular to the irregular-shaped substrate.
On the other hand, the invention also provides a manufacturing method of the special-shaped TWS SIP module, which comprises the following steps:
after the front surface of the integral substrate is subjected to mold device surface mounting, performing plastic package treatment on the front surface of the integral substrate to form a first plastic package layer;
carrying out surface mounting treatment on the back surface of the integral substrate to form a mold area and a non-mold area on the back surface of the integral substrate, wherein a non-mold device is mounted on a surface mounted in the non-mold area, and a mold device is mounted on a surface mounted in the mold area;
bonding and fixing a preset dam baffle plate on the periphery of the mold area to form a layer of dam on the periphery of the mold area;
performing plastic packaging treatment inside the box dam to form a second plastic packaging layer;
and carrying out plate cutting treatment on the integrated substrate according to the appearance of the special-shaped substrate so as to separate the special-shaped substrate together with the special-shaped TWS SIP module on the special-shaped substrate from the integrated substrate.
In addition, it is preferable that the process of presetting the dam baffle includes:
using mold compound glue to manufacture a mold light plate;
and carrying out laser etching on the mold light plate to form the dam baffle.
In addition, preferably, a mold process is used to perform a mold treatment on the front surface of the monolithic substrate, so that the first molding layer is formed on the front surface of the monolithic substrate.
In addition, the preferable scheme is that glue dispensing treatment is carried out inside the box dam by using a glue pouring process so as to form pouring glue covering the mold device in the box dam;
and baking the special-shaped substrate to solidify the pouring sealant to form the second plastic package layer.
In addition, the preferable scheme is that the pouring sealant is an underfil glue.
In addition, preferably, at least two groups of devices required by the special-shaped TWS SIP module are arranged on the integrated substrate; and;
and in the process of carrying out the plate cutting treatment on the integrated substrate according to the appearance of the special-shaped substrate, cutting the integrated substrate by using laser so as to separate the TWS SIP modules on the integrated substrate.
In addition, it is preferable that, after the second molding layer is formed, the method further includes:
and carrying out packaging and grinding treatment on the second plastic packaging layer so as to enable the glue surface of the second plastic packaging layer to be flat.
By utilizing the special-shaped TWS SIP module and the manufacturing method thereof, firstly, the mold devices and the non-mold devices on the Bottom surface of the special-shaped substrate are arranged in the mold areas and the non-mold areas, then the corresponding enclosing dams are arranged aiming at the mold areas, and the pouring sealant is poured into the enclosing dams, so that the plastic package of the devices in the mold areas can be realized, the step of arranging a mold for each mold device on the Bottom surface in the traditional process can be omitted, and the cost is obviously reduced.
To the accomplishment of the foregoing and related ends, one or more aspects of the invention comprise the features hereinafter fully described. The following description and the annexed drawings set forth in detail certain illustrative aspects of the invention. These aspects are indicative, however, of but a few of the various ways in which the principles of the invention may be employed. Further, the present invention is intended to include all such aspects and their equivalents.
Drawings
Other objects and results of the present invention will become more apparent and more readily appreciated as the same becomes better understood by reference to the following description taken in conjunction with the accompanying drawings. In the drawings:
FIG. 1 is a top view of a shaped TWS SIP module according to an embodiment of the invention;
FIG. 2 is an enlarged partial view of a dam baffle according to an embodiment of the present invention;
FIG. 3 is a front sectional view of a position A-A according to an embodiment of the present invention;
FIG. 4 is a flowchart of a method for manufacturing a TWS SIP module according to an embodiment of the invention;
fig. 5 is a partial enlarged view of an overall substrate according to an embodiment of the invention.
Wherein the reference numerals include: the structure comprises a special-shaped substrate 11, a non-mold area 111, a mold area 112, a non-mold device 12, a dam baffle 13, a mold device 14, a first plastic package layer 15, a second plastic package layer 16 and an integral substrate 17.
The same reference numbers in all figures indicate similar or corresponding features or functions.
Detailed Description
In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more embodiments. It may be evident, however, that such embodiment(s) may be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form in order to facilitate describing one or more embodiments.
Specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
Fig. 1 shows a top view structure of a shaped TWS SIP module according to an embodiment of the present invention, fig. 2 shows a partially enlarged structure of a dam shield according to an embodiment of the present invention, and fig. 3 shows a front view cross-sectional structure of a-a position according to an embodiment of the present invention.
Referring to fig. 1 to 3, the TWS SIP module includes a shaped substrate 11 adapted to a structure ID of a TWS bluetooth headset, where a front surface of the shaped substrate 11 is referred to as a Top surface and a back surface is referred to as a Bottom surface. It should be noted that fig. 1 to fig. 3 all show a structure in which a Bottom surface of the irregular substrate 11 is on an upper surface and a Top surface is on a lower surface, the Bottom surface includes a mold region 112 and a non-mold region 111, a non-mold device 12 is mounted in the non-mold region 111, and a mold device 14 is mounted in both the mold region 112 and the Top surface; and, a first plastic package layer 16 covering the mold device 14 is provided on the Top surface, a dam bar 13 is fixed on the periphery of the mold region 112, and a second plastic package layer covering the mold device 14 is provided in the dam bar 13.
In a preferred embodiment of the invention, the dam shield 13 is made of mold compound glue; the mold compound glue (epoxy plastic package material) is a glue stick which is solid at normal temperature and has stronger stability, in the actual use process, a proper amount of mold compound glue is firstly placed into a mold, a mold light plate is formed through the working procedures of heating, pressurizing, cooling and the like, then the dam baffle plate 13 with the corresponding shape is cut from the mold light plate according to the peripheral structure of the mold area, and the dam is bonded on the periphery of the mold area 112 to form a dam.
Specifically, in order to facilitate the internal layout of the special-shaped TWS SIP module, when the mold light plate is cut to form the dam baffle 13, the side wall of the dam baffle 13 is set to be a vertical structure, and the side wall of the dam baffle 13 can be perpendicular to the special-shaped substrate 11 through the design, so that the layout area of a device is reduced, and the volume of the whole special-shaped TWS SIP module is reduced.
On the other hand, fig. 4 shows a flow of a method for manufacturing the special-shaped TWS SIP module according to an embodiment of the present invention, and as can be seen from fig. 4, the present invention further provides a method for manufacturing the special-shaped TWS SIP module, which includes the following steps:
s110: performing SMT (surface mount technology, which is a circuit connection technology in which surface-mounted components without leads or short leads are mounted on the surface of a printed circuit board or other substrates and then soldered or assembled by reflow soldering, dip soldering, or the like) on the front surface of the entire substrate 17 to mount a desired mold device on the Top surface of the entire substrate 17; after the front surface mounting of the integral substrate 17 is completed, the plastic package treatment can be performed on the front surface of the integral substrate 17 to form a first plastic package layer.
Specifically, in the process of performing the plastic packaging process on the Pop surface of the integrated substrate 17, the Top surface of the integrated substrate 17 is subjected to the integrated mold process by using a conventional mold process, so that the first plastic packaging layer 16 is formed on the Top surface of the integrated substrate 17. It should be noted that the conventional mold process is a prior art, and a simple description has been made in the background art, and is not described herein again.
S120: and performing a pasting process on the reverse side of the overall substrate 17 so that a mold region 112 and a non-mold region 111 are formed on the Bottom surface, wherein the non-mold region 111 is mounted with the non-mold device 12, and the Top surface of the overall substrate 17 and the mold region 112 are mounted with the mold device 14.
It should be noted that fig. 5 shows a partial enlarged structure of the monolithic substrate 17 according to the embodiment of the invention, as shown in fig. 5, the monolithic substrate 17 is a large-area substrate with a regular shape, the special-shaped substrate 11 involved in the special-shaped TWS SIP module is cut from the monolithic substrate 17 by laser or other special processes, in general, in order to improve the working efficiency, a plurality of sets of devices required by the special-shaped TWS SIP module can be generally disposed on one monolithic substrate 17, each set of TWSSIP module has a corresponding mold region 112 and a non-mold region 111, and therefore, when each special-shaped substrate 11 is cut from the monolithic substrate 17, a plurality of corresponding special-shaped TWS SIP modules are formed.
Furthermore, it should be further noted that the mold regions 112 are regions on the Bottom surface for mounting the mold devices 14, one or more mold devices 14 may be disposed in one mold region 112, and the shape of the mold region 112 is set according to the shape of the mold devices 14 inside the mold region and the shape of the special-shaped substrate 11; the non-mold region 111 is a region of the Bottom surface except for the mold region, and is used for mounting the non-mold device 12.
S130: and (3) adhering and fixing a preset dam baffle 13 on the periphery of the mold area 112 so that the periphery of the mold area 14 forms a layer of dam.
Specifically, the process of presetting the dam guard 13 includes: using mold compound glue to manufacture a mold light plate; the mold light plate is subjected to laser etching, and the dam baffle 13 with the same shape as the periphery of the mold area 112 is cut from the mold light plate by means of the laser etching.
S140: and carrying out plastic package treatment in the dam on the reverse side of the integral substrate 17 to form a second plastic package layer covering the mold devices in the dam.
Specifically, glue can be dispensed inside the box dam by using a glue pouring process, so that pouring glue for covering the mold device is formed in the box dam; and then, baking the special-shaped substrate 11 to cure the potting adhesive to form a second plastic package layer.
According to the invention, the isolation between the mold device 14 on the Bottom surface and the non-mold device 12 can be realized by building the dam for the mold area 112 and then dispensing in the dam, so that only the mold device 14 on the Bottom surface is subjected to plastic package.
In addition, compared with the traditional Selective mold, the dam dispensing method not only omits a process of forming a mold for the mold 14 on the Bottom surface, but also omits a process of demolding because the dam baffle 13 is made of the mol compound adhesive, thereby significantly improving the manufacturing efficiency of the special-shaped TWS SIP module.
Specifically, in the process of dispensing inside the box dam by using the dispensing process, the underfil glue can be selected as the pouring glue, the underfil glue is liquid glue at normal temperature and is convenient to pour into the box dam through a dispenser, in addition, the underfil glue can be cured through baking and other procedures, and has strong stability, and the mold device 14 covered by the underfil glue can be effectively protected.
Specifically, after plastic package treatment is carried out on the interior of the dam, packaging and grinding treatment can be carried out on a second plastic package layer in the dam so as to enable the adhesive surface of the second plastic package layer to be flat; through the design, on one hand, the shell can be conveniently installed for the whole special-shaped TWSSIP module, and on the other hand, the height of the whole special-shaped TWS SIP module can be reduced to a certain extent, so that the size of the TWS earphone is reduced.
S150: the entire substrate 17 is subjected to a dicing process according to a desired shape of the shaped substrate 11 to separate the shaped substrate 11 from the entire substrate 17.
It should be noted that, because the required shape of the irregular substrate 11 is an irregular structure, and the conventional SAW cutting technology can only cut out a structure with a regular moment, the present invention adopts a novel laser cutting technology, and can cut out any required shape by the laser cutting technology, thereby satisfying the requirement of the shell structure ID. It should be emphasized here that the laser cutting technology is a new cutting technology, and the present invention mainly lies in the application of the laser cutting technology, so that the working principle of the laser cutting technology itself will not be described herein again.
As can be seen from the foregoing embodiments, the TWS SIP module and the manufacturing method thereof provided by the present invention have at least the following advantages:
1. the traditional Selective mold process is replaced by a dam dispensing mode, so that the processes of mold opening and demolding treatment of a mold device on a Bottom surface are omitted, the cost can be reduced, and the working efficiency can be obviously improved;
2. the laser cutting plate technology is used for replacing the traditional cutting plate technology, and the special-shaped substrate can be cut into a required shape, so that the requirements of various TWS Bluetooth earphones are met;
3. the glue surface of the second plastic package layer is smooth through packaging and grinding treatment, on one hand, the shell can be conveniently installed on the whole special-shaped TWSSIP module, on the other hand, the height of the whole special-shaped TWS SIP module can be reduced to a certain extent, and therefore the size of the TWS earphone is reduced.
The profiled TWS SIP module and the method of making the same according to the present invention are described above by way of example with reference to fig. 1 to 5. However, it should be understood by those skilled in the art that various modifications can be made to the TWS SIP module and the method for making the same without departing from the scope of the invention. Therefore, the scope of the present invention should be determined by the contents of the appended claims.
Claims (10)
1. A TWS SIP module having a different shape, comprising a different substrate,
a mold region and a non-mold region are arranged on the reverse side of the special-shaped substrate, a non-mold device is arranged in the non-mold region, and mold devices are arranged in the mold region and the front side of the special-shaped substrate; and the number of the first and second electrodes,
and a first plastic packaging layer covering the mold device is arranged on the front surface of the special-shaped substrate, a dam baffle is arranged on the periphery of the mold area, and a second plastic packaging layer covering the mold device is arranged in the dam baffle.
2. The contoured TWS SIP module of claim 1,
the dam baffle is made of mold compound glue.
3. The contoured TWS SIP module of claim 1,
the side walls of the box dam baffles are perpendicular to the special-shaped base plate.
4. A method of making the shaped TWS SIP module of claim 1, the method comprising the steps of:
after the front surface of the integral substrate is subjected to mold device surface mounting, performing plastic package treatment on the front surface of the integral substrate to form a first plastic package layer;
carrying out surface mounting treatment on the back surface of the integral substrate to form a mold area and a non-mold area on the back surface of the integral substrate, wherein a non-mold device is mounted on a surface mounted in the non-mold area, and a mold device is mounted on a surface mounted in the mold area;
bonding and fixing a preset dam baffle plate on the periphery of the mold area to form a layer of dam on the periphery of the mold area;
performing plastic packaging treatment inside the box dam to form a second plastic packaging layer;
and carrying out plate cutting treatment on the integrated substrate according to the appearance of the special-shaped substrate so as to separate the special-shaped substrate together with the special-shaped TWS SIP module on the special-shaped substrate from the integrated substrate.
5. The method of making a contoured TWS SIP module of claim 4, wherein the process of pre-setting the dam bar includes:
using mold compound glue to manufacture a mold light plate;
and carrying out laser etching on the mold light plate to form the dam baffle.
6. The method of claim 4 wherein said TWS SIP module is formed by a plurality of TWS SIP modules,
and performing integral mold treatment on the front surface of the integral substrate by using a mold process so as to form the first plastic packaging layer on the front surface of the integral substrate.
7. The method of claim 4 wherein said TWS SIP module is formed by a plurality of TWS SIP modules,
dispensing glue inside the box dam by using a glue pouring process so as to form pouring glue covering the mold device in the box dam;
and baking the special-shaped substrate to solidify the pouring sealant to form the second plastic package layer.
8. The method of claim 7 wherein said TWS SIP module is formed by a plurality of TWS SIP modules,
the pouring sealant is an underfil adhesive.
9. The method of claim 4 wherein said TWS SIP module is formed by a plurality of TWS SIP modules,
at least two groups of devices required by the special-shaped TWS SIP module are arranged on the integrated substrate; and;
and in the process of carrying out the plate cutting treatment on the integrated substrate according to the appearance of the special-shaped substrate, cutting the integrated substrate by using laser so as to separate the TWS SIP modules on the integrated substrate.
10. The method of making a contoured TWS SIP module of claim 4, further comprising, after forming the second molding layer:
and carrying out packaging and grinding treatment on the second plastic packaging layer so as to enable the glue surface of the second plastic packaging layer to be flat.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911396758.0A CN111063665A (en) | 2019-12-30 | 2019-12-30 | Special-shaped TWS SIP module and manufacturing method thereof |
| PCT/CN2020/135046 WO2021135880A1 (en) | 2019-12-30 | 2020-12-09 | Special-shaped tws sip module and manufacturing method therefor |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911396758.0A CN111063665A (en) | 2019-12-30 | 2019-12-30 | Special-shaped TWS SIP module and manufacturing method thereof |
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| CN201911396758.0A Pending CN111063665A (en) | 2019-12-30 | 2019-12-30 | Special-shaped TWS SIP module and manufacturing method thereof |
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| WO (1) | WO2021135880A1 (en) |
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| CN112038238A (en) * | 2020-08-31 | 2020-12-04 | 青岛歌尔微电子研究院有限公司 | Manufacturing method of frame, plastic packaging method of module and manufacturing method of SIP module |
| WO2021135880A1 (en) * | 2019-12-30 | 2021-07-08 | 青岛歌尔智能传感器有限公司 | Special-shaped tws sip module and manufacturing method therefor |
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| CN102176438A (en) * | 2010-10-11 | 2011-09-07 | 日月光半导体制造股份有限公司 | Double-sided packaging structure and wireless communication system using it |
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| CN211428143U (en) * | 2019-12-30 | 2020-09-04 | 青岛歌尔智能传感器有限公司 | Special-shaped TWS SIP module |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021135880A1 (en) * | 2019-12-30 | 2021-07-08 | 青岛歌尔智能传感器有限公司 | Special-shaped tws sip module and manufacturing method therefor |
| CN112038238A (en) * | 2020-08-31 | 2020-12-04 | 青岛歌尔微电子研究院有限公司 | Manufacturing method of frame, plastic packaging method of module and manufacturing method of SIP module |
| WO2022042353A1 (en) * | 2020-08-31 | 2022-03-03 | 青岛歌尔微电子研究院有限公司 | Manufacturing method for frame, plastic encapsulation method for module, and manufacturing method for sip module |
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| WO2021135880A1 (en) | 2021-07-08 |
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