CN111042481B - Graphene far-infrared ground heating brick - Google Patents
Graphene far-infrared ground heating brick Download PDFInfo
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- CN111042481B CN111042481B CN201911401440.7A CN201911401440A CN111042481B CN 111042481 B CN111042481 B CN 111042481B CN 201911401440 A CN201911401440 A CN 201911401440A CN 111042481 B CN111042481 B CN 111042481B
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 124
- 229910021389 graphene Inorganic materials 0.000 title claims abstract description 109
- 239000011449 brick Substances 0.000 title claims abstract description 70
- 238000010438 heat treatment Methods 0.000 title claims abstract description 64
- 239000010410 layer Substances 0.000 claims abstract description 97
- 239000002344 surface layer Substances 0.000 claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052802 copper Inorganic materials 0.000 claims abstract description 4
- 239000010949 copper Substances 0.000 claims abstract description 4
- 238000002156 mixing Methods 0.000 claims description 30
- 239000000835 fiber Substances 0.000 claims description 28
- 239000000843 powder Substances 0.000 claims description 24
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- 238000000576 coating method Methods 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 19
- 239000002994 raw material Substances 0.000 claims description 18
- 239000000725 suspension Substances 0.000 claims description 18
- 239000000945 filler Substances 0.000 claims description 17
- 239000000243 solution Substances 0.000 claims description 16
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 15
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 15
- 229910002804 graphite Inorganic materials 0.000 claims description 13
- 239000010439 graphite Substances 0.000 claims description 13
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 12
- 238000001035 drying Methods 0.000 claims description 12
- 238000009210 therapy by ultrasound Methods 0.000 claims description 12
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 9
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 claims description 9
- 238000001125 extrusion Methods 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 9
- 238000002360 preparation method Methods 0.000 claims description 9
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 9
- 239000002904 solvent Substances 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- -1 alkoxide compound Chemical class 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 claims description 7
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 6
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 claims description 6
- 239000012153 distilled water Substances 0.000 claims description 6
- IDGUHHHQCWSQLU-UHFFFAOYSA-N ethanol;hydrate Chemical compound O.CCO IDGUHHHQCWSQLU-UHFFFAOYSA-N 0.000 claims description 6
- 238000000227 grinding Methods 0.000 claims description 6
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- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 150000001450 anions Chemical class 0.000 claims description 3
- 239000007864 aqueous solution Substances 0.000 claims description 3
- 239000000440 bentonite Substances 0.000 claims description 3
- 229910000278 bentonite Inorganic materials 0.000 claims description 3
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 claims description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 3
- 239000004917 carbon fiber Substances 0.000 claims description 3
- 239000002041 carbon nanotube Substances 0.000 claims description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 3
- 239000004927 clay Substances 0.000 claims description 3
- 230000001112 coagulating effect Effects 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 3
- 239000006185 dispersion Substances 0.000 claims description 3
- 238000010304 firing Methods 0.000 claims description 3
- 239000010881 fly ash Substances 0.000 claims description 3
- 230000007062 hydrolysis Effects 0.000 claims description 3
- 238000006460 hydrolysis reaction Methods 0.000 claims description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 3
- 239000002105 nanoparticle Substances 0.000 claims description 3
- 229920000620 organic polymer Polymers 0.000 claims description 3
- 229910000073 phosphorus hydride Inorganic materials 0.000 claims description 3
- 238000006068 polycondensation reaction Methods 0.000 claims description 3
- 239000002861 polymer material Substances 0.000 claims description 3
- 238000010008 shearing Methods 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- NFMWFGXCDDYTEG-UHFFFAOYSA-N trimagnesium;diborate Chemical compound [Mg+2].[Mg+2].[Mg+2].[O-]B([O-])[O-].[O-]B([O-])[O-] NFMWFGXCDDYTEG-UHFFFAOYSA-N 0.000 claims description 3
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 claims description 3
- 238000002166 wet spinning Methods 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
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- 239000000919 ceramic Substances 0.000 description 2
- 241000826860 Trapezium Species 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
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Images
Classifications
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/02044—Separate elements for fastening to an underlayer
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B33/00—Clay-wares
- C04B33/02—Preparing or treating the raw materials individually or as batches
- C04B33/13—Compounding ingredients
- C04B33/132—Waste materials; Refuse; Residues
- C04B33/135—Combustion residues, e.g. fly ash, incineration waste
- C04B33/1352—Fuel ashes, e.g. fly ash
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B38/00—Porous mortars, concrete, artificial stone or ceramic ware; Preparation thereof
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/02161—Floor elements with grooved main surface
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/18—Separately-laid insulating layers; Other additional insulating measures; Floating floors
- E04F15/181—Insulating layers integrally formed with the flooring or the flooring elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/34—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3418—Silicon oxide, silicic acids or oxide forming salts thereof, e.g. silica sol, fused silica, silica fume, cristobalite, quartz or flint
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/60—Production of ceramic materials or ceramic elements, e.g. substitution of clay or shale by alternative raw materials, e.g. ashes
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- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Chemical & Material Sciences (AREA)
- Structural Engineering (AREA)
- Ceramic Engineering (AREA)
- Civil Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Environmental & Geological Engineering (AREA)
- Combustion & Propulsion (AREA)
- Resistance Heating (AREA)
- Surface Heating Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention relates to a graphene far-infrared ground heating brick which comprises brick units and connecting pieces arranged between the adjacent brick units; the brick unit comprises a bottom brick and a panel from bottom to top, wherein the bottom brick comprises a bottom frame and a graphene heat conduction assembly; a heating film is arranged in the graphene heat conduction assembly; the panel comprises a surface layer, the bottom surface of the surface layer is provided with a groove, and a heat conducting brick layer is bonded in the groove; two sides of the bottom brick are bevel edges which incline inwards from top to bottom, two sides of the panel extend outwards to form a connecting part, the bottom of the connecting part is concave inwards to form a concave interface, the side of the bottom brick is provided with a socket, and the socket is connected with the heating film through a lead; the connecting piece is a strip-shaped structure with a trapezoidal cross section, trapezoidal inclined planes arranged on two side edges of the connecting piece are matched with inclined edges, joints matched with the concave connectors are arranged at two ends of the upper surface of each trapezoidal inclined plane, inserting blocks matched with the inserting ports are arranged at the lower parts of the trapezoidal inclined planes, and the inserting blocks on the two sides are made of connected copper strips. This warm up brick radiating effect is good, lays concatenation easy operation and security height.
Description
Technical Field
The invention relates to the field of heating plates made of electric heating materials, in particular to a graphene far infrared heating brick.
Background
The traditional heating system comprises a radiator, an air conditioner, a point heating system represented by a radiator and a line heating system represented by a heating cable, and the traditional heating mode has the defects of large energy consumption, large occupied space, low heat energy utilization rate and the like.
At present, heating chip heating is developed as a novel heating mode, and the heating chip is made of conductive special printing ink and metal current carrying strips which are processed and hot-pressed between insulating polyester films. The electrothermal film is used as a heating body during working, heat is sent into a space in a radiation mode, and the comprehensive effect of the electrothermal film is superior to that of the traditional convection heating mode. Graphene has very good heat conduction performance, the heat conductivity coefficient is as high as 5300W/mK, the graphene is the carbon material with the highest heat conductivity coefficient so far, and a heating floor or a wall board prepared by the graphene is available at present. However, the problem faced by the current floor and floor tile using graphene heating chips is that the heat dissipation effect is not ideal, the heated space cannot be heated up quickly, and the functionality is poor. In addition, the current graphite alkene generates heat and connects the circular telegram through the joint interconnect of side when ceramic tile lays, and wiring department drops easily during the concatenation to side department is for linking up the gap just, very easily infiltrates into water or other liquid, leads to connecting into water, and the influence generates heat the normal of ceramic tile and generates heat, and graphite alkene generates heat the layer and wets easily, further causes the decline of heat conduction efficiency.
Disclosure of Invention
The invention aims to provide a graphene far-infrared ground heating brick which is good in heat dissipation effect, simple in laying and splicing operation and high in safety.
In order to achieve the purpose, the technical scheme adopted by the invention is that the graphene far infrared heating brick comprises brick units which are connected and laid front and back and connecting pieces which are arranged between the adjacent brick units; the brick unit comprises a bottom brick and a panel from bottom to top, the bottom brick comprises a bottom frame and a graphene heat conduction assembly, the bottom frame is of a shallow disc structure with a concave upper surface in the middle, and the graphene heat conduction assembly is arranged in the concave; a heating film is arranged in the graphene heat conduction assembly, and a heat conduction surface is formed above the heating film; the panel comprises a surface layer, the bottom surface of the surface layer is provided with a groove, and a heat conducting brick layer is bonded in the groove;
two side edges of the bottom brick are inclined edges which are inclined inwards from top to bottom, two sides of the panel extend outwards to form a connecting part, the bottom of the connecting part is concave inwards to form a concave interface, a socket is arranged on the side edge of the bottom brick, and the socket is connected with the heating film through a lead;
the connecting piece is for having trapezoidal cross section's strip structure, the trapezoidal inclined plane that its both sides limit was equipped with the hypotenuse cooperatees, trapezoidal inclined plane upper surface both ends be equipped with concave interface matched with connects, trapezoidal inclined plane lower part be equipped with socket matched with inserted block, both sides the inserted block is made for the copper product material that is connected.
Furthermore, the heat conducting brick layer is composed of a porous floor tile material layer and a heat conducting filler filled in the porous floor tile material layer;
the heat conduction filler is prepared from the following raw materials in parts by weight: 20-40 parts of graphene powder, 10-35 parts of graphene fiber, 10-20 parts of nano far infrared anion powder and 20-50 parts of bisphenol A epoxy resin;
the porous floor tile material layer comprises the following raw materials in parts by weight: 20-80 parts of diatomite, 10-30 parts of white clay, 10-30 parts of bentonite and 8-14 parts of fly ash.
Further, the graphene fiber is prepared by the following method: carrying out wet spinning on graphene oxide DMF dispersion liquid with the solid content of 10-15mg/g through an ethyl acetate coagulating bath to obtain graphene oxide long fibers, drying at the drying temperature of 70-75 ℃ for 12h, and shearing the dried graphene oxide long fibers into graphene oxide short fibers; wherein the maximum radial diameter of the graphene fiber is 10-50 μm, and the length is 100-800 nm;
the preparation method of the heat conduction filler comprises the following steps: weighing the graphene powder in parts by weight, soaking the graphene powder in ethanol water for 1-5 hours, adding nano far infrared negative ion powder, fully mixing, adding 2 times of distilled water by weight, carrying out ultrasonic treatment for 15min, uniformly mixing to obtain a suspension, and carrying out reduced pressure concentration until the volume of the suspension is reduced to 30-55% of the original volume; adding bisphenol A epoxy resin and graphene fiber into the suspension, and performing ultrasonic treatment for 15 min; mixing uniformly to obtain the heat conducting filler.
Further, the porous floor tile material layer is prepared by the following method: uniformly mixing the raw materials in parts by weight, feeding the mixture into a high-pressure extrusion molding machine, extruding the mixture into a porous brick blank by using a porous extrusion die of the high-pressure extrusion molding machine, feeding the blank into an oven by using a conveying belt after blank discharging, drying the blank at the temperature of 100 ℃ plus 200 ℃, and then conveying the dried blank to a firing kiln for baking.
Furthermore, the graphene heat conduction assembly comprises an upper insulating layer, a conductive heating layer, a conducting layer, a reflecting layer and a lower insulating layer from top to bottom; the conductive heating layer comprises a heating element arranged on the conducting layer and a heat radiating piece arranged above the heating element; the heating element is coated with graphene composite coating above the conducting layer, and the heat dissipation piece is a graphene composite rack uniformly laid on the surface of the heating element.
Further, the graphene composite coating is prepared from the following raw materials in parts by weight: 30-50 parts of graphene powder, 40-85 parts of ethanol aqueous solution, 10-30 parts of bisphenol A epoxy resin and 3-8 parts of hydroxyalkylamide;
the preparation method of the graphene composite coating comprises the following steps: weighing the graphene powder in parts by weight, soaking the graphene powder in an ethanol water solution for 1-5 hours, adding hydroxyalkylamide, fully mixing, adding 5 times of distilled water by weight, carrying out ultrasonic treatment at the power of 50-60kHz for 10min, uniformly mixing to obtain a suspension, and carrying out reduced pressure concentration until the volume of the suspension is reduced to 30-55% of the original volume; adding bisphenol A epoxy resin into the suspension, and performing ultrasonic treatment at 40-50kHz power for 15 min; uniformly mixing to obtain the graphene composite coating;
the graphene composite rack is formed by spot coating a solution prepared by mixing nano-sized graphene fragments and a solvent according to a weight ratio of 1: 1-2.5; the solvent comprises 10-20 parts by weight of dimethylformamide solvent and 0.5-2 parts by weight of aminoethylpiperazine; the diameter of the graphene composite rack is 10-45 mu m, and the thickness of the graphene composite rack is 100-400 mu m.
Furthermore, the conducting layer is arranged on the lower surface of the heating element, and the side end of the conducting layer is connected with the socket through an electric wire; the thickness of the conducting layer is 0.5-2 mm;
the conducting layer comprises the following components in parts by weight: 30-40 parts of conductive silver paste, 25-35 parts of silicon carbide powder, 12-25 parts of gamma-aminopropyltriethoxysilane and aminoethylpiperazine; the preparation method of the conducting layer comprises the following steps: putting silicon carbide powder, gamma-aminopropyltriethoxysilane and aminoethylpiperazine into a stirring device for mixing, and then putting the mixture into a grinder for grinding until the fineness of the raw materials is 1-10 mu m; and adding conductive silver paste into the ground material, further grinding and mixing until the fineness of the raw material is less than 20 micrometers, thus obtaining the conducting layer solution, coating the conducting layer on the upper surface of the reflecting layer through the conducting layer solution, and drying to obtain the conductive coating.
Furthermore, the upper insulating layer and the lower insulating layer are made of organic polymer materials; the reflecting layer is a nano silver particle fiber film, and the nano silver particle fiber film is obtained by hydrolysis and polycondensation of fibrous nano silver, trimethoxypropylsilane, phosphine and an alkoxide compound.
Further, the graphene heat conduction assembly at the bottom frame depression position is provided with a heat transfer layer, the heat transfer layer is composed of an alloy honeycomb plate and a high heat conduction filler filled in a honeycomb cavity of the alloy honeycomb plate, and the high heat conduction filler 131 is one or more of boron nitride, silicon carbide, magnesium borate, aluminum oxide, calcium carbonate, calcium sulfate, graphite, expandable graphite, expanded graphite, carbon fiber or carbon nanotube; the thickness of the heat transfer layer is 2-10 mm.
Furthermore, a lower engaging tooth is arranged on the upper surface of the bottom frame of the bottom brick, and an upper engaging tooth matched with the lower engaging tooth is arranged on the bottom surface of the panel; the lower rodent and the upper rodent are connected through bonding.
According to the graphene far-infrared floor heating brick disclosed by the invention, the floor unit is connected through the connecting piece, so that on one hand, the splicing connection operation is simpler, and the falling of the joint is avoided due to the double matching of the inserting block of the connecting piece and the joint; on the other hand connects blockking of cooperation trapezium structure and joint and avoids the rivers of infiltration to flow into the inserted block of connecting piece side, avoids the junction to wet, and further simplifies the operation of laying bricks through mutual block concatenation, beautifies the concatenation effect.
According to the surface heat conduction brick layer structure arranged on the graphene far infrared floor heating brick, graphene and graphene fibers are fused onto the floor brick with the porous structure, so that the heat transfer area is further enlarged, the thickness of a blocking medium is reduced, and the heat transfer and radiation efficiency is improved; and the graphite alkene rack on graphite alkene heat conduction subassembly's the electrically conductive layer that generates heat forms multipoint mode, high specific surface area's heat radiation structure for this electric heat membrane has more excellent radiating effect.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without inventive efforts.
FIG. 1 is a schematic structural diagram of one embodiment of a graphene far infrared heating brick;
FIG. 2 is a schematic structural view of one embodiment of a bottom block;
FIG. 3 is a schematic cross-sectional view of one embodiment of a graphene thermal conductive assembly;
FIG. 4 is a schematic cross-sectional view of yet another embodiment of a bottom tile;
FIG. 5 is a schematic structural view of one embodiment of a heat transfer layer;
fig. 6 is a partial structural schematic view of a brick unit.
Detailed Description
In order to make the purpose, technical solution and beneficial effects of the present application more clear and more obvious, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
A graphene far-infrared ground heating brick comprises brick units 1 which are connected and laid back and forth and connecting pieces 2 which are arranged between the adjacent brick units 1; as shown in fig. 1-2. The brick unit 1 comprises a bottom brick 12 and a panel 11 from bottom to top, wherein the bottom brick 12 comprises a bottom frame 120 and a graphene heat conduction assembly 121, the bottom frame 120 is a shallow disc structure with a concave upper surface in the middle, and the graphene heat conduction assembly 121 is arranged in the concave upper surface; a heating film is arranged in the graphene heat conduction assembly 121, and a heat conduction surface is formed above the heating film; the panel 11 includes a surface layer 110, a groove is disposed on a bottom surface of the surface layer 110, and a thermal conductive brick layer 111 is bonded in the groove.
The both sides limit of end brick 12 is the hypotenuse 115 of from top to bottom leanin, the outside extension in panel 11 both sides is established to linking portion 112, the concave interface 113 that forms in the bottom of linking portion 112, the side of end brick 12 is equipped with socket 122, connect through the wire in the socket 122 the heating film.
Connecting piece 2 is for having trapezoidal cross section's strip structure, trapezoidal inclined plane 22 that its both sides limit was equipped with hypotenuse 115 cooperatees, trapezoidal inclined plane 22 upper surface both ends be equipped with concave interface 113 matched with connects 21, trapezoidal inclined plane 22 lower part be equipped with socket 122 matched with inserted block 20, both sides inserted block 20 is made for the copper product material that is connected.
When the connector is used, the connector of the connecting piece is inserted into the concave interface, and the inserting block is inserted into the inserting opening for connection. The socket and the plug block are understood as a male plug and a female plug structure which are connected with each other, and the prior art is adopted, and the detailed structural description is omitted. The connecting piece is of a trapezoidal structure and a joint structure, so that water can be better prevented from permeating into the socket, and the trapezoidal structure of the connecting piece is favorable for bricklaying operation.
In a specific example, the thermal conductivity brick layer 111 is modified to be composed of a porous floor tile material layer and a thermal conductivity filler filled in the porous floor tile material layer;
the heat conduction filler is prepared from the following raw materials in parts by weight: 20-40 parts of graphene powder, 10-35 parts of graphene fiber, 10-20 parts of nano far infrared anion powder and 20-50 parts of bisphenol A epoxy resin; the porous floor tile material layer comprises the following raw materials in parts by weight: 20-80 parts of diatomite, 10-30 parts of white clay, 10-30 parts of bentonite and 8-14 parts of fly ash.
The graphene fiber is prepared by the following method: carrying out wet spinning on graphene oxide DMF dispersion liquid with the solid content of 10-15mg/g through an ethyl acetate coagulating bath to obtain graphene oxide long fibers, drying at the drying temperature of 70-75 ℃ for 12h, and shearing the dried graphene oxide long fibers into graphene oxide short fibers; wherein the maximum radial diameter of the graphene fiber is 10-50 μm, and the length is 100-800 nm.
The preparation method of the heat conduction filler comprises the following steps: weighing the graphene powder in parts by weight, soaking the graphene powder in ethanol water for 1-5 hours, adding nano far infrared negative ion powder, fully mixing, adding 2 times of distilled water by weight, carrying out ultrasonic treatment for 15min, uniformly mixing to obtain a suspension, and carrying out reduced pressure concentration until the volume of the suspension is reduced to 30-55% of the original volume; adding bisphenol A epoxy resin and graphene fiber into the suspension, and performing ultrasonic treatment for 15 min; mixing uniformly to obtain the heat conducting filler.
The porous floor tile material layer is prepared by the following method: uniformly mixing the raw materials in parts by weight, feeding the mixture into a high-pressure extrusion molding machine, extruding the mixture into a porous brick blank by using a porous extrusion die of the high-pressure extrusion molding machine, feeding the blank into an oven by using a conveying belt after blank discharging, drying the blank at the temperature of 100 ℃ plus 200 ℃, and then conveying the dried blank to a firing kiln for baking.
In the scheme, the thermal conductive brick layer keeps the mechanical property of the composite brick layer through the porous interlayer with the graphene thermal conductive material, and extends a heat transfer chain forwards to further accelerate the heat transfer and heat dissipation effects; meanwhile, the multifunctional far infrared sterilizer has the functions of far infrared emission and negative ion release, plays a role in purification and disinfection, and also plays a role in human health.
In another example, as shown in fig. 3, the graphene thermal conductive assembly 121 includes, from top to bottom, an upper insulating layer 210, an electrically conductive heat generating layer 211, a conducting layer 212, a reflecting layer 213, and a lower insulating layer 214; the conductive heating layer 211 comprises a heating element arranged on the conducting layer 212 and a heat sink arranged above the heating element; the heating element is a graphene composite coating 1041 coated above the conducting layer 212, and the heat dissipation piece is a graphene composite rack 1042 uniformly laid on the surface of the heating element.
In a specific example, the graphene composite coating 1041 is prepared from the following raw materials in parts by weight: 30-50 parts of graphene powder, 40-85 parts of ethanol aqueous solution, 10-30 parts of bisphenol A epoxy resin and 3-8 parts of hydroxyalkylamide; the preparation method of the graphene composite coating 1041 comprises the following steps: weighing the graphene powder in parts by weight, soaking the graphene powder in an ethanol water solution for 1-5 hours, adding hydroxyalkylamide, fully mixing, adding 5 times of distilled water by weight, carrying out ultrasonic treatment at the power of 50-60kHz for 10min, uniformly mixing to obtain a suspension, and carrying out reduced pressure concentration until the volume of the suspension is reduced to 30-55% of the original volume; adding bisphenol A epoxy resin into the suspension, and performing ultrasonic treatment at 40-50kHz power for 15 min; and mixing uniformly to obtain the graphene composite coating 1041.
In a specific example, the graphene composite rack 1042 is formed by spot coating a solution prepared by mixing nano-sized graphene fragments and a solvent in a weight ratio of 1: 1-2.5; the solvent comprises 10-20 parts by weight of dimethylformamide solvent and 0.5-2 parts by weight of aminoethylpiperazine; the diameter of the graphene composite rack 1042 is 10-45 μm, and the thickness is 100-400 μm.
The invention further improves the conducting layer, in one example, the conducting layer 212 is arranged on the lower surface of the heating element, and the side end of the conducting layer 212 is connected with the socket 122 through a wire; the thickness of the conducting layer 212 is 0.5-2 mm; the conductive layer 212 comprises the following components in parts by weight: 30-40 parts of conductive silver paste, 25-35 parts of silicon carbide powder, 12-25 parts of gamma-aminopropyltriethoxysilane and aminoethylpiperazine; the preparation method of the conductive layer 212 comprises the following steps: putting silicon carbide powder, gamma-aminopropyltriethoxysilane and aminoethylpiperazine into a stirring device for mixing, and then putting the mixture into a grinder for grinding until the fineness of the raw materials is 1-10 mu m; and adding conductive silver paste into the ground material, further grinding and mixing until the fineness of the raw material is less than 20 micrometers to obtain the conductive layer solution, and coating the conductive layer 212 on the upper surface of the reflecting layer 213 through the conductive layer solution and then drying to obtain the conductive layer solution.
The upper insulating layer 210 and the lower insulating layer 214 are made of an organic polymer material; the reflecting layer 213 is a nano silver particle fiber film, and the nano silver particle fiber film is obtained by hydrolysis and polycondensation of fibrous nano silver, trimethoxypropylsilane, phosphine and an alkoxide compound.
In order to make the floor tile more compact, in another example, as shown in fig. 4, the graphene heat conducting member 121 in the recessed position of the bottom frame 120 is provided with a heat conducting layer 129, and the heat conducting layer 129 is composed of an alloy honeycomb plate 130 and a high heat conducting filler 131 filled in the honeycomb cavity of the alloy honeycomb plate 130, as shown in fig. 5. The high thermal conductivity filler 131 is one or more of boron nitride, silicon carbide, magnesium borate, alumina, calcium carbonate, calcium sulfate, graphite, expandable graphite, expanded graphite, carbon fiber or carbon nano tube; the thickness of the heat transfer layer 129 is 2-10 mm.
Figure 6 shows a connection between the bottom brick and the panel of the brick unit, as shown in figure 6, the upper surface of the bottom frame 120 of the bottom brick 12 is provided with a lower tooth 127, and the bottom surface of the panel 11 is provided with an upper tooth 126 which cooperates with the lower tooth 127; the lower tooth ring 127 and the upper tooth ring 126 are connected through bonding.
The above-described embodiments do not limit the scope of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the above-described embodiments should be included in the protection scope of the technical solution.
Claims (10)
1. The graphene far-infrared floor heating brick is characterized by comprising brick units (1) which are connected and paved in a front-back mode and connecting pieces (2) which are arranged between the adjacent brick units (1); the brick unit (1) comprises a bottom brick (12) and a panel (11) from bottom to top, the bottom brick (12) comprises a bottom frame (120) and a graphene heat conduction assembly (121), the bottom frame (120) is of a shallow disc structure with a concave upper surface in the middle, and the graphene heat conduction assembly (121) is arranged in the concave part; a heating film is arranged in the graphene heat conduction assembly (121), and a heat conduction surface is formed above the heating film; the panel (11) comprises a surface layer (110), the bottom surface of the surface layer (110) is provided with a groove, and a heat conducting brick layer (111) is bonded in the groove;
the two side edges of the bottom brick (12) are inclined oblique edges (115) which are inclined inwards from top to bottom, the two sides of the panel (11) extend outwards to form a connecting part (112), the bottom of the connecting part (112) is recessed inwards to form a concave interface (113), the side edge of the bottom brick (12) is provided with a socket (122), and the socket (122) is connected with the heating film through a lead;
connecting piece (2) is for having the strip structure of trapezoidal cross section, trapezoidal inclined plane (22) that its both sides limit was equipped with hypotenuse (115) cooperate, trapezoidal inclined plane (22) upper surface both ends be equipped with concave interface (113) matched with connects (21), trapezoidal inclined plane (22) lower part be equipped with socket (122) matched with inserted block (20), both sides inserted block (20) are made for the copper product material that is connected.
2. The graphene far-infrared heating brick according to claim 1, wherein the thermal conductive brick layer (111) is composed of a porous floor tile material layer and a thermal conductive filler filled in the porous floor tile material layer;
the heat conduction filler is prepared from the following raw materials in parts by weight: 20-40 parts of graphene powder, 10-35 parts of graphene fiber, 10-20 parts of nano far infrared anion powder and 20-50 parts of bisphenol A epoxy resin;
the porous floor tile material layer comprises the following raw materials in parts by weight: 20-80 parts of diatomite, 10-30 parts of white clay, 10-30 parts of bentonite and 8-14 parts of fly ash.
3. The graphene far-infrared heating brick as claimed in claim 2, wherein the graphene fiber is prepared by the following method: carrying out wet spinning on graphene oxide DMF dispersion liquid with the solid content of 10-15mg/g through an ethyl acetate coagulating bath to obtain graphene oxide long fibers, drying at the drying temperature of 70-75 ℃ for 12h, and shearing the dried graphene oxide long fibers into graphene oxide short fibers; wherein the maximum radial diameter of the graphene fiber is 10-50 μm, and the length is 100-800 nm;
the preparation method of the heat conduction filler comprises the following steps: weighing the graphene powder in parts by weight, soaking the graphene powder in ethanol water for 1-5 hours, adding nano far infrared negative ion powder, fully mixing, adding 2 times of distilled water by weight, carrying out ultrasonic treatment for 15min, uniformly mixing to obtain a suspension, and carrying out reduced pressure concentration until the volume of the suspension is reduced to 30-55% of the original volume; adding bisphenol A epoxy resin and graphene fiber into the suspension, and performing ultrasonic treatment for 15 min; mixing uniformly to obtain the heat conducting filler.
4. The graphene far-infrared heating brick according to claim 2, wherein the porous floor tile material layer is prepared by the following method: uniformly mixing the raw materials in parts by weight, feeding the mixture into a high-pressure extrusion molding machine, extruding the mixture into a porous brick blank by using a porous extrusion die of the high-pressure extrusion molding machine, feeding the blank into an oven by using a conveying belt after blank discharging, drying the blank at the temperature of 100 ℃ plus 200 ℃, and then conveying the dried blank to a firing kiln for baking.
5. The graphene far-infrared heating brick as claimed in claim 1, wherein the graphene heat-conducting component (121) comprises an upper insulating layer (210), an electrically-conductive heat-generating layer (211), a conducting layer (212), a reflecting layer (213) and a lower insulating layer (214) from top to bottom; the conductive heating layer (211) comprises a heating element arranged on the conducting layer (212) and a heat dissipation piece arranged above the heating element; the heating element is coated with graphene composite coating (1041) above the conducting layer (212), and the heat dissipation piece is a graphene composite rack (1042) uniformly laid on the surface of the heating element.
6. The graphene far-infrared heating brick as claimed in claim 5, wherein the graphene composite coating (1041) is prepared from the following raw materials in parts by weight: 30-50 parts of graphene powder, 40-85 parts of ethanol aqueous solution, 10-30 parts of bisphenol A epoxy resin and 3-8 parts of hydroxyalkylamide;
the preparation method of the graphene composite coating (1041) comprises the following steps: weighing the graphene powder in parts by weight, soaking the graphene powder in an ethanol water solution for 1-5 hours, adding hydroxyalkylamide, fully mixing, adding 5 times of distilled water by weight, carrying out ultrasonic treatment at the power of 50-60kHz for 10min, uniformly mixing to obtain a suspension, and carrying out reduced pressure concentration until the volume of the suspension is reduced to 30-55% of the original volume; adding bisphenol A epoxy resin into the suspension, and performing ultrasonic treatment at 40-50kHz power for 15 min; uniformly mixing to obtain the graphene composite coating (1041);
the graphene composite rack (1042) is formed by spot coating a solution prepared by mixing nano-sized graphene fragments and a solvent according to a weight ratio of 1: 1-2.5; the solvent comprises 10-20 parts by weight of dimethylformamide solvent and 0.5-2 parts by weight of aminoethylpiperazine; the diameter of the graphene composite rack (1042) is 10-45 mu m, and the thickness is 100-400 mu m.
7. The graphene far-infrared heating brick as claimed in claim 5, wherein the conducting layer (212) is arranged on the lower surface of the heating element, and the side end of the conducting layer (212) is connected with the socket (122) through a wire; the thickness of the conducting layer (212) is 0.5-2 mm;
the conductive layer (212) comprises the following components in parts by weight: 30-40 parts of conductive silver paste, 25-35 parts of silicon carbide powder, 12-25 parts of gamma-aminopropyltriethoxysilane and aminoethylpiperazine; the preparation method of the conducting layer (212) comprises the following steps: putting silicon carbide powder, gamma-aminopropyltriethoxysilane and aminoethylpiperazine into a stirring device for mixing, and then putting the mixture into a grinder for grinding until the fineness of the raw materials is 1-10 mu m; and adding conductive silver paste into the ground material, further grinding and mixing until the fineness of the raw material is less than 20 micrometers to obtain a conductive layer solution, coating the conductive layer (212) on the upper surface of the reflecting layer (213) through the conductive layer solution, and drying to obtain the conductive layer coating.
8. The graphene far-infrared heating brick as claimed in claim 5, wherein the upper insulating layer (210) and the lower insulating layer (214) are made of an organic polymer material; the reflecting layer (213) is a nano silver particle fiber film, and the nano silver particle fiber film is obtained by hydrolysis and polycondensation of fibrous nano silver, trimethoxypropylsilane, phosphine and an alkoxide compound.
9. The graphene far-infrared heating brick according to claim 1, wherein a heat transfer layer (129) is disposed on the graphene heat conducting component (121) at the recessed position of the bottom frame (120), the heat transfer layer (129) is composed of an alloy honeycomb plate (130) and a high heat conducting filler (131) filled in the honeycomb cavity of the alloy honeycomb plate (130), and the high heat conducting filler (131) is one or more of boron nitride, silicon carbide, magnesium borate, aluminum oxide, calcium carbonate, calcium sulfate, graphite, expandable graphite, expanded graphite, carbon fiber or carbon nanotube; the thickness of the heat transfer layer (129) is 2-10 mm.
10. The graphene far-infrared heating brick as claimed in claim 1, wherein the upper surface of the bottom frame (120) of the bottom brick (12) is provided with a lower engaging tooth (127), and the bottom surface of the panel (11) is provided with an upper engaging tooth (126) which is matched with the lower engaging tooth (127); the lower tooth ring (127) and the upper tooth ring (126) are connected in an adhesive manner.
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