CN110855854B

CN110855854B - Image pickup module, molded photosensitive member, method of manufacturing the same, and electronic apparatus

Info

Publication number: CN110855854B
Application number: CN201810952770.4A
Authority: CN
Inventors: 黄桢; 赵波杰; 梅哲文; 刘丽; 陈佳炜; 许晨祥
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2018-08-21
Filing date: 2018-08-21
Publication date: 2024-10-15
Anticipated expiration: 2038-08-21
Also published as: CN110855854A

Abstract

The invention provides an image pickup module, a molded photosensitive assembly, a manufacturing method thereof and an electronic device. The molded photosensitive assembly includes an imaging assembly, a molded base, and a filter assembly. The imaging component comprises a circuit board and at least one photosensitive element, and each photosensitive element is connected with the circuit board in a conductive way. The molding base is provided with at least one stepped peripheral groove so as to define a light window through each stepped peripheral groove, wherein the molding base covers a part of the imaging component, and the photosensitive area of each photosensitive element corresponds to each light window of the molding base. The filter assembly comprises at least one filter element, wherein each filter element is correspondingly arranged in each stepped peripheral groove of the molding base, so that each filter element corresponds to each light window of the molding base.

Description

Image pickup module, molded photosensitive member, method of manufacturing the same, and electronic apparatus

Technical Field

The present invention relates to the field of optical imaging technology, and in particular, to an imaging module, a molded photosensitive assembly, a method for manufacturing the same, and an electronic device.

Background

In recent years, electronic products, smart devices, etc. are increasingly being made thinner and smaller, and the trend of electronic products, smart devices, etc. is placing more stringent demands on the size (particularly the height) of the camera module, which is one of the standard configurations of electronic products, smart devices.

In the assembly process of the camera module in the prior art, a chip and an electronic component are generally mounted on a circuit board, a molding base is formed on the circuit board through a molding process, and then an optical lens is mounted on the optical filter assembly after the optical filter assembly is mounted on the lens base, so that the optical lens is kept on a photosensitive path of the chip.

However, the assembly method of the prior art makes the height of the camera module depend on the thickness of the circuit board, the height of the molded base, the thickness of the filter assembly and the height of the optical lens, that is, the sum of the thickness of the circuit board, the height of the lens base, the thickness of the filter assembly and the height of the optical lens is equal to the height of the camera module, which has many limitations for the light and thin camera module.

First, in the molding process, the electronic components mounted on the circuit board are located in the molding die because a safety distance needs to be reserved between the electronic components and the molding die to avoid the molding die from pressing the electronic components, i.e., a safety distance needs to be reserved between the molding die and the electronic components both in the horizontal direction and in the height direction to cover the electronic components after the molding base is molded, so that the height of the molding base must be greater than the height of the electronic components, i.e., the height of the molding base is limited by the height of the electronic components themselves, which results in the height of the molding base not being reduced.

Second, the filter assembly is composed of the filter and the support member, which is generally manufactured by an injection molding process, and the portion of the support member supporting the filter needs to have a certain thickness to ensure sufficient strength to firmly support the filter, so that the thickness of the filter assembly must be greater than that of the filter, i.e., the thickness of the filter assembly is limited by the support member and the filter together, which results in that the thickness of the filter assembly cannot be reduced.

Therefore, the assembly method in the prior art cannot reduce the height of the camera module due to the limitations of the above factors, so that the requirements of the market on the lightness, thinness and miniaturization of the camera module cannot be met.

Disclosure of Invention

An object of the present invention is to provide a camera module, a molded photosensitive assembly, a method for manufacturing the same, and an electronic device, which can reduce the height of the camera module, and is beneficial to meeting the development requirements of light weight and miniaturization of the camera module.

Another object of the present invention is to provide an image pickup module and a molded photosensitive member, and a method of manufacturing the same, and an electronic apparatus capable of reducing the height of the image pickup module by reducing the distance between a filter element and a circuit board.

Another object of the present invention is to provide an image capturing module, a molded photosensitive assembly, a method for manufacturing the same, and an electronic device, which can reduce the back focus of an optical lens of the image capturing module, and facilitate the realization of a smaller image capturing module, so as to meet the market demand.

Another object of the present invention is to provide an image capturing module, a molded photosensitive assembly, a method of manufacturing the same, and an electronic apparatus, wherein in some embodiments of the present invention, a molded base of the molded photosensitive assembly has a stepped peripheral groove, and a filter element of the molded photosensitive assembly is mounted in the stepped peripheral groove of the molded base such that a distance between the filter element and the circuit board is reduced.

Another object of the present invention is to provide an image capturing module, a molded photosensitive assembly, a method for manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, the molded base has a stepped peripheral groove, wherein the filter element is disposed in the stepped peripheral groove to reduce a distance between the filter element and the circuit board.

Another object of the present invention is to provide an image pickup module, a molded photosensitive assembly, a method of manufacturing the same, and an electronic apparatus, wherein in some embodiments of the present invention, the molded base includes a first base portion and a second base portion, wherein the second base portion integrally extends inward from the first base portion along the wiring board, and a first top surface of the first base portion defines the first mounting surface, a second top surface of the second base portion defines the second mounting surface, wherein the first mounting surface is higher than the second mounting surface, and the filter element is mounted to the first mounting surface,

Another object of the present invention is to provide an image capturing module, a molded photosensitive assembly, a method for manufacturing the same, and an electronic apparatus, wherein in some embodiments of the present invention, the second mounting surface of the molded base is lower than the upper surface of the electronic component on the circuit board, so as to further reduce the distance between the filter element and the circuit board.

Another object of the present invention is to provide an image pickup module, a molded photosensitive assembly, a method of manufacturing the same, and an electronic apparatus, wherein in some embodiments of the present invention, the filter element is mounted to the first mounting surface of the molded base by a support, and the filter element is located between the first mounting surface and the second mounting surface to reduce a distance between the filter element and the wiring board.

Another object of the present invention is to provide an imaging module, a molded photosensitive assembly, a method for manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, the first mounting surface and the second mounting surface of the molded base are parallel to each other, which facilitates a subsequent active calibration process.

Another object of the present invention is to provide an imaging module, a molded photosensitive assembly, a method for manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, a wire loop height of a gold wire is reduced by a back-punching process for avoiding a press head of a molding die, so that a distance between the second mounting surface of the molded base and the circuit board can be reduced.

Another object of the present invention is to provide an image capturing module, a molded photosensitive assembly, a method of manufacturing the same, and an electronic apparatus, wherein in some embodiments of the present invention, the molded base is manufactured by a molding process before the photosensitive element is mounted, so as to further reduce a distance between the second mounting surface of the molded base and the circuit board.

Another object of the present invention is to provide an imaging module, a molded photosensitive assembly, a method for manufacturing the same, and an electronic apparatus, wherein in some embodiments of the present invention, the photosensitive element is mounted in a die attach slot of the circuit board to further reduce a distance between the second mounting surface of the molded base and the circuit board.

Another object of the present invention is to provide an imaging module, a molded photosensitive assembly, a method for manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, the photosensitive element is mounted in a through hole type chip mounting groove of the circuit board, so as to further reduce a distance between the second mounting surface of the molded base and the circuit board.

Another object of the present invention is to provide an image capturing module, a molded photosensitive assembly, a method for manufacturing the same, and an electronic apparatus, wherein in some embodiments of the present invention, an upper surface of the optical filter is not higher than the first mounting surface of the molded base, so that the optical filter is effectively prevented from being impacted by downward movement of the optical lens in the in-focus image capturing module.

Another object of the present invention is to provide an image capturing module, a molded photosensitive assembly, a method for manufacturing the same, and an electronic apparatus, wherein in some embodiments of the present invention, a gap is reserved between the optical filter element and a first inner peripheral surface of the first base portion of the molded base for attaching the optical filter element.

To achieve at least one of the above or other objects and advantages, the present invention provides a molded photosensitive assembly comprising:

An imaging assembly, wherein the imaging assembly comprises a circuit board and at least one photosensitive element, and each photosensitive element is conductively connected with the circuit board;

A molded base, wherein the molded base has at least one stepped peripheral groove to define a light window through each of the stepped peripheral grooves, wherein the molded base encloses a portion of the imaging assembly, and the photosensitive area of each of the photosensitive elements corresponds to each of the light windows of the molded base, respectively; and

The optical filter assembly comprises at least one optical filter element, wherein each optical filter element is correspondingly arranged in each stepped peripheral groove of the molding base, so that each optical filter element corresponds to each optical window of the molding base.

In some embodiments of the present invention, the molding base includes at least one first base portion and at least one second base portion, wherein each of the second base portions integrally extends inwardly from an inner peripheral surface of each of the first base portions along the wiring board, and a first top surface of each of the first base portions is higher than a second top surface of the second base portion to form each of the stepped peripheral grooves of the molding base by each of the first base portions and each of the second base portions.

In some embodiments of the present invention, the circuit board includes a die attach area and an edge area around the die attach area, the photosensitive element includes a photosensitive area and a non-photosensitive area around the photosensitive area, wherein the first base portion of the molded base covers at least a portion of the edge area of the circuit board, and the second base portion of the molded base covers at least a portion of the non-photosensitive area of the photosensitive element.

In some embodiments of the present invention, the first base portion covers a circuit board outer side portion of the edge region of the circuit board, and the second base portion covers a circuit board connection portion and a circuit board inner side portion of the edge region of the circuit board and a chip outer side portion and a chip connection portion of the non-photosensitive region of the photosensitive element.

In some embodiments of the invention, the first base portion of the molded base covers a circuit board outer portion and a circuit board connecting portion of the edge region of the circuit board, and the second base portion covers a circuit board inner portion of the edge region of the circuit board and a chip outer portion and a chip connecting portion of the non-photosensitive region of the photosensitive element.

In some embodiments of the invention, the first base portion of the molded base covers a circuit board outer portion, a circuit board connecting portion, and a circuit board inner portion of the edge region of the circuit board, and the second base portion covers a chip outer portion, a chip connecting portion, and a portion of a chip inner portion of the non-photosensitive region of the photosensitive element.

In some embodiments of the invention, the first base portion of the molded base covers a circuit board outer portion, a circuit board connecting portion, and a circuit board inner portion of the edge region of the circuit board and a chip outer portion of the non-photosensitive region of the photosensitive element, and the second base portion covers a chip connecting portion and a portion of a chip inner portion of the non-photosensitive region of the photosensitive element.

In some embodiments of the invention, the imaging assembly further comprises at least one set of leads to conductively connect the photosensitive element and the wiring board through each of the leads, wherein the second base portion has a height greater than a wire arc height of each of the leads, and each of the leads of the imaging assembly is encased by the second base portion.

In some embodiments of the invention, the imaging assembly further comprises at least one set of electronic components, and each of the electronic components is mounted to the circuit board outer side of the edge region of the circuit board, wherein the first base portion of the molded base is greater in height than each of the electronic components, and each of the electronic components of the imaging assembly is encapsulated by the first base portion.

In some embodiments of the invention, the second top surface of the second base portion is lower than the top surface of the uppermost electronic component.

In some embodiments of the present invention, the circuit board includes a die attach area and an edge area around the die attach area, wherein the first base portion and the second base portion of the molded base each cover an outside portion of the circuit board in the edge area of the circuit board.

In some embodiments of the invention, the first top surface of each of the first base portions and the second top surface of the second base portion are parallel to each other.

In some embodiments of the invention, the first top surface of each of the first base portions of the molded base is parallel to a photosurface of the photosensitive element.

In some embodiments of the invention, an inclination angle of the first inner peripheral surface of each of the first base portions with respect to a photosensitive surface of the photosensitive element is less than 30 °.

In some embodiments of the invention, an inclined angle of a second inner peripheral surface of each of the second base portions with respect to the photosensitive surface of the photosensitive element is less than 30 °.

In some embodiments of the invention, the filter assembly further comprises at least one adhesive layer, wherein each adhesive layer is disposed between each filter element and each second base portion, such that each filter element is fixedly disposed to each second base portion of the molded base by each adhesive layer.

In some embodiments of the invention, each of the adhesive layers is formed by curing glue applied to the second top surface of each of the second base portions, and each of the adhesive layers is located between a lower surface of each of the filter elements and the second top surface of each of the second base portions.

In some embodiments of the present invention, each of the second base portions is further provided with at least one glue groove, wherein each of the glue grooves is recessed downward from the second top surface of each of the second base portions to form a groove for receiving the glue.

In some embodiments of the invention, each of the adhesive layers is formed by curing glue applied to a lower surface of each of the filter elements, and each of the adhesive layers is located between the lower surface of each of the filter elements and the second top surface of each of the second base portions.

In some embodiments of the invention, the molded photosensitive assembly further comprises a mounting gap, wherein the mounting gap is located between the filter element and the first inner peripheral surface of the first base portion.

In some embodiments of the invention, each of the adhesive layers has at least one air vent, wherein each air vent extends from an inside of the adhesive layer to an outside of the adhesive layer to communicate a space between the filter element and the photosensitive element with an external space of the molded photosensitive assembly.

In some embodiments of the present invention, the filter assembly further comprises at least one adhesive layer and at least one annular support member, wherein each adhesive layer is located between an upper surface of each filter element and each support member to fixedly attach each filter element to each support member via each adhesive layer, wherein each support member is correspondingly disposed in the first base portion of the molded base such that each filter element is located in each stepped peripheral groove of the molded base.

In some embodiments of the invention, each of the support members of the filter assembly is attached to the first top surface of each of the first base portions such that the upper surface of each of the filter elements is lower than the first top surface of each of the first base portions.

In some embodiments of the present invention, the circuit board is further provided with at least one chip mounting groove, wherein each chip mounting groove is located in a chip mounting area of the circuit board, and each chip mounting groove is recessed downward from an upper side surface of the circuit board to form a groove for mounting the photosensitive element.

In some embodiments of the present invention, each of the chip mounting grooves extends downward from the upper side of the circuit board to a lower side of the circuit board to form a through hole in the chip mounting region of the circuit board, wherein each of the photosensitive elements is fixedly disposed in each of the chip mounting grooves.

According to another aspect of the present invention, there is also provided an image capturing module, including:

The molded photosensitive assembly described above; and

At least one optical lens, wherein each optical lens is arranged on the photosensitive path of each photosensitive element of the imaging component of the molded photosensitive component, so as to provide a light path for each optical lens and each photosensitive element by each optical window.

According to another aspect of the present invention, there is also provided an electronic apparatus including:

an electronic device body; and

The camera module is arranged on the electronic equipment body and used for acquiring images.

According to another aspect of the present invention, there is provided a method of manufacturing a molded photosensitive assembly, comprising the steps of:

Attaching a photosensitive element and at least one group of electronic components to a circuit board, and conducting the photosensitive element and the circuit board to assemble an imaging assembly;

Forming a molded base with a stepped peripheral groove for coating a part of the circuit board and a part of the photosensitive element by a molding process to form a light window through the stepped peripheral groove, wherein a photosensitive area of the photosensitive element corresponds to the light window of the molded base to form a molded photosensitive assembly semi-finished product with an integrated structure; and

And correspondingly arranging a light filtering element of a light filtering component on the stepped peripheral groove of the molding base of the semi-finished product of the molded photosensitive component to assemble the molded photosensitive component, wherein the photosensitive area of the photosensitive element corresponds to the light filtering element.

In some embodiments of the present invention, the step of mounting a photosensitive element and at least one group of electronic components on a circuit board and conducting the photosensitive element and the circuit board to assemble an imaging assembly includes the steps of:

Attaching the photosensitive element to a chip attaching area of the circuit board;

Attaching each electronic component to the outer side of a circuit board in an edge area of the circuit board; and

By means of a gold wire bonding process, a lead wire is extended from a chip connecting piece of the photosensitive element to a circuit board connecting piece of the circuit board so as to conductively connect the photosensitive element and the circuit board.

By means of a gold wire bonding process, a lead wire is extended from a circuit board connecting piece of the circuit board to a chip connecting piece of the photosensitive element so as to conductively connect the circuit board and the photosensitive element.

In some embodiments of the present invention, the step of forming a molded base having a stepped peripheral groove for covering a portion of the circuit board and a portion of the photosensitive element by a molding process to form an optical window through the stepped peripheral groove, wherein a photosensitive area of the photosensitive element corresponds to the optical window of the molded base to form a molded photosensitive assembly semi-finished product having an integral structure, comprises the steps of:

placing the imaging assembly in a forming mold;

performing die closing operation on an upper die and a lower die of the forming die, and forming a forming space of the forming die between the upper die and the lower die;

adding a molding material into the molding space of the molding die to form the molding base with the stepped peripheral groove after the molding material is solidified; and

And drawing the upper die and the lower die to obtain the semi-finished product of the molded photosensitive assembly.

In some embodiments of the present invention, the step of closing an upper mold and a lower mold of the molding mold to form a molding space of the molding mold between the upper mold and the lower mold includes the steps of:

Setting a covering film on a pressing surface of the upper die;

Pressing the photosensitive element of the imaging component by the covering film so that the covering film is positioned between the pressing surface and the photosensitive element;

Forming a first molding space of the molding space between a first inner surface of the upper mold and at least a portion of the edge region of the circuit board; and

A second molding space of the molding space is formed between a second inner surface of the upper mold and at least a portion of a non-photosensitive region of the photosensitive element, wherein the first inner surface of the upper mold is above the second inner surface of the upper mold.

In some embodiments of the present invention, the step of adding a molding material to the molding space of the molding die to form the molding base having the stepped peripheral groove after the molding material is cured includes the steps of:

adding the molding material into the first molding space to form a first base portion of the molded base after the molding material is cured, wherein the first base portion covers at least a portion of the edge region of the circuit board; and

And adding the molding material into the second molding space to form a second base part of the molding base after the molding material is solidified, wherein the second base part covers at least one part of the non-photosensitive area of the photosensitive element, and the height of the second base part is lower than that of the first base part.

In some embodiments of the present invention, the step of correspondingly disposing a filter element of a filter assembly in the stepped peripheral groove of the molded base of the molded photosensitive assembly semi-finished product to assemble a molded photosensitive assembly, wherein the photosensitive area of the photosensitive element corresponds to the filter element comprises the steps of:

applying a glue to a second top surface of the second base portion of the molded base;

Correspondingly arranging the filter element on the second top surface of the second base part; and

After the glue is cured, an adhesive layer of the filter assembly is formed between a lower surface of the filter element and the second top surface of the second base portion.

Applying glue on the lower surface of the optical filter element;

correspondingly arranging the filter element on a second top surface of the second base part; and

After the glue is cured, an adhesive layer of the filter assembly is formed between the lower surface of the filter element and the second top surface of the second base part.

Applying a glue to an annular support member of the filter assembly;

Correspondingly arranging the optical filter element on the support member so as to form an adhesive layer of the optical filter assembly between an upper surface of the optical filter element and the support member after the glue is solidified; and

The support piece is correspondingly arranged on a first top surface of the first base part, so that the light filtering element is positioned in the stepped peripheral groove of the molded base.

Forming a molding base with a stepped peripheral groove on the outer side of a circuit board for coating an edge area of the circuit board by a molding process to form an optical window through the stepped peripheral groove, wherein a photosensitive area of the photosensitive element corresponds to the optical window of the molding base to form a molded photosensitive assembly semi-finished product with an integrated structure;

attaching a photosensitive element to a chip attaching area of the circuit board, and conducting the photosensitive element and the circuit board; and

And correspondingly arranging a light filtering element of a light filtering component on the stepped peripheral groove of the molding base to assemble a molding photosensitive component, wherein the photosensitive area of the photosensitive element corresponds to the light filtering element.

According to another aspect of the present invention, the present invention further provides a method for manufacturing an image capturing module, including the steps of:

According to the method for manufacturing the molded photosensitive assembly, a molded photosensitive assembly is manufactured; and

An optical lens is correspondingly arranged on a photosensitive path of an imaging component of the molded photosensitive component to manufacture an imaging module.

Further objects and advantages of the present invention will become fully apparent from the following description and the accompanying drawings.

These and other objects, features and advantages of the present invention will become more fully apparent from the following detailed description, the accompanying drawings and the appended claims.

Drawings

Fig. 1 is a schematic perspective view of an image capturing module according to a first preferred embodiment of the present invention.

Fig. 2 is an exploded view of the camera module according to the first preferred embodiment of the present invention.

Fig. 3 is a schematic cross-sectional view of a molded photosensitive member of the camera module according to the first preferred embodiment of the present invention.

Fig. 4A shows a first variant of the molded photosensitive component according to the first preferred embodiment of the present invention described above.

Fig. 4B shows a second variant of the molded photosensitive component according to the first preferred embodiment of the present invention described above.

Fig. 4C shows a third variant of the molded photosensitive component according to the first preferred embodiment of the present invention described above.

Fig. 5A and 5B are schematic cross-sectional views illustrating a manufacturing process of the camera module according to the first preferred embodiment of the present invention.

Fig. 6A shows a first variant of the camera module according to the first preferred embodiment of the invention.

Fig. 6B shows a second variant of the camera module according to the first preferred embodiment of the invention.

Fig. 6C shows a third variant of the camera module according to the first preferred embodiment of the invention.

Fig. 6D shows a fourth variant of the camera module according to the first preferred embodiment of the invention.

Fig. 6E shows a fifth modification of the camera module according to the first preferred embodiment of the present invention.

Fig. 6F shows a sixth modification of the camera module according to the first preferred embodiment of the present invention.

Fig. 6G shows a seventh modification of the camera module according to the first preferred embodiment of the present invention.

Fig. 6H shows an eighth modification of the camera module according to the first preferred embodiment of the present invention.

Fig. 7A to 7D are flow charts of a method of manufacturing the molded photosensitive component according to the above-described first preferred embodiment of the present invention, respectively.

Fig. 8 is a flowchart illustrating a method for manufacturing the camera module according to the first preferred embodiment of the present invention.

Fig. 9 is a schematic cross-sectional view of an image capturing module according to a second preferred embodiment of the present invention.

Fig. 10A and 10B are schematic cross-sectional views illustrating steps of manufacturing the camera module according to the second preferred embodiment of the present invention.

Fig. 11 is a flow chart of a method for manufacturing the molded photosensitive component according to the second preferred embodiment of the present invention.

Fig. 12 is a schematic view of an electronic device with the camera module according to the present invention.

Detailed Description

The following description is presented to enable one of ordinary skill in the art to make and use the invention. The preferred embodiments in the following description are by way of example only and other obvious variations will occur to those skilled in the art. The basic principles of the invention defined in the following description may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

It will be appreciated by those skilled in the art that in the present disclosure, the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc. refer to an orientation or positional relationship based on that shown in the drawings, which is merely for convenience of description and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore the above terms should not be construed as limiting the present invention.

In the present invention, the terms "a" and "an" in the claims and specification should be understood as "one or more", i.e. in one embodiment the number of one element may be one, while in another embodiment the number of the element may be plural. The terms "a" and "an" are not to be construed as unique or singular, and the term "the" and "the" are not to be construed as limiting the amount of the element unless the amount of the element is specifically indicated as being only one in the disclosure of the present invention.

In the description of the present invention, it should be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, unless explicitly stated or limited otherwise, the terms "connected," "connected," and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through a medium. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

With the development of electronic products, intelligent devices and the like in the direction of being lighter, thinner and miniaturized, the camera module is one of standard configurations of the electronic products or the intelligent devices, and more stringent requirements are put on the size (particularly the height) of the camera module.

However, in the prior art assembly method, the chip and the electronic component are usually mounted on the circuit board, the molding base is formed on the circuit board by a molding process, and then the lens is mounted on the filter assembly after the filter is mounted on the lens base, so that the lens is maintained on the photosensitive path of the chip. However, this assembly of the prior art has a significant limitation on the height of the camera module.

On the one hand, although the traditional lens holder is replaced by the molded base to reduce the transverse size and height of the camera module, the mold used in the molding process needs to avoid the electronic components such as the capacitor and the resistor on the circuit board (particularly, the size of the capacitor is larger, the minimum capacitor is 0.38mm high at present), and a certain safety distance is reserved between the mold and various electronic components, so that the height of the molded base is at least more than 0.4mm; on the other hand, the filter typically forms a filter assembly with a support member, and then the filter assembly is mounted on the molded base, and since the support member is typically manufactured by injection molding, the thickness of the portion of the support member for supporting the filter is required to be substantially greater than 0.15mm, and the thickness of the filter itself is typically greater than 0.21mm, the thickness of the filter assembly is at least greater than 0.36mm.

In summary, the distance between the lens and the circuit board is equal to the sum of the height of the molded base and the thickness of the filter assembly (at least greater than 0.76 mm), and is limited by all the above factors, the distance between the lens and the circuit board of the prior art camera module cannot be further reduced, that is, the height of the prior art camera module cannot be further reduced, so that the market demand for thinning and miniaturization of the camera module cannot be satisfied. Accordingly, in order to solve the above-described problems, the present invention provides an image pickup module, a molded photosensitive assembly, a method of manufacturing the same, and an electronic apparatus.

Referring to fig. 1 to 8 of the drawings, a camera module and a molded photosensitive member and a method of manufacturing the same according to a first preferred embodiment of the present invention are illustrated, wherein the camera module 1 includes at least one optical lens 10 and a molded photosensitive member 20, wherein the molded photosensitive member 20 includes an imaging member 21, a filter member 22, and a molded base 23, wherein the molded base 23 covers a portion of the imaging member 21 after molding, and has at least one stepped peripheral groove 230, wherein the filter member 22 includes at least one filter element 221, and each filter element 221 is correspondingly disposed to each stepped peripheral groove 230 of the molded base 23 such that each filter element 221 of the filter member 22 corresponds to a photosensitive path of the imaging member 21, respectively, wherein each optical lens 10 is disposed to a photosensitive path of the imaging member 21, respectively, to form the camera module 1.

It should be noted that, although the description of fig. 1 to 8 and the following description take the case that the camera module includes only one optical lens 10 as an example, features and advantages of the camera module of the present invention are described, those skilled in the art will understand that the camera modules disclosed in fig. 1 to 8 and the following description are merely examples, and do not limit the content and scope of the present invention, for example, in other examples of the camera module, the number of optical lenses 10 may be more than one to form an array camera module.

As shown in fig. 2, the imaging assembly 21 of the molded photosensitive assembly 20 includes a circuit board 211 and at least one photosensitive element 212, and each of the photosensitive elements 212 is mounted at a different position of the circuit board 211.

Further, as shown in fig. 3, the circuit board 211 includes at least one flat chip mounting area 2111 and an edge area 2112, wherein each of the chip mounting area 2111 and the edge area 2112 are integrally formed, and the edge area 2112 is located around the chip mounting area 2111, and each of the photosensitive elements 212 is mounted on each of the chip mounting areas 2111 of the circuit board 211, respectively, to ensure the flatness of each of the photosensitive elements 212 mounted on each of the chip mounting areas 2111. For example, in the specific example shown in fig. 3, the circuit board 211 may include one chip mounting region 2111 and one edge region 2112, wherein the chip mounting region 2111 is located at a middle portion of the circuit board 211, and the edge region 2112 is located outside the circuit board 211.

Typically, as shown in fig. 3, the circuit board 211 further includes at least one set of circuit board connectors 2113, wherein each circuit board connector 2113 is disposed at the edge region 2112 of the circuit board 211, respectively.

As shown in fig. 3, the photosensitive element 212 includes a photosensitive region 2121, a non-photosensitive region 2122, and at least one set of chip connectors 2123. The photosensitive region 2121 and the non-photosensitive region 2122 are integrally formed, and the non-photosensitive region 2122 is located around the photosensitive region 2121, that is, the photosensitive region 2121 is located in the middle of the photosensitive element 212, the non-photosensitive region 2122 is located outside the photosensitive element 212, and the non-photosensitive element 2122 is disposed around the photosensitive region 2121. Each of the chip connectors 2123 is disposed to the non-photosensitive region 2122 of the photosensitive element 212, respectively.

As shown in fig. 3, the imaging assembly 21 further includes at least one set of leads 213, wherein each of the leads has a circuit board connection end and a chip connection end, respectively, wherein each of the leads 213 extends curvedly between the chip connection end and the circuit board connection end, respectively, and the chip connection end of each of the leads 213 is connected to each of the chip connection pieces of the photosensitive element 212, respectively, and the circuit board connection end of each of the leads 213 is connected to each of the circuit board connection pieces of the circuit board 211, respectively, to conduct the photosensitive element 212 and the circuit board 211, respectively.

It should be noted that the type of the lead 213 is not limited, and for example, the lead 213 may be a gold wire, that is, after the photosensitive element 212 is mounted on the die attach area 2111 of the circuit board 211, the lead 213 may be made conductive to the photosensitive element 212 and the circuit board 211 by a wire bonding process. However, in other examples, the lead 213 may be other types of leads, such as silver wires, copper wires, etc., so as to ensure that the lead 213 can conduct the photosensitive element 212 and the circuit board 211.

Note that, in one example of the camera module of the present invention, each of the wiring board connectors 2113 of the wiring board 211 and each of the chip connectors 2123 of the photosensitive element 212 may be lands, respectively, that is, each of the wiring board connectors 2113 of the wiring board 211 and each of the chip connectors 2123 of the photosensitive element 212 may be disk-shaped, respectively, for connecting the wiring board connection ends and the chip connection ends of the leads 213 to the wiring board connectors 2113 of the wiring board 211 and the chip connectors 2123 of the photosensitive element 212, respectively. In another example of the camera module of the present invention, the circuit board connector 2113 of the circuit board 211 and the chip connector 2123 of the photosensitive element 212 may be spherical, for example, solder paste or other solder material may be dispensed on the edge region 2112 of the circuit board 211 and the non-photosensitive region 2122 of the photosensitive element 212, respectively, to form the circuit board connector 2113 of the circuit board 211 and the chip connector 2123 of the photosensitive element 212, respectively. However, it will be appreciated by those skilled in the art that the types of the circuit board connectors 2113 of the circuit board 211 and the chip connectors 2123 of the photosensitive element 212 do not constitute limitations on the type and scope of the camera module of the present invention, i.e., in other examples of the camera module, the circuit board connectors 2113 of the circuit board 211 and the chip connectors 2123 of the photosensitive element 212 may have other shapes not exemplified above.

Further, as shown in fig. 3, the imaging assembly 21 further includes a set of electronic components 214, and each of the electronic components 214 may be attached to the edge region 2112 of the wiring board 211 at intervals from each other by a process such as SMT (Surface Mount Technology). It should be noted that the photosensitive element 212 and each of the electronic components 214 may be located on the same side or opposite sides of the circuit board 211, respectively. For example, in one specific example shown in fig. 3, the photosensitive element 212 and each of the electronic components 214 may be respectively located on the same side of the circuit board 211, and the photosensitive element 212 may be mounted on the die attach region 2111 of the circuit board 211, and each of the electronic components 214 may be respectively mounted on the edge region 2112 of the circuit board 211 at a distance from each other. It should be appreciated that in the camera module of the present invention, the type of the electronic component 214 may not be limited, and for example, the electronic component 214 can be implemented as a resistor, a capacitor, a driving device, or the like.

According to the first preferred embodiment of the present invention, as shown in fig. 3, each stepped peripheral groove 230 of the molding base 23 of the molded photosensitive assembly 20 defines an optical window 2301, and each filter element 221 disposed in each stepped peripheral groove 230 corresponds to each optical window, wherein the photosensitive area 2121 of each photosensitive element 212 corresponds to each optical window 2301, such that each optical window 2301 provides a light path for each optical lens 10 and each photosensitive element 212, and each filter element 221 is correspondingly located in the light path. For example, in the specific example shown in fig. 3, the filter assembly 22 includes one of the filter elements 221, and the molding base 23 has one of the stepped peripheral grooves 230 to define the light window 2301, wherein the filter element 221 is located between the optical lens 10 and the photosensitive element 212, and the filter element 221, the optical lens 10, and the photosensitive element 212 each correspond to the light window 2301 to provide the light path for the filter element 221, the optical lens 10, and the photosensitive element 212 through the light window 2301 so that light entering the interior of the image pickup module 1 from the optical lens 10 can be received and photoelectrically converted by the photosensitive region 2121 of the photosensitive element 212 after being filtered by the filter element 221.

It will be appreciated by those skilled in the art that in different examples of the camera module, the filter element 221 can be implemented as a different type, for example, the filter element 221 can be implemented as an ir cut filter, a full spectrum filter, or a combination of other filters, for example, the filter element 221 can be implemented as a combination of an ir cut filter and a full spectrum filter, that is, the ir cut filter and the full spectrum filter can be switched to be selectively located on the photosensitive path of the photosensitive element 21, for example, when the camera module is used in an environment where light is relatively sufficient such as daytime, the ir cut filter can be switched to the photosensitive path of the photosensitive element 212 to filter the infrared light reflected by the object entering the camera module by the ir cut filter, and when the camera module is used in an environment where light is relatively dark such as night, the full spectrum filter can be switched to the photosensitive path of the photosensitive element 212 to allow the infrared light entering the reflected object to pass through the portion of the camera module.

It should be noted that, since the filter element 221 of the filter assembly 22 is disposed in the stepped peripheral groove 230 of the molding base 23, in the image capturing module 1 provided by the present invention, the distance between the optical lens 10 and the circuit board 211 is no longer limited by the thickness of the filter assembly 22 itself, that is, the distance between the optical lens 10 and the circuit board 211 can be reduced to be smaller than the sum of the thickness of the filter assembly 22 and the height of the molding base 23, thereby reducing the height of the image capturing module 1.

Specifically, as shown in fig. 2 and 3, the molding base 23 includes a first base portion 231 and a second base portion 232, wherein the second base portion 232 integrally extends inward from a first inner peripheral surface 2311 of the first base portion 231 along the wiring board 211, wherein a height of the first base portion 231 is greater than a height of the second base portion 232 to form the stepped peripheral groove 230 by the first base portion 231 and the second base portion 232, and to form the optical window 2301 by the first inner peripheral surface 2311 of the first base portion 231 and a second inner peripheral surface 2321 of the second base portion 232. In other words, the first base portion 231 is located around the second base portion 232, wherein a first bottom surface 2313 of the first base portion 231 and a second bottom surface 2323 of the second base portion 232 are both attached to the circuit board 211, and a first top surface 2312 of the first base portion 231 is higher than a second top surface 2322 of the second base portion 232 to form the stepped peripheral groove 230 at an inner peripheral edge of the molding base 23.

Thus, in the first preferred embodiment according to the present invention, as shown in fig. 3, the first top surface 2312 of the first base part 231 of the mold base 23 is defined as a first mounting surface of the mold base 23 for mounting the optical lens 10; the second top surface 2322 of the second base portion 232 of the molded base 23 is positioned as a second mounting surface of the molded base 23 for mounting the filter element 221. Since the second mounting surface is lower than the first mounting surface, the mounting height of the filter element 221 is reduced, and therefore the back focus of the optical lens 10 of the camera module 1 is also reduced, and the overall height of the camera module 1 is further reduced, so as to meet the market demand for the development of light and thin camera modules and miniaturization. It should be appreciated that, compared to prior art camera modules, not only is the support member eliminated in the filter assembly, but the filter is also mounted directly to the second mounting surface of the molded base 23, while the lens is mounted directly to the first mounting surface of the module base 23, which reduces not only the mounting height of the filter, but also the distance between the lens and the circuit board, to reduce the overall height of the camera module.

Preferably, the first top surface 2312 of the first base part 231 and the photosensitive surface of the photosensitive element 212 are parallel to each other, so that the optical lens 10 mounted on the first top surface 2312 and the photosensitive element 212 can be actively aligned.

Further, as shown in fig. 3, the second top surface 2322 of the second base portion 232 and the first top surface 2312 of the first base portion 231 are parallel to each other, that is, the second top surface 2322 of the second base portion 232 is also parallel to the photosensitive surface of the photosensitive element 212, so that the filter element 221 mounted to the second top surface 2322 is kept parallel to the photosensitive element 212.

According to the first preferred embodiment of the present invention, as shown in fig. 2 and 3, after the molding base 23 is formed through a molding process, the molding base 23 encapsulates at least a portion of the edge region 2112 of the circuit board 211, each of the electronic components 214, each of the leads 213, and at least a portion of the non-photosensitive region 2122 of the photosensitive element 212 to integrate the circuit board 211, the photosensitive element 212, the leads 213, and the electronic components 214 of the imaging assembly 21 such that the imaging assembly 21 and the molding base 23 form a unitary structure.

Illustratively, as shown in fig. 3, the first base portion 231 of the molded base 23 encapsulates at least a portion of the edge region 2112 of the circuit board 211 and each of the electronic components 214 to isolate adjacent ones of the electronic components 214 by the first base portion 231 of the molded base 23. Accordingly, the second base portion 232 of the molded base 23 encapsulates at least a portion of the edge region 2112 of the circuit board 211, each of the leads 213, and at least a portion of the non-photosensitive region 2122 of the photosensitive element 212 to isolate adjacent ones of the leads 213 by the second base portion 232 of the molded base 23.

Specifically, as shown in fig. 3, the non-photosensitive region 2122 of the photosensitive element 212 has a chip inner portion 21221, a chip connecting portion 21222, and a chip outer portion 21223, wherein the chip inner portion 21221 is located around the photosensitive region 2121, the chip connecting portion 21222 extends inward and outward to connect to the chip inner portion 21221 and the chip outer portion 21223, respectively, and each of the chip connecting members 2123 is provided to the chip connecting portion 21222. In other words, in the present invention, the region of the photosensitive element 212 where the chip connection 2123 is provided is defined as the chip connection 21222, the region of the photosensitive element 212 from the chip connection 21222 to the photosensitive region 2121 is defined as the chip inner portion 21221, and the region of the photosensitive element 212 from the chip connection 21222 to the outer edge of the photosensitive element 212 is defined as the chip outer portion 21223. In other words, the photosensitive element 212 is the photosensitive region 2121, the chip inner portion 21221, the chip connecting portion 21222, and the chip outer portion 21223 in this order from the inside to the outside in a plan view.

Similarly, as shown in fig. 3, the edge region 2112 of the circuit board 211 has a circuit board inside portion 21121, a circuit board connecting portion 21122 and a circuit board outside portion 21123, wherein the circuit board inside portion 21121 is located around the die attach region 2111, the circuit board connecting portion 21122 extends inward and outward to connect to the circuit board inside portion 21121 and the circuit board outside portion 21123, respectively, and the circuit board connecting member 2113 is provided at the circuit board connecting portion 21122. In other words, in the present invention, the region of the wiring board 211 used for disposing the wiring board connector 2113 is defined as the wiring board connection portion 21122, the region of the wiring board 211 from the wiring board connection portion 21122 to the chip light sensing region 2111 is defined as the wiring board inside portion 21121, and the region of the wiring board 211 from the wiring board connection portion 21122 to the outer edge of the wiring board 211 is defined as the wiring board outside portion 21123. In other words, the circuit board 211 is the chip mounting region 211, the circuit board inner portion 21121, the circuit board connecting portion 21122, and the circuit board outer portion 21123 in this order from the inside to the outside in a plan view.

Thus, as shown in fig. 3, the first base portion 231 of the molding base 23 is provided to cover the board outer side portion 21123 of the edge region 2112 of the board 211, the second base portion 232 of the molding base 23 is provided to cover the board connection portion 21122 and the board inner side portion 21121 of the edge region 2112 of the board 211 and the chip outer side portion 21223 and the chip connection portion 21222 of the non-photosensitive region 2122 of the photosensitive element 212, so that each of the electronic components 214 is covered by the first base portion 231 of the molding base 23, and each of the leads 213 is covered by the second base portion 232 of the molding base 23. It is worth mentioning that, in the present invention, the height of the first base portion 231 of the molding base 23 is limited by the height of each electronic component 214, and the height of the second base portion 232 of the molding base 23 is limited by the height of each wire arc 213.

Since in the process of forming the molding base 23 by the molding process, in order to avoid any contact between the mold used and each of the electronic components 214 and each of the leads 213, a certain safety gap needs to be reserved between the mold used and each of the electronic components 214 and each of the leads 213. Therefore, the height of the first base 231 must be greater than the height of the highest electronic component among the electronic components 214, and the height of the second base 232 must be greater than the height of the wire loop of the highest lead among the leads 213. Further, since the height of the capacitor in the electronic component 214 is high (the smallest capacitor is 0.38mm high at present) and the height of the capacitor is also greater than the height of the wire arc of each of the wires 213, the height of the second base portion 232 may be smaller than the height of the first base portion 231 so as to reduce the height of the filter element 221 mounted on the second top surface 2322 of the second base portion 232.

Preferably, as shown in fig. 3, the height of the second base portion 232 is smaller than the height of the electronic component 214 itself, that is, the second top surface 2322 of the second base portion 232 is lower than the top surface of the electronic component 214, so that a lower surface 2211 of the filter element 221 is lower than the top surface of the electronic component 214. Of course, since the heights of the electronic components 214 are different, in some other embodiments of the present invention, the height of the second base portion 232 only needs to be smaller than the height of the highest electronic component of the electronic components 214, that is, the first top surface 2322 of the second base portion 232 only needs to be lower than the top surface of the highest electronic component 214.

It should be appreciated that the height difference between the first base portion 231 and the second base portion 232 may be designed according to the height difference between the electronic component 214 and the lead 213, and the thickness of the filter element 221 may be designed according to the filter performance and the manufacturing process, so that an upper surface 2212 of the filter element 221 may be higher than the first top surface 2312 of the first base portion 231, may be lower than the first top surface 2312 of the first base portion 231, and may be flush with the first top surface 2312 of the first base portion 231. Of course, in the first preferred embodiment of the present invention, since the thickness of the filter element 221 is greater than the height difference between the first base portion 231 and the second base portion 232, when the lower surface 2211 of the filter element 221 is attached to the second top surface 2322 of the second base portion 232, the upper surface 2212 of the filter element 221 is higher than the first top surface 2321 of the first base portion 231.

Fig. 4A shows a first variant of the molded photosensitive assembly 20 according to the above-described first preferred embodiment of the present invention, in which the first base portion 231 of the molded base 23 is provided to cover the board outer side portion 21123 and the board connecting portion 21122 of the edge region 2112 of the molded base 211, and the second base portion 232 of the molded base 23 is provided to cover the board inner side portion 21121 of the edge region 2112 of the molded base 211 and the chip outer side portion 21223, the chip connecting portion 21222, and a portion of the chip inner portion 2122 of the photosensitive element 212, such that each of the electronic components 214 is covered by the first base portion 231 of the molded base 23, and each of the leads 213 is jointly covered by the first base portion 231 and the second base portion 232 of the molded base 23 to isolate the mutually adjacent leads 231, 232 of the first and second base portion 23 of the molded base 23.

In this way, since the distance between the second base portion 232 of the molding base 23 and the electronic component 214 is increased, when the electronic component 232 is close to the lead 213, the electronic component 232 does not affect the molding process of the second base portion 232 of the module base 23, in other words, the electronic component 214 does not interfere with the portion of the molding die in which the second base portion 232 is molded during the molding of the molding base 23, so as to ensure the normal operation of the molding process.

Fig. 4B shows a second variant of the molded photosensitive assembly 20 according to the first preferred embodiment of the present invention described above, in which the first base portion 231 of the molded base 23 is provided to cover the board outer side portion 21123, the board connecting portion 21122, and the board inner side portion 21121 of the edge region 2112 of the board 211, and the second base portion 232 of the molded base 23 is provided to cover the chip outer side portion 21223, the chip connecting portion 21222, and a portion of the chip inner side portion 21221 of the non-photosensitive region 2122 of the photosensitive element 212, such that each of the electronic components 214 is covered by the first base portion 231 of the molded base 23, and each of the leads 213 is jointly covered by the first base portion 231 and the second base portion 232 of the molded base 23 to isolate the jointly adjacent leads 213 by the first and second base portions 231, 232 of the molded base 23. In other words, the first base portion 231 of the molding base 23 covers the edge region 2112 of the circuit board 211, and the second base portion 232 of the molding base 23 covers a portion of the non-photosensitive region 2122 of the photosensitive element 212, which facilitates the mounting position of the electronic component 214 to be closer to the circuit board connector 2113 of the circuit board 211, so as to reduce the overall size of the circuit board 211.

Fig. 4C shows a third modification of the molded photosensitive assembly 20 according to the above-described first preferred embodiment of the present invention, in which the first base portion 231 of the molded base 23 is provided to cover the edge region 2112 of the wiring board 211 and the chip outside portion 21223 of the non-photosensitive region 2122 of the photosensitive element 212, and the second base portion 232 of the molded base 23 is provided to cover the chip connecting portion 21222 and a portion of the chip inside portion 21221 of the non-photosensitive region 2122 of the photosensitive element 212, such that each of the electronic components 214 is covered by the first base portion 231 of the molded base 23, and each of the leads 213 is jointly covered by the first base portion 231 and the second base portion 232 of the molded base 23 to jointly isolate the adjacent leads 213 by the first and second base portions 231, 232 of the molded base 23.

In other words, the first base portion 231 of the mold base 23 covers not only the edge region 2112 of the wiring board 211 but also a portion of the non-photosensitive region 2122 of the photosensitive element 212 to enhance the connection strength between the photosensitive element 212 and the wiring board 211 by the first base portion 231. Meanwhile, since the second base portion 232 of the molding base 23 covers only a portion of the non-photosensitive region 2122 of the photosensitive element 212, the lateral dimension of the stepped peripheral groove 230 of the module base 23 is smaller than the lateral dimension of the photosensitive element 212, and thus the lateral dimension of the filter element 221 disposed in the stepped peripheral groove 230 is also smaller than the lateral dimension of the photosensitive element 212, but larger than the lateral dimension of the photosensitive region 2121 of the photosensitive element 212. In this way, not only can the filter element 221 be ensured to perform the corresponding filtering effect, but also the size of the filter element 221 can be reduced as much as possible, because the larger the size of the filter element 221 is, the more easily broken, and the larger the size is, the higher the cost is.

Referring to fig. 1 to 5B, the camera module 1 further includes at least one actuator 30, wherein each optical lens 10 is assembled to each actuator 30, and each actuator 30 is assembled to the first top surface 2312 of the first base portion 231 of the molded base 23, so that each optical lens 10 is held in the photosensitive path of each photosensitive element 212 of the molded photosensitive assembly 20. In addition, when the image capturing module is used, the driver 30 can drive the optical lens 10 to move back and forth along the photosensitive path of the photosensitive element 212, so as to adjust the focal length of the image capturing module by adjusting the distance between the optical lens 10 and the photosensitive element 212. The type of the driver 30 of the camera module 1 of the present invention is not limited, and the driver 30 may be implemented as a voice coil motor, which can be electrically connected to the circuit board 211 to be in an operating state after receiving electric power and a control signal, and drive the optical lens 10 to move back and forth along the photosensitive path of the photosensitive element 212. However, it will be appreciated by those skilled in the art that the type of the driver 30 is not limited, as long as it can drive the optical lens 10 to move back and forth along the photosensitive path of the photosensitive element 212.

Referring to fig. 5A and 5B, a process of manufacturing the camera module 1 according to the first preferred embodiment of the present invention is shown. It will be appreciated by those skilled in the art that the process of manufacturing the molded photosensitive assembly 20 and the process of manufacturing the camera module 1 shown in fig. 5A and 5B are merely examples to illustrate the features and advantages of the present invention and are not to be construed as limiting the scope and content of the present invention.

Specifically, in fig. 5A, the photosensitive element 212 is mounted on the chip mounting area 2111 of the wiring board 211, the chip connection end of each of the leads 213 is connected to each of the chip connectors 2123 of the photosensitive element 212, and the wiring board connection end of each of the leads 213 is connected to each of the wiring board connectors 2113 of the wiring board 211. Each of the electronic components 214 is attached to the board outer side portion 21123 of the edge region 2112 of the board 211 at intervals, respectively, to assemble the imaging assembly 21.

In fig. 5A, the imaging assembly 21 is placed in a molding die 500 to perform a molding process by the molding die 500, thereby forming the molding base 23 having the stepped peripheral groove 230, and the edge region 2112 of the wiring board 211 and a portion of the non-photosensitive region 2122 of the photosensitive element 212 are covered by the molding base 23. It will be appreciated by those skilled in the art that in other embodiments of the present invention, a plurality of the imaging assemblies 21 may be simultaneously placed in a molding die to perform a molding process on a plurality of the imaging assemblies 21 by means of the molding die, thereby forming a plurality of the molding bases 23 having the stepped peripheral grooves 230 at a time.

Specifically, the molding module 500 includes an upper mold 510 and a lower mold 520, wherein at least one of the upper and lower molds 510, 520 is movable to enable the upper mold 510 and the lower mold 520 to be subjected to mold clamping and mold drawing operations, and a molding space 530 is formed between the upper mold 510 and the lower mold 520 when the molding mold 500 is in a clamped state, wherein the mold base 23 is formed by a molding material added to the molding space 530 and after curing.

More specifically, the upper mold 510 has a first inner surface 511, a second inner surface 512, and a pressing surface 513, wherein the second inner surface 512 is located around the first inner surface 511, and the second inner surface 512 is located between the first inner surface 511 and the pressing surface 513, wherein the second inner surface 512 is lower than the first inner surface 511, and the pressing surface 513 is lower than the second inner surface 512.

In fig. 5A, after the imaging assembly 21 is placed on the upper mold 510 and/or the lower mold 520, the upper mold 510 and the lower mold 520 are operated to be clamped such that the imaging assembly 21 is positioned in the molding space 530 formed between the upper mold 510 and the lower mold 520. At this time, the first inner surface 511 of the upper mold 510 corresponds to the circuit board outer side portion 21123 of the edge region 2112 of the circuit board 211 to define a first molding space 531 between the first inner surface 511 and the circuit board 211, and the first base portion 231 is formed after the molding material is added to the first molding space 531 and cured; the second inner surface 512 of the upper mold 510 corresponds to the circuit board connection portion 21122 and the circuit board inner portion 21121 of the edge region 2112 of the circuit board 211 and the chip outer portion 21223 and the chip inner portion 21221 of the non-photosensitive element 2122 of the photosensitive element 212 to define a second molding space 532 between the second inner surface 512 and the circuit board 211, and the second base portion 232 is formed after the molding material is added to the second molding space 532 and cured; the pressing surface 513 of the upper mold 510 presses the photosensitive element 212, and since the photosensitive element 212 is located in the die attach area 2111 of the circuit board 211 and the die attach area 2111 is located in the middle of the circuit board 211, the circuit board 211 can be flattened by the pressing surface 513, so that the overall flatness of the circuit board 211 is ensured, that is, a flat molding base is provided for the molding process.

It is noted that the first molding space 531 communicates with the second molding space 532 to form the molding space 530 having a unitary structure, so that the molding material can flow from the first molding space 531 into the second molding space 532 to form the molding base 23 having a unitary structure after the molding material is solidified. It should be appreciated that when the molding material is cured within the molding space 530 to form the molding base 23, the first inner surface 511 of the upper mold 510 corresponds to the first top surface 2312 of the first base portion 231 of the molding base 23, and the second inner surface 512 of the upper mold 510 corresponds to the second top surface 2322 of the second base portion 232 of the molding base 23. And the first inner surface 511 of the upper mold 510 is higher than the second inner surface 512 of the upper mold 520 such that the height of the first base portion 231 is greater than the height of the second base portion 232 to form the stepped peripheral groove 230 at the inner peripheral edge of the molding base 23.

It should be noted that, the first inner surface 511 and the second inner surface 512 of the upper mold 510 are parallel to the pressing surface 513 of the upper mold 510, and when the pressing surface 513 is pressed against the photosensitive element 212 in an overlapping manner, the first inner surface 511 and the second inner surface 512 are parallel to the photosensitive element 212, so that after the molding base 23 is formed, the first top surface 2312 and the second top surface 2322 are parallel to the photosensitive element 212, which facilitates active calibration in a subsequent assembly process.

Further, as shown in fig. 5A, the forming mold 500 further includes a cover film 540, wherein the cover film 540 is overlapped on the pressing surface 513 of the upper mold 510. When the pressing surface 513 of the upper mold 510 presses the photosensitive element 212, the cover film 540 is positioned between the pressing surface 513 of the upper mold 510 and the photosensitive element 212 to avoid the pressing surface 513 of the upper mold 510 from scratching the photosensitive element 212 or contaminating the photosensitive element 212. In addition, the cover film 540 can also prevent a gap from being generated between the pressing face 513 of the upper mold 510 and the photosensitive element 212, so as to prevent the molding material from entering between the pressing face 513 of the upper mold 510 and the photosensitive element 212 to contaminate the photosensitive region 2121 of the photosensitive element 212 during the molding process. Of course, the cover film 540 can absorb impact force generated at an instant when the pressing surface 513 of the upper mold 510 contacts the photosensitive element 212 when the upper mold 510 and the lower mold 520 are subjected to the mold clamping operation, thereby preventing the mold clamping of the upper mold 510 and the lower mold 520 from damaging the photosensitive element 212.

In other embodiments of the present invention, the cover film 540 of the molding die 500 has a ring-shaped structure, wherein the cover film 540 is disposed at the outer peripheral edge of the pressing surface 513 of the upper die 510, so that after the upper and lower dies 510, 520 are clamped, the cover film 540 correspondingly presses the chip inner portion 21221 of the non-photosensitive region 2122 of the photosensitive element 212, for avoiding the cover film 540 and the pressing surface 513 from directly contacting the photosensitive region 2121 of the photosensitive element 212, so that the photosensitive region 2121 of the photosensitive element 212 is not damaged by external pressure.

After the molding material is cured in the molding space 530 to form the molded base 23, a molded photosensitive assembly blank is formed, wherein the molded photosensitive assembly blank includes the imaging assembly 21 and the molded base 23, as shown in fig. 5B. Next, the upper mold 510 and the lower mold 520 are operated to perform drawing to open the molding space 530 of the molding mold 500 for taking out the molded photosensitive assembly semi-finished product from the molding space 530. Then, the filter element 221 is attached to the second top surface 2322 of the second base portion 232 of the molded base 23 to manufacture the molded photosensitive assembly 20.

Generally, for better drawing operation, the inner peripheral surface of the molding base 23 has a certain inclination angle with respect to the photosensitive surface of the photosensitive element 212. In other words, as shown in fig. 3 and 5A, the first inner peripheral surface 2311 of the first base portion 231 has a first predetermined inclination angle θ ₁ with respect to the photosensitive surface of the photosensitive element 212, and the second inner peripheral surface 2321 of the second base portion 232 also has a second predetermined inclination angle θ ₂ with respect to the photosensitive surface of the photosensitive element 212, and the width of the first top surface 2312 of the first base portion 231 is smaller than the width of the first bottom surface 2313 of the first base portion 231, and the width of the second top surface 2322 of the second base portion 232 is smaller than the width of the second bottom surface 2323 of the second base portion 232.

However, in order to make the filter element 221 have a wider attachment surface, that is, the second base portion 232 has a wider second top surface 2322, therefore, the smaller the first and second predetermined inclination angles θ ₁、θ₂, the better, even the first and second predetermined inclination angles θ ₁、θ₂ may be zero (that is, the first inner peripheral surface 2311 and the second inner peripheral surface 2321 may be perpendicular to the photosensitive surface of the photosensitive element 212).

Preferably, the first and second predetermined inclination angles θ ₁、θ₂ are less than 30 ° to increase an attaching area between the filter element 221 and the second top surface 2322 of the second base portion 232 to improve reliability of adhesion between the filter element 221 and the second base portion 232 to prevent the filter element 221 from being deviated or falling off.

According to the first preferred embodiment of the present invention, as shown in fig. 5B, the optical filter assembly 22 further comprises an adhesive layer 222, wherein the adhesive layer 222 is disposed between the second top surface 2322 of the second base portion 232 and the optical filter element 221, so as to adhere the optical filter element 221 to the second base portion 232, thereby fixedly attaching the optical filter element 221 to the stepped peripheral groove 230 of the molding base 23, and enabling the optical filter element 221 to correspond to the optical window 2301 of the molding base 23.

Specifically, in the embodiment shown in fig. 5B, a glue is applied to the second top surface 2322 of the second base portion 232, and then the filter element 221 is correspondingly disposed on the second top surface 2322 of the second base portion 232, so as to form the adhesive layer 222 between the second top surface 2322 of the second base portion 232 and the lower surface 2211 of the filter element 221 after the glue is cured, so as to fixedly connect the filter element 221 and the second base portion 232 of the molding base 23 through the adhesive layer 222.

In another embodiment of the present invention, glue may be applied to the lower surface 2211 of the filter element 221, and then the filter element 221 is correspondingly disposed on the second top surface 2322 of the second base portion 232, so as to form the adhesive layer 222 between the second top surface 2322 of the second base portion 232 and the lower surface 2211 of the filter element 221 after the glue is cured, so as to fixedly connect the filter element 221 and the second base portion 232 of the molded base 23 through the adhesive layer 222.

It should be noted that the glue used to form the adhesive layer 222 may be a thermosetting glue or other type of glue. Preferably, the adhesive layer 222 may have better elasticity to prevent the filter element 221 from being damaged when the camera module 1 collides. More preferably, the glue forming the adhesive layer 222 has low fluidity so as to prevent the glue from flowing down from the second inner peripheral surface 2321 of the second base part 232, thereby ensuring the product yield of the camera module. The poor fluidity glue is selected, on the one hand, because the reflectivity of the cured glue is greater than that of the module base 23, and when the glue flows to the second inner peripheral surface 2321, a flare problem may be caused to the camera module; on the other hand, if glue remains on the photosensitive area 2121 of the photosensitive element 212, the photosensitive area 2121 of the photosensitive element 212 will be contaminated.

Further, as shown in fig. 5B, a mounting gap 2302 is reserved between the filter element 221 and the first inner peripheral surface 2311 of the first base portion 231, that is, the stepped peripheral groove 230 of the molding base 23 has a lateral dimension larger than that of the filter element 221 so as to attach the filter element 221 to the second top surface 2322 of the second base portion 232. In this way, since the outer peripheral edge of the filter element 221 is not in direct contact with the first base portion 231, but the safety gap 2302 is reserved, it is possible to effectively prevent the first base portion 231 of the mold base 23 from transmitting the stress received to the filter element 221, so as not to damage the filter element 221. Of course, the lateral dimensions of the filter element 221 are smaller than those of the stepped peripheral groove 230 of the molded base 23, also facilitating the fitting of the filter element 221 into the stepped peripheral groove 230.

Preferably, as shown in fig. 5B, the adhesive layer 222 has at least one air vent 2221, wherein the air vent 2221 extends from the inside of the adhesive layer 222 to the outside of the adhesive layer 222, so as to communicate the inside space of the adhesive layer 222 with the safety gap 2302 through the air vent 2221, and further communicate the inside space of the molded photosensitive element 20 with the outside space of the molded photosensitive element 20, so as to allow air between the filter element 221 and the photosensitive element 212 to escape to the outside through the air vent 2221 when the filter element 221 is attached to the stepped peripheral groove 230 of the molded base 23, so as to prevent the attachment of the filter element 221 from being affected.

In other words, the glue is applied on the second top surface 2322 of the second base portion 232 by breaking, so as to form the adhesive layer 222 having the air vent 2221 after the glue is cured. That is, a circle of the glue cannot be applied to the second top surface 2322 of the second base portion 232, but the glue is intermittently applied to reserve at least one notch, so that the air escape holes 2221 are formed on the adhesive layer 222 after the glue is cured.

In fig. 5B, the optical lens 10 is assembled to the driver 30, and the driver 30 is assembled to the first top surface 2312 of the first base part 231 of the molding base 23, so that the optical lens 10 is held in the photosensitive path of the photosensitive element 212, thereby manufacturing the image capturing module 1.

Fig. 6A shows a first variant of the camera module 1, wherein the camera module 1 is embodied as a fixed-focus camera module, i.e. the driver 30 may be omitted in this embodiment of the camera module according to the invention. Specifically, the image capturing module 1 includes at least one lens barrel 40, wherein the lens barrel 40 integrally extends on the first top surface 2312 of the first base portion 231 of the molded base 23, and each of the optical lenses 10 is assembled to each of the lens barrels 40, respectively, such that each of the optical lenses 10 is held in the photosensitive path of each of the photosensitive elements 212 of the molded photosensitive assembly 20 by each of the lens barrels 40. That is, in this embodiment of the camera module of the present invention, the lens barrel 40 and the molding base 23 may be integrally cured and molded by the molding material through a molding process, thereby enhancing the stability and reliability of the camera module.

Fig. 6B shows a second modified embodiment of the camera module 1, in which the separately manufactured lens barrel 40 is assembled to the first top surface 2312 of the first base part 231 of the module base 23 after the molded base 23 is formed by curing the molding material through a molding process, wherein the optical lens 10 is assembled to the lens barrel 40 such that the optical lens 10 is held on a photosensitive path of the photosensitive element 212 of the molded photosensitive assembly 20 by the lens barrel 40. In addition, in assembling the lens barrel 40 to the first top surface 2312 of the first base part 231 of the mold base 23, an angle at which the lens barrel 40 is assembled to the first top surface 2312 of the first base part 231 of the mold base 23 may be adjusted by a calibration device, so that an optical axis of the optical lens 10 can be perpendicular to the light sensing surface of the light sensing element 212 to ensure an imaging quality of the image capturing module 1. It is to be appreciated that barrel 40 may be fabricated separately such that barrel 40 may or may not be threaded, as the invention is not limited in this respect.

Fig. 6C shows a third variant of the camera module 1, in which the leads 213 are connected to the circuit board 211 and the photosensitive element 212 by a "reverse-printing" process during the mounting of the photosensitive element 212. In this way, the height of the upward protrusion of the lead 213 may be made not to exceed the height of the upward protrusion of the chip connector 2123 of the photosensitive element 212, that is, the wire-loop height of the lead 213 is reduced to reduce the height of the second base portion 232 of the molded base 23, so that the difference in height between the first top surface 2311 of the first base portion 231 and the second top surface 2321 of the second base portion 232 can be increased so that the upper surface 2212 of the filter element 221 is flush with the first top surface 2312 of the first base portion 231, even so that the upper surface 2212 of the filter element 221 is lower than the first top surface 2312 of the first base portion 231 to prevent the filter element 221 from being bumped when the optical lens 10 is moved.

It should be noted that, the "reverse bonding" process according to the present invention refers to a wire bonding method of the lead 213 from the circuit board 211 to the photosensitive element 212 in the process of conducting the photosensitive element 212 and the circuit board 211 through the lead 213. Specifically, by providing the wiring board connector 2113 on the wiring board 211, the wire bonding jig forms the wiring board connection end of the lead 213 connected to the wiring board connector 2113 at the tip of the wiring board connector 2113, then lifts up a predetermined position, then translates toward the wiring board connector 2113 and forms the chip connection end of the lead 213 connected to the chip connector 2123 at the tip of the chip connector 2123, so that the lead 213 extends in a curved shape, in such a manner that the height of the upward protrusion of the lead 213 may be substantially flush with the height of the chip connector 2123, and even the height of the upward protrusion of the lead 213 may be lower than the height of the chip connector 2123.

Fig. 6D shows a fourth variant of the camera module 1, in which the second base part 232 of the molding base 23 is further provided with a glue groove 2324, and the glue groove 2324 is recessed downward from the second top surface 2322 of the second base part 232, wherein the glue can be applied into the glue groove 2324 of the second base part 232 and protrude out of the second top surface 2322 of the second base part 232, so that after the filter element 221 is correspondingly disposed on the imaging assembly 21, the adhesive layer 222 formed by curing the glue can be disposed overlapping the lower surface 2211 of the filter element 221, thereby ensuring that the filter element 221 is firmly disposed in the stepped peripheral groove 230 of the molding base 23, and preventing glue from flowing to the second inner peripheral surface 2321 of the second base part 232 of the molding base 23.

Fig. 6E shows a fifth variant of the camera module 1, wherein the filter member 22 further comprises at least one annular support 223, wherein the filter element 221 is assembled to the support 223, and the support 223 is disposed on the first base portion 231 of the molding base 23, so that the filter element 221 is correspondingly disposed on the stepped peripheral groove 230 of the molding base 23 through the support 223.

Specifically, the upper surface 2212 of the filter element 221 is fixedly attached to the lower side of the support 223 by the adhesive layer 222 so that the upper surface 2212 of the filter element 221 is positioned below the first top surface 2312 when the support 223 is attached to the first top surface 2312 of the first base part 231 of the mold base 23. By this attaching means, the attaching width or attaching area between the filter element 221 and the supporting member 223 can be increased to enhance the adhesive strength between the filter element 221 and the supporting member 223, so as to prevent the filter element 221 from being damaged by impact. In addition, the driver 30 of the camera module 1 is also attached to the first top surface 2312 of the first base part 231 of the mold base 23, and the support 223 is located inside the driver 30, without increasing the overall height of the camera mold 1.

It should be noted that the supporting member 223 may be made of a material having a certain toughness such as plastic, metal, or the like. Since the support 223 is made of a material having higher toughness than that of the molding base 23, the filter element 221 is not easily detached from the molding base 23, so that the risk of breakage of the filter element 221 is reduced.

Fig. 6F shows a sixth modification of the camera module 1, in which the support 223 of the filter member 22 is disposed between the driver 30 and the first top surface 2312 of the first base portion 231, that is, the support 223 is attached to the first top surface 2312 of the first base portion 231, and the driver 30 is attached to the support 223 so as to correspondingly dispose the filter element 221 to the stepped peripheral groove 230 of the mold base 23 through the support 223.

It should be appreciated that although in this variant embodiment the height of the camera module 1 is increased by one thickness of the support 223, the height of the camera module 1 in this variant embodiment of the invention is still reduced compared to the camera modules of the prior art, since the thickness of the support 223 is smaller than the thickness of the filter element 221. Further, since the contact area between the support 223 and the mold base 23 is greatly increased, the filter element 221 can be more firmly mounted to the mold base 23 through the support 223 to prevent the filter element 221 from being damaged by collision.

Fig. 6G shows a seventh modified embodiment of the camera module 1, in which the die attach region 2111 of the circuit board 211 of the imaging module 21 of the molded photosensitive assembly 20 is sunk to form a die attach groove 2114 at the die attach region 2111 of the circuit board 211, in which the photosensitive element 212 is correspondingly disposed in the die attach groove 2114 of the circuit board 211 to lower the height of the photosensitive surface of the photosensitive element 212, so that the height of the second base portion 232 of the molded base 23 is further lowered, whereby the upper surface 2212 of the filter element 221 can be made flush with the first top surface 2312 of the first base portion 231, even so that the upper surface 2212 of the filter element 221 is lower than the first top surface 2312 of the first base portion 231 to prevent the filter element 221 from being bumped when the optical lens 10 is moved.

In other words, the die attach groove 2114 of the circuit board 211 is recessed downward from the upper side of the circuit board 211 to form a recess in the die attach area 2111 of the circuit board 211, wherein the photosensitive element 212 is attached to the recess to reduce the height of the photosensitive surface of the photosensitive element 212, thereby further reducing the height of the wire bow of the wire 213, which helps to reduce the height of the second base portion 232 of the molding base 23.

Fig. 6H shows an eighth variant of the camera module 1, in which the circuit board 211 of the imaging module 21 of the molded photosensitive module 20 is further provided with a through-hole type die attach groove 2114', in which the die attach groove 2114' extends downward from the upper side surface of the circuit board 211 to the lower side surface of the circuit board 211 to form a through hole in the die attach region 2111 of the circuit board 211, and in which the photosensitive element 212 is correspondingly disposed in the through hole so that the photosensitive surface of the photosensitive element 212 is lower than the upper side surface of the circuit board 211, thereby minimizing the height of the wire bow of the wire 213 to minimize the height of the second base portion 232 of the molded base 23.

Referring to fig. 7A to 7D of the drawings, according to another aspect of the present invention, the first preferred embodiment of the present invention further provides a method of manufacturing a molded photosensitive member and a method of manufacturing an image pickup module. As shown in fig. 7A, the method for manufacturing the molded photosensitive assembly includes the steps of:

S1: attaching a photosensitive element 212 and at least one group of electronic components 214 to a circuit board 211, and conducting the photosensitive element 212 and the circuit board 211 to assemble an imaging assembly 21;

s2: forming a molding base 23 having a stepped peripheral groove 230 for covering a portion of the circuit board 211 and a portion of the photosensitive element 212 by a molding process to form an optical window 2301 through the stepped peripheral groove 230, wherein a photosensitive area 2121 of the photosensitive element 212 corresponds to the optical window 2301 of the molding base 23 to make a molded photosensitive assembly semi-finished product having an integral structure; and

S3: a filter element 221 of a filter element 22 is correspondingly disposed in the stepped peripheral groove 230 of the molded base 23 of the molded photosensitive element blank to assemble a molded photosensitive element 20, wherein the photosensitive area 2121 of the photosensitive element 212 corresponds to the filter element 221.

It should be noted that, in an embodiment of the present invention, as shown in fig. 7B, the step S1 includes the steps of:

S11: attaching the photosensitive element 212 to a chip attach area 2111 of the circuit board 211;

S12: a circuit board outer side portion 21123 for attaching each of the electronic components 214 to an edge region 2112 of the circuit board 211; and

S13: by a wire bonding process, a lead 213 is extended from a chip connector 2123 of the photosensitive element 212 to a wiring board connector 2113 of the wiring board 211 to conductively connect the photosensitive element 212 and the wiring board 21.

In another variant embodiment of the present invention, as shown in fig. 7B, the step S1 further includes a step S13': by a reverse bonding process, a lead 213 is extended from a wiring board connector 2113 of the wiring board 211 to a chip connector 2123 of the photosensitive element 212 to conductively connect the photosensitive element 212 and the wiring board 21.

Further, as shown in fig. 7C, the step S2 includes the steps of:

S21: placing the imaging assembly 21 in a forming mold 500;

S22: a mold clamping operation is performed on an upper mold 510 and a lower mold 520 of the molding mold 500, and a molding space 530 of the molding mold 500 is formed between the upper mold 510 and the lower mold 520;

S23: adding a molding material to the molding space 103 of the molding die 500 to form the molding base 23 having the stepped peripheral groove 230 after the molding material is solidified; and

S24: and (3) performing a drawing operation on the forming die 500 to obtain the semi-finished product of the molded photosensitive assembly.

More specifically, the step S22 includes the steps of:

Disposing a cover film 540 on a pressing surface 513 of the upper mold 510;

Pressing the photosensitive element 212 of the imaging assembly 21 by the cover film 540, so that the cover film 540 is positioned between the pressing surface 513 and the photosensitive element 212;

A first molding space 531 of the molding space 530 is formed between a first inner surface 511 of the upper mold 510 and a circuit board outer side portion 21123 of the edge region 2112 of the circuit board 211; and

A second molding space 532 of the molding space 530 is formed between a second inner surface 512 of the upper mold 510 and a circuit board connection portion 21122 and a circuit board inner portion 21121 of the edge region 2112 of the circuit board 211 and a chip outer portion 21223 and a chip connection portion 21222 of a non-photosensitive region 2122 of the photosensitive element 212, wherein the first inner surface 511 of the upper mold 510 is above the second inner surface 512 of the upper mold 510.

Further, the step S23 includes the steps of:

Adding the molding material to the first molding space 531 to form a first base portion 231 of the molding base 23 for covering the board outer side portion 21123 of the edge region 2112 of the board 211 after the molding material is cured; and

The molding material is added to the second molding space 532 to form the board connection portion 21122 and the board inner portion 21121 for coating the edge region 2112 of the board 211 and the chip outer portion 21223 and the chip connection portion 21222 of the non-photosensitive region 2122 of the photosensitive element 212 after the molding material is cured, wherein the height of the second base portion 232 is lower than the height of the first base portion 231.

In the first preferred embodiment of the present invention, as shown in fig. 7D, the step S3 includes the steps of:

S31: applying a glue to a second top surface 2322 of the second base portion 232 of the molded base 23;

s32: correspondingly disposing the filter element 221 on the second top surface 2322 of the second base portion 232; and

S33: after the glue is cured, an adhesive layer 222 of the filter assembly 22 is formed between a lower surface 2211 of the filter element 221 and the second top surface 2322 of the second base portion 232.

In a variant embodiment of the present invention, as shown in fig. 7D, the step S3 includes the steps of:

s31': applying a glue to a lower surface 2211 of the filter element 221;

S32': correspondingly, the filter element 221 is disposed on a second top surface 2322 of the second base portion 232; and

S33': after the glue is cured, an adhesive layer 222 of the filter assembly 22 is formed between the lower surface 2211 of the filter element 221 and the second top surface 2322 of the second base portion 232.

In another variant embodiment of the present invention, as shown in fig. 7D, the step S3 includes the steps of:

S31': applying a glue to an annular support 223 of the filter assembly 22;

S32': correspondingly, the filter element 221 is disposed on the support 223, so as to form an adhesive layer 222 of the filter assembly 22 between an upper surface 2212 of the filter element 221 and the support 223 after the glue is cured; and

S33': the support member 223 is correspondingly disposed on a first top surface 2312 of the first base portion 231, so that the optical filter element 221 is located in the stepped peripheral groove 230 of the molded base 23.

As shown in fig. 8, the method for manufacturing the camera module includes the steps of:

(a) Attaching a photosensitive element 212 and at least one group of electronic components 214 to a circuit board 211, and conducting the photosensitive element 212 and the circuit board 211 to assemble an imaging assembly 21;

(b) Forming a molding base 23 having a stepped peripheral groove 230 for covering a portion of the circuit board 211 and a portion of the photosensitive element 212 by a molding process to define an optical window 2301 on the molding base 23 through the stepped peripheral groove 230, wherein a photosensitive area 2121 of the photosensitive element 212 corresponds to the optical window 2301 of the molding base 23 to make a molded photosensitive assembly semi-finished product having an integral structure;

(c) Correspondingly, a filter element 221 of a filter assembly 22 is disposed in the stepped peripheral groove 230 of the molding base 23 of the molded photosensitive assembly semi-finished product to assemble a molded photosensitive assembly 20, wherein the photosensitive area 2121 of the photosensitive element 212 corresponds to the filter element 221; and

(D) An optical lens 10 is correspondingly arranged on a photosensitive path of the imaging component 21 of the molded photosensitive component 20 to manufacture an image pickup module 1.

Referring to fig. 9 to 11 of drawings, an image pickup module and a molded photosensitive member and a method of manufacturing the same according to a second preferred embodiment of the present invention are illustrated. Compared to the above-described first preferred embodiment according to the present invention, the image capturing module 1A according to the second preferred embodiment of the present invention is different in that: as shown in fig. 9, a molded base 23A of a molded photosensitive element 20A of the camera module 1A is only coated on the outer side portion 21123 of the edge region 2112 of the circuit board 211, but not coated on other portions of the edge region 2112 of the circuit board 211 and the non-photosensitive region 2122 of the photosensitive element 212. In other words, the first base portion 231A and the second base portion 232A of the molded base 23A are both coated on the board outer side portion 21123 of the edge region 2112 of the board 211, and the first base portion 231A coats each of the electronic components 214, while the second base portion 232A coats neither the electronic components 214 nor the leads 213, so that a safety gap reserved between the second base portion 232A and the leads 213 can be further reduced so as to further reduce the height of the second base portion 232A.

It should be noted that, since the circuit board connector 2113 and the die attach area 2111 of the circuit board 211 are exposed outside the molding base 23A, the molding base 23A may be formed on the circuit board 211 by a molding process, then the photosensitive element 212 is attached to the circuit board 211, and finally the circuit board 211 and the photosensitive element 212 are conducted.

Illustratively, as shown in fig. 10A and 10B, the circuit board 211 is placed in a molding die 500A to perform a molding process by the molding die 500A, thereby forming the molding base 23A having the stepped peripheral groove 230, and the circuit board outer side portion 21123 of the edge region 2112 of the circuit board 211 is covered by the molding base 23A.

Specifically, the molding module 500A includes an upper mold 510A and a lower mold 520A, wherein at least one of the upper and lower molds 510A, 520A is movable to enable the upper mold 510A and the lower mold 520A to be subjected to mold clamping and mold drawing operations, and a molding space 530A is formed between the upper mold 510A and the lower mold 520A when the molding mold 500A is in a clamped state, wherein the module base 23A is formed by a molding material added to the molding space 530A and after curing.

More specifically, the upper mold 510A has a first inner surface 511A, a second inner surface 512A, and a pressing surface 513A, wherein the second inner surface 512A is located around the first inner surface 511A, and the second inner surface 512A is located between the first inner surface 511A and the pressing surface 513A, wherein the second inner surface 512A is lower than the first inner surface 511A, and the pressing surface 513A is lower than the second inner surface 512A.

In fig. 10A, after the circuit board 211 is placed in the upper mold 510A and/or the lower mold 520A, the upper mold 510A and the lower mold 520A are operated to be clamped such that the circuit board 211 is positioned in the molding space 530A formed between the upper mold 510A and the lower mold 520A. At this time, the first inner surface 511A of the upper mold 510A corresponds to the circuit board outer side portion 21123 of the edge region 2112 of the circuit board 211 to form a first molding space 531A between the first inner surface 511A and the circuit board outer side portion 21123 of the circuit board 211, and the first base portion 231A is formed after the molding material is added to the first molding space 531A and cured; the second inner surface 512A of the upper mold 510A also corresponds to the circuit board outer side 21123 of the edge region 2112 of the circuit board 211 to form a second molding space 532A between the second inner surface 512A and the circuit board outer side 21123 of the circuit board 211, and the second base portion 232A is formed after the molding material is added to the second molding space 532A and cured; the pressing surface 513A of the upper mold 510A presses the die attach region 2111 of the circuit board 211 and the circuit board inner side portion 21121 and the circuit board connecting portion 21122 of the edge region 2112, and since the die attach region 2111 is located at the middle of the circuit board 211, the circuit board 211 can be flattened by the pressing surface 513A, thereby ensuring the overall flatness of the circuit board 211, that is, providing a flat molding base for the molding process.

As shown in fig. 10B, after the molding material is cured in the molding space 530A to form the molded base 23A, a molded photosensitive member semi-finished product having an integrated structure is manufactured, wherein the molded photosensitive member semi-finished product includes the wiring board 211 of the imaging member 21 and the molded base 23. Next, the upper mold 510 and the lower mold 520 are operated to perform drawing to open the molding space 530 of the molding mold 500 for taking out the molded photosensitive assembly semi-finished product from the molding space 530. Then, the photosensitive element 212 is mounted on the chip mounting area 2111 of the wiring board 211, and the photosensitive element 21 and the wiring board 211 are conducted. Finally, the filter element 221 is attached to the second top surface 2322 of the second base portion 232A of the molded base 23A, so as to manufacture the molded photosensitive assembly 20A.

It should be noted that, in the second preferred embodiment of the present invention, except for the above-mentioned structure, other structures of the camera module 1A are the same as those of the camera module 1 according to the first preferred embodiment of the present invention, and the camera module 1A also has a similar or identical modification to the various modification of the camera module 1 according to the first preferred embodiment, which is not repeated herein.

According to another aspect of the present invention, the second preferred embodiment of the present invention further provides a method of manufacturing a molded photosensitive assembly. As shown in fig. 11, the method for manufacturing the molded photosensitive assembly 20A includes the steps of:

(A) Forming a molding base 23A having a stepped peripheral groove 230 for covering an edge region 2112 of a circuit board 211 by a molding process to form an optical window 2301 through the stepped peripheral groove 230, wherein a photosensitive region 2121 of the photosensitive element 212 corresponds to the optical window 2301 of the molding base 23A to make a molded photosensitive element semi-finished product having an integral structure;

(B) Attaching a photosensitive element 212 to a chip attach area 2111 of the circuit board 211, and conducting the photosensitive element 212 and the circuit board 211; and

(C) A filter element 221 of a filter element 22 is correspondingly disposed in the stepped peripheral groove 230 of the molding base 23A to assemble a molded photosensitive element 20A, wherein the photosensitive area 2121 of the photosensitive element 212 corresponds to the filter element 221.

Further, before the step (a), the method further comprises the steps of: at least one set of electronic components 214 is mounted on the outer side portion 21123 of the circuit board 211 in the edge region 2112.

Referring to fig. 12, according to another aspect of the present invention, there is further provided an electronic device 600, wherein the electronic device 600 includes an electronic device body 610 and at least one camera module 1, 1A, wherein each camera module 1, 1A is respectively disposed on the electronic device body 610 for capturing images. It should be noted that the type of the electronic device body 610 is not limited, and for example, the electronic device body 610 may be any electronic device capable of being configured with the camera module, such as a smart phone, a tablet computer, a notebook computer, an electronic book, a personal digital assistant, a camera, etc. It will be appreciated by those skilled in the art that although the electronic device body 610 is illustrated in fig. 12 as being implemented as a smart phone, it is not intended to limit the scope and content of the present invention.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are by way of example only and are not limiting. The objects of the present invention have been fully and effectively achieved. The functional and structural principles of the present invention have been shown and described in the examples and embodiments of the invention may be modified or practiced without departing from the principles described.

Claims

1. A molded photosensitive assembly, comprising:

An imaging assembly, wherein the imaging assembly comprises a circuit board, at least one photosensitive element and at least one group of electronic components, and each photosensitive element is conductively connected with the circuit board;

A molded base comprising at least a first base portion and at least a second base portion, wherein each of the second base portions integrally extends inwardly from a first inner peripheral surface of each of the first base portions along the circuit board, wherein the molded base has at least one stepped peripheral groove to define a light window through each of the stepped peripheral grooves, wherein the molded base encloses a portion of the imaging assembly, and a photosensitive area of each of the photosensitive elements corresponds to each of the light windows of the molded base, respectively; and

The optical filter assembly comprises at least one optical filter element, wherein each optical filter element is correspondingly arranged in each stepped peripheral groove of the molding base, so that each optical filter element corresponds to each optical window of the molding base, each electronic component is attached to the outer side part of the circuit board in the edge area of the circuit board, each first base part is provided with a first top surface, each second base part is provided with a second top surface, and the optical filter element is arranged on the second top surface of the molding base, and the second top surface of the second base part is lower than the top surface of the highest electronic component.

2. A molded photosensitive assembly as defined in claim 1, wherein said first top surface of each said first base portion is higher than said second top surface of said second base portion to form each said stepped peripheral groove of said molded base by each said first base portion and each said second base portion.

3. The molded photosensitive assembly of claim 2, wherein said circuit board comprises a die attach area and an edge area surrounding said die attach area, said photosensitive element comprises a photosensitive area and a non-photosensitive area surrounding said photosensitive area, wherein said first base portion of said molded base covers at least a portion of said edge area of said circuit board, and said second base portion of said molded base covers at least a portion of said non-photosensitive area of said photosensitive element.

4. A molded photosensitive assembly as defined in claim 3, wherein said first base portion covers a circuit board outer portion of said edge region of said circuit board, and said second base portion covers a circuit board connecting portion and a circuit board inner portion of said edge region of said circuit board and a chip outer portion and a chip connecting portion of said non-photosensitive region of said photosensitive element.

5. A molded photosensitive assembly as defined in claim 3, wherein said first base portion of said molded base covers a circuit board outer portion and a circuit board connecting portion of said edge region of said circuit board, and said second base portion covers a circuit board inner portion of said edge region of said circuit board and a chip outer portion and a chip connecting portion of said non-photosensitive region of said photosensitive element.

6. A molded photosensitive assembly as defined in claim 3, wherein said first base portion of said molded base covers a circuit board outer portion, a circuit board connecting portion and a circuit board inner portion of said edge region of said circuit board, and said second base portion covers a chip outer portion, a chip connecting portion and a portion of a chip inner portion of said non-photosensitive region of said photosensitive element.

7. A molded photosensitive assembly as defined in claim 3, wherein said first base portion of said molded base covers a circuit board outer portion, a circuit board connecting portion, and a circuit board inner portion of said edge region of said circuit board and a chip outer portion of said non-photosensitive region of said photosensitive element, and said second base portion covers a chip connecting portion and a portion of a chip inner portion of said non-photosensitive region of said photosensitive element.

8. The molded photosensitive assembly of claim 4, wherein said imaging assembly further comprises at least one set of leads for conductively connecting said photosensitive element and said circuit board through each of said leads, wherein a height of said second base portion is greater than a wire arc height of each of said leads, and wherein each of said leads of said imaging assembly is encased by said second base portion.

9. The molded photosensitive assembly of any of claims 5 to 7, wherein the imaging assembly further comprises at least one set of leads to conductively connect the photosensitive element and the wiring board through each of the leads, wherein the second base portion has a height greater than a wire arc height of each of the leads, and each of the leads of the imaging assembly is encased by the second base portion.

10. The molded photosensitive assembly of claim 9, wherein a height of said first base portion of said molded base is greater than a height of each of said electronic components and each of said electronic components of said imaging assembly is encapsulated by said first base portion.

11. The molded photosensitive assembly of claim 2, wherein the circuit board comprises a die attach area and an edge area surrounding the die attach area, wherein the first and second base portions of the molded base each cover a circuit board outer portion of the edge area of the circuit board.

12. The molded photosensitive assembly of claim 11, wherein the imaging assembly further comprises at least one set of electronic components, and each of the electronic components is mounted to the circuit board outer side of the edge region of the circuit board, wherein the first base portion of the molded base has a height greater than a height of each of the electronic components, and each of the electronic components of the imaging assembly is encapsulated by the first base portion.

13. A molded photosensitive assembly as defined in claim 2, wherein said first top surface of each said first base portion and said second top surface of said second base portion are parallel to each other.

14. A molded photosensitive assembly as defined in claim 13, wherein said first top surface of each of said first base portions of said molded base is parallel to a photosensitive surface of said photosensitive element.

15. A molded photosensitive assembly according to claim 2, wherein said first inner peripheral surface of each said first base portion is inclined at an angle of less than 30 ° relative to a photosensitive surface of said photosensitive element.

16. A molded photosensitive assembly as defined in claim 15, wherein a second inner peripheral surface of each of said second base portions is inclined at an angle of less than 30 ° relative to said photosensitive surface of said photosensitive element.

17. A molded photosensitive assembly according to any of claims 2-7, wherein said filter assembly further comprises at least one adhesive layer, wherein each of said adhesive layers is disposed between each of said filter elements and each of said second base portions, such that each of said filter elements is fixedly disposed to each of said second base portions of said molded base by each of said adhesive layers.

18. A molded photosensitive assembly as defined in claim 17, wherein each of said adhesive layers is formed by curing glue applied to said second top surface of each of said second base portions, and each of said adhesive layers is located between a lower surface of each of said filter elements and said second top surface of each of said second base portions.

19. A molded photosensitive assembly as defined in claim 18, wherein each of said second base portions is further provided with at least one glue slot, wherein each of said glue slots is recessed downwardly from said second top surface of each of said second base portions to form a recess for receiving the glue.

20. A molded photosensitive assembly as defined in claim 17, wherein each of said adhesive layers is formed by curing glue applied to a lower surface of each of said filter elements, and each of said adhesive layers is located between said lower surface of each of said filter elements and said second top surface of each of said second base portions.

21. A molded photosensitive assembly as defined in claim 17, further comprising a mounting gap, wherein said mounting gap is located between said filter element and said first inner peripheral surface of said first base portion.

22. A molded photosensitive assembly as defined in claim 18, wherein each of said adhesive layers has at least one vent, wherein each of said vent extends from an inside of said adhesive layer to an outside of said adhesive layer to communicate a space between said filter element and said photosensitive element with an exterior space of said molded photosensitive assembly.

23. A molded photosensitive assembly according to any of claims 2-7, wherein said filter assembly further comprises at least one adhesive layer and at least one annular support member, wherein each of said adhesive layers is positioned between an upper surface of each of said filter elements and each of said support members to fixedly attach each of said filter elements to each of said support members via each of said adhesive layers, wherein each of said support members is correspondingly positioned within said first base portion of said molded base such that each of said filter elements is positioned within each of said stepped peripheral grooves of said molded base.

24. A molded photosensitive assembly as defined in claim 23, wherein each of said support members of said filter assembly is mounted to said first top surface of each of said first base portions such that said upper surface of each of said filter elements is lower than said first top surface of each of said first base portions.

25. The molded photosensitive assembly of any of claims 2-7, wherein the circuit board is further provided with at least one die attach slot, wherein each die attach slot is located in a die attach area of the circuit board and each die attach slot is recessed downwardly from an upper side of the circuit board to form a recess for attaching the photosensitive element.

26. The molded photosensitive assembly of claim 25, wherein each of said die attach slots extends downwardly from said upper side of said circuit board to a lower side of said circuit board to form a through hole in said die attach area of said circuit board, wherein each of said photosensitive elements is fixedly disposed within each of said die attach slots.

27. A camera module, its characterized in that includes:

a molded photosensitive assembly according to any of claims 1 to 26; and

28. An electronic device, comprising:

an electronic device body; and

The camera module of claim 27, wherein each camera module is disposed on the electronic device body for capturing images.

29. A method of manufacturing a molded photosensitive assembly, comprising the steps of:

forming a molded base having a stepped peripheral groove for covering a portion of the circuit board and a portion of the photosensitive element by a molding process to form a light window through the stepped peripheral groove, wherein a photosensitive area of the photosensitive element corresponds to the light window of the molded base to make a molded photosensitive assembly semi-finished product having an integrated structure, wherein the molded base includes at least a first base portion and at least a second base portion, wherein each of the second base portions integrally extends inward along the circuit board from a first inner peripheral surface of each of the first base portions; and

And correspondingly arranging a light filtering element of a light filtering component in the stepped peripheral groove of the molding base of the molding photosensitive component semi-finished product to assemble a molding photosensitive component, wherein the photosensitive area of the photosensitive element corresponds to the light filtering element, each electronic component is attached to the edge area of the circuit board, each first base part is provided with a first top surface, each second base part is provided with a second top surface, wherein the light filtering element is arranged on the second top surface of the molding base, and the second top surface of the second base part is lower than the top surface of the highest electronic component.

30. The method of claim 29, wherein the step of attaching a photosensitive element and at least one set of electronic components to a circuit board and conducting the photosensitive element and the circuit board to assemble an imaging assembly comprises the steps of:

31. The method of claim 29, wherein the step of attaching a photosensitive element and at least one set of electronic components to a circuit board and conducting the photosensitive element and the circuit board to assemble an imaging assembly comprises the steps of:

Attaching the photosensitive element to a chip attaching area of the circuit board; attaching each electronic component to the outer side of a circuit board in an edge area of the circuit board; and

32. The method of manufacturing a molded photosensitive assembly according to claim 30 or 31, wherein the step of forming a molded base having a stepped peripheral groove for covering a portion of the wiring board and a portion of the photosensitive element by a molding process to form an optical window through the stepped peripheral groove, wherein a photosensitive area of the photosensitive element corresponds to the optical window of the molded base to form a molded photosensitive assembly semi-finished product having an integral structure, comprises the steps of:

Placing the imaging assembly in a forming mold; performing die closing operation on an upper die and a lower die of the forming die, and forming a forming space of the forming die between the upper die and the lower die;

33. The method of manufacturing a molded photosensitive assembly according to claim 32, wherein said step of closing an upper mold and a lower mold of the molding die to form a molding space of the molding die between the upper mold and the lower mold comprises the steps of:

Setting a covering film on a pressing surface of the upper die; pressing the photosensitive element of the imaging component by the covering film so that the covering film is positioned between the pressing surface and the photosensitive element;

forming a first molding space of the molding space between a first inner surface of the upper mold and at least a part of the edge area of the circuit board; and

34. The method of claim 33, wherein the step of adding a molding material to the molding space of the molding die to form the molded base having the stepped peripheral groove after the molding material is cured, comprises the steps of:

35. The method of claim 34, wherein the step of correspondingly disposing a filter element of a filter element in the stepped peripheral groove of the molded base of the molded photosensitive assembly blank to assemble a molded photosensitive assembly, wherein the photosensitive area of the photosensitive element corresponds to the filter element, comprises the steps of:

applying a glue to the second top surface of the second base portion of the molded base;

36. The method of claim 34, wherein the step of correspondingly disposing a filter element of a filter element in the stepped peripheral groove of the molded base of the molded photosensitive assembly blank to assemble a molded photosensitive assembly, wherein the photosensitive area of the photosensitive element corresponds to the filter element, comprises the steps of:

Applying glue on the lower surface of the optical filter element; correspondingly arranging the filter element on a second top surface of the second base part; and

37. The method of claim 34, wherein the step of correspondingly disposing a filter element of a filter element in the stepped peripheral groove of the molded base of the molded photosensitive assembly blank to assemble a molded photosensitive assembly, wherein the photosensitive area of the photosensitive element corresponds to the filter element, comprises the steps of:

Applying a glue to an annular support member of the filter assembly;

38. A method of manufacturing an imaging module, comprising the steps of:

A method of manufacturing a molded photosensitive component according to any of claims 29 to 37, manufacturing a molded photosensitive component; and