CN111063557A - Thin-film capacitor encapsulating device and encapsulating process - Google Patents
Thin-film capacitor encapsulating device and encapsulating process Download PDFInfo
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- CN111063557A CN111063557A CN201911414365.8A CN201911414365A CN111063557A CN 111063557 A CN111063557 A CN 111063557A CN 201911414365 A CN201911414365 A CN 201911414365A CN 111063557 A CN111063557 A CN 111063557A
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- 239000003990 capacitor Substances 0.000 title claims abstract description 71
- 238000000034 method Methods 0.000 title claims abstract description 32
- 239000010409 thin film Substances 0.000 title claims abstract description 27
- 230000008569 process Effects 0.000 title claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 66
- 238000003860 storage Methods 0.000 claims abstract description 39
- 230000007306 turnover Effects 0.000 claims abstract description 37
- 238000007789 sealing Methods 0.000 claims abstract description 20
- 238000005538 encapsulation Methods 0.000 claims description 53
- 238000004382 potting Methods 0.000 claims description 21
- 230000009471 action Effects 0.000 claims description 10
- 238000005096 rolling process Methods 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000003292 glue Substances 0.000 abstract description 16
- 239000010408 film Substances 0.000 abstract description 6
- 238000004513 sizing Methods 0.000 description 30
- 239000000565 sealant Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 238000003825 pressing Methods 0.000 description 5
- 230000005484 gravity Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/003—Apparatus or processes for encapsulating capacitors
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Abstract
The invention belongs to the technical field of filling and sealing equipment, and particularly relates to a thin film capacitor filling and sealing device and a filling and sealing process, wherein the thin film capacitor filling and sealing device comprises a conveying table, one end of the conveying table is provided with a support frame, the top end of the support frame is provided with a pneumatic push rod, the bottom end of the pneumatic push rod is connected with a material storage cavity, the bottom surface of the material storage cavity is connected with a filling and sealing cavity, the side wall of the filling and sealing cavity is connected with a plugging plate, the bottom surface of the plugging plate is provided with a chute, the interior of the chute is connected; the bottom end of the storage cavity is provided with a conveying belt, the top end of the conveying belt is provided with a turnover plate, the top surface of the turnover plate is provided with a fixed groove, and a capacitor shell is transported inside the fixed groove; the encapsulating device provided by the invention can be used for encapsulating the shell quickly and efficiently, and can also reduce the leakage and splashing of the glue material of the shell in the encapsulating process, thereby greatly improving the encapsulating quality of the film capacitor.
Description
Technical Field
The invention belongs to the technical field of encapsulation equipment, and particularly relates to an encapsulation device and an encapsulation process for a thin-film capacitor.
Background
The encapsulation is to pour the liquid compound into the device with electronic components and circuits mechanically or manually, and solidify the liquid compound into a thermosetting polymer insulating material with excellent performance under normal temperature or heating condition, so as to strengthen the integrity of the electronic device and improve the resistance to external impact and vibration; the insulation between internal elements and circuits is improved, and the miniaturization and the light weight of devices are facilitated; the direct exposure of elements and circuits is avoided, the waterproof and moistureproof performances of the device are improved, and the service performance and stable parameters are improved.
Traditional film capacitor embedment device often utilizes the less ejection of compact mouth of spout to carry out the embedment to the condenser and handles, and not only embedment is inefficient, still leads to the jam of ejection of compact mouth easily, and traditional embedment device often is not equipped with protection machanism when carrying out embedment to the condenser simultaneously for the inside sizing material of condenser leaks easily or splashes the casing outside, thereby influences the embedment quality of condenser greatly.
In view of the above, the invention provides a thin film capacitor potting device and a potting process, and the potting device can be used for rapidly and efficiently potting the shell, and can also reduce leakage and splashing of glue in the potting process of the shell, so that the potting quality of the thin film capacitor is greatly improved.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides the thin-film capacitor encapsulating device and the encapsulating process, the shell can be encapsulated quickly and efficiently by the arranged encapsulating device, and the leakage and splashing of glue materials of the shell in the encapsulating process can be reduced, so that the encapsulating quality of the thin-film capacitor is greatly improved.
The technical scheme adopted by the invention for solving the technical problems is as follows: the invention discloses a thin film capacitor filling and sealing device, which comprises a conveying table; a support frame is arranged at one end of the conveying table, a pneumatic push rod is installed at the top end of the support frame, a material storage cavity is connected to the bottom end of the pneumatic push rod, a group of uniformly distributed encapsulation cavities are connected to the bottom surface of the material storage cavity, a first discharge port is arranged at a position, corresponding to the encapsulation cavity, of the bottom surface of the material storage cavity, a sliding cavity is arranged on the inner wall of one side of the first discharge port, a baffle is connected to the inside of the sliding cavity in a sliding mode, a second discharge port communicated with the first discharge port is arranged at one end, close to the first discharge port, of the baffle, and the; the side wall of the inner end of the encapsulation cavity is symmetrically connected with an encapsulation plate which is obliquely and downwards arranged, inclined sliding grooves corresponding to the bottom surface of the encapsulation plate in shape are formed in the bottom surface of the encapsulation plate, sliding plates are connected inside the sliding grooves in a sliding mode, an elastic telescopic layer is connected between the top end of each sliding plate and the inner wall of each sliding groove, the bottom ends of the two sliding plates can be pressed and attached under the action of the telescopic layer, a group of uniformly arranged rolling balls are rotatably connected onto the side wall of each sliding plate corresponding to the side surface of the top end of each sliding groove, the top end of the side wall of each sliding plate, opposite to the rolling balls, is connected with an L-shaped pressing plate; a conveying belt is arranged on a conveying table where the bottom end of the storage cavity is located, a turnover plate is arranged at the top end of the conveying belt, a fixing groove corresponding to the encapsulation cavity is formed in the top surface of the turnover plate, a capacitor shell is fixedly conveyed inside the fixing groove, a position sensor is arranged on the conveying table at the bottom end of the storage cavity, a controller is arranged on the conveying table, and the controller is used for controlling automatic operation of the device; when the device works, the traditional film capacitor filling and sealing device usually performs filling and sealing treatment on the capacitor by using the discharge nozzle with a smaller nozzle, so that the filling and sealing efficiency is low, the discharge nozzle is easy to block, and meanwhile, the traditional filling and sealing device is not provided with a protection mechanism when performing filling and sealing treatment on the capacitor, so that glue inside the capacitor is easy to leak or splash to the outer side of the shell, and the filling and sealing quality of the capacitor is greatly influenced; when the thin-film capacitor encapsulating device works, firstly, a capacitor shell is fixed in a fixed groove at the top end of a turnover plate, so that the shell can be effectively fixed and limited during encapsulating treatment, then a conveying platform drives the turnover plate to move to the bottom end of a material storage cavity through a conveying belt, and the moving position of the turnover plate can be effectively controlled through an arranged position sensor, so that the turnover plate can drive the shell at the top end to correspond to an encapsulating cavity, at the moment, a controller controls a pneumatic push rod to drive the material storage cavity and the encapsulating cavity at the bottom end of the material storage cavity to move towards the direction of the shell, the encapsulating cavity in an initial state is filled with encapsulating glue flowing out from a communicated first discharge port and a communicated second discharge port, the bottom ends of sliding plates symmetrically arranged in the encapsulating cavity are mutually extruded and attached to seal the encapsulating glue in the cavity, and when the top end of the side wall of the shell is in, at the moment, the pressure plate is stressed to drive the sliding plate at the top end to slide upwards in the sliding chute, so that the bottom end of the sliding plate sliding upwards is not contacted and attached any more and is not blocked any more for the pouring sealant, and at the moment, the pouring sealant flows into the shell under the action of self gravity and realizes the function of encapsulation; the side wall corresponding to the side face of the top end of the sliding chute is provided with the rolling balls, so that friction and resistance between the top end of the sliding plate and the side wall of the sliding chute can be effectively reduced, the shell can be more easily and stably pushed to move by the sliding plate, the stability and the efficiency of the device in operation are further enhanced, meanwhile, in the process that the sliding plate slides upwards, the sliding plate applies pulling force to the baffle through the traction rope, the baffle slides in the sliding cavity and drives the second discharge port to move synchronously, the second discharge port is not communicated with the first discharge port any more, the baffle can effectively plug the first discharge port at the moment, and the phenomenon that excessive rubber materials in the capacitor shell are filled due to the flowing of the rubber materials in the storage cavity in the working process of the encapsulating cavity is; and the encapsulation cavity that sets up can protect it at the in-process of casing embedment, reduces the pouring sealant to leak and splash to stability and validity when having strengthened the condenser embedment greatly.
Preferably, a connecting rod is arranged on the inner wall of the first discharge port, an elastic floating ball capable of plugging the second discharge port is arranged at the bottom end of the second discharge port, and the floating ball is connected with the end part of the connecting rod through an elastic connecting rope; when the device works, when the sliding plate slides upwards under the action of the top end of the capacitor shell and drives the baffle plate to slide synchronously, the baffle plate can not immediately block the first discharge hole, when the sizing material in the encapsulating cavity flows out from the bottom end, the sizing material in the material storage cavity can flow into the encapsulating cavity from the communication gap gradually reduced between the first discharge port and the second discharge port, so that the sizing material in the encapsulation cavity can not be effectively controlled, and at the moment, the floating ball is arranged at the bottom end of the second discharge hole, when the sizing material in the encapsulation cavity begins to flow out, the higher sizing material applies upward buoyancy to the floating ball and plugs the second discharge hole, so that the floating ball plugs and seals the encapsulation cavity when the sizing material begins to consume, and the amount of sizing material in the encapsulating cavity is effectively controlled, and the encapsulating quality of the capacitor is greatly improved.
Preferably, a limiting ring is arranged at the bottom end of the baffle plate where the outer part of the floating ball is located, and a group of through discharge chutes are formed in the side wall of the limiting ring; when the floating ball is in work, the floating ball is easy to deviate from the relative position of the second discharge port under the action of the top connecting rope and the bottom sizing material, so that the quick and efficient plugging of the floating ball on the second discharge port is influenced, and at the moment, the floating ball is always positioned in the limiting ring to move through arranging the limiting ring aligned with the second discharge port at the bottom end of the floating ball, so that the floating ball can quickly and accurately plug the second discharge port when floating; when the inside sizing material of embedment chamber consumed and finished and need reinforced, the floating ball was backed down to spacing intra-annular at the pressure of the inside sizing material of storage chamber this moment, through set up the blown down tank on the spacing ring lateral wall this moment, conveniently flowed in to the inside sizing material of spacing ring and flowed out to embedment intracavity portion and cycle work from the blown down tank to effectual stability and the continuation of having strengthened condenser embedment device at the during operation.
Preferably, the projection shape of the discharge chute in the radial direction of the limiting ring is rectangular, and the discharge chutes are annularly and uniformly distributed on the side surface of the limiting ring; during operation, through setting up shape and the distribution form that sets up the blown down tank, when guaranteeing that the spacing ring can carry on spacingly to the floating ball, increased the effective area of blown down tank on the spacing ring for flow into to the inside sizing material of spacing ring can be faster flow into to embedment intracavity portion from the blown down tank, and can reduce the sizing material and block up in the inside piling up of spacing ring, thereby the effectual stability and the high efficiency that improve condenser embedment device during operation.
Preferably, the outer surface of the floating ball is provided with a magnetic layer capable of attracting the inner wall of the second discharge hole, and the opening of the second discharge hole is gradually enlarged from top to bottom; the during operation, through be equipped with the magnetic layer that the one deck can attract with No. two discharge gates inner walls at the floating ball surface, make the magnetic layer drive the floating ball lateral wall and No. two discharge gates lateral wall in-process attracting each other with No. two discharge gates lateral wall pressfittings, thereby the effectual shutoff effect that improves the floating ball to No. two discharge gates, and through the shape that sets up No. two discharge gates, make inside extrusion to No. two discharge gates that the floating ball is more convenient light, thereby further strengthened the sealed effect of floating ball to No. two discharge gates, further improvement the validity of device during operation.
A thin film capacitor encapsulation process is suitable for the thin film capacitor encapsulation device and comprises the following process steps:
s1: respectively fixing the capacitor shells to be encapsulated inside fixing grooves at the tops of the turnover plates, and then conveying the turnover plates loaded with the capacitor shells to a working area of a conveying table through a conveying belt; by arranging the turnover disc and the fixed groove, the shell loaded in the fixed groove can be effectively fixed and limited during encapsulation treatment, so that the stability of the shell during working is enhanced;
s2: after the turnover plate is transported to a working area of the conveying table in S1, the moving position of the turnover plate is fixed through a position sensor arranged on the conveying table, so that the capacitor shells in the top fixing groove correspond to the encapsulation cavities in the top one by one through the stopped turnover plate; the motion position of the turnover plate can be controlled through the arranged position sensor, so that the leakage of glue materials caused by the fact that the positions of the shell and the encapsulating structure are not aligned is reduced, and the stability of the shell during encapsulating treatment is further improved;
s3: after S2 the capacitor shell and the encapsulation cavity are in one-to-one correspondence, the controller controls the pneumatic push rod to drive the material storage box to move, so that the rubber material in the material storage cavity is filled in the capacitor shell, and the purpose of encapsulation treatment is achieved; the encapsulation device through setting up not only can effectually carry out quick embedment to the casing, can also reduce the casing at the encapsulation in-process sizing material leak and splash to the embedment quality of film capacitor has been improved greatly.
The invention has the technical effects and advantages that:
1. according to the thin-film capacitor encapsulating device and the encapsulating process, the shell can be encapsulated quickly and efficiently through the encapsulating device, leakage and splashing of glue materials of the shell in the encapsulating process can be reduced, and accordingly encapsulating quality of the thin-film capacitor is improved greatly.
2. According to the thin-film capacitor encapsulating device and the encapsulating process, the floating ball is arranged at the bottom end of the second discharge hole, so that the encapsulating cavity is blocked and sealed when the sizing material is just consumed by the floating ball, the sizing material amount in the encapsulating cavity is effectively controlled, and the encapsulating quality of the capacitor is further improved.
Drawings
The invention will be further explained with reference to the drawings.
FIG. 1 is a diagram of the method steps of the present invention;
FIG. 2 is a schematic perspective view of the present invention;
FIG. 3 is an enlarged view of FIG. 2 at A
FIG. 4 is a schematic structural view of the present invention;
FIG. 5 is an enlarged view at B in FIG. 4;
FIG. 6 is a cross-sectional view taken at C-C of FIG. 5;
in the figure: conveying table 1, support frame 2, pneumatic push rod 21, storage cavity 3, discharge hole 31, sliding cavity 32, baffle 33, discharge hole 34 II, connecting rod 35, floating ball 36, connecting rope 37, magnetic layer 38, embedment cavity 4, plugging plate 41, spout 42, slide 43, flexible layer 44, spin 45, clamp plate 46, haulage rope 47, conveyer belt 5, turnover board 51, fixed slot 52, casing 6, spacing ring 7, blown down tank 71.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
As shown in fig. 1-6, the thin film capacitor filling and sealing apparatus according to the present invention includes a conveying table 1; a support frame 2 is arranged at one end of the conveying table 1, a pneumatic push rod 21 is installed at the top end of the support frame 2, a material storage cavity 3 is connected to the bottom end of the pneumatic push rod 21, a group of uniformly distributed encapsulation cavities 4 are connected to the bottom surface of the material storage cavity 3, a first discharge hole 31 is formed in the position, corresponding to the encapsulation cavities 4, of the bottom surface of the material storage cavity 3, a sliding cavity 32 is arranged on the inner wall of one side of the first discharge hole 31, a baffle 33 is connected to the inside of the sliding cavity 32 in a sliding mode, a second discharge hole 34 communicated with the first discharge hole 31 is formed in one end, close to the first discharge hole 31, of the baffle 33, and the inner wall; the side wall of the inner end of the encapsulation cavity 4 is symmetrically connected with an encapsulation plate 41 which is obliquely and downwards arranged, inclined sliding grooves 42 corresponding to the bottom surface of the encapsulation plate 41 in shape are formed in the bottom surface of the encapsulation plate 41, sliding plates 43 are connected in the sliding grooves 42 in a sliding mode, an elastic telescopic layer 44 is connected between the top ends of the sliding plates 43 and the inner wall of the sliding grooves 42, the bottom ends of the two symmetrical sliding plates 43 can be pressed and attached under the action of the telescopic layer 44, a group of uniformly arranged rolling balls 45 are rotatably connected to the side wall, corresponding to the side face of the top end of the sliding plate 43 and the sliding groove 42, of the sliding plate 43, the top end of the side wall, opposite to the rolling balls 45, of the sliding plate 43 is connected with an L; a conveying belt 5 is arranged on the conveying table 1 where the bottom end of the material storage cavity 3 is located, a turnover plate 51 is arranged at the top end of the conveying belt 5, a fixing groove 52 corresponding to the encapsulation cavity 4 is formed in the top surface of the turnover plate 51, a capacitor shell 6 is fixedly transported in the fixing groove 52, a position sensor is arranged on the conveying table 1 at the bottom end of the material storage cavity 3, and a controller is arranged on the conveying table 1 and used for controlling automatic operation of the device; during working, the traditional film capacitor filling and sealing device usually utilizes the discharge nozzle with a smaller nozzle to fill and seal the capacitor, so that the filling and sealing efficiency is low, the discharge nozzle is easy to block, and meanwhile, the traditional filling and sealing device is not provided with a protection mechanism when filling and sealing the capacitor, so that glue inside the capacitor is easy to leak or splash to the outer side of the shell 6, and the filling and sealing quality of the capacitor is greatly influenced; when the thin-film capacitor encapsulating device works, firstly, a capacitor shell 6 is fixed in a fixing groove 52 at the top end of a turnover plate 51, so that the shell 6 can be effectively fixed and limited during encapsulating treatment, then a conveying table 1 drives the turnover plate 51 to move to the bottom end of a material storage cavity 3 through a conveying belt 5, and can effectively control the movement position of the turnover plate 51 through a set position sensor, so that the turnover plate 51 can drive the shell 6 at the top end to correspond to an encapsulating cavity 4, at the moment, a controller controls a pneumatic push rod 21 to drive the material storage cavity 3 and the encapsulating cavity 4 at the bottom end to move towards the shell 6, encapsulating glue flowing out of a communicated first discharge port 31 and a second discharge port 34 is filled in the encapsulating cavity 4 in an initial state, and the bottom ends of sliding plates 43 symmetrically arranged in the encapsulating cavity 4 are mutually extruded and attached to seal the encapsulating glue in the cavity, when the top end of the side wall of the shell 6 is in contact with and extruded by the pressing plate 46, the pressing plate 46 is stressed to drive the sliding plate 43 at the top end to slide upwards in the sliding groove 42, so that the bottom end of the sliding plate 43 sliding upwards is not contacted and attached any more and is not blocked any more, and the pouring sealant flows into the shell 6 under the action of self gravity and realizes the function of pouring; the side wall corresponding to the side face of the top end of the chute 42 is provided with the group of rolling balls 45, so that friction and resistance between the top end of the sliding plate 43 and the side wall of the chute 42 can be effectively reduced, the shell 6 can easily and stably push the sliding plate 43 to move, the stability and the efficiency of the device in operation are further enhanced, meanwhile, in the process that the sliding plate 43 slides upwards, the sliding plate 43 applies pulling force to the baffle 33 through the traction rope 47, the baffle 33 drives the second discharge port 34 to synchronously move while sliding in the sliding cavity 32, the second discharge port 34 is not communicated with the first discharge port 31 any more, at the moment, the baffle 33 can effectively seal the first discharge port 31, and the phenomenon that too much glue material is filled in the capacitor shell 6 due to the fact that glue material in the storage cavity 3 flows in the working process of the encapsulation cavity 4 is; and the embedment chamber 4 that sets up can protect it at the in-process of 6 embedments of casing, reduces the pouring sealant to leak and splash to stability and validity when having strengthened the condenser embedment greatly.
As an embodiment of the invention, a connecting rod 35 is arranged on the inner wall of the first discharge port 31, an elastic floating ball 36 capable of plugging the second discharge port 34 is arranged at the bottom end of the second discharge port, and the floating ball 36 is connected with the end part of the connecting rod 35 through an elastic connecting rope 37; when the device works, when the sliding plate 43 slides upwards under the action of the top end of the capacitor shell 6 and drives the baffle plate 33 to slide synchronously, at this time, the baffle plate 33 cannot immediately plug the first discharge port 31, when the sizing material in the encapsulation cavity 4 flows out from the bottom end, the sizing material in the storage cavity 3 flows into the encapsulation cavity 4 from the communication gap between the first discharge port 31 and the second discharge port 34, which gradually decreases, so that the sizing material in the encapsulation cavity 4 cannot be effectively controlled, at this time, the floating ball 36 is arranged at the bottom end of the second discharge port 34, when the sizing material in the encapsulation cavity 4 just begins to flow out, the higher sizing material exerts upward buoyancy on the floating ball 36 and plugs the second discharge port 34, so that the floating ball 36 plugs and seals the encapsulation cavity 4 when the sizing material just begins to consume, and further, the sizing material amount in the encapsulation cavity 4 is effectively controlled, the encapsulation quality of the capacitor is greatly improved.
As an embodiment of the invention, the bottom end of the baffle 33, where the floating ball 36 is located, is provided with a limiting ring 7, and a set of through discharge chutes 71 are arranged on the side wall of the limiting ring 7; when the floating ball 36 works, under the action of the top connecting rope 37 and the bottom rubber material, the floating ball 36 is easy to deviate from the relative position of the second discharge hole 34, so that the quick and efficient plugging of the floating ball 36 on the second discharge hole 34 is influenced, and at the moment, the limiting ring 7 aligned with the second discharge hole 34 is arranged at the bottom end of the floating ball 36, so that the floating ball 36 is always positioned in the limiting ring 7 to move, and the floating ball 36 can be conveniently and quickly and accurately plugged on the second discharge hole 34 when floating; when the inside sizing material of embedment chamber 4 consumed and finished and need reinforced, float ball 36 was backed down to spacing ring 7 in the pressure of the inside sizing material of storage chamber 3 this moment, and through set up blown down tank 71 on the spacing ring 7 lateral wall this moment, the sizing material that conveniently flows into to spacing ring 7 inside flows out to embedment chamber 4 inside and cycle work from blown down tank 71 to the effectual stability and the continuation of strengthening condenser embedment device at the during operation.
As an embodiment of the invention, the projection shape of the discharge chute 71 in the radial direction of the limit ring 7 is rectangular, and the discharge chutes 71 are annularly and uniformly arranged on the side surface of the limit ring 7; during operation, through setting up shape and the distribution form that sets up blown down tank 71, when guaranteeing that spacing ring 7 can carry out spacingly to floating ball 36, increased blown down tank 71's effective area on the spacing ring 7 for flow in to inside sizing material of spacing ring 7 can be faster flow in to embedment chamber 4 inside from blown down tank 71, and can reduce the sizing material and block up in the inside heap of spacing ring 7, thereby the effectual stability and the high efficiency that improve condenser embedment device during operation.
As an embodiment of the present invention, a magnetic layer 38 capable of attracting the inner wall of the second discharge hole 34 is disposed on the outer surface of the floating ball 36, and the opening of the second discharge hole 34 is gradually enlarged from top to bottom; the during operation, through be equipped with the magnetic layer 38 that the one deck can attract with No. two discharge gate 34 inner walls at the floating ball 36 surface, make magnetic layer 38 drive the floating ball 36 lateral wall and No. two discharge gate 34 lateral walls in-process of attracting each other with No. two discharge gate 34 lateral walls pressfitting, thereby the effectual shutoff effect of floating ball 36 to No. two discharge gate 34 that has improved, and through the shape that sets up No. two discharge gate 34, make the more convenient easy extrusion of floating ball 36 inside No. two discharge gate 34, thereby further strengthened the sealed effect of floating ball 36 to No. two discharge gate 34, further improvement the validity of device during operation.
A thin film capacitor encapsulation process is suitable for the thin film capacitor encapsulation device and comprises the following process steps:
s1: the capacitor cases 6 to be potted are respectively fixed inside the fixing grooves 52 at the top of the turnover plates 51, and then the turnover plates 51 loaded with the capacitor cases 6 are transported to the working area of the conveying table 1 by the conveyor belt 5; by arranging the turnover disc and the fixing groove 52, the shell 6 loaded in the fixing groove 52 can be effectively fixed and limited during the potting treatment, so that the stability of the shell 6 during the operation is enhanced;
s2: after the transfer plate 51 is transported to the working area of the conveying table 1 in S1, the moving position of the transfer plate 51 is fixed by a position sensor provided on the conveying table 1, so that the stopped transfer plate 51 corresponds the capacitor cases 6 inside the top fixing groove 52 to the potting chambers 4 on the top one by one; the movement position of the turnover plate 51 can be controlled through the arranged position sensor, so that the leakage of glue materials caused by the fact that the positions of the shell 6 and the encapsulation structure are not aligned is reduced, and the stability of the shell 6 during encapsulation treatment is further improved;
s3: after the capacitor shell 6 and the encapsulation cavity 4 are in one-to-one correspondence at S2, the controller controls the pneumatic push rod 21 to drive the storage box to move, so that the adhesive inside the storage cavity 3 is filled inside the capacitor shell 6 and the encapsulation treatment is achieved; through the embedment device that sets up not only can effectually carry out quick embedment to casing 6, can also reduce casing 6 at the outer of embedment in-process sizing material leak with splash to the embedment quality of film capacitor has been improved greatly.
When the device works, firstly, the capacitor shell 6 is fixed in the fixing groove 52 at the top end of the turnover plate 51, so that the shell 6 can be effectively fixed and limited during potting treatment, then the conveying table 1 drives the turnover plate 51 to move to the bottom end of the material storage cavity 3 through the conveying belt 5, and can effectively control the movement position of the turnover plate 51 through the arranged position sensor, so that the turnover plate 51 can drive the shell 6 at the top end to correspond to the potting cavity 4, at the moment, the controller controls the pneumatic push rod 21 to drive the material storage cavity 3 and the potting cavity 4 at the bottom end to move towards the shell 6, the potting cavity 4 in an initial state is filled with potting adhesive flowing out from the communicated first discharge port 31 and second discharge port 34, and the bottom ends of the sliding plates 43 symmetrically arranged in the potting cavity 4 are mutually extruded and attached to seal the potting adhesive in the cavity, when the top end of the side wall of the shell 6 is in contact and extruded with the pressing plate 46, at this time, the pressing plate 46 is stressed to drive the sliding plate 43 at the top end to slide upwards in the sliding groove 42, so that the bottom end of the sliding plate 43 sliding upwards is not contacted with and attached to the bottom end of the pouring sealant and is not blocked, and the pouring sealant flows into the shell 6 under the action of self gravity and realizes the function of pouring; the side wall corresponding to the side face of the top end of the chute 42 is provided with the group of rolling balls 45, so that friction and resistance between the top end of the sliding plate 43 and the side wall of the chute 42 can be effectively reduced, the shell 6 can easily and stably push the sliding plate 43 to move, the stability and the efficiency of the device in operation are further enhanced, meanwhile, in the process that the sliding plate 43 slides upwards, the sliding plate 43 applies pulling force to the baffle 33 through the traction rope 47, the baffle 33 drives the second discharge port 34 to synchronously move while sliding in the sliding cavity 32, the second discharge port 34 is not communicated with the first discharge port 31 any more, at the moment, the baffle 33 can effectively seal the first discharge port 31, and the phenomenon that too much glue material is filled in the capacitor shell 6 due to the fact that glue material in the storage cavity 3 flows in the working process of the encapsulation cavity 4 is; and the embedment chamber 4 that sets up can protect it at the in-process of 6 embedments of casing, reduces the pouring sealant to leak and splash to stability and validity when having strengthened the condenser embedment greatly.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. A thin-film capacitor filling and sealing device comprises a conveying table (1); the method is characterized in that: the conveying device is characterized in that a supporting frame (2) is arranged at one end of the conveying table (1), a pneumatic push rod (21) is installed at the top end of the supporting frame (2), a material storage cavity (3) is connected to the bottom of the pneumatic push rod (21), a group of uniformly distributed encapsulation cavities (4) are connected to the bottom of the material storage cavity (3), a first discharge hole (31) is formed in the position, corresponding to the encapsulation cavities (4), of the bottom of the material storage cavity (3), a sliding cavity (32) is formed in the inner wall of one side of the first discharge hole (31), a baffle (33) is connected to the inside of the sliding cavity (32) in a sliding mode, a second discharge hole (34) communicated with the first discharge hole (31) is formed in one end, close to the first discharge hole (31), of the baffle (33), and the inner wall of the; the side wall of the inner end of the encapsulation cavity (4) is symmetrically connected with an inclined downward-arranged encapsulation plate (41), the bottom surfaces of the plugging plates (41) are provided with inclined sliding grooves (42) corresponding to the shapes of the plugging plates, a sliding plate (43) is connected in the sliding groove (42) in a sliding way, an elastic telescopic layer (44) is connected between the top end of the sliding plate (43) and the inner wall of the sliding groove (42), the bottom ends of the two symmetrical sliding plates (43) can be pressed and jointed under the action of the telescopic layer (44), a group of rolling balls (45) which are uniformly arranged are rotatably connected on the side wall of the sliding plate (43) corresponding to the side surface of the top end of the sliding chute (42), the top end of the side wall of the sliding plate (43) opposite to the rolling ball (45) is connected with an L-shaped pressure plate (46), a traction rope (47) is connected with the middle part of the sliding plate (43) and one end of the baffle plate (33) close to the first discharge hole (31); be equipped with conveyer belt (5) on transport platform (1) at storage cavity (3) bottom place, conveyer belt (5) top is equipped with turnover board (51), be provided with on turnover board (51) top surface with embedment chamber (4) corresponding fixed slot (52), fixed slot (52) inside fixed transportation has capacitor case (6), be equipped with the position inductor on transport platform (1) of storage cavity (3) bottom, be equipped with the controller on transport platform (1), the controller is used for controlling means's automatic operation.
2. The thin film capacitor potting device of claim 1, wherein: be equipped with connecting rod (35) on discharge gate (31) inner wall, No. two discharge gate (34) bottom is equipped with elasticity floating ball (36) that can carry out the shutoff to it, link to each other with elastic connection rope (37) between floating ball (36) and connecting rod (35) tip.
3. The thin film capacitor potting device of claim 2, wherein: the floating ball is characterized in that a limiting ring (7) is arranged at the bottom end of a baffle (33) where the outside of the floating ball (36) is located, and a group of through discharge chutes (71) are formed in the side wall of the limiting ring (7).
4. The thin film capacitor potting device of claim 3, wherein: the projection shape of the discharge chute (71) on the radial direction of the limiting ring (7) is rectangular, and the discharge chute (71) is annularly and uniformly distributed on the side surface of the limiting ring (7).
5. The thin film capacitor potting device of claim 3, wherein: the outer surface of the floating ball (36) is provided with a magnetic layer (38) capable of attracting the inner wall of the second discharge hole (34), and the opening of the second discharge hole (34) is gradually enlarged from top to bottom.
6. A thin film capacitor potting process, which is applied to the thin film capacitor potting device according to any one of claims 1 to 5, wherein:
s1: respectively fixing the capacitor shells (6) to be encapsulated inside fixing grooves (52) at the top of a turnover plate (51), and then transporting the turnover plate (51) loaded with the capacitor shells (6) to a working area of a conveying table (1) through a conveying belt (5);
s2: after the turnover plate (51) is transported to a working area of the conveying table (1) in S1, fixing the moving position of the turnover plate (51) through a position sensor arranged on the conveying table (1), so that the stopped turnover plate (51) enables the capacitor shells (6) in the top fixing groove (52) to correspond to the encapsulation cavities (4) on the top in a one-to-one mode;
s3: after the capacitor shell (6) and the encapsulation cavity (4) are in one-to-one correspondence at S2, the controller controls the pneumatic push rod (21) to drive the storage box to move, so that the adhesive inside the storage cavity (3) is filled inside the capacitor shell (6) and the purpose of encapsulation treatment is achieved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911414365.8A CN111063557A (en) | 2019-12-31 | 2019-12-31 | Thin-film capacitor encapsulating device and encapsulating process |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911414365.8A CN111063557A (en) | 2019-12-31 | 2019-12-31 | Thin-film capacitor encapsulating device and encapsulating process |
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| Publication Number | Publication Date |
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| CN111063557A true CN111063557A (en) | 2020-04-24 |
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| CN201911414365.8A Withdrawn CN111063557A (en) | 2019-12-31 | 2019-12-31 | Thin-film capacitor encapsulating device and encapsulating process |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111889326A (en) * | 2020-06-03 | 2020-11-06 | 北方夜视技术股份有限公司 | Image intensifier high-voltage power supply voltage-multiplying module integrated encapsulating device and encapsulating method |
| CN112635203A (en) * | 2020-12-10 | 2021-04-09 | 扬州日精电子有限公司 | Thin film capacitor embedment device |
| CN115295330A (en) * | 2022-08-12 | 2022-11-04 | 扬州日精电子有限公司 | Thin film capacitor plug-in shell glue filling all-in-one machine capable of reducing cleaning area |
| CN116705959A (en) * | 2023-08-08 | 2023-09-05 | 永林电子股份有限公司 | Packaging structure of LED light source device |
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2019
- 2019-12-31 CN CN201911414365.8A patent/CN111063557A/en not_active Withdrawn
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111889326A (en) * | 2020-06-03 | 2020-11-06 | 北方夜视技术股份有限公司 | Image intensifier high-voltage power supply voltage-multiplying module integrated encapsulating device and encapsulating method |
| CN112635203A (en) * | 2020-12-10 | 2021-04-09 | 扬州日精电子有限公司 | Thin film capacitor embedment device |
| CN115295330A (en) * | 2022-08-12 | 2022-11-04 | 扬州日精电子有限公司 | Thin film capacitor plug-in shell glue filling all-in-one machine capable of reducing cleaning area |
| CN115295330B (en) * | 2022-08-12 | 2023-11-03 | 扬州日精电子有限公司 | Film capacitor shell inserting and glue filling integrated machine capable of reducing cleaning area |
| CN116705959A (en) * | 2023-08-08 | 2023-09-05 | 永林电子股份有限公司 | Packaging structure of LED light source device |
| CN116705959B (en) * | 2023-08-08 | 2023-12-01 | 永林电子股份有限公司 | Packaging equipment for LED light source device |
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