CN110876236B - Surface-mounted coupler mounting structure and mounting method - Google Patents
Surface-mounted coupler mounting structure and mounting method Download PDFInfo
- Publication number
- CN110876236B CN110876236B CN201911191665.4A CN201911191665A CN110876236B CN 110876236 B CN110876236 B CN 110876236B CN 201911191665 A CN201911191665 A CN 201911191665A CN 110876236 B CN110876236 B CN 110876236B
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- coupler
- circuit substrate
- groove
- cavity
- substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0405—Solder foil, tape or wire
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
The invention discloses a surface-mounted coupler mounting structure, which comprises a substrate, wherein a circuit substrate with a pad gold wire is arranged on the substrate, the circuit substrate is provided with a cavity, a groove is arranged on the substrate corresponding to the cavity, a coupler is embedded in the groove, and the bottom of the coupler is connected with the substrate through a welding layer; the leading-out end of the coupler is electrically connected with the bonding pad gold wire; the leading-out end of the coupler is insulated from the substrate. The coupler and the circuit substrate are arranged on the same layer, so that the coupler is in direct contact with the substrate, and the heat dissipation capacity of the coupler is effectively improved. The application also provides an installation method of the surface-mounted coupler.
Description
Technical Field
The invention relates to the field of electronic component processing, in particular to a surface-mounted coupler mounting structure and a surface-mounted coupler mounting method.
Background
Surface-mount couplers are a common component in microwave products, and are generally used by being bonded and welded to a circuit substrate.
As shown in fig. 1, in the conventional surface mount type coupler mounting method, a coupler 3 is directly mounted on a circuit board 2, and a lead terminal of the coupler 3 is connected to a gold wire bonding pad on the circuit board 2 by soldering or sintering. The ground portion of the coupler 3 is connected to the base 1 through a metallized ground hole 201 of the circuit substrate.
The problem is that the coupler 3 installed by the method needs to transmit heat to the substrate 1 through the metalized grounding hole 201, the heat dissipation distance is large, and the heat dissipation thermal resistance is large due to the fact that the coupler 3 needs to pass through two welding layers between the coupler 3 and the circuit substrate 2 and between the circuit substrate 2 and the substrate 1, so that the heat dissipation efficiency of the coupler 3 is poor, the heat accumulation temperature is too high, and the normal work of the coupler 3 is affected.
Disclosure of Invention
In view of this, the present application provides a surface-mount type coupler mounting structure, in which a coupler and a circuit substrate are disposed on the same layer, so that the coupler is directly contacted with a substrate, thereby effectively improving the heat dissipation capability of the coupler. The application also provides an installation method of the surface-mounted coupler.
In order to solve the technical problems, the technical scheme provided by the invention is that the surface-mounted coupler mounting structure comprises a substrate, wherein a circuit substrate with a pad gold wire is arranged on the substrate, the circuit substrate is provided with a cavity, a groove is arranged on the substrate corresponding to the cavity, a coupler is embedded in the groove, and the bottom of the coupler is connected with the substrate through a welding layer; the leading-out end of the coupler is electrically connected with the bonding pad gold wire; the leading-out end of the coupler is insulated from the substrate; the cavity has a flared opening at a position corresponding to the leading-out end of the coupler, and the flared opening is used for insulating the leading-out end of the coupler from the side surface of the circuit substrate; the bottom of the groove is provided with a sinking groove at a position corresponding to the flaring, and the bottom surface of the sinking groove is lower than the groove.
Preferably, the coupler is rectangular, and the leading-out ends are positioned at the top corners of the rectangle; the cavity and the groove are attached to the side edge of the coupler, and the flaring is arranged around the top corner of the coupler.
Preferably, at least two bonding pad gold wires are arranged on the circuit substrate, and the bonding pad gold wires are parallel to each other; and the leading-out end of the coupler is bonded and connected with the gold wire of the bonding pad through a lead.
Preferably, at least one pad gold wire extends through the cavity.
The invention also provides a surface-mounted coupler installation method, which comprises the following steps:
preparing a substrate with a groove, and arranging a welding layer at the bottom of the groove;
arranging a coupler and a circuit substrate on a base, wherein the coupler is embedded in a cavity of the circuit substrate;
the coupler and the circuit substrate are welded on the base through the welding layer;
bonding and connecting the coupler and the circuit substrate through leads;
wherein, the preparation has the notched basement, sets up the welding layer step at the recess bottom, specifically does: the bottom of the groove is provided with a sinking groove, and the welding layer is arranged in an area where the bottom of the groove is not provided with the sinking groove.
Preferably, the step of disposing the coupler and the circuit substrate on the base, and embedding the coupler in the cavity of the circuit substrate, specifically, includes:
the coupler is embedded in the cavity of the circuit substrate, and the side edge of the coupler is attached to the circuit substrate, so that the position of the coupler is fixed.
Preferably, in the step of bonding and connecting the coupler and the circuit substrate through a lead, the lead is made of a silicon-aluminum wire material.
Compared with the prior art, the application has the beneficial effects that:
the cavity is arranged on the circuit substrate, the coupler is installed in the cavity, the heat dissipation mode of the metallized grounding hole is changed into the mode of directly contacting with the metal shell or the metal carrier for heat dissipation, the heat dissipation path is shortened, the thermal resistance of a heat dissipation passage is reduced, and the heat dissipation efficiency and the working stability of the coupler are improved.
The flaring is arranged in the cavity, and the circuit substrate and the leading-out end of the coupler are insulated through a gap, so that short circuit between the leading-out end and the circuit substrate is avoided. The circuit substrate is connected with the leading-out end of the coupler through a lead wire, so that the original coupler connection relation is kept unchanged.
The position that corresponds the flaring sets up heavy groove, and when part solder flowed out in the welding process, the unsettled messenger solder that draws forth end bottom and heavy groove can't adhere to the connection, has avoided the solder short circuit to arouse the coupler short circuit.
The pad gold wires are arranged in parallel, the extending path penetrates through the cavity, the arrangement positions of the pad gold wires are matched with the leading-out ends of the coupler, the lead distance required by bonding is short, and mutual interference is not easy to occur.
Drawings
FIG. 1 is a schematic view of a conventional surface mount coupler mounting structure;
FIG. 2 is an isometric view of a surface mount coupler mounting structure of the present invention;
FIG. 3 is an enlarged view of portion A of FIG. 2;
fig. 4 is a cross-sectional view of a surface-mount type coupler mounting structure of the present invention.
Reference numerals: the circuit board comprises a substrate 1, a groove 11, a sink 12, a circuit substrate 2, a metalized grounding hole 201, a gold bonding pad wire 21, a cavity 22, a flared opening 23, a coupler 3, a leading-out terminal 31, a welding layer 4 and a lead 5.
Detailed Description
In order to make the technical solutions of the present invention better understood, the present invention is further described in detail with reference to the accompanying drawings and specific embodiments.
Referring to fig. 2-4, the present embodiment provides a surface mount coupler mounting structure, which includes a substrate 1, a circuit substrate 2 with a gold wire 21 is disposed on the substrate 1, the circuit substrate 2 has a cavity 22, a groove 11 is disposed on the substrate 1 corresponding to the cavity 22, a rectangular coupler 3 is embedded in the groove 11, and a leading-out terminal 31 of the coupler 3 is located at a vertex angle of the rectangle. The bottom of the coupler 3 is connected with the substrate 1 through a welding layer 4; the terminal 31 of the coupler 3 is electrically connected to the gold pad wire 21. The cavity 22 and the groove 11 are fitted to the side of the coupler 3, and the cavity 22 has a flared end 23 at a position corresponding to the terminal 31 of the coupler 3. A flare 23 is provided around a top corner of the coupler 3 for insulating the pigtail 31 of the coupler 3 from the side surface of the circuit substrate 2. The bottom of the groove 11 is provided with a sinking groove 12 at the position corresponding to the flaring 23, and the bottom surface of the sinking groove 12 is lower than the groove 11. Two bonding pad gold wires 21 are arranged on the circuit substrate 2, and the bonding pad gold wires 21 are parallel to each other; and the pad gold wire 21 extends through the cavity 22. The leading end 31 provided on the coupler 3 is bonded and connected to the gold bonding pad wire 21 through the lead 5.
The embodiment further provides an installation method of the surface-mount coupler, which includes the following steps:
preparing a substrate 1 with a groove 11, wherein the bottom of the groove 11 is provided with a sinking groove 12; the welding layer 4 is arranged at the bottom of the groove 11, and the welding layer 4 is arranged in the area where the sinking groove 12 is not arranged at the bottom of the groove 11;
the coupler 3 and the circuit substrate 2 are arranged on the substrate 1, the coupler 3 is embedded in the cavity 22 of the circuit substrate 2, and the side edge of the coupler 3 is attached to the circuit substrate 2, so that the position of the coupler 3 is fixed;
the coupler 3 and the circuit substrate 2 are soldered to the base 1 through the solder layer 4;
the coupler 3 and the circuit board 2 are bonded and connected by a lead 5 made of a silicon aluminum wire.
In the surface-mount coupler mounting structure and the mounting method provided in this embodiment, the cavity 22 is formed in the circuit substrate 2 and the coupler 3 is embedded, so that the coupler 3 and the substrate 1 are in direct contact for heat transfer, the heat dissipation path is shortened, the thermal resistance of the heat dissipation path is reduced, and the heat dissipation efficiency is improved. After being embedded into the cavity 22, the coupler 3 and the circuit substrate 2 are positioned on the same layer, so that the thickness of the surface-mounted coupler and the space height required by installation are reduced, and the miniaturization design of a product is facilitated.
The coupler 3 is directly connected with the substrate 1 through the welding layer 4 in a welding mode, and the welding flux of the welding layer 4 enables the middle part of the knife coupler 3 to be directly conducted and grounded, so that the grounding area is enlarged, the conductive distance is shortened, and the electrical characteristics are improved; meanwhile, because the metalized grounding hole 201 is not needed to be arranged on the circuit substrate 2 between the coupler 3 and the substrate 1 for conducting, the problems of insufficient soldering and long-term reliability caused by hole failure due to solder loss in the soldering process are avoided.
The bottom of the groove 11 is provided with a sinking groove 12, so that the leading-out terminal 31 can still keep suspended after the coupler 3 is welded with the substrate 1. Even if solder flows out of the welding layer 4 in the welding process, the solder flows into the cavity of the sinking groove 12, and the risk of short circuit of the leading-out terminal 31 caused by the flowing solder is avoided.
The coupler 3 is embedded in the circuit board 2. The cavity 22 and the groove 11 of the circuit substrate 2 are attached to the side edge of the coupler 3, so that the arrangement position of the coupler 3 is limited and fixed, and the coupler 3 is prevented from deviating due to the tension of solder in the installation process, so that the position accuracy is improved.
The above is only a preferred embodiment of the present invention, and it should be noted that the above preferred embodiment should not be considered as limiting the present invention, and the protection scope of the present invention should be subject to the scope defined by the claims. It will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the spirit and scope of the invention, and these modifications and adaptations should be considered within the scope of the invention.
Claims (7)
1. A surface-mounted coupler mounting structure comprises a base, and is characterized in that a circuit substrate with a pad gold wire is arranged on the base, the circuit substrate is provided with a cavity, a groove is arranged on the base corresponding to the cavity, a coupler is embedded in the groove, and the bottom of the coupler is connected with the base through a welding layer; the leading-out end of the coupler is electrically connected with the bonding pad gold wire; the leading-out end of the coupler is insulated from the substrate; the cavity is provided with a flaring at a position corresponding to the leading-out end of the coupler, and the flaring is used for insulating the leading-out end of the coupler from the side surface of the circuit substrate; the bottom of the groove is provided with a sinking groove at the position corresponding to the flaring, and the bottom surface of the sinking groove is lower than the groove.
2. The surface-mount coupler mounting structure according to claim 1, wherein the coupler is rectangular, and the terminals are located at the corners of the rectangle; the cavity and the groove are attached to the side edge of the coupler, and the flaring is arranged around the top corner of the coupler.
3. The surface-mount coupler mounting structure according to claim 1, wherein at least two gold bonding pads are formed on the circuit substrate, the gold bonding pads being parallel to each other; and the leading-out end of the coupler is bonded and connected with the gold wire of the bonding pad through a lead.
4. The surface mount coupler mounting structure of claim 3, wherein the at least one bond pad wire extends through the cavity.
5. A surface-mount coupler mounting method is characterized by comprising the following steps:
preparing a substrate with a groove, and arranging a welding layer at the bottom of the groove;
arranging a coupler and a circuit substrate on a base, wherein the coupler is embedded in a cavity of the circuit substrate;
the coupler and the circuit substrate are welded on the base through the welding layer;
bonding and connecting the coupler and the circuit substrate through leads;
wherein, the preparation has the notched basement, sets up the welding layer step at the recess bottom, specifically does: the bottom of the groove is provided with a sinking groove, and the welding layer is arranged in an area where the bottom of the groove is not provided with the sinking groove.
6. The method of mounting a surface-mount coupler according to claim 5, wherein the step of providing the coupler and the circuit substrate on the base, and embedding the coupler in a cavity of the circuit substrate, specifically:
the coupler is embedded in the cavity of the circuit substrate, and the side edge of the coupler is attached to the circuit substrate, so that the position of the coupler is fixed.
7. The method of mounting a surface-mount coupler according to claim 5, wherein the step of bonding the coupler to the circuit substrate via a lead wire, the lead wire being made of a silicon aluminum wire material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911191665.4A CN110876236B (en) | 2019-11-28 | 2019-11-28 | Surface-mounted coupler mounting structure and mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911191665.4A CN110876236B (en) | 2019-11-28 | 2019-11-28 | Surface-mounted coupler mounting structure and mounting method |
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| Publication Number | Publication Date |
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| CN110876236A CN110876236A (en) | 2020-03-10 |
| CN110876236B true CN110876236B (en) | 2023-01-06 |
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| CN201911191665.4A Active CN110876236B (en) | 2019-11-28 | 2019-11-28 | Surface-mounted coupler mounting structure and mounting method |
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| CN110876236A (en) | 2020-03-10 |
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