CN110854300B - Display device, display panel and manufacturing method thereof - Google Patents

Abstract

The present disclosure relates to the field of display technology, and relates to a display panel, a method for manufacturing a display panel, and a display device. The display panel includes: a substrate, a display layer, and an encapsulation layer. The display layer is arranged on one side of the substrate, and the encapsulation layer is arranged on a side of the display layer away from the substrate. The encapsulation layer is a metal material, and a hydrophobic micro-nano structure is formed on the surface of the metal layer. The display panel provided by the present disclosure has an encapsulation layer with super-hydrophobicity, which can effectively prevent water vapor from penetrating into the interior of the display panel, thereby improving the encapsulation effect of the display panel and extending the life of the display panel.

Description

Display device, display panel and manufacturing method thereof

Technical Field

The present disclosure relates to the field of display technology, and in particular, to a display panel, a method for manufacturing a display panel, and a display device.

Background Art

Organic Light-Emitting Diode (OLED) display devices have been listed as the next generation display technology with great development prospects due to their advantages such as thinness, lightness, wide viewing angle, active light emission, continuously adjustable light emission color, low cost, fast response speed, low energy consumption, low driving voltage, wide operating temperature range, simple production process, high light emission efficiency and flexible display.

OLED devices are very sensitive to external factors such as water vapor and oxygen. For example, once an oxidation reaction occurs, the stability of the OLED device will deteriorate and its life will be greatly reduced. Therefore, using an effective packaging structure to prevent the intrusion of water vapor and oxygen can extend the service life of the OLED device.

It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field.

Summary of the invention

The purpose of the present disclosure is to provide a display panel, a method for manufacturing a display panel and a display device, which can effectively prevent water vapor from penetrating into the interior of the display panel, thereby improving the packaging effect of the display panel and extending the life of the display panel.

According to one aspect of the present disclosure, there is provided a display panel, the display panel comprising:

substrate;

A display layer, disposed on one side of the substrate;

The encapsulation layer is arranged on a side of the display layer away from the substrate. The encapsulation layer is made of a metal material, and a hydrophobic micro-nano structure is formed on the surface of the metal layer.

In an exemplary embodiment of the present disclosure, the micro-nano structure includes a plurality of micro-nano pillars extending from the surface of the encapsulation layer.

In an exemplary embodiment of the present disclosure, the diameter of the micro-nano column is 10 nm to 1000 nm.

In an exemplary embodiment of the present disclosure, the height of the micro-nano column is 10 nm to 1000 nm.

In an exemplary embodiment of the present disclosure, the center distance between two adjacent micro-nano pillars is 10 nm to 500 nm.

In an exemplary embodiment of the present disclosure, the wetting angle between the micro-nano structure and water vapor is 110° to 160°.

In an exemplary embodiment of the present disclosure, the encapsulation layer has a thickness of 150 nm to 1000 nm.

In an exemplary embodiment of the present disclosure, the material of the encapsulation layer includes at least one of aluminum, neodymium, copper and silver.

According to another aspect of the present disclosure, a method for manufacturing a display panel is provided, the method comprising:

providing a substrate;

forming a display layer on one side of the substrate;

forming an encapsulation layer on a side of the display layer away from the substrate, wherein the encapsulation layer is made of a metal material;

A hydrophobic micro-nano structure is formed on the surface of the encapsulation layer.

According to yet another aspect of the present disclosure, a display device is provided, comprising the above-mentioned display panel.

The display panel provided by the present disclosure has an encapsulation layer formed of a metal material, and a hydrophobic micro-nano structure is formed on the surface of the metal material. The encapsulation layer with the micro-nano structure on the surface not only plays a role of encapsulation, but also can effectively prevent water vapor from penetrating into the interior of the display device, thereby improving the device packaging effect and extending the device life.

It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the specification are used to explain the principles of the present disclosure. Obviously, the accompanying drawings described below are only some embodiments of the present disclosure, and for ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without creative work.

FIG1 is a cross-sectional schematic diagram of a display panel provided by an embodiment of the present disclosure;

FIG. 2 is a flow chart of a method for manufacturing a display panel provided in an embodiment of the present disclosure.

DETAILED DESCRIPTION

Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as being limited to the examples set forth herein; on the contrary, these embodiments are provided so that the present disclosure will be more comprehensive and complete, and the concepts of the example embodiments are fully conveyed to those skilled in the art. The described features, structures, or characteristics may be combined in one or more embodiments in any suitable manner. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure may be practiced while omitting one or more of the specific details, or other methods, steps, etc. may be adopted. In other cases, known technical solutions are not shown or described in detail to avoid obscuring various aspects of the present disclosure.

The terms "a", "an", "the" and "said" are used to indicate the presence of one or more elements/components/etc.; the terms "including" and "having" are used to express an open-ended inclusive meaning and mean that additional elements/components/etc. may exist in addition to the listed elements/components/etc.; the terms "first", "second", etc. are used merely as labels and are not intended to limit the quantity of their objects.

In this example implementation, a display panel is first provided, as shown in FIG1 , the display panel includes: a substrate 10, a display layer 30 and an encapsulation layer 60, the display layer 30 is arranged on one side of the substrate 10, the encapsulation layer 60 is arranged on the side of the display layer 30 away from the substrate 10, the encapsulation layer 60 is a metal material, and a hydrophobic micro-nano structure is formed on the surface of the metal layer, and the hydrophobic micro-nano structure can be an uneven surface with hydrophobic properties on the encapsulation layer 60.

The display panel provided by the present disclosure has an encapsulation layer formed of a metal material, and a hydrophobic micro-nano structure is formed on the surface of the metal material. The encapsulation layer with the micro-nano structure on the surface not only plays a role of encapsulation, but also can effectively prevent water vapor from penetrating into the interior of the display device, thereby improving the device packaging effect and extending the device life.

Specifically, by forming an uneven micro-nano structure with super-hydrophobic properties on the surface of the encapsulation layer 60, an extremely thin air layer at the nanometer level is formed on the surface of the encapsulation layer 60. When external moisture contacts the encapsulation layer 60, the air layer is separated, so the direct contact between the moisture and the encapsulation layer 60 can be reduced, thereby improving the water-oxygen barrier capacity of the encapsulation layer.

As shown in Fig. 1, the micro-nano structure includes a plurality of micro-nano pillars extending from the surface of the encapsulation layer 60. The diameter of the micro-nano pillars is 10nm to 1000nm, such as 10nm, 100nm, 200nm, 500nm, 700nm, 1000nm, etc., which are not listed here; the height of the micro-nano pillars is 10nm to 1000nm, such as 10nm, 100nm, 200nm, 500nm, 700nm, 1000nm, etc., which are not listed here; the center distance between two adjacent micro-nano pillars is 10nm to 500nm, such as 10nm, 100nm, 200nm, 300nm, 400nm, 500nm, etc., which are not listed here. Of course, the diameter of the micro-nano column may be less than 10nm or greater than 1000nm, the height of the micro-nano column may be less than 10nm or greater than 1000nm, and the center distance between two adjacent micro-nano columns may be less than 10nm or greater than 500nm. The present disclosure does not impose any restrictions on this.

In addition, the micro-nano structure may include a plurality of triangular, hemispherical, trapezoidal or other irregular nanoscale micro-nano structures extending from the surface of the encapsulation layer 60, and the present disclosure does not limit this, and all changes in the micro-nano structure fall within the protection scope of the present disclosure.

Specifically, the thickness of the encapsulation layer 60 is 150 nm to 1000 nm to ensure the formation of the micro-nano structure. The thickness of the encapsulation layer 60 can be, for example, 150 nm, 200 nm, 400 nm, 500 nm, 700 nm, 1000 nm, etc., which are not listed here one by one. Of course, the thickness of the encapsulation layer 60 can also be less than 150 nm or greater than 500 nm, which is not limited in the present disclosure.

Specifically, the wetting angle between the micro-nano structure and the water vapor is 110° to 160° to ensure that the micro-nano structure on the surface of the encapsulation layer 60 has good hydrophobicity. The wetting angle between the micro-nano structure and the water vapor can be, for example, 110°, 120°, 130°, 140°, 150°, 160°, etc., which are not listed here. Of course, the wetting angle between the micro-nano structure and the water vapor can also be less than 110° or greater than 160°, and the present disclosure does not limit this.

The material of the encapsulation layer 60 includes at least one of aluminum, neodymium, copper, and silver. The above metal materials are selected to form the encapsulation layer 60, so as to facilitate the formation of micro-nano structures on the surface of the encapsulation layer 60. Of course, other metal materials, such as zinc, may also be used, and the present disclosure does not limit this.

Specifically, the substrate 10 may be a substrate of an inorganic material or a substrate of an organic material. For example, in one embodiment of the present disclosure, the material of the substrate 10 may be a glass material such as soda-lime glass, quartz glass, sapphire glass, or may be a metal material such as stainless steel, aluminum, nickel, etc. In another embodiment of the present disclosure, the material of the substrate 10 may be polymethyl methacrylate (PMMA), polyvinyl alcohol (PVA), polyvinyl phenol (PVP), polyethersulfone (PES), polyimide, polyamide, polyacetal, polycarbonate (PC), polyethylene terephthalate (PET), polyethylene naphthalate (PEN) or a combination thereof. In another embodiment of the present disclosure, the substrate 10 may also be a flexible substrate, for example, the material of the substrate may be polyimide (PI).

Specifically, the display layer 30 is used to realize pattern display. In the display layer 30, the display unit can be an organic light emitting diode (OLED), a liquid crystal display unit, a light emitting diode (LED) or other feasible display units. It is understandable that the display unit can realize autonomous light emission, such as an organic light emitting diode or a light emitting diode, or can realize light emission control with the help of a backlight source, such as a liquid crystal display unit can control whether the light of the backlight source passes through the light emitting area to realize display.

Further, the display layer 30 may further include a driving layer 20 for driving each light-emitting unit 40. The driving layer 20 may include a thin film transistor and a capacitor, wherein the thin film transistor may be an LTPS-TFT (low temperature polycrystalline silicon-thin film transistor) or an oxide-TFT (oxide-thin film transistor), for example, an IGZO-TFT (indium gallium zinc oxygen-thin film transistor), which is not limited in the present disclosure. The thin film transistor may be a top gate type or a bottom gate type, which is not limited in the present disclosure.

Specifically, a common electrode layer 50 is provided on the side of the display layer 30 away from the substrate 10, and the common electrode layer 50 may be a common cathode or a common anode. The material of the common electrode layer 50 may be a metal material. For example, the metal may be platinum, gold, silver, aluminum, chromium, barium, sodium, palladium, iron, manganese or a combination thereof. In other words, the encapsulation layer 60 and the common electrode layer 50 may be made of the same metal material, and a metal layer may be formed as the common electrode layer 50 and the encapsulation layer 60 through a deposition process, and a micro-nano structure may be directly formed on the surface of the metal layer so that the upper region of the metal layer serves as the encapsulation layer 60.

In addition, the display panel may further include a passivation layer and a protective film layer disposed on a side of the encapsulation layer 60 away from the substrate 10 , which is not limited in the present disclosure.

The following are embodiments of the method disclosed herein, which can be used to implement the device embodiments disclosed herein. For details not disclosed in the method embodiments disclosed herein, please refer to the device embodiments disclosed herein.

The embodiment of the present disclosure further provides a method for manufacturing a display panel, as shown in FIG2 , comprising:

Step S100, providing a substrate;

Step S200, forming a display layer on one side of the substrate;

Step S300, forming an encapsulation layer on a side of the display layer away from the substrate, wherein the encapsulation layer is made of a metal material;

Step S400: forming a hydrophobic micro-nano structure on the surface of the encapsulation layer.

The display panel provided by the present disclosure has an encapsulation layer formed of a metal material, and a hydrophobic micro-nano structure is formed on the surface of the metal material. The encapsulation layer with the micro-nano structure on the surface not only plays a role of encapsulation, but also can effectively prevent water vapor from penetrating into the interior of the display device, thereby improving the device packaging effect and extending the device life.

Next, each step of the method for manufacturing the display panel in this exemplary embodiment will be further described.

In step S100 , a substrate is provided.

Specifically, as shown in FIG1 , the substrate 10 can be formed by deposition or other processes, and the material of the substrate 10 can be an inorganic material or an organic material. For example, the inorganic material can be a glass material such as soda-lime glass, quartz glass, sapphire glass, or a metal material such as stainless steel, aluminum, nickel, or various metals or alloys thereof; the organic material can be polymethyl methacrylate, polyvinyl alcohol, polyvinyl phenol, polyether sulfone, polyimide, polyamide, or a combination thereof. The substrate 10 can be a flexible substrate.

In step S200 , a display layer is formed on one side of a substrate.

Specifically, a buffer layer can be formed on one side of the substrate 10 by deposition, spraying or other processes, and the material of the buffer layer can be silicon oxide, silicon oxynitride, silicon nitride or a combination of the above materials; then a driving layer 20 is formed on the buffer layer, and the driving layer 20 includes a plurality of thin film transistors. Of course, the driving layer 20 can also be formed directly on the substrate 10. The driving layer 20 specifically includes an active layer formed on the side of the buffer layer away from the substrate 10 by physical vapor deposition, chemical vapor deposition, spin coating or a combination thereof, and the active layer partially covers the buffer layer; a gate insulating layer covering the buffer layer and the active layer is formed on the side of the buffer layer away from the substrate 10 by physical vapor deposition, chemical vapor deposition, spin coating or a combination thereof, and a gate layer is formed on the side of the gate insulating layer away from the substrate 10 by deposition and other processes; then, an interlayer dielectric layer covering the gate insulating layer and the gate layer is formed on the side of the gate insulating layer away from the substrate 10 by deposition and other processes; then, source and drain vias are formed on the interlayer dielectric layer and the gate insulating layer by exposure display, etching and other processes, and the source via and the drain via are respectively located on both sides of the gate layer and are connected to the active layer; then, a source and a drain are formed in the source via and the drain via by deposition and other processes, thereby forming a thin film transistor.

Then, a flat layer is formed on the side of the interlayer dielectric layer away from the substrate 10 by deposition and other processes; then, a via hole exposing the drain is formed on the flat layer by etching and other processes, and then a first electrode layer is formed on the side of the flat layer away from the substrate 10 by deposition and other processes, the first electrode layer includes a plurality of first electrodes, and each first electrode is connected to each drain electrode one by one through the via hole; then, a pixel defining layer is formed on the side of the flat layer away from the substrate 10 by deposition and other processes, and a plurality of through holes are formed on the pixel defining layer by etching and other processes, and each through hole exposes each first electrode layer; then, a light-emitting unit 40 is formed on the pixel defining layer, and the light-emitting unit 40 may include a hole injection layer, a hole transport layer, a light-emitting material layer, an electron transport layer and an electron injection layer; then, a second electrode layer is formed on the side of the light-emitting unit 40 away from the substrate 10 by deposition and other processes, and the second electrode layer is a common electrode layer 50, wherein the first electrode layer may be an anode layer, and the second electrode layer may be a transparent common cathode layer.

In step S300, a packaging layer is formed on a side of the display layer away from the substrate, and the packaging layer is made of metal material.

Specifically, a metal material is used to form an encapsulation layer 60 on the side of the display layer 30 away from the substrate 10 by physical vapor deposition, chemical vapor deposition, spin coating or a combination thereof, and then a nano-microstructure is formed on the metal surface of the encapsulation layer 60 by laser etching technology, and a raster scanning focused femtosecond laser pulse is used to irradiate the metal surface to form a plurality of hydrophobic micro-nano columns extending from the surface. In addition, a deposition method such as physical vapor deposition and chemical vapor deposition can also be used. This method mainly utilizes the physical and chemical processes occurring in the gas phase to form a hydrophobic metal layer on the surface, which can be used to manufacture a micro-nanostructure coating, as well as bionic templates, ion etching and other technologies. Those skilled in the art can also use other methods to form a micro-nanostructure on the surface of the encapsulation layer, such as anodization, which is not limited by the present disclosure.

In addition, the common electrode layer 50 may be a common cathode or a common anode. The material of the common electrode layer 50 may be a metal material. For example, the metal may be platinum, gold, silver, aluminum, chromium, barium, sodium, palladium, iron, manganese or a combination thereof. In other words, the encapsulation layer 60 and the common electrode layer 50 may be made of the same metal material, and a metal layer may be formed as the common electrode layer 50 and the encapsulation layer 60 through a single deposition process. A micro-nano structure may be directly formed on the surface of the metal layer so that the upper region of the metal layer serves as the encapsulation layer 60, thereby reducing the process steps of the manufacturing process of the display panel, improving the manufacturing efficiency of the display panel, and reducing the manufacturing cost.

Among them, by forming an uneven micro-nano structure with super hydrophobic properties on the surface of the encapsulation layer 60, an extremely thin air layer at the nanometer level is formed on the surface of the encapsulation layer 60. When external moisture contacts the encapsulation layer 60, the air layer is separated, so the direct contact between the moisture and the encapsulation layer 60 can be reduced, thereby improving the water-oxygen barrier capacity of the encapsulation layer.

Among them, the diameter of the micro-nano column is 10nm to 1000nm, such as 10nm, 100nm, 200nm, 500nm, 700nm, 1000nm, etc., which are not listed here one by one; the height of the micro-nano column is 10nm to 1000nm, such as 10nm, 100nm, 200nm, 500nm, 700nm, 1000nm, etc., which are not listed here one by one; the center distance between two adjacent micro-nano columns is 10nm to 500nm, such as 10nm, 100nm, 200nm, 300nm, 400nm, 500nm, etc., which are not listed here one by one. Of course, the diameter of the micro-nano column can also be less than 10nm or greater than 1000nm, the height of the micro-nano column can also be less than 10nm or greater than 1000nm, and the center distance between two adjacent micro-nano columns can also be less than 10nm or greater than 500nm, and the present disclosure does not limit this.

In addition, the micro-nano structure may include a plurality of triangular, hemispherical, trapezoidal or other irregular nanoscale micro-nano structures extending from the surface of the packaging layer 60, and the present disclosure does not limit this, and all changes in the micro-nano structure fall within the protection scope of the present disclosure.

The thickness of the encapsulation layer 60 is 150 nm to 1000 nm to ensure the formation of the micro-nano structure. The thickness of the encapsulation layer 60 can be, for example, 150 nm, 200 nm, 400 nm, 500 nm, 700 nm, 1000 nm, etc., which are not listed here. Of course, the thickness of the encapsulation layer 60 can also be less than 150 nm or greater than 500 nm, which is not limited in the present disclosure.

The wetting angle between the micro-nano structure and the water vapor is 110° to 160°, so as to ensure that the micro-nano structure on the surface of the encapsulation layer 60 has good hydrophobicity. The wetting angle between the micro-nano structure and the water vapor can be, for example, 110°, 120°, 130°, 140°, 150°, 160°, etc., which are not listed here. Of course, the wetting angle between the micro-nano structure and the water vapor can also be less than 110° or greater than 160°, and the present disclosure does not limit this.

The material of the encapsulation layer 60 includes at least one of aluminum, neodymium, copper, and silver. The above metal materials are selected to form the encapsulation layer 60, so as to form a micro-nano structure on the surface of the encapsulation layer 60. Of course, other metal materials, such as zinc, can also be used, and the present disclosure does not limit this.

In addition, the manufacturing method of the display panel also includes forming a stacked passivation layer and a protective film layer on the side of the encapsulation layer 60 away from the substrate 10. Those skilled in the art may also set more other layers, such as a cover plate, which is not limited in the present disclosure.

It should be noted that although the steps of the method in the present disclosure are described in a specific order in the drawings, this does not require or imply that the steps must be performed in this specific order, or that all the steps shown must be performed to achieve the desired results. Additionally or alternatively, some steps may be omitted, multiple steps may be combined into one step, and/or one step may be decomposed into multiple steps, etc.

The embodiment of the present disclosure also provides a display device, which includes the display panel of the above embodiment. The display device can be a mobile phone, a tablet computer, a television or other terminal device with a display panel, and its beneficial effects can refer to the beneficial effects of the above display panel, which will not be described in detail here.

Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any modification, use or adaptation of the present disclosure, which follows the general principles of the present disclosure and includes common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present disclosure are indicated by the appended claims.

Claims (4)

1. A display panel, comprising: substrate; A display layer, disposed on one side of the substrate, the display layer comprising a driving layer and a light-emitting unit, the driving layer being used to drive the light-emitting unit; A common electrode layer, disposed on a side of the display layer away from the substrate; An encapsulation layer is provided on a surface of the common electrode layer away from the substrate, the encapsulation layer is made of a metal material and is the same material as the common electrode layer, and a metal layer is formed as the common electrode layer and the encapsulation layer by a single deposition process; a hydrophobic micro-nano structure is formed on the surface of the encapsulation layer; and the thickness of the encapsulation layer is 150nm to 1000nm; A passivation layer, disposed on a side of the encapsulation layer away from the substrate; A protective film layer, disposed on a side of the passivation layer away from the substrate; Wherein, the micro-nano structure comprises a plurality of micro-nano pillars extending from the surface of the encapsulation layer, and two adjacent micro-nano pillars are arranged at intervals; the micro-nano pillars and the encapsulation layer are an integrated structure; The diameter of the micro-nano column is 10 nm or 700 nm to 1000 nm, the height of the micro-nano column is 10 nm or 700 nm to 1000 nm, the center distance between two adjacent micro-nano columns is 10 nm, and the wetting angle between the micro-nano structure and water vapor is 110° to 140°. 2 . The display panel according to claim 1 , wherein the material of the encapsulation layer comprises at least one of aluminum, neodymium, copper and silver. 3. A method for manufacturing a display panel, comprising: providing a substrate; forming a display layer on one side of the substrate, the display layer comprising a driving layer and a light-emitting unit, the driving layer being used to drive the light-emitting unit; forming a common electrode layer on a side of the display layer away from the substrate; An encapsulation layer is formed on a surface of the common electrode layer on one side away from the substrate, wherein the encapsulation layer is made of a metal material and is the same material as the common electrode layer, and the metal layer is formed as the common electrode layer and the encapsulation layer through a single deposition process; the thickness of the encapsulation layer is 150 nm to 1000 nm; A hydrophobic micro-nano structure is formed on the surface of the encapsulation layer; the micro-nano structure includes a plurality of micro-nano columns extending from the surface of the encapsulation layer, and two adjacent micro-nano columns are arranged at intervals; the micro-nano columns and the encapsulation layer are an integral structure; wherein the diameter of the micro-nano column is 10nm or 700nm-1000nm, the height of the micro-nano column is 10nm or 700nm-1000nm, the center distance between two adjacent micro-nano columns is 10nm, and the wetting angle between the micro-nano structure and water vapor is 110°-140°; forming a passivation layer on a side of the encapsulation layer away from the substrate; A protection film layer is formed on a side of the passivation layer away from the substrate. 4. A display device, characterized by comprising the display panel according to claim 1 or 2.