CN110931515B - Array substrate, display panel and display device - Google Patents
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- 239000000758 substrate Substances 0.000 title claims abstract description 108
- 239000002184 metal Substances 0.000 claims abstract description 99
- 229910052751 metal Inorganic materials 0.000 claims abstract description 99
- 239000010410 layer Substances 0.000 claims description 153
- 239000000463 material Substances 0.000 claims description 12
- 239000012044 organic layer Substances 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 24
- 239000010408 film Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 230000002411 adverse Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 239000002346 layers by function Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 1
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/441—Interconnections, e.g. scanning lines
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- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/481—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs integrated with passive devices, e.g. auxiliary capacitors
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
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Abstract
本发明提供一种阵列基板、显示面板以及显示装置,阵列基板包括显示区和台阶区;衬底;多条数据线,位于所述显示区;所述多条数据线沿第二方向延伸并沿第一方向排列;以及多条扇出走线,位于所述台阶区,所述扇出走线与所述数据线电连接,用于向所述数据线提供数据信号;所述多条扇出走线包括位于第一金属层的第一扇出走线、位于第二金属层的第二扇出走线和位于第三金属层的第三扇出走线;在垂直于所述衬底的方向上,所述第二金属层位于所述第一金属层远离所述衬底的一侧,所述第三金属层位于所述第二金属层远离所述第一金属层的一侧,且所述第一扇出走线与所述第二扇出走线在所述衬底的垂直投影不交叠。本发明以实现减小边框,增加占屏比。
The invention provides an array substrate, a display panel and a display device. The array substrate includes a display area and a stepped area; a substrate; a plurality of data lines located in the display area; the plurality of data lines extend along a second direction and extend along the arrayed in the first direction; and a plurality of fan-out traces located in the step area, the fan-out traces are electrically connected to the data lines, and used for providing data signals to the data lines; the plurality of fan-out traces include: The first fan-out trace located in the first metal layer, the second fan-out trace located in the second metal layer, and the third fan-out trace located in the third metal layer; in the direction perpendicular to the substrate, the first fan-out trace is The second metal layer is located on the side of the first metal layer away from the substrate, the third metal layer is located on the side of the second metal layer away from the first metal layer, and the first fan out The line does not overlap with the vertical projection of the second fan-out trace on the substrate. The present invention can reduce the frame and increase the screen ratio.
Description
技术领域technical field
本发明涉及显示技术领域,尤其涉及一种阵列基板、显示面板以及显示装置。The present invention relates to the field of display technology, and in particular, to an array substrate, a display panel and a display device.
背景技术Background technique
随着科学技术的发展和社会的进步,人们对于信息的交流和传递等方面的依赖程度日益增加,而显示装置作为信息交换和传递的主要载体和物质基础,现已成为众多科学家研究的热点。With the development of science and technology and the progress of society, people's dependence on the exchange and transmission of information is increasing day by day. As the main carrier and material basis for information exchange and transmission, display devices have become the research focus of many scientists.
现在,高占屏比窄边框的显示面板以及显示装置越来成为一种趋势。但是,台阶区需要设置众多的扇出走线,导致台阶区的宽度无法缩减。Now, display panels and display devices with a high screen-to-body ratio and narrow bezels are increasingly becoming a trend. However, many fan-out traces need to be set in the step area, so that the width of the step area cannot be reduced.
发明内容SUMMARY OF THE INVENTION
本发明提供一种阵列基板、显示面板以及显示装置,以实现减小边框,增加占屏比。The present invention provides an array substrate, a display panel and a display device, so as to reduce the frame and increase the screen ratio.
第一方面,本发明实施例提供一种阵列基板,包括显示区和台阶区;In a first aspect, an embodiment of the present invention provides an array substrate, including a display area and a stepped area;
衬底;substrate;
多条数据线,位于所述显示区;所述多条数据线沿第二方向延伸并沿第一方向排列;a plurality of data lines located in the display area; the plurality of data lines extend along the second direction and are arranged along the first direction;
以及多条扇出走线,位于所述台阶区,所述扇出走线与所述数据线电连接,用于向所述数据线提供数据信号;所述多条扇出走线包括位于第一金属层的第一扇出走线、位于第二金属层的第二扇出走线和位于第三金属层的第三扇出走线;在垂直于所述衬底的方向上,所述第二金属层位于所述第一金属层远离所述衬底的一侧,所述第三金属层位于所述第二金属层远离所述第一金属层的一侧,且所述第一扇出走线与所述第二扇出走线在所述衬底的垂直投影不交叠。and a plurality of fan-out traces located in the step area, the fan-out traces are electrically connected to the data lines, and used for providing data signals to the data lines; the plurality of fan-out traces include a first metal layer The first fan-out trace, the second fan-out trace located in the second metal layer, and the third fan-out trace located in the third metal layer; in the direction perpendicular to the substrate, the second metal layer is located in the The first metal layer is located on a side away from the substrate, the third metal layer is located at a side of the second metal layer away from the first metal layer, and the first fan-out trace is connected to the first metal layer. The vertical projections of the two fan-out traces on the substrate do not overlap.
第二方面,本发明实施例提供一种显示面板,包括第一方面所述的阵列基板。In a second aspect, an embodiment of the present invention provides a display panel, including the array substrate described in the first aspect.
第三方面,本发明实施例提供一种显示装置,包括第二方面所述的显示面板。In a third aspect, an embodiment of the present invention provides a display device, including the display panel described in the second aspect.
本发明实施例提供的阵列基板中,多条扇出走线分别设置于第一金属层、第二金属层和第三金属层,相对于将多条扇出走线设置于一个金属层或者两个金属层而言,可以减小相邻两条扇出走线之间的间距,从而减小扇出走线在台阶区中占据面积,减小台阶区的宽度,减小边框,并增加占屏比。另外,设置第一扇出走线与第二扇出走线不交叠,还可以在减小边框的基础上,防止第一扇出走线与第二扇出走线产生交叠电容,从而防止第一扇出走线与第二扇出走线负载的增加。In the array substrate provided by the embodiment of the present invention, a plurality of fan-out traces are respectively disposed on the first metal layer, the second metal layer, and the third metal layer, compared to the fact that the plurality of fan-out traces are disposed in one metal layer or two metals In terms of layers, the spacing between two adjacent fan-out traces can be reduced, thereby reducing the area occupied by the fan-out traces in the step area, reducing the width of the step area, reducing the frame, and increasing the screen-to-screen ratio. In addition, setting the first fan-out wiring and the second fan-out wiring to not overlap can also prevent the first fan-out wiring and the second fan-out wiring from generating overlapping capacitance on the basis of reducing the frame, thereby preventing the first fan-out wiring Increased load on outgoing traces and second fanout traces.
附图说明Description of drawings
图1为本发明实施例提供的一种阵列基板的俯视结构示意图;FIG. 1 is a schematic top-view structural diagram of an array substrate according to an embodiment of the present invention;
图2为图1中S1区域的放大结构示意图;Fig. 2 is the enlarged structural schematic diagram of S1 area in Fig. 1;
图3为沿图2中AA’方向的剖面结构示意图;Fig. 3 is a schematic cross-sectional structure along the AA' direction in Fig. 2;
图4为沿图1中BB’方向的剖面结构示意图;Fig. 4 is the cross-sectional structure schematic diagram along BB' direction in Fig. 1;
图5为本发明实施例提供的另一种阵列基板的剖面结构示意图;FIG. 5 is a schematic cross-sectional structure diagram of another array substrate according to an embodiment of the present invention;
图6为本发明实施例提供的另一种阵列基板的俯视结构示意图;FIG. 6 is a schematic top-view structure diagram of another array substrate according to an embodiment of the present invention;
图7为本发明实施例提供的另一种阵列基板的俯视结构示意图;FIG. 7 is a schematic top-view structural diagram of another array substrate according to an embodiment of the present invention;
图8为本发明实施例提供的一种阵列基板中扇出走线的俯视结构示意图;8 is a schematic top-view structural diagram of a fan-out wiring in an array substrate according to an embodiment of the present invention;
图9为本发明实施例提供的另一种阵列基板中扇出走线的俯视结构示意图;9 is a schematic top-view structural diagram of a fan-out trace in another array substrate according to an embodiment of the present invention;
图10为本发明实施例提供的另一种阵列基板的剖面结构示意图;FIG. 10 is a schematic cross-sectional structure diagram of another array substrate according to an embodiment of the present invention;
图11为本发明实施例提供的另一种阵列基板的剖面结构示意图;FIG. 11 is a schematic cross-sectional structure diagram of another array substrate according to an embodiment of the present invention;
图12为本发明实施例提供的另一种阵列基板的俯视结构示意图;FIG. 12 is a schematic top-view structure diagram of another array substrate according to an embodiment of the present invention;
图13为本发明实施例提供的另一种阵列基板的俯视结构示意图;FIG. 13 is a schematic top-view structural diagram of another array substrate according to an embodiment of the present invention;
图14为本发明实施例提供的一种显示面板的结构示意图;FIG. 14 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
图15为本发明实施例提供的一种显示装置的结构示意图。FIG. 15 is a schematic structural diagram of a display device according to an embodiment of the present invention.
具体实施方式Detailed ways
下面结合附图和实施例对本发明作进一步的详细说明。可以理解的是,此处所描述的具体实施例仅仅用于解释本发明,而非对本发明的限定。另外还需要说明的是,为了便于描述,附图中仅示出了与本发明相关的部分而非全部结构。The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, the drawings only show some but not all structures related to the present invention.
图1为本发明实施例提供的一种阵列基板的俯视结构示意图,图2为图1中S1区域的放大结构示意图,图3为沿图2中AA’方向的剖面结构示意图,图4为沿图1中BB’方向的剖面结构示意图,参考图1、图2、图3和图4,阵列基板包括显示区A1和台阶区A2。阵列基板包括衬底10、多条数据线22以及多条扇出走线30。多条数据线22位于显示区A1,多条数据线22沿第二方向延伸并沿第一方向排列。多条扇出走线30位于台阶区A2,扇出走线30与数据线22电连接,用于向数据线22提供数据信号。多条扇出走线30包括位于第一金属层M1的第一扇出走线31、位于第二金属层M2的第二扇出走线32和位于第三金属层M3的第三扇出走线33。在垂直于衬底10的方向上,第二金属层M2位于第一金属层M1远离衬底10的一侧,第三金属层M3位于第二金属层M2远离第一金属层M1的一侧,且第一扇出走线31与第二扇出走线32在衬底10的垂直投影不交叠。1 is a schematic top view of an array substrate according to an embodiment of the present invention, FIG. 2 is an enlarged schematic view of the S1 area in FIG. 1 , FIG. 3 is a schematic cross-sectional structure along the direction AA′ in FIG. 2 , and FIG. A schematic cross-sectional structure diagram in the direction of BB′ in FIG. 1 , referring to FIGS. 1 , 2 , 3 and 4 , the array substrate includes a display area A1 and a step area A2 . The array substrate includes a
需要说明的是,实际的阵列基板中包含大量的数据线22以及大量的扇出走线30,图1中所示数据线22以及扇出走线30的数量仅为一种示意,并非对本发明实施例的限定。It should be noted that the actual array substrate includes a large number of
本发明实施例提供的阵列基板中,多条扇出走线分别设置于第一金属层、第二金属层和第三金属层,相对于将多条扇出走线设置于一个金属层或者两个金属层而言,可以减小相邻两条扇出走线之间的间距,从而减小扇出走线在台阶区中占据面积,减小台阶区的宽度,减小边框,并增加占屏比。另外,设置第一扇出走线与第二扇出走线不交叠,还可以在减小边框的基础上,防止第一扇出走线与第二扇出走线产生交叠电容,从而防止第一扇出走线与第二扇出走线负载的增加。In the array substrate provided by the embodiment of the present invention, a plurality of fan-out traces are respectively disposed on the first metal layer, the second metal layer, and the third metal layer, compared to the fact that the plurality of fan-out traces are disposed in one metal layer or two metals In terms of layers, the spacing between two adjacent fan-out traces can be reduced, thereby reducing the area occupied by the fan-out traces in the step area, reducing the width of the step area, reducing the frame, and increasing the screen-to-screen ratio. In addition, setting the first fan-out wiring and the second fan-out wiring to not overlap can also prevent the first fan-out wiring and the second fan-out wiring from generating overlapping capacitance on the basis of reducing the frame, thereby preventing the first fan-out wiring Increased load on outgoing traces and second fanout traces.
可选地,参考图1、图3和图4,阵列基板还包括多条扫描线21,多条扫描线21位于显示区A1,多条扫描线21沿第一方向延伸并沿第二方向排列。扫描线21位于第一金属层M1,第二金属层M2位于第一金属层M1与数据线22所在膜层之间。本发明实施例中,第一扇出走线31与扫描线21同层,第二扇出走线32位于第一扇出走线31与数据线22所在膜层之间,第一扇出走线31与第二扇出走线32之间的间距较近,因此尤其需要设置第一扇出走线31与第二扇出走线32不交叠,防止第一扇出走线31与第二扇出走线32产生交叠电容。Optionally, referring to FIG. 1 , FIG. 3 and FIG. 4 , the array substrate further includes a plurality of
可选地,参考图3和图4,第一金属层M1与第二金属层M2采用相同的材料。则位于第一金属层M1的第一扇出走线31与位于第二金属层M2的第二扇出走线32采用相同的材料,第一扇出走线31与第二扇出走线32具有相同的电阻率,从而减小了第一扇出走线31与第二扇出走线32上的压降之差,使得在第一扇出走线31与第二扇出走线32上传输的数据信号具有相同或者近似程度的衰减,以保证显示的均一性。Optionally, referring to FIG. 3 and FIG. 4 , the first metal layer M1 and the second metal layer M2 use the same material. Then the first fan-
可选地,参考图2和图3,第一扇出走线31的线宽与第二扇出走线32的线宽相等。第一扇出走线31的线宽为第一扇出走线31在垂直于其延伸方向上的宽度,第二扇出走线32的线宽为第二扇出走线32在垂直于其延伸方向上的宽度。本发明实施例中,第一扇出走线31与第二扇出走线32采用相同的材料,且第一扇出走线31的线宽与第二扇出走线32的线宽相等,从而进一步地减小了第一扇出走线31与第二扇出走线32上的压降之差,使得在第一扇出走线31与第二扇出走线32上传输的数据信号具有相同或者近似程度的衰减,以保证显示的均一性。Optionally, referring to FIG. 2 and FIG. 3 , the line width of the first fan-
示例性地,参考图1,多条扫描线21与多条数据线22交叉出多个子像素110,多个子像素110在显示区A1中呈阵列排布。扇出走线30的一端与数据线22电连接,扇出走线30的另一端与驱动芯片40电连接,驱动芯片40绑定于阵列基板的台阶区A2。驱动芯片40通过扇出走线30向数据线22提供数据信号。1 , a plurality of
示例性地,图1、图2、参考图3和图4,阵列基板还包括沿远离衬底10依次叠层设置的缓冲层11、栅极绝缘层12、第一介电层13、第二介电层14、第一有机层15、平坦化层16和像素限定层17。阵列基板还包括像素驱动电路和发光单元70,像素驱动电路与发光单元70电连接,像素驱动电路用于为发光单元70提供驱动电压或者驱动电流。像素驱动电路包括薄膜晶体管50和存储电容60,薄膜晶体管50包括源极51、栅极52、半导体层53和漏极54。存储电容60包括第一极板61和第二极板62。发光单元70包括第一电极71、发光功能层72和第二电极73。发光功能层72位于第一电极71与第二电极73之间,且第一电极71注入的空穴与第二电极73注入的电子在发光功能层72中结合形成激子,激子跃迁产生光子以使发光单元70发光。扫描线21、栅极52与第一极板61位于第一金属层M1,第一金属层M1位于栅极绝缘层12与第一介电层13之间。第二极板62位于第二金属层M2。数据线22、源极51和漏极54位于同一层,数据线22位于第二金属层M2远离衬底10一侧。数据线22可以通过过孔与第一扇出走线31电连接,数据线22可以通过过孔与第二扇出走线32电连接。Exemplarily, as shown in FIGS. 1 , 2 , and referring to FIGS. 3 and 4 , the array substrate further includes a
可选地,参考图4,第三金属层M3位于数据线22所在膜层远离衬底10一侧。因此,第三扇出走线33位于数据线22所在膜层远离衬底10一侧,第三扇出走线33与第一扇出走线31以及第二扇出走线32的距离较远,避免了第三扇出走线33对第一扇出走线31以及第二扇出走线32的不良电性影响。Optionally, referring to FIG. 4 , the third metal layer M3 is located on the side of the film layer where the data lines 22 are located away from the
示例性地,参考图4,第三扇出走线33位于数据线22所在膜层远离衬底10一侧,第三扇出走线33与数据线22通过过孔电连接。Exemplarily, referring to FIG. 4 , the third fan-out traces 33 are located on the side of the film layer where the data lines 22 are located away from the
可选地,参考图4,阵列基板还包括第一绝缘层81和第二绝缘层82,第一绝缘层81位于第一金属层M1与第二金属层M2之间,第二绝缘层82位于第三金属层M3与数据线22所在膜层之间,第二绝缘层82的厚度大于第一绝缘层81的厚度。本发明实施例中,第二绝缘层82的厚度大于第一绝缘层81的厚度,第二绝缘层82具有较大的厚度,从而在垂直于衬底10所在平面的方向上,第三扇出走线33与数据线22的距离较大,第三扇出走线33与第一扇出走线31以及第二扇出走线32的距离较远,进一步地避免了第三扇出走线33对第一扇出走线31以及第二扇出走线32的不良电性影响。Optionally, referring to FIG. 4 , the array substrate further includes a first insulating layer 81 and a second insulating
示例性地,参考图4,第一绝缘层81包括第一介电层13,第一绝缘层81为无机层。第二绝缘层82包括第一有机层15。第一有机层15的厚度大于第一介电层13的厚度。第一金属层M1与第二金属层M2之间间隔有第一介电层13,第二金属层M2与第三金属层M3之间间隔有第二介电层14和第一有机层15。在垂直于衬底10所在平面的方向上,第三金属层M3与第一金属层M1之间的间距较远,第三金属层M3与第二金属层M2之间的间距较远。故而,第三扇出走线33与第一扇出走线31以及第二扇出走线32的距离较远。For example, referring to FIG. 4 , the first insulating layer 81 includes the
图5为本发明实施例提供的另一种阵列基板的剖面结构示意图,参考图5,第二绝缘层82包括平坦化层16和像素限定层17,平坦化层16位于像素限定层17与第三金属层M3之间。本发明实施例中,第二绝缘层82包括平坦化层16和像素限定层17,从而进一步地增加了第二绝缘层82的厚度,增加第三扇出走线33与第一扇出走线31的距离,以及增加第三扇出走线33与第二扇出走线32的距离,进一步地避免了第三扇出走线33对第一扇出走线31以及第二扇出走线32的不良电性影响。FIG. 5 is a schematic cross-sectional structure diagram of another array substrate provided by an embodiment of the present invention. Referring to FIG. 5 , the second insulating
示例性地,参考图5,第三扇出走线33与第二电极73同层并采用同种材料,第三扇出走线33与第二电极73可以在同一工艺中形成,从而节省了工艺制程。Exemplarily, referring to FIG. 5 , the third fan-out traces 33 and the
图6为本发明实施例提供的另一种阵列基板的俯视结构示意图,参考图6,显示区A1包括多个阵列排布的像素100,像素100包括多个子像素110,多个子像素110包括第一子像素101、第二子像素102和第三子像素103。沿第二方向,与多个第一子像素101以及多个第二子像素102电连接的数据线22为第一数据线221,与多个第三子像素103电连接的数据线22为第二数据线222。一条第一数据线221与一条第一扇出走线31或者一条第二扇出走线32电连接,一条第二数据线222与一条第三扇出走线33电连接。本发明实施例中,部分第一子像素101电连接至第一扇出走线31,另一部分第一子像素101电连接至第二扇出走线32,类似地,部分第二子像素102电连接至第一扇出走线31,另一部分第二子像素102电连接至第二扇出走线32,位于第一金属层M1的第一扇出走线31与位于第二金属层M2的第二扇出走线32采用相同的材料,第一扇出走线31与第二扇出走线32具有相同的电阻率,从而减小了第一扇出走线31与第二扇出走线32上的压降之差,使得在第一扇出走线31与第二扇出走线32上传输的数据信号具有相同或者近似程度的衰减,使得接收第一扇出走线31传输数据信号的第一子像素101与接收第二扇出走线32传输该数据信号的第一子像素101具有相同或者相近的发光亮度,使得接收第一扇出走线31传输数据信号的第二子像素102与接收第二扇出走线32传输该数据信号的第二子像素102具有相同或者相近的发光亮度,以保证显示的均一性。6 is a schematic top-view structure diagram of another array substrate provided by an embodiment of the present invention. Referring to FIG. 6 , a display area A1 includes a plurality of
可选地,参考图6,像素100包括2*3排列的多个子像素110,第一方向上排列的一行子像素110包括第一子像素101、第三子像素103和第二子像素102,第一方向上排列的另一行子像素110包括第二子像素102、第三子像素103和第一子像素101。Optionally, referring to FIG. 6 , the
图7为本发明实施例提供的另一种阵列基板的俯视结构示意图,参考图7,一条第一数据线221与一条第一扇出走线31或者一条第二扇出走线32电连接,一条第二数据线222与一条第三扇出走线33电连接。像素100包括2*4排列的多个子像素110,第一方向上排列的一行子像素110包括第一子像素101、第三子像素103、第二子像素102和第三子像素103,第一方向上排列的另一行子像素110包括第二子像素102、第三子像素103、第一子像素101和第三子像素103。7 is a schematic top-view structure diagram of another array substrate provided by an embodiment of the present invention. Referring to FIG. 7 , a
示例性地,参考图6和图7,第一子像素101的发光颜色为红色,第二子像素102的发光颜色为蓝色,第三子像素103的发光颜色为绿色。6 and 7 , the emission color of the
可选地,参考图2、图3、图6和图7,第一扇出走线31与第三扇出走线33在衬底10的垂直投影不交叠,第二扇出走线32与第三扇出走线33在衬底10的垂直投影不交叠。本发明实施例中,第一扇出走线31与第三扇出走线33在衬底10的垂直投影不交叠,防止了第一扇出走线31与第三扇出走线33产生交叠电容。第二扇出走线32与第三扇出走线33在衬底10的垂直投影不交叠,防止了第二扇出走线32与第三扇出走线33产生交叠电容。Optionally, referring to FIG. 2 , FIG. 3 , FIG. 6 and FIG. 7 , the vertical projections of the first fan-
图8为本发明实施例提供的一种阵列基板中扇出走线的俯视结构示意图,参考图8,第三扇出走线33与第一扇出走线31在衬底10的垂直投影交叠。由于在垂直于衬底10所在平面的方向上,第三金属层M3与第一金属层M1之间间隔有第二金属层M2,第三扇出走线33与第一扇出走线31之间间隔有第二扇出走线32。在垂直于衬底10所在平面的方向上,第三扇出走线33与第一扇出走线31之间的间距大于第二扇出走线32与第一扇出走线31之间的间距,第三扇出走线33与第一扇出走线31之间的间距较大,第三扇出走线33与第一扇出走线31之间产生交叠时的交叠电容较小,从而对第三扇出走线33以及第一扇出走线31造成的负载增加较小。且由于第三扇出走线33与第一扇出走线31在衬底10的垂直投影交叠,从而减小扇出走线30在台阶区A2中占据面积,减小台阶区A2的宽度,减小边框,并增加占屏比。8 is a schematic top view of a fan-out trace in an array substrate according to an embodiment of the present invention. Referring to FIG. 8 , the vertical projection of the third fan-
此外,还可以设置第一扇出走线31、第二扇出走线32与第三扇出走线33三者在衬底10的垂直投影互相不交叠,且紧密相邻排列。即第一扇出走线31、第二扇出走线32和第三扇出走线33在衬底10的垂直投影彼此之间不重合,同时,三种扇出走线的垂直投影彼此之间没有缝隙的紧密排布。如此一来,既可以节省同层设置时走线与走线之间的间隙所占用的空间,减小下台阶宽度,走线在沉底基板的正投影完全不交叠也可以避免走线之间产生交叠电容,不同层设置的走线与走线之间的空间间距也对应会增加,进一步减小了扇出走线之间的信号干扰。In addition, the vertical projections of the first fan-out traces 31 , the second fan-out traces 32 and the third fan-out traces 33 on the
图9为本发明实施例提供的另一种阵列基板中扇出走线的俯视结构示意图,参考图9,第三扇出走线33与第二扇出走线32在衬底10的垂直投影交叠。本发明实施例中,第三扇出走线33与第一扇出走线31以及第二扇出走线32在衬底10的垂直投影均交叠。从而进一步地减小扇出走线30在台阶区A2中占据面积,减小台阶区A2的宽度,减小边框,并增加占屏比。在其他实施方式中,第三扇出走线33还可以不与第一扇出走线31在衬底10的垂直投影交叠,而是仅与第二扇出走线32在衬底10的垂直投影交叠。故而,在一些可行的实施方式中,第三扇出走线33可以与第一扇出走线31和/或第二扇出走线32在衬底10的垂直投影交叠,以减小扇出走线30在台阶区A2中占据面积。FIG. 9 is a schematic top-view structural diagram of fan-out traces in another array substrate according to an embodiment of the present invention. Referring to FIG. 9 , the vertical projections of the third fan-out traces 33 and the second fan-out traces 32 on the
可选地,参考图9,第三扇出走线33与第二扇出走线32的交叠面积小于第三扇出走线33与第一扇出走线31的交叠面积。本发明实施例中,第三扇出走线33与第一扇出走线31在衬底10的垂直投影交叠,第三扇出走线33与第二扇出走线32在衬底10的垂直投影交叠。在垂直于衬底10所在平面的方向上,第三扇出走线33与第一扇出走线31的距离大于第三扇出走线33与第二扇出走线32的距离,第三扇出走线33与第二扇出走线32的交叠面积小于第三扇出走线33与第一扇出走线31的交叠面积。可以理解的是,交叠电容与距离成反比,交叠电容与交叠面积成正比。本发明实施例中,距离较大的第三扇出走线33与第一扇出走线31的交叠面积较大,距离较小的第三扇出走线33与第二扇出走线32的交叠面积较小,从而使第三扇出走线33、第一扇出走线31两者的交叠电容与第三扇出走线33、第二扇出走线32两者的交叠电容相一致,以均衡第三扇出走线33对第一扇出走线31以及第二扇出走线32造成的电性影响,使得在第一扇出走线31与第二扇出走线32上传输的数据信号具有相同或者近似程度的衰减,以保证显示的均一性。Optionally, referring to FIG. 9 , the overlapping area of the third fan-out
图10为本发明实施例提供的另一种阵列基板的剖面结构示意图,参考图10,数据线22位于第三金属层M3。本发明实施例中,第三扇出走线33与数据线22均位于第三金属层M3,第三扇出走线33可以与数据线22采用同种材料并在同一工艺中形成,以节省工艺制程。FIG. 10 is a schematic cross-sectional structure diagram of another array substrate according to an embodiment of the present invention. Referring to FIG. 10 , the data lines 22 are located in the third metal layer M3 . In the embodiment of the present invention, the third fan-out
图11为本发明实施例提供的另一种阵列基板的剖面结构示意图,图12为本发明实施例提供的另一种阵列基板的俯视结构示意图,图13为本发明实施例提供的另一种阵列基板的俯视结构示意图,参考图11、图12、图13,并结合参考图1,阵列基板还包括多条扫描线21,多条扫描线21位于显示区A1,沿第一方向延伸并沿第二方向排列。扫描线21位于第一金属层M1,数据线22位于第二金属层M2,第二金属层M2与第三金属层M3层采用相同的材料。本发明实施例中,第二扇出走线32与第三扇出走线33采用相同的材料,第二扇出走线32与第三扇出走线33具有相同的电阻率,从而减小了第二扇出走线32与第三扇出走线33上的压降之差,使得在第二扇出走线32与第三扇出走线33上传输的数据信号具有相同或者近似程度的衰减,以保证显示的均一性。FIG. 11 is a schematic cross-sectional structure diagram of another array substrate provided by an embodiment of the present invention, FIG. 12 is a top-view structural schematic diagram of another array substrate provided by an embodiment of the present invention, and FIG. 13 is another type of array substrate provided by an embodiment of the present invention. 11 , 12 , and 13 , and with reference to FIG. 1 , the array substrate further includes a plurality of
示例性地,参考图11、图12、图13,并结合参考图1,扫描线21、薄膜晶体管50的栅极52以及存储电容60的第一极板61位于第一金属层M1,薄膜晶体管50的源极51、薄膜晶体管50的漏极54、数据线22和第二扇出走线32位于第二金属层M2。11 , 12 , and 13 , and with reference to FIG. 1 , the
可选地,参考图11、图12、图13,并结合参考图1,显示区A1包括多个阵列排布的像素100,像素100包括多个子像素110,多个子像素110包括第一子像素101、第二子像素102和第三子像素103。沿第二方向,与多个第一子像素101以及多个第二子像素102电连接的数据线22为第一数据线221,与多个第三子像素103电连接的数据线22为第二数据线222。一条第一数据线221与一条第二扇出走线32或者一条第三扇出走线33电连接,一条第二数据线222与一条第一扇出走线31电连接。Optionally, referring to FIG. 11 , FIG. 12 , and FIG. 13 , and with reference to FIG. 1 , the display area A1 includes a plurality of
本发明实施例中,部分第一子像素101电连接至第二扇出走线32,另一部分第一子像素101电连接至第三扇出走线33,类似地,部分第二子像素102电连接至第二扇出走线32,另一部分第二子像素102电连接至第三扇出走线33,位于第二金属层M2的第二扇出走线32与位于第三金属层M3的第三扇出走线33采用相同的材料,第二扇出走线32与第三扇出走线33具有相同的电阻率,从而减小了第二扇出走线32与第三扇出走线33上的压降之差,使得在第二扇出走线32与第三扇出走线33上传输的数据信号具有相同或者近似程度的衰减,使得接收第二扇出走线32传输数据信号的第一子像素101与接收第三扇出走线33传输该数据信号的第一子像素101具有相同或者相近的发光亮度,使得接收第二扇出走线32传输数据信号的第二子像素102与接收第三扇出走线33传输该数据信号的第二子像素102具有相同或者相近的发光亮度,以保证显示的均一性。In the embodiment of the present invention, some of the first sub-pixels 101 are electrically connected to the second fan-out traces 32 , and another part of the first sub-pixels 101 are electrically connected to the third fan-out traces 33 . Similarly, some of the second sub-pixels 102 are electrically connected to each other. To the second fan-
图14为本发明实施例提供的一种显示面板的结构示意图,参考图14,显示面板400包括上述实施例中的阵列基板200。显示面板400可以为有机发光显示面板、液晶显示面板或者电泳显示面板等。FIG. 14 is a schematic structural diagram of a display panel according to an embodiment of the present invention. Referring to FIG. 14 , the
示例性地,参考图14,显示面板400还包括与阵列基板200相对设置的对置基板300,对置基板300例如可以为彩膜基板或者封装盖板。彩膜基板例如可以包括色阻和黑色矩阵等公知结构,在此不再赘述。For example, referring to FIG. 14 , the
本发明实施例还提供了一种显示装置,图15为本发明实施例提供的一种显示装置的结构示意图,如图15所示,本发明实施例提供的显示装置包括上述显示面板400。显示装置可以为图15中所示的手机,也可以为电脑、电视机、智能穿戴设备等,本发明实施例对此不作特殊限定。An embodiment of the present invention further provides a display device. FIG. 15 is a schematic structural diagram of a display device provided by an embodiment of the present invention. As shown in FIG. 15 , the display device provided by an embodiment of the present invention includes the above-mentioned
注意,上述仅为本发明的较佳实施例及所运用技术原理。本领域技术人员会理解,本发明不限于这里所述的特定实施例,对本领域技术人员来说能够进行各种明显的变化、重新调整、相互结合和替代而不会脱离本发明的保护范围。因此,虽然通过以上实施例对本发明进行了较为详细的说明,但是本发明不仅仅限于以上实施例,在不脱离本发明构思的情况下,还可以包括更多其他等效实施例,而本发明的范围由所附的权利要求范围决定。Note that the above are only preferred embodiments of the present invention and applied technical principles. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, combinations and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and can also include more other equivalent embodiments without departing from the concept of the present invention. The scope is determined by the scope of the appended claims.
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