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CN110850819A - Single-arm combined equipment scheduling method, system, mobile terminal and storage medium - Google Patents

Single-arm combined equipment scheduling method, system, mobile terminal and storage medium Download PDF

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CN110850819A
CN110850819A CN201911018270.4A CN201911018270A CN110850819A CN 110850819 A CN110850819 A CN 110850819A CN 201911018270 A CN201911018270 A CN 201911018270A CN 110850819 A CN110850819 A CN 110850819A
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wafer
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潘春荣
卢艳君
乔岩
胡国林
王际鹏
熊文清
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Buddhist Tzu Chi Medical Foundation
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    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
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Abstract

本发明适用于半导体制造自动化设备技术领域,提供了一种单臂组合设备调度方法、系统、移动终端及存储介质,该方法包括:分析多品种晶圆同时加工时单臂组合设备的可调度性,并根据可调度性提出死锁避免规则;根据死锁避免规则建立Petri网模型;获取本地加工策略,并将加工策略在Petri网模型中进行计算,以得到多品种晶圆同时加工时单臂组合设备的最优调度算法;根据所述最优调度算法控制单臂组合设备进行加工调度。本发明可以避免因多品种晶圆同时加工带来的系统死锁问题,降低晶圆质量和损害SACT设备,单臂组合设备调度方法中的调度算法计算复杂度为O(n2),可以高效地应对多品种晶圆同时加工的调度问题,减少了因系统调试浪费的生产时间。

Figure 201911018270

The invention is applicable to the technical field of semiconductor manufacturing automation equipment, and provides a scheduling method, system, mobile terminal and storage medium for a single-arm combined equipment. The method includes: analyzing the schedulability of the single-arm combined equipment when multiple varieties of wafers are processed simultaneously , and propose deadlock avoidance rules according to the schedulability; establish a Petri net model according to the deadlock avoidance rules; obtain the local processing strategy, and calculate the processing strategy in the Petri net model, so as to obtain a single arm when processing multiple varieties of wafers at the same time. The optimal scheduling algorithm of the combined equipment; the single-arm combined equipment is controlled to perform processing scheduling according to the optimal scheduling algorithm. The invention can avoid the system deadlock problem caused by the simultaneous processing of multi - variety wafers, reduce the wafer quality and damage the SACT equipment. It can effectively deal with the scheduling problem of simultaneous processing of multi-variety wafers, and reduce the production time wasted due to system debugging.

Figure 201911018270

Description

单臂组合设备调度方法、系统、移动终端及存储介质Single-arm combined equipment scheduling method, system, mobile terminal and storage medium

技术领域technical field

本发明涉及半导体制造自动化设备技术领域,尤其涉及一种单臂组合设备调度方法、系统、移动终端及存储介质。The present invention relates to the technical field of semiconductor manufacturing automation equipment, and in particular, to a scheduling method, system, mobile terminal and storage medium for single-arm combined equipment.

背景技术Background technique

近年来,由于市场需求扩大、投资环境的日益改善以及全球半导体产业向中国转移等原因,我国集成电路产业发展保持持续增长,进一步刺激了单晶硅、多晶硅等基础材料需求量的增长。组合设备作为制造硅晶圆最关键的一类设备,其高度自动化制造系统可以有效地应对市场需求。但是,晶圆片包含多层电路、加工环境高温高压,调度与控制该制造系统投入生产并不易。研究组合设备在不同运行环境下的调度与控制要求,成为该领域关注的焦点。In recent years, due to the expansion of market demand, the improvement of the investment environment, and the transfer of the global semiconductor industry to China, the development of my country's integrated circuit industry has maintained continuous growth, which has further stimulated the growth of demand for basic materials such as monocrystalline silicon and polycrystalline silicon. Combination equipment is the most critical type of equipment for manufacturing silicon wafers, and its highly automated manufacturing system can effectively respond to market demands. However, the wafer contains multiple layers of circuits, and the processing environment is high temperature and high pressure. It is not easy to schedule and control the manufacturing system to be put into production. Studying the scheduling and control requirements of combined equipment in different operating environments has become the focus of attention in this field.

组合设备通常包含4-6个制造单元(manufacturing unit,MU),装载待加工晶圆和成品晶圆的真空锁(loadlock,LL)和运输单元(transport unit,TU),对应的组合设备分别称为单臂组合设备(single-arm cluster tools,SATCs)和双臂组合设备(dual-armcluster tools,DACLs)。TU位于设备的中心位置,其它MU呈径向分布并由计算机统一控制。该设备拥有独特的单晶圆制造技术,即同一时刻,任意MU至多只能加工单片晶圆。通常,组合设备中设置两个LL,每个LL可以装载25片相同类型的晶圆。待加工的晶圆需通过机械手从LL卸载并将其载入系统;然后,根据晶圆加工工艺依次访问不同的MU;最后,机械手将成品晶圆再次载入LL。The combined equipment usually contains 4-6 manufacturing units (MU), vacuum locks (loadlock, LL) and transport unit (TU) for loading the wafers to be processed and finished wafers, and the corresponding combined equipment is called For single-arm combination equipment (single-arm cluster tools, SATCs) and dual-arm combination equipment (dual-arm cluster tools, DACLs). The TU is located in the center of the equipment, and the other MUs are radially distributed and controlled by the computer. The equipment has a unique single-wafer manufacturing technology, that is, at the same time, any MU can only process a single wafer at most. Typically, two LLs are set up in a combined facility, and each LL can hold 25 wafers of the same type. The wafer to be processed needs to be unloaded from the LL by the robot and loaded into the system; then, different MUs are accessed in sequence according to the wafer processing process; finally, the robot will load the finished wafer into the LL again.

随着晶圆制造由大批量少品种向客户定制化转变,导致系统频换切换和调试,寻找新的调度方法必然浪费大量的时间成本。为了提高设备的利用率和灵活性,组合设备更多的应用于同时加工多品种晶圆,不同品种晶圆的工艺路径存在MU共享情形。但是,现有的调度和控制方法仅适用于单品种或特定的晶圆品种。另外,组合设备无缓冲区,有限的MU带来资源竞争问题,易造成系统死锁。As wafer manufacturing shifts from high-volume and low-variety to customer-customized, it leads to frequent system switching and debugging, and finding new scheduling methods will inevitably waste a lot of time and cost. In order to improve the utilization and flexibility of the equipment, the combined equipment is more used to process multiple types of wafers at the same time, and the process paths of different types of wafers have MU sharing. However, existing scheduling and control methods are only applicable to a single variety or a specific wafer variety. In addition, the combined device has no buffer, and the limited MU brings the problem of resource competition, which is easy to cause system deadlock.

发明内容SUMMARY OF THE INVENTION

本发明实施例要解决的技术问题是,现有的单臂组合设备调度过程中,由于其调度方法仅适用于单品种或特定的晶圆品种,因此导致系统锁死率较高的问题。The technical problem to be solved by the embodiments of the present invention is that in the scheduling process of the existing single-arm combined equipment, since the scheduling method is only applicable to a single variety or a specific wafer variety, the problem of a high system lock rate is caused.

本发明实施例是这样实现的,一种单臂组合设备调度方法,所述方法包括:The embodiments of the present invention are implemented in this way, a method for scheduling a single-arm combined equipment, the method comprising:

分析多品种晶圆同时加工时单臂组合设备的可调度性,并根据所述可调度性提出死锁避免规则;Analyze the schedulability of single-arm combined equipment when multiple varieties of wafers are processed simultaneously, and propose deadlock avoidance rules according to the schedulability;

根据所述死锁避免规则建立Petri网模型;Establish a Petri net model according to the deadlock avoidance rule;

获取本地加工策略,并将所述加工策略在所述Petri网模型中进行计算,以得到多品种晶圆同时加工时所述单臂组合设备的最优调度算法;Obtaining a local processing strategy, and calculating the processing strategy in the Petri net model, so as to obtain the optimal scheduling algorithm of the single-arm combination device when multiple varieties of wafers are processed simultaneously;

根据所述最优调度算法控制所述单臂组合设备进行加工调度Control the single-arm combined equipment to perform processing scheduling according to the optimal scheduling algorithm

更进一步的,所述根据所述可调度性提出死锁避免规则的步骤包括:Further, the step of proposing deadlock avoidance rules according to the schedulability includes:

当所述单臂组合设备中的机械手从制造单元MUi(i∈Nn)卸载晶圆并移动至下一道加工工序Si-next需满足下列条件之一:When the robot in the single-arm combination equipment unloads the wafer from the manufacturing unit MU i (i∈Nn) and moves to the next processing step Si -next , one of the following conditions must be met:

当制造单元MUi(i=0)中待加工的晶圆个数不少于1时,Si-next=MUi-next为空闲状态;When the number of wafers to be processed in the manufacturing unit MU i (i=0) is not less than 1, Si -next =MU i-next is in an idle state;

当制造单元MUi(i∈Nn+)中加工晶圆个数为1时,Si-next=MUi-next为空闲状态;When the number of processed wafers in the manufacturing unit MU i (i∈Nn + ) is 1, Si -next =MU i-next is an idle state;

当制造单元MUi(i∈Nn +)中加工晶圆个数为1时,Si-next=MUn+1When the number of processed wafers in the manufacturing unit MU i (i∈N n + ) is 1, Si -next =MU n+1 .

更进一步的,所述根据所述死锁避免规则建立Petri网模型的步骤包括:Further, the described step of establishing a Petri net model according to the deadlock avoidance rule includes:

获取所述死锁避免规则中存储的所述单臂组合设备同时加工多品种晶圆时系统的运行特点和机械手的动作序列;Obtain the operating characteristics of the system and the action sequence of the manipulator when the single-arm combination device simultaneously processes multiple varieties of wafers stored in the deadlock avoidance rule;

根据所述运行特点和所述机械手的动作序列以建立所述Petri网模型;To establish the Petri net model according to the operating characteristics and the action sequence of the manipulator;

其中,单臂组合设备同时加工多品种晶圆,第i种晶圆的晶圆流

Figure RE-GDA0002327338800000031
Figure RE-GDA0002327338800000032
Figure RE-GDA0002327338800000033
i∈Nζ +
Figure RE-GDA0002327338800000034
xj i∈Nn +,mi≤n。Among them, the single-arm combination equipment processes multiple types of wafers at the same time, and the wafer flow of the i-th type of wafers
Figure RE-GDA0002327338800000031
Figure RE-GDA0002327338800000032
Figure RE-GDA0002327338800000033
i∈N ζ + ,
Figure RE-GDA0002327338800000034
x j i ∈N n + , and m i ≤n.

更进一步的,所述单臂组合设备的库所和变迁间的函数关系如下:Further, the functional relationship between the location and transition of the single-arm combination device is as follows:

·uj (i)={pj (i),wj (i)},

Figure RE-GDA0002327338800000035
u0 (i)·={d01 (i)},
Figure RE-GDA0002327338800000036
u j (i) = {p j (i) , w j (i) },
Figure RE-GDA0002327338800000035
u 0 (i) = {d 01 (i) },
Figure RE-GDA0002327338800000036

·u0(i)={p0 (i),d0 (i)},·uj(i)={pj(i)},

Figure RE-GDA0002327338800000037
u0(i)·={d01 (i)},
Figure RE-GDA0002327338800000038
Figure RE-GDA0002327338800000039
u 0(i) = {p 0 (i) , d 0 (i) } , u j(i) = {p j(i) },
Figure RE-GDA0002327338800000037
u 0(i) = {d 01 (i) },
Figure RE-GDA0002327338800000038
Figure RE-GDA0002327338800000039

·lj (i)={d(j-1)j (i)},

Figure RE-GDA00023273388000000310
lj (i)·={pj (i),r},
Figure RE-GDA00023273388000000311
Figure RE-GDA00023273388000000312
·ln+1={pn+1′},ln+1 ·={pn+1,r};l j (i) = {d (j-1)j (i) },
Figure RE-GDA00023273388000000310
l j (i) = {p j (i) , r},
Figure RE-GDA00023273388000000311
Figure RE-GDA00023273388000000312
· l n+1 = {p n+1 ′}, l n+1 · = {p n+1 , r};

Figure RE-GDA0002327338800000041
lj(i)·={pj(i)},
Figure RE-GDA0002327338800000043
ln+1(i)·={p0 (i),d0 (i),pn+1};
Figure RE-GDA0002327338800000041
l j(i) ={p j(i) },
Figure RE-GDA0002327338800000043
l n+1(i)· ={p 0 (i) , d 0 (i) , p n+1 };

Figure RE-GDA0002327338800000044
vrj (i)·={pj (i),wj (i)},
Figure RE-GDA0002327338800000045
Figure RE-GDA0002327338800000044
v rj (i) = {p j (i) , w j (i) },
Figure RE-GDA0002327338800000045

r表示单臂机械手;r represents a single-arm manipulator;

Figure RE-GDA0002327338800000046
表示晶圆在第j道工序加工时制造单元
Figure RE-GDA0002327338800000047
对应的资源库所,
Figure RE-GDA0002327338800000048
xj i∈Nn +
Figure RE-GDA0002327338800000046
Indicates the manufacturing unit when the wafer is processed in the jth process
Figure RE-GDA0002327338800000047
the corresponding repository,
Figure RE-GDA0002327338800000048
x j i ∈N n + ;

p0 (i)表示单臂组合设备在输入端中放置第i种待加工的晶圆;p 0 (i) means that the single-arm combination device places the i-th wafer to be processed in the input;

pj (i)表示第i种类型晶圆在第j道工序加工,

Figure RE-GDA00023273388000000410
p j (i) indicates that the i-th type of wafer is processed in the j-th process,
Figure RE-GDA00023273388000000410

pj(i)表示第i种类型晶圆在第j道工序加工,

Figure RE-GDA00023273388000000411
p j(i) indicates that the i-th type of wafer is processed in the j-th process,
Figure RE-GDA00023273388000000411

pn+1 (i)表示单臂组合设备输出端中放置的第i种成品晶圆;p n+1 (i) represents the i-th finished wafer placed in the output of the single-arm combination device;

pn+1′表示机械手移动到输出端并准备装载成品晶圆到输出端;p n+1 ' indicates that the robot moves to the output end and is ready to load the finished wafer to the output end;

用于连接

Figure RE-GDA00023273388000000412
与pn+1′,无实意; for connection
Figure RE-GDA00023273388000000412
and p n+1 ′, meaningless;

djk (i)表示机械手将第i种晶圆从第j道工序移动到第k道工序,

Figure RE-GDA00023273388000000413
Figure RE-GDA00023273388000000414
j<k;d jk (i) means that the robot moves the i-th wafer from the j-th process to the k-th process,
Figure RE-GDA00023273388000000413
Figure RE-GDA00023273388000000414
j <k;

wj (i)表示机械从第j道工序卸载第i种晶圆前的等待;w j (i) represents the waiting time before the machine unloads the i-th wafer from the j-th process;

vrj (i)表示空载机械手移动到第j道工序,

Figure RE-GDA00023273388000000415
v rj (i) means that the unloaded manipulator moves to the jth process,
Figure RE-GDA00023273388000000415

uj (i)表示机械手从第j道工序卸载第i种晶圆,

Figure RE-GDA00023273388000000416
u j (i) means that the robot unloads the i-th wafer from the j-th process,
Figure RE-GDA00023273388000000416

uj(i)表示机械手从第j道工序卸载第i种晶圆,

Figure RE-GDA00023273388000000417
u j(i) means that the robot unloads the i-th wafer from the j-th process,
Figure RE-GDA00023273388000000417

lj (i)表示机械手将第i种类型的晶圆装载到第j道工序,

Figure RE-GDA00023273388000000418
l j (i) means that the robot loads the i-th type of wafer to the j-th process,
Figure RE-GDA00023273388000000418

lj(i)表示机械手将第i种类型的晶圆装载到第j道工序,

Figure RE-GDA0002327338800000051
l j(i) means that the robot loads the i-th type of wafer to the j-th process,
Figure RE-GDA0002327338800000051

更进一步的,所述加工策略为所述单臂组合设备中当多个加工模块同时加工晶圆时,所述单臂组合设备上机械手移动到最快加工完成晶圆的目标模块,并将所述目标模块上的晶圆卸载。Further, the processing strategy is that when a plurality of processing modules in the single-arm combined equipment process wafers at the same time, the robot on the single-arm combined equipment moves to the target module that processes the wafers fastest, and processes all the wafers. described wafer unloading on the target module.

本发明实施例的另一目的在于提供一种单臂组合设备调度系统,所述系统包括:Another object of the embodiments of the present invention is to provide a single-arm combined equipment scheduling system, the system includes:

分析模块,用于分析多品种晶圆同时加工时单臂组合设备的可调度性,并根据所述可调度性提出死锁避免规则;The analysis module is used to analyze the schedulability of the single-arm combination equipment when multiple varieties of wafers are processed at the same time, and propose deadlock avoidance rules according to the schedulability;

建模模块,用于根据所述死锁避免规则建立Petri网模型;A modeling module for establishing a Petri net model according to the deadlock avoidance rule;

算法计算模块,用于获取本地加工策略,并将所述加工策略在所述Petri网模型中进行计算,以得到多品种晶圆同时加工时所述单臂组合设备的最优调度算法;an algorithm calculation module for obtaining a local processing strategy, and calculating the processing strategy in the Petri net model to obtain an optimal scheduling algorithm for the single-arm combination device when multiple varieties of wafers are simultaneously processed;

调度控制模块,用于根据所述最优调度算法控制所述单臂组合设备进行加工调度。A scheduling control module, configured to control the single-arm combined equipment to perform processing scheduling according to the optimal scheduling algorithm.

更进一步的,所述分析模块还用于:Further, the analysis module is also used for:

当所述单臂组合设备中的机械手从制造单元MUi(i∈Nn)卸载晶圆并移动至下一道加工工序Si-next需满足下列条件之一:When the robot in the single-arm combination equipment unloads the wafer from the manufacturing unit MU i (i∈N n ) and moves to the next processing step Si -next , one of the following conditions must be met:

当制造单元MUi(i=0)中待加工的晶圆个数不少于1时,Si-next=MUi-next为空闲状态;When the number of wafers to be processed in the manufacturing unit MU i (i=0) is not less than 1, Si -next =MU i-next is in an idle state;

当制造单元MUi(i∈Nn +)中加工晶圆个数为1时,Si-next=MUi-next为空闲状态;When the number of processed wafers in the manufacturing unit MU i (i∈N n + ) is 1, Si -next =MU i-next is in an idle state;

当制造单元MUi(i∈Nn +)中加工晶圆个数为1时,Si-next=MUn+1When the number of processed wafers in the manufacturing unit MU i (i∈N n + ) is 1, Si -next =MU n+1 .

更进一步的,所述建模模块还用于:Further, the modeling module is also used for:

获取所述死锁避免规则中存储的所述单臂组合设备同时加工多品种晶圆时系统的运行特点和机械手的动作序列;Obtain the operating characteristics of the system and the action sequence of the manipulator when the single-arm combination device simultaneously processes multiple varieties of wafers stored in the deadlock avoidance rule;

根据所述运行特点和所述机械手的动作序列以建立所述Petri网模型;To establish the Petri net model according to the operating characteristics and the action sequence of the manipulator;

其中,单臂组合设备同时加工多品种晶圆,第i种晶圆的晶圆流

Figure RE-GDA0002327338800000062
Figure RE-GDA0002327338800000063
i∈Nζ +xj i∈Nn +,mi≤n。Among them, the single-arm combination equipment processes multiple types of wafers at the same time, and the wafer flow of the i-th type of wafers
Figure RE-GDA0002327338800000062
Figure RE-GDA0002327338800000063
i∈N ζ + , x j i ∈N n + , and m i ≤n.

本发明实施例的另一目的在于提供一种移动终端,包括存储设备以及处理器,所述存储设备用于存储计算机程序,所述处理器运行所述计算机程序以使所述移动终端执行上述的单臂组合设备调度方法。Another object of the embodiments of the present invention is to provide a mobile terminal, including a storage device and a processor, where the storage device is used to store a computer program, and the processor runs the computer program to make the mobile terminal execute the above-mentioned Single-arm combined equipment scheduling method.

本发明实施例的另一目的在于提供一种存储介质,其存储有上述的移动终端中所使用的计算机程序,该计算机程序被处理器执行时实现上述的单臂组合设备调度方法的步骤。Another object of the embodiments of the present invention is to provide a storage medium, which stores the above-mentioned computer program used in the mobile terminal, and when the computer program is executed by the processor, implements the steps of the above-mentioned single-arm combination equipment scheduling method.

本发明实施例,可以避免因多品种晶圆同时加工带来的系统死锁问题,降低晶圆质量和损害SACT设备,所述单臂组合设备调度方法中的调度算法计算复杂度为O(n2),可以高效地应对多品种晶圆同时加工的调度问题,减少了因系统调试浪费的生产时间。The embodiment of the present invention can avoid the system deadlock problem caused by the simultaneous processing of multi-variety wafers, reduce the wafer quality and damage the SACT equipment. The scheduling algorithm in the single-arm combined equipment scheduling method has a computational complexity of O(n 2 ), can efficiently deal with the scheduling problem of simultaneous processing of multi-variety wafers, reducing the production time wasted due to system debugging.

附图说明Description of drawings

图1是本发明第一实施例提供的单臂组合设备调度方法的流程图;FIG. 1 is a flowchart of a method for scheduling a single-arm combined equipment provided by a first embodiment of the present invention;

图2是本发明第二实施例提供的单臂组合设备调度方法的流程图;2 is a flowchart of a method for scheduling a single-arm combination device provided by a second embodiment of the present invention;

图3是本发明第二实施例提供的单臂组合设备的结构示意图;3 is a schematic structural diagram of a single-arm assembly device provided by a second embodiment of the present invention;

图4是本发明第二实施例提供的晶圆加工路径示意图;4 is a schematic diagram of a wafer processing path provided by a second embodiment of the present invention;

图5是本发明第二实施例提供的两种类型晶圆同时在SACT加工的Petri网模型示意图;5 is a schematic diagram of a Petri net model of two types of wafers simultaneously processed in SACT according to the second embodiment of the present invention;

图6是本发明第三实施例提供的单臂组合设备调度系统的结构示意图;6 is a schematic structural diagram of a single-arm combined equipment scheduling system provided by a third embodiment of the present invention;

具体实施方式Detailed ways

为了使本发明的目的、技术方案及优点更加清楚明白,以下结合附图及实施例,对本发明进行进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本发明,并不用于限定本发明。In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

为了说明本发明所述的技术方案,下面通过具体实施例来进行说明。In order to illustrate the technical solutions of the present invention, the following specific embodiments are used for description.

实施例一Example 1

请参阅图1,是本发明第一实施例提供的单臂组合设备调度方法的流程图,包括步骤:Please refer to FIG. 1, which is a flowchart of a method for scheduling a single-arm combined equipment provided by the first embodiment of the present invention, including the steps:

步骤S10,分析多品种晶圆同时加工时单臂组合设备的可调度性,并根据所述可调度性提出死锁避免规则;Step S10, analyzing the schedulability of the single-arm assembly equipment when multiple varieties of wafers are simultaneously processed, and proposing deadlock avoidance rules according to the schedulability;

其中,通过分析多品种晶圆同时加工时单臂组合设备的可调度性的设计,以使分析多品种晶圆在SACT的晶圆流和死锁情形;Among them, by analyzing the design of the schedulability of the single-arm combination equipment when multiple types of wafers are processed at the same time, the wafer flow and deadlock situation of multiple types of wafers in SACT can be analyzed;

步骤S20,根据所述死锁避免规则建立Petri网模型;Step S20, establishes a Petri net model according to the deadlock avoidance rule;

其中,通过所述Petri网模型的建立,有效的方便了单臂组合设备上晶圆加工的分析;Wherein, through the establishment of the Petri net model, the analysis of wafer processing on the single-arm combination equipment is effectively facilitated;

步骤S30,获取本地加工策略,并将所述加工策略在所述Petri网模型中进行计算,以得到多品种晶圆同时加工时所述单臂组合设备的最优调度算法;Step S30, obtaining a local processing strategy, and calculating the processing strategy in the Petri net model, so as to obtain an optimal scheduling algorithm for the single-arm assembly equipment when multiple varieties of wafers are processed simultaneously;

其中,所述加工策略为所述单臂组合设备中当多个加工模块同时加工晶圆时,所述单臂组合设备上机械手移动到最快加工完成晶圆的目标模块,并将所述目标模块上的晶圆卸载;Wherein, the processing strategy is that when a plurality of processing modules in the single-arm combined equipment process wafers at the same time, the robot on the single-arm combined equipment moves to the target module that processes the wafers fastest, and converts the target wafer unloading on module;

步骤S40,根据所述最优调度算法控制所述单臂组合设备进行加工调度;Step S40, controlling the single-arm combined equipment to perform processing scheduling according to the optimal scheduling algorithm;

本实施例,可以避免因多品种晶圆同时加工带来的系统死锁问题,降低晶圆质量和损害SACT设备,所述单臂组合设备调度方法中的调度算法计算复杂度为O(n2),可以高效地应对多品种晶圆同时加工的调度问题,减少了因系统调试浪费的生产时间。This embodiment can avoid the system deadlock problem caused by the simultaneous processing of multi-variety wafers, reduce the wafer quality and damage the SACT equipment. The scheduling algorithm in the single-arm combined equipment scheduling method has a computational complexity of O(n 2 ), which can efficiently deal with the scheduling problem of simultaneous processing of multi-variety wafers, reducing the production time wasted due to system debugging.

实施例二Embodiment 2

请参阅图2至图4,是本发明第二实施例提供的单臂组合设备调度方法的流程图,包括步骤:Please refer to FIG. 2 to FIG. 4 , which are flowcharts of a method for scheduling single-arm combined equipment provided by the second embodiment of the present invention, including the steps:

步骤S11,分析多品种晶圆同时加工时单臂组合设备的可调度性,并根据所述可调度性提出死锁避免规则;Step S11, analyzing the schedulability of the single-arm assembly equipment when multiple varieties of wafers are processed simultaneously, and propose deadlock avoidance rules according to the schedulability;

SACT同时加工多品种晶圆,第i种晶圆的晶圆流为

Figure RE-GDA0002327338800000082
i∈Nζ +
Figure RE-GDA0002327338800000083
xj i∈Nn +,mi≤n。SACT processes multiple varieties of wafers at the same time, and the wafer flow of the i-th wafer is
Figure RE-GDA0002327338800000082
i∈N ζ + ,
Figure RE-GDA0002327338800000083
x j i ∈N n + , and m i ≤n.

Nn +={1,2...,n};N n + = {1, 2..., n};

n表示系统中制造单元MU的总数量;n represents the total number of manufacturing units MU in the system;

mi表示第i种晶圆加工工序的总数量;m i represents the total number of i-th wafer processing operations;

Si,j表示第i种晶圆加工第j道工序;S i, j represents the jth process of the i-th wafer processing;

Figure RE-GDA0002327338800000091
表示第i种晶圆的第j道工序对应的制造单元。
Figure RE-GDA0002327338800000091
Indicates the manufacturing unit corresponding to the jth process of the ith wafer.

具体的,该步骤中,当SACT同时加工多品种晶圆时,系统中仅应用单臂机械手用于装卸载晶圆,资源竞争问题易造成系统死锁,降低了生产率甚至损坏设备。然而,组合设备非常昂贵,因此,死锁是SACT加工多品种晶圆需解决的关键问题。在n个MU的SACT中,如果机械手从MUi(i∈Nn +)卸载晶圆,应提前检测MUi中是否存在晶圆。若MUi有晶圆加工,机械手可以执行该命令,否则为了避免系统发生死锁机械手将被禁止执行此命令。同理可知,若机械手从MU0卸载晶圆,为了避免系统发生死锁需保证MU0存在待加工的晶圆。Specifically, in this step, when SACT processes multiple types of wafers at the same time, only a single-arm manipulator is used in the system for loading and unloading wafers. The resource competition problem can easily lead to system deadlock, reduce productivity and even damage equipment. However, combined equipment is very expensive, so deadlock is a key issue for SACT to process a wide variety of wafers. In the SACT of n MUs, if the robot unloads wafers from MU i (i∈N n + ), it should detect in advance whether there are wafers in MU i . If MU i has wafer processing, the manipulator can execute this command, otherwise the manipulator will be prohibited from executing this command in order to avoid system deadlock. Similarly, if the robot unloads wafers from MU 0 , in order to avoid system deadlock, it is necessary to ensure that there are wafers to be processed in MU 0 .

优选的,所述根据所述可调度性提出死锁避免规则的步骤包括:Preferably, the step of proposing deadlock avoidance rules according to the schedulability includes:

当所述单臂组合设备中的机械手从制造单元MUi(i∈Nn)卸载晶圆并移动至下一道加工工序Si-next需满足下列条件之一:When the robot in the single-arm combination equipment unloads the wafer from the manufacturing unit MU i (i∈N n ) and moves to the next processing step Si -next , one of the following conditions must be met:

当制造单元MUi(i=0)中待加工的晶圆个数不少于1时,Si-next=MUi-next为空闲状态;When the number of wafers to be processed in the manufacturing unit MU i (i=0) is not less than 1, Si -next =MU i-next is in an idle state;

当制造单元MUi(i∈Nn +)中加工晶圆个数为1时,Si-next=MUi-next为空闲状态;When the number of processed wafers in the manufacturing unit MU i (i∈N n + ) is 1, Si -next =MU i-next is in an idle state;

当制造单元MUi(i∈Nn +)中加工晶圆个数为1时,Si-next=MUn+1When the number of processed wafers in the manufacturing unit MU i (i∈N n + ) is 1, Si -next =MU n+1 ;

步骤S21,获取所述死锁避免规则中存储的所述单臂组合设备同时加工多品种晶圆时系统的运行特点和机械手的动作序列;Step S21, obtaining the operating characteristics of the system and the action sequence of the manipulator when the single-arm combination device stored in the deadlock avoidance rule simultaneously processes multiple varieties of wafers;

步骤S31,根据所述运行特点和所述机械手的动作序列以建立所述Petri网模型;Step S31, to establish the Petri net model according to the operating characteristics and the action sequence of the manipulator;

其中,单臂组合设备同时加工多品种晶圆,第i种晶圆的晶圆流

Figure RE-GDA0002327338800000101
Figure RE-GDA0002327338800000102
i∈Nζ +xj i∈Nn +,mi≤n;Among them, the single-arm combination equipment processes multiple types of wafers at the same time, and the wafer flow of the i-th type of wafers
Figure RE-GDA0002327338800000101
Figure RE-GDA0002327338800000102
i∈N ζ + , x j i ∈N n + , m i ≤n;

根据所述运行特点和所述机械手的动作序列,步骤31建立了通用的Petri 网模型描述多品种晶圆同时在SACT加工,

Figure RE-GDA0002327338800000104
表示SACT加工多品种晶圆的Petri网模型,其中库所集
Figure RE-GDA0002327338800000106
变迁集
Figure RE-GDA0002327338800000109
初始标识
Figure RE-GDA00023273388000001010
According to the operating characteristics and the action sequence of the manipulator, step 31 establishes a general Petri net model to describe the simultaneous processing of multi-variety wafers in SACT,
Figure RE-GDA0002327338800000104
Represents a Petri net model for SACT processing multi-variety wafers, where the library sets
Figure RE-GDA0002327338800000106
transition set
Figure RE-GDA0002327338800000109
initial identification
Figure RE-GDA00023273388000001010

具体的,所述单臂组合设备的库所和变迁间的函数关系F如下:Specifically, the functional relationship F between the locations and transitions of the single-arm combination device is as follows:

·uj (i)={pj (i),wj (i)},

Figure RE-GDA00023273388000001011
u0 (i)·={d01 (i)},
Figure RE-GDA00023273388000001012
u j (i) = {p j (i) , w j (i) },
Figure RE-GDA00023273388000001011
u 0 (i) = {d 01 (i) },
Figure RE-GDA00023273388000001012

·u0(i)={p0 (i),d0 (i)},·uj(i)={pj(i)},u0(i)·={d01 (i)},

Figure RE-GDA00023273388000001014
Figure RE-GDA00023273388000001015
u 0(i) = {p 0 (i) , d 0 (i) } , u j(i) = {p j(i) }, u 0(i) = {d 01 (i) },
Figure RE-GDA00023273388000001014
Figure RE-GDA00023273388000001015

·lj (i)={d(j-1)j (i)},

Figure RE-GDA00023273388000001016
lj (i)·={pj (i),r},
Figure RE-GDA00023273388000001017
Figure RE-GDA00023273388000001023
·ln+1={pn+1′},ln+1 ·={pn+1,r};l j (i) = {d (j-1)j (i) },
Figure RE-GDA00023273388000001016
l j (i) = {p j (i) , r},
Figure RE-GDA00023273388000001017
Figure RE-GDA00023273388000001023
· l n+1 = {p n+1 ′}, l n+1 · = {p n+1 , r};

Figure RE-GDA00023273388000001018
lj(i)·={pj(i)},
Figure RE-GDA00023273388000001020
ln+1(i)·={p0 (i),d0 (i),pn+1};
Figure RE-GDA00023273388000001018
l j(i) ={p j(i) },
Figure RE-GDA00023273388000001020
l n+1(i)· ={p 0 (i) , d 0 (i) , p n+1 };

Figure RE-GDA00023273388000001021
vrj (i)·={pj (i),wj (i)},
Figure RE-GDA00023273388000001021
v rj (i) = {p j (i) , w j (i) },

r表示单臂机械手;r represents a single-arm manipulator;

表示晶圆在第j道工序加工时制造单元

Figure RE-GDA0002327338800000112
对应的资源库所,
Figure RE-GDA0002327338800000113
xj i∈Nn + Indicates the manufacturing unit when the wafer is processed in the jth process
Figure RE-GDA0002327338800000112
the corresponding repository,
Figure RE-GDA0002327338800000113
x j i ∈N n + ;

p0 (i)表示单臂组合设备在输入端中放置第i种待加工的晶圆;p 0 (i) means that the single-arm combination device places the i-th wafer to be processed in the input;

pj (i)表示第i种类型晶圆在第j道工序加工,

Figure RE-GDA0002327338800000115
p j (i) indicates that the i-th type of wafer is processed in the j-th process,
Figure RE-GDA0002327338800000115

pj(i)表示第i种类型晶圆在第j道工序加工, p j(i) indicates that the i-th type of wafer is processed in the j-th process,

pn+ 1(i)表示单臂组合设备输出端中放置的第i种成品晶圆;p n+ 1(i) represents the i-th finished wafer placed in the output of the single-arm combination device;

pn+1′表示机械手移动到输出端并准备装载成品晶圆到输出端;p n+1 ' indicates that the robot moves to the output end and is ready to load the finished wafer to the output end;

Figure RE-GDA00023273388000001116
用于连接与pn+1′,无实意;
Figure RE-GDA00023273388000001116
for connection and p n+1 ′, meaningless;

djk (i)表示机械手将第i种晶圆从第j道工序移动到第k道工序,

Figure RE-GDA0002327338800000118
j<k;d jk (i) means that the robot moves the i-th wafer from the j-th process to the k-th process,
Figure RE-GDA0002327338800000118
j <k;

wj (i)表示机械从第j道工序卸载第i种晶圆前的等待;w j (i) represents the waiting time before the machine unloads the i-th wafer from the j-th process;

vrj (i)表示空载机械手移动到第j道工序,

Figure RE-GDA00023273388000001110
v rj (i) means that the unloaded manipulator moves to the jth process,
Figure RE-GDA00023273388000001110

uj (i)表示机械手从第j道工序卸载第i种晶圆,

Figure RE-GDA00023273388000001111
u j (i) means that the robot unloads the i-th wafer from the j-th process,
Figure RE-GDA00023273388000001111

uj(i)表示机械手从第j道工序卸载第i种晶圆, u j(i) means that the robot unloads the i-th wafer from the j-th process,

lj (i)表示机械手将第i种类型的晶圆装载到第j道工序,

Figure RE-GDA00023273388000001113
l j (i) means that the robot loads the i-th type of wafer to the j-th process,
Figure RE-GDA00023273388000001113

lj(i)表示机械手将第i种类型的晶圆装载到第j道工序,

Figure RE-GDA00023273388000001114
l j(i) means that the robot loads the i-th type of wafer to the j-th process,
Figure RE-GDA00023273388000001114

Figure RE-GDA00023273388000001115
表示第i种晶圆在某批量加工的总数量;
Figure RE-GDA00023273388000001115
Indicates the total number of i-th wafers processed in a batch;

步骤S41,获取本地加工策略,并将所述加工策略在所述Petri网模型中进行计算,以得到多品种晶圆同时加工时所述单臂组合设备的最优调度算法;Step S41, obtaining a local processing strategy, and calculating the processing strategy in the Petri net model, so as to obtain an optimal scheduling algorithm for the single-arm combination device when multiple varieties of wafers are processed simultaneously;

其中,所述加工策略为所述单臂组合设备中当多个加工模块同时加工晶圆时,所述单臂组合设备上机械手移动到最快加工完成晶圆的目标模块,并将所述目标模块上的晶圆卸载;Wherein, the processing strategy is that when a plurality of processing modules in the single-arm combined equipment process wafers at the same time, the robot on the single-arm combined equipment moves to the target module that processes the wafers fastest, and converts the target wafer unloading on module;

优选的,Petri网模型定义建立的两种晶圆同时在SACT加工的Petri网模型,其中两种晶圆流分别为WFP1=(PM1,PM3),WFP2=(PM2,PM3);Preferably, the Petri net model defines a Petri net model for two kinds of wafers to be processed simultaneously in SACT, wherein the two wafer flows are WFP 1 =(PM 1 , PM 3 ), WFP 2 =(PM 2 , PM 3 , respectively );

该步骤中,算法为:Petri网模型在任意状态标识为Mk(k≥1)状态下,根据下面规则选择使能变迁t,使系统达到新的状态Mk+1,实时调度与控制系统加工多品种晶圆。In this step, the algorithm is: when the Petri net model is in any state marked as M k (k≥1), select the enabling transition t according to the following rules, so that the system reaches a new state M k+1 , and the real-time scheduling and control system Process a variety of wafers.

具体的,该步骤中的具体实施程序为:Specifically, the specific implementation procedure in this step is:

Figure RE-GDA0002327338800000121
Figure RE-GDA0002327338800000121

Figure RE-GDA0002327338800000131
Figure RE-GDA0002327338800000131

Er表示集合;E r represents the set;

Figure RE-GDA0002327338800000132
Figure RE-GDA0002327338800000132

Figure RE-GDA0002327338800000133
Figure RE-GDA0002327338800000133

R(p)表示令牌在库所p的驻留时间,

Figure RE-GDA0002327338800000134
R(p) represents the residence time of the token in place p,
Figure RE-GDA0002327338800000134

R(t)表示触发变迁所需时间,

Figure RE-GDA0002327338800000135
R(t) represents the time required to trigger the transition,
Figure RE-GDA0002327338800000135

Mi表示库所对应的向量在第i次触发变迁后达到的标识;M i represents the sign that the vector corresponding to the library reaches after the i-th trigger transition;

Figure RE-GDA0002327338800000136
表示第i次触发变迁对应的向量;
Figure RE-GDA0002327338800000136
Represents the vector corresponding to the i-th trigger transition;

Figure RE-GDA0002327338800000137
表示系统的Petri网模型对应的关联矩阵;
Figure RE-GDA0002327338800000137
Represents the correlation matrix corresponding to the Petri net model of the system;

χi(p)表示令牌进入库所p的时刻,

Figure RE-GDA0002327338800000138
χ i (p) represents the moment when the token enters the place p,
Figure RE-GDA0002327338800000138

λi表示系统达到标识Mi的时刻;λ i represents the moment when the system reaches the mark Mi ;

公式:formula:

Figure RE-GDA0002327338800000139
Figure RE-GDA0002327338800000139

Figure RE-GDA0002327338800000141
Figure RE-GDA0002327338800000141

注:若χi(p)=0,表示在系统达到标识Mi时,无令牌进入库所p。在初始状态时,SACT处于空闲状态,可得标识

Figure RE-GDA0002327338800000142
mi≤n,和xj i∈Nn +
Figure RE-GDA0002327338800000143
M0(p)=0,
Figure RE-GDA0002327338800000145
λ0=0;Note: If χ i (p)=0, it means that when the system reaches the mark Mi , no token enters the place p. In the initial state, SACT is in an idle state, and the identification can be obtained
Figure RE-GDA0002327338800000142
m i ≤n, and x j i ∈N n + ,
Figure RE-GDA0002327338800000143
M 0 (p)=0,
Figure RE-GDA0002327338800000145
λ 0 =0;

步骤S51,根据所述最优调度算法控制所述单臂组合设备进行加工调度;Step S51, controlling the single-arm combined equipment to perform processing scheduling according to the optimal scheduling algorithm;

本实施例,可以避免因多品种晶圆同时加工带来的系统死锁问题,降低晶圆质量和损害SACT设备,所述单臂组合设备调度方法中的调度算法计算复杂度为O(n2),可以高效地应对多品种晶圆同时加工的调度问题,减少了因系统调试浪费的生产时间。This embodiment can avoid the system deadlock problem caused by the simultaneous processing of multi-variety wafers, reduce the wafer quality and damage the SACT equipment. The scheduling algorithm in the single-arm combined equipment scheduling method has a computational complexity of O(n 2 ), which can efficiently deal with the scheduling problem of simultaneous processing of multi-variety wafers, reducing the production time wasted due to system debugging.

实施例三Embodiment 3

请参阅图6,是本发明第三实施例提供的单臂组合设备调度系统100的结构示意图,包括:分析模块10、建模模块11、算法计算模块12和调度控制模块13,其中:Please refer to FIG. 6, which is a schematic structural diagram of a single-arm combined equipment scheduling system 100 provided by the third embodiment of the present invention, including: an analysis module 10, a modeling module 11, an algorithm calculation module 12, and a scheduling control module 13, wherein:

分析模块10,用于分析多品种晶圆同时加工时单臂组合设备的可调度性,并根据所述可调度性提出死锁避免规则。The analysis module 10 is used to analyze the schedulability of the single-arm combination equipment when multiple varieties of wafers are processed simultaneously, and propose deadlock avoidance rules according to the schedulability.

建模模块11,用于根据所述死锁避免规则建立Petri网模型。The modeling module 11 is used for establishing a Petri net model according to the deadlock avoidance rule.

算法计算模块12,用于获取本地加工策略,并将所述加工策略在所述Petri 网模型中进行计算,以得到多品种晶圆同时加工时所述单臂组合设备的最优调度算法,其中,所述加工策略为所述单臂组合设备中当多个加工模块同时加工晶圆时,所述单臂组合设备上机械手移动到最快加工完成晶圆的目标模块,并将所述目标模块上的晶圆卸载。The algorithm calculation module 12 is used to obtain a local processing strategy, and calculate the processing strategy in the Petri net model, so as to obtain the optimal scheduling algorithm of the single-arm combination device when multiple varieties of wafers are processed simultaneously, wherein , the processing strategy is that when multiple processing modules process wafers simultaneously in the single-arm combination device, the robot on the single-arm combination device moves to the target module that processes the wafer fastest, and moves the target module to the target module. on the wafer unloading.

调度控制模块13,用于根据所述最优调度算法控制所述单臂组合设备进行加工调度。The scheduling control module 13 is configured to control the single-arm combined equipment to perform processing scheduling according to the optimal scheduling algorithm.

优选的,所述分析模块10还用于:Preferably, the analysis module 10 is also used for:

当所述单臂组合设备中的机械手从制造单元MUi(i∈Nn)卸载晶圆并移动至下一道加工工序Si-next需满足下列条件之一:When the robot in the single-arm combination equipment unloads the wafer from the manufacturing unit MU i (i∈N n ) and moves to the next processing step Si -next , one of the following conditions must be met:

当制造单元MUi(i=0)中待加工的晶圆个数不少于1时,Si-next=MUi-next为空闲状态;When the number of wafers to be processed in the manufacturing unit MU i (i=0) is not less than 1, Si -next =MU i-next is in an idle state;

当制造单元MUi(i∈Nn +)中加工晶圆个数为1时,Si-next=MUi-next为空闲状态;When the number of processed wafers in the manufacturing unit MU i (i∈N n + ) is 1, Si -next =MU i-next is in an idle state;

当制造单元MUi(i∈Nn +)中加工晶圆个数为1时,Si-next=MUn+1When the number of processed wafers in the manufacturing unit MU i (i∈N n + ) is 1, Si -next =MU n+1 .

本实施例中,所述建模模块11还用于:In this embodiment, the modeling module 11 is also used for:

获取所述死锁避免规则中存储的所述单臂组合设备同时加工多品种晶圆时系统的运行特点和机械手的动作序列;Obtain the operating characteristics of the system and the action sequence of the manipulator when the single-arm combination device simultaneously processes multiple varieties of wafers stored in the deadlock avoidance rule;

根据所述运行特点和所述机械手的动作序列以建立所述Petri网模型;To establish the Petri net model according to the operating characteristics and the action sequence of the manipulator;

其中,单臂组合设备同时加工多品种晶圆,第i种晶圆的晶圆流

Figure RE-GDA0002327338800000151
i∈Nζ +
Figure RE-GDA0002327338800000153
xj i∈Nn +,mi≤n;Among them, the single-arm combination equipment processes multiple types of wafers at the same time, and the wafer flow of the i-th type of wafers
Figure RE-GDA0002327338800000151
i∈N ζ + ,
Figure RE-GDA0002327338800000153
x j i ∈N n + , m i ≤n;

具体的,所述单臂组合设备的库所和变迁间的函数关系如下:Specifically, the functional relationship between the location and transition of the single-arm combination device is as follows:

·uj (i)={pj (i),wj (i)},

Figure RE-GDA0002327338800000154
u0 (i)·={d01 (i)},
Figure RE-GDA0002327338800000155
u j (i) = {p j (i) , w j (i) },
Figure RE-GDA0002327338800000154
u 0 (i) = {d 01 (i) },
Figure RE-GDA0002327338800000155

·u0(i)={p0 (i),d0 (i)},·uj(i)={pj(i)},

Figure RE-GDA0002327338800000161
u0(i)·={d01 (i)},
Figure RE-GDA0002327338800000162
Figure RE-GDA0002327338800000163
u 0(i) = {p 0 (i) , d 0 (i) } , u j(i) = {p j(i) },
Figure RE-GDA0002327338800000161
u 0(i) = {d 01 (i) },
Figure RE-GDA0002327338800000162
Figure RE-GDA0002327338800000163

·lj (i)={d(j-1)j (i)},

Figure RE-GDA0002327338800000164
lj (i)·={pj (i),r},
Figure RE-GDA0002327338800000165
Figure RE-GDA00023273388000001622
·ln+1={pn+1′},ln+1 ·={pn+1,r};l j (i) = {d (j-1)j (i) },
Figure RE-GDA0002327338800000164
l j (i) = {p j (i) , r},
Figure RE-GDA0002327338800000165
Figure RE-GDA00023273388000001622
· l n+1 = {p n+1 ′}, l n+1 · = {p n+1 , r};

lj(i)·={pj(i)},ln+1(i)·={p0 (i),d0 (i),pn+1}; l j(i) ={p j(i) }, l n+1(i) ·={p 0 (i) , d 0 (i) , p n+1 };

Figure RE-GDA00023273388000001610
vrj (i)·={pj (i),wj (i)},
Figure RE-GDA00023273388000001611
Figure RE-GDA00023273388000001610
v rj (i) = {p j (i) , w j (i) },
Figure RE-GDA00023273388000001611

r表示单臂机械手;r represents a single-arm manipulator;

Figure RE-GDA00023273388000001612
表示晶圆在第j道工序加工时制造单元
Figure RE-GDA00023273388000001613
对应的资源库所,
Figure RE-GDA00023273388000001614
xj in +
Figure RE-GDA00023273388000001612
Indicates the manufacturing unit when the wafer is processed in the jth process
Figure RE-GDA00023273388000001613
the corresponding repository,
Figure RE-GDA00023273388000001614
x j in + ;

p0 (i)表示单臂组合设备在输入端中放置第i种待加工的晶圆;p 0 (i) means that the single-arm combination device places the i-th wafer to be processed in the input;

pj (i)表示第i种类型晶圆在第j道工序加工,

Figure RE-GDA00023273388000001616
p j (i) indicates that the i-th type of wafer is processed in the j-th process,
Figure RE-GDA00023273388000001616

pj(i)表示第i种类型晶圆在第j道工序加工, p j(i) indicates that the i-th type of wafer is processed in the j-th process,

pn+1 (i)表示单臂组合设备输出端中放置的第i种成品晶圆;p n+1 (i) represents the i-th finished wafer placed in the output of the single-arm combination device;

pn+1′表示机械手移动到输出端并准备装载成品晶圆到输出端;p n+1 ′ indicates that the robot moves to the output end and is ready to load the finished wafer to the output end;

Figure RE-GDA00023273388000001623
用于连接与pn+1′,无实意;
Figure RE-GDA00023273388000001623
for connection and p n+1 ′, meaningless;

djk (i)表示机械手将第i种晶圆从第j道工序移动到第k道工序,

Figure RE-GDA00023273388000001619
Figure RE-GDA00023273388000001620
j<k;d jk (i) means that the robot moves the i-th wafer from the j-th process to the k-th process,
Figure RE-GDA00023273388000001619
Figure RE-GDA00023273388000001620
j <k;

wj (i)表示机械从第j道工序卸载第i种晶圆前的等待;w j (i) represents the waiting time before the machine unloads the i-th wafer from the j-th process;

vrj (i)表示空载机械手移动到第j道工序,

Figure RE-GDA00023273388000001621
v rj (i) means that the unloaded manipulator moves to the jth process,
Figure RE-GDA00023273388000001621

uj (i)表示机械手从第j道工序卸载第i种晶圆,

Figure RE-GDA0002327338800000171
u j (i) means that the robot unloads the i-th wafer from the j-th process,
Figure RE-GDA0002327338800000171

uj(i)表示机械手从第j道工序卸载第i种晶圆,

Figure RE-GDA0002327338800000172
u j(i) means that the robot unloads the i-th wafer from the j-th process,
Figure RE-GDA0002327338800000172

lj (i)表示机械手将第i种类型的晶圆装载到第j道工序,

Figure RE-GDA0002327338800000173
l j (i) means that the robot loads the i-th type of wafer to the j-th process,
Figure RE-GDA0002327338800000173

lj(i)表示机械手将第i种类型的晶圆装载到第j道工序,

Figure RE-GDA0002327338800000174
l j(i) means that the robot loads the i-th type of wafer to the j-th process,
Figure RE-GDA0002327338800000174

本实施例,可以避免因多品种晶圆同时加工带来的系统死锁问题,降低晶圆质量和损害SACT设备,所述单臂组合设备调度方法中的调度算法计算复杂度为O(n2),可以高效地应对多品种晶圆同时加工的调度问题,减少了因系统调试浪费的生产时间。This embodiment can avoid the system deadlock problem caused by the simultaneous processing of multi-variety wafers, reduce the wafer quality and damage the SACT equipment. The scheduling algorithm in the single-arm combined equipment scheduling method has a computational complexity of O(n 2 ), which can efficiently deal with the scheduling problem of simultaneous processing of multi-variety wafers, reducing the production time wasted due to system debugging.

本实施例还提供一种移动终端,包括存储设备以及处理器,所述存储设备用于存储计算机程序,所述处理器运行所述计算机程序以使所述移动终端执行上述的单臂组合设备调度方法。This embodiment also provides a mobile terminal, including a storage device and a processor, where the storage device is used to store a computer program, and the processor runs the computer program to make the mobile terminal perform the above-mentioned scheduling of the single-arm combination device method.

本实施例还提供了一种存储介质,其上存储有上述移动终端中所使用的计算机程序,该程序在执行时,包括如下步骤:This embodiment also provides a storage medium on which the computer program used in the above-mentioned mobile terminal is stored, and when the program is executed, the program includes the following steps:

分析多品种晶圆同时加工时单臂组合设备的可调度性,并根据所述可调度性提出死锁避免规则;Analyze the schedulability of single-arm combined equipment when multiple varieties of wafers are processed simultaneously, and propose deadlock avoidance rules according to the schedulability;

根据所述死锁避免规则建立Petri网模型;Establish a Petri net model according to the deadlock avoidance rule;

获取本地加工策略,并将所述加工策略在所述Petri网模型中进行计算,以得到多品种晶圆同时加工时所述单臂组合设备的最优调度算法;Obtaining a local processing strategy, and calculating the processing strategy in the Petri net model, so as to obtain the optimal scheduling algorithm of the single-arm combination device when multiple varieties of wafers are processed simultaneously;

根据所述最优调度算法控制所述单臂组合设备进行加工调度。所述的存储介质,如:ROM/RAM、磁碟、光盘等。The single-arm combined equipment is controlled to perform processing scheduling according to the optimal scheduling algorithm. The storage medium, such as: ROM/RAM, magnetic disk, optical disk, etc.

所属领域的技术人员可以清楚地了解到,为描述的方便和简洁,仅以上述各功能单元、模块的划分进行举例说明,实际应用中,可以根据需要而将上述功能分配由不同的功能单元或模块完成,即将存储装置的内部结构划分成不同的功能单元或模块,以完成以上描述的全部或者部分功能。实施方式中的各功能单元、模块可以集成在一个处理单元中,也可以是各个单元单独物理存在,也可以两个或两个以上单元集成在一个单元中,上述集成的单元既可以采用硬件的形式实现,也可以采用软件功能单元的形式实现。另外,各功能单元、模块的具体名称也只是为了便于相互区分,并不用于限制本申请的保护范围。Those skilled in the art can clearly understand that, for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example. The module is completed, that is, the internal structure of the storage device is divided into different functional units or modules, so as to complete all or part of the functions described above. Each functional unit and module in the implementation manner may be integrated into one processing unit, or each unit may exist physically alone, or two or more units may be integrated into one unit, and the above-mentioned integrated units may adopt hardware. It can also be realized in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing from each other, and are not used to limit the protection scope of the present application.

本领域技术人员可以理解,图6中示出的组成结构并不构成对本发明的单臂组合设备调度系统的限定,可以包括比图示更多或更少的部件,或者组合某些部件,或者不同的部件布置,而图1和图2中的单臂组合设备调度方法亦采用图6中所示的更多或更少的部件,或者组合某些部件,或者不同的部件布置来实现。本发明所称的单元、模块等是指一种能够被所述目标单臂组合设备调度系统中的处理器(图未示)所执行并功能够完成特定功能的一系列计算机程序,其均可存储于所述目标单臂组合设备调度系统的存储设备(图未示)内。Those skilled in the art can understand that the composition shown in FIG. 6 does not constitute a limitation to the single-arm combined equipment scheduling system of the present invention, and may include more or less components than those shown in the figure, or combine certain components, or Different components are arranged, and the single-arm combined equipment scheduling method in FIG. 1 and FIG. 2 is also realized by using more or less components shown in FIG. 6 , or combining some components, or different component arrangements. The units, modules, etc. mentioned in the present invention refer to a series of computer programs that can be executed by the processor (not shown in the figure) in the scheduling system of the target single-arm combined equipment and can perform specific functions. It is stored in the storage device (not shown) of the target single-arm combined equipment scheduling system.

以上所述仅为本发明的较佳实施例而已,并不用以限制本发明,凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本发明的保护范围之内。The above descriptions are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention shall be included in the protection of the present invention. within the range.

Claims (10)

1. A method for scheduling single-arm combined equipment, the method comprising:
the schedulability of single-arm combination equipment for simultaneously processing multiple varieties of wafers is analyzed, and a deadlock avoidance rule is proposed according to the schedulability;
establishing a Petri network model according to the deadlock avoidance rule;
acquiring a local processing strategy, and calculating the processing strategy in the Petri network model to obtain an optimal scheduling algorithm of the single-arm combination equipment when multiple varieties of wafers are processed simultaneously;
and controlling the single-arm combined equipment to process and schedule according to the optimal scheduling algorithm.
2. The single-arm combined equipment scheduling method of claim 1, wherein said step of proposing deadlock avoidance rules according to said schedulability comprises:
when the robot in the single arm cluster tool is MU from manufacturingi(i∈Nn) Unloading the wafer and moving to the next processing step Si-nextOne of the following conditions is satisfied:
when manufacturing the unit MUi(i-0) when the number of wafers to be processed is not less than 1, Si-next=MUi-nextIs in an idle state;
when manufacturing the unit MUi(i∈Nn +) When the number of the middle processing wafers is 1, Si-next=MUi-nextIs in an idle state;
when manufacturing the unit MUi(i∈Nn +) When the number of the middle processing wafers is 1, Si-next=MUn+1
3. The single-arm combination equipment scheduling method of claim 1, wherein the step of building a Petri Net model according to the deadlock avoidance rule comprises:
acquiring the operation characteristics of the system and the action sequence of the manipulator when the single-arm combined equipment simultaneously processes a plurality of kinds of wafers, which are stored in the deadlock avoidance rule;
establishing the Petri network model according to the operation characteristics and the action sequence of the manipulator;
wherein, the single-arm combination equipment simultaneously processes the wafer flow of a plurality of varieties of wafers and the ith wafer
Figure RE-FDA0002327338790000021
Figure RE-FDA0002327338790000022
i∈Nζ+
Figure RE-FDA0002327338790000023
xj i∈Nn +,mi≤n。
4. The method for scheduling a single-arm combination device according to claim 3, wherein the functional relationship between the library and the transition of the single-arm combination device is as follows:
·uj (i)={pj (i),wj (i)},
Figure RE-FDA0002327338790000024
u0 (i)·={d01 (i)},
Figure RE-FDA0002327338790000025
·u0(i)={p0 (i),d0 (i)},·uj(i)={pj(i)},u0(i)·={d01 (i)},
Figure RE-FDA0002327338790000027
Figure RE-FDA0002327338790000028
·lj (i)={d(j-1)j (i)},lj (i)·={pj (i),r},
Figure RE-FDA00023273387900000210
Figure RE-FDA00023273387900000211
·ln+1={pn+1′},ln+1·={pn+1,r};
Figure RE-FDA00023273387900000212
lj(i)·={pj(i)},
Figure RE-FDA00023273387900000214
ln+1(i)·={p0 (i),d0 (i),pn+1};
vrj (i)·={pj (i),wj (i)},
r represents a single-arm manipulator;
Figure RE-FDA00023273387900000217
indicating that the wafer is processed in the jth process
Figure RE-FDA00023273387900000218
The corresponding resource pool is provided with a plurality of resource pools,
Figure RE-FDA00023273387900000219
Figure RE-FDA00023273387900000220
p0 (i)showing the single-arm combined equipment placing the ith wafer to be processed in the input end;
pj (i)indicating that the ith type wafer is processed in the jth procedure,
Figure RE-FDA00023273387900000221
pj(i)indicating that the ith type wafer is processed in the jth procedure,
Figure RE-FDA00023273387900000222
pn+1 (i)showing the i-th product wafer placed in the output end of the single-arm combined equipment;
pn+1' indicating the robot moves to the output and is ready to load a finished wafer to the output;
Figure RE-FDA0002327338790000031
for connecting
Figure RE-FDA0002327338790000032
And pn+1', no sense;
djk (i)showing the robot moving the ith wafer from the jth process to the kth process,
Figure RE-FDA0002327338790000033
Figure RE-FDA0002327338790000034
j<k;
wj (i)indicating a wait before the machine unloads the ith wafer from the jth process;
vrj (i)the empty manipulator is shown to move to the j-th procedure,
Figure RE-FDA0002327338790000035
uj (i)indicating that the robot unloads the ith wafer from the jth process,
Figure RE-FDA0002327338790000036
uj(i)indicating that the robot unloads the ith wafer from the jth process,
Figure RE-FDA0002327338790000037
lj (i)showing the robot loading the ith type of wafer into the jth process,
Figure RE-FDA0002327338790000038
lj(i)showing the robot loading the ith type of wafer into the jth process,
Figure RE-FDA0002327338790000039
5. the method as claimed in claim 1, wherein the processing strategy is that when a plurality of processing modules process wafers simultaneously in the single-arm assembly, the robot on the single-arm assembly moves to a target module that processes the wafer most quickly and unloads the wafer on the target module.
6. A single-armed cluster device dispatch system, the system comprising:
the analysis module is used for analyzing the schedulability of the single-arm combination equipment when multiple varieties of wafers are processed simultaneously and providing a deadlock avoidance rule according to the schedulability;
the modeling module is used for establishing a Petri network model according to the deadlock avoidance rule;
the algorithm calculation module is used for acquiring a local processing strategy and calculating the processing strategy in the Petri network model so as to obtain an optimal scheduling algorithm of the single-arm combination equipment when multiple varieties of wafers are processed simultaneously;
and the scheduling control module is used for controlling the single-arm combination equipment to perform processing scheduling according to the optimal scheduling algorithm.
7. The single-arm cluster tool scheduling system of claim 6, wherein the analysis module is further configured to:
when the robot in the single arm cluster tool is MU from manufacturingi(i∈Nn) Unloading the wafer and moving to the next processing step Si-nextOne of the following conditions is satisfied:
when manufacturing the unit MUi(i-0) when the number of wafers to be processed is not less than 1, Si-next=MUi-nextIs in an idle state;
when manufacturing the unit MUi(i∈Nn +) When the number of the middle processing wafers is 1, Si-next=MUi-nextIs in an idle state;
when manufacturing the unit MUi(i∈Nn +) When the number of the middle processing wafers is 1, Si-next=MUn+1
8. The single-arm cluster tool scheduling system of claim 6, wherein the modeling module is further configured to:
acquiring the operation characteristics of the system and the action sequence of the manipulator when the single-arm combined equipment simultaneously processes a plurality of kinds of wafers, which are stored in the deadlock avoidance rule;
establishing the Petri network model according to the operation characteristics and the action sequence of the manipulator;
wherein, the single-arm combination equipment simultaneously processes the wafer flow of a plurality of varieties of wafers and the ith wafer
Figure RE-FDA0002327338790000041
Figure RE-FDA0002327338790000042
i∈Nζ +xj i∈Nn +,mi≤n。
9. A mobile terminal, characterized by comprising a storage device for storing a computer program and a processor for executing the computer program to cause the mobile terminal to execute the single-arm combination device scheduling method according to any one of claims 1 to 5.
10. A storage medium, characterized in that it stores a computer program for use in a mobile terminal according to claim 9, which computer program, when executed by a processor, implements the steps of the single-arm combination device scheduling method according to any one of claims 1 to 5.
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CN117484521A (en) * 2023-11-30 2024-02-02 广东工业大学 A fault scheduling method for two-arm robot combined equipment in wafer processing

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CN117484521A (en) * 2023-11-30 2024-02-02 广东工业大学 A fault scheduling method for two-arm robot combined equipment in wafer processing

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