CN110972394B - Circuit board structure and electronic equipment - Google Patents
Circuit board structure and electronic equipment Download PDFInfo
- Publication number
- CN110972394B CN110972394B CN201911423675.6A CN201911423675A CN110972394B CN 110972394 B CN110972394 B CN 110972394B CN 201911423675 A CN201911423675 A CN 201911423675A CN 110972394 B CN110972394 B CN 110972394B
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- China
- Prior art keywords
- circuit board
- power supply
- supply pin
- back surface
- welding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The application provides a circuit board structure and electronic equipment. The circuit board structure includes: the circuit board is provided with a plurality of welding holes; the processor is arranged on the front surface of the circuit board, and a first power supply pin of the processor extends to the back surface through the corresponding welding hole; the power supply end is arranged on the front surface, and a second power supply pin of the power supply end extends to the back surface through the corresponding welding hole; and the connecting metal sheet is arranged on the back surface and used for electrically connecting the first power supply pin and the second power supply pin. This application is through setting up a connection sheetmetal at the back of circuit board and connecting treater and power supply end to form a current channel for this treater power supply, can reduce the power pressure drop, improve power stability, and, because this connection sheetmetal is located outmost, can improve heat dispersion, avoid the unable discharge of high heat that the heavy current produced.
Description
Technical Field
The application relates to the technical field of circuit boards, in particular to a circuit board structure and electronic equipment.
Background
With the increasing performance of servers, the power consumption of processors is increasing, and the power consumption of processors of main stream processor manufacturers on the market reaches 300 watts. Some specially customized processors consume up to 400 watts. The core current of the processor correspondingly reaches more than 300 amperes. The current of 300A to 400A only depends on two layers of power inner copper foils in the circuit board as the current channel of the power end of the processor, and the requirements are increasingly not met.
Therefore, the prior art has defects and needs to be improved urgently.
Disclosure of Invention
An object of the embodiment of the present application is to provide a circuit board structure and an electronic device, so as to reduce a power voltage drop and improve power supply stability.
The embodiment of the application provides a circuit board structure, includes:
the circuit board comprises a front surface and a back surface, and a plurality of welding holes are formed in the circuit board;
the processor is arranged on the front surface of the circuit board, and a first power supply pin of the processor extends to the back surface through the corresponding welding hole;
the power supply end is arranged on the front surface, and a second power supply pin of the power supply end extends to the back surface through the corresponding welding hole;
and the connecting metal sheet is arranged on the back surface and used for electrically connecting the first power supply pin and the second power supply pin.
The embodiment of the application connects the processor and the power supply end by arranging the connecting metal sheet on the back of the circuit board, thereby forming a current channel for supplying power to the processor, reducing the voltage drop of the power supply and improving the power supply stability, and because the connecting metal sheet is positioned on the outermost layer of the circuit board, the heat dissipation performance can be improved, the high heat generated by the large current cannot be discharged, and the interference of the large current to other circuit elements of the circuit board can be avoided by the outermost layer positioned on the circuit board by the connecting metal sheet.
Optionally, in the circuit board structure according to the embodiment of the present application, the connection metal sheet includes a first welding portion, a connection portion, and a second welding portion, and two ends of the connection portion are respectively connected to the first welding portion and the second welding portion;
the first welding part is welded on the back surface and is electrically connected with the first power supply pin;
the second welding part is welded on the back face and electrically connected with the second power supply pin.
Optionally, in the circuit board structure according to the embodiment of the present application, two folded portions are disposed at two ends of the connecting metal sheet, and the two folded portions form the first welding portion and the second welding portion, respectively.
Optionally, in the circuit board structure according to the embodiment of the present application, the first welding portion and/or the second welding portion are both provided with a welding-assisting hole.
The circuit board structure that this application embodiment provided can improve this connection sheet metal's connection stability through set up at two welding parts and help the welding hole.
Optionally, in the circuit board structure according to the embodiment of the present application, a distance between the connection portion and the back surface of the circuit board is 2mm to 4 mm.
The circuit board structure that this application embodiment provided sets up the distance with connecting portion and circuit board into 2mm to 4mm and can avoid the whole thickness of circuit board too big, also can be convenient for the heat dissipation of other components and parts on the circuit board.
Optionally, in the circuit board structure according to the embodiment of the present application, a protective shell for fixing the pins of the processor is further disposed on the back surface, and an opening for exposing the first power supply pin is formed in the middle of the protective shell;
the width of one end, close to the first power supply pin, of the connecting part is smaller than that of one end, far away from the first power supply pin, of the connecting part, so that the end part of the connecting part extends into the opening.
Optionally, in the circuit board structure of this embodiment of the application, a portion of the protective shell opposite to the connecting portion is provided with an inward recess, the recess is communicated with the opening, and the connecting portion passes through the recess and extends into the opening.
Optionally, in the circuit board structure of this embodiment of the present application, the protective shell is a conductive metal shell, the protective shell is electrically connected to the ground pin of the processor, and the protective shell is insulated from the connection portion.
Optionally, in the circuit board structure according to the embodiment of the present application, the connection metal sheet is coated with an insulating varnish.
In a second aspect, an embodiment of the present application further provides an electronic device, including the circuit board structure described in any one of the above.
Therefore, the circuit board structure provided by the embodiment of the application connects the processor and the power supply end by arranging the connecting metal sheet on the back of the circuit board, so that a current channel for supplying power to the processor is formed, the power supply voltage drop can be reduced, the power supply stability is improved, and the connecting metal sheet is positioned on the outermost layer of the circuit board, so that the heat dissipation performance can be improved, and the phenomenon that high heat generated by large current cannot be discharged is avoided.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.
Fig. 1 is a schematic back side structure diagram of a circuit board structure according to an embodiment of the present disclosure;
fig. 2 is a schematic partial structure diagram of a back side of a circuit board structure according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a connection metal sheet of a circuit board structure according to an embodiment of the present disclosure;
fig. 4 is another partial structural diagram of the back surface of the circuit board structure according to the embodiment of the present disclosure.
Icon: 10-circuit board, 20-processor, 30-power supply terminal, 40-connecting metal sheet, 21-protective shell, 211-opening, 212-depressed part, 31-second power supply pin, 41-first welding part, 42-connecting part and 43-second welding part.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.
In the description of the present application, it should be noted that the terms "inside", "outside", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the application usually place when using, and are only used for convenience in describing the present application and simplifying the description, but do not indicate or imply that the devices or elements that are referred to must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.
It should also be noted that, unless expressly stated or limited otherwise, the terms "disposed" and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
Referring to fig. 1 and fig. 2, fig. 1 is a schematic structural diagram of a circuit board structure according to an embodiment of the present disclosure. The circuit board structure includes: a circuit board 10, a processor 20, a power supply terminal 30 and a connecting metal sheet 40.
The circuit board 10 includes a front surface and a back surface, and a plurality of soldering holes are formed on the circuit board 10. The processor 20 is disposed on the front surface of the circuit board 10, and a first power supply pin (not shown) of the processor 20 extends to the back surface of the circuit board 10 through a corresponding soldering hole (not shown). The power supply terminal 30 is disposed on the front surface of the circuit board 10, and the second power supply pin 31 of the power supply terminal 30 extends to the back surface of the circuit board 10 through the corresponding welding hole; the connection metal sheet 40 is disposed on the back surface of the circuit board 10, and the connection metal sheet 40 is used for electrically connecting the first power supply pin and the second power supply pin 31.
Specifically, the circuit board 10 is a PCB, and two layers of inner copper foils are further disposed in the circuit board 10 to form two current channels for respectively supplying power to the processor 20. The connecting metal sheet 40 forms another current path for supplying power to the processor 10, wherein the two inner copper foils form two current paths for supplying a small current, and the connecting metal sheet 40 forms a current path for supplying a large current to the processor 20.
The processor 20 includes a processor body, a first power supply pin, a plurality of function pins, and a protective shell 21, where the processor body is located on the front surface of the circuit board 10, and the first power supply pin extends from the front surface of the circuit board 10 to the back surface of the circuit board through a corresponding soldering hole and is soldered and fixed. The plurality of functional pins extend from the front side of the circuit board 10 to the back side of the circuit board 10 through the corresponding soldering holes and are soldered, and the plurality of functional pins may be power supply pins, enable pins, control pins and other signal pins. The protective case 21 is disposed on the back surface of the circuit board 10, and covers a part or all of the functional pins of the processor 20 for fixing and protection.
The protective shell 21 is a conductive metal shell, and is electrically connected to a ground pin of the plurality of functional pins to be grounded. An opening 211 is formed in a middle region of the protective case 21 to expose the first power supply pin, and an end of the connection metal piece 40 extends into the opening 211 to be electrically connected to the first power supply pin.
The power supply terminal 30 is disposed on the front surface of the circuit board 10. The second power supply pin 31 of the power supply terminal 30 extends to the back side of the circuit board 10 through the corresponding soldering hole. It will be appreciated that the power supply terminal 30 may have a plurality of power pins for respectively supplying power to a plurality of different components on the circuit board 10.
The connecting metal sheet 40 may be a copper sheet or other metal sheet with good conductivity. The connection metal sheet 40 includes a first welding portion 41, a connection portion 42, and a second welding portion 43. Both ends of the connecting portion 42 are connected to the first welding portion 41 and the second welding portion 43, respectively. The first welding portion 41, the connecting portion 42 and the second welding portion 43 are integrally formed. Two ends of the connecting metal sheet 40 are respectively folded to form two folded portions, which are the first welding portion 41 and the second welding portion 43. The connecting portion 42 has a sheet shape.
The heights of the first soldering portion 41 and the second soldering portion 43 are respectively set to preset values, so that the connecting portion 42 is spaced from the back surface of the circuit board 10, and the spacing distance is set according to actual requirements. In the present embodiment, the connecting portion 42 is spaced from the back surface of the circuit board 10 by 2mm to 4 mm. The circuit board structure that this application embodiment provided sets up the distance with connecting portion and circuit board into 2mm to 4mm and can avoid the whole thickness of circuit board too big, also can be convenient for the heat dissipation of other components and parts on the circuit board.
In some embodiments, a plurality of welding-assisting holes are formed in the first welding portion 41 and/or the second welding portion 43, so as to enhance the welding stability.
In some embodiments, the connection metal sheet 40 is coated with an insulating paint, and particularly, the connection metal sheet 40 is coated with an insulating paint except for portions in contact with the first power supply pin and the second power supply pin.
As shown in fig. 4, in some embodiments, a portion of the upper surface of the protective case 21 opposite to the connection metal sheet 40 is provided with an inward recess 212, and the recess 212 communicates with the opening 211. The connection portion 42 of the connection metal piece 40 protrudes into the opening 211 through the recess 212. The connecting portion 42 of the connecting metal sheet 40 is not in contact with the inner sidewall of the recess 212, and the outer surface of the connecting portion 42 of the connecting metal sheet 40 is flush with the top surface of the protective case 21. The provision of the recess 212 can prevent the increase in thickness of the circuit board structure due to the provision of the connection metal piece 40, thereby saving space.
Therefore, the circuit board structure provided by the embodiment of the application connects the processor and the power supply end by arranging the connecting metal sheet on the back of the circuit board, so that a current channel for supplying power to the processor is formed, the power supply voltage drop can be reduced, the power supply stability is improved, and the connecting metal sheet is positioned on the outermost layer of the circuit board, so that the heat dissipation performance can be improved, and the phenomenon that high heat generated by large current cannot be discharged is avoided.
The application also provides an electronic device, which can be a server. The electronic device comprises the circuit board structure of any of the embodiments described above.
The above description is only an example of the present application and is not intended to limit the scope of the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (7)
1. A circuit board structure, comprising:
the circuit board comprises a front surface and a back surface, and a plurality of welding holes are formed in the circuit board;
the processor is arranged on the front surface of the circuit board, and a first power supply pin of the processor extends from the front surface to the back surface through a corresponding welding hole;
the power supply end is arranged on the front surface, and a second power supply pin of the power supply end extends from the front surface to the back surface through a corresponding welding hole;
a connection metal sheet disposed on the back surface, the connection metal sheet being used to electrically connect the first power supply pin and the second power supply pin; the connecting metal sheet comprises a first welding part, a connecting part and a second welding part, and two ends of the connecting part are respectively connected with the first welding part and the second welding part;
the first welding part is welded on the back surface and is electrically connected with the first power supply pin;
the second welding part is welded on the back surface and is electrically connected with the second power supply pin; the back surface is also provided with a protective shell for fixing the pins of the processor, and the middle part of the protective shell is provided with an opening for exposing the first power supply pin; the width of one end, close to the first power supply pin, of the connecting part is smaller than that of one end, far away from the first power supply pin, of the connecting part, so that the end part of the connecting part extends into the opening; the protective housing with the position that connecting portion are relative is provided with inward depressed part, the depressed part with the opening intercommunication, connecting portion pass the depressed part stretches into in the opening.
2. The circuit board structure according to claim 1, wherein two folded portions are provided at both ends of the connection metal sheet, and the two folded portions form the first soldering portion and the second soldering portion, respectively.
3. The circuit board structure of claim 1, wherein the first welding part and/or the second welding part are provided with welding-assisting holes.
4. The circuit board structure according to claim 1, wherein the connection portion is spaced from the back surface of the circuit board by a distance of 2mm to 4 mm.
5. The circuit board structure according to claim 1, wherein the protective shell is a conductive metal shell, the protective shell is electrically connected to a ground pin of the processor, and the protective shell is insulated from the connection portion.
6. The circuit board structure according to claim 1, wherein the connection metal sheet is coated with an insulating varnish.
7. An electronic device, characterized in that it comprises a circuit-board structure according to any one of claims 1-6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911423675.6A CN110972394B (en) | 2019-12-31 | 2019-12-31 | Circuit board structure and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911423675.6A CN110972394B (en) | 2019-12-31 | 2019-12-31 | Circuit board structure and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110972394A CN110972394A (en) | 2020-04-07 |
| CN110972394B true CN110972394B (en) | 2021-03-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911423675.6A Active CN110972394B (en) | 2019-12-31 | 2019-12-31 | Circuit board structure and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110972394B (en) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU3021592A (en) * | 1991-12-20 | 1993-06-24 | International Computers Limited | Power distribution arrangement |
| US20060050494A1 (en) * | 2004-09-03 | 2006-03-09 | Cotek Electronic Ind. Co. Ltd. | DC-AC power inverter |
| CN201042005Y (en) * | 2007-06-12 | 2008-03-26 | 武汉中原电子集团有限公司 | Center control module for narrow-band high-speed broadcasting station |
| CN101335442A (en) * | 2007-06-27 | 2008-12-31 | 株式会社Tant | Wiring board and bus bar segments to be used therefor |
| CN102254895A (en) * | 2010-05-21 | 2011-11-23 | 株式会社东芝 | Semiconductor device, semiconductor unit, and power semiconductor device |
| EP2991461A1 (en) * | 2014-08-13 | 2016-03-02 | Fujitsu Limited | Circuit board and electronic apparatus |
| CN105472879A (en) * | 2016-01-12 | 2016-04-06 | 深圳市立洋光电子股份有限公司 | Auxiliary welding structure of ALC PCB and preparation technology of auxiliary welding structure |
| CN106793478A (en) * | 2017-03-31 | 2017-05-31 | 三禾电器(福建)有限公司 | A kind of circuit board with window |
| US20180343748A1 (en) * | 2017-05-23 | 2018-11-29 | Fujitsu Limited | Substrate on which electronic component is soldered, electronic device, method for soldering electronic component |
| CN110036700A (en) * | 2016-12-14 | 2019-07-19 | 株式会社自动网络技术研究所 | Circuit structure |
| CN110381668A (en) * | 2019-08-08 | 2019-10-25 | 宁波海贝电器有限公司 | A kind of novel timer module |
-
2019
- 2019-12-31 CN CN201911423675.6A patent/CN110972394B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU3021592A (en) * | 1991-12-20 | 1993-06-24 | International Computers Limited | Power distribution arrangement |
| US20060050494A1 (en) * | 2004-09-03 | 2006-03-09 | Cotek Electronic Ind. Co. Ltd. | DC-AC power inverter |
| CN201042005Y (en) * | 2007-06-12 | 2008-03-26 | 武汉中原电子集团有限公司 | Center control module for narrow-band high-speed broadcasting station |
| CN101335442A (en) * | 2007-06-27 | 2008-12-31 | 株式会社Tant | Wiring board and bus bar segments to be used therefor |
| CN102254895A (en) * | 2010-05-21 | 2011-11-23 | 株式会社东芝 | Semiconductor device, semiconductor unit, and power semiconductor device |
| EP2991461A1 (en) * | 2014-08-13 | 2016-03-02 | Fujitsu Limited | Circuit board and electronic apparatus |
| CN105472879A (en) * | 2016-01-12 | 2016-04-06 | 深圳市立洋光电子股份有限公司 | Auxiliary welding structure of ALC PCB and preparation technology of auxiliary welding structure |
| CN110036700A (en) * | 2016-12-14 | 2019-07-19 | 株式会社自动网络技术研究所 | Circuit structure |
| CN106793478A (en) * | 2017-03-31 | 2017-05-31 | 三禾电器(福建)有限公司 | A kind of circuit board with window |
| US20180343748A1 (en) * | 2017-05-23 | 2018-11-29 | Fujitsu Limited | Substrate on which electronic component is soldered, electronic device, method for soldering electronic component |
| CN110381668A (en) * | 2019-08-08 | 2019-10-25 | 宁波海贝电器有限公司 | A kind of novel timer module |
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| Publication number | Publication date |
|---|---|
| CN110972394A (en) | 2020-04-07 |
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