CN111031754A - PCB cooling assembly and server having the same - Google Patents
PCB cooling assembly and server having the same Download PDFInfo
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- CN111031754A CN111031754A CN201911289312.8A CN201911289312A CN111031754A CN 111031754 A CN111031754 A CN 111031754A CN 201911289312 A CN201911289312 A CN 201911289312A CN 111031754 A CN111031754 A CN 111031754A
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- 238000001816 cooling Methods 0.000 title claims 3
- 230000017525 heat dissipation Effects 0.000 claims abstract description 288
- 230000001154 acute effect Effects 0.000 claims description 4
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 24
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 24
- 230000002035 prolonged effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a PCB (printed circuit board) heat dissipation assembly and a server with the same, wherein the PCB heat dissipation assembly comprises a PCB and a heat radiator, wherein a plurality of chips which are arranged in an array are arranged on the PCB, the heat radiator is arranged on at least one side surface of the PCB and comprises a plurality of groups of heat dissipation groups, each group of heat dissipation groups comprises a plurality of heat dissipation fins which are parallel to each other, an air channel is defined between every two adjacent heat dissipation fins, the plurality of groups of heat dissipation groups are sequentially arranged along the extending direction of the air channel, and an included angle α is formed between the heat dissipation fins in every two adjacent groups of heat dissipation groups, wherein α meets the requirements that α is not equal to 0 degree and α is not equal to 180 degrees, according to the PCB heat dissipation assembly, hot air can form turbulent flow when passing through the air channel of the heat radiator, viscous layers on the heat dissipation fins can be effectively prevented, the heat dissipation efficiency of the whole PCB heat.
Description
Technical Field
The invention relates to the technical field of PCBs, in particular to a PCB heat dissipation assembly and a server with the same.
Background
A plurality of electronic components connected to a PCB (Printed Circuit Board, also called Printed Circuit Board, is an important electronic component, is a support body for the electronic components, and is a carrier for electrical connection of the electronic components) generate heat during operation, and in order to remove the heat in time, a heat sink is usually disposed on the PCB for heat dissipation.
In the related art, the fin directions of the heat sink are consistent, and the hot air travels along a fixed route in the air duct of the heat sink, however, this causes a viscous layer to be formed on the portion of the air duct close to the fin surface, thereby affecting the heat dissipation efficiency of the heat sink.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, an object of the present invention is to provide a PCB heat dissipation assembly, which can make hot air form turbulent flow, thereby improving heat dissipation efficiency.
Another object of the present invention is to provide a server having the PCB heat dissipation assembly.
The PCB heat dissipation assembly comprises a PCB and a heat sink, wherein a plurality of chips are arranged on the PCB in an array mode, the heat sink is arranged on at least one side surface of the PCB and comprises a plurality of groups of heat dissipation groups, each group of heat dissipation group comprises a plurality of heat dissipation fins which are parallel to each other, an air channel is defined between every two adjacent heat dissipation fins, the plurality of groups of heat dissipation groups are sequentially arranged along the extending direction of the air channel, an included angle α is formed between the heat dissipation fins in every two adjacent groups of heat dissipation groups, and the requirements that α is not equal to 0 degree and α is not equal to 180 degree are met in α.
According to the PCB heat dissipation assembly provided by the embodiment of the invention, the heat dissipater comprising a plurality of heat dissipation groups is arranged on at least one side surface of the PCB, and the included angle α between the heat dissipation fins in two adjacent heat dissipation groups is enabled to meet the requirements that α is not equal to 0 degrees and α is not equal to 180 degrees, so that hot air can form turbulent flow when passing through an air channel of the heat dissipater, a viscous layer can be effectively prevented from appearing on the heat dissipation fins, the heat dissipation efficiency of the whole PCB heat dissipation assembly is improved, and the service life of a chip can be prolonged.
According to some embodiments of the present invention, the included angle α is formed between the heat dissipation fins in two adjacent heat dissipation groups along the extending direction of the air duct.
According to some embodiments of the present invention, each of the heat dissipation groups includes a plurality of first sub heat dissipation groups, each of the first sub heat dissipation groups includes a first base disposed on the at least one side surface of the PCB and a plurality of heat dissipation fins disposed on the first base, a projection of each of the first sub heat dissipation groups on the PCB is a parallelogram, and a plurality of the first sub heat dissipation groups in two adjacent groups of the heat dissipation groups are symmetrical.
According to some embodiments of the invention, the included angle α is an obtuse angle.
According to some embodiments of the invention, the included angle α satisfies 170 ≦ α < 180.
According to some embodiments of the present invention, the included angle α satisfies 174 ≦ α ≦ 176.
According to some embodiments of the present invention, the included angle α is formed between the heat dissipation fins in two adjacent heat dissipation groups along a direction facing away from the at least one side surface of the PCB board.
According to some embodiments of the present invention, the heat dissipation fins in two adjacent heat dissipation groups are respectively a first heat dissipation fin and a second heat dissipation fin, and a free end of the first heat dissipation fin is located between free ends of two adjacent second heat dissipation fins.
According to some embodiments of the invention, the heat sink of one of the two adjacent heat dissipation groups is perpendicular to the PCB, and the heat sink of the other of the two adjacent heat dissipation groups is obliquely arranged with respect to the PCB; or the heat radiating fins of two adjacent heat radiating groups are obliquely arranged relative to the PCB.
According to some embodiments of the invention, along the extending direction of the air duct, one end of the heat dissipation fin in two adjacent heat dissipation groups, which is connected with the PCB, is flush.
According to some embodiments of the invention, the heat sink comprises a second base and a plurality of sets of the heat dissipating sets disposed on the second base; or each group of the heat dissipation groups comprises a plurality of second sub heat dissipation groups, and each second sub heat dissipation group comprises a third base arranged on the surface of at least one side of the PCB and a plurality of heat dissipation fins arranged on the third base.
According to some embodiments of the invention, the included angle α is an acute angle.
According to some embodiments of the present invention, the included angle α satisfies 0 ° < α ≦ 10 °.
According to some embodiments of the present invention, the included angle α satisfies 2 ≦ α ≦ 5.
According to some embodiments of the present invention, the plurality of heat dissipation groups include a plurality of first heat dissipation groups and a plurality of second heat dissipation groups, and the plurality of first heat dissipation groups and the plurality of second heat dissipation groups are arranged in a staggered manner along the extending direction of the air duct.
A server according to an embodiment of the second aspect of the present invention comprises a PCB heat sink assembly according to the above-described embodiment of the first aspect of the present invention.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a perspective view of a PCB heat sink assembly according to one embodiment of the present invention;
FIG. 2 is a top view of the PCB heat sink assembly shown in FIG. 1;
FIG. 3 is a side view of the PCB heat sink assembly shown in FIG. 1;
fig. 4 is a perspective view of a first heat dissipation sub-assembly of the PCB heat dissipation assembly shown in fig. 1;
fig. 5 is a top view of the first sub heat dissipation group shown in fig. 4;
fig. 6 is a side view of the first subgrouping shown in fig. 4;
fig. 7 is a perspective view of a PCB heat sink assembly according to another embodiment of the present invention;
FIG. 8 is a top view of the PCB heat sink assembly shown in FIG. 7;
fig. 9 is a side view of the PCB heat sink assembly shown in fig. 7;
FIG. 10 is an enlarged view of portion A circled in FIG. 9;
fig. 11 is a perspective view of a PCB heat sink assembly according to yet another embodiment of the present invention;
fig. 12 is a top view of the PCB heat sink assembly shown in fig. 11;
fig. 13 is a side view of the PCB heat sink assembly shown in fig. 11;
fig. 14 is a perspective view of two of the second heat dissipation subgroups of the PCB heat dissipation assembly shown in fig. 11;
fig. 15 is a side view of the second sub heat dissipation group shown in fig. 14;
fig. 16 is a top view of the second sub heat dissipation group shown in fig. 14.
Reference numerals:
100: a PCB heat dissipation assembly;
1: a PCB board; 11: a chip;
2: a heat sink; 21: a heat dissipation group;
211: a first heat dissipation group; 212: a second heat dissipation group;
213: a heat sink; 214: an air duct;
215: a first sub-radiating group; 2151: a first base;
216: a first heat sink; 217: a second heat sink;
218: a second base; 219: a second sub-radiating group; 2191: and a third base.
Detailed Description
Embodiments of the present invention will be described in detail below, the embodiments described with reference to the drawings being illustrative, and the embodiments of the present invention will be described in detail below.
A PCB heat sink assembly 100 according to an embodiment of the first aspect of the present invention is described below with reference to fig. 1-16.
As shown in fig. 1-3 and 7-13, a PCB heat dissipation assembly 100 according to an embodiment of the present invention includes a PCB 1 and a heat sink 2, wherein electronic components on the PCB 1 generate heat during operation, and the heat dissipation device can absorb and dissipate the heat, specifically, a plurality of chips 11 arranged in an array are disposed on the PCB 1, the heat sink 2 is disposed on at least one side surface of the PCB 1, the heat sink 2 includes a plurality of heat dissipation groups 21, each heat dissipation group 21 includes a plurality of heat dissipation fins 213 parallel to each other, an air duct 214 is defined between two adjacent heat dissipation fins 213, the plurality of heat dissipation groups 21 are sequentially disposed along an extending direction of the air duct 214, and an included angle α is formed between the heat dissipation fins 213 in two adjacent heat dissipation groups 21, where α satisfies that α ≠ 0 ° and α ≠ 180 °.
For example, in the example of fig. 1 and 2, a heat sink 2 is disposed on the upper surface of the PCB 1 for dissipating heat generated by the chip 11 on the PCB 1 during operation, the heat sink 2 includes seven heat dissipation groups 21, each heat dissipation group 21 includes a plurality of heat dissipation fins 213, the plurality of heat dissipation fins 213 in each heat dissipation group 21 are parallel to each other, the air duct 214 is defined by two adjacent heat dissipation fins 213 in each group, the seven heat dissipation groups 21 are sequentially disposed in the extending direction of the air duct 214, the air blown from the air duct 214 of the heat sink 2 is hot air, wherein the heat sink 2 may include a plurality of sub-heat sinks 22 or an integral heat sink, the two adjacent heat dissipation fins 213 in the two adjacent heat dissipation groups 21 form an included angle α and α both satisfying α ≠ 0 ° and α ≠ 180 °, that is to say, the heat dissipation fins 213 in the two adjacent heat dissipation groups 21 are not parallel, when the hot air is blown from the air inlet side of the air duct 214 to the air outlet side, the movement path of the hot air is bent, thereby, the heat dissipation efficiency of the heat sink assembly is effectively improved by making the heat dissipation fins 213 not equal to α ≠ 100, and the heat dissipation efficiency of the whole heat sink assembly is improved.
It should be noted that, the present application mainly radiates heat to the chip 11 on the PCB 1, that is, the heat source is the chip 11, and when the heat source is other heat generating components on the PCB 1 or the aluminum substrate, such as a capacitor, a resistor, etc., the arrangement mode of the heat sink 2 using the present invention also belongs to the protection scope of the present application.
Seven heat dissipation groups 21 are shown in fig. 1 and 2 for illustrative purposes, but it is obvious to those skilled in the art after reading the technical solution of the present application that the solution can be applied to other numbers of heat dissipation groups 21, which also falls into the protection scope of the present invention.
According to the PCB heat dissipation assembly 100 disclosed by the embodiment of the invention, the heat radiator 2 comprising the plurality of heat dissipation groups 21 is arranged on at least one side surface of the PCB 1, and the included angle α between the heat dissipation fins 213 in the two adjacent heat dissipation groups 21 meets the requirements that the included angle is α not equal to 0 degrees and α not equal to 180 degrees, so that the hot air can form turbulent flow when passing through the air channel 214 of the heat radiator 2, a viscous layer can be effectively prevented from appearing on the heat dissipation fins 213, the heat dissipation efficiency of the whole PCB heat dissipation assembly 100 is improved, and the service life of the chip 11 can be prolonged.
In some embodiments of the present invention, as shown in fig. 1 and 2, the heat dissipation fins 213 of two adjacent heat dissipation groups 21 form an angle α along the extending direction of the air duct 214, referring to fig. 2, the projection of the heat dissipation fins 213 of two adjacent heat dissipation groups 21 on the PCB board 1 forms an angle α, thereby preventing the occurrence of a sticky layer on the heat dissipation fins 213 and improving the heat dissipation efficiency of the PCB heat dissipation assembly 100.
In some embodiments of the present invention, referring to fig. 1 and 2 in combination with fig. 3, each heat dissipation group 21 includes a plurality of first heat dissipation subgroups 215, each first heat dissipation subgroup 215 includes a first base 2151 disposed on the at least one side surface of the PCB 1 and a plurality of heat dissipation fins 213 disposed on the first base 2151, a projection of each first heat dissipation subgroup 215 on the PCB 1 is a parallelogram, and the plurality of first heat dissipation subgroups 215 in two adjacent heat dissipation groups 21 are symmetrical, for example, in the example of fig. 1 and 2, the heat sink 2 includes seven heat dissipation groups 21 in total, each heat dissipation group 21 includes twelve first heat dissipation subgroups 215, each first heat dissipation subgroup 215 includes a first base 2151 and a plurality of heat dissipation fins 213, wherein the first base 2151 is disposed on the upper surface of the PCB 1, the plurality of heat dissipation fins 213 are disposed on the first base 2151, each first heat dissipation subgroup 215 is a straight parallel, a plane of each first heat dissipation subgroup 215 parallel to the PCB 1 is a parallel plane, the plurality of heat dissipation fins 213 are disposed on the first base 2151, and the two adjacent heat dissipation subgroups 215 are symmetrical to each other, so that the heat dissipation groups of adjacent heat dissipation subgroups 215 form a heat dissipation assembly with a simple heat dissipation channel, and the heat dissipation efficiency is improved by the heat dissipation subassembly 352, and the heat dissipation subassembly is formed by two heat dissipation heat.
Further, referring to fig. 1 and 2, the included angle α is an obtuse angle, so that the space on the PCB 1 is reasonably utilized, the structure of the heat sink 2 on the PCB 1 is more compact, and the heat dissipation efficiency of the whole PCB heat dissipation assembly 100 is further improved.
Optionally, in conjunction with fig. 1 and 2, the included angle α satisfies 170 ° ≦ α ≦ 180 °, the arrangement is compact, and the heat dissipation efficiency of the PCB heat dissipation assembly 100 can be further improved, wherein 174 ° ≦ α ≦ 176 ° is preferred, and the overall heat dissipation effect of the PCB heat dissipation assembly 100 is the best in this angle range.
In some embodiments of the present invention, as shown in fig. 7-13, the heat dissipation fins 213 in two adjacent heat dissipation groups 21 are at an angle α in a direction away from the at least one side surface of the PCB board 1. for example, in the example of fig. 7, the heat dissipation fins 213 in two adjacent heat dissipation groups 21 are at an angle α from bottom to top, so that the hot air can also form turbulent flow when passing through the air channel 214 of the heat sink 2, thereby preventing the occurrence of a sticky layer on the heat dissipation fins 213 and improving the heat dissipation efficiency of the whole PCB heat dissipation assembly 100.
Further, as shown in fig. 7 to 9, the heat dissipation fins 213 in two adjacent sets of heat dissipation groups 21 are a first heat dissipation fin 216 and a second heat dissipation fin 217, respectively, and a free end (e.g., an upper end in fig. 5) of the first heat dissipation fin 216 is located between free ends (e.g., an upper end in fig. 5) of two adjacent second heat dissipation fins 217. For example, in the example of fig. 7-9, the free ends of the first fins 216 and the free ends of the second fins 217 are arranged offset from each other, and the free end of the first fin 216 is between the free ends of two adjacent second fins 217. Therefore, the radiator 2 is simple in structure and low in molding difficulty, turbulent flow can be formed when hot air flows through the air duct 214 of the radiator 2, and the heat dissipation efficiency of the whole PCB heat dissipation assembly 100 is further improved.
In some alternative embodiments of the present invention, the heat sink 213 of one of the two adjacent heat dissipation groups 21 is perpendicular to the PCB 1, and the heat sink 213 of the other of the two adjacent heat dissipation groups 21 is disposed obliquely (not shown) with respect to the PCB 1. Therefore, when hot air is blown from one of the heat dissipation groups 21 to the other heat dissipation group 21, the hot air can generate turbulent flow, so that the heat dissipation efficiency of the heat sink 2 can be improved.
Of course, the present invention is not limited thereto, and in other alternative embodiments of the present invention, as shown in fig. 7-9, the heat sinks 213 of two adjacent sets of heat dissipation groups 21 are all arranged obliquely with respect to the PCB board 1. For example, in the example of fig. 9, the first heat dissipation fins 216 are inclined to the left with respect to the PCB 1, and the second heat dissipation fins 217 are inclined to the right with respect to the PCB 1, so that when hot air flows through the air duct 214 of the heat sink 2, turbulence can be generated, and the heat dissipation efficiency of the heat sink 2 can be improved.
In some embodiments of the present invention, as shown in fig. 9 and 13, along the extending direction of the air duct 214, the ends (e.g., the lower ends in fig. 5) of the heat dissipation fins 213 in the two adjacent heat dissipation groups 21 connected to the PCB board 1 are flush. For example, in the example of fig. 3-5, the lower ends of adjacent first and second fins 216, 217 are flush along the direction of extension of the air chute 214. Therefore, the difficulty in molding the heat sink 2 is reduced, and the production cost of the entire PCB heat dissipation assembly 100 can be reduced.
In some alternative embodiments of the present invention, as shown in fig. 7-9, the heat sink 2 includes a second base 218 and a plurality of sets of heat dissipation groups 21 disposed on the second base 218. Specifically, referring to fig. 7 to 9, the heat sink 2 includes a second base 218 and a plurality of heat dissipation sets 21, wherein the plurality of heat dissipation sets 21 are disposed on the second base 218. Therefore, the radiator 2 has a simple structure and high heat radiation efficiency.
Of course, the present invention is not limited thereto, and in other alternative embodiments of the present invention, referring to fig. 11 to 16, each of the heat radiating groups 21 includes a plurality of second heat radiating subgroups 219, and each of the second heat radiating subgroups 219 includes a third base 2191 provided on the at least one side surface of the PCB board 1 and a plurality of heat radiating fins 213 provided on the third base 2191. For example, in the example of fig. 11-13, each of the heat dissipation groups 21 includes six second heat dissipation subgroups 219, each of the second heat dissipation subgroups 219 including a third base 2191 and a plurality of heat dissipation fins 213, wherein the third base 2191 is provided on the upper surface of the PCB board 1, and the plurality of heat dissipation fins 213 are provided on the third base 2191. Thus, the radiator 2 is also simple in structure and convenient to maintain and replace.
In some embodiments of the present invention, referring to FIGS. 10 and 13, included angle α is an acute angle, and thus, heat sink 213 in heat dissipation pack 21 is compact and facilitates heat dissipation from chip 11.
Optionally, in conjunction with fig. 10 and 13, the included angle α satisfies 0 ° < α ° or less than 10 °, therefore, when 0 ° < α ° or less than 10 °, the structure is reasonable, and the heat dissipation efficiency of the entire PCB heat dissipation assembly 100 can be further improved, preferably, the included angle α satisfies 2 ° < α ° or less than 5 °.
In some embodiments of the present invention, as shown in fig. 1, 2, 7, 8, 11 and 12, the plurality of heat dissipation groups 21 include a plurality of first heat dissipation groups 211 and a plurality of second heat dissipation groups 212, and the plurality of first heat dissipation groups 211 and the plurality of second heat dissipation groups 212 are arranged in a staggered manner along the extending direction of the air duct 214. For example, in the example of fig. 7, the heat sink 2 includes six heat dissipation groups 21, the six heat dissipation groups 21 include three first heat dissipation groups 211 and three second heat dissipation groups 212, the three first heat dissipation groups 211 and the three second heat dissipation groups 212 are arranged in a staggered manner along the extending direction of the air duct 214, and the second heat dissipation group 212 is disposed between two adjacent first heat dissipation groups 211. Thus, the heat sink 2 thus arranged makes the hot air continuously form turbulent flow in the air duct 214, thereby further improving the heat dissipation efficiency of the whole PCB heat dissipation assembly 100.
A server (not shown) according to an embodiment of the second aspect of the present invention includes the PCB heat sink assembly 100 according to the above-described embodiment of the first aspect of the present invention.
According to the server provided by the embodiment of the invention, by adopting the PCB heat dissipation assembly 100, the working efficiency of the chip 11 is improved, and the service life of the chip 11 is prolonged, so that the overall performance of the server is more excellent.
Other constructions and operations of servers according to embodiments of the present invention are known to those of ordinary skill in the art and will not be described in detail herein.
A PCB heat sink assembly 100 according to various embodiments of the present invention is described below with reference to fig. 1-16.
In the first embodiment, the first step is,
in the present embodiment, as shown in fig. 1-3, the PCB heat dissipation assembly 100 includes a substantially rectangular plate-shaped PCB 1 and a heat sink 2, the heat sink 2 is disposed on an upper surface of the PCB 1, the heat sink 2 includes seven heat dissipation groups 21, specifically, four heat dissipation groups 211 and three heat dissipation groups 212, the first heat dissipation groups 211 and the second heat dissipation groups 212 are arranged in a staggered manner along an extending direction of the air duct 214, adjacent first heat dissipation groups 211 and second heat dissipation groups 212 are symmetrical to each other, each heat dissipation group 21 includes twelve first heat dissipation subgroups 215, each first heat dissipation subgroup 215 includes a first base 2151 and a plurality of sub-heat dissipation fins 213, the air duct 214 is defined between adjacent two heat dissipation fins 213, a projection of each first heat dissipation subgroup 215 on the PCB 1 is a parallelogram, and the heat dissipation fins 213 in adjacent two heat dissipation groups 21 form an included angle α and an obtuse angle α along the extending direction of the air duct 214.
Therefore, the PCB heat dissipation assembly 100 is simple in structure, easy to process and convenient to overhaul and replace. Moreover, when hot air flows through the air duct 214 of the heat sink 2, turbulent flow can be formed in the heat sink 2, thereby effectively preventing a viscous layer on the heat sink 213 and improving the heat dissipation efficiency of the whole PCB heat dissipation assembly 100.
In the second embodiment, the first embodiment of the method,
in this embodiment, referring to fig. 7 to 9, the heat sink 2 includes a second base 218 and six heat dissipation groups 21 disposed on the second base 218, each of the six heat dissipation groups 21 includes three first heat dissipation groups 211 and three second heat dissipation groups 212, each of the heat dissipation groups 21 includes a plurality of heat dissipation fins 213, an air duct 214 is defined between two adjacent heat dissipation fins 213, the first heat dissipation groups 211 and the second heat dissipation groups 212 are arranged in a staggered manner along an extending direction of the air duct 214, the heat dissipation fins 213 in two adjacent heat dissipation groups 21 are respectively a first heat dissipation fin 216 and a second heat dissipation fin 217, the first heat dissipation fin 216 is inclined to the left with respect to the PCB 1, the second heat dissipation fin 217 is inclined to the right with respect to the PCB 1, one end of the heat dissipation fins 213 in two adjacent heat dissipation groups 21 connected to the base is flush, and an included angle α and an acute angle α are formed between the first heat dissipation group 211 and the second heat dissipation group.
Therefore, when hot air flows through the air duct 214 of the heat sink 2, turbulent flow can be formed in the heat sink 2, which can effectively prevent the occurrence of a viscous layer on the heat sink 213 and improve the heat dissipation efficiency of the whole PCB heat dissipation assembly 100.
In the third embodiment, the first step is that,
as shown in fig. 11 to 16, the present embodiment has substantially the same structure as the second embodiment, wherein the same reference numerals are used for the same components, except that: each of the heat radiating groups 21 includes a plurality of second sub-heat radiating groups 219, and each of the second sub-heat radiating groups 219 includes a third base 2191 provided on at least one side surface of the PCB board 1 and a plurality of heat radiating fins 213 provided on the third base 2191.
Referring to fig. 11 to 13, each of the heat radiating groups 21 includes six second heat radiating subgroups 219, and each of the second heat radiating subgroups 219 includes a third base 2191 and a plurality of heat radiating fins 213, wherein the third base 2191 is provided on the upper surface of the PCB board 1, and the plurality of heat radiating fins 213 are provided on the third base 2191. Therefore, the maintenance and the replacement of the radiator 2 are facilitated while the heat radiation efficiency of the radiator 2 is ensured.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
In the description of the present invention, "the first feature", "the second feature", and "the third feature" may include one or more of the features.
In the description of the invention, "above", "over" and "above" a first feature in a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (16)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911289312.8A CN111031754A (en) | 2019-12-13 | 2019-12-13 | PCB cooling assembly and server having the same |
Applications Claiming Priority (1)
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023159966A1 (en) * | 2022-02-25 | 2023-08-31 | 中兴通讯股份有限公司 | Heat dissipation module and heat dissipation device |
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| DE2910115A1 (en) * | 1979-03-15 | 1980-09-18 | Siempelkamp Gmbh & Co | Radioactive waste screening container - with herringbone cooling ribs of specified pattern outside cast metal cylinder |
| US20070137849A1 (en) * | 2005-12-15 | 2007-06-21 | Toshiba International Corporation | Heatsink with offset fins |
| CN203115975U (en) * | 2013-03-08 | 2013-08-07 | 河南永兴锅炉集团有限公司 | Cast iron inclined sheet type coal economizer |
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| CN106662321A (en) * | 2014-06-03 | 2017-05-10 | 飞利浦灯具控股公司 | Luminaire heat sink |
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| WO2023159966A1 (en) * | 2022-02-25 | 2023-08-31 | 中兴通讯股份有限公司 | Heat dissipation module and heat dissipation device |
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