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CN110931515B - Array substrate, display panel and display device - Google Patents

Array substrate, display panel and display device Download PDF

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CN110931515B
CN110931515B CN201911240515.8A CN201911240515A CN110931515B CN 110931515 B CN110931515 B CN 110931515B CN 201911240515 A CN201911240515 A CN 201911240515A CN 110931515 B CN110931515 B CN 110931515B
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metal layer
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array substrate
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CN110931515A (en
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王宝男
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Wuhan Tianma Microelectronics Co Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441Interconnections, e.g. scanning lines
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/481Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs integrated with passive devices, e.g. auxiliary capacitors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices

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Abstract

本发明提供一种阵列基板、显示面板以及显示装置,阵列基板包括显示区和台阶区;衬底;多条数据线,位于所述显示区;所述多条数据线沿第二方向延伸并沿第一方向排列;以及多条扇出走线,位于所述台阶区,所述扇出走线与所述数据线电连接,用于向所述数据线提供数据信号;所述多条扇出走线包括位于第一金属层的第一扇出走线、位于第二金属层的第二扇出走线和位于第三金属层的第三扇出走线;在垂直于所述衬底的方向上,所述第二金属层位于所述第一金属层远离所述衬底的一侧,所述第三金属层位于所述第二金属层远离所述第一金属层的一侧,且所述第一扇出走线与所述第二扇出走线在所述衬底的垂直投影不交叠。本发明以实现减小边框,增加占屏比。

Figure 201911240515

The invention provides an array substrate, a display panel and a display device. The array substrate includes a display area and a stepped area; a substrate; a plurality of data lines located in the display area; the plurality of data lines extend along a second direction and extend along the arrayed in the first direction; and a plurality of fan-out traces located in the step area, the fan-out traces are electrically connected to the data lines, and used for providing data signals to the data lines; the plurality of fan-out traces include: The first fan-out trace located in the first metal layer, the second fan-out trace located in the second metal layer, and the third fan-out trace located in the third metal layer; in the direction perpendicular to the substrate, the first fan-out trace is The second metal layer is located on the side of the first metal layer away from the substrate, the third metal layer is located on the side of the second metal layer away from the first metal layer, and the first fan out The line does not overlap with the vertical projection of the second fan-out trace on the substrate. The present invention can reduce the frame and increase the screen ratio.

Figure 201911240515

Description

一种阵列基板、显示面板以及显示装置Array substrate, display panel and display device

技术领域technical field

本发明涉及显示技术领域,尤其涉及一种阵列基板、显示面板以及显示装置。The present invention relates to the field of display technology, and in particular, to an array substrate, a display panel and a display device.

背景技术Background technique

随着科学技术的发展和社会的进步,人们对于信息的交流和传递等方面的依赖程度日益增加,而显示装置作为信息交换和传递的主要载体和物质基础,现已成为众多科学家研究的热点。With the development of science and technology and the progress of society, people's dependence on the exchange and transmission of information is increasing day by day. As the main carrier and material basis for information exchange and transmission, display devices have become the research focus of many scientists.

现在,高占屏比窄边框的显示面板以及显示装置越来成为一种趋势。但是,台阶区需要设置众多的扇出走线,导致台阶区的宽度无法缩减。Now, display panels and display devices with a high screen-to-body ratio and narrow bezels are increasingly becoming a trend. However, many fan-out traces need to be set in the step area, so that the width of the step area cannot be reduced.

发明内容SUMMARY OF THE INVENTION

本发明提供一种阵列基板、显示面板以及显示装置,以实现减小边框,增加占屏比。The present invention provides an array substrate, a display panel and a display device, so as to reduce the frame and increase the screen ratio.

第一方面,本发明实施例提供一种阵列基板,包括显示区和台阶区;In a first aspect, an embodiment of the present invention provides an array substrate, including a display area and a stepped area;

衬底;substrate;

多条数据线,位于所述显示区;所述多条数据线沿第二方向延伸并沿第一方向排列;a plurality of data lines located in the display area; the plurality of data lines extend along the second direction and are arranged along the first direction;

以及多条扇出走线,位于所述台阶区,所述扇出走线与所述数据线电连接,用于向所述数据线提供数据信号;所述多条扇出走线包括位于第一金属层的第一扇出走线、位于第二金属层的第二扇出走线和位于第三金属层的第三扇出走线;在垂直于所述衬底的方向上,所述第二金属层位于所述第一金属层远离所述衬底的一侧,所述第三金属层位于所述第二金属层远离所述第一金属层的一侧,且所述第一扇出走线与所述第二扇出走线在所述衬底的垂直投影不交叠。and a plurality of fan-out traces located in the step area, the fan-out traces are electrically connected to the data lines, and used for providing data signals to the data lines; the plurality of fan-out traces include a first metal layer The first fan-out trace, the second fan-out trace located in the second metal layer, and the third fan-out trace located in the third metal layer; in the direction perpendicular to the substrate, the second metal layer is located in the The first metal layer is located on a side away from the substrate, the third metal layer is located at a side of the second metal layer away from the first metal layer, and the first fan-out trace is connected to the first metal layer. The vertical projections of the two fan-out traces on the substrate do not overlap.

第二方面,本发明实施例提供一种显示面板,包括第一方面所述的阵列基板。In a second aspect, an embodiment of the present invention provides a display panel, including the array substrate described in the first aspect.

第三方面,本发明实施例提供一种显示装置,包括第二方面所述的显示面板。In a third aspect, an embodiment of the present invention provides a display device, including the display panel described in the second aspect.

本发明实施例提供的阵列基板中,多条扇出走线分别设置于第一金属层、第二金属层和第三金属层,相对于将多条扇出走线设置于一个金属层或者两个金属层而言,可以减小相邻两条扇出走线之间的间距,从而减小扇出走线在台阶区中占据面积,减小台阶区的宽度,减小边框,并增加占屏比。另外,设置第一扇出走线与第二扇出走线不交叠,还可以在减小边框的基础上,防止第一扇出走线与第二扇出走线产生交叠电容,从而防止第一扇出走线与第二扇出走线负载的增加。In the array substrate provided by the embodiment of the present invention, a plurality of fan-out traces are respectively disposed on the first metal layer, the second metal layer, and the third metal layer, compared to the fact that the plurality of fan-out traces are disposed in one metal layer or two metals In terms of layers, the spacing between two adjacent fan-out traces can be reduced, thereby reducing the area occupied by the fan-out traces in the step area, reducing the width of the step area, reducing the frame, and increasing the screen-to-screen ratio. In addition, setting the first fan-out wiring and the second fan-out wiring to not overlap can also prevent the first fan-out wiring and the second fan-out wiring from generating overlapping capacitance on the basis of reducing the frame, thereby preventing the first fan-out wiring Increased load on outgoing traces and second fanout traces.

附图说明Description of drawings

图1为本发明实施例提供的一种阵列基板的俯视结构示意图;FIG. 1 is a schematic top-view structural diagram of an array substrate according to an embodiment of the present invention;

图2为图1中S1区域的放大结构示意图;Fig. 2 is the enlarged structural schematic diagram of S1 area in Fig. 1;

图3为沿图2中AA’方向的剖面结构示意图;Fig. 3 is a schematic cross-sectional structure along the AA' direction in Fig. 2;

图4为沿图1中BB’方向的剖面结构示意图;Fig. 4 is the cross-sectional structure schematic diagram along BB' direction in Fig. 1;

图5为本发明实施例提供的另一种阵列基板的剖面结构示意图;FIG. 5 is a schematic cross-sectional structure diagram of another array substrate according to an embodiment of the present invention;

图6为本发明实施例提供的另一种阵列基板的俯视结构示意图;FIG. 6 is a schematic top-view structure diagram of another array substrate according to an embodiment of the present invention;

图7为本发明实施例提供的另一种阵列基板的俯视结构示意图;FIG. 7 is a schematic top-view structural diagram of another array substrate according to an embodiment of the present invention;

图8为本发明实施例提供的一种阵列基板中扇出走线的俯视结构示意图;8 is a schematic top-view structural diagram of a fan-out wiring in an array substrate according to an embodiment of the present invention;

图9为本发明实施例提供的另一种阵列基板中扇出走线的俯视结构示意图;9 is a schematic top-view structural diagram of a fan-out trace in another array substrate according to an embodiment of the present invention;

图10为本发明实施例提供的另一种阵列基板的剖面结构示意图;FIG. 10 is a schematic cross-sectional structure diagram of another array substrate according to an embodiment of the present invention;

图11为本发明实施例提供的另一种阵列基板的剖面结构示意图;FIG. 11 is a schematic cross-sectional structure diagram of another array substrate according to an embodiment of the present invention;

图12为本发明实施例提供的另一种阵列基板的俯视结构示意图;FIG. 12 is a schematic top-view structure diagram of another array substrate according to an embodiment of the present invention;

图13为本发明实施例提供的另一种阵列基板的俯视结构示意图;FIG. 13 is a schematic top-view structural diagram of another array substrate according to an embodiment of the present invention;

图14为本发明实施例提供的一种显示面板的结构示意图;FIG. 14 is a schematic structural diagram of a display panel according to an embodiment of the present invention;

图15为本发明实施例提供的一种显示装置的结构示意图。FIG. 15 is a schematic structural diagram of a display device according to an embodiment of the present invention.

具体实施方式Detailed ways

下面结合附图和实施例对本发明作进一步的详细说明。可以理解的是,此处所描述的具体实施例仅仅用于解释本发明,而非对本发明的限定。另外还需要说明的是,为了便于描述,附图中仅示出了与本发明相关的部分而非全部结构。The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, the drawings only show some but not all structures related to the present invention.

图1为本发明实施例提供的一种阵列基板的俯视结构示意图,图2为图1中S1区域的放大结构示意图,图3为沿图2中AA’方向的剖面结构示意图,图4为沿图1中BB’方向的剖面结构示意图,参考图1、图2、图3和图4,阵列基板包括显示区A1和台阶区A2。阵列基板包括衬底10、多条数据线22以及多条扇出走线30。多条数据线22位于显示区A1,多条数据线22沿第二方向延伸并沿第一方向排列。多条扇出走线30位于台阶区A2,扇出走线30与数据线22电连接,用于向数据线22提供数据信号。多条扇出走线30包括位于第一金属层M1的第一扇出走线31、位于第二金属层M2的第二扇出走线32和位于第三金属层M3的第三扇出走线33。在垂直于衬底10的方向上,第二金属层M2位于第一金属层M1远离衬底10的一侧,第三金属层M3位于第二金属层M2远离第一金属层M1的一侧,且第一扇出走线31与第二扇出走线32在衬底10的垂直投影不交叠。1 is a schematic top view of an array substrate according to an embodiment of the present invention, FIG. 2 is an enlarged schematic view of the S1 area in FIG. 1 , FIG. 3 is a schematic cross-sectional structure along the direction AA′ in FIG. 2 , and FIG. A schematic cross-sectional structure diagram in the direction of BB′ in FIG. 1 , referring to FIGS. 1 , 2 , 3 and 4 , the array substrate includes a display area A1 and a step area A2 . The array substrate includes a substrate 10 , a plurality of data lines 22 and a plurality of fan-out traces 30 . The plurality of data lines 22 are located in the display area A1, and the plurality of data lines 22 extend along the second direction and are arranged along the first direction. A plurality of fan-out traces 30 are located in the step area A2 , and the fan-out traces 30 are electrically connected to the data lines 22 for providing data signals to the data lines 22 . The plurality of fan-out traces 30 include a first fan-out trace 31 located in the first metal layer M1, a second fan-out trace 32 located in the second metal layer M2, and a third fan-out trace 33 located in the third metal layer M3. In the direction perpendicular to the substrate 10, the second metal layer M2 is located on the side of the first metal layer M1 away from the substrate 10, the third metal layer M3 is located on the side of the second metal layer M2 away from the first metal layer M1, Moreover, the vertical projections of the first fan-out traces 31 and the second fan-out traces 32 on the substrate 10 do not overlap.

需要说明的是,实际的阵列基板中包含大量的数据线22以及大量的扇出走线30,图1中所示数据线22以及扇出走线30的数量仅为一种示意,并非对本发明实施例的限定。It should be noted that the actual array substrate includes a large number of data lines 22 and a large number of fan-out lines 30 , and the numbers of data lines 22 and fan-out lines 30 shown in FIG. limit.

本发明实施例提供的阵列基板中,多条扇出走线分别设置于第一金属层、第二金属层和第三金属层,相对于将多条扇出走线设置于一个金属层或者两个金属层而言,可以减小相邻两条扇出走线之间的间距,从而减小扇出走线在台阶区中占据面积,减小台阶区的宽度,减小边框,并增加占屏比。另外,设置第一扇出走线与第二扇出走线不交叠,还可以在减小边框的基础上,防止第一扇出走线与第二扇出走线产生交叠电容,从而防止第一扇出走线与第二扇出走线负载的增加。In the array substrate provided by the embodiment of the present invention, a plurality of fan-out traces are respectively disposed on the first metal layer, the second metal layer, and the third metal layer, compared to the fact that the plurality of fan-out traces are disposed in one metal layer or two metals In terms of layers, the spacing between two adjacent fan-out traces can be reduced, thereby reducing the area occupied by the fan-out traces in the step area, reducing the width of the step area, reducing the frame, and increasing the screen-to-screen ratio. In addition, setting the first fan-out wiring and the second fan-out wiring to not overlap can also prevent the first fan-out wiring and the second fan-out wiring from generating overlapping capacitance on the basis of reducing the frame, thereby preventing the first fan-out wiring Increased load on outgoing traces and second fanout traces.

可选地,参考图1、图3和图4,阵列基板还包括多条扫描线21,多条扫描线21位于显示区A1,多条扫描线21沿第一方向延伸并沿第二方向排列。扫描线21位于第一金属层M1,第二金属层M2位于第一金属层M1与数据线22所在膜层之间。本发明实施例中,第一扇出走线31与扫描线21同层,第二扇出走线32位于第一扇出走线31与数据线22所在膜层之间,第一扇出走线31与第二扇出走线32之间的间距较近,因此尤其需要设置第一扇出走线31与第二扇出走线32不交叠,防止第一扇出走线31与第二扇出走线32产生交叠电容。Optionally, referring to FIG. 1 , FIG. 3 and FIG. 4 , the array substrate further includes a plurality of scan lines 21 , the plurality of scan lines 21 are located in the display area A1 , and the plurality of scan lines 21 extend along the first direction and are arranged along the second direction . The scan lines 21 are located in the first metal layer M1, and the second metal layer M2 is located between the first metal layer M1 and the film layer where the data lines 22 are located. In the embodiment of the present invention, the first fan-out traces 31 and the scan lines 21 are on the same layer, the second fan-out traces 32 are located between the first fan-out traces 31 and the film layer where the data lines 22 are located, and the first fan-out traces 31 and the The distance between the two fan-out traces 32 is relatively close, so it is especially necessary to set the first fan-out trace 31 and the second fan-out trace 32 to not overlap to prevent the first fan-out trace 31 and the second fan-out trace 32 from overlapping capacitance.

可选地,参考图3和图4,第一金属层M1与第二金属层M2采用相同的材料。则位于第一金属层M1的第一扇出走线31与位于第二金属层M2的第二扇出走线32采用相同的材料,第一扇出走线31与第二扇出走线32具有相同的电阻率,从而减小了第一扇出走线31与第二扇出走线32上的压降之差,使得在第一扇出走线31与第二扇出走线32上传输的数据信号具有相同或者近似程度的衰减,以保证显示的均一性。Optionally, referring to FIG. 3 and FIG. 4 , the first metal layer M1 and the second metal layer M2 use the same material. Then the first fan-out traces 31 located in the first metal layer M1 and the second fan-out traces 32 located in the second metal layer M2 are made of the same material, and the first fan-out traces 31 and the second fan-out traces 32 have the same resistance Therefore, the difference between the voltage drops on the first fan-out trace 31 and the second fan-out trace 32 is reduced, so that the data signals transmitted on the first fan-out trace 31 and the second fan-out trace 32 are the same or similar degree of attenuation to ensure display uniformity.

可选地,参考图2和图3,第一扇出走线31的线宽与第二扇出走线32的线宽相等。第一扇出走线31的线宽为第一扇出走线31在垂直于其延伸方向上的宽度,第二扇出走线32的线宽为第二扇出走线32在垂直于其延伸方向上的宽度。本发明实施例中,第一扇出走线31与第二扇出走线32采用相同的材料,且第一扇出走线31的线宽与第二扇出走线32的线宽相等,从而进一步地减小了第一扇出走线31与第二扇出走线32上的压降之差,使得在第一扇出走线31与第二扇出走线32上传输的数据信号具有相同或者近似程度的衰减,以保证显示的均一性。Optionally, referring to FIG. 2 and FIG. 3 , the line width of the first fan-out wiring 31 is equal to the line width of the second fan-out wiring 32 . The line width of the first fan-out trace 31 is the width of the first fan-out trace 31 perpendicular to its extension direction, and the line width of the second fan-out trace 32 is the width of the second fan-out trace 32 perpendicular to its extension direction. width. In the embodiment of the present invention, the first fan-out trace 31 and the second fan-out trace 32 are made of the same material, and the line width of the first fan-out trace 31 is equal to that of the second fan-out trace 32, thereby further reducing the The difference between the voltage drops on the first fan-out trace 31 and the second fan-out trace 32 is reduced, so that the data signals transmitted on the first fan-out trace 31 and the second fan-out trace 32 have the same or similar degree of attenuation, to ensure display uniformity.

示例性地,参考图1,多条扫描线21与多条数据线22交叉出多个子像素110,多个子像素110在显示区A1中呈阵列排布。扇出走线30的一端与数据线22电连接,扇出走线30的另一端与驱动芯片40电连接,驱动芯片40绑定于阵列基板的台阶区A2。驱动芯片40通过扇出走线30向数据线22提供数据信号。1 , a plurality of scan lines 21 and a plurality of data lines 22 intersect to form a plurality of sub-pixels 110, and the plurality of sub-pixels 110 are arranged in an array in the display area A1. One end of the fan-out trace 30 is electrically connected to the data line 22 , and the other end of the fan-out trace 30 is electrically connected to the driver chip 40 , and the driver chip 40 is bound to the step area A2 of the array substrate. The driver chip 40 provides data signals to the data lines 22 through the fan-out traces 30 .

示例性地,图1、图2、参考图3和图4,阵列基板还包括沿远离衬底10依次叠层设置的缓冲层11、栅极绝缘层12、第一介电层13、第二介电层14、第一有机层15、平坦化层16和像素限定层17。阵列基板还包括像素驱动电路和发光单元70,像素驱动电路与发光单元70电连接,像素驱动电路用于为发光单元70提供驱动电压或者驱动电流。像素驱动电路包括薄膜晶体管50和存储电容60,薄膜晶体管50包括源极51、栅极52、半导体层53和漏极54。存储电容60包括第一极板61和第二极板62。发光单元70包括第一电极71、发光功能层72和第二电极73。发光功能层72位于第一电极71与第二电极73之间,且第一电极71注入的空穴与第二电极73注入的电子在发光功能层72中结合形成激子,激子跃迁产生光子以使发光单元70发光。扫描线21、栅极52与第一极板61位于第一金属层M1,第一金属层M1位于栅极绝缘层12与第一介电层13之间。第二极板62位于第二金属层M2。数据线22、源极51和漏极54位于同一层,数据线22位于第二金属层M2远离衬底10一侧。数据线22可以通过过孔与第一扇出走线31电连接,数据线22可以通过过孔与第二扇出走线32电连接。Exemplarily, as shown in FIGS. 1 , 2 , and referring to FIGS. 3 and 4 , the array substrate further includes a buffer layer 11 , a gate insulating layer 12 , a first dielectric layer 13 , a second The dielectric layer 14 , the first organic layer 15 , the planarization layer 16 and the pixel defining layer 17 . The array substrate further includes a pixel driving circuit and a light-emitting unit 70 . The pixel driving circuit is electrically connected to the light-emitting unit 70 , and the pixel driving circuit is used to provide driving voltage or driving current for the light-emitting unit 70 . The pixel driving circuit includes a thin film transistor 50 and a storage capacitor 60 , and the thin film transistor 50 includes a source electrode 51 , a gate electrode 52 , a semiconductor layer 53 and a drain electrode 54 . The storage capacitor 60 includes a first electrode plate 61 and a second electrode plate 62 . The light emitting unit 70 includes a first electrode 71 , a light emitting functional layer 72 and a second electrode 73 . The light-emitting functional layer 72 is located between the first electrode 71 and the second electrode 73, and the holes injected by the first electrode 71 and the electrons injected by the second electrode 73 combine to form excitons in the light-emitting functional layer 72, and the excitons transition to generate photons so that the light emitting unit 70 emits light. The scan line 21 , the gate electrode 52 and the first electrode plate 61 are located on the first metal layer M1 , and the first metal layer M1 is located between the gate insulating layer 12 and the first dielectric layer 13 . The second electrode plate 62 is located on the second metal layer M2. The data line 22 , the source electrode 51 and the drain electrode 54 are located on the same layer, and the data line 22 is located on the side of the second metal layer M2 away from the substrate 10 . The data line 22 may be electrically connected to the first fan-out line 31 through a via hole, and the data line 22 may be electrically connected to the second fan-out line 32 through a via hole.

可选地,参考图4,第三金属层M3位于数据线22所在膜层远离衬底10一侧。因此,第三扇出走线33位于数据线22所在膜层远离衬底10一侧,第三扇出走线33与第一扇出走线31以及第二扇出走线32的距离较远,避免了第三扇出走线33对第一扇出走线31以及第二扇出走线32的不良电性影响。Optionally, referring to FIG. 4 , the third metal layer M3 is located on the side of the film layer where the data lines 22 are located away from the substrate 10 . Therefore, the third fan-out trace 33 is located on the side of the film layer where the data line 22 is located away from the substrate 10 , and the distance between the third fan-out trace 33 and the first fan-out trace 31 and the second fan-out trace 32 is relatively long, which avoids the need for the first fan-out trace 31 and the second fan-out trace 32 The adverse electrical effects of the three fan-out traces 33 on the first fan-out trace 31 and the second fan-out trace 32 .

示例性地,参考图4,第三扇出走线33位于数据线22所在膜层远离衬底10一侧,第三扇出走线33与数据线22通过过孔电连接。Exemplarily, referring to FIG. 4 , the third fan-out traces 33 are located on the side of the film layer where the data lines 22 are located away from the substrate 10 , and the third fan-out traces 33 are electrically connected to the data lines 22 through vias.

可选地,参考图4,阵列基板还包括第一绝缘层81和第二绝缘层82,第一绝缘层81位于第一金属层M1与第二金属层M2之间,第二绝缘层82位于第三金属层M3与数据线22所在膜层之间,第二绝缘层82的厚度大于第一绝缘层81的厚度。本发明实施例中,第二绝缘层82的厚度大于第一绝缘层81的厚度,第二绝缘层82具有较大的厚度,从而在垂直于衬底10所在平面的方向上,第三扇出走线33与数据线22的距离较大,第三扇出走线33与第一扇出走线31以及第二扇出走线32的距离较远,进一步地避免了第三扇出走线33对第一扇出走线31以及第二扇出走线32的不良电性影响。Optionally, referring to FIG. 4 , the array substrate further includes a first insulating layer 81 and a second insulating layer 82 , the first insulating layer 81 is located between the first metal layer M1 and the second metal layer M2 , and the second insulating layer 82 is located between the first metal layer M1 and the second metal layer M2 . Between the third metal layer M3 and the film layer where the data lines 22 are located, the thickness of the second insulating layer 82 is greater than that of the first insulating layer 81 . In the embodiment of the present invention, the thickness of the second insulating layer 82 is greater than the thickness of the first insulating layer 81, and the second insulating layer 82 has a larger thickness, so that the third fan out in the direction perpendicular to the plane of the substrate 10 The distance between the line 33 and the data line 22 is relatively large, and the distance between the third fan-out routing 33 and the first fan-out routing 31 and the second fan-out routing 32 is relatively far, which further prevents the third fan-out routing 33 from affecting the first fan-out routing. The adverse electrical effects of the outgoing traces 31 and the second fan out traces 32 .

示例性地,参考图4,第一绝缘层81包括第一介电层13,第一绝缘层81为无机层。第二绝缘层82包括第一有机层15。第一有机层15的厚度大于第一介电层13的厚度。第一金属层M1与第二金属层M2之间间隔有第一介电层13,第二金属层M2与第三金属层M3之间间隔有第二介电层14和第一有机层15。在垂直于衬底10所在平面的方向上,第三金属层M3与第一金属层M1之间的间距较远,第三金属层M3与第二金属层M2之间的间距较远。故而,第三扇出走线33与第一扇出走线31以及第二扇出走线32的距离较远。For example, referring to FIG. 4 , the first insulating layer 81 includes the first dielectric layer 13 , and the first insulating layer 81 is an inorganic layer. The second insulating layer 82 includes the first organic layer 15 . The thickness of the first organic layer 15 is greater than that of the first dielectric layer 13 . A first dielectric layer 13 is spaced between the first metal layer M1 and the second metal layer M2, and a second dielectric layer 14 and a first organic layer 15 are spaced between the second metal layer M2 and the third metal layer M3. In a direction perpendicular to the plane of the substrate 10, the distance between the third metal layer M3 and the first metal layer M1 is farther, and the distance between the third metal layer M3 and the second metal layer M2 is farther. Therefore, the distance between the third fan-out trace 33 and the first fan-out trace 31 and the second fan-out trace 32 is relatively long.

图5为本发明实施例提供的另一种阵列基板的剖面结构示意图,参考图5,第二绝缘层82包括平坦化层16和像素限定层17,平坦化层16位于像素限定层17与第三金属层M3之间。本发明实施例中,第二绝缘层82包括平坦化层16和像素限定层17,从而进一步地增加了第二绝缘层82的厚度,增加第三扇出走线33与第一扇出走线31的距离,以及增加第三扇出走线33与第二扇出走线32的距离,进一步地避免了第三扇出走线33对第一扇出走线31以及第二扇出走线32的不良电性影响。FIG. 5 is a schematic cross-sectional structure diagram of another array substrate provided by an embodiment of the present invention. Referring to FIG. 5 , the second insulating layer 82 includes a planarization layer 16 and a pixel defining layer 17 , and the planarizing layer 16 is located between the pixel defining layer 17 and the second insulating layer 17 . between the three metal layers M3. In the embodiment of the present invention, the second insulating layer 82 includes the planarization layer 16 and the pixel defining layer 17 , thereby further increasing the thickness of the second insulating layer 82 and increasing the distance between the third fan-out trace 33 and the first fan-out trace 31 . distance, and increasing the distance between the third fan-out trace 33 and the second fan-out trace 32 , further avoids the adverse electrical influence of the third fan-out trace 33 on the first fan-out trace 31 and the second fan-out trace 32 .

示例性地,参考图5,第三扇出走线33与第二电极73同层并采用同种材料,第三扇出走线33与第二电极73可以在同一工艺中形成,从而节省了工艺制程。Exemplarily, referring to FIG. 5 , the third fan-out traces 33 and the second electrodes 73 are in the same layer and use the same material, and the third fan-out traces 33 and the second electrodes 73 can be formed in the same process, thereby saving the process. .

图6为本发明实施例提供的另一种阵列基板的俯视结构示意图,参考图6,显示区A1包括多个阵列排布的像素100,像素100包括多个子像素110,多个子像素110包括第一子像素101、第二子像素102和第三子像素103。沿第二方向,与多个第一子像素101以及多个第二子像素102电连接的数据线22为第一数据线221,与多个第三子像素103电连接的数据线22为第二数据线222。一条第一数据线221与一条第一扇出走线31或者一条第二扇出走线32电连接,一条第二数据线222与一条第三扇出走线33电连接。本发明实施例中,部分第一子像素101电连接至第一扇出走线31,另一部分第一子像素101电连接至第二扇出走线32,类似地,部分第二子像素102电连接至第一扇出走线31,另一部分第二子像素102电连接至第二扇出走线32,位于第一金属层M1的第一扇出走线31与位于第二金属层M2的第二扇出走线32采用相同的材料,第一扇出走线31与第二扇出走线32具有相同的电阻率,从而减小了第一扇出走线31与第二扇出走线32上的压降之差,使得在第一扇出走线31与第二扇出走线32上传输的数据信号具有相同或者近似程度的衰减,使得接收第一扇出走线31传输数据信号的第一子像素101与接收第二扇出走线32传输该数据信号的第一子像素101具有相同或者相近的发光亮度,使得接收第一扇出走线31传输数据信号的第二子像素102与接收第二扇出走线32传输该数据信号的第二子像素102具有相同或者相近的发光亮度,以保证显示的均一性。6 is a schematic top-view structure diagram of another array substrate provided by an embodiment of the present invention. Referring to FIG. 6 , a display area A1 includes a plurality of pixels 100 arranged in an array, the pixel 100 includes a plurality of sub-pixels 110 , and the plurality of sub-pixels 110 includes a first A sub-pixel 101 , a second sub-pixel 102 and a third sub-pixel 103 . Along the second direction, the data lines 22 electrically connected to the plurality of first sub-pixels 101 and the plurality of second sub-pixels 102 are the first data lines 221, and the data lines 22 electrically connected to the plurality of third sub-pixels 103 are the first data lines 221. Two data lines 222 . A first data line 221 is electrically connected with a first fan-out line 31 or a second fan-out line 32 , and a second data line 222 is electrically connected with a third fan-out line 33 . In the embodiment of the present invention, some of the first sub-pixels 101 are electrically connected to the first fan-out traces 31 , and another part of the first sub-pixels 101 are electrically connected to the second fan-out traces 32 . Similarly, some of the second sub-pixels 102 are electrically connected to each other. To the first fan-out trace 31, another part of the second sub-pixel 102 is electrically connected to the second fan-out trace 32, the first fan-out trace 31 located in the first metal layer M1 and the second fan-out trace located in the second metal layer M2 The wire 32 is made of the same material, and the first fan-out wire 31 and the second fan-out wire 32 have the same resistivity, thereby reducing the voltage drop difference between the first fan-out wire 31 and the second fan-out wire 32, Make the data signals transmitted on the first fan-out trace 31 and the second fan-out trace 32 have the same or similar degree of attenuation, so that the first sub-pixel 101 that receives the data signal transmitted by the first fan-out trace 31 and the second fan-out The first sub-pixel 101 that transmits the data signal from the wire 32 has the same or similar luminance, so that the second sub-pixel 102 that receives the data signal from the first fan-out wire 31 and the second sub-pixel 102 that receives the second fan-out wire 32 transmit the data signal The second sub-pixels 102 have the same or similar luminous brightness to ensure display uniformity.

可选地,参考图6,像素100包括2*3排列的多个子像素110,第一方向上排列的一行子像素110包括第一子像素101、第三子像素103和第二子像素102,第一方向上排列的另一行子像素110包括第二子像素102、第三子像素103和第一子像素101。Optionally, referring to FIG. 6 , the pixel 100 includes a plurality of sub-pixels 110 arranged in a 2*3 arrangement, and a row of sub-pixels 110 arranged in the first direction includes a first sub-pixel 101, a third sub-pixel 103 and a second sub-pixel 102, Another row of sub-pixels 110 arranged in the first direction includes a second sub-pixel 102 , a third sub-pixel 103 and a first sub-pixel 101 .

图7为本发明实施例提供的另一种阵列基板的俯视结构示意图,参考图7,一条第一数据线221与一条第一扇出走线31或者一条第二扇出走线32电连接,一条第二数据线222与一条第三扇出走线33电连接。像素100包括2*4排列的多个子像素110,第一方向上排列的一行子像素110包括第一子像素101、第三子像素103、第二子像素102和第三子像素103,第一方向上排列的另一行子像素110包括第二子像素102、第三子像素103、第一子像素101和第三子像素103。7 is a schematic top-view structure diagram of another array substrate provided by an embodiment of the present invention. Referring to FIG. 7 , a first data line 221 is electrically connected to a first fan-out line 31 or a second fan-out line 32 , and a first data line 221 is electrically connected to a first fan-out line 31 or a second fan-out line 32 . The two data lines 222 are electrically connected to a third fan-out trace 33 . The pixel 100 includes a plurality of sub-pixels 110 arranged in 2*4, and a row of sub-pixels 110 arranged in the first direction includes a first sub-pixel 101, a third sub-pixel 103, a second sub-pixel 102 and a third sub-pixel 103. Another row of sub-pixels 110 arranged in the direction includes a second sub-pixel 102 , a third sub-pixel 103 , a first sub-pixel 101 and a third sub-pixel 103 .

示例性地,参考图6和图7,第一子像素101的发光颜色为红色,第二子像素102的发光颜色为蓝色,第三子像素103的发光颜色为绿色。6 and 7 , the emission color of the first sub-pixel 101 is red, the emission color of the second sub-pixel 102 is blue, and the emission color of the third sub-pixel 103 is green.

可选地,参考图2、图3、图6和图7,第一扇出走线31与第三扇出走线33在衬底10的垂直投影不交叠,第二扇出走线32与第三扇出走线33在衬底10的垂直投影不交叠。本发明实施例中,第一扇出走线31与第三扇出走线33在衬底10的垂直投影不交叠,防止了第一扇出走线31与第三扇出走线33产生交叠电容。第二扇出走线32与第三扇出走线33在衬底10的垂直投影不交叠,防止了第二扇出走线32与第三扇出走线33产生交叠电容。Optionally, referring to FIG. 2 , FIG. 3 , FIG. 6 and FIG. 7 , the vertical projections of the first fan-out trace 31 and the third fan-out trace 33 on the substrate 10 do not overlap, and the second fan-out trace 32 and the third fan-out trace 32 do not overlap. The vertical projections of the fan-out traces 33 on the substrate 10 do not overlap. In the embodiment of the present invention, the vertical projections of the first fan-out traces 31 and the third fan-out traces 33 on the substrate 10 do not overlap, which prevents the first fan-out traces 31 and the third fan-out traces 33 from generating overlapping capacitances. The vertical projections of the second fan-out traces 32 and the third fan-out traces 33 on the substrate 10 do not overlap, which prevents the second fan-out traces 32 and the third fan-out traces 33 from generating overlapping capacitances.

图8为本发明实施例提供的一种阵列基板中扇出走线的俯视结构示意图,参考图8,第三扇出走线33与第一扇出走线31在衬底10的垂直投影交叠。由于在垂直于衬底10所在平面的方向上,第三金属层M3与第一金属层M1之间间隔有第二金属层M2,第三扇出走线33与第一扇出走线31之间间隔有第二扇出走线32。在垂直于衬底10所在平面的方向上,第三扇出走线33与第一扇出走线31之间的间距大于第二扇出走线32与第一扇出走线31之间的间距,第三扇出走线33与第一扇出走线31之间的间距较大,第三扇出走线33与第一扇出走线31之间产生交叠时的交叠电容较小,从而对第三扇出走线33以及第一扇出走线31造成的负载增加较小。且由于第三扇出走线33与第一扇出走线31在衬底10的垂直投影交叠,从而减小扇出走线30在台阶区A2中占据面积,减小台阶区A2的宽度,减小边框,并增加占屏比。8 is a schematic top view of a fan-out trace in an array substrate according to an embodiment of the present invention. Referring to FIG. 8 , the vertical projection of the third fan-out trace 33 and the first fan-out trace 31 on the substrate 10 overlaps. Since the second metal layer M2 is spaced between the third metal layer M3 and the first metal layer M1 in the direction perpendicular to the plane of the substrate 10 , the third fan-out trace 33 and the first fan-out trace 31 are spaced apart There is a second fanout trace 32 . In the direction perpendicular to the plane of the substrate 10, the distance between the third fan-out trace 33 and the first fan-out trace 31 is greater than the spacing between the second fan-out trace 32 and the first fan-out trace 31, and the third The distance between the fan-out trace 33 and the first fan-out trace 31 is relatively large, and the overlap capacitance when the third fan-out trace 33 and the first fan-out trace 31 overlap is small, so that the third fan-out trace 31 has a relatively small overlap. The load increase caused by line 33 and the first fan-out trace 31 is small. And since the vertical projection of the third fan-out trace 33 and the first fan-out trace 31 on the substrate 10 overlaps, the area occupied by the fan-out trace 30 in the step area A2 is reduced, the width of the step area A2 is reduced, and the bezels and increase the screen-to-body ratio.

此外,还可以设置第一扇出走线31、第二扇出走线32与第三扇出走线33三者在衬底10的垂直投影互相不交叠,且紧密相邻排列。即第一扇出走线31、第二扇出走线32和第三扇出走线33在衬底10的垂直投影彼此之间不重合,同时,三种扇出走线的垂直投影彼此之间没有缝隙的紧密排布。如此一来,既可以节省同层设置时走线与走线之间的间隙所占用的空间,减小下台阶宽度,走线在沉底基板的正投影完全不交叠也可以避免走线之间产生交叠电容,不同层设置的走线与走线之间的空间间距也对应会增加,进一步减小了扇出走线之间的信号干扰。In addition, the vertical projections of the first fan-out traces 31 , the second fan-out traces 32 and the third fan-out traces 33 on the substrate 10 may not overlap each other and are arranged closely adjacent to each other. That is, the vertical projections of the first fan-out trace 31 , the second fan-out trace 32 and the third fan-out trace 33 on the substrate 10 do not overlap each other, and at the same time, the vertical projections of the three fan-out traces have no gaps with each other. tightly packed. In this way, it can save the space occupied by the gap between the traces and the traces when they are set on the same layer, reduce the width of the lower step, and the orthographic projections of the traces on the sinking substrate can be completely non-overlapping. Overlapping capacitance is generated between the lines, and the space distance between the lines arranged on different layers will also increase correspondingly, which further reduces the signal interference between the fan-out lines.

图9为本发明实施例提供的另一种阵列基板中扇出走线的俯视结构示意图,参考图9,第三扇出走线33与第二扇出走线32在衬底10的垂直投影交叠。本发明实施例中,第三扇出走线33与第一扇出走线31以及第二扇出走线32在衬底10的垂直投影均交叠。从而进一步地减小扇出走线30在台阶区A2中占据面积,减小台阶区A2的宽度,减小边框,并增加占屏比。在其他实施方式中,第三扇出走线33还可以不与第一扇出走线31在衬底10的垂直投影交叠,而是仅与第二扇出走线32在衬底10的垂直投影交叠。故而,在一些可行的实施方式中,第三扇出走线33可以与第一扇出走线31和/或第二扇出走线32在衬底10的垂直投影交叠,以减小扇出走线30在台阶区A2中占据面积。FIG. 9 is a schematic top-view structural diagram of fan-out traces in another array substrate according to an embodiment of the present invention. Referring to FIG. 9 , the vertical projections of the third fan-out traces 33 and the second fan-out traces 32 on the substrate 10 overlap. In the embodiment of the present invention, the vertical projections of the third fan-out trace 33 and the first fan-out trace 31 and the second fan-out trace 32 on the substrate 10 all overlap. Therefore, the area occupied by the fan-out traces 30 in the step area A2 is further reduced, the width of the step area A2 is reduced, the frame is reduced, and the screen-occupancy ratio is increased. In other embodiments, the third fan-out trace 33 may not overlap with the vertical projection of the first fan-out trace 31 on the substrate 10 , but only intersect with the vertical projection of the second fan-out trace 32 on the substrate 10 . stack. Therefore, in some feasible embodiments, the third fan-out trace 33 may overlap the vertical projection of the first fan-out trace 31 and/or the second fan-out trace 32 on the substrate 10 to reduce the fan-out trace 30 occupies an area in the step area A2.

可选地,参考图9,第三扇出走线33与第二扇出走线32的交叠面积小于第三扇出走线33与第一扇出走线31的交叠面积。本发明实施例中,第三扇出走线33与第一扇出走线31在衬底10的垂直投影交叠,第三扇出走线33与第二扇出走线32在衬底10的垂直投影交叠。在垂直于衬底10所在平面的方向上,第三扇出走线33与第一扇出走线31的距离大于第三扇出走线33与第二扇出走线32的距离,第三扇出走线33与第二扇出走线32的交叠面积小于第三扇出走线33与第一扇出走线31的交叠面积。可以理解的是,交叠电容与距离成反比,交叠电容与交叠面积成正比。本发明实施例中,距离较大的第三扇出走线33与第一扇出走线31的交叠面积较大,距离较小的第三扇出走线33与第二扇出走线32的交叠面积较小,从而使第三扇出走线33、第一扇出走线31两者的交叠电容与第三扇出走线33、第二扇出走线32两者的交叠电容相一致,以均衡第三扇出走线33对第一扇出走线31以及第二扇出走线32造成的电性影响,使得在第一扇出走线31与第二扇出走线32上传输的数据信号具有相同或者近似程度的衰减,以保证显示的均一性。Optionally, referring to FIG. 9 , the overlapping area of the third fan-out wiring 33 and the second fan-out wiring 32 is smaller than the overlapping area of the third fan-out wiring 33 and the first fan-out wiring 31 . In the embodiment of the present invention, the third fan-out trace 33 overlaps the vertical projection of the first fan-out trace 31 on the substrate 10 , and the third fan-out trace 33 overlaps the vertical projection of the second fan-out trace 32 on the substrate 10 stack. In the direction perpendicular to the plane of the substrate 10, the distance between the third fan-out trace 33 and the first fan-out trace 31 is greater than the distance between the third fan-out trace 33 and the second fan-out trace 32, and the third fan-out trace 33 The overlapping area with the second fan-out trace 32 is smaller than the overlap area of the third fan-out trace 33 and the first fan-out trace 31 . It can be understood that the overlap capacitance is inversely proportional to the distance, and the overlap capacitance is proportional to the overlap area. In the embodiment of the present invention, the overlapping area of the third fan-out wiring 33 with the larger distance and the first fan-out wiring 31 is larger, and the overlapping area of the third fan-out wiring 33 and the second fan-out wiring 32 with the smaller distance The area is small, so that the overlapping capacitance of the third fan-out trace 33 and the first fan-out trace 31 is consistent with the overlapping capacitance of the third fan-out trace 33 and the second fan-out trace 32, so as to balance the The electrical influence of the third fan-out trace 33 on the first fan-out trace 31 and the second fan-out trace 32 makes the data signals transmitted on the first fan-out trace 31 and the second fan-out trace 32 the same or similar degree of attenuation to ensure display uniformity.

图10为本发明实施例提供的另一种阵列基板的剖面结构示意图,参考图10,数据线22位于第三金属层M3。本发明实施例中,第三扇出走线33与数据线22均位于第三金属层M3,第三扇出走线33可以与数据线22采用同种材料并在同一工艺中形成,以节省工艺制程。FIG. 10 is a schematic cross-sectional structure diagram of another array substrate according to an embodiment of the present invention. Referring to FIG. 10 , the data lines 22 are located in the third metal layer M3 . In the embodiment of the present invention, the third fan-out wiring 33 and the data line 22 are both located in the third metal layer M3, and the third fan-out wiring 33 and the data line 22 can be formed of the same material and in the same process, so as to save the process. .

图11为本发明实施例提供的另一种阵列基板的剖面结构示意图,图12为本发明实施例提供的另一种阵列基板的俯视结构示意图,图13为本发明实施例提供的另一种阵列基板的俯视结构示意图,参考图11、图12、图13,并结合参考图1,阵列基板还包括多条扫描线21,多条扫描线21位于显示区A1,沿第一方向延伸并沿第二方向排列。扫描线21位于第一金属层M1,数据线22位于第二金属层M2,第二金属层M2与第三金属层M3层采用相同的材料。本发明实施例中,第二扇出走线32与第三扇出走线33采用相同的材料,第二扇出走线32与第三扇出走线33具有相同的电阻率,从而减小了第二扇出走线32与第三扇出走线33上的压降之差,使得在第二扇出走线32与第三扇出走线33上传输的数据信号具有相同或者近似程度的衰减,以保证显示的均一性。FIG. 11 is a schematic cross-sectional structure diagram of another array substrate provided by an embodiment of the present invention, FIG. 12 is a top-view structural schematic diagram of another array substrate provided by an embodiment of the present invention, and FIG. 13 is another type of array substrate provided by an embodiment of the present invention. 11 , 12 , and 13 , and with reference to FIG. 1 , the array substrate further includes a plurality of scan lines 21 , and the plurality of scan lines 21 are located in the display area A1 , extending along the first direction and extending along the Arrangement in the second direction. The scan lines 21 are located in the first metal layer M1, the data lines 22 are located in the second metal layer M2, and the second metal layer M2 and the third metal layer M3 are made of the same material. In the embodiment of the present invention, the second fan-out trace 32 and the third fan-out trace 33 are made of the same material, and the second fan-out trace 32 and the third fan-out trace 33 have the same resistivity, thereby reducing the second fan-out trace. The difference between the voltage drops on the outgoing trace 32 and the third fan out trace 33 makes the data signals transmitted on the second fan out trace 32 and the third fan out trace 33 have the same or similar degree of attenuation to ensure a uniform display sex.

示例性地,参考图11、图12、图13,并结合参考图1,扫描线21、薄膜晶体管50的栅极52以及存储电容60的第一极板61位于第一金属层M1,薄膜晶体管50的源极51、薄膜晶体管50的漏极54、数据线22和第二扇出走线32位于第二金属层M2。11 , 12 , and 13 , and with reference to FIG. 1 , the scan line 21 , the gate 52 of the thin film transistor 50 and the first plate 61 of the storage capacitor 60 are located in the first metal layer M1 , and the thin film transistor The source electrode 51 of 50 , the drain electrode 54 of the thin film transistor 50 , the data line 22 and the second fan-out line 32 are located in the second metal layer M2 .

可选地,参考图11、图12、图13,并结合参考图1,显示区A1包括多个阵列排布的像素100,像素100包括多个子像素110,多个子像素110包括第一子像素101、第二子像素102和第三子像素103。沿第二方向,与多个第一子像素101以及多个第二子像素102电连接的数据线22为第一数据线221,与多个第三子像素103电连接的数据线22为第二数据线222。一条第一数据线221与一条第二扇出走线32或者一条第三扇出走线33电连接,一条第二数据线222与一条第一扇出走线31电连接。Optionally, referring to FIG. 11 , FIG. 12 , and FIG. 13 , and with reference to FIG. 1 , the display area A1 includes a plurality of pixels 100 arranged in an array, the pixel 100 includes a plurality of sub-pixels 110 , and the plurality of sub-pixels 110 includes a first sub-pixel 101 , a second sub-pixel 102 and a third sub-pixel 103 . Along the second direction, the data lines 22 electrically connected to the plurality of first sub-pixels 101 and the plurality of second sub-pixels 102 are the first data lines 221, and the data lines 22 electrically connected to the plurality of third sub-pixels 103 are the first data lines 221. Two data lines 222 . A first data line 221 is electrically connected with a second fan-out line 32 or a third fan-out line 33 , and a second data line 222 is electrically connected with a first fan-out line 31 .

本发明实施例中,部分第一子像素101电连接至第二扇出走线32,另一部分第一子像素101电连接至第三扇出走线33,类似地,部分第二子像素102电连接至第二扇出走线32,另一部分第二子像素102电连接至第三扇出走线33,位于第二金属层M2的第二扇出走线32与位于第三金属层M3的第三扇出走线33采用相同的材料,第二扇出走线32与第三扇出走线33具有相同的电阻率,从而减小了第二扇出走线32与第三扇出走线33上的压降之差,使得在第二扇出走线32与第三扇出走线33上传输的数据信号具有相同或者近似程度的衰减,使得接收第二扇出走线32传输数据信号的第一子像素101与接收第三扇出走线33传输该数据信号的第一子像素101具有相同或者相近的发光亮度,使得接收第二扇出走线32传输数据信号的第二子像素102与接收第三扇出走线33传输该数据信号的第二子像素102具有相同或者相近的发光亮度,以保证显示的均一性。In the embodiment of the present invention, some of the first sub-pixels 101 are electrically connected to the second fan-out traces 32 , and another part of the first sub-pixels 101 are electrically connected to the third fan-out traces 33 . Similarly, some of the second sub-pixels 102 are electrically connected to each other. To the second fan-out trace 32, another part of the second sub-pixel 102 is electrically connected to the third fan-out trace 33, the second fan-out trace 32 located in the second metal layer M2 and the third fan-out trace located in the third metal layer M3 The wire 33 is made of the same material, and the second fan-out wire 32 and the third fan-out wire 33 have the same resistivity, thereby reducing the voltage drop difference between the second fan-out wire 32 and the third fan-out wire 33, Make the data signals transmitted on the second fan-out trace 32 and the third fan-out trace 33 have the same or similar degree of attenuation, so that the first sub-pixel 101 that receives the data signal transmitted by the second fan-out trace 32 and the first sub-pixel 101 that receives the third fan-out trace 32 The first sub-pixel 101 that transmits the data signal from the line 33 has the same or similar luminance, so that the second sub-pixel 102 that receives the data signal from the second fan-out line 32 and the second sub-pixel 102 that receives the third fan-out line 33 transmit the data signal The second sub-pixels 102 have the same or similar luminous brightness to ensure display uniformity.

图14为本发明实施例提供的一种显示面板的结构示意图,参考图14,显示面板400包括上述实施例中的阵列基板200。显示面板400可以为有机发光显示面板、液晶显示面板或者电泳显示面板等。FIG. 14 is a schematic structural diagram of a display panel according to an embodiment of the present invention. Referring to FIG. 14 , the display panel 400 includes the array substrate 200 in the above-mentioned embodiment. The display panel 400 may be an organic light emitting display panel, a liquid crystal display panel, an electrophoretic display panel, or the like.

示例性地,参考图14,显示面板400还包括与阵列基板200相对设置的对置基板300,对置基板300例如可以为彩膜基板或者封装盖板。彩膜基板例如可以包括色阻和黑色矩阵等公知结构,在此不再赘述。For example, referring to FIG. 14 , the display panel 400 further includes an opposite substrate 300 disposed opposite to the array substrate 200 , and the opposite substrate 300 may be, for example, a color filter substrate or a package cover. For example, the color filter substrate may include well-known structures such as color resist and black matrix, which will not be repeated here.

本发明实施例还提供了一种显示装置,图15为本发明实施例提供的一种显示装置的结构示意图,如图15所示,本发明实施例提供的显示装置包括上述显示面板400。显示装置可以为图15中所示的手机,也可以为电脑、电视机、智能穿戴设备等,本发明实施例对此不作特殊限定。An embodiment of the present invention further provides a display device. FIG. 15 is a schematic structural diagram of a display device provided by an embodiment of the present invention. As shown in FIG. 15 , the display device provided by an embodiment of the present invention includes the above-mentioned display panel 400 . The display device may be the mobile phone shown in FIG. 15 , or may be a computer, a television, a smart wearable device, or the like, which is not particularly limited in this embodiment of the present invention.

注意,上述仅为本发明的较佳实施例及所运用技术原理。本领域技术人员会理解,本发明不限于这里所述的特定实施例,对本领域技术人员来说能够进行各种明显的变化、重新调整、相互结合和替代而不会脱离本发明的保护范围。因此,虽然通过以上实施例对本发明进行了较为详细的说明,但是本发明不仅仅限于以上实施例,在不脱离本发明构思的情况下,还可以包括更多其他等效实施例,而本发明的范围由所附的权利要求范围决定。Note that the above are only preferred embodiments of the present invention and applied technical principles. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, combinations and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and can also include more other equivalent embodiments without departing from the concept of the present invention. The scope is determined by the scope of the appended claims.

Claims (19)

1. The array substrate is characterized by comprising a display area and a step area;
a substrate;
a plurality of data lines located in the display area; the data lines extend along a second direction and are arranged along a first direction;
the fan-out wires are positioned in the step areas and electrically connected with the data lines and used for providing data signals for the data lines; the plurality of fan-out wires comprise a first fan-out wire positioned on the first metal layer, a second fan-out wire positioned on the second metal layer and a third fan-out wire positioned on the third metal layer; in a direction perpendicular to the substrate, the second metal layer is located on one side, away from the substrate, of the first metal layer, the third metal layer is located on one side, away from the first metal layer, of the second metal layer, and vertical projections of the first fan-out routing and the second fan-out routing on the substrate are not overlapped;
the film layer where the data line is located is a first organic layer; the first fan-out routing and the second fan-out routing are positioned on two sides of the third fan-out routing;
the first fan-out routing line and the second fan-out routing line are closer in distance.
2. The array substrate of claim 1, further comprising a plurality of scan lines in the display area, extending along the first direction and arranged along the second direction;
the scanning line is located on the first metal layer, and the second metal layer is located between the first metal layer and the film layer where the data line is located.
3. The array substrate of claim 2, wherein the first metal layer and the second metal layer are made of the same material.
4. The array substrate of claim 3, wherein a line width of the first fan-out trace is equal to a line width of the second fan-out trace.
5. The array substrate of claim 3, wherein the display area comprises a plurality of pixels arranged in an array, the pixels comprising a plurality of sub-pixels, the plurality of sub-pixels comprising a first sub-pixel, a second sub-pixel and a third sub-pixel;
along the second direction, the data line electrically connected with the first sub-pixels and the second sub-pixels is a first data line, and the data line electrically connected with the third sub-pixels is a second data line;
one first data line is electrically connected with one first fan-out wiring or one second fan-out wiring, and one second data line is electrically connected with one third fan-out wiring.
6. The array substrate of claim 5, wherein the pixel comprises a plurality of the sub-pixels arranged in 2 x 3, one row of the sub-pixels arranged in the first direction comprises the first sub-pixel, the third sub-pixel and the second sub-pixel, and another row of the sub-pixels arranged in the first direction comprises the second sub-pixel, the third sub-pixel and the first sub-pixel.
7. The array substrate of claim 5, wherein the pixel comprises a plurality of the sub-pixels arranged in 2 x 4 rows, one row of the sub-pixels arranged in the first direction comprises the first sub-pixel, the third sub-pixel, the second sub-pixel and the third sub-pixel, and another row of the sub-pixels arranged in the first direction comprises the second sub-pixel, the third sub-pixel, the first sub-pixel and the third sub-pixel.
8. The array substrate of claim 1, wherein the data line is located in the third metal layer.
9. The array substrate of claim 1, wherein the third metal layer is located on a side of the film layer where the data line is located away from the substrate.
10. The array substrate of claim 9, further comprising a first insulating layer and a second insulating layer, wherein the first insulating layer is located between the first metal layer and the second metal layer, the second insulating layer is located between the third metal layer and the film layer where the data line is located, and a thickness of the second insulating layer is greater than a thickness of the first insulating layer.
11. The array substrate of claim 10, wherein the second insulating layer comprises a planarization layer and a pixel defining layer, the planarization layer being located between the pixel defining layer and the third metal layer.
12. The array substrate of claim 1, wherein the third fan-out trace overlaps a perpendicular projection of the first fan-out trace on the substrate.
13. The array substrate of claim 12, wherein the third fan-out trace overlaps a perpendicular projection of the second fan-out trace on the substrate.
14. The array substrate of claim 13, wherein an overlapping area of the third fan-out trace and the second fan-out trace is smaller than an overlapping area of the third fan-out trace and the first fan-out trace.
15. The array substrate of claim 1, wherein the first fan-out trace and the third fan-out trace do not overlap in vertical projection on the substrate, and the second fan-out trace and the third fan-out trace do not overlap in vertical projection on the substrate.
16. The array substrate of claim 1, further comprising a plurality of scan lines in the display area, extending along the first direction and arranged along the second direction;
the scanning lines are located on the first metal layer, the data lines are located on the second metal layer, and the second metal layer and the third metal layer are made of the same material.
17. The array substrate of claim 16, wherein the display area comprises a plurality of pixels arranged in an array, the pixels comprising a plurality of sub-pixels, the plurality of sub-pixels comprising a first sub-pixel, a second sub-pixel and a third sub-pixel;
along the second direction, the data line electrically connected with the plurality of first sub-pixels and the plurality of second sub-pixels is a first data line, and the data line electrically connected with the plurality of third sub-pixels is a second data line;
one first data line is electrically connected with one second fan-out wiring or one third fan-out wiring, and one second data line is electrically connected with one first fan-out wiring.
18. A display panel comprising the array substrate according to any one of claims 1 to 17.
19. A display device characterized by comprising the display panel according to claim 18.
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