CN110867662A - Antenna packaging module and electronic equipment - Google Patents

Abstract

The present application relates to an antenna packaging module and an electronic device, the antenna packaging module comprising: an antenna substrate having a first side and a second side disposed opposite to each other; a first laminate circuit disposed on the first side of the antenna substrate, and a side of the first laminate circuit away from the antenna substrate is used to set a radio frequency chip; a radiation structure disposed on the second side of the antenna substrate; and a feeding network, comprising a 90° directional coupling structure disposed in the first laminate circuit and a transmission line running through the antenna substrate and the first laminate circuit. By introducing a 90° directional coupling structure and connecting it to the radio frequency chip and the radiation structure respectively through a transmission line, it is possible to feed the radiation structure so that the radiation structure can achieve circularly polarized radiation, improve the isolation between the feeding ports, and reduce the mutual coupling between the antenna units.

Description

Antenna package modules and electronic equipment

technical field

The present application relates to the field of antenna technology, and in particular, to an antenna packaging module and electronic equipment.

Background technique

With the development of wireless communication technology, 5G network technology is also born. As a fifth-generation mobile communication network, the 5G network has a peak theoretical transmission speed of tens of gigabits per second, which is hundreds of times faster than the transmission speed of the 4G network. Therefore, the millimeter wave frequency band with sufficient spectrum resources has become one of the working frequency bands of the 5G communication system.

The millimeter-wave packaged antenna module is the mainstream packaging solution in the future 5G millimeter-wave electronic equipment. It can adopt a multi-layer PCB high-density interconnection process and set a radiation structure on one side of the module. However, the current application of millimeter-wave packaged antenna modules in circular polarization scenarios is still limited.

SUMMARY OF THE INVENTION

Embodiments of the present application provide an antenna packaging module and an electronic device, which can realize circularly polarized radiation.

An antenna package module, comprising:

an antenna substrate having a first side and a second side disposed opposite to each other;

a first laminated circuit is disposed on the first side of the antenna substrate, and a side of the first laminated circuit away from the antenna substrate is used for disposing a radio frequency chip;

a radiation structure disposed on the second side of the antenna substrate; and

A feeding network includes a 90° directional coupling structure disposed in the first stacked circuit and a transmission line running through the antenna substrate and the first stacked circuit, the 90° directional coupling structure passing through the The transmission lines are respectively connected with the radio frequency chip and the radiation structure, and are used for feeding the radiation structure so that the radiation structure performs circularly polarized radiation.

In addition, an electronic device is also provided, comprising: a casing and the above-mentioned antenna packaging module, wherein the antenna packaging module is accommodated in the casing.

The above-mentioned antenna package module and electronic equipment include: an antenna substrate having opposite first and second sides; a first laminated circuit disposed on the first side of the antenna substrate, and the first laminated circuit facing away from the antenna One side of the substrate is used for arranging the radio frequency chip; the radiation structure is arranged on the second side of the antenna substrate; A transmission trace of a stacked circuit. By introducing a 90° directional coupling structure and connecting with the radio frequency chip and the radiation structure through transmission lines, it is possible to feed the radiation structure so that the radiation structure realizes circularly polarized radiation.

Description of drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the accompanying drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without any creative effort.

1 is a perspective view of an electronic device in one embodiment;

2 is a schematic structural diagram of an antenna packaging module in an embodiment;

3 is a schematic structural diagram of a radiation structure in an embodiment;

4 is a schematic structural diagram of a 90° directional coupler in an embodiment;

5 is a schematic structural diagram of a radiation structure in another embodiment;

Fig. 6 is the isolation curve of the existing antenna package module;

Fig. 7 is the isolation curve corresponding to the antenna package module of Fig. 5;

8 is a schematic structural diagram of an antenna packaging module in another embodiment;

9 is a schematic structural diagram of an antenna packaging module in another embodiment;

10 is a schematic structural diagram of a radiation structure in another embodiment;

11 is a schematic structural diagram of a radiation structure in another embodiment;

12 is a schematic structural diagram of a radiation structure in another embodiment;

13 is a schematic structural diagram of an isolation grid in an embodiment;

14 is a schematic structural diagram of an antenna packaging module in another embodiment;

15 is a front view of the housing assembly of the electronic device shown in FIG. 1 in another embodiment;

FIG. 16 is a block diagram of a partial structure of a mobile phone related to an electronic device provided by an embodiment of the present invention.

Detailed ways

In order to make the purpose, technical solutions and advantages of the present application more clearly understood, the present application will be described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application.

It will be understood that the terms "first", "second", etc. used in this application may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish a first element from another element, and should not be construed to indicate or imply relative importance or to imply the number of indicated technical features. Thus, a feature delimited with "first", "second" may expressly or implicitly include at least one of that feature. In the description of the present application, "plurality" means at least two, such as two, three, etc., unless expressly and specifically defined otherwise.

It should be noted that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

The antenna packaging module of an embodiment of the present application is applied to an electronic device. In one embodiment, the electronic device may include a mobile phone, a tablet computer, a notebook computer, a palmtop computer, a Mobile Internet Device (MID), a wearable device (such as smart watches, smart bracelets, pedometers, etc.) or other communication modules that can be equipped with antenna packaging modules.

In this embodiment of the present application, as shown in FIG. 1 , the electronic device 10 may include a display screen assembly 110 , a housing assembly 120 and a controller. The display screen assembly 110 is fixed on the casing assembly 120, and together with the casing assembly 120, forms an external structure of the electronic device. The housing assembly 120 may include a middle frame and a rear cover. The middle frame may be a frame structure with through holes. Wherein, the middle frame can be accommodated in the accommodation space formed by the display screen assembly and the back cover. The back cover is used to form the outer contour of the electronic device. The back cover can be integrally formed. During the molding process of the back cover, structures such as a rear camera hole, a fingerprint identification module, and an antenna packaging module mounting hole can be formed on the back cover. The back cover may be a non-metal back cover, for example, the back cover may be a plastic back cover, a ceramic back cover, a 3D glass back cover, or the like. The controller can control the operation of the electronic equipment and the like. Display components can be used to display pictures or fonts, and can provide users with an operating interface.

In one embodiment, the housing assembly 120 is integrated with an antenna packaging module, and the antenna packaging module can transmit and receive millimeter-wave signals through the housing assembly 120 , so that the electronic device can achieve wide coverage of the millimeter-wave signals.

Millimeter waves refer to electromagnetic waves with wavelengths in the order of millimeters, and their frequencies are about 20 GHz to 300 GHz. 3GPP has specified a list of frequency bands supported by 5G NR. The spectrum range of 5G NR can reach 100GHz, and two major frequency ranges have been specified: Frequency range 1 (FR1), which is the frequency band below 6GHz, and Frequency range 2 (FR2), which is the millimeter wave frequency band. The frequency range of Frequency range 1: 450MHz-6.0GHz, where the maximum channel bandwidth is 100MHz. The frequency range of Frequencyrange 2 is 24.25GHz-52.6GHz, and the maximum channel bandwidth is 400MHz. Near 11GHz spectrum for 5G mobile broadband includes: 3.85GHz licensed spectrum, such as: 28GHz (24.25-29.5GHz), 37GHz (37.0-38.6GHz), 39GHz (38.6-40GHz) and 14GHz unlicensed spectrum (57-71GHz) . The working frequency bands of the 5G communication system are 28GHz, 39GHz, and 60GHz.

As shown in FIG. 2 , an embodiment of the present application provides an antenna packaging module. The antenna packaging module includes an antenna substrate 210 , a first laminated circuit 220 , a radiation structure 230 and a feeding network 240 .

The antenna substrate 210 has a first side and a second side opposite to each other. The first side can be used for arranging the first stacked circuit 220 , and the second side can be used for arranging the radiation structure 230 .

The first laminated circuit 220 is disposed on the first side of the antenna substrate 210 , and the side of the first laminated circuit 220 away from the antenna substrate 210 is used for disposing the radio frequency chip 250 .

In one embodiment, the antenna substrate 210 and the first laminated circuit 220 may be a multi-layer printed circuit board (Printed circuit board, PCB) integrated using an HDI (High Density Interconnect) process. For example, the antenna substrate 20 can be understood as a core layer, a PP (Prepreg, prepreg) layer can be stacked on both sides of the core layer, and a metal layer is plated on each of the PP layer and the core layer. The first laminated circuit 220 can be understood as a superimposed layer of a PP layer and a metal layer disposed on one side of the core layer, and the first laminated circuit 220 can be used to connect with the radio frequency chip 250 . Wherein, the PP layer is arranged between the two metal layers to isolate and bond the two metal layers. The metal layer may be a copper layer, a tin layer, a lead-tin alloy layer, a tin-copper alloy layer, or the like.

The radiation structure 230 is disposed on the second side of the antenna substrate 210, and is used for transmitting and receiving millimeter wave signals. The radiating structure 230 may be a phased antenna array for radiating millimeter wave signals. For example, the radiating structure 230 for radiating millimeter wave signals may be an antenna array composed of patch antennas, dipole antennas, Yagi antennas, beam antennas, or other suitable antenna elements. The specific type of the antenna array is not further limited in the embodiment of the present application, and the millimeter wave signal can be sent and received.

In one embodiment, the radiation structure 230 includes a plurality of antenna units 231 arranged in an array, and the number of the antenna units 231 is determined according to specific scanning angles and gain requirements, which is not limited in this embodiment. Taking two-dimensional scanning as an example, referring to FIG. 3 , the antenna units 231 are arranged in a 1×4 rectangle along the array direction F1 . The 1×4 rectangular arrangement has higher spatial coverage, and can be placed on the left and right sides of the mobile phone in structure. If a full-space 3D scanning antenna unit 231 can be arranged in rotational symmetry, the shape and position can be appropriately changed. The spacing between adjacent antenna units 231 may be 0.4λ˜0.6λ, for example, may be 4.85 mm.

Each antenna unit 231 is provided with a first feeding port and a second feeding port for feeding a current signal. The position of the feeding port is determined according to debugging, and the impedance of the feeding port position may be matched to 50Ω. For example, the first feeding port is a vertically polarized feeding point, and the second feeding port is a horizontally polarized feeding point.

In one embodiment, the material of the antenna unit 231 may be a conductive material, such as a metal material, an alloy material, a conductive silicone material, a graphite material, indium tin oxide (ITO), etc., and may also be a material with a high dielectric constant. materials, such as glass, plastic, ceramic, etc. with high dielectric constant.

The feeding network 240 includes a 90° directional coupling structure 240 a disposed in the first stacked circuit 220 and a transmission line 240 b penetrating the antenna substrate 210 and the first stacked circuit 220 . Specifically, the 90° directional coupling structure 240a is respectively connected to the radio frequency chip 250 and the radiation structure 230 through the transmission line 240b, and is used for feeding the radiation structure 230 so that the radiation structure 230 performs circularly polarized radiation. The circularly polarized radiation includes first circularly polarized radiation (eg, left circularly polarized radiation) and second circularly polarized radiation (eg, right circularly polarized radiation). The 90° directional coupling structure 240a excites a signal of equal amplitude and inphase and a signal of equal amplitude and opposite phase according to the radio frequency signal, and feeds the radiation structure 230 so that the radiation structure 230 realizes the radiation of the circularly polarized millimeter wave antenna and improves the distance between the feeding ports. isolation, and reduce the mutual coupling between the antenna units 231.

In one embodiment, the 90° directional coupling structure 240a includes a plurality of 90° directional couplers, and each 90° directional coupler is connected to one antenna unit 231 correspondingly.

Zop＝Z_o)。90°定向耦合器的90°移相传输线的长度为λ/4，λ为带状传输线的等效介质波长。Specifically, referring to FIG. 4, the 90° directional coupler is a 3dB 90° directional coupler, including four ports, namely input port 1, through port 2, isolation port 3 and coupling port 4. The 90° directional coupler has four ports. The through port 2 is connected to the first feed port, the coupling port 4 of the 90° directional coupler is connected to the second feed port, the input port 1 of the 90° directional coupler is connected to the first RF port of the RF chip 250, and the 90° directional coupler The isolation port 3 is connected to the second radio frequency port of the radio frequency chip 250 . Among them, the characteristic impedance of the 90° directional coupler can be Z _o =50Ω (in the figure

Zop=Z _o ). The length of the 90° phase-shifted transmission line of the 90° directional coupler is λ/4, where λ is the equivalent medium wavelength of the strip transmission line.

The input port 1 of the 90° directional coupler excites signals of equal amplitude and in-phase at the through port 2 and the coupling port 4, respectively, so as to feed the radiation structure 230 so that the radiation structure 230 realizes the first circularly polarized radiation; at the through port 2 and the coupling port 4 respectively excite equal-amplitude and opposite-phase signals, so as to feed the radiation structure 230 so that the radiation structure 230 realizes the second circularly polarized radiation. The isolation between the feeding ports is improved, and the mutual coupling between the antenna units 231 is reduced.

Taking the antenna package module in which the antenna units 231 are arranged in a rectangle of 1×4 as an example, referring to FIG. 5 , the feeding terminals of the four antenna units 231 are respectively feeding port 1, feeding port 2, feeding port 3, feeding Port 4, feed port 5, feed port 6, feed port 7 and feed port 8. Referring to Figure 6 and Figure 7 (only the worst case is shown in the figure), Figure 6 shows the isolation of the feed port 3 and feed port 5 of the existing antenna package module (without the 90° directional coupler) Curve, Figure 7 (S1,1 curve, S3,3 curve, S5,5 curve and S7,7 curve in the figure correspond to the reflection of feed port 1, feed port 3, feed port 5 and feed port 7 respectively The coefficient curve) is the isolation curve of feed port 1 and feed port 2 of the antenna package module of the present application (S2, 1 curves in the figure), and the isolation curve of feed port 1 and feed port 3 (S1 in the figure). , 3 curve), the isolation curve of feed port 3 and feed port 5 (S5, 3 curve in the figure). It can be seen from FIG. 6 and FIG. 7 that the isolation between the first feeding port and the second feeding port in the antenna packaging module of the present application is less than -28dB, and the isolation between the antenna units 231 is less than -19dB. In the case where the 90° directional coupler is not added (the worst isolation between the antenna elements 231 is -11.7dB), the improvement is 7-8dB.

In one embodiment, through holes may be formed on the antenna substrate 210 and the first laminated circuit 220 , and the positions of the through holes are set corresponding to the positions of the feeding port and the radio frequency port. Conductive material can also be filled in the through hole to form the transmission line 240b of the feeding network 240 , and the RF chip 250 and the radiation structure 230 are conducted through the feeding network 240 . The radio frequency chip 250 and the feeding network 240 are connected to the radiation structure 230 so as to feed the current signal into the radiation structure 230, thereby realizing the transmission and reception of millimeter wave signals.

The above-mentioned antenna package module includes: an antenna substrate 210 having opposite first and second sides; a first laminated circuit 220 disposed on the first side of the antenna substrate 210, and the first laminated circuit 220 facing away from the antenna substrate One side of the 210 is used for setting the radio frequency chip; the radiation structure 230 is arranged on the second side of the antenna substrate 210; The substrate 210 and the transmission lines 240b of the first multilayer circuit 220 . By introducing the 90° directional coupling structure 240a and connecting with the radio frequency chip and the radiation structure 230 through the transmission line 240b, it is possible to feed the radiation structure 230 so that the radiation structure 230 realizes circularly polarized radiation, and improves the distance between the feeding ports. isolation, and reduce the mutual coupling between the antenna units 231.

In one embodiment, the antenna unit 231 is a single-layer antenna structure. Referring to FIG. 8 , the antenna package module further includes a second laminated circuit 260 .

The second multilayer circuit 260 is disposed on the second side of the antenna base 210, and the side of the second multilayer circuit 260 facing away from the antenna substrate 210 is provided with an antenna element 231 (only one antenna element 231 is shown in FIG. 8). The antenna unit 231 is connected to the 90° directional coupling structure 240a through the second multilayer circuit 260 through the transmission line 240b.

In one embodiment, the second laminate circuit 260 , the antenna substrate 210 and the first laminate circuit 220 may be a multi-layer printed circuit board (Printed circuit board, PCB) integrated using an HDI (High Density Interconnect) process. For example, referring to FIG. 8 , the antenna substrate 210 can be understood as a core layer, the first laminated circuit 220 can be understood as a superimposed layer of a PP layer 2201 and a metal layer 2202 disposed on one side of the core layer, and the second laminated circuit 260 can be understood as It is a superimposed layer of the PP layer 2601 and the metal layer 2602 disposed on the other side of the core layer. Wherein, the antenna unit 231 and the topmost metal layer 2602-T are arranged at intervals in the same layer.

In one embodiment, referring to FIG. 9 , the antenna unit 231 is a stacked antenna structure, and the antenna unit 231 includes a first radiating element 231a and a second radiating element 231b arranged at intervals (only one antenna unit 231 is shown in FIG. 9 ). The antenna package module further includes a second laminated circuit 270 .

The second multi-layer circuit 270 is disposed on the first side of the antenna substrate 210 , the side of the second multi-layer circuit 270 close to the antenna substrate 210 is provided with the first radiating element 231 a , and the second multi-layer circuit 270 faces away from the antenna substrate 210 The side is provided with a second radiating element 231b.

In one embodiment, the first radiating element 231a is connected to the 90° directional coupler through the second multilayer circuit 270 through the transmission line 240b, and the 90° directional coupler feeds the first radiating element 231a, so that the first radiating element 231a is fed with electricity. The radiation element 231a performs circularly polarized radiation ( FIG. 9 corresponds to this embodiment), and the first radiation element 231a couples the second radiation element 231b so that the second radiation element 231b performs circularly polarized radiation.

In one embodiment, the second radiating element 231b is connected to the 90° directional coupler through the first radiating element 231a and the second stacked circuit 270 through the transmission line 240b, and the 90° directional coupler is fed by the second radiating element 231b , so that the second radiation element 231b performs circularly polarized radiation; the second radiation element 231b couples the first radiation element 231a to enable the first radiation element 231a to perform circularly polarized radiation. Wherein, the first radiating element 231a is provided with a through hole so that the transmission line 240b passes through.

In one embodiment, the second laminate circuit 270 , the antenna substrate 210 and the first laminate circuit 220 may be a multi-layer printed circuit board (Printed circuit board, PCB) integrated using an HDI (High Density Interconnect) process. For example, referring to FIG. 9 , the antenna substrate 20 can be understood as a core layer, the first laminated circuit 220 can be understood as a superimposed layer of a PP layer 2201 and a metal layer 2202 disposed on one side of the core layer, and the second laminated circuit 270 can be understood as It is a superimposed layer of the PP layer 2701 and the metal layer 2702 disposed on the other side of the core layer. Wherein, the second radiating element 231b is arranged on the topmost PP layer 2701-T of the second multilayer circuit 270, and is arranged spaced apart from the topmost metal layer 2702-T; the first radiating element 231a is arranged on the antenna substrate 210, It is spaced from the bottom metal layer 2702-B.

In one embodiment, the number of the first radiating elements 231a and the second radiating elements 231b are equal and multiple, wherein the multiple first radiating elements 231a and the multiple second radiating elements 231b are arranged in an array, and two adjacent radiating elements 231a are arranged in an array. The pitches of the first radiating elements 231a are equal. For example, the number of the first radiating element 231a and the number of the second radiating element 231b can be set to 4, 8 or 16. It should be noted that the plurality of first radiating elements 231a and the plurality of second radiating elements 231b may be arranged in a linear array, a two-dimensional array, or the like. In this embodiment of the present application, the number and arrangement of the first radiating elements 231a and the second radiating elements 231b are not further limited.

In one embodiment, the shape of the first radiating element 231a and the second radiating element 231b are the same or similar, and both can be one of a square patch antenna, a loop patch antenna, an elliptical patch antenna and a cross patch antenna .

In an embodiment, the first feeding ports of the plurality of antenna elements 231 in the above embodiment are mirror-symmetrical in the array direction, and the second feeding ports of the plurality of antenna elements 231 are mirror-symmetrical in the array direction.

When the plurality of antenna units 231 are arranged in a linear rectangle, the array direction is a single direction. For example, referring to FIG. 10 , the radiation structure 230 includes four antenna elements 231, and the four antenna elements 231 are arranged in a 1×4 rectangle, and the array direction is F1. The four antenna elements 231 are arranged along the array direction F1, and the feeding ports are respectively Named as feed port 1, feed port 2, feed port 3, feed port 4, feed port 5, feed port 6, feed port 7 and feed port 8. The feed port 1 and the feed port 7 are mirror-symmetrical, the feed port 2 and the feed port 8 are mirror-symmetric, the feed port 3 and the feed port 5 are mirror-symmetric, and the feed port 4 and the feed port 6 are mirror-symmetric. By adopting mirror symmetry, the distance between the feed port 4 and the feed port 6 is increased, the distance between the feed port 2 and the feed port 8 is increased, and the isolation between the feed ports is further improved.

When the plurality of antenna elements 231 are arranged in a nonlinear rectangle, the array direction includes a first array direction F1 and a second array direction F2. For example, referring to FIG. 11 , the four antenna elements 231 are arranged along the array direction F1 and the second array direction F2 respectively, and the feeding ports are named as feeding port 1, feeding port 2, feeding port 3, and feeding port 4, respectively. , feed port 5, feed port 6, feed port 7 and feed port 8. Among them, in the first array direction F1, the feeding port 1 and the feeding port 5 are mirror-symmetrical, the feeding port 2 and the feeding port 6 are mirror-symmetrical, the feeding port 3 and the feeding port 7 are mirror-symmetrical, and the feeding port 4 is mirror-symmetrical. It is mirror-symmetric with feed port 8; in the first array direction F2, feed port 1 and feed port 3 are mirror-symmetric, feed port 2 and feed port 4 are mirror-symmetric, and feed port 5 and feed port 7 are mirrored Symmetrical, feed port 6 and feed port 8 are mirror-symmetrical. By adopting mirror symmetry, the distance between the feed port 1 and the feed port 5, the distance between the feed port 1 and the feed port 3, the distance between the feed port 3 and the feed port 7, and the feed port 5 are increased The distance from the feed port 7 further improves the isolation between the feed ports.

In one embodiment, referring to FIG. 12 , the radiation structure further includes an isolation grid 232 . The isolation grid 232 is arranged around each antenna element 231 to adjust the isolation between two adjacent antenna elements 231 (in FIG. 12 , four antenna elements 231 are arranged in a 1×4 rectangle as an example).

In one embodiment, the first laminated circuit 220 includes a ground layer, and the ground layer is disposed on the side of the antenna substrate 210 away from the radiation structure 230 (which can be understood as the topmost metal layer in the first laminated circuit 220 ), and The isolation grid 232 is connected.

In one embodiment, referring to FIG. 13 , the isolation grid 232 includes a metal through hole 232a disposed around each antenna element 231, and the metal through hole 232a penetrates to the ground layer of the first laminated circuit 220, thereby preventing phase The millimeter wave signals radiated by the two adjacent antenna units 231 influence each other, so as to improve the isolation degree between the two adjacent antenna units 231 .

In one embodiment, when the antenna unit 231 is a single-layer antenna, the isolation grid 232 is spaced apart from the antenna unit 231 and penetrates to the ground layer of the first multilayer circuit 220, so as to prevent two adjacent antenna units 231 from being separated from each other. The radiated millimeter-wave signals influence each other.

In one embodiment, when the antenna unit 231 is a multilayer antenna, for example, when the antenna unit 231 includes a first radiating element 231a and a second radiating element 231b, the isolation grid 232 is connected to the first radiating element 231a and the second radiating element 231b respectively. 231b are arranged at intervals and penetrate to the ground layer of the first multilayer circuit 220, thereby preventing the millimeter wave signals radiated by two adjacent first radiating elements 231a from interacting with each other, and preventing the radiated signals radiated by two adjacent second radiating elements 231b. mmWave signals influence each other.

As shown in FIG. 14 , in one embodiment, the antenna package module includes: an antenna substrate 210 , a first laminated circuit 220 , a radiation structure 230 , a feeding network 240 , a radio frequency chip 250 and a second laminated circuit 260 .

Wherein, the antenna substrate 210 , the first laminated circuit 220 and the second laminated circuit 260 adopt the PCB stack structure of an 8-layer millimeter-wave packaged antenna integrated by an HDI (High Density Interconnect) process.

The second stacked circuit 260 includes four metal layers 2602 , and a PP layer 2601 between adjacent metal layers 2602 . The metal layer 2602 is the copper layer marking layer of the antenna part, and the radiation structure 230 (taking the radiation structure 230 as a single-layer antenna as an example) is located on the PP layer 2601-T and is spaced apart from the metal layer 2602-T.

The first laminated circuit 220 includes four metal layers 2202, and a PP layer 2201 between adjacent metal layers 2202, wherein the metal layers 2202-T are ground layers, and the other metal layers 2202 are the feed network and the control line wiring The copper layer, the 90° directional coupling structure 240a and the metal layer 2202-S are arranged at intervals in the same layer, and the radio frequency chip 250 is welded on the metal layer 2202-E.

It should be noted that the PP layer 2201 and the PP layer 2601 are both prepregs, which are located between two adjacent metal layers (eg, copper layers) to isolate and bond the two copper layers.

By introducing a 90° directional coupling structure 240a into the metal layer 2202-S to connect with the radiation structure 230 and the radio frequency chip 250 to form a feeding network of the radiation structure 230, the radiation structure 230 can realize circularly polarized radiation and improve the feeding The isolation between the electrical ports reduces the mutual coupling between the antenna units 231 .

As shown in FIG. 15 , an electronic device includes a casing and the antenna packaging module in any of the above embodiments, wherein the antenna packaging module is accommodated in the casing.

In one embodiment, the electronic device includes a plurality of antenna packaging modules, and the plurality of antenna packaging modules are distributed on different sides of the casing. For example, the housing includes a first side 121 and a third side 123 arranged opposite to each other, and a second side 122 and a fourth side 124 arranged opposite to each other, and the second side 122 is connected to the first side The side edge 121 and one end of the third side edge 123 and the fourth side edge 124 are connected to the other end of the first side edge 121 and the third side edge 123 . At least two of the first side 121 , the second side 122 , the third side 123 and the fourth side 124 are respectively provided with millimeter wave modules. When the number of millimeter wave modules is two, the two millimeter wave modules 200 are located on the second side 122 and the fourth side 124 respectively, so that the overall size of the antenna packaging module is reduced in the dimension of the non-scanning direction, so that the It is possible to place on both sides of electronic equipment.

The electronic device having the antenna package module of any of the above-mentioned embodiments can be suitable for transmitting and receiving millimeter-wave signals in 5G communication, improving the isolation between feed ports, improving the radiation efficiency and radiation gain of the millimeter-wave signals, and at the same time reducing the size of the antenna. The footprint of the module within the electronic device.

The electronic device may include a mobile phone, a tablet computer, a notebook computer, a handheld computer, a Mobile Internet Device (MID), a wearable device (such as a smart watch, a smart bracelet, a pedometer, etc.) or other antennas that can be set communication module.

FIG. 16 is a block diagram of a partial structure of a mobile phone related to an electronic device provided by an embodiment of the present invention. 16 , the mobile phone 1600 includes: an array antenna 1610, a memory 1620, an input unit 1630, a display unit 1640, a sensor 1650, an audio circuit 1660, a wireless fidelity (WIFI) module 1670, a processor 1680, and a power supply 1690, etc. part. Those skilled in the art can understand that the structure of the mobile phone shown in FIG. 16 does not constitute a limitation on the mobile phone, and may include more or less components than shown, or combine some components, or arrange different components.

The array antenna 1610 can be used to send and receive information or to receive and send signals during a call. After receiving the downlink information of the base station, it can be processed by the processor 1680; it can also send uplink data to the base station. The memory 1620 can be used to store software programs and modules, and the processor 1680 executes various functional applications and data processing of the mobile phone by running the software programs and modules stored in the memory 1620 . The memory 1620 may mainly include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application program required for at least one function (such as an application program for a sound playback function, an application program for an image playback function, etc.), etc.; The data storage area may store data (such as audio data, address book, etc.) created according to the usage of the mobile phone, and the like. Additionally, memory 1620 may include high-speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other volatile solid state storage device.

The input unit 1630 may be used to receive input numerical or character information, and generate key signal input related to user settings and function control of the mobile phone 1600 . In one embodiment, the input unit 1630 may include a touch panel 1631 and other input devices 1632 . The touch panel 1631, which may also be referred to as a touch screen, collects the user's touch operations on or near it (such as the user using a finger, a stylus, or any suitable object or accessory on or near the touch panel 1631 ). operation), and drive the corresponding connection device according to the preset program. In one embodiment, the touch panel 1631 may include two parts, a touch measurement device and a touch controller. Among them, the touch measurement device measures the user's touch orientation, measures the signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch measurement device, converts it into contact coordinates, and then sends it to the touch controller. To the processor 1680, and can receive the command sent by the processor 1680 and execute it. In addition, the touch panel 1631 can be implemented in various types such as resistive, capacitive, infrared, and surface acoustic waves. Besides the touch panel 1631 , the input unit 1630 may also include other input devices 1632 . In one embodiment, other input devices 1632 may include, but are not limited to, one or more of a physical keyboard, function keys (such as volume control keys, switch keys, etc.), and the like.

The display unit 1640 may be used to display information input by the user or information provided to the user and various menus of the mobile phone. The display unit 1640 may include a display panel 1641 . In one embodiment, the display panel 1641 may be configured in the form of a liquid crystal display (Liquid Crystl Disply, LCD), an organic light-emitting diode (Orgnic Light-Emitting Diode, OLED), or the like. In one embodiment, the touch panel 1631 may cover the display panel 1641. After the touch panel 1631 measures a touch operation on or near it, the touch operation is transmitted to the processor 1680 to determine the type of the touch event, and then the processor 1680 determines the type of the touch event according to the The type of touch event provides a corresponding visual output on the display panel 1641 . Although in FIG. 16, the touch panel 1631 and the display panel 1641 are used as two independent components to realize the input and input functions of the mobile phone, in some embodiments, the touch panel 1631 and the display panel 1641 can be integrated to form a Realize the input and output functions of the mobile phone.

Cell phone 1600 may also include at least one sensor 1650, such as light sensors, motion sensors, and other sensors. In one embodiment, the light sensor may include an ambient light sensor and a proximity sensor, wherein the ambient light sensor may adjust the brightness of the display panel 1641 according to the brightness of the ambient light, and the proximity sensor may turn off the display panel when the mobile phone is moved to the ear 1641 and/or backlight. The motion sensor can include an acceleration sensor. The acceleration sensor can measure the magnitude of acceleration in all directions, and can measure the magnitude and direction of gravity when it is stationary. It can be used for applications that recognize the attitude of mobile phones (such as switching between horizontal and vertical screens), and vibration recognition related functions (such as pedometer, tap), etc. In addition, the mobile phone can also be equipped with other sensors such as gyroscope, barometer, hygrometer, thermometer, infrared sensor, etc.

Audio circuit 1660, speaker 1661 and microphone 1662 may provide an audio interface between the user and the cell phone. The audio circuit 1660 can transmit the received audio data converted electrical signals to the speaker 1661, and the speaker 1661 converts them into sound signals for output; on the other hand, the microphone 1662 converts the collected sound signals into electrical signals, which are converted by the audio circuit 1660 into electrical signals. After receiving, the audio data is converted into audio data, and then processed by the output processor 1680, and can be sent to another mobile phone via the array antenna 1610, or the audio data can be output to the memory 1620 for subsequent processing.

The processor 1680 is the control center of the mobile phone, using various interfaces and lines to connect various parts of the entire mobile phone, by running or executing the software programs and/or modules stored in the memory 1620, and calling the data stored in the memory 1620. Various functions of the mobile phone and processing data, so as to monitor the mobile phone as a whole. In one embodiment, the processor 1680 may include one or more processing units. In one embodiment, the processor 1680 may integrate an application processor and a modem processor, wherein the application processor mainly handles the operating system, user interface and application programs, etc.; the modem processor mainly handles wireless communication. It can be understood that, the above-mentioned modulation and demodulation processor may not be integrated into the processor 1680.

The mobile phone 1600 also includes a power supply 1690 (such as a battery) for supplying power to various components. Preferably, the power supply can be logically connected to the processor 1680 through a power management system, so as to manage charging, discharging, and power consumption management functions through the power management system.

In one embodiment, the mobile phone 1600 may further include a camera, a Bluetooth module, and the like.

Any reference to a memory, storage, database, or other medium as used herein may include non-volatile and/or volatile memory. Suitable nonvolatile memory may include read only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory may include random access memory (RM), which acts as external cache memory. By way of illustration and not limitation, RM is available in various forms such as static RM (SRM), dynamic RM (DRM), synchronous DRM (SDRM), double data rate SDRM (DDR SDRM), enhanced SDRM (ESDRM), synchronous Link (Synchlink) DRM (SLDRM), Memory Bus (Rmbus) Direct RM (RDRM), Direct Memory Bus Dynamic RM (DRDRM), and Memory Bus Dynamic RM (RDRM).

The technical features of the above embodiments can be combined arbitrarily. In order to make the description simple, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction in the combination of these technical features It is considered to be the range described in this specification.

The above-mentioned embodiments only represent several embodiments of the present application, and the descriptions thereof are relatively specific and detailed, but should not be construed as a limitation on the scope of the patent of the present application. It should be pointed out that for those skilled in the art, without departing from the concept of the present application, several modifications and improvements can be made, which all belong to the protection scope of the present application. Therefore, the scope of protection of the patent of the present application shall be subject to the appended claims.

Claims (11)

1. An antenna package module, comprising:

the antenna substrate is provided with a first side and a second side which are arranged in a reverse manner;

the first laminated circuit is arranged on the first side of the antenna substrate, and one side of the first laminated circuit, which is far away from the antenna substrate, is used for arranging a radio frequency chip;

a radiating structure disposed on the second side of the antenna substrate; and

the feed network comprises a 90-degree directional coupling structure arranged in the first laminated circuit and a transmission line penetrating through the antenna substrate and the first laminated circuit, wherein the 90-degree directional coupling structure is respectively connected with the radio frequency chip and the radiation structure through the transmission line and is used for feeding the radiation structure so as to enable the radiation structure to carry out circular polarization radiation.

2. The antenna package module of claim 1, wherein the radiating structure comprises a plurality of antenna elements arranged in an array, each of the antenna elements having a first feeding port and a second feeding port;

the 90 ° directional coupling structure includes:

each 90-degree directional coupler is correspondingly connected with one antenna unit, a through port of each 90-degree directional coupler is connected with the first feed port, a coupling port of each 90-degree directional coupler is connected with the second feed port, an input port of each 90-degree directional coupler is connected with the first radio frequency port of the radio frequency chip, and an isolation port of each 90-degree directional coupler is connected with the second radio frequency port of the radio frequency chip.

3. The antenna package module of claim 2, wherein the antenna element is a single-layer antenna; the antenna packaging module further comprises:

the second laminated circuit is arranged on the second side of the antenna substrate, and the antenna unit is arranged on one side of the second laminated circuit, which is far away from the antenna substrate;

and the antenna unit penetrates through the second laminated circuit through transmission wiring and is connected with the 90-degree directional coupler.

4. The antenna package module of claim 2, wherein the antenna unit is a stacked antenna, and the antenna unit includes a first radiating element and a second radiating element that are spaced apart from each other;

the antenna packaging module further comprises:

the second laminated circuit is arranged on the second side of the antenna substrate, the first radiating element is arranged on one side, close to the antenna substrate, of the second laminated circuit, and the second radiating element is arranged on one side, away from the antenna substrate, of the second laminated circuit;

wherein the first radiating element is connected to the 90 ° directional coupler by transmission traces running through the second stacked circuit; or the second radiation element penetrates through the first radiation element and the second laminated circuit through transmission wiring and is connected with the 90-degree directional coupler.

5. The antenna package module of claim 2, wherein the first feeding ports of the plurality of antenna elements are mirror symmetric in the array direction, and the second feeding ports of the plurality of antenna elements are mirror symmetric in the array direction.

6. The antenna package module of claim 2, wherein the plurality of antenna units are arranged in a linear array in the array direction.

7. The antenna package module of any one of claims 2-6, wherein the radiating structure further comprises:

and the isolation grid is arranged around each antenna unit and used for adjusting the isolation between two adjacent antenna units.

8. The antenna package module of claim 7, wherein the isolation grid is a metal via disposed around each of the antenna elements.

9. The antenna package module of claim 7, wherein the first laminate circuit comprises:

and the grounding layer is arranged on one side of the antenna substrate, which is far away from the radiation structure, and is connected with the isolation grid.

10. An electronic device, comprising:

a housing; and

the antenna package module of any one of claims 1-9, wherein the antenna package module is housed within the housing.

11. The electronic device of claim 10, wherein the number of antenna package modules is plural;

the shell comprises a first side edge and a third side edge which are arranged in a back-to-back manner, and a second side edge and a fourth side edge which are arranged in a back-to-back manner, wherein the second side edge is connected with one end of the first side edge and one end of the third side edge, and the fourth side edge is connected with the other end of the first side edge and the other end of the third side edge;

at least two of the first side, the second side, the third side and the fourth side are respectively provided with the antenna packaging module.

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