CN110856857A - Method for ultrasonically treating waste circuit board - Google Patents
Method for ultrasonically treating waste circuit board Download PDFInfo
- Publication number
- CN110856857A CN110856857A CN201810976235.2A CN201810976235A CN110856857A CN 110856857 A CN110856857 A CN 110856857A CN 201810976235 A CN201810976235 A CN 201810976235A CN 110856857 A CN110856857 A CN 110856857A
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- Prior art keywords
- circuit board
- waste circuit
- ultrasonic
- crushing
- particles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
- B29B17/02—Separating plastics from other materials
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
- C22B7/005—Separation by a physical processing technique only, e.g. by mechanical breaking
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/52—Mechanical processing of waste for the recovery of materials, e.g. crushing, shredding, separation or disassembly
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/62—Plastics recycling; Rubber recycling
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
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- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geology (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Processing Of Solid Wastes (AREA)
Abstract
The invention relates to the technical field of resource treatment of waste circuit boards, in particular to a method for ultrasonically treating a waste circuit board. The following technical scheme is adopted: firstly, removing electronic components from a waste circuit board, and carrying out wet crushing on the circuit board without the electronic components, wherein the crushing granularity is about 0.45-2.0 mm; then placing the crushed waste circuit board slurry in an ultrasonic external field, wherein the liquid-solid ratio is 1-3, the ultrasonic power is 100-2000W, and the ultrasonic action time is 10-60 min; after the reaction is finished, the obtained mixed slurry is subjected to gravity separation to obtain various metal particles with high purity and plastic particles containing aluminum, and the obtained plastic particles are subjected to magnetic separation to obtain metal aluminum particles and plastic particles. The method adopts the ultrasonic external field to strengthen and separate the waste circuit board, and after the strengthening treatment of the process, the metal and the plastic in the waste circuit board are effectively separated; the method realizes comprehensive utilization of natural resources, is beneficial to relieving the pressure of resources and environment, and has excellent economic and ecological benefits.
Description
Technical Field
The invention relates to the field of circuit board recovery, in particular to a method for ultrasonically treating a waste circuit board.
Background
The printed circuit board is the foundation of the electronic industry, and along with the rapid development of the electronic industry, the updating speed of electronic products is increased, so that a large amount of electronic wastes are generated, and in addition, a large amount of leftover materials and the like are generated in the manufacturing process of the printed circuit board. Two thirds of electronic garbage in the world finally flows to China, if the electronic garbage is directly stacked without being treated, a large amount of space can be occupied, and harmful substances in the electronic garbage can pollute soil and cause great burden to the ecological environment. Due to the characteristics of the circuit board, only 75% of metal and plastic are used, and the waste circuit board needs to be recycled for the purpose of environmental protection or resource recycling. The printed circuit board mainly comprises organic reinforced resin, glass fiber, copper foil and electronic elements, has high recycling value, contains heavy metals such as Pb, Hg, Cd and Cr and toxic and harmful substances such as halogenated flame retardants, and causes serious secondary pollution to the environment if not treated properly. As early as the 20's last century, Richard et al in the United states first studied the effect of ultrasound on various liquids, solids and solutions and found that ultrasound can accelerate chemical reactions. By the middle of the 80 s of the 20 th century, with the popularization and development of ultrasonic power equipment, important conditions are provided for the application of ultrasonic waves in chemical and chemical processes. Since then, many successive research councils on phonochemistry have been carried out in europe, the united states and the like, and a more detailed academic study on the mechanism and application of phonochemistry has been published, as well as a lot of valuable academic papers and monographs. The invention provides a strengthening means of the waste circuit board treatment process by combining the self mechanical action, the thermal action and the cavitation action of ultrasonic waves, and provides a possibility for the comprehensive recovery of the waste circuit board.
At present, the domestic waste circuit board recovery mainly comprises the following aspects: mechanical, pyrogenic, wet, pyrogenic processes. The mechanical method generally means that after the waste circuit board is crushed to a certain particle size, the separation purpose is achieved through the different physical properties of metal and plastic, and the problem mainly exists that the certain particle size needs to be achieved, so that the crushing difficulty is high, and toxic and harmful gas and dust are easily generated along with the crushing, and the environment is not protected. The waste circuit boards are directly treated by the pyrogenic process without selecting raw materials, but the investment is large, the energy consumption is high, and the difficulty in treating tail gas is large. The wet treatment mainly utilizes chemical agents to react with metal on the waste circuit board, thereby achieving the purpose of separating plastic from metal, but the flow is long, and a large amount of generated chemical wastewater cannot be directly discharged. The pyrolysis method is used for pyrolyzing the waste circuit board under the condition of inert gas, and has great influence on the environment.
In a patent with publication number "CN 108085508A", a method for recovering copper from waste circuit boards is disclosed, the method is that the waste circuit boards are crushed into 0.15-0.25mm by a hammer mill and then added into a plasma arc furnace for recovery treatment; in the patent of "CN 104028530B", a method for processing waste circuit boards is disclosed, which comprises heating the waste circuit boards, plasticizing the plastic in vacuum or inert atmosphere, ball-milling-sorting, and calcining the sorted metals with alkali and water leaching. The two methods are complicated in treatment process, have high requirements on the granularity of circuit board crushing, and have high processing cost.
Disclosure of Invention
The invention aims to provide a method for ultrasonically treating a waste circuit board, and particularly provides a method for ultrasonically treating a waste circuit board, which has the advantages of low requirement on treatment conditions, simple process and good treatment effect.
In order to achieve the purpose, the invention adopts the following technical scheme: a method for ultrasonically treating a waste circuit board is characterized by comprising the following steps: the method comprises the following steps:
s01, removing electronic elements on the waste circuit board, and crushing the waste circuit board after the electronic elements are removed, wherein the crushing granularity is 0.45-2.00 mm; the waste circuit board generally comprises the following components: 35-55% of plastic, 10-25% of copper, 5-10% of iron, 3-5% of bromide, 10-35% of lead, tin, nickel, zinc, gold, silver, cadmium, palladium and the like.
S02, adding tap water into the crushed waste circuit boards, uniformly mixing, and placing in an ultrasonic field, wherein the mass ratio of the tap water to the crushed waste circuit boards is 1-3, and the ultrasonic action is carried out for 10-60 min.
S03, carrying out gravity separation on the mixed slurry after ultrasonic treatment to obtain aluminum-containing plastic particles and multi-metal mixed particles, and carrying out magnetic separation on the aluminum-containing plastic particles to separate out aluminum and plastic particles.
Preferably, the waste circuit board crushing treatment method adopts a wet crushing method.
Preferably, the ultrasonic power is 100W-1200W.
Preferably, the frequency of the ultrasonic wave is 20 KHz-80 KHz.
The invention has the beneficial effects that:
(1) the waste circuit board is crushed by a wet crushing method, so that the problems that the crushing difficulty is high and toxic and harmful gases are generated in the crushing process to harm human health are avoided.
(2) The method introduces ultrasonic external field strengthening into comprehensive recovery of the waste circuit board, and provides a new method for the technical field of comprehensive treatment of the waste circuit board.
(3) The method uses the ultrasonic agitation, cavitation and thermal effect to strengthen the treatment of the waste circuit board, so that the metal and plastic of the waste circuit board are completely separated, and the method is efficient and reliable.
(4) The method avoids the problems of high energy consumption, difficult tail gas treatment and chemical medicine use in the existing pyrogenic process and wet process for recycling the waste circuit boards, short flow and high-efficiency recycling of all components of the waste circuit boards.
Drawings
Fig. 1 is a process flow chart of ultrasonic processing of a waste circuit board in embodiment 1.
Detailed Description
Example 1: referring to fig. 1, a method for ultrasonically treating a waste circuit board is characterized in that: the method comprises the following steps:
s01, removing electronic elements on the waste circuit board, and crushing the waste circuit board after the electronic elements are removed, wherein the crushing granularity is 1.00 mm; the waste circuit board generally comprises the following components: 35-55% of plastic, 10-25% of copper, 5-10% of iron, 3-5% of bromide, 10-35% of lead, tin, nickel, zinc, gold, silver, cadmium, palladium and the like.
S02, adding tap water into the crushed waste circuit boards, uniformly mixing, and placing in an ultrasonic external field, wherein the mass ratio of the tap water to the crushed waste circuit boards is 2, the ultrasonic power is 1000W, the ultrasonic frequency is 50KHz, and the ultrasonic action time is 30 min.
S03, carrying out gravity separation on the mixed slurry after ultrasonic treatment to obtain aluminum-containing plastic particles and multi-metal mixed particles, and carrying out magnetic separation on the aluminum-containing plastic particles to separate out aluminum and plastic particles.
Preferably, the waste circuit board crushing treatment method adopts a wet crushing method.
After the treatment by the method, the recovery rate of the metal on the waste circuit board can be improved by 10 percent, and the aluminum-containing plastic particles with higher purity are obtained, so that the treatment efficiency of the waste circuit board is effectively improved.
It should be understood that the above-mentioned embodiments are merely preferred embodiments of the present invention, and not intended to limit the scope of the invention, therefore, all equivalent changes in the principle of the present invention should be included in the protection scope of the present invention.
Claims (4)
1. A method for ultrasonically treating a waste circuit board is characterized by comprising the following steps: the method comprises the following steps:
s01, removing electronic elements on the waste circuit board, and crushing the waste circuit board after the electronic elements are removed, wherein the crushing granularity is 0.45-2.00 mm; the waste circuit board generally comprises the following components: 35-55% of plastic, 10-25% of copper, 5-10% of iron, 3-5% of bromide, 10-35% of lead, tin, nickel, zinc, gold, silver, cadmium, palladium and the like;
s02, adding tap water into the crushed waste circuit board, uniformly mixing, and placing in an ultrasonic outfield, wherein the mass ratio of the tap water to the crushed waste circuit board is 1-3, and the ultrasonic action is carried out for 10-60 min;
s03, carrying out gravity separation on the mixed slurry after ultrasonic treatment to obtain aluminum-containing plastic particles and multi-metal mixed particles, and carrying out magnetic separation on the aluminum-containing plastic particles to separate out aluminum and plastic particles.
2. The method for ultrasonically processing the waste circuit board as claimed in claim 1, wherein: the method for crushing the waste circuit board adopts a wet crushing method.
3. The method for ultrasonically treating the waste circuit board as claimed in claim 1 or 2, wherein: the ultrasonic power is 100W-1200W.
4. The method for ultrasonically processing the waste circuit board as claimed in claim 3, wherein: the frequency of the ultrasonic waves is 20 KHz-80 KHz.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810976235.2A CN110856857A (en) | 2018-08-25 | 2018-08-25 | Method for ultrasonically treating waste circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810976235.2A CN110856857A (en) | 2018-08-25 | 2018-08-25 | Method for ultrasonically treating waste circuit board |
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| Publication Number | Publication Date |
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| CN110856857A true CN110856857A (en) | 2020-03-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810976235.2A Pending CN110856857A (en) | 2018-08-25 | 2018-08-25 | Method for ultrasonically treating waste circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI796107B (en) * | 2022-01-20 | 2023-03-11 | 菖鼎科技股份有限公司 | Recycling methods of waste printed circuit boards |
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|---|---|---|---|---|
| JP2003155523A (en) * | 2001-11-19 | 2003-05-30 | Sumitomo Bakelite Co Ltd | Method of recovering metal from multilayer substrate chip, and apparatus therefor |
| CN1832663A (en) * | 2006-03-23 | 2006-09-13 | 合肥工业大学 | Method and device for desoldering and separating devices in liquid heat-conducting medium of printed circuit board |
| CN1947847A (en) * | 2006-10-26 | 2007-04-18 | 江博新 | Method for recovering metals resources from waste electronic circuit board |
| CN102671916A (en) * | 2012-05-21 | 2012-09-19 | 宁波天地回珑再生资源科技有限公司 | Recycling processing technology for waste circuit board |
| CN104745824A (en) * | 2015-03-17 | 2015-07-01 | 昆明理工大学 | Method for recovering copper from waste circuit board |
| CN105624407A (en) * | 2016-02-16 | 2016-06-01 | 北京梦之墨科技有限公司 | Recycling method for liquid metal printed circuits and recycling system |
| CN106077037A (en) * | 2016-06-30 | 2016-11-09 | 中南大学 | A kind of method of ultrasonic assistant flotation pressurized acid leaching synthetical recovery aluminum electrolysis waste cathode carbon block |
| CN106076657A (en) * | 2016-06-16 | 2016-11-09 | 兰州理工大学 | The flotation separation method of copper in a kind of waste mobile phone circuit board |
| CN107716105A (en) * | 2017-09-28 | 2018-02-23 | 宝鸡市铭坤有色金属有限公司 | The extracting method of non-ferrous metal in a kind of waste and old circuit board |
-
2018
- 2018-08-25 CN CN201810976235.2A patent/CN110856857A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003155523A (en) * | 2001-11-19 | 2003-05-30 | Sumitomo Bakelite Co Ltd | Method of recovering metal from multilayer substrate chip, and apparatus therefor |
| CN1832663A (en) * | 2006-03-23 | 2006-09-13 | 合肥工业大学 | Method and device for desoldering and separating devices in liquid heat-conducting medium of printed circuit board |
| CN1947847A (en) * | 2006-10-26 | 2007-04-18 | 江博新 | Method for recovering metals resources from waste electronic circuit board |
| CN102671916A (en) * | 2012-05-21 | 2012-09-19 | 宁波天地回珑再生资源科技有限公司 | Recycling processing technology for waste circuit board |
| CN104745824A (en) * | 2015-03-17 | 2015-07-01 | 昆明理工大学 | Method for recovering copper from waste circuit board |
| CN105624407A (en) * | 2016-02-16 | 2016-06-01 | 北京梦之墨科技有限公司 | Recycling method for liquid metal printed circuits and recycling system |
| CN106076657A (en) * | 2016-06-16 | 2016-11-09 | 兰州理工大学 | The flotation separation method of copper in a kind of waste mobile phone circuit board |
| CN106077037A (en) * | 2016-06-30 | 2016-11-09 | 中南大学 | A kind of method of ultrasonic assistant flotation pressurized acid leaching synthetical recovery aluminum electrolysis waste cathode carbon block |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI796107B (en) * | 2022-01-20 | 2023-03-11 | 菖鼎科技股份有限公司 | Recycling methods of waste printed circuit boards |
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Application publication date: 20200303 |