CN111009492A - Integrated reflective directional array sensing packaging structure and detection module - Google Patents
Integrated reflective directional array sensing packaging structure and detection module Download PDFInfo
- Publication number
- CN111009492A CN111009492A CN201911337467.4A CN201911337467A CN111009492A CN 111009492 A CN111009492 A CN 111009492A CN 201911337467 A CN201911337467 A CN 201911337467A CN 111009492 A CN111009492 A CN 111009492A
- Authority
- CN
- China
- Prior art keywords
- tube wafer
- wafer
- pin
- tube
- photo
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 34
- 238000001514 detection method Methods 0.000 title claims abstract description 13
- 239000000084 colloidal system Substances 0.000 claims abstract description 18
- 235000012431 wafers Nutrition 0.000 claims description 70
- 239000000758 substrate Substances 0.000 claims description 25
- 230000006698 induction Effects 0.000 claims description 9
- 239000004593 Epoxy Substances 0.000 claims description 3
- 239000008393 encapsulating agent Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
- H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Light Receiving Elements (AREA)
Abstract
The invention is applicable to the technical field of semiconductor packaging, and provides an integrated reflective directional array sensing packaging structure and a detection module. In the packaging structure, the photoelectric receiving tube wafer and the transmitting tube wafer are both fixed on the mounting seat of the PCB support, and the photoelectric receiving tube wafer and the transmitting tube wafer are electrically connected with pins on the PCB support through leads. The packaging colloid packages the photoelectric receiving tube wafer, the transmitting tube wafer and part of the PCB support together, thereby realizing the integrated packaging of the transmitting tube wafer and the photoelectric receiving tube wafer. Therefore, the integrated structure can avoid the interference problem caused by an external PCB connecting circuit and has strong anti-interference capability. Compared with the existing connecting circuit, the packaging structure saves space and materials, and can miniaturize the detection module.
Description
Technical Field
The invention belongs to the technical field of semiconductor packaging, and particularly relates to an integrated reflective directional array sensing packaging structure and a detection module.
Background
At present, the conventional method of the photoelectric direction sensing circuit is to connect a photo-receiving diode component and a transmitting tube component on a circuit board, which is not only not beneficial to saving the space of the circuit board, but also can lead to a longer path of a connecting line between the photo-receiving diode and the transmitting tube, thereby reducing the anti-interference capability of the circuit.
Disclosure of Invention
The invention aims to solve the technical problems that a connection circuit of a photoelectric receiving diode component and a transmitting tube component is not beneficial to saving the space of a circuit board, the path of the connection circuit is long, and the anti-interference capability of the circuit is reduced.
The invention is realized in this way, an integrated reflection type direction array induction packaging structure, which comprises a transmitting tube wafer, at least two photoelectric receiving tube wafers, a PCB bracket and an insulating packaging colloid; the PCB support comprises an insulating substrate and a plurality of mutually separated conductive areas which are positioned on the substrate; the plurality of conductive areas comprise a transmitting tube wafer mounting seat, at least two photoelectric receiving tube wafer mounting seats, a first pin and at least two second pins; the transmitting tube wafer mounting seat is positioned between the at least two photoelectric receiving tube wafer mounting seats; the first pin and the second pin are positioned at the edge of one side of the substrate, a third pin extends from one end of the transmitting tube wafer mounting seat to the edge of the other side of the substrate, and a fourth pin extends from one end of each photoelectric receiving tube wafer mounting seat to the edge of the other side of the substrate; the transmitting tube wafer is fixed on the transmitting tube wafer mounting seat, and the photoelectric receiving tube wafer is fixed on the photoelectric receiving tube wafer mounting seat; the transmitting tube wafer is bound with the first pins through first leads, and the at least two photoelectric receiving tube wafers are respectively bound with the corresponding second pins through second leads; the photoelectric receiving tube wafer and the transmitting tube wafer are both packaged in the packaging colloid; the first pin, the second pin and the third pin are packaged in the packaging colloid at one end of the fourth pin, which is positioned at the inner side of the substrate, and the end of the fourth pin, which is positioned at the outer side of the substrate, is exposed out of the packaging colloid.
Furthermore, the periphery of the emission tube wafer mounting seat is provided with lightproof shielding walls, and a light outlet is reserved right above the emission tube wafer mounting seat.
Further, the emission tube wafer can emit light with the wavelength of 850nm, 880nm or 940 nm.
Further, the light and wavelength range received by the photoelectric receiving tube chip is 400 nm-1100 nm.
Furthermore, two photoelectric receiving tube wafers positioned on two opposite side edges of the transmitting tube wafer form a photoelectric receiving tube wafer group, the integrated reflection type directional array induction packaging structure comprises at least one photoelectric receiving tube wafer group, and the number of the photoelectric receiving tube wafer mounting seats is the same as that of the photoelectric receiving tube wafers.
Further, the photoelectric receiving tube wafer is a photodiode receiving wafer.
Furthermore, the packaging colloid is an epoxy colloid which can transmit infrared rays.
The present invention also provides a detection module for capturing the moving direction of an object, which includes any one of the above integrated reflective directional array sensing package structures.
Compared with the prior art, the invention has the beneficial effects that:
according to the integrated reflection type directional array induction packaging structure, the photoelectric receiving tube wafer and the transmitting tube wafer are fixed on the mounting seat of the PCB support, and the photoelectric receiving tube wafer and the transmitting tube wafer are electrically connected with pins on the PCB support through the wires. The packaging colloid packages the photoelectric receiving tube wafer, the transmitting tube wafer and part of the PCB support together, thereby realizing the integrated packaging of the transmitting tube wafer and the photoelectric receiving tube wafer. Therefore, the integrated structure can avoid the interference problem caused by an external PCB connecting circuit and has strong anti-interference capability. Compared with the existing connecting circuit, the packaging structure saves space and materials, and can miniaturize the detection module.
Drawings
Fig. 1 is a schematic plan structure diagram of an integrated reflective directional array sensing package structure according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of the operation of the package structure shown in FIG. 1;
FIG. 3 is a schematic diagram of a chip layout of a package structure having a transmitting transistor chip and four receiving transistor chips according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a chip layout of a package structure having one emitter transistor chip and six photoreceiving transistor chips according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a chip layout of a package structure having one emitter tube chip and eight photo receiver tube chips according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; the two components can be directly connected or indirectly connected through an intermediate medium, and the two components can be communicated with each other. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1, a preferred embodiment of an integrated reflective directional array sensing package structure according to the present invention is shown, which includes an emitter die 1, at least two photo receiver dies 2, a PCB support and an insulating encapsulant 4.
The PCB support comprises an insulating substrate 3 and a plurality of spaced apart conductive areas on the substrate 3. In practical applications, the conductive area may be a copper sheet layer covering the substrate 3, or may be a sheet-like conductor subsequently bonded or soldered on the substrate 3.
The conductive areas include a emitter tube die pad 51, at least two photo receiver tube die pads 52, a first lead 5a and at least two second leads 5 b.
The emitter tube wafer mount 51 is located at a position between two photoreceiver tube wafer mounts 52. In the present embodiment, the substrate 3 has a rectangular planar structure, and the substrate 3 has two photo-receiver tube chip mounting seats 52 and one emitter tube chip mounting seat 51. The first photo-receiver tube chip mounting seat 52, the emitter tube chip mounting seat 51 and the second photo-receiver tube chip mounting seat 52 are distributed from left to right in sequence.
The first pin 5a and the second pin 5b are located at an edge of one side of the substrate 3, the third pin 5c extends from one end of the emitter tube wafer mounting seat 51 to the edge of the other side of the substrate 3, and the fourth pin 5d extends from one end of each of the photo-receiver tube wafer mounting seats 52 to the edge of the other side of the substrate 3.
The emitter tube chip 1 is fixed on the emitter tube chip mount 51, and the photo receiver tube chip 2 is fixed on the photo receiver tube chip mount 52. The emitter tube chip 1 is bonded to the first lead 5a through a first wire 61, and the at least two photo-receiver tube chips 2 are bonded to the corresponding second lead 5b through a second wire 62.
The photoelectric receiving tube chip 2 and the transmitting tube chip 1 are both packaged in a packaging colloid 4; the first pin 5a, the second pin 5b, and the third pin 5c are packaged in the package colloid 4 at one end of the fourth pin 5d located inside the substrate 3, the package colloid 4 is exposed at one end located outside the substrate 3, and the exposed part of the pins are used as ports for electrically connecting the entire package structure with an external circuit, wherein the first pin 5a and the third pin 5c are used as transmitting ports of the package structure, the second pin 5b is used as an output port of the package structure, and the fourth pin 5d is used as a receiving port of the package structure.
Specifically, the light and wavelength range received by the photoelectric receiving tube chip 2 is 400nm to 1100 nm. The emitter tube wafer 1 is capable of emitting light at a wavelength of 850nm, 880nm or 940 nm.
Furthermore, the light-tight shielding walls 7 are arranged around the emitter tube wafer mounting seat 51, a light outlet is reserved right above the emitter tube wafer mounting seat 51, and the light rays around the emitter tube wafer 1 can be shielded by the shielding walls 7, so that the light rays of the emitter tube wafer 1 are emitted only in a scattered manner right above the emitter tube wafer.
Referring to fig. 2, the working principle of the package structure of the present embodiment is: the light emitted by the transmitting tube wafer 1 is reflected back by the object moving above, the reflected light is received by the peripheral photoelectric receiving tube wafer 2, the output signals are fed back, and the moving direction of the object can be calculated according to the sequence of the output signals of different output ports.
Two photoelectric receiving tube chips 2 located at two opposite sides of the transmitting tube chip 1 form a photoelectric receiving tube chip set. The integrated reflective directional array sensing package structure includes at least one photo receiving transistor die set, and the number of the photo receiving transistor die mounting seats 51 is the same as the number of the photo receiving transistor dies 2. Referring to fig. 3, in order to realize the detection in two directions, one photo receiving device chip 2 (i.e. two photo receiving device chip sets) may be disposed in each of the front, back, left and right directions of the transmitting device chip 1. It is understood that, referring to fig. 4 and 5, by arranging different numbers of the photo receiver die sets at different orientations around the periphery of the emitter die, signals of different motion directions can be captured.
Preferably, the photo-receiving transistor chip 2 is a photodiode receiving chip, which has a fast response speed and a delay within 100ns, and can capture a signal in a motion direction when a gesture is stroked. The packaging colloid 4 is an epoxy colloid which can transmit infrared rays.
The embodiment also provides a detection module, which can be used for capturing the moving direction of an object and comprises the integrated reflective directional array sensing packaging structure. When the packaging structure is internally provided with a plurality of photoelectric receiving tube chip sets in different directions, the detection module can detect a plurality of directions.
In summary, in the integrated reflective directional array sensing package structure of the present embodiment, the photo receiving device chip 2 and the transmitting device chip 1 are both fixed on the mounting seat of the PCB support, and the photo receiving device chip 2 and the transmitting device chip 1 are electrically connected to the pins on the PCB support through the wires. The packaging colloid 4 packages the photoelectric receiving tube wafer 2, the transmitting tube wafer 1 and part of the PCB support together, thereby realizing the integrated packaging of the transmitting tube wafer 1 and the photoelectric receiving tube wafer 2.
It is thus clear that the interference problem that outside PCB interconnecting link brought can be avoided to the integrated structure of this embodiment, and the interference killing feature is strong. In addition, compared with the existing connection circuit, the packaging structure of the embodiment saves space, saves materials and can miniaturize the detection module.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (8)
1. An integrated reflection type directional array induction packaging structure is characterized by comprising a transmitting tube wafer, at least two photoelectric receiving tube wafers, a PCB (printed circuit board) bracket and an insulating packaging colloid; the PCB support comprises an insulating substrate and a plurality of mutually separated conductive areas which are positioned on the substrate; the plurality of conductive areas comprise a transmitting tube wafer mounting seat, at least two photoelectric receiving tube wafer mounting seats, a first pin and at least two second pins; the transmitting tube wafer mounting seat is positioned between the at least two photoelectric receiving tube wafer mounting seats; the first pin and the second pin are positioned at the edge of one side of the substrate, a third pin extends from one end of the transmitting tube wafer mounting seat to the edge of the other side of the substrate, and a fourth pin extends from one end of each photoelectric receiving tube wafer mounting seat to the edge of the other side of the substrate; the transmitting tube wafer is fixed on the transmitting tube wafer mounting seat, and the photoelectric receiving tube wafer is fixed on the photoelectric receiving tube wafer mounting seat; the transmitting tube wafer is bound with the first pins through first leads, and the at least two photoelectric receiving tube wafers are respectively bound with the corresponding second pins through second leads; the photoelectric receiving tube wafer and the transmitting tube wafer are both packaged in the packaging colloid; the first pin, the second pin and the third pin are packaged in the packaging colloid at one end of the fourth pin, which is positioned at the inner side of the substrate, and the end of the fourth pin, which is positioned at the outer side of the substrate, is exposed out of the packaging colloid.
2. The integrated reflective type direction array sensing package structure of claim 1, wherein a light-tight shielding wall is disposed around the emitter tube die pad, and a light outlet is disposed right above the emitter tube die pad.
3. The integrated reflective directional array induction package structure of claim 1 or 2, wherein said emitter tube die is capable of emitting light at a wavelength of 850nm, 880nm, or 940 nm.
4. The integrated reflective directional array induction package structure of claim 1, wherein the light and wavelength range received by said photo receiver tube wafer is 400 nm-1100 nm.
5. The integrated reflection type directional array induction package structure as claimed in claim 1, wherein two said photo-receiving device dies located on two opposite sides of said transmitting device die form a photo-receiving device die set, said integrated reflection type directional array induction package structure comprises at least one said photo-receiving device die set, and the number of said photo-receiving device die mounting seats is the same as the number of said photo-receiving device dies.
6. The integrated reflection type direction array induction packaging structure of any one of claims 1, 4 or 5, wherein the photo receiving tube wafer is a photo diode receiving wafer.
7. The integrated reflective directional array sensor package of claim 1, wherein the encapsulant is an infrared light transmissive epoxy.
8. A detection module for capturing a moving direction of an object, wherein the detection module comprises the integrated reflective directional array sensing package structure as claimed in any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911337467.4A CN111009492A (en) | 2019-12-23 | 2019-12-23 | Integrated reflective directional array sensing packaging structure and detection module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911337467.4A CN111009492A (en) | 2019-12-23 | 2019-12-23 | Integrated reflective directional array sensing packaging structure and detection module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111009492A true CN111009492A (en) | 2020-04-14 |
Family
ID=70117127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911337467.4A Pending CN111009492A (en) | 2019-12-23 | 2019-12-23 | Integrated reflective directional array sensing packaging structure and detection module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111009492A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111710753A (en) * | 2020-06-19 | 2020-09-25 | 深圳成光兴光电技术股份有限公司 | A multi-spectral emission and reception integrated sensor and detection circuit |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103383457A (en) * | 2012-05-04 | 2013-11-06 | 台湾典范半导体股份有限公司 | Proximity sensor and method for fabricating the same |
| KR20150080273A (en) * | 2013-12-31 | 2015-07-09 | 주식회사 루멘스 | Display apparatus and display command input apparatus |
| CN204542140U (en) * | 2015-01-17 | 2015-08-12 | 黄雅凡 | A kind of micro photo electric blood oxygen heart rate and measuring blood flow rate system |
| US20160091364A1 (en) * | 2014-09-30 | 2016-03-31 | Lingsen Precision Industries, Ltd. | Optical sensing module and method of manufacturing the same |
| TW201717420A (en) * | 2015-11-11 | 2017-05-16 | 兆龍國際股份有限公司 | Optocoupler |
| US20180190856A1 (en) * | 2016-12-30 | 2018-07-05 | Lingsen Precision Industries, Ltd. | Package structure of long-distance sensor and packaging method of the same |
| CN211350616U (en) * | 2019-12-23 | 2020-08-25 | 深圳成光兴光电技术股份有限公司 | Integrated reflective directional array sensing packaging structure and detection module |
-
2019
- 2019-12-23 CN CN201911337467.4A patent/CN111009492A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103383457A (en) * | 2012-05-04 | 2013-11-06 | 台湾典范半导体股份有限公司 | Proximity sensor and method for fabricating the same |
| KR20150080273A (en) * | 2013-12-31 | 2015-07-09 | 주식회사 루멘스 | Display apparatus and display command input apparatus |
| US20160091364A1 (en) * | 2014-09-30 | 2016-03-31 | Lingsen Precision Industries, Ltd. | Optical sensing module and method of manufacturing the same |
| CN204542140U (en) * | 2015-01-17 | 2015-08-12 | 黄雅凡 | A kind of micro photo electric blood oxygen heart rate and measuring blood flow rate system |
| TW201717420A (en) * | 2015-11-11 | 2017-05-16 | 兆龍國際股份有限公司 | Optocoupler |
| US20180190856A1 (en) * | 2016-12-30 | 2018-07-05 | Lingsen Precision Industries, Ltd. | Package structure of long-distance sensor and packaging method of the same |
| CN211350616U (en) * | 2019-12-23 | 2020-08-25 | 深圳成光兴光电技术股份有限公司 | Integrated reflective directional array sensing packaging structure and detection module |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111710753A (en) * | 2020-06-19 | 2020-09-25 | 深圳成光兴光电技术股份有限公司 | A multi-spectral emission and reception integrated sensor and detection circuit |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW400632B (en) | Optoelectronic interconnection of integrated circuits | |
| US20210281040A1 (en) | Laser diode packaging module, distance detection device, and electronic device | |
| US9018074B2 (en) | Photonic semiconductor devices in LLC assembly with controlled molding boundary and method for forming same | |
| US20080219673A1 (en) | Optical Transceiver with Reduced Height | |
| JP6626974B2 (en) | Optical sensor package, optical sensor device, and electronic module | |
| KR102135474B1 (en) | Semiconductor package with optical transceiver | |
| CN108711566B (en) | Optical sensing system, optical sensing component and manufacturing method thereof | |
| US6613597B2 (en) | Optical chip packaging via through hole | |
| EP2824778A1 (en) | Photonic semiconductor devices in LLC assembly with controlled molding boundary and method for forming same | |
| KR20150084926A (en) | Through silicon optical interconnects | |
| CN211350616U (en) | Integrated reflective directional array sensing packaging structure and detection module | |
| CN111009492A (en) | Integrated reflective directional array sensing packaging structure and detection module | |
| CN103713331A (en) | Proximity sensor and circuit layout method thereof | |
| JP4172558B2 (en) | Infrared communication device | |
| US20230333335A1 (en) | Optical module package structure | |
| CN211556412U (en) | Laser seed source system and laser radar | |
| CA2308000C (en) | Infrared transceiver assembly for asymmetric data transmission | |
| US6445008B1 (en) | Photo sensing device and the manufacturing method thereof | |
| CN208240679U (en) | Optical sensing module and optical sensing system | |
| CN216648300U (en) | Integrated photoelectric detection sensor and electronic equipment | |
| CN114744481A (en) | A chip package, a photosensitive module, a laser emission module and a laser radar | |
| CN211605155U (en) | Rainfall detection control device and rainfall detection equipment | |
| CN114556452B (en) | Chip packaging structure and electronic equipment | |
| CN111463195A (en) | Photoelectric sensor packaging structure, packaging method and lidar including the same | |
| CN222071935U (en) | Optical sensors and electronic devices |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |