CN110993767A

CN110993767A - LED holder and LED assembly having the same

Info

Publication number: CN110993767A
Application number: CN201911164991.6A
Authority: CN
Inventors: 陶燕兵; 刘跃斌; 盛刚
Original assignee: Changzhou Amicc Optoelectronics Technology Co ltd
Current assignee: Changzhou Amicc Optoelectronics Technology Co ltd
Priority date: 2019-08-22
Filing date: 2019-11-25
Publication date: 2020-04-10
Also published as: CN210429879U

Abstract

The invention provides an LED bracket and an LED assembly having the same. The LED bracket includes: a first substrate, the first substrate is formed as a metal plate whose upper surface can be electrically connected to the positive electrode of the LED; a second substrate, the second substrate is adjacent to the first substrate The substrate is provided, the second substrate is formed as a metal plate whose upper surface can be electrically connected to the negative electrode of the LED, and at least one of the first substrate and/or the second substrate is provided with a mounting portion capable of mounting at least a part of the LED; A reflective plate is provided between the first substrate and the second substrate to insulate the first substrate from the second substrate; at least a part of one end of the reflective plate is connected to the first substrate, and at least the other part is connected to the second substrate to connect with the second substrate. The first substrate and the second substrate cooperate to define a chamber with one end open; the protective layer covers at least one side wall of the reflector facing the chamber to protect the reflector. The LED bracket according to the embodiment of the present invention not only has a simple structure, but also has high thermal conductivity and long service life.

Description

LED support and LED subassembly that has it

Technical Field

The invention relates to the technical field of LEDs, in particular to an LED bracket and an LED assembly with the same.

Background

At present, the LED package of UV wave band, especially the wavelength below 320nm, has strong destructiveness to all organic materials, so the chip below 320nm can only be packaged by inorganic materials, for example, the package is made by using materials such as ceramics, metal, quartz, etc., the cost is very expensive because the processing difficulty of the materials is high, and the materials are not formed by injection molding, so the optical design is difficult to be added, the treatment of various inclined reflection surfaces is difficult, and the luminous efficiency is poor. The product on the market at present relies on naked brilliant the luminescence completely, and the sidelight of the naked light source of wafer accounts for more than 30%, and the design that does not have the reflection inclined plane makes this part of energy can't be brought into play effectively, and the luminous angle of convergence relies on convex lens completely, because the inner space restriction, the convex surface is upwards for the light source volume increases, is difficult for assembling.

Disclosure of Invention

In view of this, the present invention provides an LED support, which has a simple structure and is easy to assemble and can be used for UV-band LED packaging.

The invention also provides an LED component.

An LED fixture according to an embodiment of the first aspect of the invention can be used for mounting LEDs in the UV band, the LED fixture comprising: a first substrate formed as a metal plate having an upper surface capable of being electrically connected to a positive electrode of an LED; a second substrate disposed adjacent to the first substrate, the second substrate being formed as a metal plate having an upper surface capable of being electrically connected to a negative electrode of the LED, at least one of the first substrate and/or the second substrate being provided with a mounting portion capable of mounting at least a part of the LED; a barrier disposed between the first substrate and the second substrate to insulate the first substrate from the second substrate; a reflection plate formed as an annular member having both ends open, at least one portion of one end of the reflection plate being connected to the first base plate and at least another portion thereof being connected to the second base plate to define a chamber having one end open in cooperation with the first and second base plates; and the protective layer at least coats one side wall surface of the reflecting plate facing the cavity so as to protect the reflecting plate.

According to the LED support provided by the embodiment of the invention, the metal plates are used as the first substrate and the second substrate, and the protective layer is arranged on the inner wall surface of the reflecting plate, so that the LED support is simple in structure, convenient to install, high in heat conduction efficiency, long in service life and capable of being used for LED packaging of UV wave bands.

The LED support according to embodiments of the invention may also have the following additional technical features.

According to an embodiment of the present invention, the first substrate and the second substrate are respectively formed as copper plates, and the reflective plate is formed as a plastic plate.

According to one embodiment of the invention, the protective layer is formed as an evaporated silver layer.

According to an embodiment of the present invention, the upper surface of the second substrate is provided with the mounting part formed as a groove depressed downward along the upper surface of the second substrate.

According to one embodiment of the invention, the depth of the groove is 0.05mm to 0.2 mm.

According to one embodiment of the present invention, the LEDs are electrically connected to the first substrate and the second substrate, respectively, through wires.

According to one embodiment of the present invention, the thickness of the reflection plate is gradually decreased from one end to the other end.

According to an embodiment of the present invention, an outer wall surface of the reflection plate is formed as a plane perpendicular to an upper surface of the first substrate or the second substrate, and an inner wall surface of the reflection plate is formed as a slope extending obliquely outward from one end to the other end.

The LED component according to the second aspect of the embodiment of the invention comprises the LED bracket of the embodiment; the LED is arranged in the cavity; the quartz lens is arranged at the other end of the reflecting plate and seals the chamber, and a protrusion part protruding downwards is arranged on one side of the quartz lens facing the chamber.

According to one embodiment of the present invention, a portion of the quartz lens connected to the reflection plate is coated with a tin layer, and the quartz lens is connected to the reflection plate by a tin paste.

Drawings

FIG. 1 is a schematic diagram of an LED support according to an embodiment of the present invention;

FIG. 2 is a schematic view of another structure of an LED support according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of an LED assembly according to an embodiment of the invention.

Reference numerals:

an LED assembly 1000;

an LED support 100; a first substrate 10; a second substrate 20; a barrier 30; a reflection plate 40; a protective layer 50; a mounting portion 60; a metal wire 70;

a quartz lens 200;

LED300。

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention. Furthermore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The LED support 100 according to an embodiment of the present invention will be described first in detail with reference to the accompanying drawings.

As shown in fig. 1 and 2, an LED support 100 according to an embodiment of the present invention can be used to mount an LED300 in a UV band, and the LED support 100 includes a first substrate 10, a second substrate 20, a barrier 30, a reflective plate 40, and a protective layer 50.

Specifically, the first substrate 10 is formed as a metal plate whose upper surface can be electrically connected to the anode of the LED300, the second substrate 20 is disposed adjacent to the first substrate 10, the second substrate 20 is formed as a metal plate whose upper surface can be electrically connected to the cathode of the LED300, at least one of the first substrate 10 and/or the second substrate 20 is provided with a mounting portion 60 on which at least a portion of the LED300 can be mounted, the barrier 30 is disposed between the first substrate 10 and the second substrate 20 to insulate the first substrate 10 from the second substrate 20, the reflective plate 40 is formed as a ring member whose both ends are opened, at least a portion of one end of the reflective plate 40 is connected to the first substrate 10, and at least another portion is connected to the second substrate 20 to define a chamber with one end open by cooperating with the first substrate 10 and the second substrate 20, and the protective layer 50 covers at least one side wall surface of the reflective plate 40 facing the chamber to protect the reflective plate 40.

In other words, the LED support 100 mainly comprises the first substrate 10, the second substrate 20, the barrier 30, the reflective plate 40 and the protective layer 50, wherein the first substrate 10 and the second substrate 20 are respectively formed as metal plates, the metal plates can be used for heat conduction, the heat conduction efficiency is higher than that of a conventional ceramic material, and the service life is longer than that of the ceramic material. The barrier 30 separates the first substrate 10 from the second substrate 20, the mounting portion 60 may be disposed on the first substrate 10, the second substrate 20, or the first substrate 10 and the second substrate 20, the LED300 is mounted on the mounting portion 60, and the anode and the cathode of the LED are connected to the first substrate 10 and the second substrate 20, respectively, the reflective plate 40 surrounds a ring shape, one end of the reflective plate 40 is connected to the first substrate 10 and the second substrate 20, respectively, to define a cavity, and the other end of the reflective plate is open. The protective layer 50 is provided on the inner wall surface of the reflective plate 40, and the protective layer 50 can protect the reflective plate 40 from being damaged by UV light.

Therefore, according to the LED support 100 of the embodiment of the present invention, the metal plates are used as the first substrate 10 and the second substrate 20, and the protective layer 50 is disposed on the inner wall surface of the reflective plate 40, so that the LED support 100 has the advantages of simple structure, easy installation, high heat conduction efficiency, long service life, and capability of being used for LED packaging in the UV band.

According to some embodiments of the present invention, the first substrate 10 and the second substrate 20 are respectively formed as copper plates, and the reflective plate 40 is formed as a plastic plate.

Specifically, the first substrate 10 and the second substrate 20 are copper plates, which have good heat conduction effect, high strength, and long service life. The reflecting plate 40 is a plastic plate which is easy to be formed and can be processed into various reflecting inclined planes, and the light emitting efficiency is high.

According to an embodiment of the present invention, the protection layer 50 is formed as an evaporated silver layer, which can protect the reflection plate 40 from being damaged by UV light and has a good protection effect.

Preferably, the upper surface of the second substrate 20 is provided with a mounting part 60, and the mounting part 60 is formed as a groove depressed downward along the upper surface of the second substrate 20.

Specifically, the second substrate 20 is disposed at the bottom of the bracket, and is formed by extrusion molding through a mold, and a subsidence area, i.e., a groove, is formed on the upper surface of the second substrate 20, and the groove can protect plastic at the insulating edge of the anode and the cathode at the bottom of the LED bracket 100 from being irradiated by UV light.

Further, the depth of the groove is 0.05 mm-0.2 mm.

According to still another embodiment of the present invention, the LED300 is electrically connected to the first substrate 10 and the second substrate 20 through a wire, respectively. In other words, the LED300 is fixed in the groove and connected to the positive and negative electrodes of the first and

second substrates

10 and 20 through the metal wire 70.

In one embodiment of the present invention, the thickness of the reflection plate 40 is gradually decreased from one end to the other end.

Preferably, an outer wall surface of the reflection plate 40 is formed as a plane perpendicular to the upper surface of the first substrate 10 or the second substrate 20, and an inner wall surface of the reflection plate 40 is formed as an inclined surface extending obliquely outward from one end to the other end.

Specifically, the reflective plate 40 is formed as a ring-shaped member surrounding the first substrate 10 and the second substrate 20, and the reflective plate 40 has a thickness gradually decreasing from the lower end to the upper end, so that the reflective plate 40 has a simple structure and is easy to machine and mold.

As shown in fig. 3, an LED assembly 1000 according to an embodiment of the second aspect of the present invention includes the LED holder 100, the LED300, and the quartz lens 200 according to the above-described embodiments.

Specifically, the LED300 is provided in the chamber, the quartz lens 200 is provided at the other end of the reflection plate 40 and closes the chamber, and a side of the quartz lens 200 facing the chamber is provided with a protrusion protruding downward.

In other words, the LED assembly 1000 mainly comprises an LED support 100, an LED300 and a quartz lens 200, wherein the LED300 is disposed in a cavity of the LED support 100, and is fixed on the second substrate 20 and electrically connected to the first substrate 10 and the second substrate 20, the quartz lens 200 covers the cavity to seal the cavity, the quartz lens 200 is inverted inside the LED300, and the volume of the LED assembly 1000 is smaller than that of a conventional ceramic support.

Further, the portion of the quartz lens 200 connected to the reflection plate 40 is coated with a tin layer to perform a protection function, and the quartz lens 200 is connected to the reflection plate 40 through a tin paste and cured at a high temperature, so that the strength is high and the structure is stable.

In summary, according to the LED holder 100 of the embodiment of the present invention, the metal plates are used as the first substrate 10 and the second substrate 20, and the protective layer 50 is disposed on the inner wall surface of the reflective plate 40, so that the LED holder 100 has a simple structure, is easy to mount, has high heat conduction efficiency and a long service life, and can be used for LED packaging in the UV band.

The LED assembly 1000 according to the embodiment of the present invention includes the LED support 100 according to the above-mentioned embodiment, and since the LED support 100 according to the above-mentioned embodiment of the present invention has the above-mentioned technical effects, the LED assembly 1000 according to the embodiment of the present invention also has the corresponding technical effects, i.e., the structure is simple, the installation is convenient, the heat conduction efficiency is high, the service life is long, and the LED assembly can be used for LED packaging in the UV band.

While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. An LED bracket, which can be used to install an LED in a UV band, wherein the LED bracket comprises:

a first substrate, the first substrate is formed as a metal plate whose upper surface can be electrically connected to the positive electrode of the LED;

A second substrate, the second substrate is disposed adjacent to the first substrate, the second substrate is formed as a metal plate whose upper surface can be electrically connected to the negative electrode of the LED, the first substrate and/or the first substrate At least one of the two substrates is provided with a mounting portion capable of mounting at least a part of the LED;

a barrier, the barrier is provided between the first substrate and the second substrate to insulate the first substrate and the second substrate;

A reflector, the reflector is formed as a ring with both ends open, at least a part of one end of the reflector is connected to the first substrate, and at least another part is connected to the second substrate to connect with the first substrate The base plate and the second base plate cooperate to define a cavity with one end open;

A protective layer, the protective layer covers at least one side wall of the reflector facing the chamber to protect the reflector.

2 . The LED bracket of claim 1 , wherein the first substrate and the second substrate are formed as copper plates, respectively, and the reflector is formed as a plastic plate. 3 .

3 . The LED bracket of claim 1 , wherein the protective layer is formed as an evaporated silver layer. 4 .

4 . The LED bracket according to claim 1 , wherein the mounting portion is provided on the upper surface of the second substrate, and the mounting portion is formed to be recessed downward along the upper surface of the second substrate. 5 . groove.

5 . The LED bracket according to claim 4 , wherein the depth of the groove is 0.05mm˜0.2mm. 6 .

6 . The LED bracket according to claim 4 , wherein the LED is electrically connected to the first substrate and the second substrate respectively through wires. 7 .

7 . The LED bracket according to claim 1 , wherein the thickness of the reflecting plate gradually decreases from one end to the other end. 8 .

8 . The LED bracket according to claim 7 , wherein the outer wall surface of the reflection plate is formed as a plane perpendicular to the upper surface of the first substrate or the second substrate, and the inner surface of the reflection plate is formed as a plane perpendicular to the upper surface of the first substrate or the second substrate. 9 . The wall surface is formed as an inclined surface extending obliquely outward from one end to the other end.

9. An LED assembly, characterized in that, comprising:

The LED bracket according to any one of claims 1-8;

LED, the LED is arranged in the chamber;

A quartz lens is provided at the other end of the reflecting plate and closes the chamber, and a side of the quartz lens facing the chamber is provided with a downwardly protruding convex portion.

10 . The LED assembly according to claim 9 , wherein a portion of the quartz lens connected to the reflection plate is coated with a tin layer, and the quartz lens is connected to the reflection plate by solder paste. 11 .