CN110911323A - Wafer rotating and drying tank for wafer wet processing equipment - Google Patents
Wafer rotating and drying tank for wafer wet processing equipment Download PDFInfo
- Publication number
- CN110911323A CN110911323A CN201911332461.8A CN201911332461A CN110911323A CN 110911323 A CN110911323 A CN 110911323A CN 201911332461 A CN201911332461 A CN 201911332461A CN 110911323 A CN110911323 A CN 110911323A
- Authority
- CN
- China
- Prior art keywords
- placing
- wafer
- rack
- transmission
- transmission shaft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Drying Of Solid Materials (AREA)
Abstract
本发明公开了一种晶圆湿制程设备用晶圆旋转甩干槽，包括供放置晶圆的放置架机构、第一驱动机构以及第二驱动机构，所述放置架机构与第一驱动机构传动连接进而所述放置架机构整体可沿所述第一驱动机构的输出轴旋转以供甩干，所述放置架机构自身相对所述输出轴的轴向方向可调节摆转地设置，所述放置架机构与所述第二驱动机构控制连接进而通过所述第二驱动机构控制定位所述放置架机构的摆转位置。本发明所提供的晶圆湿制程设备用晶圆旋转甩干槽，其结构精巧，方便操作，通过可调节摆转的放置架实现晶圆的垂直旋转甩干以及水平旋转甩干工作。
The invention discloses a wafer rotating and drying tank for wafer wet process equipment, comprising a placing rack mechanism for placing wafers, a first driving mechanism and a second driving mechanism, the placing rack mechanism and the first driving mechanism are driven Connected so that the entire placement rack mechanism can be rotated along the output shaft of the first drive mechanism for drying, and the placement rack mechanism itself is arranged in an adjustable swing relative to the axial direction of the output shaft, the placement rack mechanism The rack mechanism is in control connection with the second drive mechanism, and the swing position of the placement rack mechanism is controlled and positioned by the second drive mechanism. The wafer rotary drying tank for the wafer wet process equipment provided by the present invention has a compact structure and is convenient to operate, and realizes the vertical rotation and horizontal rotation drying of the wafer through the adjustable swing placement rack.
Description
Technical Field
The invention relates to a wafer rotating and drying groove for wafer wet processing equipment.
Background
In the IC industry, the rotary rinsing and spin-drying process is an important link of wafer cleaning treatment. The existing rotary spin-drying tank equipment can only be used for fixing one axial rotary spin-drying, and the arrangement position or orientation of a wafer cannot be movably adjusted. When a vertically placed wafer rotates along a vertical axis, the surface of the wafer is subjected to a large centrifugal force impact, and after the wafer is continuously rotated too fast, impact damage may be caused to the surface (particularly the edge) of the wafer.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a wafer rotating and drying groove for wafer wet processing equipment.
In order to achieve the purpose, the method is realized by the following technical scheme:
the utility model provides a wet processing procedure equipment of wafer is with rotatory groove of getting rid of futilely, is including supplying the storage rack mechanism, first actuating mechanism and the second actuating mechanism of placing the wafer, storage rack mechanism is connected with the transmission of first actuating mechanism and then the whole frame of putting can be followed first actuating mechanism's output shaft is rotatory for spin-drying, storage rack mechanism self is relative the adjustable ground setting of pendulum of the axial direction of output shaft, storage rack mechanism with second actuating mechanism control connection and then pass through second actuating mechanism control location the pendulum of storage rack mechanism changes the position.
Preferably, the placing rack mechanism comprises a placing table, the placing table is provided with a placing rack, a transmission shaft mechanism is arranged below the placing table, the first driving mechanism comprises a first driving motor, the transmission shaft mechanism and the placing table are provided with a central through hole, the first driving motor is in transmission connection with the transmission shaft mechanism so as to drive the placing table to rotate along the central through hole shaft, the second driving mechanism comprises a second driving motor, an output shaft of the second driving motor is movably and telescopically arranged in the central through hole, the rack is provided with a transmission connecting rod assembly, the rack can freely swing and rotate relative to the axial direction of the central through hole, the transmission connecting rod assembly is linked into the central through hole along with the swinging of the placing rack, and an output shaft of the second driving motor is movably supported on the transmission connecting rod assembly so as to limit the swinging position of the placing rack.
Preferably, including casing frame, rack mechanism locates in the casing frame, transmission shaft mechanism includes transmission pivot and outer fixing base, outer fixing base install in casing frame is last, place the platform rotationally install in on the outer fixing base, the activity of transmission pivot is worn to locate in the outer fixing base, the upper end fixed connection of transmission pivot in place the platform, the transmission pivot with be equipped with the bearing between the outer fixing base, a driving motor pass through the drive belt connect in transmission pivot and then drive place the platform rotation, the axle center of transmission pivot link up in order to form central through-hole.
Preferably, the first driving motor is fixedly installed at the side of the bottom of the casing frame, and the second driving motor is fixedly installed below the bottom surface of the casing frame, so that an output shaft of the second driving motor vertically penetrates into the central through hole.
Preferably, the placing frame is eccentrically arranged on the placing table and can freely swing and rotate along with the gravity center of the placing frame, and the transmission connecting rod assembly comprises a linkage pushing block which vertically moves in the central through hole; when the output shaft of the second driving motor ascends and props against the ascending limit position of the linkage pushing block, the transmission connecting rod assembly props against the placing frame so that the placing frame is perpendicular to the placing table; when the output shaft of the second driving motor descends and props against the descending limit position of the linkage pushing block, the transmission connecting rod assembly loosens the placing frame so that the placing frame is horizontal to the placing table.
Preferably, the rack is arranged on the placing table through a vertical support rod, two sides of the rack are connected to the top end of the vertical support rod through movable shafts, so that the rack can eccentrically swing around the movable shafts, the transmission connecting rod assembly comprises a linkage connecting rod and a gear transmission shaft, the gear transmission shaft is horizontally arranged on the placing table and can rotate, the upper end of the linkage connecting rod is fixedly connected to the movable shafts, the lower end of the linkage connecting rod is fixedly connected to the end part of the gear transmission shaft, so that the linkage connecting rod is linked along with the swing of the rack, the linked linkage connecting rod drives the gear transmission shaft to rotate, the gear transmission shaft is provided with a transmission gear, a lifting tooth block capable of movably lifting is arranged in the central through hole to form the linkage pushing block, and the lifting tooth block is meshed with the transmission gear, and an output shaft of the second driving motor is telescopically supported on the lifting tooth block so as to limit the rotation of the gear transmission shaft and further force the linkage connecting rod to control the swinging position of the placing rack.
Preferably, a central fixing block is installed at the central through hole of the placing table, and the lifting tooth block is slidably arranged on the central fixing block and then lifted in the central through hole.
Preferably, a wafer blocking mechanism is arranged on the placing table, and when the placing frame is horizontal to the placing table, the wafer blocking mechanism is correspondingly blocked on the wafer placed on the placing frame.
Preferably, the wafer blocking mechanism is arranged in a reciprocating swinging manner and is forced to be linked with the transmission connecting rod assembly, and an output shaft of the second driving motor is simultaneously lifted, retracted and supported on the wafer blocking mechanism and the transmission connecting rod assembly; when the output shaft of the second driving motor rises to be supported, the wafer blocking mechanism is far away from the placing frame; when the output shaft of the second driving motor descends to prop, the wafer blocking mechanism is close to the placing frame.
Preferably, the wafer blocking mechanism is elastically forced to be linked with the transmission connecting rod assembly.
Preferably, the wafer blocking mechanism comprises at least two blocking rods, the bottom ends of the blocking rods are arranged on the placing table in a reciprocating swinging mode through a swinging installation block, an actuating push rod is arranged on the swinging installation block and extends towards the central through hole, a lifting connecting rod is arranged on the central fixed block in a sliding mode, the upper end of the lifting connecting rod is hinged to the extending end of the actuating push rod, the lower end of the lifting connecting rod extends to the lower end of the lifting tooth block and is linked with the lifting tooth block in a descending mode in the central through hole, and then the output shaft of the second driving motor is simultaneously lifted and supported on the lifting connecting rod and the lifting tooth block in a retracting mode; when the output shaft of the second driving motor ascends to prop, the lifting connecting rod ascends and pushes the actuating push rod to force the stop rod to be far away from the vertical placing rack; when the output shaft of the second driving motor descends to prop, the lifting connecting rod is forced to descend along with the lifting tooth block and pulls the actuating push rod to force the stop lever to be close to the horizontal placing rack, and the wafer horizontally placed on the placing rack is limited and blocked by the stop lever.
Preferably, a spring rod piece penetrates through the lifting tooth block, the spring rod piece elastically stretches out and draws back to the bottom of the lifting tooth block, and then when the lifting tooth block descends, the spring rod piece elastically pushes against the lifting connecting rod.
Preferably, the drying machine comprises a machine shell frame, wherein the placing frame mechanism is arranged in the machine shell frame, and a heating mechanism, a drying mechanism and a drying mechanism are arranged on the machine shell frame.
Preferably, the heating mechanism is a quartz heater and is mounted at the bottom of the chassis frame and the placing frame mechanism.
Preferably, the drying mechanism is an oven and is installed at one side of the casing frame and the placing frame mechanism.
Preferably, the drying mechanism is a blower and is mounted on the other side of the casing frame and the placing frame mechanism relative to the drying mechanism, and a switchable grid plate window is arranged between the blower and the placing frame mechanism.
Preferably, the device comprises a machine shell frame, the placing frame mechanism is arranged in the machine shell frame, and the top of the machine shell frame is provided with an openable cover plate.
Preferably, the top of the casing frame is provided with a plurality of cover plates, and at least two cover plates are foldable to open and close the fan at the top of the casing frame through a hinge structure.
The beneficial effects of the invention include:
1) the utility model provides a rack mechanism can not only rotate and carry out perpendicular or vertical spin-drying along with first actuating mechanism, can also be under second actuating mechanism's control, the direction of relative rotation axis carries out the regulation of perpendicular or even horizontally pendulum and changes, when the rack level of regulation in placing rack mechanism is in the position of placing the platform, insert the wafer of locating in the rack and just can carry out the horizontal rotation and spin-dry, spin-dry for the rotation under perpendicular or vertical state, the whipping centrifugal impact force that the wafer received is little a lot less (almost none), thus, realize the mode of spin-drying under two states, avoid causing impact damage to the wafer surface.
2) The placing table is in transmission connection with the first driving mechanism through the transmission shaft mechanism so as to rotate along the axial direction of the central through hole of the transmission shaft mechanism; meanwhile, the placing rack is eccentrically installed, and further, under the condition of no stress, the placing rack swings and rotates around the horizontal activity on the placing platform under the action of self gravity, the two sides of the placing rack are also fixedly connected with transmission connecting rod assemblies, the transmission connecting rod assemblies are linked along with the swinging and rotation of the placing rack so as to drive lifting tooth blocks in the transmission connecting rod assemblies to move up and down, an output shaft of a second driving motor is telescopically lifted in the central through hole, and when the output shaft of the second driving motor rises and props at the lifting limit position of the lifting tooth blocks, the transmission connecting rod assemblies prop the placing rack so that the placing rack is perpendicular to the placing platform; when the output shaft of the second driving motor descends and props against the descending limit position of the linkage pushing block, the transmission connecting rod assembly loosens the placing frame so that the placing frame is horizontal to the placing table; in this way, vertical and horizontal placement of the rack is adjustably achieved through mechanical cooperation.
3) Furthermore, a wafer blocking mechanism is also arranged on the placing table, the wafer blocking mechanism is elastically forced to be linked with the transmission connecting rod assembly, and when the output shaft of the second driving motor is lifted and retracted simultaneously, the output shaft is supported on the lifting connecting rod and the lifting tooth block; when the output shaft of the second driving motor ascends to prop, the lifting connecting rod ascends and pushes the actuating push rod to force the stop rod to be far away from the vertical placing rack; when the output shaft of the second driving motor descends and props up, the lifting connecting rod is forced to descend along with the lifting tooth block and pulls the actuating push rod to force the stop lever to be close to the horizontal placing rack, and the wafer horizontally placed on the placing rack is stopped by the stop lever in a limiting mode; therefore, through mechanical cooperation, the blocking and limiting of the horizontal wafers are achieved adjustably and synchronously, and the wafers which rotate horizontally are prevented from running out of the placing frame and the hanging basket.
4) The spin-drying rack is also provided with a shell frame, and a shell can be arranged on the shell frame to protect the placing rack mechanism and spin-dry in the shell frame; the shell frame is also internally provided with a quartz heater, an oven and a blower so as to heat, dry and blow the wafer all around while spin-drying, and the functions are comprehensive.
Drawings
FIG. 1 is a schematic view of the overall structure of a wafer spin-dry tank for a wafer wet processing apparatus according to the present invention.
Fig. 2 is a schematic view of a back structure corresponding to fig. 1.
Fig. 3 is a schematic perspective view of the chassis frame and the cover plate in fig. 1.
Fig. 4 is a schematic top view of fig. 3.
Fig. 5 is a schematic perspective view of the connection and matching between the first driving mechanism and the rack mechanism in fig. 1.
Fig. 6 is a schematic perspective view corresponding to another view angle after the wafer is hidden in fig. 5.
Fig. 7 is a schematic structural diagram corresponding to the transmission connection between the first driving motor and the placing table in fig. 5.
Fig. 8 is a schematic structural view of a lower transmission shaft mechanism of the placing table corresponding to fig. 7.
Fig. 9 is a schematic perspective view of the connection and matching between the second driving mechanism and the rack mechanism in fig. 6.
Fig. 10 is a schematic top enlarged view corresponding to the area a in fig. 9.
Fig. 11 is a schematic perspective view of the back side of the structure corresponding to fig. 9.
Fig. 12 is an enlarged schematic structural view corresponding to the region B in fig. 11.
Fig. 13 is a schematic side view of the rack and its transmission link assembly of fig. 11.
Fig. 14 is a schematic view of a structure corresponding to fig. 13.
Fig. 15 is a schematic view of the matching relationship between the wafer blocking mechanism and the lower lifting shaft of the placing table in fig. 9 or fig. 10.
Fig. 16 is an enlarged perspective view corresponding to the area C in fig. 15.
Fig. 17 is a schematic view of the wafer in fig. 1 or 5 after being swung to a flat position.
Fig. 18 is a schematic side view of the carriage mechanism and the second driving motor in fig. 17.
Detailed Description
The invention is described in detail below with reference to the attached drawing figures:
as shown in fig. 1 and 2, a wafer rotating and spin-drying groove for wafer wet process equipment comprises a placing frame mechanism 2 for placing a wafer 99, a first driving mechanism 3, a second driving mechanism 4 and a casing frame 1, wherein the placing frame mechanism 2 is arranged in the casing frame 1, the placing frame mechanism 2 is in transmission connection with the first driving mechanism 3 and then the placing frame mechanism 2 can integrally follow the output shaft of the first driving mechanism 3 to rotate for spin-drying, the placing frame mechanism 2 is relative to the axial direction of the output shaft and can be adjusted to swing and rotate, and the placing frame mechanism 2 is in control connection with the second driving mechanism 4 and then is controlled and positioned by the second driving mechanism 4 to swing and rotate the placing frame mechanism 2.
Specifically, the casing frame 1 is provided with a heating mechanism 5, a drying mechanism 6 and a blow-drying mechanism 7. The heating mechanism is a quartz heater 5 and is arranged at the bottom of the machine shell frame 1 and the placing frame mechanism 2. The drying mechanism is an oven 6 and is installed on one side part of the machine shell frame 1 and the placing frame mechanism 2. The drying mechanism is a blower 7 and is opposite to the drying mechanism 6 which is arranged on the other side part of the machine shell frame 1 and the placing frame mechanism 2, and a switchable grid plate window 70 is arranged between the blower 7 and the placing frame mechanism 2. The shell can be arranged around the shell frame 1 to play a role in overall protection and isolation.
The top of the cabinet frame 1 shown in fig. 3 and 4 is provided with an openable cover plate 8. The top of the casing frame 1 is provided with a plurality of cover plates 8, and at least two cover plates 8 can be folded and opened at the top of the casing frame 1 through a hinge structure 80 or a connecting rod structure. In fig. 4 the two cover plates 8 are hidden.
As shown in fig. 5 and 6, the placing frame mechanism 2 includes a placing table 20, a frame basket type placing frame 22 is disposed on the placing table 20, a transmission shaft mechanism 9 is disposed under the placing table 20, the first driving mechanism includes a first driving motor 3, the transmission shaft mechanism 9 and the placing table 20 are provided with a central through hole 90, the first driving motor 3 is in transmission connection with the transmission shaft mechanism 9 to drive the placing table 20 to rotate along the central through hole 90, the second driving mechanism includes a second driving motor 4, an output shaft 40 of the second driving motor 4 movably and telescopically penetrates through the central through hole 90, a transmission link assembly 21 is disposed on the placing frame 22, the placing frame 22 can freely swing in the axial direction of the central through hole 90, the transmission link assembly 21 is linked to the central through hole 90 along with the swinging of the placing frame 22, the output shaft 40 of the second driving motor 4 is movably supported on the transmission link assembly 21 so as to limit the swing position of the placing rack 22. The first driving motor 3 is fixedly installed at the side of the bottom of the casing frame 1, the second driving motor 4 is fixedly installed under the bottom of the casing frame 1, and the output shaft 40 of the second driving motor 4 vertically penetrates into the central through hole 90.
As shown in fig. 7 and 8, the transmission shaft mechanism 9 includes a transmission shaft 92 and an outer fixing seat 94, the outer fixing seat 94 is mounted on the middle seat 18 of the chassis frame 1 (see fig. 3 and 4), the placing table 20 is rotatably mounted on the outer fixing seat 94, the transmission shaft 92 is movably inserted into the outer fixing seat 94, the upper end of the transmission shaft 92 is fixedly connected to the placing table 20, a bearing 96 (in fig. 8, the outer fixing seat 94 is hidden) is disposed between the transmission shaft 92 and the outer fixing seat 94, the bottom of the first driving motor 3 is connected to the bottom of the transmission shaft 92 through a transmission belt 30 to drive the placing table 20 to rotate, and the axis of the transmission shaft 92 penetrates through to form the central through hole 90.
As shown in fig. 9 to 12, the placing frame 22 is eccentrically mounted on the placing table 20 and can freely swing along with the gravity center of the placing table, and the transmission link assembly 21 includes a linkage pushing block 210 which moves up and down in the central through hole 90; when the output shaft 40 of the second driving motor 4 rises and props against the rising limit position of the linkage pushing block 210, the transmission link assembly 21 props against the placing frame 22 so that the placing frame 22 is perpendicular to the placing table 20; when the output shaft 40 of the second driving motor 4 descends and props against the descending limit position of the linkage pushing block 210, the transmission link assembly 21 releases the placing frame 22 so that the placing frame 22 is horizontal to the placing table 20.
Specifically, as shown in fig. 13 and 14 in conjunction, the placement stage 20 in fig. 13 is hidden. The placing frame 22 is arranged on the placing table 20 through vertical support rods 222 on two sides, two sides of the placing frame 22 are connected to the top ends of the vertical support rods 220 through movable shafts 220, so that the placing frame 22 can eccentrically swing around the movable shafts 220, the transmission connecting rod assembly 21 comprises two groups of linkage connecting rods 211 on two sides and a gear transmission shaft 212, the gear transmission shaft 212 is horizontally arranged on the placing table 20 and can rotate, the upper end of the linkage connecting rod 211 is fixedly connected to the movable shafts 220, the lower end of the linkage connecting rod 211 is fixedly connected to the end part of the gear transmission shaft 212, so that the linkage connecting rod 211 is linked along with the swing of the placing frame 22, the linked linkage connecting rod 211 drives the gear transmission shaft 212 to rotate, a transmission gear 213 is fixedly arranged on the middle part of the gear transmission shaft 212, and a movable lifting tooth block 210 is arranged in the central through hole 90 to form the linked top pushing block, the lifting tooth block 210 is engaged with the transmission gear 213, and the output shaft 40 of the second driving motor 4 is telescopically supported on the lifting tooth block 210 to limit the rotation of the gear transmission shaft 212 so as to force the linkage connecting rod 211 to control the swing position of the placing frame 22.
Wherein, the central through hole 90 of the placing table 20 is fixedly provided with a central fixing block 29, and the lifting tooth block 210 is slidably arranged on the central fixing block 29 and lifted in the central through hole 90. The linkage link 211 may be an articulated three-link structure.
On the other hand, the placing table 20 is provided with a wafer blocking mechanism 24 for blocking and limiting the horizontally placed wafer 99. As shown in fig. 9, 10, 11, 12, 15 and 16, when the placing frame 22 is horizontal to the placing table 20, the wafer blocking mechanism 24 blocks the wafer 99 placed on the placing frame 22. Specifically, the wafer blocking mechanism 24 is disposed in a reciprocating and swinging manner and is elastically forced to be linked to the transmission link assembly 21, and the output shaft 40 of the second driving motor 4 is simultaneously lifted, retracted and supported by the wafer blocking mechanism 24 and the transmission link assembly 21; when the output shaft 40 of the second driving motor 4 is lifted and supported, the wafer blocking mechanism 24 is far away from the placing frame 22; when the output shaft 40 of the second driving motor 4 descends to prop, the wafer blocking mechanism 24 is close to the placing frame 22.
As shown in fig. 15 to 18, the wafer blocking mechanism 24 includes at least two blocking rods 240, the bottom ends of the blocking rods 240 are reciprocally and swingably mounted on the placing table 20 through a swing mounting block 242, an actuating push rod 244 is disposed on the swing mounting block 242, the actuating push rod 244 extends toward the central through hole 90, an L-shaped lifting connecting rod 246 is slidably disposed on the central fixing block 29, the upper end of the lifting connecting rod 246 is hinged to the extending end of the actuating push rod 244 through two ends of a straight rod, the lower end of the lifting connecting rod 246 extends to the lower end of the lifting tooth block 210 and is linked with the lifting tooth block 210 descending in the central through hole 90, and further, the output shaft 40 of the second driving motor 4 is simultaneously lifted and supported on the lifting connecting rod 246 and the lifting tooth block 210; when the output shaft 40 of the second driving motor 4 is lifted and supported, the lifting connecting rod 246 is lifted and pushes the actuating push rod 244 to force the stop lever 240 to move away from the vertical placing frame 22; when the output shaft 40 of the second driving motor 4 descends and props up, the lifting connecting rod 246 is forced to descend along with the lifting tooth block 210 and pulls the actuating push rod 244 to force the stop lever 240 to approach the horizontal placing rack 22, and the wafer 99 horizontally placed on the placing rack 22 is stopped by the stop lever 240.
As shown in fig. 15 and 16, a spring rod 219 passes through the lifting gear block 210 (hidden) or the central fixing block 29, the spring rod 219 elastically extends and retracts to the bottom of the lifting gear block 210, and when the lifting gear block 210 descends, the spring rod 219 elastically contacts the lifting connecting rod 246. Thus, elastic driving is realized.
After having the above structural features, the present invention can be implemented as follows:
a. as shown in fig. 1 and 2, the cover plate 8 is opened, a plurality of wafers 99 placed in order in the hanging basket 98 are slowly placed on the placing rack 22 in the machine shell frame 1 and fixedly mounted, the second driving motor 4 is started, the output shaft 40 of the second driving motor 4 is made to ascend, support the lifting connecting rod 246 and the lifting tooth block 210 until reaching the ascending limit position, and thus, the plurality of wafers 99 are all perpendicular to the placing platform 20.
b. Closing the cover plate 8, starting the first driving motor 3 to rotate the placing table 20, and further rotating the plurality of vertically/vertically placed wafers 99 along the vertical shaft for a period of time to perform the vertical spin-drying operation at the first stage; while the wafer is dried, the quartz heater 5, the oven 6 and the blower 7 in the casing frame 1 are sequentially started to heat, dry and dry the wafer 99 comprehensively.
c. And (5) turning off the first driving motor 3 and finishing the first-stage drying. The output shaft 40 of the second driving motor 4 is controlled to descend, and as the output shaft descends for a certain distance, the lifting connecting rod 246 and the lifting tooth block 210 gradually lose jacking force and gradually descend (as shown by arrows in the figures), the transmission link assembly 21 is in a loose state, further, the placing frame 22 freely swings from a vertical position to a horizontal position under the action of self gravity, the lifting tooth block 210 is linked to descend under the transmission of the transmission link assembly 21 and downwards drives the lifting connecting rod 246 to descend together, so as to pull the stop lever 240 of the wafer blocking mechanism 24 to approach the placing frame 22, after the lifting connecting rod 246 and the lifting tooth block 210 descend to a certain position, the lifting tooth block is still propped by the output shaft 40 of the second driving motor 4, namely, the lifting tooth block reaches a descending limit position, therefore, after the wafer 99 on the placing frame 22 swings for 90 degrees, the wafer 99 keeps horizontal relative to the placing frame 20, and meanwhile, the two stop levers 240 can just block the, as shown in fig. 17 and 18. After the swing of the placing frame 22 is completed, the first driving motor 3 is started again, the placing table 20 is rotated, and the horizontal spin-drying work of the second stage is continued.
d. After the second stage of spin-drying operation is completed, the first driving motor 3 is turned off, the placing table 20 stops rotating, the placing frame 22 can be returned to the vertical position by the supporting of the second driving motor 4 (as shown by arrows in the figures), the cover plate 8 is opened again, and finally the wafer 99 and the hanging basket 98 which are vertically placed after the spin-drying operation are taken out of the casing frame. Thus, all the operation processes are completed.
The wafer rotating and drying groove for the wafer wet processing equipment provided by the invention has the advantages of exquisite structure and convenience in operation, and the vertical rotating and drying and the horizontal rotating and drying work of the wafer are realized through the adjustable swinging and rotating placing rack.
The embodiments of the present invention are merely illustrative, and not restrictive, of the scope of the claims, and other substantially equivalent alternatives may occur to those skilled in the art and are within the scope of the present invention.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911332461.8A CN110911323B (en) | 2019-12-22 | 2019-12-22 | Wafer spin drying tank for wafer wet process equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911332461.8A CN110911323B (en) | 2019-12-22 | 2019-12-22 | Wafer spin drying tank for wafer wet process equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110911323A true CN110911323A (en) | 2020-03-24 |
| CN110911323B CN110911323B (en) | 2025-06-13 |
Family
ID=69827012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911332461.8A Active CN110911323B (en) | 2019-12-22 | 2019-12-22 | Wafer spin drying tank for wafer wet process equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110911323B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5339539A (en) * | 1992-04-16 | 1994-08-23 | Tokyo Electron Limited | Spindrier |
| JPH11288916A (en) * | 1998-04-06 | 1999-10-19 | Tokyo Electron Ltd | Drying processor |
| CN211088219U (en) * | 2019-12-22 | 2020-07-24 | 上海新阳半导体材料股份有限公司 | Wafer rotating and drying tank for wafer wet processing equipment |
-
2019
- 2019-12-22 CN CN201911332461.8A patent/CN110911323B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5339539A (en) * | 1992-04-16 | 1994-08-23 | Tokyo Electron Limited | Spindrier |
| JPH11288916A (en) * | 1998-04-06 | 1999-10-19 | Tokyo Electron Ltd | Drying processor |
| CN211088219U (en) * | 2019-12-22 | 2020-07-24 | 上海新阳半导体材料股份有限公司 | Wafer rotating and drying tank for wafer wet processing equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110911323B (en) | 2025-06-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN211088219U (en) | Wafer rotating and drying tank for wafer wet processing equipment | |
| CN107081300A (en) | A kind of medical operational tool Rapid Cleaning drying plant | |
| CN112873192A (en) | Mechanical arm for clamping reinforced grinding workpiece | |
| CN110911323A (en) | Wafer rotating and drying tank for wafer wet processing equipment | |
| CN210107909U (en) | Be used for gold thread lotus drying device | |
| CN205463443U (en) | Computer motherboard surface cleaning processing system | |
| CN211106661U (en) | Pottery art sculpture preparation platform | |
| CN216534992U (en) | Pizza oven with automatic turntable | |
| CN213095771U (en) | Improved moon cake baking machine | |
| CN114717803B (en) | Lifting base and washing machine with same | |
| CN109237894A (en) | A kind of mushroom drying heating cabinet mobile mechanism | |
| CN113847798A (en) | Fabric drying device for textile operation | |
| CN209013657U (en) | A kind of chemicals highly effective drying case | |
| CN219603998U (en) | Adjusting component of clothes ironing device | |
| CN114111253A (en) | Multifunctional fruit and vegetable drying equipment for producing original ecological fruit and vegetable products | |
| CN205505632U (en) | Efficient ore drying device | |
| CN219556191U (en) | A fry tea machine for tealeaves processing | |
| CN112916458A (en) | Method for preparing electronic element wafer | |
| CN215638485U (en) | A cure equipment for tea processing | |
| CN219756856U (en) | Layered dryer | |
| CN221729671U (en) | A stir-frying device for roasted seeds and nuts production | |
| CN220366644U (en) | Drying equipment | |
| CN221493512U (en) | Full-automatic ceramic treatment ultrasonic cleaner | |
| CN214031591U (en) | Bearing cap jacking and transplanting device | |
| CN220724268U (en) | Hanging device for heat treatment of cutter |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |