CN110888276B - Liquid crystal display panel - Google Patents
Liquid crystal display panel Download PDFInfo
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- CN110888276B CN110888276B CN201911109298.9A CN201911109298A CN110888276B CN 110888276 B CN110888276 B CN 110888276B CN 201911109298 A CN201911109298 A CN 201911109298A CN 110888276 B CN110888276 B CN 110888276B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
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- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
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- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
Abstract
The application provides a liquid crystal display panel, through set up electrically conductive frame glue between a plurality of terminals and various membrane base plate of array base plate, the cover brilliant film is bound on electrically conductive frame glue and the side of the thickness direction of terminal to increase the electrical property area of contact when covering brilliant film and binding, thereby improve the yield of binding of cover brilliant film.
Description
Technical Field
The application relates to the technical field of display, in particular to a liquid crystal display panel.
Background
In recent years, the Display industry of Liquid Crystal Display (LCD) devices has been developed, and the appearance of LCD panels has been gradually narrowed. Such as narrow-frame televisions and full-screen mobile phones, the non-display area at the edge of the liquid crystal display device is narrowed, so that the area of the display area is increased, the screen occupation ratio is improved, and the frame of the display device is in a simpler and more detailed shape, so that the products manufactured by the liquid crystal display device are more attractive.
At present, the liquid crystal display device can realize a narrow frame with a width of less than 1 mm by using a Side binding (Side binding) technology. The side Bonding technology is to print metal lines on the side of the array substrate, electrically contact the metal lines with external Lead pads (OLBpad) on the side of the array substrate, and bond the chip on film on the metal lines, so that the electrical signal of the chip on film is output to the external output Lead pads to control the liquid crystal display device to display. However, the side bonding technology has a problem that the gap between the array substrate and the color film substrate on one side of the bonded flip chip film is difficult to control, which causes poor contact between the metal wires and the external output pins, and affects the display effect of the liquid crystal display device.
Disclosure of Invention
An object of the present application is to provide a liquid crystal display panel to improve the bonding yield when bonding the flip chip film side.
In order to realize the purpose, the technical scheme is as follows:
a liquid crystal display panel is provided, one end edge of the liquid crystal display panel is provided with a terminal area, the liquid crystal display panel comprises an array substrate, a color film substrate, conductive frame glue and a flip chip film, the color film substrate and the array substrate are arranged oppositely,
the array substrate comprises a plurality of terminals arranged in the terminal area;
the conductive frame glue is positioned in the terminal area and at least arranged between the plurality of terminals and the color film substrate;
the flip chip film is bound on the side surfaces of the conductive frame glue and the terminal in the thickness direction.
In the liquid crystal display panel, the liquid crystal display panel further includes a plurality of supporting portions located in the terminal area and disposed between the array substrate and the color film substrate, and the height of each supporting portion is less than or equal to the distance between the portion of the array substrate corresponding to the terminal area and the portion of the color film substrate corresponding to the terminal area.
In the above liquid crystal display panel, the conductive sealant covers the whole terminal area, and at least one of the supporting portions is disposed between two adjacent terminals.
In the liquid crystal display panel, the supporting portion is disposed on the array substrate and/or the color filter substrate.
In the liquid crystal display panel, the supporting portion includes a second supporting portion disposed on the array substrate and a first supporting portion disposed on the color film substrate, and the first supporting portion and the second supporting portion are disposed in a one-to-one correspondence manner.
In the above liquid crystal display panel, a longitudinal section of the first support portion is an inverted trapezoid, and a longitudinal section of the second support portion is a trapezoid.
In the liquid crystal display panel, a distance between the support part close to the first edge and the first edge is 50 micrometers to 200 micrometers, and the first edge is an outer edge of the conductive frame glue.
In the liquid crystal display panel, the color film substrate includes a plurality of conductive blocks disposed in the terminal area, the conductive blocks and the terminals are disposed in a one-to-one correspondence, and the flip chip film is bonded to the conductive frame adhesive, the terminals, and the side surfaces of the conductive blocks in the thickness direction.
In the liquid crystal display panel, the array substrate is flush with the edge of the color film substrate.
In the liquid crystal display panel, the conductive frame glue comprises frame glue and conductive microspheres filled in the frame glue.
Has the beneficial effects that: the application provides a liquid crystal display panel, through set up the electric conduction frame glue between a plurality of terminals and various membrane base plate of array base plate, the cover brilliant film is bound on the side of electric conduction frame glue and terminal in the thickness direction to electric property area of contact when increasing the cover brilliant film and binding, thereby improve the binding yield of cover brilliant film.
Drawings
FIG. 1 is a schematic view of a first structure of a liquid crystal display panel according to an embodiment of the present disclosure;
FIG. 2 is a second schematic structural diagram of a liquid crystal display panel according to an embodiment of the present disclosure;
FIG. 3 is a first partial schematic view of the LCD panel shown in FIG. 2;
FIG. 4 is a second partial schematic view of the LCD panel shown in FIG. 2.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It should be apparent that the described embodiments are only a few embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Please refer to fig. 1, which is a first structural diagram of a liquid crystal display panel according to an embodiment of the present application. The liquid crystal display panel 100 may be one of a twisted nematic liquid crystal display panel, a planar switching liquid crystal display panel, or a vertical alignment liquid crystal display panel. Specifically, the liquid crystal display panel 100 is a twisted nematic liquid crystal display panel or a vertical alignment liquid crystal display panel. The liquid crystal display panel 100 has a display area 100a and a non-display area 100b located at the periphery of the display area 100 a. The edge of one end of the liquid crystal display panel 100 has a terminal area 100c, and the terminal area 100c is located in the non-display area 100b and located on a side of the non-display area 100b far away from the display area 100 a. The liquid crystal display panel 100 includes an array substrate 10, a color film substrate 20, a liquid crystal layer 30, a ring-shaped sealant 40, a conductive sealant 50, a flip-chip film 60, and a flexible printed circuit board 70.
The array substrate 10 of the display area 100a is provided with a plurality of thin film transistors T arranged in an array. The thin film transistor T comprises an active layer, a grid electrode, a source drain electrode, a grid electrode insulating layer, an interlayer insulating layer and a passivation layer, wherein the grid electrode insulating layer is arranged between the active layer and the grid electrode, the interlayer insulating layer is arranged between the source drain electrode and the grid electrode, the source drain electrode is electrically connected with the active layer, and the passivation layer covers the source drain electrode and the interlayer insulating layer. The thin film transistor T may be a bottom gate thin film transistor, and the thin film transistor T may also be a top gate thin film transistor. Specifically, as shown in fig. 1, the thin film transistor T is a top gate thin film transistor. The interlayer insulating layer 103, the gate insulating layer 102, and the passivation layer 104 are formed in the display region 100a and also in the non-display region 100b. A metal layer forming a gate electrode and source and drain electrodes is formed in the terminal region 100c as well as the display region 100 a.
A plurality of parallel data lines (not shown) and a plurality of parallel scan lines (not shown) are disposed on the array substrate 10 of the display region 100 a. Each data line is vertically intersected with each scanning line, pixels and a pixel driving circuit are arranged in an area enclosed by two adjacent data lines and two adjacent scanning lines, scanning signals are loaded into the scanning lines line by line so that the pixels in the line are loaded with the data signals to control the display state of the pixels in the line, wherein the pixel electrode 105, the liquid crystal layer 30 positioned between the array substrate 10 and the color film substrate 20, the common electrode 203 and the color film layer 201 form a plurality of pixels which are arranged in an array, and the pixel driving circuit comprises the thin film transistor and other devices.
The array substrate 10 includes a plurality of terminals 101 disposed in the terminal area 100 c. The partial terminal 101 is connected to a Gate driving circuit (GOA) through a first lead (not shown), the Gate driving circuit outputting a scan signal to the scan line, and the partial terminal 101 is electrically connected to the data line through a second lead (not shown). The terminals 101 are used for loading the electrical signals output by the driving chip on the chip on film 60, so that the scan lines are loaded with the scan signals and the data lines are loaded with the data signals. Since the width of the first lead and the width of the second lead are smaller than the width of the terminal 101 in the conventional technology, the reliability of signal loading is reduced by electrically connecting the first lead and the second lead with the chip on film to load the electrical signal, and the stability and reliability of signal loading can be further improved by electrically connecting the terminal 101 with the chip on film 60 to load the electrical signal.
Each terminal 101 may be composed of a metal layer. Each terminal 101 may also be composed of a metal layer and a metal oxide semiconductor layer. The metal oxide semiconductor layer plays a role in conducting electricity on one hand and protecting the metal layer from oxidation on the other hand. The metal oxide semiconductor layer may be formed through the same process as the pixel electrode on the array substrate 10. The metal oxide semiconductor layer and the metal layer can be electrically connected through the via hole or can be directly electrically contacted.
Specifically, as shown in fig. 1, each terminal 101 is composed of a portion of the first metal layer M1 corresponding to the terminal area 100c and a portion of the second metal layer M2 corresponding to the terminal area 100c, by removing the interlayer insulating layer 103 of the terminal area 100c, such that the first metal layer M1 and the second metal layer M2 of the terminal area 100c are in direct contact and the second metal layer M2 is located on the first metal layer M1, and by removing the passivation layer 104 of the terminal area 100c, such that the portion of the second metal layer M2 corresponding to the terminal area 100c is exposed. The first metal layer M1 and the gate of the thin film transistor T in the display area 100a are formed through the same process, the second metal layer M2 and the source/drain electrode of the thin film transistor T in the display area 100a are formed through the same process, and the first metal layer M1 and the second metal layer M2 are located in the non-display area 100b and extend from the terminal area 100c to the terminal area 100 c. The preparation material of the first metal layer M1 includes at least one of molybdenum, aluminum, titanium, copper and silver, the preparation material of the second metal layer M2 includes at least one of molybdenum, aluminum, titanium, copper and silver, the value range of the sum of the thicknesses of the first metal layer M1 and the second metal layer M2 is 80 micrometers-100 micrometers, that is, the thickness of the terminal 101 is 80 micrometers-100 micrometers. The width of the terminals 101 is 80-100 microns.
The color filter substrate 20 is disposed opposite to the array substrate 10. The color filter substrate 20 includes a color film layer 201 disposed in the display area 100a and a black matrix 202. The color film 201 includes a red photoresist R, a green photoresist G, and a blue photoresist B. One red photoresist R, one green photoresist G and one blue photoresist B form one repeating unit, and a plurality of repeating unit arrays are disposed on the color film substrate 20. A black matrix 202 is disposed between two adjacent photo-resists.
The color filter substrate 20 further includes a plurality of spacers PS disposed in the display area 100 a. After the color filter substrate 20 and the array substrate 10 are aligned to form the liquid crystal display panel 100, the spacer PS is used to support the array substrate 10 and the color filter substrate 20 to maintain the box thickness of the liquid crystal display panel 100. The spacer PS is prepared from an organic transparent photoresist. The spacers PS are columnar.
The array substrate 10 further includes a plurality of independent pixel electrodes 105 located in the display area 100a, and the pixel electrodes 105 are electrically connected to the drain electrodes of the thin film transistors T. The color filter substrate 20 further includes a common electrode 203 located in the display area 100 a. The pixel electrode 105 and the common electrode 203 are made of indium tin oxide.
The conductive sealant 50 is located in the terminal area 100c and at least disposed between the plurality of terminals 101 and the color filter substrate 20. The conductive sealant 50 serves to bond the portion of the array substrate 10 corresponding to the terminal area 100c and the portion of the color film substrate 20 corresponding to the terminal area 100c, so as to prevent gap variation caused by vibration during cutting to form a liquid crystal cell and edging or transportation, that is, the conductive sealant 50 is used to maintain a distance between the portion of the color film substrate 20 corresponding to the terminal area 100c and the portion of the array substrate 10 corresponding to the terminal area 100c, so as to improve stability of the distance between the portion of the color film substrate 20 corresponding to the terminal area 100c and the portion of the array substrate 10 corresponding to the terminal area 100c, on the other hand, the conductive sealant 50 is in direct contact with the plurality of terminals 101, the flip-chip film 60 is bonded to the sides of the conductive sealant 50 and the terminals 101 in the thickness direction, and compared with the conventional technology in which the flip-chip film is bonded to the sides of the first lead and/or the second lead in the thickness direction, a contact area of the flip-chip film bonded to the sides of the conductive sealant 50 and the terminals 101 is larger, so as to reduce contact resistance, which is beneficial to improve yield of the bonding of the flip-chip 60, and improve reliability and stability of the driving chip input electrical property number of the flip-chip.
The conductive sealant 50 includes a sealant and conductive microspheres filled in the sealant. The particle size of the conductive microspheres is 1-3 microns. The thickness of the conductive sealant 50 is equal to the distance between the portion of the color film substrate 20 corresponding to the terminal area 100c and the portion of the array substrate 10 corresponding to the terminal area 100 c. The distance between the part of the color film substrate 20 corresponding to the terminal area 100c and the part of the array substrate 10 corresponding to the terminal area 100c is 3-10 micrometers. The conductive sealant 50 may be disposed corresponding to the plurality of terminals 101 one by one, and the width of the conductive sealant 50 is equal to the width of the terminals 101. The conductive sealant 50 may also cover the entire terminal area 100c, so as to simplify the process of forming the conductive sealant 50. By applying pressure in the thickness direction of the conductive frame glue 50, the conductive microspheres gather in the thickness direction and contact with each other, so that the conductive frame glue 50 is conductive in the thickness direction and non-conductive in the horizontal direction, thus the conductive frame glue 50 can be conductive in the thickness direction and non-conductive in the horizontal direction, and the conductive part of the conductive frame glue 50 corresponds to the terminal 101.
The edges of the array substrate 10 and the color film substrate 20 are flush, so that the frame of the liquid crystal display panel 100 is reduced. The outer edge of the conductive sealant 50 is also flush with the edges of the array substrate 10 and the color filter substrate 20.
The plurality of silver lines 90 extend from the side surface of the array substrate 10 to the side surface of the conductive frame glue 50, and extend from the side surface of the conductive frame glue 50 to the side surface of the color film substrate 20, and the flip chip film 60 is bound on the plurality of silver lines 90 and directly contacts with the silver lines. Each silver wire 90 is provided corresponding to one terminal 101. The silver line 90 is obtained by coating conductive silver paste and removing the solvent. The width of the silver wire 90 may be greater than or equal to the width of the terminal 101 to increase the contact area between the silver wire 90 and the terminal 101, thereby improving the reliability of electrical signal transmission. The width of the silver wire 90 may be larger than the width of the output pad on the chip on film 60, so as to improve the reliability of the electrical signal transmission between the chip on film 60 and the silver wire 90. In addition, because the conductive frame glue 50 is arranged, the conductive frame glue 50 can prevent the broken lines or short circuits caused by silver paste infiltration when the conductive silver paste is printed, the silver wires 90 can also be in direct contact with the conductive frame glue 50 to increase the contact area, and the resistance of the electric signal output to the terminal 101 is reduced.
The flexible printed circuit board 70 is bonded to the chip on film 60 to load electrical signals to the driving chip of the chip on film 60. The ring-shaped sealant 40 is used for sealing the liquid crystal layer 30 to prevent liquid crystal leakage, and is used for bonding the array substrate 10 and the color film substrate 20.
Referring to fig. 2 and fig. 3, fig. 2 is a second structural schematic diagram of a liquid crystal display panel according to an embodiment of the present disclosure, and fig. 3 is a first partial schematic diagram of the liquid crystal display panel shown in fig. 2. The lcd panel shown in fig. 2 is substantially similar to the lcd panel shown in fig. 1, except that the lcd panel further includes a plurality of supporting portions 80 located in the terminal areas 100c and disposed between the array substrate 10 and the color filter substrate 20.
The supporting portion 80 is used for further maintaining the stability of the distance between the portion of the array substrate 10 corresponding to the terminal area 100c and the portion of the color filter substrate 20 corresponding to the terminal area 100 c. In consideration of the self weight of the array substrate 10 or the color filter substrate 20 and the vibration of the liquid crystal display panel 100 during transportation and the like, the height of the supporting portion 80 is less than or equal to the distance between the portion of the array substrate 10 corresponding to the terminal area 100c and the portion of the color filter substrate 20 corresponding to the terminal area 100c, and the stability of the distance between the portion of the array substrate 10 corresponding to the terminal area 100c and the portion of the color filter substrate 20 corresponding to the terminal area 100c is improved by the supporting and bonding effects of the conductive frame glue 50.
When the conductive sealant 50 covers the entire terminal area 100c, at least one supporting portion 80 is disposed between two adjacent terminals 101. At this time, the supporting portion 80 not only plays a role of maintaining the stable distance between the array substrate 10 and the color filter substrate 20 in the terminal area 100c, but also plays a role of avoiding a problem of short circuit between two adjacent terminals 101 caused by contact between conductive particles electrically connected with the two adjacent terminals 101, i.e., plays a role of isolating the conductive particles electrically contacted with the two adjacent terminals 101. It is understood that one support portion 80 may be provided between two adjacent terminals 101, or a plurality of support portions 80 may be provided.
The supporting portion 80 is disposed on the array substrate 10 and/or the color filter substrate 20. The supporting portion 80 may be a black matrix, a color film layer or a spacer disposed on the color filter substrate 20, and the supporting portion 80 may be made of the same halftone mask as the color film layer 201, the black matrix 202 or the spacer PS of the display area 100a of the color filter substrate 10. The supporting portion 80 may also be an organic photoresist disposed on the array substrate 10.
Specifically, as shown in fig. 3, the supporting portion 80 includes a second supporting portion 802 disposed on the array substrate 10 and a first supporting portion 801 disposed on the color filter substrate 20. The first support portions 801 and the second support portions 802 are provided in one-to-one correspondence. The sum of the height of the first supporting portion 801 and the height of the second supporting portion 802 is less than or equal to the distance between the portion of the array substrate 10 corresponding to the display area 100c and the portion of the color filter substrate 20 corresponding to the display area 100 c.
The first support portion 801 and the second support portion 802 may be disposed vertically symmetrically. The distance between the first supporting portion 801 and the second supporting portion 802 is smaller than the particle size of the conductive microspheres, so as to avoid signal crosstalk caused by contact between the conductive microspheres electrically connected to two adjacent terminals 101. The longitudinal section of the first supporting portion 801 is an inverted trapezoid, and the longitudinal section of the second supporting portion 802 is a trapezoid, so as to improve the supporting effect of the first supporting portion 801 and the second supporting portion 802 on the portion of the array substrate 10 corresponding to the terminal area 100c and the portion of the color filter substrate 20 corresponding to the terminal area 100 c. The longitudinal section of the first supporting portion 801 is an inverted trapezoid, and the longitudinal section of the second supporting portion 802 is a trapezoid, which is the shape of the first supporting portion 801 and the second supporting portion 802 when the color filter substrate 20 is located above the array substrate 10 when the liquid crystal display panel is horizontally placed. It can be understood that when the array substrate 10 is located above the color filter substrate 20, the longitudinal cross section of the first support portion 801 is a trapezoid, and the longitudinal cross section of the second support portion 802 is an inverted trapezoid. It is understood that the longitudinal sections of the first support portion 801 and the second support portion 802 may also be rectangular, semicircular, or the like.
Further, the distance between the support portion 80 near the first edge 50a and the first edge 50a is 50 micrometers to 200 micrometers, and the first edge 50a is the outer edge of the conductive frame glue 50, so that when the large panel is cut along the cutting line to manufacture the liquid crystal cell, the support portion 80 occupies the space around the cutting line, so that the glue amount of the conductive frame glue around the cutting line is reduced, that is, the glue amount at the splitting position of the liquid crystal cell is reduced, which is beneficial to splitting of the liquid crystal cell.
Further, the color filter substrate 20 includes a plurality of conductive bumps 11 disposed in the terminal area 100c, the conductive bumps 11 and the terminals 101 are disposed in a one-to-one correspondence, and the flip chip 60 is bound on the side surfaces of the conductive frame glue 50, the terminals 101 and the conductive bumps 11 in the thickness direction. The conductive blocks 11 corresponding to the terminals 101 one to one are disposed on the color filter substrate 20, so as to increase the contact area when the flip-chip films 60 are bonded, and further improve the bonding yield of the flip-chip films 60. As described above, after the conductive frame glue 50 is coated, hot pressing needs to be applied in the thickness direction to make the conductive frame glue conductive in the thickness direction but non-conductive in the horizontal direction, and the conductive microspheres in the conductive frame glue 50 output the electrical signal on the terminal 101 to the conductive block 11.
At least one first supporting portion 801 is disposed between two adjacent conductive bumps 11. The first supporting portion 801 may be disposed on the glass substrate of the color filter substrate 20, or on the transparent protective layer of the color filter substrate 20. Specifically, the first supporting portion 801 is disposed on the glass substrate of the color filter substrate 20. The second supporting portion 802 is disposed on the gate insulating layer 102 of the terminal region 100c, and the second supporting portion 802 may also be disposed on the interlayer insulating layer 103 or the passivation layer 104 of the terminal region 100 c. Specifically, the second support portion 802 is disposed on the gate insulating layer 102 of the terminal region 100c, i.e., both the interlayer insulating layer 103 and the passivation layer 104 of the terminal region 100c are removed.
The conductive block 11 is disposed vertically symmetrically with the terminal 101. The conductive block 11 has the same size as the terminal 101. The conductive block 11 may be a metal layer. The conductive block 11 may be a metal oxide semiconductor layer, for example, an indium tin oxide layer. The conductive block 11 and the common electrode 203 are formed by the same process.
Please refer to fig. 4, which is a second partial schematic view of the lcd panel shown in fig. 2. The supporting portion 80 is a spacer disposed on the color filter substrate 20, and the height of the supporting portion 80 is equal to the distance between the portion of the array substrate 10 corresponding to the terminal area 100c and the portion of the color filter substrate 20 corresponding to the terminal area 100 c. The portion of the lcd panel shown in fig. 4 corresponding to the terminal area 100c has better thickness stability and can avoid the signal crosstalk problem between the adjacent terminals 101.
The above description of the embodiments is only for assisting understanding of the technical solutions and their core ideas of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.
Claims (7)
1. A liquid crystal display panel is characterized in that the edge of one end of the liquid crystal display panel is provided with a terminal area, the liquid crystal display panel comprises an array substrate, a color film substrate, conductive frame glue and a flip chip film, the color film substrate and the array substrate are arranged oppositely,
the array substrate comprises a plurality of terminals arranged in the terminal areas;
the conductive frame glue is positioned in the terminal area and at least arranged between the plurality of terminals and the color film substrate; the outer edge of the conductive rubber frame, the edge of the array substrate and the edge of the color film substrate are flush; the conductive frame glue comprises frame glue and conductive microspheres filled in the frame glue, and the conductive microspheres are gathered in the thickness direction and mutually contacted so as to enable the conductive frame glue to be conducted in the thickness direction and not to be conducted in the horizontal direction;
the flip chip film is bound on the side surfaces of the conductive frame glue and the terminal in the thickness direction;
the color film substrate comprises a plurality of conductive blocks arranged in the terminal area, the conductive blocks and the terminals are arranged in a one-to-one correspondence manner, the flip chip film is bound on the conductive frame glue, the terminals and the side faces of the conductive blocks in the thickness direction, and the sizes of the conductive blocks are the same as the sizes of the terminals; the conductive microspheres output the electrical signals on the terminals to the conductive blocks.
2. The liquid crystal display panel according to claim 1, further comprising a plurality of supporting portions located in the terminal area and disposed between the array substrate and the color filter substrate, wherein a height of each supporting portion is less than or equal to a distance between a portion of the array substrate corresponding to the terminal area and a portion of the color filter substrate corresponding to the terminal area.
3. The liquid crystal display panel according to claim 2, wherein the conductive sealant covers the entire terminal area, and at least one of the supporting portions is disposed between two adjacent terminals.
4. The liquid crystal display panel according to claim 2 or 3, wherein the supporting portion is disposed on the array substrate and/or the color filter substrate.
5. The liquid crystal display panel according to claim 4, wherein the supporting portions comprise a second supporting portion disposed on the array substrate and a first supporting portion disposed on the color film substrate, and the first supporting portion and the second supporting portion are disposed in a one-to-one correspondence.
6. The liquid crystal display panel according to claim 5, wherein the first support portion has an inverted trapezoidal longitudinal section, and the second support portion has a trapezoidal longitudinal section.
7. The LCD panel of claim 2, wherein a distance between the support portion near the first edge and the first edge is 50-200 μm, and the first edge is an outer edge of the frame conductive adhesive.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911109298.9A CN110888276B (en) | 2019-11-13 | 2019-11-13 | Liquid crystal display panel |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911109298.9A CN110888276B (en) | 2019-11-13 | 2019-11-13 | Liquid crystal display panel |
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| CN110888276A CN110888276A (en) | 2020-03-17 |
| CN110888276B true CN110888276B (en) | 2022-11-01 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111221190A (en) * | 2020-03-18 | 2020-06-02 | Tcl华星光电技术有限公司 | Display device |
| CN111430421B (en) * | 2020-04-02 | 2023-08-15 | 京东方科技集团股份有限公司 | Display device and method for manufacturing the same |
| CN111427202A (en) * | 2020-04-08 | 2020-07-17 | 深圳市华星光电半导体显示技术有限公司 | Narrow-frame display panel and display device |
| CN111474778B (en) * | 2020-05-13 | 2023-05-02 | 深圳市华星光电半导体显示技术有限公司 | Liquid crystal display panel and liquid crystal display mother board |
| CN111933037B (en) * | 2020-08-31 | 2023-06-06 | 京东方科技集团股份有限公司 | Display substrate and quantum dot display panel |
| TWI737545B (en) * | 2020-11-20 | 2021-08-21 | 友達光電股份有限公司 | Display apparatus |
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