CN110850531B - Multi-channel optical module integrated structure with high-efficiency heat dissipation capability and high integration level - Google Patents

Abstract

The present invention discloses a multi-channel optical module integrated structure with efficient heat dissipation capability and high integration, the optical module integrated structure comprises a first optical module housing, a first PCB board, an insulating high thermal conductivity block with a local surface pad, a power device, and a multi-channel integrated optical element for interconnecting an optical chip inside the optical module with an optical fiber optical path, the power device and the multi-channel integrated optical element are both arranged on the insulating high thermal conductivity block, the power device is connected to the first PCB board by gold wire bonding, and the first PCB board is provided with a first dot matrix pad array for establishing an electrical connection relationship between an optical module circuit network and an external electrical connection relationship of the optical module. The present invention has efficient internal heat extraction capability, and at the same time will not occupy the wiring space inside and on the surface of the PCB, and can provide more electrical signal pins, thereby adapting to the integration of optical modules with more channels.

Description

Multi-channel optical module integrated structure with efficient heat dissipation capability and high integration

Technical Field

The present invention belongs to the technical field of optical module integrated design, and in particular relates to a multi-channel optical module integrated structure with efficient heat dissipation capability and high integration.

Background Art

With the advancement of communication technology and the development of big data applications, communication base stations and data centers have an increasingly urgent need for high-speed optical modules. For optical modules with a rate of 40G or above, the rate of a single laser chip can no longer meet the overall communication rate requirements of the optical module. In order to resolve this contradiction, the industry has integrated multiple laser chips into an optical module, relying on multi-channel parallel transmission to meet the overall transmission rate requirements. Since more optical chips are integrated into a multi-channel optical module, the heat dissipation pressure inside the module is much greater than that of a low-speed module. If good heat dissipation cannot be guaranteed, a large amount of heat will accumulate inside the module. High temperature will cause a series of performance deteriorations, such as an increase in the threshold current of the laser chip, a decrease in efficiency, and a drift in the responsivity of the detector chip. In severe cases, the chip will fail, greatly reducing the performance and reliability of the module.

Compared with the TO (Transistor Outline) package, the number and mounting position of the optical chips in the COB (Chip on Board) package can be flexibly configured, so it is widely used in the integration of optical modules for multi-channel parallel transmission. Restricted by industry standards, optical modules usually have two heat dissipation surfaces, and the main heat dissipation surface is in contact with the heat dissipation surface of the device. The heat generated inside the optical module needs to be conducted to the main heat dissipation surface. In the traditional COB structure scheme, see Figures 1 and 2. The first PCB board (Printed Circuit Board) 2 uses dense copper vias 7 as a medium for heat conduction, and the heat generated by the power device 3 on the front of the first PCB board 2 is conducted to the back of the first PCB board 2, and then the heat is conducted to the first optical module housing 1 by contact. The optical path interconnection between the external and the optical chip inside the optical module is realized by an optical lens group 6 or a multi-channel fiber array FA (Fiber Array) 9 that integrates a multi-channel optical path. The circuit connection interface of the optical module to the outside is realized by the strip-shaped gold finger pad 4 provided on the inner cavity part of the first optical module housing 1 extending from one end of the first PCB board 2.

The defects of the existing solution are: ① The density of the heat dissipation copper vias is limited by the punching density of the PCB board, and its thermal conductivity is limited, usually around 10W/m·K; ② The dense heat dissipation copper vias will occupy the routing space inside the PCB board, affecting the routing density of the PCB board and reducing the integration of the PCB board; ③ In order to have good contact and heat transfer with the shell, a large area of copper foil is required on the back of the PCB board, which will also occupy the routing space on the back of the PCB board and reduce the integration of the PCB board; ④ The external electrical signal interface of the optical module is arranged at one end of the PCB board, and the total number of pins is limited, which is not conducive to the integration of a larger number of channels.

Summary of the invention

In view of the above-mentioned deficiencies in the prior art, the present invention provides a multi-channel optical module integrated structure with efficient heat dissipation capability and high integration. The structure has efficient internal heat dissipation capability and does not occupy the wiring space inside and on the surface of the PCB. It can provide more electrical signal pins, thereby adapting to the integration of optical modules with more channels.

In order to achieve the above-mentioned object of the invention, the technical solution adopted by the present invention is:

A multi-channel optical module integrated structure with efficient heat dissipation capability and high integration, comprising a first optical module housing, a first PCB board, an insulating high thermal conductivity block with a pad on the surface, a power device and a multi-channel integrated optical element for interconnecting an optical chip inside the optical module with an optical fiber optical path, wherein the inner cavity of the first optical module housing is arranged in a stepped shape, the first PCB board is mounted on a cavity surface with a deeper cavity of the first optical module housing, a part of the insulating high thermal conductivity block is arranged on the first PCB board, another part of the insulating high thermal conductivity block is arranged on a cavity surface with a shallower cavity of the first optical module housing, and a weldable metallized pad is arranged on the contact surface between the insulating high thermal conductivity block and the inner cavity of the first optical module housing, the power device and the multi-channel integrated optical element are both arranged on the insulating high thermal conductivity block, and the power device is circuit-connected to the first PCB board by gold wire bonding.

Furthermore, the multi-channel integrated optical element adopts an integrated multi-channel optical lens group, the mounting surface of the optical lens group is arranged in a stepped shape, a part of the optical lens group is arranged on the insulating high thermal conductivity block, and another part of the optical lens group is arranged on the first PCB board, and the power device is arranged inside the optical lens group and connected to the insulating high thermal conductivity block through a metallized pad arranged on the front side of the insulating high thermal conductivity block.

Furthermore, the multi-channel integrated optical element adopts a multi-channel optical fiber array, the multi-channel optical fiber array and the power device are both arranged on an insulating high thermal conductivity block, and the power device is connected to the insulating high thermal conductivity block via a metallized pad arranged on the front side of the insulating high thermal conductivity block.

Furthermore, a first dot matrix pad array for establishing electrical connection between the optical module circuit network and the outside of the optical module is provided on the back of the first PCB board, and a window is provided at a position corresponding to the first dot matrix pad array in the first optical module housing.

Furthermore, it also includes a second optical module housing with an inwardly directed heat-conducting column, wherein the heat-conducting column is connected to the insulating high thermal conductivity block via a metallized pad or a high thermal conductivity flexible medium arranged on the front side of the insulating high thermal conductivity block.

Furthermore, it also includes a third optical module housing and a second PCB board, wherein the second PCB board is installed on the inner cavity surface of the third optical module housing, and flexibly interconnects the circuit with the first PCB board through a flexible PCB board, and a first dot matrix solder pad array is provided on the back of the second PCB board to establish an electrical connection relationship between the optical module circuit network and the outside of the optical module, and the third optical module housing has a window at a corresponding position of the first dot matrix solder pad array.

Furthermore, all pads in the first dot matrix pad array are arranged in a dot matrix in the horizontal and vertical directions according to a fixed pad spacing, wherein the pad pairs of high-speed differential signal pairs are arranged in an alternating manner with the pad pairs of ground pins, power pins and low-speed signal pins.

Furthermore, it also includes a PCB motherboard for mounting the optical module, and a second dot matrix pad array is arranged on the front side of the PCB motherboard, which is mapped one-to-one with the first dot matrix pad array, and the second dot matrix pad array is electrically connected to the first dot matrix pad array through an electrical connector with array metal springs on both sides, and the thickness of both sides of the electrical connector is greater than the window thickness of the first optical module housing or the third optical module housing.

Furthermore, it also includes a PCB motherboard for mounting the optical module, and a second dot matrix pad array is arranged on the front side of the PCB motherboard, which is mapped one-to-one with the first dot matrix pad array, and the second dot matrix pad array is electrically connected to the first dot matrix pad array through an electrical connector with an array solder ball on one side and a metal spring on the other side, and the thickness of both sides of the electrical connector is greater than the window thickness of the first optical module housing or the third optical module housing.

Furthermore, it also includes a PCB motherboard for mounting the optical module, and a second dot matrix pad array is arranged on the front side of the PCB motherboard, which is mapped one-to-one with the first dot matrix pad array. The first dot matrix pad array forms a ball grid array packaging structure through a solder ball array and is electrically connected to the second dot matrix pad array.

The present invention has the following beneficial effects:

(1) The present invention adopts an insulating high thermal conductivity block as the main heat dissipation medium. The heat generated by the power device can be directly transferred to the optical module housing through the insulating high thermal conductivity block, thereby efficiently conducting the heat generated by the power device inside the optical module, greatly improving the heat dissipation capacity of the optical module, and is particularly suitable for high-speed optical modules with more integrated channels;

(2) The present invention has efficient heat dissipation capability, which can reduce the operating temperature of the chip inside the optical module, thereby extending the service life of the optical module and expanding the operating temperature range of the optical module;

(3) The present invention saves wiring space inside and on the back of the PCB board, improves the circuit integration level of the optical module, and is suitable for integrating more channels in the optical module.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a schematic diagram of the structure of a traditional COB packaged multi-channel optical module;

FIG2 is a schematic cross-sectional view of a conventional COB packaged multi-channel optical module structure;

FIG3 is a schematic diagram of the integrated structure of a multi-channel optical module using an optical lens group in Example 1 of the present invention;

4 is a schematic diagram of the integrated structure of a multi-channel optical module using a multi-channel optical fiber array in Example 1 of the present invention;

5 is a schematic diagram of the integrated structure of a multi-channel optical module using an optical lens group in Example 2 of the present invention;

6 is a schematic diagram of the integrated structure of a multi-channel optical module using a multi-channel optical fiber array in Example 2 of the present invention;

7 is a schematic diagram of the integrated structure of a multi-channel optical module using an optical lens group in Example 3 of the present invention;

8 is a schematic diagram of the integrated structure of a multi-channel optical module using a multi-channel optical fiber array in Example 3 of the present invention;

9 is a schematic diagram of a first dot matrix pad array arrangement method in Embodiment 4 of the present invention;

10 is a schematic diagram of the structure of the electrical signal pins in Example 5 of the present invention;

11 is a schematic diagram of the structure of the electrical signal pins in Example 6 of the present invention;

FIG. 12 is a schematic diagram of the electrical signal pin structure in Embodiment 7 of the present invention.

The accompanying drawings are marked as follows: first optical module housing-1, first PCB board-2, first dot matrix pad array-201, power device-3, gold wire-301, gold finger pad-4, second optical module housing-5, thermal conductive column-501, high thermal conductivity flexible medium-502, optical lens group-6, dense copper vias-7, insulating high thermal conductivity block-8, multi-channel optical fiber array-9, third optical module housing-10, second PCB board-11, flexible PCB board-12, PCB motherboard-13, second dot matrix pad array-1301, electrical connector-14, metal reed-1401, solder ball-1402, solder ball array-15.

DETAILED DESCRIPTION

In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

It should be noted that the diagram does not include all components and parts inside the optical module. For better illustration, some dimensions of structures or parts are exaggerated relative to other structures or parts, and are only used to express relative structural relationships.

Since the diagram does not fully express all transitional elements or layers (such as solder layers, surface pads, thermal conductive medium layers, etc.), when an element or layer is described as being "on" or "connected to" another component or layer, it can be directly on or connected to the other component or layer, or intermediate elements or layers may exist.

Since there are many structural combinations, in Example 1, Example 2 and Example 3, only the integrated structure related to efficient heat dissipation is described. In Example 4, Example 5, Example 6 and Example 7, the integrated structure of the electrical signal pins of the optical module of the present invention is mainly described, that is, how the dot matrix pad array is interconnected with the circuit outside the optical module. The efficient heat dissipation integrated structure described in Example 1 to Example 3 can be arbitrarily combined with the integrated structure of the electrical signal pins described in Example 4 to Example 7 to form a complete optical module integrated structure.

Example 1

The present invention provides a multi-channel optical module integrated structure with efficient heat dissipation capability and high integration, see Figure 3, comprising a first optical module housing 1, a first PCB board 2, an insulating high thermal conductivity block 8 with a local solder pad on the surface, a power device 3 and a multi-channel integrated optical element for interconnecting an optical chip inside the optical module with an optical fiber optical path.

The inner cavity of the first optical module housing 1 is arranged in a stepped shape. Specifically, the inner cavity surface of the first optical module housing 1 is arranged as two mounting surfaces of different heights, namely, a deeper cavity surface and a shallower cavity surface; the first PCB board 2 is mounted on the deeper cavity surface of the inner cavity of the first optical module housing 1, a part of the insulating high thermal conductivity block 8 is arranged on the first PCB board 2, and the other part of the insulating high thermal conductivity block 8 is arranged on the shallower cavity surface of the inner cavity of the first optical module housing 1.

The power device 3 includes a laser chip, a photodetector chip, a laser driver chip, a transimpedance amplifier chip, a limiting amplifier chip, and a clock recovery chip; the above chips can be in the form of a single chip, a multi-channel integrated BAR strip chip, or a multi-functional chip with multiple chips integrated as a whole. The power device 3 is placed on the insulating high thermal conductivity block 8 and is circuit-connected to the first PCB board 2 by bonding with gold wires 301.

The multi-channel integrated optical element is also placed on the insulating high thermal conductivity block 8, which can adopt an integrated multi-channel optical lens group 6 or a multi-channel optical fiber array 9; when the optical lens group 6 is adopted, see Figure 3, the mounting surface of the optical lens group 6 can be set to a stepped shape according to the thickness of the insulating high thermal conductivity block 8, and high-strength glue is used for bonding during installation. A part of the optical lens group 6 is installed on the insulating high thermal conductivity block 8, and the other part of the optical lens group 6 is installed on the first PCB board 2, and the power device 3 is arranged inside the optical lens group 6; when the multi-channel optical fiber array 9 is adopted, see Figure 4, the multi-channel optical fiber array 9 and the power device 3 are both arranged on the insulating high thermal conductivity block, and the multi-channel optical fiber array 9 can be connected to the insulating high thermal conductivity block 8 by high-strength glue bonding or welding.

The insulating high thermal conductivity block 8 can be made of ceramic materials with high thermal conductivity such as AlN ceramics, SiC ceramics or BeO ceramics. When the power device 3 generates a large amount of heat, the power device 3 needs eutectic welding or the multi-channel integrated optical element needs to be welded, the insulating high thermal conductivity block 8 can be processed with a weldable metallized pad in the installation area of the power device 3 or the multi-channel integrated optical element as needed, and the power device 3 and the insulating high thermal conductivity block 8 are fixed together by AuSn eutectic welding or high thermal conductivity Ag glue bonding. The contact surface between the back of the insulating high thermal conductivity block 8 and the inner cavity of the first optical module housing 1 is provided with a weldable metallized pad, the surface of the first optical module housing 1 is subjected to a weldable electroplating treatment (such as nickel plating), and the insulating high thermal conductivity block 8 and the first optical module housing 1 are brazed by adding SnPb solder. The insulating high thermal conductivity block 8 and the first PCB board 2 are bonded and fixed by high-strength insulating glue.

The present invention adopts an insulating high thermal conductivity block 8 as the main heat dissipation medium, and the heat generated by the power device 3 can be directly conducted to the first optical module housing 1 through the insulating high thermal conductivity block 8. The insulating high thermal conductivity block 8 has the characteristics of high thermal conductivity, and its thermal conductivity can reach up to 270W/m·K or more (AlN ceramics are 170-200W/m·K, SiC ceramics are, BeO ceramics are about 270W/m·K, and SiC ceramics are about 83W/m·K), which far exceeds the heat dissipation capacity of the dense copper vias inside the PCB in the traditional COB solution, and can efficiently export the heat generated by the power device 3 inside the optical module. Since the heat dissipation capacity of the optical module is greatly improved, it is particularly suitable for integrating high-speed optical modules with more channels. Better heat dissipation capacity can reduce the operating temperature of the chip inside the optical module (especially the laser chip), thereby extending the service life of the optical module, and can expand the operating temperature range of the optical module.

The present invention is provided with a first dot matrix pad array 201 on the back of the first PCB board 2 to establish an electrical connection between the optical module circuit network and the outside of the optical module, as an external electrical signal pin of the optical module. The first optical module housing 1 is provided with a window at a position corresponding to the first dot matrix pad array 201, so that the first dot matrix pad array 201 can be exposed.

All circuit networks of the optical module that need to be electrically connected to the outside are connected to the first dot matrix pad array 201 on the back side of the first PCB board 2 through the circuit wiring inside the first PCB board 2 .

Since the dense copper via heat dissipation structure in the traditional solution is not adopted, the PCB board does not need to sacrifice the wiring space inside and on the back. At the same time, since the insulating high thermal conductivity block is not conductive, it also does not affect the surface wiring of the front of the PCB board and its overlapping area, that is, the entire surface area and internal space of the PCB board can be used for circuit wiring.

The PCB board routing in the present invention is more flexible and the design is more convenient; the PCB board of the same size can have the maximum wiring density in theory, thereby improving the circuit integration level of the optical module, and is suitable for integrating more channels in the optical module; due to the flexible wiring, all circuit networks can be conveniently connected to the dot matrix pad array on the back of the PCB board, so that all external electrical signal pins of the optical module are realized by using the dot matrix pad array.

Example 2

5 and 6 , based on Example 1, the present invention adds a second optical module housing 5 with an inwardly directed heat-conducting column 501 , which is placed on an insulating high thermal conductivity block 8 , and the two are connected by adding solder brazing or a high thermal conductivity flexible medium 502 .

When the thermally conductive column 501 is connected to the insulating high thermal conductive block 8 by soldering with added solder, it is necessary to set a metallized pad in the overlapping area of the front side of the insulating high thermal conductive block 8 and electroplate a solderable coating on the second optical module housing 5 .

When the thermally conductive column 501 is connected to the insulating high thermal conductive block 8 through the highly thermally conductive flexible medium 502, the highly thermally conductive flexible medium 502 can be made of a flexible material with a high thermal conductivity coefficient, such as indium foil, copper foil, graphite or highly thermally conductive silicone grease.

Example 3

7 and 8 , based on Example 1, the configuration of the first optical module housing 1 , the first PCB board 2 , the insulating high thermal conductivity block 8 , the power device 3 and the multi-channel integrated optical element in this embodiment is completely consistent with that in Example 6.

The difference between this embodiment and embodiment 1 is that in this embodiment, the first dot matrix pad array 201 is not set on the back of the first PCB board 2, but a third optical module housing 10 and a second PCB board 11 are added, and the second PCB board 11 is installed on the inner cavity surface of the third optical module housing 10.

The second PCB board 11 is connected to the first PCB board 2 through the flexible PCB board 12 to achieve flexible interconnection of circuits.

Similar to the structure of the first PCB board 2 in Example 1, the present invention is provided with a first dot matrix pad array 201 on the back of the second PCB board 11 to establish an electrical connection between the optical module circuit network and the outside of the optical module, which serves as an external electrical signal pin of the optical module. The third optical module housing 10 is provided with a window at a position corresponding to the first dot matrix pad array 201, so that the first dot matrix pad array 201 can be exposed.

All circuit networks of the optical module that need to be electrically connected to the outside are connected to the first dot matrix pad array 201 on the back side of the second PCB board 11 through the circuit wiring inside the second PCB board 11 .

Example 4

Referring to FIG9 , based on Example 1, Example 2 or Example 3, the present invention specifically sets the arrangement rules of all pads in the first dot matrix pad array 201, that is, all pads are arranged in a dot matrix in the horizontal and vertical directions according to a fixed pad spacing d.

The pads filled with black are the high-speed differential signal pairs of the optical module to the outside. Among them, 2001p is the positive end of the differential signal pair, and 2001n is the reverse end of the differential signal pair. The number of high-speed differential signal pairs corresponds to the number of channels integrated in the optical module. The unfilled white circular pads 2001ref are mainly ground pins and a small number of power pins and other low-speed signal pins. The black pad pairs and the white pad pairs are arranged in an alternating manner. The ground pins 2001ref need to be used to separate the differential signal pairs to ensure that there is no crosstalk between the pairs of differential signals. This figure takes a 20×10 pad matrix as an example. The 200 pads shown can be arranged with a maximum of 50 high-speed differential signal pairs, which meets the electrical pin requirements of 50 channels integrated in the optical module.

To prevent the signal from leaking out of the gap between the ground pin pads and to ensure good isolation between the differential signal pairs, the pad spacing d should meet certain requirements. The pad spacing d should be as small as possible, and the maximum d should not exceed 1/2 of the high-speed differential signal operating wavelength. If the optical module is to obtain better electromagnetic compatibility performance, d should not exceed 1/20 of the high-speed differential signal operating wavelength. At the same time, in order to obtain better high-speed signal transmission performance, the diameter of the pad and the signal via on the pad should be as small and short as possible to reduce the parasitic capacitance between the pad and the via and the parasitic inductance of the via.

It should be noted that this diagram is mainly used to illustrate the arrangement and setting rules of the dot matrix pad array 2001. For the convenience of example, circular pads are used in the diagram. In addition to circular pads, rectangular pads, parallelogram pads, dog bone pads, teardrop pads and other pad shapes and their deformations can also be used.

The density of the dot matrix pad array in the present invention can be flexibly adjusted according to the processing capacity of the PCB board. Taking the dot matrix spacing of 0.8mm as an example, a dot matrix pad array of 200 (20×10) pins can be realized in the area of 15.2mm×7.2mm on the back of the PCB board. It can meet the external electrical signal interface of the optical module with a maximum of 50 channels, while the number of channels integrated in the 40G and 100G optical modules using the traditional solution is only 8 (4 receive and 4 transmit).

Example 5

Referring to FIG. 10 , based on Embodiment 4, the present invention adds a PCB motherboard 13 for mounting the optical module.

The front side of the PCB motherboard 13 (the projection area of the first dot matrix pad array 201) is provided with a second dot matrix pad array 1301 which is mapped one-to-one with the first dot matrix pad array 201. The second dot matrix pad array 1301 is electrically connected to the first dot matrix pad array 201 through an electrical connector 14 having array metal springs 1401 on both sides. The metal springs 1401 at corresponding positions on the front and back sides of the electrical connector 14 are in a conductive relationship in the circuit.

It should be noted that the thickness of the metal reeds 1401 on both sides of the electrical connector 14 when not compressed should be set to be greater than the window thickness of the first optical module housing 1 or the third optical module housing 10. The metal reeds 1401 on both sides of the electrical connector 14 are compressed and deformed to ensure reliable connection between the metal reeds 1401 and the first dot matrix solder pad array 201 and the second dot matrix solder pad array 1301 respectively.

Example 6

Referring to Fig. 11, based on Example 4, the internal circuit structure of the first PCB board 2 or the second PCB board 11 and the arrangement of the first dot matrix pad array 201 on the back in this embodiment are completely consistent with those in Example 5. The arrangement of the front pads of the PCB motherboard 13 on which the optical module is mounted is also completely consistent with that in Example 5.

The difference between this embodiment and embodiment 5 is that in this embodiment, the second dot matrix pad array 1301 and the first dot matrix pad array 201 are electrically connected through an electrical connector 14 having an array solder ball 1402 on one side and an array metal spring 1401 on the other side, and the metal spring 1401 and the solder ball 1402 at the corresponding position on the front and back sides of the electrical connector 14 are in a conductive relationship in the circuit. The side of the electrical connector 14 close to the optical module is the array solder ball 1402, which is fixed on the first dot matrix pad array 201 on the back of the first PCB board 2 or the second PCB board 11 by welding, and realizes circuit connection. The side of the electrical connector 14 close to the PCB motherboard 13 is the array metal spring 1401. By setting the window thickness h of the first optical module housing 1 or the third optical module housing 10, the array metal spring 1401 is appropriately deformed, and the electrical connection between the electrical connector 14 and the second dot matrix pad array 1301 of the PCB motherboard 13 is realized. The electrical connection between the first dot matrix pad array 201 and the second dot matrix pad array 1301 is finally achieved through the above method.

Example 7

Referring to Fig. 12, based on Example 4, the internal circuit structure of the first PCB board 2 or the second PCB board 11 and the arrangement of the first dot matrix pad array 201 on the back in this embodiment are completely consistent with those in Example 5. The arrangement of the front pads of the PCB motherboard 13 on which the optical module is mounted is also completely consistent with that in Example 5.

The difference between this embodiment and the fifth embodiment is that this embodiment does not use the electrical connector 14, but relies on the solder ball array 15 as the external electrical pin of the optical module, that is, the solder ball array 15 is planted on the first dot matrix pad array 201 on the back of the first PCB board 2 or the second PCB board 11 to realize the ball grid array package (BGA, Ball Grid Array) of the external pin, and is electrically connected with the second dot matrix pad array 1301. The BGA packaging structure should meet the following rules: ① The diameter of the solder ball used for ball planting should be slightly larger than the diameter of the pad (the pad of the first dot matrix pad array 201 and the second dot matrix pad array 1301), usually 125%-133% of the pad diameter; ② The window thickness h of the first optical module housing 1 or the third optical module housing 10 should be slightly smaller than the diameter of the solder ball used for ball planting, usually 65% of the solder ball diameter.

Those skilled in the art will appreciate that the embodiments described herein are intended to help readers understand the principles of the present invention, and should be understood that the protection scope of the present invention is not limited to such specific statements and embodiments. Those skilled in the art can make various other specific variations and combinations that do not deviate from the essence of the present invention based on the technical revelations disclosed by the present invention, and these variations and combinations are still within the protection scope of the present invention.

Claims (10)

1. A multi-channel optical module integrated structure with efficient heat dissipation capability and high integration, characterized in that it comprises a first optical module housing (1), a first PCB board (2), an insulating high thermal conductivity block (8) with a solder pad on its surface, a power device (3) and a multi-channel integrated optical element for interconnecting an optical chip inside the optical module with an optical fiber optical path, wherein the inner cavity of the first optical module housing (1) is arranged in a stepped shape, the first PCB board (2) is mounted on a cavity surface with a deeper cavity of the first optical module housing (1), a portion of the insulating high thermal conductivity block (8) is arranged on the first PCB board (2), another portion of the insulating high thermal conductivity block (8) is arranged on a cavity surface with a shallower cavity of the first optical module housing (1), and a metallized solder pad that can be welded is arranged on the contact surface between the insulating high thermal conductivity block (8) and the inner cavity of the first optical module housing (1), the power device (3) and the multi-channel integrated optical element are both arranged on the insulating high thermal conductivity block (8), and the power device (3) is connected to the first PCB board (2) by gold wire (301) bonding. 2. The multi-channel optical module integrated structure with efficient heat dissipation capability and high integration as claimed in claim 1, characterized in that the multi-channel integrated optical element adopts an integrated multi-channel optical lens group (6), the mounting surface of the optical lens group (6) is arranged in a stepped shape, a part of the optical lens group (6) is arranged on the insulating high thermal conductivity block (8), and another part of the optical lens group (6) is arranged on the first PCB board (2), and the power device (3) is arranged inside the optical lens group (6) and connected to the insulating high thermal conductivity block (8) through a metallized pad arranged on the front of the insulating high thermal conductivity block (8). 3. The multi-channel optical module integrated structure with efficient heat dissipation capability and high integration as described in claim 1 is characterized in that the multi-channel integrated optical element adopts a multi-channel optical fiber array (9), the multi-channel optical fiber array (9) and the power device (3) are both arranged on an insulating high thermal conductivity block (8), and the power device (3) is connected to the insulating high thermal conductivity block (8) through a metallized pad arranged on the front side of the insulating high thermal conductivity block (8). 4. The multi-channel optical module integrated structure with efficient heat dissipation capability and high integration as described in claim 2 or 3 is characterized in that a first dot matrix solder pad array (201) for establishing electrical communication between the optical module circuit network and the outside of the optical module is provided on the back of the first PCB board (2), and a window is provided at a position corresponding to the first dot matrix solder pad array (201) of the first optical module housing (1). 5. The multi-channel optical module integrated structure with efficient heat dissipation capability and high integration as described in claim 4 is characterized in that it also includes a second optical module housing (5) with an inward heat-conducting column (501), and the heat-conducting column (501) is connected to the insulating high thermal conductivity block (8) through a metallized pad or a high thermal conductivity flexible medium (502) arranged on the front side of the insulating high thermal conductivity block (8). 6. The multi-channel optical module integrated structure with efficient heat dissipation capability and high integration as described in claim 2 or 3 is characterized in that it also includes a third optical module housing (10) and a second PCB board (11), wherein the second PCB board (11) is installed on the inner cavity surface of the third optical module housing (10), and is flexibly interconnected with the first PCB board (2) through a flexible PCB board (12), and a first dot matrix pad array (201) is provided on the back of the second PCB board (11) for establishing an electrical connection relationship between the optical module circuit network and the outside of the optical module, and the third optical module housing (10) is provided with a window at a position corresponding to the first dot matrix pad array (201). 7. The multi-channel optical module integrated structure with efficient heat dissipation capability and high integration as described in claim 5 is characterized in that all pads in the first dot matrix pad array (201) are arranged in a dot matrix in the horizontal and vertical directions according to a fixed pad spacing, wherein the pad pairs of high-speed differential signal pairs are arranged in an alternating manner with the pad pairs of ground pins, power pins and low-speed signal pins. 8. The multi-channel optical module integrated structure with efficient heat dissipation capability and high integration as described in claim 7 is characterized in that it also includes a PCB motherboard (13) for mounting the optical module, and a second dot matrix pad array (1301) is arranged on the front of the PCB motherboard (13) and is mapped one-to-one with the first dot matrix pad array (201), and the second dot matrix pad array (1301) is electrically connected to the first dot matrix pad array (201) through an electrical connector (14) with arrayed metal springs (1401) on both sides, and the thickness of both sides of the electrical connector (14) is greater than the window thickness of the first optical module housing (1) or the third optical module housing (10). 9. The multi-channel optical module integrated structure with efficient heat dissipation capability and high integration as described in claim 7 is characterized in that it also includes a PCB motherboard (13) for mounting the optical module, and a second dot matrix pad array (1301) is arranged on the front of the PCB motherboard (13) and is mapped one-to-one with the first dot matrix pad array (201), and the second dot matrix pad array (1301) is electrically connected to the first dot matrix pad array (201) through an electrical connector (14) having an array solder ball (1402) on one side and a metal spring sheet (1401) on the other side, and the thickness of both sides of the electrical connector (14) is greater than the window thickness of the first optical module housing (1) or the third optical module housing (10). 10. The multi-channel optical module integrated structure with efficient heat dissipation capability and high integration as described in claim 7 is characterized in that it also includes a PCB motherboard (13) for mounting the optical module, and a second dot matrix pad array (1301) is arranged on the front of the PCB motherboard (13) and is mapped one-to-one with the first dot matrix pad array (201), and the first dot matrix pad array (201) forms a ball grid array packaging structure through a solder ball array (15) and is electrically connected to the second dot matrix pad array (1301).