CN110849190A - Copper-aluminum composite radiator and processing method thereof - Google Patents
Copper-aluminum composite radiator and processing method thereof Download PDFInfo
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- CN110849190A CN110849190A CN201911132690.5A CN201911132690A CN110849190A CN 110849190 A CN110849190 A CN 110849190A CN 201911132690 A CN201911132690 A CN 201911132690A CN 110849190 A CN110849190 A CN 110849190A
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- Prior art keywords
- copper
- copper substrate
- aluminum
- mortise
- radiator
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/084—Heat exchange elements made from metals or metal alloys from aluminium or aluminium alloys
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/085—Heat exchange elements made from metals or metal alloys from copper or copper alloys
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/02—Header boxes; End plates
- F28F9/04—Arrangements for sealing elements into header boxes or end plates
- F28F9/16—Arrangements for sealing elements into header boxes or end plates by permanent joints, e.g. by rolling
- F28F9/18—Arrangements for sealing elements into header boxes or end plates by permanent joints, e.g. by rolling by welding
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a copper aluminium composite heat radiator, includes aluminum alloy heat radiator main part, still includes the copper base plate that inlays admittedly on the heat-conducting surface of aluminum alloy heat radiator main part and be the draw-in groove form, the draw-in groove top opening of copper base plate has laid the capillary board in this draw-in groove, and this draw-in groove opening is sealed through tin soldering by the DBC board. The composite radiator fully utilizes the characteristics of two materials, namely the characteristics of high heat conduction capability of copper, strong heat dissipation performance of aluminum, easiness in processing, low cost and the like, heat transfer is accelerated through better heat conduction performance of copper, the heat dissipation performance is improved, the capillary plate is arranged in the copper substrate, namely the clamping groove, the capillary plate can transfer heat more quickly, the copper substrate and the DBC substrate can be directly welded at the opening of the slotting, the integrated radiator is directly formed, the subsequent process is reduced, and the intermediate medium heat conduction silicone grease is not needed.
Description
Technical Field
The invention relates to the technical field of radiators, in particular to a power device radiator.
Background
With the continuous increase of power devices, the requirements on heat radiators are higher and higher. Generally, increasing the heat dissipation area can increase the heat dissipation effect of the heat sink, but at the same time, the size and cost of the heat sink are increased, and the development trend of miniaturization of the whole device is not met. In terms of materials, the existing aluminum alloy radiator cannot meet the increasingly improved radiating requirement. The aluminum alloy radiator cannot be directly welded with the DBC plate, the aluminum alloy radiator must be fixed by bolts after being bonded by an intermediate medium (heat-conducting silicone grease), the heat-conducting property of the intermediate medium (heat-conducting silicone grease) is poor, bubbles cannot be completely eliminated, the contact surface cannot be guaranteed to be sufficient, and the heat-conducting efficiency is affected.
Disclosure of Invention
The invention aims to provide a copper-aluminum composite radiator which has good heat-conducting property, can be directly welded with a DBC plate and has local temperature equalization and a processing method thereof aiming at the defects in the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme: the utility model provides a copper aluminium composite heat radiator, includes aluminum alloy heat radiator main part, still includes the copper base plate that inlays admittedly on the heat-conducting surface of aluminum alloy heat radiator main part and be the draw-in groove form, the draw-in groove top opening of copper base plate has laid the capillary board in this draw-in groove, and this draw-in groove opening is sealed through the welding by the DBC board.
As an improvement: the clamping groove is also internally vacuumized and injected with liquid.
As an improvement: the heat conducting surface is provided with a through hole which is externally communicated with the clamping groove, a closable vacuum pumping pipe is inserted through the through hole, and the clamping groove is vacuumized and injected with liquid through the vacuum pumping pipe to form the uniform temperature of the copper substrate.
As an improvement: the capillary plates are in a staggered honeycomb shape on the cross section.
As an improvement: the bottom of the copper substrate is provided with a mortise and tenon groove, and the copper substrate is in mortise and tenon connection with the aluminum alloy radiator main body.
A processing method of a copper-aluminum composite radiator comprises the following process steps:
1) manufacturing a copper substrate, carrying out die extrusion forming, and further processing an opening clamping groove by using a numerical control milling machine;
2) positioning a copper substrate, namely forming a positioning groove on the upper top surface of a lower top block of a lower die of an aluminum alloy radiator die, placing an opening of the copper substrate facing the lower top block into the positioning groove, and placing an aluminum cake into an aluminum cake placing inlet of the lower die of the die and on the copper substrate;
3) the upper die and the lower die are matched and forged and formed, the upper die with the hole plate moves downwards to be matched with the lower die for placing the copper substrate and the aluminum cake, the lower ejector block applies pressure, the die is opened after the forging and forming, and the copper substrate is embedded into the heat conducting surface of the aluminum alloy radiator main body to form the copper-aluminum integrated radiator;
4) placing a capillary plate in a copper substrate clamping groove of the copper-aluminum integrated radiator;
5) a vacuum pumping pipe is inserted into the straight through hole, a straight through hole which leads to the clamping groove from the outside is formed in the heat conducting surface, and the closable vacuum pumping pipe is inserted through the straight through hole;
6) welding the DBC board, and sealing the opening by welding the DBC board at the opening of the clamping groove;
7) vacuumizing and injecting liquid, vacuumizing the clamping groove through a vacuum exhaust pipe, injecting the liquid, and sealing the vacuum exhaust pipe.
As an improvement: in the step of manufacturing the copper substrate, the copper substrate is directly manufactured into a mortise and tenon copper substrate with mortise and tenon grooves at the bottom, and when the mortise and tenon copper substrate is forged and pressed in the steps of closing the upper die and the lower die and forging and pressing, the mortise and tenon grooves of the mortise and tenon copper substrate are quickly filled with aluminum blocks to form a mortise and tenon structure.
The invention has the beneficial effects that: firstly, the composite radiator fully utilizes the characteristics of two materials, namely the characteristics of high heat conduction capability of copper, strong heat dissipation performance of aluminum, easiness in processing, low cost and the like, accelerates heat transfer and improves heat dissipation performance through better heat conduction performance of copper; the capillary plate is arranged in the copper substrate, namely the clamping groove, the capillary plate can conduct heat more quickly, the copper substrate and the DBC substrate can be directly welded at the opening of the groove to directly form an integrated radiator, the follow-up process is reduced, and an intermediate medium heat conduction silicone grease is not needed.
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings.
Drawings
Fig. 1 is a schematic view of the copper-aluminum composite radiator of the present invention.
Fig. 2 is a sectional view of the copper-aluminum composite heat sink of the present invention.
Fig. 3 is a schematic view of the structure of the wool board of fig. 1.
Fig. 4 is a schematic structural view of a copper substrate.
Detailed Description
As shown in fig. 1, 2, 3 and 4, an embodiment of the copper-aluminum composite heat sink of the present invention includes an aluminum alloy heat sink main body 1, and further includes a copper substrate 2 embedded on a heat conducting surface of the aluminum alloy heat sink main body and in a shape of a slot, an opening is formed above the slot of the copper substrate 2, capillary plates 4 are laid in the slot, the capillary plates 4 are in a staggered honeycomb shape on a cross section, and heat transfer is rapid and uniform. The opening of the clamping groove is sealed by the DBC plate 3 through welding to form a module. In order to form a temperature-uniforming plate structure in the copper substrate, the clamping groove is also internally vacuumized and injected with liquid. The heat transfer is further accelerated by utilizing the evaporation heat absorption and condensation heat release of the liquid, and the heat dissipation effect is further enhanced and improved. The bottom of copper base plate 2 have the mortise and tenon groove, copper base plate 2 is the mortise and tenon copper base plate promptly, copper base plate and aluminum alloy radiator main part 1 are mortise and tenon connection. Mortise and tenon copper base plate and the mutual mortise and tenon of aluminum alloy radiator body integrated into one piece to can directly weld with the DBC base plate through mortise and tenon copper base plate, greatly increased the fastness of radiator, and owing to need not intermediate medium heat conduction silicone grease, the mutual mortise and tenon of copper-aluminum composition face is forged and formed, direct contact, the contact surface is big, and is firm, and the radiating effect is very good. In order to realize the injection of the liquid, in the embodiment, a through hole leading to the clamping groove from the outside is formed in the heat conducting surface, a sealable vacuum pumping pipe 5 is inserted through the through hole, and the clamping groove is vacuumized and injected with the liquid through the vacuum pumping pipe 5, so that the temperature equalization of the copper substrate 2 is formed.
A processing method of a copper-aluminum composite radiator comprises the following process steps:
1) manufacturing a copper substrate, carrying out die extrusion forming, and further processing an opening clamping groove by using a numerical control milling machine;
2) positioning a copper substrate, namely forming a positioning groove on the upper top surface of a lower top block of a lower die of an aluminum alloy radiator die, placing an opening of the copper substrate facing the lower top block into the positioning groove, and placing an aluminum cake into an aluminum cake placing inlet of the lower die of the die and on the copper substrate;
3) the upper die and the lower die are matched and forged and formed, the upper die with the hole plate moves downwards to be matched with the lower die for placing the copper substrate and the aluminum cake, the lower ejector block applies pressure, the die is opened after the forging and forming, and the copper substrate is embedded into the heat conducting surface of the aluminum alloy radiator main body to form the copper-aluminum integrated radiator;
4) placing a capillary plate in a copper substrate clamping groove of the copper-aluminum integrated radiator;
5) a vacuum pumping pipe is inserted into the straight through hole, a straight through hole leading to the clamping groove from the outside is formed in the heat conducting surface, and a closable vacuum pumping pipe 5 is inserted through the straight through hole;
6) welding the DBC board, and sealing the opening by welding the DBC board at the opening of the clamping groove;
7) vacuumizing and injecting liquid, vacuumizing the clamping groove through a vacuum exhaust tube 5, injecting the liquid, and sealing the vacuum exhaust tube 5.
In order to improve the connection firmness and the heat dissipation of the copper substrate and the aluminum alloy radiator body, in the step of manufacturing the copper substrate, the copper substrate is directly manufactured into a mortise and tenon copper substrate with mortise and tenon grooves at the bottom, and when the mortise and tenon copper substrate is forged and pressed in the steps of assembling the upper die and the lower die and forging and pressing, the mortise and tenon grooves of the mortise and tenon copper substrate are quickly filled with aluminum blocks to form a mortise and tenon structure.
The processing method has the advantages of simple flow, convenient manufacture, contribution to batch production of the radiator and low cost.
Although the present invention has been described with reference to the above embodiments, it should be understood that the invention is not limited thereto, and various changes and modifications can be made by those skilled in the art without departing from the spirit and scope of the invention.
Claims (8)
1. The utility model provides a copper aluminium composite radiator, includes aluminum alloy radiator main part (1), its characterized in that: still including inlaying on the heat-conducting surface of aluminum alloy radiator main part and being copper base plate (2) of draw-in groove form, the draw-in groove top opening of copper base plate (2), having laid capillary board (4) in this draw-in groove, this draw-in groove opening is sealed through the welding by DBC board (3).
2. The copper-aluminum composite heat sink as recited in claim 1, wherein: the clamping groove is also internally vacuumized and injected with liquid.
3. The copper-aluminum composite heat sink as recited in claim 2, wherein: a through hole leading to the clamping groove from the outside is formed in the heat conducting surface, a sealable vacuum pumping pipe (5) is inserted through the through hole, the clamping groove is vacuumized through the vacuum pumping pipe (5) and liquid is injected, and the temperature equalization of the copper substrate (2) is achieved.
4. The copper-aluminum composite heat sink according to claim 1, 2 or 3, characterized in that: the capillary plate (4) is in a staggered honeycomb shape on the cross section.
5. The copper-aluminum composite heat sink according to claim 1, 2 or 3, characterized in that: the bottom of the copper substrate (2) is provided with mortise and tenon grooves, and the copper substrate is in mortise and tenon connection with the aluminum alloy radiator main body (1).
6. The copper-aluminum composite heat sink as recited in claim 4, wherein: the bottom of the copper substrate (2) is provided with mortise and tenon grooves, and the copper substrate is in mortise and tenon connection with the aluminum alloy radiator main body (1).
7. A processing method of a copper-aluminum composite radiator is characterized by comprising the following steps: the method comprises the following process steps:
1) manufacturing a copper substrate, carrying out die extrusion forming, and further processing an opening clamping groove by using a numerical control milling machine;
2) positioning a copper substrate, namely forming a positioning groove on the upper top surface of a lower top block of a lower die of an aluminum alloy radiator die, placing an opening of the copper substrate facing the lower top block into the positioning groove, and placing an aluminum cake into an aluminum cake placing inlet of the lower die of the die and on the copper substrate;
3) the upper die and the lower die are matched and forged and formed, the upper die with the hole plate moves downwards to be matched with the lower die for placing the copper substrate and the aluminum cake, the lower ejector block applies pressure, the die is opened after the forging and forming, and the copper substrate is embedded into the heat conducting surface of the aluminum alloy radiator main body to form the copper-aluminum integrated radiator;
4) placing a capillary plate in a copper substrate clamping groove of the copper-aluminum integrated radiator;
5) a vacuum pumping pipe is inserted into the straight through hole, a straight through hole leading to the clamping groove from the outside is formed in the heat conducting surface, and a closable vacuum pumping pipe (5) is inserted through the straight through hole;
6) welding the DBC board, and sealing the opening by welding the DBC board at the opening of the clamping groove;
7) vacuumizing and injecting liquid, vacuumizing the clamping groove through a vacuum exhaust tube (5), injecting the liquid, and sealing the vacuum exhaust tube (5).
8. The processing method of the copper-aluminum composite radiator as recited in claim 7, characterized in that: in the step of manufacturing the copper substrate, the copper substrate is directly manufactured into a mortise and tenon copper substrate with mortise and tenon grooves (21) at the bottom, and when the mortise and tenon copper substrate is forged and pressed in the steps of closing the upper die and the lower die and forging and pressing, the mortise and tenon grooves of the mortise and tenon copper substrate are quickly filled with aluminum blocks to form a mortise and tenon structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911132690.5A CN110849190A (en) | 2019-11-19 | 2019-11-19 | Copper-aluminum composite radiator and processing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911132690.5A CN110849190A (en) | 2019-11-19 | 2019-11-19 | Copper-aluminum composite radiator and processing method thereof |
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| CN110849190A true CN110849190A (en) | 2020-02-28 |
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| CN201911132690.5A Pending CN110849190A (en) | 2019-11-19 | 2019-11-19 | Copper-aluminum composite radiator and processing method thereof |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110808232A (en) * | 2019-11-19 | 2020-02-18 | 浙江天毅半导体科技有限公司 | A copper-aluminum composite radiator and its processing method |
| CN111811307A (en) * | 2020-08-24 | 2020-10-23 | 陈豪 | Integrated 3D temperature equalization plate and manufacturing method thereof |
| CN113126719A (en) * | 2021-05-06 | 2021-07-16 | 顺德职业技术学院 | Modularized integrated processor assembly and processing technology thereof |
| CN113241334A (en) * | 2021-05-06 | 2021-08-10 | 顺德职业技术学院 | Intelligent processor module of integrated cooling assembly |
| TWI800245B (en) * | 2022-01-28 | 2023-04-21 | 奇鋐科技股份有限公司 | Heat dissipation device |
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| CN111811307A (en) * | 2020-08-24 | 2020-10-23 | 陈豪 | Integrated 3D temperature equalization plate and manufacturing method thereof |
| CN113126719A (en) * | 2021-05-06 | 2021-07-16 | 顺德职业技术学院 | Modularized integrated processor assembly and processing technology thereof |
| CN113241334A (en) * | 2021-05-06 | 2021-08-10 | 顺德职业技术学院 | Intelligent processor module of integrated cooling assembly |
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Application publication date: 20200228 |