[go: up one dir, main page]

CN110977174B - A pulsed laser high-speed and same-point interval multiple processing system and processing method - Google Patents

A pulsed laser high-speed and same-point interval multiple processing system and processing method Download PDF

Info

Publication number
CN110977174B
CN110977174B CN201911119407.5A CN201911119407A CN110977174B CN 110977174 B CN110977174 B CN 110977174B CN 201911119407 A CN201911119407 A CN 201911119407A CN 110977174 B CN110977174 B CN 110977174B
Authority
CN
China
Prior art keywords
laser
processing
pulse
processed
deflection module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201911119407.5A
Other languages
Chinese (zh)
Other versions
CN110977174A (en
Inventor
陈天阳
符永宏
纪敬虎
杨锡平
张航成
汤发全
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu University
Original Assignee
Jiangsu University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu University filed Critical Jiangsu University
Priority to CN201911119407.5A priority Critical patent/CN110977174B/en
Publication of CN110977174A publication Critical patent/CN110977174A/en
Application granted granted Critical
Publication of CN110977174B publication Critical patent/CN110977174B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B23K26/048—Automatically focusing the laser beam by controlling the distance between laser head and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

本发明提供了一种脉冲激光高速同点间隔多次加工系统及加工方法，包括激光光源、偏转模块、聚焦模块和控制系统；所述脉冲激光经过偏转模块和聚焦模块后射入加工面；所述偏转模块用于将脉冲激光偏转射入聚焦模块；所述控制系统输出加工形貌所需要的脉冲激光参数、形貌加工过程中焦点偏移量对应的偏转模块控制信号的集合和系统输出频率；所述控制系统根据形貌加工过程中焦点偏移量对应的偏转模块控制信号的集合和系统输出频率控制所述偏转模块。本发明通过同点间隔多次的加工方法，不仅有效规避了负面热效应累积，还能精确控制加工形貌，实现直线凹槽的高精度加工，兼顾加工效率和加工质量。

Figure 201911119407

The invention provides a pulsed laser high-speed, same-point, multiple-time processing system and a processing method, including a laser light source, a deflection module, a focusing module and a control system; the pulsed laser enters the processing surface after passing through the deflection module and the focusing module; the The deflection module is used for deflecting the pulsed laser into the focusing module; the control system outputs the pulsed laser parameters required for processing the topography, the set of deflection module control signals corresponding to the focus offset during the topography processing, and the system output frequency; The control system controls the deflection module according to the set of deflection module control signals corresponding to the focus offset during the topography processing and the output frequency of the system. The present invention not only effectively avoids the accumulation of negative thermal effects, but also accurately controls the machining profile, realizes high-precision machining of straight grooves, and takes both machining efficiency and machining quality into consideration.

Figure 201911119407

Description

Pulse laser high-speed same-point interval multiple processing system and processing method
Technical Field
The invention relates to the technical field of laser processing, in particular to a pulse laser high-speed same-point interval multi-processing system and a pulse laser high-speed same-point interval multi-processing method.
Background
In recent years, the application of short/ultrashort laser pulses in the fields of scientific research, medical treatment, industrial processing and the like is continuously increased, the short/ultrashort pulse laser has extremely short action time and hardly generates a heat effect in the interaction process with substances, and the laser processing is carried out by using a single pulse in a laboratory by adopting a special process, so that the processed material almost has no microcrack and no recast layer, but the laser processing efficiency is difficult to improve due to the scanning speed of a scanning system.
For example, the fundamental frequency of the laser is generally in the MHz level, but the highest scanning speed of the galvanometer can only reach the order of m/s, the output frequency of the pulse laser can only reach KHz, only a small number of pulses can be selected from the pulses generated by the laser to be output for laser processing, and a large number of laser pulses are wasted. In order to improve the short/ultra-short pulse laser processing efficiency, the industry tends to adopt the following schemes.
Scheme 1, under the existing scanning speed, the pulse laser energy is improved. Although the high energy density laser pulse can accelerate the material removal process, the pulse laser with excessive energy can cause the peripheral energy of the Gaussian spot to be excessive, so that the surface quality of the groove is poor, and the optimal pulse energy corresponds to the removal of the material with larger depth and optimal quality. Therefore, the efficiency improving method of the scheme 1 has small optimization space and poor applicability.
In the case of the conventional scanning speed, the output frequency (high repetition rate) of the pulsed laser is increased in the case of the scheme 2. In the linear groove processing, the effect of continuous processing of the pulse laser at the same point in batch is realized by continuously acting the pulse laser on the surface of a material, and the subsequent pulse acts on a heat radiation area of the previous pulse, so that a large amount of heat accumulation at the point is caused, and defects such as cracks, recast layers and the like are generated, thereby influencing the processing quality; meanwhile, due to the plasma shielding generated by the previous pulse processing, the subsequent pulse cannot directly act on the surface of the material, so that the efficiency of removing the material by the laser is reduced. Therefore, the efficiency-improving method of scheme 2 has more obvious defects and is only suitable for low-quality laser processing application occasions.
The above analysis shows that, at the existing scanning speed, the difficulty of considering both quality and efficiency is high, and the existing technical scheme has large limitation and can not meet industrial requirements.
The Chinese patent discloses a dynamic focusing laser processing method and a system for large complex curved surfaces, which firstly adopts a 'slicing-blocking-layering' mode to sequentially decompose complex curved surface slices and further realizes the dynamic focusing laser processing of the large complex curved surfaces according to a 'layering-blocking-slicing' forming sequence. In the above technical scheme, each basic unit is actually formed by combining a large number of linear grooves, so that the linear grooves are the key basic units for three-dimensional laser processing, but negative heat effect accumulation often occurs in linear groove processing, and the precision of the linear grooves cannot be controlled.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides a pulse laser high-speed same-point interval multiple processing system and a processing method, which utilize incident laser pulses output by MHz frequency to realize the full utilization of the pulses generated by a short/ultra-short pulse laser; meanwhile, the deflection module can be used for realizing the deflection of pulse laser at the MHz level, the scanning speed of hundreds of meters per second is realized by the laser focus on a focal plane, the scanning range reaches the mm level, and the effect of considering both the processing quality and the efficiency is achieved; in addition, by the processing method of the same point at intervals for multiple times, not only is negative heat effect accumulation effectively avoided, but also the processing morphology can be accurately controlled, and the high-precision processing of the linear groove is realized.
The present invention achieves the above-described object by the following technical means.
A pulse laser high-speed same-point interval multi-processing system comprises a laser light source, a deflection module, a focusing module and a control system;
the laser light source is used for generating pulse laser, and the pulse laser passes through the deflection module and the focusing module and then is injected into a processing surface; the deflection module is used for deflecting and emitting the pulse laser into the focusing module; according to the parameters of the pulse Laser, the parameters of the feature to be processed, the characteristic parameters of the deflection module and the characteristic parameters of the focusing module, the control system outputs the pulse Laser parameters Laser required by processing the featureGrooveA set of deflection module control signals corresponding to the focus offset in the morphology processing process and a system output frequency fm;
the control system is used for controlling the Laser according to the pulse Laser parameters required by the shape to be processedGrooveAnd the system output frequency fm controls the laser light source to output pulse laser required by processing morphology; and the control system controls the deflection module according to the set of deflection module control signals corresponding to the focus offset in the morphology processing process and the system output frequency fm.
Further, the control system comprises a laser parameter calculation unit, a tail end laser scanning capability calculation unit, a scanning parameter calculation unit, a system frequency calculation unit and a processing control unit;
the Laser parameter calculating unit obtains a pulse Laser parameter Laser required by processing morphology according to the parameters of the pulse Laser and the parameters of the morphology to be processedGrooveAnd number of pulses NPulseAnd the pulse Laser parameter needed by the processing shape is usederooveAnd number of pulses NPulseInputting a processing control unit;
the tail end laser scanning capability calculation unit obtains a tail end laser focus offset parameter according to the deflection module characteristic parameter and the focusing module characteristic parameter;
the scanning parameter calculating unit obtains a segmentation parameter of the morphology to be processed, a laser scanning parameter and a set of deflection module control signals corresponding to the focus offset in the morphology processing process according to the tail end laser focus offset parameter and the morphology parameter to be processed, and inputs the segmentation parameter of the morphology to be processed, the laser scanning parameter and the set of deflection module control signals corresponding to the focus offset in the morphology processing process into the processing control unit;
the system frequency calculation unit obtains a system output frequency fm according to the pulse laser output frequency and the deflection module frequency, and inputs the system output frequency fm into the processing control unit;
and the processing control unit controls the laser light source and the deflection module and is used for realizing the processing of the feature to be processed at the same point and multiple times at intervals.
Further, the pulse laser is a single pulse laser or a pulse train laser, and specifically includes:
the single pulse laser parameters are as follows:
Figure BDA0002275013950000031
the laser parameters of the pulse train are as follows:
Figure BDA0002275013950000032
wherein: laser is a set of pulsed Laser parameters; paIs the average power of the laser; widthPulseIs the laser pulse width; m2A laser pulse mode; sumBurstThe number of laser pulses in a pulse train; fBurstThe maximum output frequency of the laser pulse in the pulse train; dFocusThe diameter of a laser focus spot; fPulseThe maximum output frequency of the pulse laser; asfPulseAnd a safety factor is used for the maximum output frequency of the pulse laser.
Further, the Laser parameter calculation unit obtains a pulse Laser parameter Laser required by the processing morphology according to the parameter of the pulse Laser and the parameter of the morphology to be processedGrooveAnd number of pulses NPulseThe method specifically comprises the following steps:
establishing an equation set according to a pulse laser same-point interval multiple processing rule:
Figure BDA0002275013950000033
wherein: laserGroovePulse laser parameters required for processing the morphology;
NPulsethe number of pulses required to machine the feature;
BGroovethe width of the shape to be processed;
DepthGroovethe depth of the shape to be processed;
fD() The method is a functional expression of a set Laser of pulse Laser parameters and the diameter of the feature to be processed when the number of single pulses is large, and the diameter of the feature to be processed is the same as the width of the feature to be processed;
fDepth() In the number of single pulses, a set Laser of pulse Laser parameters and a function expression of the depth of the feature to be processed;
solving an equation to obtain a pulse Laser parameter needed by processing morphologyGrooveAnd number of pulses NPulse。
Further, the terminal laser scanning capability calculating unit obtains a terminal laser focus offset parameter according to the deflection module characteristic parameter and the focusing module characteristic parameter, and specifically includes:
determining the highest response frequency F according to the characteristic parameters of the deflection moduleCyMaximum response frequency use safety factor Asf of deflection moduleCyCorresponding relation between deflection angle and deflection module control electric signal
Figure BDA0002275013950000041
Wherein: zeta is the deflection module control electrical signal; alpha is the deflection angle of the laser at the tail end controlled by the deflection module; alpha is alphamaxControlling the maximum deflection angle of the tail end laser for the deflection module;
calculating the theoretical offset distance of the laser without lens at the tail end of the processing surface according to the characteristic parameters of the deflection module and the characteristic parameters of the focusing module, and specifically comprises the following steps:
Figure BDA0002275013950000042
wherein: asfαUsing a safety factor for controlling the maximum deflection angle of the tail end laser by the deflection module; w is a0The theoretical deflection of the end laser without lens on the focal plane is shown; l is1Is the distance between the deflection module and the focal plane; f is the focal length of the focusing lens;
correcting theoretical offset distance through a process test according to the relative position of the deflection module and the focusing module, and establishing the corresponding relation between the offset of the tail end laser focus position and a control electric signal of the deflection module, wherein the specific relation is as follows:
Figure BDA0002275013950000043
in the formula
Figure BDA0002275013950000044
Wherein: w is the offset of the position of the tail end laser focus on the focal plane; sigma is a correction coefficient of the offset distance of the tail end laser focus position on the focal plane; l is2Is the distance between the deflection module and the focal point of the focusing lens, L2＝L1-f；
Calculating the maximum scanning range w of the end laser focusmaxThe method specifically comprises the following steps: w is amax＝1/Asfα*αmax*L1*σ。
Further, the scanning parameter calculating unit obtains a set of segment parameters of the feature to be processed, laser scanning parameters and deflection module control signals corresponding to the focus offset in the feature processing process according to the end laser focus offset parameter and the feature to be processed, and specifically includes:
maximum scan range w with end laser focusmaxFor the basis, the length direction of the shape to be processed is evenly divided,
Figure BDA0002275013950000045
each section of the shape to be processed has the length of
Figure BDA0002275013950000046
Wherein: n is a radical ofSecSegmenting the number of the features to be processed; l is0The length of the shape to be processed;
the scanning parameter calculating unit calculates the length L of each section of the feature to be processedeObtaining the step size number N contained in each section of morphology to be processed1And corrected deflection module scanning step length wesThe method specifically comprises the following steps:
Figure BDA0002275013950000047
wherein wsFor preliminary setting of the deflection module scanning step, ws∈(BGroove,Le)；BGrooveThe width of the shape to be processed;
the scanning parameter calculating unit scans the step length w according to the corrected deflection moduleesCalculating the feed amount w in each scanning stepeqAnd the number of feeds N per scanning step2The method specifically comprises the following steps:
Figure BDA0002275013950000048
wherein: lambda is the linear groove scanning overlapping rate;
the scanning parameter calculation unit calculates a focus offset set of each section of morphology to be processed in the processing process, and the specific calculation method is as follows:
Figure BDA0002275013950000051
wherein: w is akThe k-th focus offset of each section of the feature to be processed in the processing process; w is a focus offset set of each section of morphology to be processed in the processing process; k is the focal point deviation sequence of each section of the morphology to be processed in the processing process; i is the order of feed in each scanning step; j is the step length sequence in each section of the morphology to be processed;
the scanning parameter calculation unit obtains a set gamma of deflection module control signals corresponding to the focus offset in the processing process of each section of feature to be processed according to the focus offset set W and the tail end laser focus offset parameter in the processing process of each section of feature to be processed, and specifically comprises the following steps:
Figure BDA0002275013950000052
in the formula kmax＝N1*N2，
Wherein: k is a radical ofmaxThe number of focus offsets contained in each section of the morphology to be processed in the laser processing process is calculated; zetakA deflection module control signal corresponding to the k-th focus offset of each section of the morphology to be processed in the laser processing process; f is a set of deflection module control signals corresponding to the focus offset in the processing process of each section of the feature to be processed;
and the set of deflection module control signals corresponding to the focus offset in the profile machining process is a set gamma of deflection module control signals corresponding to the focus offset in the profile machining process of each section to be machined.
Further, the system frequency calculation unit obtains a system output frequency fm according to the pulse laser output frequency and the deflection module frequency, specifically:
fm＝MIN(1/AsfCy*FCy,1/AsfPulse*FPulse) Wherein: fm is the system output frequency, namely the deflection module deflection frequency or the pulse laser output frequency; asfCyUsing a safety factor for the highest response frequency of the deflection module, FCyAt the highest response frequency, AsfPulseSafety factor for maximum output frequency of pulse laser, FPulseThe maximum output frequency of the pulse laser.
A processing method of a pulse laser high-speed same-point interval multiple processing system comprises the following steps:
the scanning parameter calculating unit segments the to-be-processed appearance, and determines the segmentation number N of the to-be-processed appearanceSec，；
The processing control unit controls the laser light source and the deflection module to measure the nmSecNm of segmental processing morphologyPulseThe layer is laser-processed in nmSecFor the order of segmented processing of the processing features, nmSec∈[1，NSec]；nmPulseProcessing layering sequence for segmented processing features, nmPulse∈[1，NPulse](ii) a When nmSec＝NSecAnd then finishing the appearance processing.
Further, the processing control unit controls the processing steps of the laser light source and the deflection module to be as follows:
s1: setting the order nm of segmented processing of the processing morphology Sec1, process layering order nm of segmented process featuresPulse1, the focal point shift sequence k of each section of the morphology to be processed is 1 in the processing process;
s2: to the nmSecNm of segmental processing morphologyPulseLaser processing of the layer, in particular the following steps:
s2-1: the processing control unit controls the Laser light source to output pulse Laser parameters required by processing morphologyGrooveAnd the output frequency f of the pulsed lasermThe pulse laser sequentially passes through the deflection module and the focusing module and is focused on the surface of the material;
s2-2: while the pulsed laser is output, the deflection module deflects the frequency f according to the deflection modulemA deflection module control signal zeta corresponding to the k-th focus offset of each section of to-be-processed appearance in the laser processing processkDeflecting the pulsed laser light passing through the deflection module by alphakThe deflected pulse laser is focused on a processing surface through a focusing module, and is deflected by w according to step length in each section of processing morphology through a focuskAt the nm ofSecNm of segmental processing morphologyPulseRemoving material of the kth point of the layer for processing at intervals of the same point for multiple times;
S2-3：k＝k+1；
s2-4: judging whether the nm-th step is finishedSecNm of segmental processing morphologyPulseLaser processing of the layer:
if k is<kmaxAnd the process proceeds to S2-2,
if k is equal to kmaxThen S2-5 is executed;
S2-5：k＝1，nmPulse＝nmPulse+1, go to S3;
s3: judging whether the nm-th step is finishedSecLaser processing of segment processing appearance:
if nmPulse<NPulseThen the process proceeds to S2,
if nmPulse＝NPulseThen execution proceeds to S4;
s4: moving the laser focus to the nm by moving the working surfaceSec+1 real position of the processing morphology;
S5：nmPulse＝1，nmSec＝nmSec+1；
s6: judging whether laser processing of all processing appearances is finished:
if nmSec<NSecThen the process proceeds to S2,
if nmSec＝NSecAnd finishing the processing.
The invention has the beneficial effects that:
1. the pulse laser high-speed same-point interval multiple processing system can utilize incident laser pulses output by MHz frequency, and compared with a galvanometer scanning system, the pulse laser output frequency is improved by 2-3 orders of magnitude, so that the full utilization of pulses generated by a short/ultrashort pulse laser is realized.
2. According to the pulse laser high-speed same-point interval multiple processing system, deflection of pulse laser at the MHz level can be realized by utilizing the deflection module, the scanning speed of hundreds of meters per second is realized by the laser focus on the focal plane, the scanning range reaches the mm level, and the effect of considering both processing quality and efficiency is achieved.
3. According to the high-speed same-point interval multiple processing method of the pulse laser, negative heat effect accumulation is effectively avoided, the processing morphology can be accurately controlled, and high-precision processing of the linear groove is realized.
4. The high-speed pulse laser same-point interval multiple processing method provided by the invention aims at the laser processing of the linear groove, can realize area processing by combining multiple sections of grooves, and is convenient to integrate and use in the later period.
Drawings
FIG. 1 is a schematic diagram of a pulsed laser high-speed, same-spot-spacing, multiple-pass machining system according to the present invention.
Fig. 2 is a schematic diagram of a pulse laser same-point interval multiple processing rule.
FIG. 3 shows a single pulse laser according to the present invention.
Fig. 4 shows a pulse train type pulsed laser according to the present invention.
Fig. 5 is a control schematic diagram of the laser parameter calculation unit according to the present invention.
Fig. 6 is a control schematic diagram of the end laser scanning capability and scanning parameter calculation unit according to the present invention.
Fig. 7 is a control schematic diagram of the system frequency calculation unit according to the present invention.
Fig. 8 is a flowchart of a high-speed pulse laser high-speed same-point interval multiple processing method according to the present invention.
Fig. 9 is a detailed flowchart of steps S1 and S2.
FIG. 10 shows the nm-th mode of the present inventionSecNm of section linear groove Pulse1 st to Nth of layer1Processing sequence chart of each feature point.
FIG. 11 shows the nm of the present inventionSecNm of section linear groovePulseN th of layer1+1 to 2N1Processing sequence chart of each feature point.
FIG. 12 shows the nm of the present inventionSecNm of section linear groovePulse2 x N of layer1+1 to 3 x N1Processing sequence chart of each feature point.
FIG. 13 shows the nm-th mode of the present inventionSecNm of section linear groovePulse(i-1) × N of the layer1+1 to ith1Processing sequence chart of each feature point.
FIG. 14 shows the nm of the present inventionSecNm of section linear groovePulseNo (N) of layer2-1)*N1+1 to Nth2*N1Processing sequence chart of each feature point.
In the figure:
1-a laser light source; 2-pulse laser; 3-a deflection module; 4-a focusing module; 5-linear grooves to be processed; 6-a workbench; 7-control system.
Detailed Description
The invention will be further described with reference to the following figures and specific examples, but the scope of the invention is not limited thereto.
As shown in fig. 1, the pulsed laser high-speed same-point interval multiple processing system of the present invention includes a laser light source 1, a deflection module 3, a focusing module 4 and a control system 7;
the laser light source 1 is used for generating pulse laser 2, and the pulse laser 2 is injected into a processing surface after passing through the deflection module 3 and the focusing module 4; the processing surface is located on a working table 6, and the working table 6 can move in a plane. The deflection module 3 is used for deflecting the pulse laser 2 to be emitted into the focusing module 4; according to the parameters of the pulse Laser 2, the parameters of the feature to be processed, the characteristic parameters of the deflection module 3 and the characteristic parameters of the focusing module 4, the control system 7 outputs the pulse Laser parameters Laser required by the feature processingGrooveA set of deflection module control signals corresponding to the focus offset in the morphology processing process and a system output frequency fm;
the control system 7 is used for controlling the pulse Laser parameters according to the shape to be processedGrooveAnd the system output frequency fm controls the laser light source 1 to output the pulse laser required by the processing morphology; and the control system controls the deflection module 3 according to the set of deflection module control signals corresponding to the focus offset in the feature processing process and the system output frequency fm, and is used for realizing the multipoint interval multiple processing of the feature to be processed.
The control system 7 comprises a laser parameter calculation unit, a tail end laser scanning capability calculation unit, a scanning parameter calculation unit, a system frequency calculation unit and a processing control unit;
as shown in fig. 5, the Laser parameter calculating unit obtains a pulse Laser parameter Laser required for processing the feature according to the parameter of the pulse Laser 2 and the parameter of the feature to be processedGroovAnd number of pulses NPulseAnd the pulse Laser parameter needed by the processing shape is usedGrooveAnd number of pulses NPulseInputting a processing control unit;
as shown in fig. 6, the terminal laser scanning capability calculating unit obtains a terminal laser focus offset parameter according to the characteristic parameter of the deflection module 3 and the characteristic parameter of the focusing module 4; the scanning parameter calculating unit obtains a segmentation parameter of the morphology to be processed, a laser scanning parameter and a set of deflection module control signals corresponding to the focus offset in the morphology processing process according to the tail end laser focus offset parameter and the morphology parameter to be processed, and inputs the segmentation parameter of the morphology to be processed, the laser scanning parameter and the set of deflection module control signals corresponding to the focus offset in the morphology processing process into the processing control unit;
as shown in fig. 7, the system frequency calculation unit obtains a system output frequency fm according to the pulse laser output frequency and the deflection module frequency, and inputs the system output frequency fm into the processing control unit; the processing control unit controls the laser light source 1 and the deflection module 3 and is used for realizing the processing of the feature to be processed at the same point and multiple times.
In the invention f appearsD() And fDept() Determination of these two functionsThe solution can be solved by:
as shown in fig. 2, a multiple processing rule of the pulse laser 2 at the same point interval is determined, specifically, a corresponding relationship between the pulse laser parameters, the number of pulses and the shape parameters of the micro-pits formed by laser removal is established, and the specific determination method of the rule is as follows:
firstly, utilizing incident pulse laser 2 to pass through a deflection module and a focusing module in turn and then focus on the surface of a material, wherein the deflection module does not work, the incident pulse laser does not deflect, the pulse laser acts on the same point on the surface of the material, and the action interval time T of the pulse laser 2PulseRealizing the processing effect of the pulse laser at the same point and multiple times, and measuring the pulse number n along with the pulse laserPulseIncreasing, the shape parameter change of the micro-pits formed by material removal, and the obtaining rule is as follows:
Figure BDA0002275013950000091
in the formula: theta epsilon (0.1, 0.4);
then, combining the general rule of material laser removal, the influence of the pulse quantity of the pulse laser at the same point and multiple intervals on the profile diameter of the formed micro-pit is small, the profile depth of the micro-pit is basically in a linear relation, and the obtained rule is corrected:
Figure BDA0002275013950000092
in the formula:
Figure BDA0002275013950000094
∈(0.1,0.4)。
wherein: n isPulseThe number of pulses of the pulsed laser; dDimpleThe micro-pit morphology diameter formed for pulsed laser removal of material; depthDimpleThe micro-pit morphology depth formed for pulsed laser removal of material; (Depth)Dimple)maxThe maximum depth of the micro-pit morphology formed for pulsed laser removal of material; theta is the depth-diameter ratio coefficient of the micro-pit morphology. The action interval time T of the pulse laserPulseSetting a constant for pulsed laser output, typically TPulse＝0.1ms。
The following results are obtained: f. ofD() The method is a functional expression of a set Laser of pulse Laser parameters and the shape and diameter of the micro-pits when the number of single pulses is large; f. ofDept() When the number of single pulses is large, a function expression of a set Laser of pulse Laser parameters and the shape depth of the micro-pits is obtained;
the following is a detailed description of the 2 examples:
embodiment 1, the processing surface is subjected to linear groove processing of multiple times at the same point interval of pulse laser by single pulse laser:
as shown in fig. 3, the parameters of the single pulse laser are:
Figure BDA0002275013950000093
in the examples, WidthPulse＝10ps，FPulse＝10MHz，AsfPulse＝1.1，dFocus＝40μm。
Wherein: laser is a set of pulsed Laser parameters; paIs the average power of the laser; widthPulseIs the laser pulse width; m2A laser pulse mode; dFocusThe diameter of a laser focus spot; fPulseThe maximum output frequency of the pulse laser; asfPulseAnd a safety factor is used for the maximum output frequency of the pulse laser.
As shown in fig. 4, the Laser parameter calculating unit obtains a pulse Laser parameter Laser required for processing the shape of the linear groove according to the parameter of the pulse Laser 2 and the parameter of the shape to be processedGrooveAnd number of pulses NPulseThe method specifically comprises the following steps:
according to the fact that the influence of the number of pulses obtained last time at intervals of the same point of the pulse laser on the diameter of the formed micro-pit shape is small, the depth of the micro-pit shape is basically in a linear relation, and an equation set is established:
set of equations
Figure BDA0002275013950000101
Namely, the method is simplified as follows:
Figure BDA0002275013950000102
solving to obtain the required pulse Laser parameter LaserGrooveAnd number of pulses NPulse。
Wherein: laserGroovePulse laser parameters required by the linear groove to be processed; n is a radical ofPulseThe required number of pulse laser pulses; b isGrooveThe width of the linear groove to be processed is defined; depthGrooveIs the depth of the linear groove to be processed.
As shown in fig. 5, the terminal laser scanning capability calculating unit obtains a terminal laser focus offset parameter according to the characteristic parameter of the deflection module 3 and the characteristic parameter of the focusing module 4, specifically:
determining the highest response frequency F according to the characteristic parameters of the deflection module 3CyMaximum response frequency use safety factor Asf of deflection moduleCyCorresponding relation between deflection angle and deflection module control electric signal
Figure BDA0002275013950000103
Wherein: zeta is the deflection module control electrical signal; alpha is the deflection angle of the laser at the tail end controlled by the deflection module; alpha is alphamaxControlling the maximum deflection angle, alpha, of the terminal laser for the deflection modulemax＝100mrad；FCyIs the highest response frequency FCy＝50MHz；AsfCyUsing a safety factor Asf for the highest response frequency of the deflection moduleCy＝1.1。
Calculating the theoretical offset distance of the laser without lens at the tail end of the processing surface according to the characteristic parameters of the deflection module 3 and the characteristic parameters of the focusing module 4, specifically:
Figure BDA0002275013950000104
in the formula: l is1＝f+60mm，f＝40mm，Asfα＝1.1；
Wherein: asfαControlling the maximum deflection angle of the laser at the end of the deflection moduleUsing safety factors; w is a0The theoretical deflection of the end laser without lens on the focal plane is shown; l is1Is the distance between the deflection module and the focal plane; f is the focal length of the focusing lens;
correcting theoretical offset distance through a process test according to the relative position of the deflection module and the focusing module, and establishing the corresponding relation between the offset of the tail end laser focus position and a control electric signal of the deflection module, wherein the specific relation is as follows:
Figure BDA0002275013950000105
in the formula
Figure BDA0002275013950000106
Wherein: w is the offset of the position of the tail end laser focus on the focal plane; sigma is a correction coefficient sigma epsilon (0,1) of the offset distance of the tail end laser focus position on the focal plane; l is2Is the distance between the deflection module and the focal point of the focusing lens, L2＝L1-f；
Calculating the maximum scanning range of the tail end laser focus, specifically: w is amax＝1/Asfα*αmax*L1*σ。
As shown in fig. 5, the scanning parameter calculating unit obtains a set of segment parameters of the feature to be processed, laser scanning parameters and deflection module control signals corresponding to the focus offset in the feature processing process according to the parameter of the end laser focus offset and the parameter of the feature to be processed, specifically:
maximum scan range w with end laser focusmaxFor the basis, the length direction of the linear groove to be processed is evenly divided,
Figure BDA0002275013950000111
each section of the linear groove to be processed has the length of
Figure BDA0002275013950000112
Wherein: n is a radical ofSecThe number of the linear grooves to be processed is divided into sections; l is0The length of the linear groove to be processed is defined;
the scanning parameter calculation unit calculates the length L of each section of linear groove to be processedeObtaining the step size number N contained in each section of morphology to be processed1And corrected deflection module scanning step length wesThe method specifically comprises the following steps:
Figure BDA0002275013950000113
wherein wsFor preliminary setting of the deflection module scanning step, ws＝2*BGroove；BGrooveThe width of the linear groove to be processed;
the scanning parameter calculating unit scans the step length w according to the corrected deflection moduleesCalculating the feed amount w in each scanning stepeqAnd the number of feeds N per scanning step2The method specifically comprises the following steps:
Figure BDA0002275013950000114
wherein: λ is the linear groove scanning overlap ratio λ of 95%;
the scanning parameter calculation unit calculates a focus offset set of each section of morphology to be processed in the processing process, and the specific calculation method is as follows:
Figure BDA0002275013950000115
wherein: w is akThe k-th focus offset of each section of linear groove to be machined in the machining process; w is a focus offset set of each section of linear groove to be machined in the machining process; k is the focal point deviation sequence of each section of the morphology to be processed in the processing process; i is the order of feed in each scanning step; j is the step length sequence in each section of the morphology to be processed;
the scanning parameter calculation unit obtains a set gamma of deflection module control signals corresponding to the focus offset in the processing process of each section of linear groove to be processed according to the focus offset set W and the tail end laser focus offset parameter in the processing process of each section of linear groove to be processed, and specifically comprises the following steps:
Figure BDA0002275013950000116
in the formula kmax＝N1*N2，
Wherein: k is a radical ofmaxThe number of focus offsets contained in each section of linear groove to be processed in the laser processing process is calculated; zetakControlling a signal for a deflection module corresponding to the k-th focus offset of each section of linear groove to be processed in the laser processing process; f is a set of deflection module control signals corresponding to the focus offset in the machining process of each section of linear groove to be machined;
and the set of deflection module control signals corresponding to the focus offset in the morphology machining process is a set gamma of deflection module control signals corresponding to the focus offset in the machining process of each section of linear groove to be machined.
As shown in fig. 7, the system frequency calculating unit obtains a system output frequency fm according to the pulse laser output frequency and the deflection module frequency, specifically:
fm＝MIN(1/AsfCy*FCy,1/AsfPulse*FPulse) Wherein: fm is the system output frequency and is also the deflection frequency of the deflection module or the output frequency of the pulse laser; asfCyUsing a safety factor for the highest response frequency of the deflection module, FCyAt the highest response frequency, AsfPulseSafety factor for maximum output frequency of pulse laser, FPulseThe maximum output frequency of the pulse laser.
As shown in fig. 8, 9, 10, 11, 12, 13 and 14, the method for processing multiple times at the same point interval in high speed by using pulsed laser according to the present invention includes the following steps:
the scanning parameter calculating unit segments the to-be-processed appearance, and determines the segmentation number N of the to-be-processed appearanceSec，；
The processing control unit controls the laser light source 1 and the deflection module 3 to measure the nm-th wavelengthSecNm of segmental processing morphologyPulseThe layer is laser-processed in nmSecFor the order of segmented processing of the processing features, nmSec∈(1，NSec)；nmPulseIs segmentedProcessing layering sequence of processing morphology; when nmSec＝NSecAnd then finishing the appearance processing, specifically comprising the following steps:
s1: initializing the system circulation quantity, specifically comprising:
s1-1: linear groove segmentation processing order nmSec＝1，
S1-2: linear groove processing layering sequence nmPulse＝1，
S1-3: the focus offset in each section of linear groove is sequentially k equal to 1;
s2: to the nmSecNm of segmental processing morphologyPulseLaser processing of the layer, in particular the following steps:
s2-1: the processing control unit controls the Laser light source 1 to output pulse Laser parameters required by processing linear groovesGrooveAnd the output frequency f of the pulsed lasermThe pulse laser sequentially passes through the deflection module and the focusing module and is focused on the surface of the material;
s2-2: while the pulsed laser is output, the deflection module deflects the frequency f according to the deflection modulemA deflection module control signal zeta corresponding to the k-th focus offset of each section of linear groove to be machined in the laser machining processkDeflecting the pulsed laser light 2 passing through the deflection module by alphakThe deflected pulse laser 2 is focused on a processing surface through a focusing module, and is deflected by w according to step length in each section of processing morphology through a focuskAt the nm ofSecNm of segmental processing morphologyPulseRemoving material of the kth point of the layer for processing at intervals of the same point for multiple times;
s2-3: changing a system circulation amount, wherein k is k + 1;
s2-4: judging whether the nm-th step is finishedSecNm of section linear groovePulseLaser processing of the layer:
if not (i.e., k)<kmax) And the process proceeds to S2-2,
if it is completed (i.e. k ═ k)max) Then S2-5 is executed;
s2-5: change in the amount of system circulation, k is 1, nmPulse＝nmPulse+1, go to S3;
s3: judging whether the nm-th step is finishedSecLaser processing of the section straight line groove:
if not (i.e. nm)Pulse<NPulse) Then the process proceeds to S2,
if it is finished (i.e. nm)Pulse＝NPulse) Then execution proceeds to S4;
s4: the system stops signal output, stops pulse laser output and stops the deflection module from working;
s5: the change of the initial position of the laser focus is completed by the movement of the working table top, specifically, the initial position of the laser focus is controlled to move L along the direction of the linear grooveeA length;
s6: change in systemic circulation, nmPulse＝1，nmSec＝nmSec+1；
S7: judging whether the laser processing of the whole linear groove is finished:
if not (i.e. nm)Sec<NSec) Then the process proceeds to S2,
if it is finished (i.e. nm)Sec＝NSec) Then execution proceeds to S8;
s8: finishing the precision machining of the whole linear groove and finishing the circulation.
Embodiment 2, through pulse train formula laser, carry out many times of linear groove processing of pulse laser with the interval of some to the machined surface:
as shown in fig. 4, the parameters of the pulse-train laser are:
Figure BDA0002275013950000131
in the examples, WidthPulse＝10ps，FPulse＝50KHz，AsfPulse＝1.1，dFocus＝40μm，SumBurst＝0.5K，FBurst＝40MHz。
Wherein: laser is a set of pulsed Laser parameters; paIs the average power of the laser; widthPulseIs the laser pulse width; m2A laser pulse mode; sumBurstIs a laser pulse in a pulse trainPunching quantity; fBurstThe maximum output frequency of the laser pulse in the pulse train; dFocusThe diameter of a laser focus spot; fPulseThe maximum output frequency of the pulse laser; asfPulseAnd a safety factor is used for the maximum output frequency of the pulse laser.
As shown in fig. 4, the Laser parameter calculating unit obtains a pulse Laser parameter Laser required for processing the shape of the linear groove according to the parameter of the pulse Laser 2 and the parameter of the shape to be processedGrooveAnd number of pulses NPulseThe method specifically comprises the following steps:
according to the fact that the influence of the number of pulses obtained last time at intervals of the same point of the pulse laser on the diameter of the formed micro-pit shape is small, the depth of the micro-pit shape is basically in a linear relation, and an equation set is established:
set of equations
Figure BDA0002275013950000141
Namely, the method is simplified as follows:
Figure BDA0002275013950000142
solving to obtain the required pulse Laser parameter LaserGrooveAnd number of pulses NPulse。
Wherein: laserGroovePulse laser parameters required by the linear groove to be processed; n is a radical ofPulseThe required number of pulse laser pulses; b isGrooveThe width of the linear groove to be processed is defined; depthGrooveIs the depth of the linear groove to be processed.
As shown in fig. 5, the terminal laser scanning capability calculating unit obtains a terminal laser focus offset parameter according to the characteristic parameter of the deflection module 3 and the characteristic parameter of the focusing module 4, specifically:
determining the highest response frequency F according to the characteristic parameters of the deflection module 3CyMaximum response frequency use safety factor Asf of deflection moduleCyCorresponding relation between deflection angle and deflection module control electric signal
Figure BDA0002275013950000143
Wherein: zeta is the deflection module control electrical signal; alpha is the deflection angle of the laser at the tail end controlled by the deflection module; alpha is alphamaxControlling the maximum deflection angle, alpha, of the terminal laser for the deflection modulemax＝100mrad；FCyIs the highest response frequency FCy＝50MHz；AsfCyUsing a safety factor Asf for the highest response frequency of the deflection moduleCy＝2。
Calculating the theoretical offset distance of the laser without lens at the tail end of the processing surface according to the characteristic parameters of the deflection module 3 and the characteristic parameters of the focusing module 4, specifically:
Figure BDA0002275013950000144
in the formula: l is1＝f+60mm，f＝40mm，Asfα＝1.1；
Wherein: asfαUsing a safety factor for controlling the maximum deflection angle of the tail end laser by the deflection module; w is a0The theoretical deflection of the end laser without lens on the focal plane is shown; l is1Is the distance between the deflection module and the focal plane; f is the focal length of the focusing lens;
correcting theoretical offset distance through a process test according to the relative position of the deflection module and the focusing module, and establishing the corresponding relation between the offset of the tail end laser focus position and a control electric signal of the deflection module, wherein the specific relation is as follows:
Figure BDA0002275013950000145
in the formula
Figure BDA0002275013950000146
Wherein: w is the offset of the position of the tail end laser focus on the focal plane; l is2The distance between the deflection module and the focal point of the focusing lens; sigma is a correction coefficient sigma epsilon (0,1) of the offset distance of the tail end laser focus position on the focal plane; l is2Is the distance between the deflection module and the focal point of the focusing lens, L2＝L1-f；
Calculating the maximum scanning range of the tail end laser focus, specifically: w is amax＝1/Asfα*αmax*L1*σ。
As shown in fig. 5, the scanning parameter calculating unit obtains a set of segment parameters of the feature to be processed, laser scanning parameters and deflection module control signals corresponding to the focus offset in the feature processing process according to the parameter of the end laser focus offset and the parameter of the feature to be processed, specifically:
maximum scan range w with end laser focusmaxFor the basis, the length direction of the linear groove to be processed is evenly divided,
Figure BDA0002275013950000151
each section of the linear groove to be processed has the length of
Figure BDA0002275013950000152
Wherein: n is a radical ofSecThe number of the linear grooves to be processed is divided into sections; l is0The length of the linear groove to be processed is defined;
the scanning parameter calculation unit calculates the length L of each section of linear groove to be processedeObtaining the step size number N contained in each section of morphology to be processed1And corrected deflection module scanning step length wesThe method specifically comprises the following steps:
Figure BDA0002275013950000153
wherein wsFor preliminary setting of the deflection module scanning step, ws＝2*BGroove；BGrooveThe width of the linear groove to be processed;
the scanning parameter calculating unit scans the step length w according to the corrected deflection moduleesCalculating the feed amount w in each scanning stepeqAnd the number of feeds N per scanning step2The method specifically comprises the following steps:
Figure BDA0002275013950000154
wherein: λ is the linear groove scanning overlap ratio λ of 90%;
the scanning parameter calculation unit calculates a focus offset set of each section of morphology to be processed in the processing process, and the specific calculation method is as follows:
Figure BDA0002275013950000155
wherein: w is akThe k-th focus offset of each section of linear groove to be machined in the machining process; w is a focus offset set of each section of linear groove to be machined in the machining process; k is the focal point deviation sequence of each section of the morphology to be processed in the processing process; i is the order of feed in each scanning step; j is the step length sequence in each section of the morphology to be processed;
the scanning parameter calculation unit obtains a set gamma of deflection module control signals corresponding to the focus offset in the processing process of each section of linear groove to be processed according to the focus offset set W and the tail end laser focus offset parameter in the processing process of each section of linear groove to be processed, and specifically comprises the following steps:
Figure BDA0002275013950000156
in the formula kmax＝N1*N2，
Wherein: k is a radical ofmaxThe number of focus offsets contained in each section of linear groove to be processed in the laser processing process is calculated; zetakControlling a signal for a deflection module corresponding to the k-th focus offset of each section of linear groove to be processed in the laser processing process; f is a set of deflection module control signals corresponding to the focus offset in the machining process of each section of linear groove to be machined;
and the set of deflection module control signals corresponding to the focus offset in the morphology machining process is a set gamma of deflection module control signals corresponding to the focus offset in the machining process of each section of linear groove to be machined.
As shown in fig. 7, the system frequency calculating unit obtains a system output frequency fm according to the pulse laser output frequency and the deflection module frequency, specifically:
fm＝MIN(1/AsfCy*FCy,1/AsfPulse*FPulse) Wherein: fm is the system output frequencyIs the deflection frequency of the deflection module or the output frequency of the pulse laser; asfCyUsing a safety factor for the highest response frequency of the deflection module, FCyAt the highest response frequency, AsfPulseSafety factor for maximum output frequency of pulse laser, FPulseThe maximum output frequency of the pulse laser.
The processing method of example 2 is similar to that of example 1 and will not be described.
The present invention is not limited to the above-described embodiments, and any obvious improvements, substitutions or modifications can be made by those skilled in the art without departing from the spirit of the present invention.

Claims (7)

1. A pulse laser high-speed same-point interval multi-time processing system is characterized by comprising a laser light source (1), a deflection module (3), a focusing module (4) and a control system;
the laser light source (1) is used for generating pulse laser (2), and the pulse laser (2) is emitted into a processing surface after passing through the deflection module (3) and the focusing module (4); the deflection module (3) is used for deflecting the pulse laser (2) to be emitted into the focusing module (4); according to the parameters of the pulse Laser (2), the parameters of the shape to be processed, the characteristic parameters of the deflection module (3) and the characteristic parameters of the focusing module (4), the control system outputs the pulse Laser parameters Laser required by the shape processingGrooveThe control signal set of the deflection module (3) corresponding to the focus offset in the morphology processing process and the system output frequency fm; the characteristic parameters of the deflection module (3) comprise a deflection module control electric signal zeta and a deflection module control terminal laser deflection angle alpha; the characteristic parameters of the focusing module (4) comprise the distance L between the deflection module and the focal plane1And a focusing lens focal length f;
the control system is used for controlling the Laser according to the pulse Laser parameters required by the shape to be processedGrooveAnd the system output frequency fm controls the laser light source (1) to output the pulse laser (2) required by the processing morphology; the control system correspondingly deflects according to the focus offset in the feature processing process-a set of steering module control signals and a system output frequency fm controls said deflection module (3);
the control system comprises a laser parameter calculation unit, a tail end laser scanning capability calculation unit, a scanning parameter calculation unit, a system frequency calculation unit and a processing control unit;
the Laser parameter calculating unit obtains a pulse Laser parameter Laser required by the processing morphology according to the parameters of the pulse Laser (2) and the parameters of the morphology to be processedGrooveAnd number of pulses NPulseAnd the pulse Laser parameter needed by the processing shape is usedGrooveAnd number of pulses NPulseInputting a processing control unit; the Laser parameter calculating unit obtains a pulse Laser parameter Laser required by the processing morphology according to the parameters of the pulse Laser (2) and the parameters of the morphology to be processedGrooveAnd number of pulses NPulseThe method specifically comprises the following steps:
establishing an equation set according to a pulse laser same-point interval multiple processing rule:
Figure FDA0003006449910000011
wherein: laserGroovePulse laser parameters required for processing the morphology;
NPulsethe number of pulses required to machine the feature;
BGroovethe width of the shape to be processed;
DepthGroovethe depth of the shape to be processed;
fD() The method is a functional expression of a set Laser of pulse Laser parameters and the diameter of the feature to be processed when the number of single pulses is large, and the diameter of the feature to be processed is the same as the width of the feature to be processed;
fDepth() In the number of single pulses, a set Laser of pulse Laser parameters and a function expression of the depth of the feature to be processed;
solving an equation to obtain a pulse Laser parameter needed by processing morphologyGrooveAnd number of pulses NPulse；
The tail end laser scanning capability calculation unit obtains a tail end laser focus offset parameter according to the characteristic parameters of the deflection module (3) and the focusing module (4);
the scanning parameter calculating unit obtains a segmentation parameter of the morphology to be processed, a laser scanning parameter and a set of deflection module control signals corresponding to the focus offset in the morphology processing process according to the tail end laser focus offset parameter and the morphology parameter to be processed, and inputs the segmentation parameter of the morphology to be processed, the laser scanning parameter and the set of deflection module control signals corresponding to the focus offset in the morphology processing process into the processing control unit;
the system frequency calculation unit obtains a system output frequency fm according to the pulse laser output frequency and the deflection module frequency, and inputs the system output frequency fm into the processing control unit;
the processing control unit controls the laser light source (1) and the deflection module (3) and is used for realizing the processing of the feature to be processed at the same point interval for multiple times.
2. The pulsed laser high-speed same-spot-spacing multi-pass machining system according to claim 1, wherein the pulsed laser (2) is a single-pulse laser or a pulse-train laser, and specifically:
the single pulse laser parameters are as follows:
Figure FDA0003006449910000021
the laser parameters of the pulse train are as follows:
Figure FDA0003006449910000022
wherein: laser is a set of pulsed Laser parameters; paIs the average power of the laser; widthPulseIs the laser pulse width; m2A laser pulse mode; sumBurstFor the number of laser pulses in the pulse train；FBurstThe maximum output frequency of the laser pulse in the pulse train; dFocusThe diameter of a laser focus spot; fPulseThe maximum output frequency of the pulse laser; asfPulseAnd a safety factor is used for the maximum output frequency of the pulse laser.
3. The pulsed laser high-speed same-point interval multiple processing system according to claim 1, wherein the terminal laser scanning capability calculation unit obtains a terminal laser focus offset parameter according to the characteristic parameter of the deflection module (3) and the characteristic parameter of the focusing module (4), and specifically comprises:
determining the highest response frequency F according to the characteristic parameters of the deflection module (3)CyMaximum response frequency use safety factor Asf of deflection moduleCyCorresponding relation between deflection angle and deflection module control electric signal
Figure FDA0003006449910000023
Wherein: zeta is the deflection module control electrical signal; alpha is the deflection angle of the laser at the tail end controlled by the deflection module; alpha is alphamaxControlling the maximum deflection angle of the tail end laser for the deflection module;
calculating the theoretical offset distance of the laser without lens at the tail end of the processed surface according to the characteristic parameters of the deflection module (3) and the characteristic parameters of the focusing module (4), specifically:
Figure FDA0003006449910000031
wherein: asfαUsing a safety factor for controlling the maximum deflection angle of the tail end laser by the deflection module; w is a0The theoretical deflection of the end laser without lens on the focal plane is shown; l is1Is the distance between the deflection module and the focal plane; f is the focal length of the focusing lens;
correcting theoretical offset distance through a process test according to the relative position of the deflection module and the focusing module, and establishing the corresponding relation between the offset of the tail end laser focus position and a control electric signal of the deflection module, wherein the specific relation is as follows:
Figure FDA0003006449910000032
in the formula
Figure FDA0003006449910000033
Wherein: w is the offset of the position of the tail end laser focus on the focal plane; sigma is a correction coefficient of the offset distance of the tail end laser focus position on the focal plane; l is2Is the distance between the deflection module and the focal point of the focusing lens, L2＝L1-f；
Calculating the maximum scanning range w of the end laser focusmaxThe method specifically comprises the following steps: w is amax＝1/Asfα*αmax*L1*σ。
4. The pulsed laser high-speed same-point interval multiple processing system according to claim 3, wherein the scanning parameter calculation unit obtains a set of segment parameters of the feature to be processed, laser scanning parameters and deflection module control signals corresponding to the focus offset in the feature processing process according to the end laser focus offset parameter and the parameter of the feature to be processed, and specifically comprises:
maximum scan range w with end laser focusmaxFor the basis, the length direction of the shape to be processed is evenly divided,
Figure FDA0003006449910000034
each section of the shape to be processed has the length of
Figure FDA0003006449910000035
Wherein: n is a radical ofSecSegmenting the number of the features to be processed; l is0The length of the shape to be processed;
the scanning parameter calculating unit calculates the length L of each section of the feature to be processedeObtaining the step size number N contained in each section of morphology to be processed1And corrected deflection module scanning step length wesThe method specifically comprises the following steps:
Figure FDA0003006449910000036
wherein wsFor preliminary setting of the deflection module scanning step, ws∈(BGroove，Le)；BGrooveThe width of the shape to be processed;
the scanning parameter calculating unit scans the step length w according to the corrected deflection moduleesCalculating the feed amount w in each scanning stepeqAnd the number of feeds N per scanning step2The method specifically comprises the following steps:
Figure FDA0003006449910000037
wherein: lambda is the scanning overlapping rate of the processing morphology;
the scanning parameter calculation unit calculates a focus offset set of each section of morphology to be processed in the processing process, and the specific calculation method is as follows:
Figure FDA0003006449910000038
wherein: wk is the k-th focus offset of each section of the feature to be processed in the processing process; w is a focus offset set of each section of morphology to be processed in the processing process; k is the focal point deviation sequence of each section of the morphology to be processed in the processing process; i is the order of feed in each scanning step; j is the step length sequence in each section of the morphology to be processed;
the scanning parameter calculation unit obtains a set gamma of deflection module control signals corresponding to the focus offset in the processing process of each section of feature to be processed according to the focus offset set W and the tail end laser focus offset parameter in the processing process of each section of feature to be processed, and specifically comprises the following steps:
Figure FDA0003006449910000041
in the formula kmax＝N1*N2，
Wherein: k is a radical ofmaxThe coke contained in the laser processing process for each section of the shape to be processedThe number of dot offsets; zetakA deflection module control signal corresponding to the k-th focus offset of each section of the morphology to be processed in the laser processing process; f is a set of deflection module control signals corresponding to the focus offset in the processing process of each section of the feature to be processed;
and the set of deflection module control signals corresponding to the focus offset in the profile machining process is a set gamma of deflection module control signals corresponding to the focus offset in the profile machining process of each section to be machined.
5. The pulsed laser high-speed multipoint interval multiple processing system according to claim 1, wherein the system frequency calculation unit derives a system output frequency fm from the pulsed laser output frequency and the deflection module frequency, specifically:
fm＝MIN(1/AsfCy*FCy，1/AsfPulse*FPulse) Wherein: fm is the system output frequency, namely the deflection module deflection frequency or the pulse laser output frequency; asfCyUsing a safety factor for the highest response frequency of the deflection module, FCyAt the highest response frequency, AsfPulseSafety factor for maximum output frequency of pulse laser, FPulseThe maximum output frequency of the pulse laser.
6. A processing method of the pulsed laser high-speed same-point interval multiple processing system according to claim 4, characterized by comprising the following steps:
the scanning parameter calculating unit segments the to-be-processed appearance, and determines the segmentation number N of the to-be-processed appearanceSec；
The processing control unit controls the laser light source (1) and the deflection module (3) to measure the nmSecNm of segmental processing morphologyPulseThe layer is laser-processed in nmSecFor the order of segmented processing of the processing features, nmSec∈[1，NSec]；nmPulseProcessing layering sequence for segmented processing features, nmPulse∈[1，NPulse](ii) a When nmSec＝NSecWhen is at timeAnd finishing the appearance processing.
7. The processing method of the pulsed laser high-speed multipoint interval multiple processing system according to claim 6, wherein the processing control unit controls the processing steps of the laser light source (1) and the deflection module (3) to be as follows:
s1: setting the sequence nm of the sectional processing of the linear grooveSec1, the processing layering order nm of the segmented processing linear groovePulse1, the focal point deviation sequence k of each section of linear groove to be machined is 1 in the machining process;
s2: to the nmSecNm of segmental processing morphologyPulseLaser processing of the layer, in particular the following steps:
s2-1: the processing control unit controls the Laser light source (1) to output pulse Laser parameters required by processing morphologyGrooveAnd the output frequency f of the pulsed lasermThe pulse laser sequentially passes through the deflection module and the focusing module and is focused on the surface of the material;
s2-2: while the pulsed laser is output, the deflection module deflects the frequency f according to the deflection modulemA deflection module control signal zeta corresponding to the k-th focus offset of each section of to-be-processed appearance in the laser processing processkDeflecting the pulsed laser light (2) passing through the deflection module by alphakThe deflected pulse laser (2) is focused on a processing surface through a focusing module, and is deflected by w according to step length in each section of processing morphology through a focuskAt the nm ofSecNm of segmental processing morphologyPulseRemoving material of the kth point of the layer for processing at intervals of the same point for multiple times;
S2-3：k＝k+1；
s2-4: judging whether the nm-th step is finishedSecNm of segmental processing morphologyPulseLaser processing of the layer:
if k < kmaxAnd the process proceeds to S2-2,
if k is equal to kmaxThen S2-5 is executed;
S2-5：k＝1，nmPulse＝nmPulse+1, go to S3;
s3: judging whether the nm-th step is finishedSecLaser processing of segment processing appearance:
if nmPulse＜NPulseThen the process proceeds to S2,
if nmPulse＝NPulseThen execution proceeds to S4;
s4: moving the laser focus to the nm by moving the working surfaceSec+1 section of the starting position of the processing morphology;
S5：nmPulse＝1，nmSec＝nmSec+1；
s6: judging whether laser processing of all processing appearances is finished:
if nmSec＜NSecThen the process proceeds to S2,
if nmSec＝NSecAnd finishing the processing.
CN201911119407.5A 2019-11-15 2019-11-15 A pulsed laser high-speed and same-point interval multiple processing system and processing method Active CN110977174B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911119407.5A CN110977174B (en) 2019-11-15 2019-11-15 A pulsed laser high-speed and same-point interval multiple processing system and processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911119407.5A CN110977174B (en) 2019-11-15 2019-11-15 A pulsed laser high-speed and same-point interval multiple processing system and processing method

Publications (2)

Publication Number Publication Date
CN110977174A CN110977174A (en) 2020-04-10
CN110977174B true CN110977174B (en) 2021-07-20

Family

ID=70084421

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201911119407.5A Active CN110977174B (en) 2019-11-15 2019-11-15 A pulsed laser high-speed and same-point interval multiple processing system and processing method

Country Status (1)

Country Link
CN (1) CN110977174B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115519243B (en) * 2022-11-25 2023-03-21 武汉铱科赛科技有限公司 Laser pulse space-time correlation positioning scanning method, device and system
CN116586789A (en) * 2023-07-13 2023-08-15 盛合晶微半导体(江阴)有限公司 Laser perforating method and preparation method of semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000301369A (en) * 1999-04-16 2000-10-31 Hitachi Ltd Laser texture processing method and processing apparatus, and magnetic disk substrate
CN102489874A (en) * 2011-11-25 2012-06-13 江苏大学 Laser pulse control card of laser micro-processing equipment and control method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1857843A (en) * 2006-04-21 2006-11-08 江苏大学 Laser surface micro molding process
AU2010275380A1 (en) * 2009-07-24 2012-02-16 Lensar, Inc. System and method for performing ladar assisted procedures on the lens of an eye
AU2014278451B2 (en) * 2013-06-09 2017-05-18 Apple Inc. Laser-formed features
CN103521920B (en) * 2013-10-16 2015-09-30 江苏大学 A kind of laser processing device without the need to blowing assist gas and method
CN105598584B (en) * 2016-02-01 2017-08-22 大族激光科技产业集团股份有限公司 Using the method in Laser Processing hole
CN108223571B (en) * 2017-12-22 2024-06-07 江苏大学 Concave-convex interval distribution micro-texture guide rail and manufacturing method thereof
CN108555464B (en) * 2018-06-29 2024-02-02 华中科技大学 Large complex curved surface dynamic focusing laser processing method and system
CN109365993B (en) * 2018-11-27 2020-11-20 江苏大学 A kind of roller laser texturing processing equipment and processing method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000301369A (en) * 1999-04-16 2000-10-31 Hitachi Ltd Laser texture processing method and processing apparatus, and magnetic disk substrate
CN102489874A (en) * 2011-11-25 2012-06-13 江苏大学 Laser pulse control card of laser micro-processing equipment and control method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
同点间隔多次激光微织构工艺研究;符永宏;《中国激光》;20151231;第1203005-1--1203005-8 *

Also Published As

Publication number Publication date
CN110977174A (en) 2020-04-10

Similar Documents

Publication Publication Date Title
TWI507264B (en) On-the-fly manipulation of spot size and cutting speed for real-time control of trench depth and width in laser operations
CN110977174B (en) A pulsed laser high-speed and same-point interval multiple processing system and processing method
CN101209514B (en) A laser online high-speed marking device based on galvanometer array
KR101939801B1 (en) Method for machining a workpiece by a laser beam, laser tool, laser machine, machine controller
KR101645562B1 (en) Laser irradiation device and laser irradiation method using thereof
CN102049956A (en) Method for producing a surface structure for a metallic press plate, endless belt or embossing roller
TW201627175A (en) Laser ablation method with patch optimization
CN109821823A (en) A CO2 laser/nanosecond pulse laser composite cleaning method
CN111438443B (en) Method for processing controllable micro-groove on surface of workpiece through laser multiple scanning ablation
CN109433745A (en) Large-scale component Diode laser linear light spot laser cleaning method
KR101989410B1 (en) Laser machining method and laser machining device
GB2438601A (en) Method and apparatus for micro-structuring a moving substrate
CN113828932A (en) Surface high-integrity micropore machining method and system based on laser hole making
US20150122783A1 (en) Laser cladding with a laser scanning head
JPH11511807A (en) Method and apparatus for increasing absorption coefficient during solid-phase surface hardening of workpiece using laser beam
JP2011121094A (en) Laser beam machining apparatus and laser beam machining method
KR20170012111A (en) Method and device for laser machining a substrate with multiple deflections of a laser radiation
CN110340527A (en) Engagement tabs sheet welding method based on galvanometer laser
CN110548991B (en) Light field distribution control method and system for laser welding of precise structural part of power battery
CN210098969U (en) A SLM high-power parts forming device
CN116371828A (en) Low-power self-adaptive curved surface laser rust removal device and rust removal method
CN103464892B (en) Laser processing device and laser processing
CN116174741A (en) Multi-laser parallel scanning 3D printing method
CN117604202B (en) Laser heat treatment system based on temperature field and control method thereof
CN201091958Y (en) A laser online high-speed marking device based on galvanometer array

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant